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The top documents tagged [chip modules]
Technology
Conférence Internet des objets IoT M2M - CCI Bordeaux - 02 04 2015 - Telecom Design
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MCF52211
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New Product Introductions National Electronics Week Birmingham, UK - 2011
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1 IC Wafer Thinning Desired thickness goal for front-end ICs on modules is 150 Prototype results obtained so far have used mechanical thinning(grinding)
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The CMS Silicon Strip Tracker
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Mark Franklin, S06 CS, CoE, EE 362 Digital Computers II: Architecture Prof. Mark Franklin:
[email protected]
Course Assistants: –Drew Frank:
[email protected]
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ULTRA TEC FA Ads --- over the years
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USBpix Upgrade
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