Advanced Optical Transmitters

© 2015 BrPhotonics Confidential All Rights Reserved

High Speed Integrated Photonics DevicesOptical Transmission at 100G and Beyond

Júlio César R.F. de Oliveira, Ph.D., CEOMay, 2015

2 © 2015 BrPhotonics Confidential All Rights Reserved

Outline BrPhotonics Optical Transciever Market Strategy

- Photonics & Microelectronics Convergence/Verticalization Integrated Devices Technologies

– Polymer Modulators (Foundry Based)– Silicon Photonics (Passive and Active Devices)

Advanced Optical Packaging Capabilities Integrated Optical Transcievers

– 100/200G TOSA/CFP2 and u-Thin Modulator Microelectronics

– IPs and ASICs Tunable LASER ROADMAP Final Comments


BrPhotonicsBrPhotonics (BrP) is a provider of advanced high-speed devices for optical communications and integrated transceiver components that enable information streaming over communication networks. The products utilize technologies such as Silicon Photonics (SiPh) and Thin Films Polymer on Silicon (TFPSTM) to advance the 100Gbps to 1Tbps fiber-optics long haul and metro links. Microelectronic (ASICs) for photonics aplications is another driver for BrP. BrPhotonics portfolio of small form factor components addresses CFP2 and CFP4 applications by enabling a greater network capacity through superior linearization, multi-level modulation, and other advanced techniques.

GigOptix• Polymer foundry in TFPS (transfer from Seattle to Campinas)• Strong expertize in high speed analog (TIA and Drivers)• World wide operations, sales and marketing• Well stablished with potential BRPhotonics customers

CPqD• Strong photonic design and packging technology • World class system know-how• Established R&D program on Photonics and Microelectronics • Connections with industry leaders driving technology transfer

BrPhotonics IP : total of 24 patents- 17 patents on TFPS Technology- 4 patents applications on Silicon Photonics Technology- 3 patents applications on DSP design

Technology: TFPS, Silicon Photonics, SFF Packaging and Microelectronics


BrPhotonics – (%)

March’14 to Dez’14 Jan’15 to June’15 Aug’15 ...*

*Negotiations closed, under Due Diligence


BrPhotonics Location and FacilitiesCPqD Campus, Campinas, Brazil

Production Facility

• for Thin Film Polymer on Silicon (TFPS) Modulators and Packaging

Cleanrooms• Class 100• Class 10000

Labs• Optical Transmission• Packaging• Qualification


High Speed Optical Transciever Market100G TAM = Submounts -TOSA/ROSA + Components USD1.746B @2015 and USD 3.9715B @2019

100G Componnents = USD1.15B @2015 and USD 4.9B @2019

100G Datacom USD 0.79B@2015/USD 3.5B@2019 ; Telecom USD 0.516B@2015/USD1.41B@2019


Long Haul/Metro Transceiver Market Dynamics

SFF, Integration, Low Power Consumption, Low Cost

100Gbps

1Tbps 400Gbps

200Gbps

100G

b/s

200G

b/s

400G

b/s

1Tb/

s

Line

Rat

e Ev

oluti

on

Form Factor Reduction

MSA CFP CFP2 CFP4 QSFP


Coherent LineCard... Density +++++1x100G MSA 5x7

2x100G CFP

5x100G CFP2

2012

2014

2016

12,7 cm10,16 cm

8,2 cm 4,1 cm 2,4 cm


Optical Communications needs Integration Photonic Integration divers

– Data traffic increase– Lack of bandwidth to support in electrical

domain

Solutions– Integrated Photonics– Microelectronics

Main Devices (Long Haul)– Modulators and Photodetectors– Transcievers (Transmissores/Receptores)– Tunable lasers– ASICs to photonics (DSP, OTN, Monitoring,...)

Enabling Technologies– Polymer, InP, Silicon– Packaging (Hybrid and Monolitic)– Digital Signal Processing– Transport switching

Photonic IC Design Photonic Packaging High Speed Analog Microelectronic


Photonics and Microelectronics - Convergence

Integrated Photonics– Silicon Photonics

» Passives for 1550/1310» Actives (Mod., Rec., ...)» Today: Metro/Access» Future: + Long Haul

– TFPS– InP– Hybrid Integration

» Si-TFPS» II-V/Si

Microlectronics– IPs– ASICs– High Speed Analog

» TIA» Drivers

– Packaging » Wirebonded» Interposer» Flip-chip» Monolithic


BrPhotonics ... Market Chain Value

Discrete components

Submount (TOSA/ROSA)

Telecom

Others MKT


TX

RX

LINE

TX

RX

CLIENT

Current global scenarioCritical componentes ≥ 100Gbps

Digital Microelectronics (<40nm)

Integrated Photonics

High Speed Analog


BrPhotonics ... Verticalizing

TX

RX

LINE

TX

RX

CLIENT

Digital Microelectronics (<40nm)

Integrated Photonics

High Speed Analog

OTN

Tunable Laser

DSP

Driver28G

TIA28G

Modulator

Receiver


Photonics and Microelectronics - Convergence

Photonics

Microelectronics

Wirebonder Flip-ChipInterposer

Monolithic90nm?


