Projektkoordination:Robert Bosch GmbH
Thomas Fleischmannfon +49 7121 35-39527
e-mail: [email protected]
Projektmanagement:edacentrum GmbH
Peter Neumannfon +49 511 762-19383
e-mail: [email protected]
Laufzeit: 11.04.2016 - 10.04.2019Homepage: www.edacentrum.de/trace
Enabling Smart Mobility and Smart Infrastructure by Development of a Technology ReAdiness
Process for Consumer Electronics(TRACE)
Das diesem Beitrag zugrundeliegende Vorhaben wurde mit Mittelndes Bundesministeriums für Bildungund Forschung gefördert.
MotivationStatus:− Functional requirements of innovative automotive/industrial systems require leading edge
semiconductor devices− Underlying technologies not defined, designed or qualified for automotive useEffect:− Reliability of corresponding technologies under automotive load unclear – lack of research− Device assessment and system integration process neither standardized nor aligned through the
supply chain− No accepted definition of „Automotive“ available through the supply chain – lack of standardization− “Old, established” automotive quality assurance processes do not longer match market dynamics
or technology complexityResult:− Over-/under engineering− Innovation barriers− Legal contradictions (eventually technically ok, but forbidden) Design potential limited
Solution / Target:− “New Automotive Definition”− Deployment of consumer electronics under transparent rules / constraints (new automotive
integration process – a Transfer Process)
Technical Core
TRACEMethod
Target System
AnalysisRequirements:
Application/system/module/
component, CE-AE gap analysis, measures
Demonstrator
ToolsModeling & Simulation
Test & Validation
Systems-System architecture, system design and assembly (PCB), housing (2nd level package)
TRACE MethodGuideline for qualification or modification/ qualification of CE components to enable
their integration into AE systems
TRACE Target System Analysis
Consideration of 4 different application/component segments
Systems• System enhancement
concepts
• Hardware architecture /
design upgrade
• Software architecture /
design upgrade
• System test upgrade
Components• Semiconductor technology
upgrade (IC, sensor)
• Circuit design upgrade (IC,
sensor)
• Package upgrade (IC,
sensor)
• Component test upgrade
(IC, sensor)
Quality and supply, cost analysis-Quality management, supply management, cost analysis and modelling
Quality, supply, cost analysis• Quality & Safety Management
• Supply Management
• Cost analysis and modelling
• Life Cycle Assessment
Components-Semiconductor technology, circuit design, design for test, assembly (1st level package)
Modeling & Simulation• Identification of failure
mechanisms & specification
of simulation criteria
• Electrical and electronic
effects
• Thermo-mechanical effects
• Multi-field effects
• Functional deviations
Test & Validation• Identification of possible failure
mechanisms
• Specification of test and validation criteria
• Concepts for improved and/or increased
• Test coverage
• Validation coverage
• Release concepts
Demonstrator1. Detection and Ranging2. Navigation3. Autonomous Infrastructure Interaction
TRACE workpackages