copyright 2016 Honeywell International Inc. All rights reserved.

“Although all statements and information contained herein are

believed to be accurate and reliable, they are presented without

guarantee or warranty of any kind, express or implied. Information

provided herein does not relieve the user from the responsibility of

carrying out its own tests and experiments, and the user assumes all

risks and liability for use of the information and results obtained.

Statements or suggestions concerning the use of materials and pro-

cesses are made without representation or warranty that any such

use is free of patent infringement and are not recommendations to

infringe any patent. The user should not assume that all toxicity data

and safety measures are indicated herein or that other measures

may not be required.”

2

OUTLINE 概要

1. Industry thermal trends

行业热需求发展趋势

2. TIM introduction

热界面材料介绍

3. PCM technology and advantage

相变化技术和优势

4. Strength of HEM TIM and data sharing

霍尼韦尔热界面材料的性能

5. HEM TIM applied in LED application

霍尼韦尔相变化热界面材料在LED的实际应用

6. Q&A

讨论

TIM Thermal Management

导热界面材料热管理需求- Lower Thermal Impedance 低热阻

- Harsher Test Conditions 更严苛工作环境

- Increased Thermal Stability and Reliability 杰出的热稳定性和可靠性

INDUSTRY TREND: ACCELERATING POWER

DENSITIES 行业趋势

• Greater Functionality 高集成度

• Increase Power consumption 高功耗

• Device / Package shrink 小尺寸

• Higher Power densities 高功率密度

• Greater density board layout 高密度设计

• Increasing Device Temperatures 高工作温度

Rising Power Densities Drive Greater Thermal Needs

日益增长的热密度对于热管理有更高需求

Server and Telecom

Heat Load

• Power increases more than seven times after the year 2000

功耗提升7倍

• Power cycling trends in networking applications

典型网络设备的应用环境

MERCHANT SILICON POWER IN NETWORKING

APPLICATIONS 典型网络设备的芯片应用趋势

LED Market Keeps Increasing & Advance Package Grows

LED市场持续增长先进封装逐渐普及

LED MARKET TREND

LED产业发展趋势

LED Market Growth

LED市场日益增长

Advance Packaging Increasing

先进封装逐渐普及

THERMAL CHALLENGES FOR LED DESIGN

LED设计中的散热挑战

• Thermal performance and design is

critical to optimum HBLED performance

优化LED设计

- Higher Efficacy 更高效

- More light with less energy 更节能

- Longer reliability 更持久

• Minimize Thermal Resistance

降低热阻达到最佳性能

- Junction to substrate to heat sink

- Essential to maximum thermal

performance

• Thermal Interface Material (TIM)

selection is key to LED thermal design

热界面材料选择至关重要

7

●

●

LED DieLED Junction

LED COB Substrate

TIMHeat Sink

Rth J-C

●

●

ROLE OF TIMS 热界面材料

TIMs 热界面材料- Critical thermal path, dissipating heat from

device to spreader

散热系统中的关键因素

Important Properties 主要特性- Wetting at the interface 表面浸润性

- Thermal Contact Resistance 接触热阻

- Bulk Thermal Conductivity 材料导热率

- Stability 稳定性/可靠性

IC

Heat Sink

TIM 2

TIM 1Heat Spreader

BGA substrate

PC board

IC

PC board

TIM 1.5

Heat Spreader

Heat Sink

Thermal Bulk of TIM

Thermal Contact at Interface

Thermal Contact at Interface

Thermal Interface Materials fill the microscopic gaps between mating surfaces

IC Device

Constriction of heat flow contacting rough surfaces

Thermal Impedance Most Critical to Thermal Dissipation and Performance

热阻对于散热性能起决定性作用

KEY THERMAL PROPERTIES OF TIM

热界面材料的关键参数

Thermal Impedance (C.cm2/W)

热阻• Thermal bulk resistance + interface contact resistance

• Bond line thickness

TIM

Heat Spreader

Heat Sink

IC Rc1

Rc2

BLTRTIM =KTIM

BLT

RTIM

TIM Thermal Impedance:

TIT = BLT/K + RC

TIT = Total Thermal Impedance

BLT = Bond Line Thickness of TIM

K = Bulk Thermal Conductivity of TIM

RC = Thermal Contact Resistance at the Interfaces

Bulk Thermal Conductivity (W/mK)

