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The top documents tagged [indium solder]
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Intermetallic Issues With Wire Joining by Thermocompression & Soldering Dr Henning Leidecker Goddard Space Flight Center, Code 562 Parts, Packaging, and
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Phase 1 FPIX mechanics status Phase 1 Pixel Upgrade Workshop - Aug2012 Plenary IV Session1 Kirk Arndt Purdue University for CMS FPIX Mechanical Group S
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