WP1GatewayHWDesign&ImplementationLEADER:EUROTECH

INVOLVEDPARTNERS:ATOS, SKYWATCH,BIOASSIST, MOBISTAR,L IBELIUM

AGILEMEETING,20-21July2016,BerlinDE

WP1Objectives(recap)Mainobjective:

specification,designandimplementationofthehardwareofthemodulargateway.

Themodulargateway:• willbeavailableintwoversions:• the“makers”versionbasedonRaspberryPi;• theindustrialversionwithanewHWdesignbasedonIntelarchitecture.

• willbebasedonasetofcoreandexpansionmodules:• coremodules:carriermodule,cpu module,thestoragemoduleorthepowersupply,etc.;

• extensionmodules:thecommunicationmodules,sensingmodules,etc..

AGILEKICK-OFFMEETING,12-14January2016,TrentoIT

WP1Objectives(recap2)Addresstwolevelsofmodularity:• modularityforexistingHW:anexpansionmodule(shield)allowstheRPi tobeextendedwithnewmodules;

• intrinsicmodularity:intheindustrialgatewayanyarchitecturalelementisamodule.

Hardwaremoduleinteroperability:❓ identifytheHWtechnologiesthatsimplifyandpromoteinteroperability;❓ specifyasetofruletofollowduringmodulesdesignanddevelopment.

Hardwareprototypes development:• Implementasetofprototypesofthe“makers”gateway;• Implementasetofprototypesoftheindustrialgateway;• implementasetofexpansionmodulesthatwillbeadoptedinthepilots.

AGILEKICK-OFFMEETING,12-14January2016,TrentoIT

WP1- StatusT1.1 Definitionofthedesignanddevelopmentmethodologyconcluded.Elicitationofrequirementsandspecificationsdefinitionforbothgatewayhavebeenconcluded.

T1.2 FirstversionoftheMakersGatewaydesign concluded.Firstsetofprototypesavailable.

T1.3 DesignofindustrialGateway:ongoing.Firstsamplesofthecarriermoduleandoftheenclosureavailable.

Nextdeadlines:◦ MS1- AGILEInitialDesignMS1&DraftFrameworkRelease(M9)

◦ InitialdesignoftheAGILEplatform(SWandHW)andreleaseofadraftversionoftheAGILEframework(sw andbasichw builtonexistingprototypingplatforms).

◦ D8.1- PilotDesignandanalysisrequirementsandspecification◦ Contributiontodeliverableediting.

AGILEKICK-OFFMEETING,12-14January2016,TrentoIT

WP1- Timeline

• D1.1- AGILEGatewayarchitecturespecificationsandinitialdesign(SUBMITTED)Gatewayrequirements,designspecificationandinitialarchitecturaldesignforboththeindustrialandmakersversion.

• D1.2- AGILEGatewayhardwarefinalprototypes2ndAGILERelease– HardwarePlatformFinaldesigns,featuresandfunctionalspecificationsofthehardwareprototypes.DeliveryofthefinalAGILEGatewayprototypes.

•MS1- AGILEInitialDesignMS1&DraftFrameworkReleaseInitialdesignoftheAGILEplatform(SWandHW)andreleaseofadraftversionoftheAGILEframework(sw andbasichw builtonexistingprototypingplatforms).

•MS2- AGILEFramework(SWandHW)release&InitialIntegrationDeliveryoftheAGILEplatform(softwarecomponents,makersandindustrialgatewayprototypes)andtheinitialintegrationofthesoftwarecomponents.

AGILEKICK-OFFMEETING,12-14January2016,TrentoIT

DesignmethodologyDesignformodularity(DFM):DFMfollowstheemergingtrendinHWdesignandmanufacturingknownas“BuildtoOrder”.◦ BTOproductsarenotbuiltuntilaconfirmedorderforproductsisreceived.◦ WeextendBTOalsotothedesignphase(notonlymanufacturing).◦ Traditionally,BTOisthemostappropriateapproachusedforhighlycustomizedorlowvolumeproducts.

◦ DFMallowstomapacustomdesigninadesignbasedonstandardmodules!