BrPhotonics Model

InvestorsR&D Funding

R&D

Phot/uelec. Tech

#1

Global Market

Sales chain

HS Tech.ProductsInvestors

/R&D


Integrated Photonics Devices Technologies- Polymer Modulators- Silicon Photonics


Electro-Optic (EO) Polymers

• Electrical field changes refractive index of material• Polarization happens in femtoseconds• Max operation frequency is dependent on RF loss of the electrode

• Composite formed with a chromophore and a polymer – similar with semiconductor doping

• Polarization of chromophore responsible for EO effect

electricfield

acceptor

donor

+

-

Host polymer

Guest polymer(Chromophore)


Manufacturing of TFPS Modulators Chips

Top clad

Electro-optic polymer

End of waveguideWaveguide trench

Bottom clad

Ground plane

Silicon substrate

Top electrode

Ground pads

• BrPhotonics has a 200m2, class 10 cleanroom in Seattle (In transfer to Campinas)

• Team of chemists, process, RF, and optical engineers

• Specialized in the manufacture of EO polymer modulators

• Capacity of 200 wafers/year


LP33Synth

GV101Cert

WaferBottom

ElectrodeBottomClad

WaveGuide

CORETopClad

Poling NotchStreetEtch

RFElectrode

VelocityMatch

DICE Via Test

APCCert

PVPCert

LM251Synth

LM251Cert

APCPurific

PVPFormul

LP33Cert

LM251Synth

LM251Cert

LP156Cert

LP156Formul

GS2Synth

GS2Cert

CoreMonitor

CoreFormul

Donor Synth

Bridge Synth

Donor Charac

Bridge Charac

Donor/Bridge Synth

Donor/Bridge Cert

UV15MB

UV15Cert

GS2 Synth

GS2Cert

Acceptor Synth

AP5Synth

AP5Cert

B74 Purific

B74Cert

Wafer Process Flow

Material F

low

Synthesis

Characterization

Certification

Formulation

Commertial

APC

Acceptor Charac

Material Synthesis

Chemicals

Certification

Chemicals

Certification


Wafer Process Flow

Wafer Start

Bottom Electrode

Bottom Clad

Wave Guide

Core Top Clad

PolingRF

ElectrodeNotch

Street Etch

Velocity Match

Dice Via Test

SC1 Clean

Cr/Au Sputter

Photo

Wet Etch

Ti Sputter Hardmask

Photo

Plasma Etch

Strip Strip

UV15 Coat

UV Cure

Thermal Cure

B74 Coat

Thermal Cure

Etch Back

LP33 Coat

Thermal Cure

Etch Back

Cr/Au Sputter

Photo

Wet Etch

Strip

Disconnect

PVP

Pole

Strip

Ti/Au Sputter

LP156 Coat

UV Cure

Ti Sputter Hardmask

Photo

Plasma Etch

Strip

Plate

Photo

Plasma Etch

Ti/Au Coat

Strip

LM251 Coat

Etch Back

Etch Back

Ti Sputter Hardmask

Photo

Plasma Etch

Wet Etch

Ti Sputter Hardmask

Photo

Plasma Etch

Strip

Ti Sputter Hardmask

Photo

Plasma Etch

Strip

LM251 Coat

UV+Therm Cure

Etch Back

UV+Therm Cure

Coverslip Attach

Thermal Cure

Photo

Photo

Plasma Etch

Thermal Cure

Photolitography

UV/Thermal Cure

Metal Sputter

Coating

Plasma Etch

Wet Etch

Strip

Wafer Process Flow

Pro

cess Flo

w



TFPS Wafer Process Foundry

300 m2 clean room (Class 100 & 10K)EO Polymer Synthesis

Full 6” wafer fab capabilityAdvanced Dye test Capability (DC&RF)


