Download ppt - US CMS Silicon Tracker Project Joe Incandela University of California Santa Barbara Status and schedule CMS Weekly Meeting Fermilab May 14, 2004

US CMS Silicon Tracker Project

Joe Incandela

University of California Santa Barbara

Status and scheduleCMS Weekly Meeting

Fermilab

May 14, 2004

Tracker status - Fermilab - May 14, 2004 - J. Incandela 2

North American Group

• Fermilab (FNAL)• M. Demarteau, A. Ronzhin, K. Sogut, L. Spiegel, S. Tkaczyk + technicians

• Kansas State University (KSU):T.Bolton, W.Kahl, R.Sidwell, N.Stanton• University of California, Riverside (UCR)

• P. Gartung, G. Hanson, G. Pasztor• University of California, Santa Barbara (UCSB)

• A. Affolder, S. Burke, C.Campagnari, D. Hale, (C. Hill), J.Incandela, S. Kyre, J. Lamb, S. Stromberg, (D. Stuart), R. Taylor, D. White + technicians.

• University of Illinois, Chicago (UIC)• E. Chabalina, C. Gerber, T. Ten

• University of Kansas (KU)• P. Baringer, A. Bean, L. Christofek, D. Coppage

• University of Rochester (UR)• R.Demina, R. Eusebi, E. Groves, E. Halkiadakis, A. Hocker, S.Korjenevski,

P. Tipton• Mexico Consortium:

• Cinvestav: H. Castilla, R.Perez, A. Sanchez• Puebla: E. Medel, H. Salazar• San Luis Potosi: A. Morelos

• Brown University• R. Hooper, G. Landsberg, H. Nguyen, C. Nguyen


Tracking Requirements

• Efficient & robust• Fine granularity to resolve nearby tracks

• Fast response time to resolve bunch crossings

• Radiation resistant devices for 10y of LHC operation

• ~1-2% PT resolution at ~ 100 GeV

• Asymptotic impact parameter d ~ 20 m

• MOST IMPORTANTLY – We want it to be there and useable as early as possible!


US Responsibilities

5.4 m

2.4

m

Outer Barrel (TOB)

~105 m2

NEW:End Caps (TEC)

50% Modules for Rings 5 and 6 and

hybrid processing for Rings 2,5,6


Outer Barrel Production

• Outer Barrel • Modules

• 4128 Axial (Installed)

• 1080 Stereo (“ “)

• Rods

• 508 Single-sided (“ “)

• 180 Double-sided (“ “)

• US Tasks• All hybrid bonding & test

• All Module assembly & test

• All Rod assembly & test

• Joint Responsibilities with CERN• Installation & Commissioning

• Maintenance and Operation

~20 cm

Modules Built & Tested in US


End Cap Construction

• Central European Consortium requested US help

• We agreed to produce up to 2000 R5 and R6 modules

• After 10 weeks UCSB successfully built the R6 module seen above.

• UCSB has built 27 R6 and 3 R5 modules to date

First TEC Module Built at UCSB

Pisa

ROD INTEGRATION

AachenKarlsruheStrasbourgZurichWien

PETALS INTEGRATION Aachen

Brussels Karlsruhe

Louvain

Lyon Strasbourg

BrusselsWien Lyon

TEC AssemblyTEC Assembly

CERN

Frames:Brussels

Sensors:factories

Hybrids:Strasbourg

Pitch adapter:Brussels

Hybrid:CF carrier

TK ASSEMBLY

CERN

LouvainStrasbourg

Perugia Wien

BariPerugia

Bari FirenzeTorinoPisaPadova

TIB-TID INTEGRATION

FNAL

UCSB

TOB Assembly TIB-TID Assembly

CERN/USA Pisa Aachen Karlsruhe. --> Lyon

KarlsruheSensor QAC

Moduleassembly

Bonding& testing

Sub-assemblies

FNAL

Integrationinto mechanics

PisaRU

FNAL UCSB

UCSB

UCSB

UCSBCatania UCSB

US in the tracker

US carries almost half of the production load


Summary I

• Problems continued to plague components this past year• US contributions have been critical

• US played major role in finding and fixing a series of flaws• In some cases they would have been fatal

• Problems for module components have been addressed • Frames and hybrids:

• Yields and rates are high and rising• Sensors

• US identified CM Noise and other problems with STM sensors• US advocated shifting order to HPK:

• Provided funds for procuring the masks• Pressed for order to be placed with HPK in February –

beyond which we would have delayed HPK production• CMS is reviewing STM now

• Either STM quality reaches adequately high standards or the remainder of the order will be shifted to HPK

• Upshot: no matter what – we’ll have very high delivery rates by July


Summary II

• These issues have meant that the schedule has slipped• We have lost 6-8 months in FY04 due to this last round of problems

• We have responded• In parallel with work to resolve component problems we improved our

production capacity

• Major upgrade of US production lines to achieve significantly higher production capacity to recover lost schedule time.