DFMhasbeenappliedtothedesignoftheindustrialgateway:◦ definitionofthereferencedesign;◦ definitionandimplementationofageneralpurposeconsolidateddesign;◦ definitionandimplementationofaverticalconsolidateddesign(themonitoringstation,PilotC).

RequirementsRequirementelicitationisbasedon:◦ partnersexpertise,◦ studyofpilots.

Onpilotsside,theelicitationhasbeeninspiredmaily byPilotsA,CandD:◦ therequirementsidentifiedinPilotBandE,willbeintegratedinD8.1;◦ thefinalversionofthegateways(M18)willconsideralsotheserequirements.

Threemaincategoriesofrequirementshasbeenidentified:◦ makersgatewayspecificrequirements;◦ industrialgatewayspecificrequirements;◦ sharedrequirements.

WP1- Makersgateway

AGILEKICK-OFFMEETING,12-14January2016,TrentoIT

FIRSTDESIGN

•Architecture&Configurationdefined

•ShieldforRaspberryPiindesign• Firstprototypeavailable• 2modulestobepluggedontopofRaspPi• RaspberryPiGPIOsaccessibleforsensors

•HotSwapà Allowedbypressingbutton• Thegatewayisabletorecognizewhichmodule(amongthelistofsupportedmodules)hasbeenplugged

WP1- Makersgateway

AGILEKICK-OFFMEETING,12-14January2016,TrentoIT

FIRSTDESIGN

WP1- Makersgateway

AGILEKICK-OFFMEETING,12-14January2016,TrentoIT

FIRSTDESIGN

•CONNECTIVITY

• RaspberryPi2• 2modulestobeplugged• Wifi &3G/4Gà USBDongle

• RaspberryPi3• 2modulestobeplugged• Wifi &BluetoothLowEnergyà includedinRaspberry• 3G/4Gà USBDongle

Makersgatewayarchitecture

- Twocommunicationsockets– Xbee formfactorwithUARTandSPI.

- HotswapoftheradiosusingapushbuttonandadedicatedLED

- ExternalpowersourceselectablebetweentheRaspberryorexternalDCsource

- DebugLEDstoallowknowingthecurrentstatebyvisualinspection.

MakersgatewaymeetstheRaspberryPiHATspecificationDimensionsmeettherequirementsintheHATspecification

EEPROMmemoryaddedtostorevendorinfoandGPIOusage

- Theshieldusesa40pinfemaleconnectortoallowaphysicalconnectionwiththeRaspberryPi

- RaspberryPiGPIOSarephysicallyaccessiblefromtheuser.

WP1- Makersgateway

AGILEKICK-OFFMEETING,12-14January2016,TrentoIT

Makersgatewayspecifications Feature Description RequirementReference

Power

Nominalinputpower 5VDCpinfromRaspberryPi

ID_HW_52Externalinputpower 5Vto20VDCsupplyConsumption <100mAwithoutradio

modules

RadiosocketsCommunication UARTandSPI ID_HW_1,

ID_HW_3,ID_HW_10,ID_HW_47,ID_HW_48,ID_HW_60,ID_HW_61

Power 3V3Formfactor Xbeeformfactor

I/Ointerfaces

UART TwomultiplexedUARTs ID_HW_1,ID_HW_3,ID_HW_10,ID_HW_47,ID_HW_48,ID_HW_53,ID_HW_54,ID_HW_55,ID_HW_58ID_HW_60,ID_HW_61

SPI TwoSPImodulesallowedGeneralI/O AllRaspberryGPIO

available

EnvironmentOperatingtemperature -20to+50ºC ID_HW_5Storagetemperature -40to+85ºC

Dimensions Size AccordingHATspecification

ID_HW_4,ID_HW_57

Onboardtemperaturesensor

Operationalrange -40~+85ºC

ID_HW_12,ID_HW_51

Fullaccuracyrange 0~+65ºCAccuracy ±1ºC(range0ºC~+65

ºC)Responsetime 1.65seconds(63%

responsefrom+30to+125°C).

