CEATEC2013-21

Semiconductor Embedded in SUBstrate: SESUB

Features

• Small size: Higher integration of parts enables drastic miniaturization.

• Low profile: 4-layer substrate can be realized with a thickness of only 300 micron.

• Thermal dissipation: Efficient thermal dissipation provides higher degree of freedom for design.

• Reduced noise emissions: Chip connections within substrate enhance EMI performance.

Major Applications

• Smartphones, mobile phones, tablet devices

• Digital still cameras and other mobile devices

• Healthcare products, wearable devices, etc.

Advantages

SESUB (Semiconductor Embedded in SUBstrate) technique for embedding extremely low-profile chips into

the substrate enables the creation of extremely compact, high-performance PMUs for smartphones, as well

as the world's smallest class Bluetooth module.

SESUB technology from TDK realizes ultra-miniaturized power management units (PMU), Bluetooth modules, and more!

Compact, low-profile, low power consumption, low noise

PMU lineup

Shielded switching DC-DC converter (prototype)

11.0×11.0mm Height 1.65mm (max.)

μDC-DC

Converter

2.9

mm

2.3mm

PMUs for smartphones

11×11×1.65mm 8.9×10.3×1.4mm(Prototype)

BatteryCharger

6.65×5.3×1.4mm(Prototype)

ChargePump

2.3×2.4×1.0mm

μDC-DCConverter

2.9×2.3×1.0mm

■ 64% smaller mounting footprint

(Compared to modular construction using packaged ICs)

■ Ideal for wearable devices and portable devices with emphasis

on small size and elegant design

Bluetooth module demonstrationConventional small-size Bluetooth tag

Ultra low profile tag utilizing SESUB

Thickness 5 to 13mm

Thickness 2mm

Easily fits into any wallet

Chips are embedded in this substrate area

6.0×6.0mm

Package IC

Laminate Module SESUB module

8.5×8.5mm (= 72.3mm2)

Height 1.0mm

5.6×4.6mm (= 25.8mm2)

Height 1.0mm

-64%

Bluetooth module (Bluetooth Low Energy)

4.6m

m

5.6mm

1.0mm

Performance comparison

Without shield With shield

76.074.172.270.368.466.564.662.760.858.957.055.153.251.349.447.545.643.741.839.938.0

(dBμV)

Newly developed shielding structure for μDC-DC converter results in further reduced noise.

World’s smallest class!More compact products are under development.

5.2 × 4.3 × 1.0mm

1mm IC Die IC Die 0.3mm

Cross-section view of SESUB