导热率• Material property only

• Does not consider:

- Interface contact resistance

- Bond line thickness

Aq

TTI

x

TkAq

k: thermal conductivity

x: thickness of sample

T: temperature difference across sample

A: cross-sectional area of sample

TIM

Solution

Thermal Grease 导热硅脂

• silicone-based, greases are non-curing,

conformable

• provide low thermal resistance for

applications that do not require long term

reliability and thermal shock

Gap Pad 导热垫片

• typically thicker (>1mm) than other TIMs and

designed to have good compression

properties

• however, they usually can not deliver the

same level of thermal performance as other

TIM materials

Phase Change Material 相变化材料

• transforms from a solid state to a liquid

or gel state

• no bleed out, pump out and

degradation issues normally found in

thermal greases

Thermal Adhesives 导热粘合剂

• one or two-part crosslinkable

materials based on epoxies or

silicones

• known for their structural support -

this can eliminate the need for

mechanical clamps, but cure time is

required and they are not reworkable

TIM MATERIAL CHOICES 常用热界面材料

Others 其他

• thermal compound, tapes,

films, epoxy, etc.

Thermal Gel 导热凝胶

• normally is one-component, cross-

linked or pre-cured gel structure

• good compressibility and dispense

process automation

Metallic 金属

• all-metal (e.g., solder) or utilize

a metal matrix or binder to

which metallic or nonmetallic

fillers have been added

• good thermal conductivity but

normally contact resistance or

surface wetting is not good

Vis

co

sity 粘

度

Melt temp

相变化温度

Solid Liquid/gel state 熔融状态• Optimal Surface wetting 优化表面浸润性• Low Contact Resistance 降低接触热阻• Low Thermal Impedance 降低材料热阻

Temperature 温度

xx C

Theoretical Curve: PCM Viscosity vs. Temperature理论曲线 : 相变化材料的粘度与温度的关系

WHAT IS PCM? 什么是相变化材料？

• Fundamentally three primary components in PCM

相变化材料的三大构成• Each are vital to robust

polymer matrix integrity and filler optimization

每一项都至关重要• Filler 填料

- Thermal

• Wax/Polymer 蜡/聚合物- Structural integrity

• Additives 添加剂- Cross linking, ATO, etc

TIM Performance

and Reliability

Thermal Filler

Wax/

PolymerAdditives

PCM Formulation is Critical to Performance

配方决定性能

HONEYWELL PCM TECHNOLOGY

霍尼韦尔相变化技术

steric hindrance

PCM Enables Reliable, Long-Term Performance

相变化材料提供长期可靠的高性能

HONEYWELL PCM TECHNOLOGY

霍尼韦尔相变化技术

vs.

PCM: Long Chain

长链Grease: Short Chain

短链

• Rigid Polymer Structure

坚固聚合物结构

Grease: Si-O-Si

structure

“Less Rigid Structure”

脆弱架构

PCM: C-C-C with H steric

hindrance

“Rigid Structure”

坚固架构• Good flow-ability but…

优秀的流动性，但是。。。。。。

• Potential for migration, dry-out and pump-out issues.

潜在填料迁移，变干，泵出风险

• Stable and consistent filler

稳定填料状态

• Minimizes filler migration and separation

降低填料分离风险

• Long Polymer Chain

聚合物长分子链

Honeywell Phase Change

Higher molecular weight 大分子量

Less material mobility 少材料迁移

Reduced risk of pump-out 低泵出风险

Improved reliability 高可靠性

Honeywell PCM Technology Delivers Unequaled Reliability

霍尼韦尔相变化材料提供杰出的可靠性

Other TIM :

Linear Structure

线状结构

HEM PCM :

Branch Structure

枝状结构

• Non-Linear, Branch Structure 枝状结构

vs.