Typicalconsumption 1μAmeasuring

OnboardHumidity

sensor

Measurementrange 0~100%ofRelativeHumidity(fortemperatures<0°Cand>60°Cseefigurebelow)

ID_HW_12,

ID_HW_51

Accuracy <±3%RH(at25ºC,range20~80%)

Hysteresis ±1%RHOperatingtemperature -40~+85ºCResponsetime (63%ofstep90%to0%

or0%to90%):1secondTypicalconsumption 1.8μAmeasuringMaximumconsumption 2.8μAmeasuring

OnboardPressure

sensor

Measurementrange 30~110kPa

ID_HW_12,

ID_HW_51

Operationaltemperaturerange

-40~+85ºC

Fullaccuracytemperaturerange

0~+65ºC

Absoluteaccuracy ±0.1kPa(0~65ºC)Typicalconsumption 2.8μAmeasuringMaximumconsumption 4.2μAmeasuring

OnboardADC

Accuracy 18-Bit

ID_HW_51

Channels Upto4channels

Onboardvoltage

reference

2.048V

I/Ointerface I2C

Power 3V3

Programmabledatarate From3.75to240SPS

• OnboardADC• OnboardTemperature,Humidity

andPressuresensor

Industrialmodulargateway:requirementsStatus:◦ industrialgatewayreferencedesigndefined;◦ generalpurposeindustrialgatewayconsolidatedesign:

◦ designdefined;◦ implementationongoing;◦ firstsamplesofthecarrierandofthemodularenclosureavailableexpectedforthe27/7;◦ firstprototypesshouldbeavailablebytheendof2016.

◦ verticalconsolidateddesign(monitoringstation,PilotC):◦ averypreliminaryversiondefined;◦ thefinaldesignandtheprototypeswillbeavailableforM18.

IndustrialGatewayreferencedesign

Preliminarymonitoringstationconsolidateddesign

Industrialgatewayblockdiagram

Industrialgatewayrenderings

IndustrialGatewayModulesCPUModule:◦ IntelAtomBayTrail orApolloLakefamilies◦ 10WTDPClassCPU◦ COMExpressType10

BoardManagementModuleBMM:◦ 32BitMicrocontroller◦ Managessystemandmodulesstatusandrelatedtransitions(coldboot,warmboot,lowpowerstatessuchassuspendorhybernate).

◦ Managessystemmaintenance,e.g.:◦ secureupdate,◦ autotest,◦ extendedinputwakeup&suspend,◦ specialfeatureslikeinjectionsensing,timedprocedure,etc.

IndustrialGatewayModules(2)Storagemodule:

1. storageintegratedintheCPUmodule,e.g.eMMC Flash,SATASSD(e.g.itisusedinhighruggedandreliablesystemtoavoidvibrationissue).

2. Internalexpansion,e.g.mSATA SSDDriveorSDMemoryCard.

3. Externalstoragemodule,e.g.HDD/SDDDiskwithoptionalDriveBay.

AUXI/OModule(e.g.PoE orpaneldisplaybacklight):thesemoduleshaveapowerabsorptionthatisnotsupportedbythecarrierandmustbeconnecteddirectlytothepowersupplymodule.TheI/Omodulesarepoweredbythecarrier.

IndustrialGatewayModules(3)I/OExpansionmodules:◦ theygeneratethesignalthatmustbeavailableontheexternalpanel;◦ implementI/Ofunctionalitiesforaspecificvertical;◦ provideconnectorsforaspecificvertical;◦ allowstocustomizetheexternalconnections.◦ Examples:

◦ BUSconverter◦ Expander,e.g.I2C->10GPIO◦ IsolatedandprotectedI/O◦ SpecialfunctionslikeaparticularfieldbusforaScada application.

I/OExpansionModule

USB

EXTERNALPAN

EL

3xRS485

Ethernet RJ45ML2MIL

IndustrialGatewayModules(3)UserI/OModules:itcanbeanexternalmoduleorasetoffunctionalitiesimplementedinthecarrier.It’scheaperthanI/Oexpansionandsatisfiesmechanicalrequirements.◦ SDMemoryCard.◦ Test,debuganddevelopmentinterfaces.◦ Maintenanceinterfaces.◦ Legacyinterfaces,likemouseandkeyboard.

