© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
Page 1
Rochester Institute of Technology
Microelectronic Engineering
ROCHESTER INSTITUTE OF TECHNOLOGYMICROELECTRONIC ENGINEERING
Microsystem, PCB and Protoboard Components
Dr. Lynn FullerWebpage: http://people.rit.edu/lffeee
Microelectronic EngineeringRochester Institute of Technology
82 Lomb Memorial DriveRochester, NY 14623-5604
Tel (585) 475-2035Fax (585) 475-5041
Email: [email protected] webpage: http://www.microe.rit.edu
6-13-2010 PCB_Protoboard_Components.ppt
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
Page 2
Rochester Institute of Technology
Microelectronic Engineering
INTRODUCTION
The design of microsystems involves the integration of MEMS, on chip custom integrated circuits, off chip electronics such as power supply chips, microcontrollers and communication components. The integration is often done at the printed circuit board (PCB) level. This document will illustrate some of the various components used at the prototype, PCB and System level.
Protoboard PCB, MEMS
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
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Rochester Institute of Technology
Microelectronic Engineering
MICROSYSTEM DESIGN
Signal Conditioning Electronics
µP....
.
.
.
.
Multi-Sensor MEMs Chip
Micro Controller
Power Management
Com
munic
atio
n
Sig
nal
Cond
itio
ning
other
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
Page 4
Rochester Institute of Technology
Microelectronic Engineering
PCB PROTOTYPE
Prototype evaluation: breadboard sensors and signal processing electronics at the PCB level to evaluate different approaches for realizing microsystems.
Jirachai, Murat Baylav
Jennifer AlbrechtJirachai Dan Smith
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
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Rochester Institute of Technology
Microelectronic Engineering
MEMS Universal Fluid Interrogation Sensor (MUFINS)
0.8
0.85
0.9
0.95
1
0 100 200 300 400 500 600
Kinematic Viscosity ( cSt )
No
rma
lized
Fre
que
ncy
.
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Temperature ( °C )
No
rma
lized
Q
.
D25-norm-T
Q normal
57 42 36 32 29
pH
Viscosity
Spectroscopic impedanceZe ro-S pa n Com pe nsa te d Pr e ssure S e nsor ov e r
Te m pe ra ture
0.00
5.00
10.00
15.00
20.00
25.00
30.00
35.00
40.00
45.00
50.00
0 5 10 15 20
P re ss ure [p si ]
Ou
tpu
t V
olt
ag
e [m
V]
T = 27 C T = 57 C T = 84 C
Pressure
500
600
700
800
20 25 30 35 40 45
Vout
(mV
)
Temperature
0
500
1000
0 2505007501000
Vout
(mV
)
NTU
Turbidity
Fluid Level and Conductivity
Applications:
•Drinking water
•Automobile engine oil
•Industrial Fluids
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
Page 6
Rochester Institute of Technology
Microelectronic Engineering
GATE LEVEL DESIGN AND SIMULATION
R
C
RC Oscillator
Vout
U2
uA741
3
2
74
6
1
5+
-
V+
V-
OUT
OS1
OS2
U1A
7414
1 2
V
0
VEE
PARAM ET ERS:
Cvar = 10e-12
VEE
R1
47k
VCC
V1
5VDC
VCC
V2
5VDC
0
C2
{Cvar}
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
Page 7
Rochester Institute of Technology
Microelectronic Engineering
TRANSISTOR LEVEL CIRCUIT DESIGN AND SIMULATION
1
2V19V
+-
M1
7
3
M3
M2
RC_OSCILLATOR.TXT
M4
C1
M5
M6
4M7 M8
30 pF
3.0pF
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
Page 8
Rochester Institute of Technology
Microelectronic Engineering
PROTOBOARD REALIZATION
Heidi Purrington
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
Page 9
Rochester Institute of Technology
Microelectronic Engineering
EXPRESS PCB – FREE SOFTWARE FOR PCB DESIGN
Using “Express PCB”
free software
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
Page 10
Rochester Institute of Technology
Microelectronic Engineering
ARTWORK GENERATION
Print using a laser printer onto a transparency
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
Page 11
Rochester Institute of Technology
Microelectronic Engineering
MAKE COPPER PCB BOARD
1. Cut two sided copper board (6”x 9”) into smaller size that can be spin coated with photoresist (3”x 3”). Use shear in machine shop.