• Additive & Polymer Technology

添加剂以及聚合物科技

HEM PCM :

Chemical &

Physical Bond

Combination

物理化学混合

Other TIM :

Physical

Absorption

物理吸附

HEM PCM: continuous

interface between heat

sink and ASIC lid

Grease pump-out

and creation of

voids

• Advanced Additive-polymer Technology

先进添加剂技术 Superior intermolecular force

加强分子键合力

Great surface tension

出众表面张力

Limited material mobility

少材料迁移率

Robust polymer structure

杰出聚合物结构

Lower risk of pump out

低泵出风险

Excellent reliability

卓越可靠性能

HONEYWELL PCM TECHNOLOGY

霍尼韦尔相变化技术

Honeywell

PCM

Initial 1000 cycles

Silicone

Grease

Thermal Cycling Test Condition 温度循环测试条件 :

• -55°Cx5min + 125°Cx5 min, ramp up/down 15min, for 500 to 1000 cycles

• Sandwich PCM & grease between aluminum and glass plates set at 200μm gap

• TI Test : ASTM D5470

Thermal Cycle (-55 C to 125 C)

vs. Grease

PCM Stable Polymer Structure with No Pump-Out Issue

低泵出风险

HEM PCM VS. SILICONE GREASE

相变化材料和导热硅脂

Grease breaks down Grease TI degrades

Silicone Grease

Honeywell PCM

Honeywell

PCM

Initial 400 hr

Silicone

Grease

High Temperature Baking (HTB) Test Condition 高温烘烤条件:

• HTB = 150C

• PCM & thermal grease dispensed on glass plates

• TI Test : ASTM D5470

High Temp Bake at 150 C

vs. Grease

Oil bleeding from grease Grease TI degrades

0.09 0.110.12

1.78

0.00

0.20

0.40

0.60

0.80

1.00

1.20

1.40

1.60

1.80

2.00

Initial Baking 400 Hr

Honeywell PCM

Competitor greaseSilicone Grease

Honeywell PCM

Honeywell PCM Does Not Suffer From Silicone Oil Bleed

无硅油分离现象

HEM PCM VS. SILICONE GREASE

相变化材料和导热硅脂

17HEM PCM HIGH RELIABILITY PERFORMANCE

相变化材料的高可靠性

Honeywell PCM Provides Superior Long Term Reliability

霍尼韦尔热界面材料提供出众的长期可靠性

Test Condition: 150°C continuous baking

Test Method: Laser Flash, ASTM E1461

0.00

0.10

0.20

0.30

0.40

0.50

0.60

0.70

0.80

0.90

1.00

T0 200Hrs 400Hrs 600Hrs 800Hrs 1000Hrs 1300Hrs 1500Hrs 2000Hrs 2400Hrs 2800Hrs 3000Hrs 3200Hrs

Therm

al Im

pedance (

°C-c

m2/W

)

Time

Reliability Performance Comparison

长期可靠性比较

LTM6300 PTM5000 PTM6000 PTM7000 Grease1

Grease2 Grease3 Grease4 Other PCM1 Other PCM2

18HEM PCM HIGH RELIABILITY PERFORMANCE

相变化材料的高可靠性

7.3

14.6

29.2

11.0

21.9

43.8

3.7

7.3

14.6

2.9

5.8

11.7

0

5

10

15

20

25

30

35

40

45

50

150'C 120'C 100'C 90'C 80'C

Year

Lifetime Comparison

使用寿命比较

PTM7000

PTM6000

PTM5000

LTM6300

Grease1

Grease2

Grease3

Grease4

Other PCM1

Other PCM2

Honeywell PCM Enables Longer Product Life Time

霍尼韦尔热界面材料提供更长久产品使用寿命

Assumption is based on 150’C baking data and Arrhenius equation

使用寿命预期是根据150’C烘烤性能以及阿累尼乌斯经验公式推导而来

© 2015 by Honeywell International Inc. All rights reserved .

HEM PCM Shows Superior Performance

霍尼韦尔热界面材料显示更卓越性能

19HEM PCM ACTUAL APPLICATION ON LED

相变化材料在LED上的实际应用

TIM2

导热界面材料

Heat Sink

散热器

LED L2 Package

LED 芯片

Temperature

界面温度HEM LTM6300

霍尼韦尔材料Other Silicone TIM

其他有机硅材料

#1 156.0’C 160.0’C

#2 86.5’C 89.2’C

#3 80.7’C 82.0’C

#1

#2

#3

Test Condition 测试条件：• Room Temperature 室温 : 33.0’C

• Input Voltage/Current 输入电压/电流 : 220V/50Hz, 0.138A

• LED Lamp Input Power 灯具输入功率 : 30W

• Silicone TIM TC 有机硅材料导热率 : >10W

© 2015 by Honeywell International Inc. All rights reserved .