Advanced Packaging Capability

Active Alingment Sealing and Wire Bonder

Laser Welding

Dye Bonder/ Flip Chip


100G/200G CFP2 TOSA 100G/200G U-Thin Modulator


Product application

Line-side optical transport Product main applications

– CFP2 form factor Analog Coherent Optics (ACO) modules

– OIF modules and line cards Higher integration and cost reduction

– Metro and long-haul applications High-speed line rate

– Symbol rate agnostic (up to 32 GBd) 100 Gb/s DP-QPSK 200 Gb/s DP-16QAM

Advanced modulation– Polarization-multiplexing– Digital modulation formats– Advanced pulse-shaping

CFP2 Mechanical Module

Example: TOSA in CFP2 module


Product features

Features– Small form-factor– Innovative solderless LGA Package– 3 hermetic optical windows allowing TX and

LO exit fiber to be available at the same or opposite side for enhanced layout placement inside CFP2 modules.

Modulator features– Low optical insertion loss– 85oC temperature operation– Zero chirp– Low driving voltage

Tunable laser features– High output power– Full C-band tunability– ITU-T DWDM grid– Narrow linewidth

Photonic integration– Thin-Film Polymer on Silicon (TFPS)

Modulator– Tunable laser– Polarization-Multiplexing Free-Space

Optics (PolMux FSO)

TXLO2

LO1


TOSA package RF performance simulation

0 5 10 15 20 25 30 35 40 45 50-30

-25

-20

-15

-10

-5

0

Frequency (GHz)

S21

[so

lid]

/ S

11 [

dash

ed]

(dB

)

Port 1,2

Port 3,4

Port 5,6

Port 7,8

-14 dB

-3 dBPort S21* S11**

1,2 36 GHz

-17 dB

3,4 36 GHz

-14 dB

5,6 36 GHz

-14 dB

7,8 36 GHz

-18 dB

Main Parameters

*S21 bandwidth at -3 dB.**S11 from 0 up to 30 GHz.

S Curves – Package ports


TOSA package – Pilot Line


Mechanical Clamp – Engineering Samples

Clamp plan Q1’15– Engineering samples testing.

Alignment, pressure, electric contact.

– Alpha samples clamp Desgin for new TOSA package. Corrections and improvements

on current clamp design.


Evaluation KitEvaluation Board (EVB)

TOSA Carrier PCB

TOSA on carrier

TOSA EVK assembled


Real-time 100/200 G CFP2-ACO TOSA validation

ClariPhy CL20010Coherent ASIC

BrPhotonics 100GCFP2-ACO TOSA


10 12 14 16 18 20 22 24 26 28 30-8

-7

-6

-5

-4

-3

-2

OSNR [dB/0.1 nm]

log1

0(B

ER

)

3.8e-3 BER

2.0e-2 BER

2.4e-2 BER

100G Theory

LiNbO3 Real-time

TOSA Real-time

100G OSNR tolerance (real-time validation)

Required OSNR– SD-FEC (2.4e-2)

LiNbO3: 11.6 dB TOSA: 11.8 dB

Small TOSA penalty (0.2 dB) in comparison with a LiNbO3 transmitter at SD-FEC limit.

Observations:• Same coherent DSP ASIC

and ICR used in both tests.• Bandwidth-limited (~15 GHz)

PCB can be improved to enhance TOSA performance.

BrP 100G TOSA vs LiNbO3 Transmitter

32-GBd DP-QPSK real-timewith coherent DSP ASIC


200G DP-16QAM real-time validation

Required OSNR @ SD-FEC (2.0e-2):– BrPhotonics ACO-TOSA: 19.0 dB

Penalty with respect to theory ~2.0 dB.– LiNbO3 reference transmitter: 19.0 dB (literature)

16 18 20 22 24 26 28 30 32 34-4

-3.5

-3

-2.5

-2

-1.5

OSNR [dB/0.1 nm]

log1

0(B

ER

)

2.0e-2 BER

2.4e-2 BER

200G Theory

LiNbO3 (Literature)

TOSA Real-Time


Ultra-Thin 100G DPQPSK Modulator package

Features: 2.33mm total height Designed to fit the gap clearance between pcb

and CFP2 cover Very versatile optical ports configuration (7) Optimal design for efficient fiber routings inside