2. Clean Board with 400 grit sand paper or very fine steel wool followed by using Soap, Water and Blow Dry.
3. Spin coat with photoresist (HPR504) at 1500 rpm, 60 sec.4. Bake in Oven 100°C, 4 min. (gray oven near ion implanter)5. Place Transparency on Board and Flatten with Glass Plate6. Flood Expose, (10 sec = ~ 100mj/cm2) on Karl Suss MA1507. Develop in CD-26 Developer (~1 min), inspect8. Repeat 2 to 5 for other side of two sided board9. Test with drop of etch mixture on bare copper area, rinse, dry10. Hard bake in Oven 140°C 15 min11. Etch in Mixture of Water, H2O2, HCl (3:2:1)12. Strip Resist in Acetone, Rinse in Water13. Drill holes.14. Cut Board into Individual Packages Using Shear in Machine
Shop.
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
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Rochester Institute of Technology
Microelectronic Engineering
MAKE COPPER PCB BOARD
2-sided copper PCB 1/32” x 6”x9”
473-1011-ND $8.82
Shear
Small Shear
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
Page 13
Rochester Institute of Technology
Microelectronic Engineering
MAKE COPPER PCB BOARD
Oven
SCS Spin Coater
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
Page 14
Rochester Institute of Technology
Microelectronic Engineering
MAKE COPPER PCB BOARD
Flood Expose(10 sec = ~ 100mj/cm2)
Karl Suss MA150
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
Page 15
Rochester Institute of Technology
Microelectronic Engineering
PCB
Drinking Water Sensor
Heidi Purrington, 2009
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
Page 16
Rochester Institute of Technology
Microelectronic Engineering
PICK, PLACE AND SOLDER TOOL
Jeff [email protected]
78-1552
CEMA – Center for Electronics Manufacturing and Assembly
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
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Rochester Institute of Technology
Microelectronic Engineering
ADXL325 ALIGNMENT IMAGES
Copper Traces with Solder PasteImage of bottom of ADXL325
Superimposed on Copper Traces
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
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Rochester Institute of Technology
Microelectronic Engineering
BMA140 ALIGNMENT IMAGES
Copper Traces with Solder PasteImage of bottom of BMA140
Superimposed on Copper Traces
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
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Rochester Institute of Technology
Microelectronic Engineering
TEMPERATURE RAMP DURING SOLDERING
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
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Rochester Institute of Technology
Microelectronic Engineering
COMPLETED BOARD WITH SOLDERED COMPONENTS
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
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Rochester Institute of Technology
Microelectronic Engineering
SURFACE MOUNT
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
Page 22
Rochester Institute of Technology
Microelectronic Engineering
XRAY IMAGE OF ADXL325 SOLDER JOINTS
Glenbrook X-Ray Inspection
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
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Rochester Institute of Technology
Microelectronic Engineering
XRAY IMAGE OF BMA140 SOLDER JOINTS
Shows Possible Problem with Y and Z outputs shorted together
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
Page 24
Rochester Institute of Technology
Microelectronic Engineering
MEMS MULTI-SENSOR CHIP’s
1-AxisAccelerometerTemperature SensorHumidity SensorX & Y Strain Sensor
4mm x 4mm Chip
Prognostic Integrated Sensory MEMS (PRISM)
Health Management Solution to Predict
Equipment Performance and Readiness
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
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Rochester Institute of Technology
Microelectronic Engineering
MULTISENSOR MICROSYSTEM
MEMS Multisensor Chip
Acceleration (shock)