10.2

14.1

11.710.6

15.8

11.6

HEM LTM6300 Silicone Grease#1 Silicone Grease#2 HEM LTM6300 Silicone Grease#1 Silicone Grease#2

Tem

pe

ratu

re (

'C)

TIM Material

20HEM PCM ACTUAL APPLICATION ON LED

相变化材料在LED上的实际应用

HEM PCM Shows Superior Performance

霍尼韦尔热界面材料显示更卓越性能

20W 40W

Test Method 测试方法 :

• Two different power COB LED : 20W/40W

两种不同功率COB LED

• Test COB & Heat Sink temperature

测量COB芯片温度和散热器温度• Delta T is the temperature difference between COB and Heat Sink

温度差是COB芯片的温度和散热器温度的差值

T

HONEYWELL TIM PRODUCT PORTFOLIO

霍尼韦尔相变化热界面材料

Application

Classification

Product

Series

TI*(C-cm2/W),

No Shim

TC(W/m˚C)

Reliability(hrs), 150°C

baking

Note

High-End

高阶产品

PTM7000-SP 0.056 6.50 2000 hrs High Thermal performance

PTM6000-SP 0.070 4.40 3000hrs Advanced Reliability

Mid-Range

中档产品PTM5000-SP 0.070 4.40 1000hrs

Entry Level

Low COO

高性价比产品LTM6300-SP 0.130 2.03 600hrs

Remarks:

1. All TI data is collected after fully phase changed.

THANK YOU谢谢！

QUESTIONS?

• Per Fourier’s Law of Heat Conduction:

Connect to data

acquisition set-up

Cooling Block(maintain constant low temp.)

Lower Intermediate Block

Test Sample

Upper Intermediate Block

Heater Block(provide constant heat)

T1

T3

T2

T4

T6

T5

Aq

TTI

x

TkAq

q = heat flux

K = thermal conductivity

x = thickness of sample

T = temperature difference across sample

A = cross-sectional area of sample

THERMAL IMPEDANCE TEST METHOD:

CUT BAR

• ASTM D5470

- Destructive, one time test only

- Fast test for immediate results

- Most common test method

THERMAL IMPEDANCE TEST METHOD:

LASER FLASH

ASTM E1461

• Thermal Impedance Between Si, Ni-plated Cu Surfaces

- Includes the CTE mismatch

- includes actual surface finish

• Typical Coupons:

- Ni-plate copper, 0.5”X0.5”X0.03”

- Si, 0.5”X0.5”X0.02”

• Suitable for Accelerated Life Test

Die

TIM

Spreader

Flash

IR Sensor

Time

Tem

per

ature

Laser Pulse

Netzsch Laser Flash

k = ()(Cp)()

k = Thermal Conductivity (W/cmK) = Thermal Diffusivity (cm2/s)

=0.13879L2 /t1/2

L=specimen thickness, metert1/2=the time required for the temperaturerise to reach 50% percent of ΔTmax

Cp = Specific Heat Capacity (J/gK) = Density (g/cm3)

• Determines Thermal Diffusivity

• Thermal Conductivity/Resistance Calculated

RELIABILITY TEST CONDITION

长期老化性能测试条件• Highly-Accelerated Temperature and Humidity Stress

Test (HAST)

- Standard: JESD22-A110-B

- Testing Condition: 130°C, 85%RH, 96 hours

- Objective: Accelerate corrosive impact of high humidity and temperature on the thermal performance of the test structure

• Temperature Cycling Test

- Standard: JESD22-A104C

- Testing Condition: -55°C to 125°C (TCB), 1000 cycles

- Objective: Determine the resistance of TIM to extremes of high and low temperatures, and its ability to withstand cyclical stresses

• High Temperature Storage

- Standard: JESD22-A103

- Testing Condition: 150°C, 1000 hours

- Objective: Accelerate changes in TIM’s material and performance characteristics relative to prolonged and elevatedtemperature

HAST chamber

TC chamber

Oven