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The top documents tagged [wire bond pads]
Documents
1 18-20 redux Can the focal plane accommodate both RSC and RVS as viable NIR venders C. Bebek 28 April 2005
214 views
Documents
FVTX Sensors and FPHX Chips FVTX Collaboration Meeting at UNM, 07/15/2009 1Jon S. Kapustinsky7/15/2009
221 views
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Recent Results for 3D Pixel Integrated Circuits using Copper-Copper and Oxide-Oxide Bonding Ray Yarema, Grzegorz Deptuch, Ron Lipton Fermi National Accelerator
224 views
Documents
Wire Bonding and Analogue Readout ● Cold bump bonding is not easy ● Pixel chip is not reusable ● FE-I3 is not available at the moment ● FE-I4 is coming
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Documents
Dimensioning the focal plane (RSC centric version) C. Bebek 9 July 2003 Revised 14 July 2003
214 views