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High Thermal Conductivity Graphite Foam for Electronics Presenter: Alex DeTrana Principal Investigator: James Klett, Ph.D. Commercialization Manager: Alex DeTrana

High Thermal Conductivity Graphite Foam for Electronics by Alex DeTrana, Commercialization Manager

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November 2011 November marked the first technology presentation from a fellow Department of Energy National Laboratory.

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  • 1. High ThermalConductivityGraphite Foam forElectronicsPresenter: Alex DeTranaPrincipal Investigator: James Klett,Ph.D.Commercialization Manager: AlexDeTrana

2. Technology Description Foam made of pure carbon with uniquecharacteristics Surface area 100x greater than traditional heatexchangers Weight 1/5 that of aluminum Thermal conductivity 5x that of copper2 Managed by UT-Battellefor the U.S. Department of Energy Presentation_name 3. Technology Opportunity Material being manufactured by twocompanies Material has been extensively tested andevaluated Only remaining work is engineering forspecific applications Technology currently being deployed in avariety of applications: Space radiator LED cooling Fluorescent cooling3 Managed by UT-Battellefor the U.S. Department of Energy Presentation_name 4. Technology Leadership Unique technology Unmatched combination of surface area, thermalconductivity, and weight Unique capabilities and characteristics Very high thermal conductivity Very low density Very little thermal expansion RF shielding Sound insulation4 Managed by UT-Battellefor the U.S. Department of Energy Presentation_name 5. Applications Target Customers Current PracticeApplication #1 Microprocessor5 Managed by UT-BattelleApplicationDescriptionTarget Customers Current PracticecoolingComputercomponentmanufacturersfor the U.S. Department of Energy Presentation_nameCopper oraluminum heatsinks/heat pipesApplication #2 Embassy securecommunicationsAmerican andforeigngovernmentsComplicated andexpensive materialsand anti-RF activetechnology 6. Competitive DifferentiationProduct Name Manufacturer RelevanceFan/heatsinkcombination6 Managed by UT-BattelleVarious Achieves similar result using afor the U.S. Department of Energy Presentation_namedifferent (active) approachDense metal/activecountermeasuresVarious Achieves similar result using acomplex and less effectiveapproach 7. Revenue and Profit Potential Market size: Global thermal management: $7.5B in 2010,growing to $10.5B in 2015 Thermal management hardware accounts for 84%of market Incremental cost increase per laptop will benominal May be lower due to part reduction/simplification Could increase laptop performance anddurability Could create a premium product for certainapplications7 Managed by UT-Battellefor the U.S. Department of Energy Presentation_name Government/military applications 8. Contact Information Alex DeTranaSenior Commercialization ManagerOak Ridge National [email protected] Managed by UT-Battellefor the U.S. Department of Energy Presentation_name