I/OModulesforfieldbus:◦ integrated,providedbytheCPUmoduleorbytheBMM,e.g.CANBus;◦ internalexpansionmodule,providingpotentiallyanykindoffieldbus.

Powermodule:itcanbeintegratedorexternalandprovideawiderangepowerformultipledomainapplication(24V-110V).◦ Insulatedand/orprotectedversionavailable.◦ Supportfortensionslowerthanthenominalrange(e.g.forautomotive).◦ DesignedforEN50155,MIL-STD,FCC,CE.

Industrialgatewaypreliminaryspecifications

Feature DescriptionRef.

Requirements

PROCESSOR CPU Intel Atom BayTrail (E3845, 1.91GHz, 4 cores)

GW_6, GW_22, GW_38

MEMORY RAM Up to 4GB 1333 MHz DDR3L GW_7, GW23

STORAGE

Embeddedstorage Up to 8GB eMMC GW_8, GW_24, GW_38 SATA 1x mSATA

1x SATA II

Removable storage

Micro SD slot (service panel) optional Removable Drive Bay

GW_25

I/OINTERFACES

Wired networking

2x Indipendent Gb Ethernet (10/100/1000) auto-sensing

GW_1, GW_26, GW_19

USB 1x USB 2.0, 1x USB3.0

1x USB 2.0 (service panel) Noise and surge protected

GW_27, GW_19, GW_20, GW_34

Serial

1x RS-232 (5 wires) optoisolated, up to 3x RS-485/RS-422 configurable

optoisolated, 1x console (service panel)

Fieldbus Integrated 1x CANBus 2.0B;

other fieldbus standard supported by miniPCIe cards

Generic programmable I/O

Up to 8 digital optoisolated and protected lines: 3x In, 3x Out

1x system on remote ctrl

GW_28, GW_19

Video

Default: 1x mini Display Port (service panel)

custom option for 2nd video LVDS,VGA or HDMI

GW_29, GW_19, GW_20, GW_34

Audio 1x Line IN stereo, 1x Line OUT stereo

or optional integrated MIC and Speaker (2W)

GW_31, GW_19

OTHER

RTC Ultra low power RTC GW_32

RTC backup > 1 month

Watchdog Yes, CPU module independent GW_33

Non volatile User Memory Serial EEPROM GW_34

TPM Optional GW_21

Programmable button Yes (service panel) GW_34

SIM support 1x micro SIM slot (service panel) GW_35

INTEGRATEDSENSORS

GPS

Yes. Options: integrated high sensitivity receiver; up

to 3 concurrent GNSS (GPS, Galileo, GLONASS, BeiDou)

with external antenna; external module;

GW_18

System temperature

Operating temperature range temperature sensor

GW_14

Accelerometer Two or three axes GW_14

INTERNALEXPANSIONS

High speed Expansion Interface

Rugged Board to Board connector PCI express Gen 2.0 1x 1-lane SATAII port, USB2, Ctrl, Pwr

GW_10, GW_11, GW_12, GW_27, GW_37, GW_38, GW_19

miniPCIe Slots 3x independent miniPCIe slots one slot mSATA compatible

POWER

Nominal power Input

110-220 V AC or 12-24 V DC protected not isolated

GW_40, GW_16 Power

Consumption <50W Max

Industrialgatewaypreliminaryspecifications(2)

ENVIRONMENT

Operating Temperature -20 to +50 °C

GW_4, GW_5,

GW_39, GW_41, GW_42

Storage Temperature -40 to +85 °C

Humidity 0 to 95% non-condensing

Dimensionsreferencedesign

Form factor Rugged BOX PC

Width x Depth x Height < 140x260x70 mm

Weight < 3.0 Kg

Thermal solution Fanless, conductive cooling

DESIGNEDFORCERTIFICATIONS

Regulatory CE, FCC, EN45545 (fire&smoke)

GW_13, GW_43

Safety UL 60950

Environmental RoHS2 REACH

Radio RED

Cellular Carrier Specific, External antenna design

Ingres Protection IP 65

Thanksfortheattention.That’sallfolks.