Temperature, Humidity
Back
Front
µP
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
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Rochester Institute of Technology
Microelectronic Engineering
PARTIAL LIST OF PROTOTYPE COMPONENTS
Power Conditioning Components:NEG Lin Regulator; Voltage Converter CMOS SW-CAP; POS Lin Regulator; 3.3V Regulator;
Integrated Circuits:Schmitt Inverter; Op Amp Lo Voltage MOS; Microcontroller; Counter/Shift Register, Instrumentation Amplifier, Multiplier, Waveform Generator
Passive: 100Kohm, 10Kohm, 1Kohm Trimpot; SMD Resistors many values from 100ohm to 10 MEG ohm; Axial Lead Resistors ¼ watt, all values; Chip Capacitors 0.001uF, 0.1uF, 1.0uF, 10uF, more;
Other:LEDs IR, Red, Green, Blue, White, Yellow; Diodes, MOSFETs N and P; Bluetooth Radio
Hardware: Connector for Pin Strip Header, Pin Strip Header, 2-sided copper PCB
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
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Rochester Institute of Technology
Microelectronic Engineering
PROTOTYPE AND PCB PARTS
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
Page 28
Rochester Institute of Technology
Microelectronic Engineering
POWER CONDITIONING COMPONENTS
Description Digikey Part Number Package ~Price
POS Lin Regulator Variable LM317MBSTT3GOSCT-ND
SOT-223 $0.72
POS Lin Regulator 3.3 Volt 576-1151-ND 8-SOIC $1.11
Voltage Converter CMOS SW-CAP MAX1044CPA+-ND 8-DIP $2.68
Voltage Converter CMOS SW-CAP MAX1044CSA+-ND 8-SOIC $3.26
NEG Lin Regulator 296-11417-5-ND 8-SOIC $5.60
8-SOIC
8-DIP
SOT-223
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
Page 29
Rochester Institute of Technology
Microelectronic Engineering
SWITCHED CAPACITOR VOLTAGE CONVERTER
MAX1044CSA+-NDCMOS1.5-10 Volt Supply
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
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Rochester Institute of Technology
Microelectronic Engineering
INTEGRATED CIRCUITS
Description Digikey Part Number Package ~Price
Hex Schmitt Inverter CD40106BCN-ND 14-DIP $0.40
Hex Schmitt Inverter CD40106BCMXCT-ND 14-SOIC $0.32
Quad Op Amp Lo Voltage MOS NJU7034D-ND 14-DIP $1.43
Dual Op Amp Lo Voltage MOS NJU7032M#-ND 8-DMP $0.83
Quad Bipolar Op Amp 1.8to12V MC33204DGOS-ND 14-SOIC $1.46
PIC33 Microcontroller DSPIC33FJ64MC804-E/PT-ND
44-TQFP $7.26
CD4034B 8-Stage Counter/Shift 296-14237-ND 24-DIP $1.88
14-DIP24-DIP
44-TQFP
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
Page 31
Rochester Institute of Technology
Microelectronic Engineering
INTEGRATED CIRCUITS
Description Digikey Part Number Package ~Price
AD9833 Waveform Generator MAX038CWP+-ND 10-MSOP $8.20
AD534 Analog Multiplier AD534JDZ-ND 14-CDIP $31.58
Instrumentation Amplifier INA101HP-ND 14-DIP $19.13
14-CDIP14-SOIC 10-MSOP
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
Page 32
Rochester Institute of Technology
Microelectronic Engineering
HEX INVERTER WITH HYSTERESIS
CD40106CMOS3-15 Volt Supply
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
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Rochester Institute of Technology
Microelectronic Engineering
LOW VOLTAGE CMOS OP AMP
NJU7032MCMOS3-16 Volt Supply
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
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Rochester Institute of Technology
Microelectronic Engineering
MICRO-CONTROLLER (µP)
3 to 3.6 Volt Supply-40 to 85°C13 Analog Input Channels, 10 BitDAC Output 15 Bit, 100KspsSerial Communication PortMore
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
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Rochester Institute of Technology
Microelectronic Engineering
Proposed Sine Wave Generator Chip
§ MAX038 / MAX038CWP Waveform Generator
§ VSUPPLY = ±5 V ~40mA each
§ VSINE = ±1 V
§ fSINE = 4 MHz
AC signals used in the test circuitry must be
sine waves because high frequency
components of square waves were coupling to other sensors on the chip.