CFP2 Very versatile solderless LGA or Solder pins

interconnections options Package footprint: L38.60 x W11.30 mm


UT-M placement inside a CFP2 module

UT-M package height = 2.3mm

UT-M package module is designed to be placed between the CFP2 pcb and cover

UT-M package Suitable gap between PCB and Cover = 2.47mm

CFP2 PCB

CFP2 cover


Rth

Y

X

I

Q

I

VXQp

VXQn

VXIpVXIn

Bias

YQ

I GN

D

Bias

Y G

ND

Bias

YQ

Bias

YI

Bias

Y

Bias XQI G

ND

Bias X GN

D

Bias XQ

Bias XI

Bias X

PD Y

(TM

) A

PD Y

(TM

) K

PD X (TE) K

PD X (TE) A

Rth

Q

VYQ

nVY

Qp

VYIn

VYIp

GN

D

LO OUT

IN

Get a TOSA-ACO with a u-ITLA + UT-M into a CFP2

Fibers Min bending Radii = 10mm

u-ITLA

u-ICRRX-TX port

micro splices

CFP2 PCBu-ICR u-ITLA

UT-M

UT-M


UT-M internal layout and module placement inside CFP2

CFP2 - PCB

100G

UT-M

Quad DD

OUT

IN

LO

RF in

puts

DC co

ntro

ls

OUT

IN

LOLX8242 chip

50 TRRF IN

POL-MUX Optics

Input optics

RF inputs

DC contro

ls

Pre-assembled sub mount

lid

PM fiber collimators

SMF fiber collimators

Multilayer Ceramic

Hermetic package

RF inputs

DC controls


Silicon Photonics - Tapeout timeline (CPqD/BrP)

March 2013

July 2013

October 2013

March 2014

June 2014

October 2014

DP-QPSK Modulator v1OpSIS/IME5x5 mm²SOI

DP-QPSK Receiver v1OpSIS/IME2.5x5 mm²SOI

Dynamic GFF HHI

4x6 mm²InP

DP-QPSK Modulator v2OpSIS/IME

5x5 mm²SOI

Si/TFPS ModulatorExternal Cavity Laser

IME3x16 mm²

SOI

DP-QPSK Receiver v2IME3x16 mm²SOI

Edge CouplersLETI4.2x4.7 mm²SOI


BrPhotonics Passive Devices

Passive Components:• 1D Grating Coupler• 2D Polarization Splitter Grating Coupler (PSGC)• 90° Hybrid • Crossings • Edge Coupler to gain chip laser • Mach Zehnder Interferometers • MMI 2x2 50:50 • OSNR Monitor (interferometer) • Polarization Splitter Rotator (PSR) • Ring Resonator • Bragg mirror • Static dephaser • TAP 90:10 • TAP 99:1 • Y splitter 1x2


BrPhotonics Active Devices

Active Components:

• 2nd and 3rd Order Ring Tunable Filters

• Photodiode

• PIN Modulator - VOA

• RF termination (33Ω)

• Ring Resonator Modulator• • Silicon tunable cavity laser

• Thermal Phase Shifter

• Traveling Wave Mach Zehnder

Buried oxide

Ge

Si


Silicon photonics 100G Receiver

Silicon Chip Characterization (w/o TIAs)

CoherentReceiver

Signal

EDFA

ASE

VOA

Filter Coupler 99:1

PC

OSA

ECL

PC

XQ

YI

YQ

XI

Oscilloscope DSP

2.5 x 5 mm2


Silicon Photonics IP List/Status

43 © 2015 BrPhotonics Confidential All Rights Reserved4343 © 2013 GigOptix, Inc. Confidential All Rights Reserved

Microlectronic IPs and ASIC Development


Microelectronics for Optical Communications OTN ASIC

– Single chip solution Mapper/Framer/Criptography/FEC for 100G

40nm TSMC Test Chip


OTN IP List/Status


Microelectronics for Optical Communications DSP ASIC– Single chip 400G 64 to 16 QAM/QPSK up to 45GBd

16nm FF+ TSMC Test Chip

LineModem

(DSP)