• New and better methods

• More and better tooling and hardware

• Better software and Quality Control

• Both FNAL and UCSB production lines have since demonstrated more than 100% increases in stable, high quality module production

• Our production capacity is now extreme:• CDF or D0 Run 2 silicon detectors ~ 750k channels each:

• We can produce this many channels in 10, 40-hour weeks

• With overtime we’d need only 6 weeks


Hybrid Problems

• Serious problems were uncovered by US and CERN1. Flex cable fragility (US)

2. Weak wirebonds (CERN)

3. Power via opens (US)

• Found early, solved quickly• Excellent communication

between US and Europe

• Great relationships with vendors

• Problems typically have been diagnosed, understood, and removed in 1-4 weeks

These could have been fatal


Sensor Production

• Thin Sensors (320 m)• 6273 of 6877 (91%) delivered

• Yield > 99% at CMS QC

• Thick Sensors (500 m) • 7000 ordered from HPK

• Deliveries have begun

• HPK has capacity to make all CMS sensors on schedule

• Thick Sensors (500 m)• Initially ~87% yield at CMS QC

• Major efforts by the CMS tracker group and STM yield at CMS QC increased to ~ 98%

• Still concerns …

Hamamatsu Photonics (HPK) SGS Thomson (STM)


1. CMN Noise Issue

•Example: Sensors31215014 and 14308304

•Channels causing the problem• 203 at 70V

• 251 at 130V

30200020005110

100

1000

10000

100000

1000000

0 100 200 300 400 500

Voltage

Bia

s C

urr

en

t (n

A)

Current(DB)

Current(probing)

Current(Bonded)

CMN problem first reported by US in July 2003. Understood to be a pt. discharge/breakdown effect


First IV in standard Vienna qtc setup: sensor outside specifications (20µA)

Vacuum switched off: Sensor perfect 0.5 µA

Vacuum switched on again: Sensor again bad (20µA)

Sensor 30211431541220

2. Vacuum – effect (single strip!)

without vacuum

with vacuum


We identify some sensors with odd noise structure:

Good sensor

3. Time structure in leakage current


Deliveries as of mid February show a new class of sensors:All sensors have currents >1.5 µA : all grade B (have to be fully tested 100%)

IV curve in most cases flat, sensors good?

4. Large processing changes


Module Components Summary

• We exerted a major positive influence.

• Many problems (most found by US) led to delays

• Module breakage in transport → 2 months

• Hybrid Cable problem → +3 months

• ST Sensor issues → +5 months

• Hybrid via problem (found April 04) → no added delay

• ST sensors are the remaining concern

• Shifted order of 7000 (out of 18000 thick sensors) to HPK

• Re-qualifying STM final process now with decision in July

• Timing such that we can shift all production to HPK without impact on schedule if STM fails qualification


Hybrids Progress

Yield is stabilizing above 90%


Rods

• Component issues resolved• OptoHybrids

• Frames

• CCU modules were an issue last month.

• Now receiving good devices

• Mounting/cabling at CERN is underway• Can reach production rate of 50 rods/month

• One issue with potential damage in shipping• Several good solutions under study


US Productivity Enhancements

• Gantry (robotic) module assembly• Redesigned: more robust, flexible,

easily maintained

• Surveying and QA• Automated use of independent

system (OGP)

• More efficient, accurate, fail-safe

•Module Wirebonding• Fully automated wirebonding

• Faster and more reliable bonding

• Negligible damage or rework

•Taken together:• Major increase in US capabilities

• Higher quality

• Could build 750k channels (equal to CDF or D0 in Run 2) in 6 weeks!


Testing & QA

• US has led in many respects • US testing macros and test stand

configurations now used everywhere

• Critical contributions• Discovered and played lead role in

solution of potentially fatal problems

•Taken together• Averted disaster

• Higher quality


Module Mechanical Precision

• Tolerances are stringent

• x of sensors most critical

• 97% modules in specs

• Second order corrections:

• All new modules in specs!

x(Frame-Sensor) (m)

x(Sensor-Sensor) (m)

(Frame-Sensor) (mdeg)

(Sensor-Sensor) (mdeg)


Bonding

• All centers fully operational

• UCSB and FNAL both keep pace with 15/d rate with ease!


Hybrid & Module Electrical Testing

• Specification < 2% faulty channels per module

• Module testing has matured significantly• Minimum set of tests is now defined

• Fault finding algorithms:

• >99% faults found & correctly identified >90% of time

• Less than 0.1% of good channels are flagged faulty

• Performance standardization• Easy comparison of results at different sites


Module Fault Finding

Noisy

1 sensor open

2 sensor open

Pinholes

Bad Channel Flags

Noise Measurement Pulse Height Measurement (Using Calibration Pulse)

Bad Channel Flags

Shorts

Pinhole

Opens


Module Quality

• Goal of less than 1% faulty channels per module• Single Sensor Modules

• 0.20% Faulty Channels Per Module

• Production introduced faults at less than 0.1% rate!

• Two Sensor Modules

• 0.55% Faulty Channels Per Module

• Production introduced faults at less than 0.1% rate!

• Unprecedented low rate of faulty channels


Substructure Integration

•Shells, petals, rods underway

•Systems tests helping to finalize components and procedures


Rod Assembly, Test, Transport

• US contributions• Module installation

• Single rod test stands

• Multi-rod burn-in stands

• Definition of tests & methods

• Transportation


Rod Testing and Transport


Current Tracker Schedule


US Module Production(as determined by A. Cattai, J. Incandela, S. Schael)

• This is our current module production schedule:• USA module final production

• TOB modules: Early June 2004 to May 2005

• TEC modules: Late June 2004 to mid-April 2005

• Paced by sensors & hybrids

• Currently it appears they will arrive simultaneously


Other Considerations

• Rods are expected to keep pace with module assembly• Most system integration will now occur in FY06

• Meanwhile, we analyzed all systems for potential sources of downtime in production

• Stocked critical spares of fabrication tooling and equipment

• Cross-training fabrication personnel

• Developed satellite hybrid processing capacity in Mexico

• Specialized testing and diagnostics facility at UC Riverside


Summary

• The tracker is one of the main strengths of CMS

• The US tracker group is making critical contributions

• Module component problems have been solved

• We’ve accumulated more delays …

• … But we’re on much more solid ground

• Consequence for schedule: • Final assembly of the wheels at CERN slips into FY06.