20-SOIC
20-DIP
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
Page 36
Rochester Institute of Technology
Microelectronic Engineering
PASSIVE COMPONENTS
Description Digikey Part Number Package ~Price
1/10 watt, Thick Film Chip Resistors, 10M, 2M, 1M, 200K, 100K, 20K, 10K, 6.04K, 2K, 1K, 604, 200, 100
RHMxxxyHCT-ND* 0603SMD $0.08
Chip Capacitors, 16-50V,100pf, 1000pf, 0.1uF, 1.0uF, 10uF
399-xxxx-1-ND SMD $0.05 -$0.55
100K ohm potentiometer 3006-104LF-ND 3-lead $1.70
10K ohm potentiometer 3006Y-103LF-ND 3-lead $1.70
1K ohm potentiometer 3006Y-102LF-ND 3-lead $1.70
100K ohm 3mm Trimpot 3313J-104ECT-ND SMD $1.50
10K ohm 3mm Trimpot 3313J-103ECT-ND SMD $1.50
1K ohm 3mm Trimpot 3313J-102ECT-ND SMD $1.50
* RHM = Rohm Semiconductor, xxx= 2 or 3 digits for resistance value, y = power of 10 multiplier, H = 1%, CT=cut tape, Example RHM12.0KHCT-ND is 12.0 Kohm
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
Page 37
Rochester Institute of Technology
Microelectronic Engineering
PASSIVE COMPONENTS - RESISTORS
Chip Resistors
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
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Rochester Institute of Technology
Microelectronic Engineering
PASSIVE COMPONENTS - CAPACITORS
Size see next page
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
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Rochester Institute of Technology
Microelectronic Engineering
CHIP CAPACITORS
L x W = 2mm x 1.25mm
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
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Rochester Institute of Technology
Microelectronic Engineering
PASSIVE COMPONENTS - TRIMPOT
10 plus 2 more zeros = 1000 ohms
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
Page 41
Rochester Institute of Technology
Microelectronic Engineering
OTHER COMPONENTS
Description Digikey Part Number Package ~Price
NMOSFET BS107P 200V 3.3A IRF610PBF TO-220 $0.68
PMOSFET 100V 230ma Vth~-2.5 ZVP2110A-ND TO92-3 $1.13
NMOSFET 100V 320ma Vth~2.5 ZVN2110A-ND TO92-3 $0.81
PMOSFET 100V 75ma Vth~-2.5 ZVP3310FCT-ND SOT23-3 $0.83
NMOSFET 100V 100ma Vth~2.5 ZVN3310FCT-ND SOT23-3 $0.70
MOSFETs Matching N and P in same package
UP0497900LCT-ND 6-SSMINI
$0.71
Surface Mount NPN BJT MMBT3904LT3GOSCT SOT23-3 $0.07
Surface Mount PNP BJT MMBT4403LT1GOSCT SOT23-3 $0.07
TO-220SOT23-3
TO92
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
Page 42
Rochester Institute of Technology
Microelectronic Engineering
OTHER COMPONENTS
Description Digikey Part Number Package ~Price
IR LEDs 751-1027-ND Axial $0.50
1N4448 Diode 1N4448CT-ND Axial $0.062
1N4448 Diode BAS-16 BAS16FSCT-ND SOT23-3 $0.031
SFH4110 IR Diode Side Look – 950nm 475-1087-ND Axial $0.31
SEP8736 IR Diode Side Look – 880 nm 480-1969-ND Axial $1.38
CSD01060A SiC Schottky Diode CSD01060A-ND TO220-2 $1.38
Side
Looking
Axial
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
Page 43
Rochester Institute of Technology
Microelectronic Engineering
1N4448 DIODE
Axial
SOT-23
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
Page 44
Rochester Institute of Technology
Microelectronic Engineering
DISCRETE MOS TRANSISTORS
ZVN2110A
TO92
Vt = 1.5
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
Page 45
Rochester Institute of Technology
Microelectronic Engineering
DISCRETE MOS TRANSISTORS
ZVP2110A
TO92
Vt = 3.0
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
Page 46
Rochester Institute of Technology
Microelectronic Engineering
DISCRETE MOS TRANSISTORS – SURFACE MOUNT
D
S
G
D
S
G
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
Page 47
Rochester Institute of Technology
Microelectronic Engineering
OTHER
Description Digikey Part Number Qty ~Price
Receptacle for Pin Strip Header 929850E-01-36-ND 36 pin row $3.31
Pin Strip Header, Breakable 929450-01-36-ND 36 pin row $4.85
14 DIP Socket ED60001-ND each $1.09
2-sided copper PCB 6”x9” 473-1011-PCB-ND Each $10.38
Prototype boards From Computer Eng Each $10.00
Wire for Prototype boards C2004x-100-ND White, Red, BLue, BroWn
$16.24
Solder RMA Flux, 25AWG,63/37 KE1201-ND $40.25
Solder Iron 25 Watt WP25-ND $38.92
Solder Iron Tips ST5-ND $3.44
Pin Strip Header 0.1” Single Row of 36 pins, break in any length, Straight, Gold PlatedReceptacle
© June 13, 2010 Dr. Lynn Fuller
Microsystem Prototype Components
Page 48
Rochester Institute of Technology
Microelectronic Engineering
REFERENCES
1. WWW.digikey.com
2. www.Newark.com
3. Data sheets for all the components.
4. RIT_Package.pdf contains information on how to make PCBs atRIT. See http://people.rit.edu/~lffeee/labnotes.htm