OTU4Framer

ClientMapper

Line 2

Host

LineAFE

Register File

EmbeddedµP

Real-TimeCapture RAM

SPI

HIHQVIVQ

MDIO

20 x 25G10 x 50G Ho

st Se

rdes

Cros

sbar

Sw

itch

and

Gear

box

OTUx

LineModem

(DSP)OTUx

HIHQVIVQ

Line 1

LineAFE

25G Serial

FEC

FEC

OTU4Framer

ClientMapper

OTU4Framer

ClientMapper

OTU4Framer

ClientMapper

OTU4Framer

ClientMapper

ADC_I

ADC_Q

DAC_I

DAC_Q

AFE INTERFACE DSP

DAC_I 128X8

DAC_Q 128X8

ADC_I 128X8

ADC_Q 128x8

DSP_I_IN 128X8

DSP_Q_IN 128X8

DSP_OUT 64X4

AHB MASTER

SPI I

F

ADC_I CNTRL/STATUS

ADC_Q CNTRL/STATUS

ADC_I_CLK

ADC_Q_CLK

DAC_I CNTRL/STATUS

DAC_Q CNTRL/STATUS

DAC_I_CLK

DAC_Q_CLK

AFE_

AHBL

_IF

/32

/32

DSP_RX_CLK

DSP_TX_CLK

TST_BUSI_OUT_128X8

AFE

_RST

_N

DSP

_RST

_N

PMONPMON IF

AFE

ADC_HI_P

ADC_HI_N

ADC_QI_P

ADC_QI_N

DAC_HI_P

DAC_HI_N

DAC_HQ_P

DAC_HQ_N TST_BUSQ_OUT_128X8

Osc(Need to

Spec)

CSR_INTERFACE

SCLK

OSC_P

OSC_N

700MHz

RXPLL

TXPLL

16GHz

16GHz

700M

Hz

DIV32_BYPASS

DIV32_BYPASS

PLL_BYPASS

PLL_BYPASS

Full ASIC Arch.

DSP Test Chip IPs- TR- PE- Demapper- MUX


DSP IP List/Status


Tunable LASER – Narrow Linewidth

New Project starting joint with CPqD between BrP/PADTEC with BNDES support, targeting complete verticalization in coherent transcievers applications

Main Specs:Linewidth <100KHz

Pdiss <4W

Applications:CoC

GoldBoxuITLA

Tunable LASER + Modulator + Receiver integrated in a single packaging : 100/200G TROSA CFP4


100G/200G CFP2/ACO is happening now!!!

400G Modules first introduction


First Product Demo at OFC 2014

100G Coherent TOSA based on TFPS Modulator


ECOC’14 TOSA/CFP2 100G Eng. Samples Live DEMO Demonstration (Q3-2014)

• Live demonstration• Engineering samples• Evaluation kit• Detailed datasheet• System validation


OFC’15 TOSA 200G DP-16QAM Real Time Live DEMO

Next Phase ... Telcordia qualification, running now!!!


BrPhotonics - Product Roadmap Overview

2013

Potential

ASIC OTN 100GFramer + Crypto.

+ Storage

LM8242Polymer

IQ Dual Pol.Modulator

SRX-04-28-01SRX-02-56-01

SiPh Coherent Rx.

LTO-04-28-01100G TOSA CFP2

WRO-04-28-01100G ROSA CFP2

SM-04-28-01SiPh IQ

Dual Pol.Modulator

SM-16-28-01400G Dual

Carrier DualPol . IQ

Modulator Si-TFPS

1T NxCarrierDual Pol . IQModulator

SiliconProven IPsOTN 100G(Test Chip)

Silicon Proven DSP IPs

(Test Chip)

40nm TSMC

16nm TSMCSilicon Proven

DSP IPs DSP100/400G(Full Chip)

2014 2015 2016 2017 >2017

Planned

4x28G

2x56Gor

16QAM

Microelectronics

Sub-Assembly & Tunable LASER

Tx/Rx Chips

1T NxCarrierCoherentReceiver

STO-04-28-01Single Packg.

100G TOSA+ROSA CFP4

STO-04-28-01400G Dual TOSA

CFP2

SM-04-28-01Si-TFPS Dual Pol.

Modulator

SM-04-28-01Si-TFPS Dual Pol.

Receiver

WRO-04-28-02400G Dual ROSA

CFP2

Planned

LM8242Polymer

IQ Dual Pol.Modulator

LM8242Polymer

IQ Dual Pol.Modulator Packaged

TL-01-28-01CoC Coherent Tunable LASER


Future Applications

Multi Carrier 400G/1T– Chip Level

Single chip solutions for multicarrier applications

– Packaging Level Modular solution

supporting TOSA, ROSA, TROSA and interconnec.

– System Level Controllers (Bias, LASER,

Driver) miniaturized and scalable

Datacom/Datacenter– 100G already arrive in

datacenter (10x10 and 4x25)

– Single 100G is expected in a near future supported by high freq. Optics and electronics (70 GHz) or through deep coherent price reduction (mainly DSP)


Final Considerations

High speed integrated optics for 100G and beyond is entering in the Market (100G CFP2 modules)

Device integration is mandatory to track this evolution demanding increasing bit rates

BrPhotonics has a clear ROADMAP verticalizing device level targeting support 100G and beyond transciever Market to world wide market

Brazilian echosystem is supportive to high tech companies with tech. background and solid market view (FUNTTEL, FINEP, BNDEs, private investors, ...)

© 2015 BrPhotonics Confidential All Rights Reserved

www.brphotonics.com