PATENTS GRANTED

In the Metal Finishing FieldPrinted copies of patents are furnished by the Patent and Trademark Office for $3.00 each.Address orders to: Commissioner of Patents and Trademarks, Washington, D.C. 20231.

Electroformed Squeegee Bladefor Surface Mount ScreenPrintingu.s. Patent 5,746,127. May 5, 1998K. W Fischbeck and G. T. Marks, assignors toAMTX Inc., Canandaigua, N. Y.

An apparatus for depositing a printingmaterial on a substrate comprising a stencilhaving a plurality of apertures there­through, wherein the stencil is capable ofbeing placed in contact with the substrate; adepositing member for depositing printingmaterial onto the stencil; and an electro­formed squeegee blade for spreading theprinting material across the stencil.

Method of UltrasonicallyGrinding a Workpieceu.s. Patent 5,746,646. May 5, 1998Y. Shibano, Machida, Tokyo

A method of ultrasonically grinding aworkpiece comprising immersing in a pro­cessing solution with abrasive grains sus­pended therein, the processing solution be­ing contained in an ultrasonic processingtank equipped with an ultrasonic vibrator;radiating ultrasonic energy from the ultra­sonic vibrator into the processing solutionto grind surfaces of the workpiece; coolingthe processing solution to a temperaturelower than a boiling point thereof; anddeaerating to reduce the net amount ofdissolved oxygen contained in the solutionfrom 0.5 to 3 ppm.

Spray BoothU.s. Patent 5,746,650. May 5, 1998J. Johnson and D.M. St. Louis, assignors to HadenInc., Auburn Hills, Mich.

An integrated paint spray booth and airconditioning system and process.

Activating Solution forElectroless Platingu.s. Patent 5,746,809. May 5, 1998O. Kanoh et al., assignors to Murata Mfg. Co. Ltd.,Kyoto, Japan

An activating catalytic solution for hy­drophilic electroless plating comprising analkaline solution of zinc salt, copper salt,and palladium salt, wherein at least one ofthe zinc and copper salts is an oxalate.

METAL FINISHING • OCTOBER 1998

Plating High Aspect RatioFeaturesu.s. Patent 5,746,903. May 5, 1998S./. Beilin et al., assignors to Fujitsu Ltd., Japan

A method of filling a high aspect ratioaperture with a plating solution formedwithin a photosensitive layer, comprisingpattern exposing a layer of photosensitivematerial to actinic radiation to define theaperture; exposing to a developer solution;thereafter rinsing with water without dry­ing; and exposing to a plating solution,wherein the aperture is not dried of the filmof water between the time it is rinsed andthe time it is exposed to the plating solu­tion.

Water-Dilutive and ConductiveCoating Compositionu.s. Patent 5,746,948. May 5, 1998Y. Kondo, assignor to Shinto Paint Co. Ltd.,Amagasaki, Japan

A water-dilutive and conductive coatingcomposition, which contains 10 to 50% byweight of water-soluble or water-dispers­ible synthetic resin as nonvolatile contentand 5 to 40% by weight of white electro­conductive pigment with regard to nonvol­atile content of the coating compositionand the amount of each of sodium andpotassium in the coating composition is notmore than 30 ppm.

Method for Checking PaintApplied to a Surfaceu.s. Patent 5,747,094. May 5, 1998K.A. Liddell, assignor to Fibre Glass-Evercoat Co.Inc., Cincinnati

A method for checking paint applied to asurface comprising forming a black andwhite pattern on a first side of a sheet ofmasking paper to form a patterned sheet ofmasking paper; applying the patternedsheet of masking paper to an area adjacenta surface to be painted such that the blackand white pattern is substantially adjacentthe surface to be painted; painting the sur­face to be painted and at least a portion ofthe black and white pattern; and using thepainted portion of the black and white pat­tern to determine the coverage and color ofpaint applied to the surface to be painted.

Process for the Manufacture ofPrinted Circuit Boardsu.s. Patent 5,747,098. May 5, 1998G.B. Larson, assignor to MacDermid Inc.,Waterbuf}', Conn.

A process for producing printed circuitboards, which process comprises drillingholes in a desired array in a copper cladlaminate; activating the holes to acceptplating therein; thereafter applying a resistto the surfaces of the laminate in an image­wise fashion to yield resist covered sur­faces and exposed copper surfaces; etchingaway the exposed copper surfaces; platingthe hole surfaces; and stripping the resist.

Two-Stage Powder ApplicationMethodu.s. Patent 5,747,106. May 5, 1998M. Matsunaga, assignor to Nordson Corp.,Westlake, Ohio

A method for powder coating a surfacecomprising applying to the surface, duringa first coating stage, a first layer of powderparticles having a first average diameter;and applying to the first layer of powderparticles, in a second coating stage, a sec­ond layer of powder particles having asecond average diameter smaller than thefirst average diameter so that at least someof the particles applied during the secondcoating stage fill spaces between particlesapplied during the first coating stage.

Process for the Effect Coatingof Grained Plastic Partsu.s. Patent 5,747,114. May 5, 1998H. Stegen et al., assignors to Herbel1s GmbH,Wuppel1al, Germany

A process for the effect coating of polarplastic parts, said parts having a grainedsurface, comprising applying a first coatinglayer, which is free from effect pigmentsand modified polyolefines, and which com­prises a coating medium based on bindervehicle systems that may be dried physi­cally and contains one or more polyure­thane resins and/or oligomeric urethanes;drying at a temperature of 20 to 80T downto a residual content of 3 to 20% by weightof volatile fractions; applying a secondcoating layer by overcoating the first coat­ing layer wet-on-wet with a base lacquer

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