Appendix 1: Coefcient of (Linear) ThermalExpansion for Selected Materials (COE or CTE)
Coefficient of (linear) thermal expansion, α, for selectedmaterials (COE or CTE) (units are ×10−6 °C−1 (i.e. ppm/°C))
A. Pure metals
Aluminium 25
Chromium 6
Cobalt 12
Copper 17
Gold 14
Iron 12
Lead 29
Magnesium 25
Molybdenum 5
Nickel 13
Platinum 9
Silver 19
Tantalum 7
Tin 20
Titanium 9
Tungsten 5
Zinc 35
B. Alloys and MMCs
Alloy 42 4.4
Aluminium (40 % silicon) 13.5
Aluminium, AA 6061 23.6
Aluminium, AA 3003 23.2
Aluminium, AA 2017 22.9
Boron aluminium (20 %) 12.7
Brass 18.0
Copper/invar/copper 20/60/20 thick 5.8
Copper/molybdenum/copper 20/60/20thick
7.0
Graphite/aluminium 4–6
Invar 36 1.6
Invar 42 4.5
Inconel 600 13.0
Kovar (Fe–Ni–Co) 5.0(continued)
(continued)
Indium–lead 33.0
Lead (95 %) tin solder 28.0
Tin–lead solder 60/40 25.0
Magnesium, AZ31B 26.0
Ni-clad Molybdenum 5–6
Steel, 1020 12.0
Stainless steel (18-8) 17.0
Tungsten/copper (90/10) 6.5
Aluminium MMC with SiC particles(80–50 % reinforcement)
6–14
C. Insulators and substrate materials (for electronic systems)a
E glass 5.5
S glass 2.6
Glass–ceramic >3.0
Silicon 2.6
Diamond 0.9
Aluminium nitride 4.5
Silicon nitride 3.7
Quartz, fused silica 0.5
Kevlar 49 –5
Beryllia 6–9
Cubic boron nitride
x–y 3.7
z 7.2
E glass/epoxy
x–y 14–17
z 80–280
E glass/polyimide
x–y 12–16
z 40–80
E glass/PTFE
x–y 24
z 260
Kevlar/epoxy
x–y 5–7
z 70
Kevlar/polyimide(continued)
© Springer International Publishing Switzerland 2016B.D. Dunn, Materials and Processes, Springer Praxis Books,DOI 10.1007/978-3-319-23362-8
557
(continued)
x–y 3.4–6.7
z 83
Quartz/polyimide
x–y 5–8
z 68.4
Quartz/bismaleimide
x–y, 35 % resin 6.2
z 35 % resin 41
Alumina (90 %) TF substrate 7.0
Alumina (ceramic chip carrier) 5.9–7.4
Epoxy (70 % silica) plastic packaging 20–23
Mulite co-fired 4.2
Gallium arsenide 5.7
Silicon carbide 3.6
Carbon fibre 60 %–epoxy −1.1
D. Other ceramics
A12O3 6.5–8.8
BeO 9
MgO 13.5
SiC 4.8
Silicon 2.6(continued)
(continued)
Si3N4 (α-phase) 2.9
Si3N4 (β-phase) 2.3
Spinel (MgAl2O4) 7.6
Soda–lime–silicate glass 9.2 (used in lightbulbs)
Borosilicate glass 4.6 (used with Kovar)
Silica (96 % pure) 0.8
Silica (99.9 % pure) 0.55
Zerodur Class 2 0.1
Zerdur Class 0 Extreme 0.007
E. Polymers (unorientated)
Polyethylene 100–200
Polypropylene 58–100
Polystyrene 60–80
Polytetrafluoroethylene 100
Polycarbonate 66
Nylon (6/6) 80
Cellulose acetate 80–160
Polymethylmethacrylate 50–90
Epoxy 45–90
Phenolformaldehyde 60–80
Silicones 20–40aFor temperature range −55 to +100 °C
558 Appendix 1: Coefficient of (Linear) Thermal Expansion for Selected Materials (COE or CTE)
Appendix 2: Properties of Printed Circuit Laminates
Material Thermal Mechanical
ConductivityW/M-K
CTEX, Y Dir.ppm/°C
CTEZ. Dirppm//°C
Max. useTemperature°C
GlasstransitionTemperature °C
TensilestrengthMPa
YieldstrengthMPa
Elongation%
Polymer compositesPolyimide glass 0.35 12–16 40–60 215–280 250–260 345 –
Epoxy glassa 0.16–0.2 14–18 180 130–160 125–135 276 –
Modified epoxyb – 14–16 – – 140–150 – –
PTFEe glass,non-woven
0.1–0.26 20 – 230–260 – – –
PTFEe glass,woven
419–837 10–25 – 248 – 38–52 –
Epoxy aramid 0.12 6–8 66 – 125 68–103 – –
Epoxy quartz – 6–13 62 – 125 – –
Polyimide aramid 0.28 5–8 83 – 250 – –
Polyimide quartz 0.35 6–12 35 – 188–250 207 –
Epoxy—cordierite 0.9–1.3 3.3–3.8 – – – – – –
Modified epoxyaramid
– 5.5–5.6 100 – 137 – –
PTFEe quartz – 7.5–9.4 88 – 19d – –
Polyimide 4.3–11.8 45–50 – 260–315 – – – 6–7
Metal compositesCu/Invar/Cu(20/60/20)
15–18c 5.3–5.5 16 – N/A 310–414 170–270 36
Cu/Invar/Cu(12.5/75/12.5)
14c 4.4 – – N/A 380–480 240–340
Cu/Mo/Cu 90–174 2.6 – – N/A – –
Ni/Mo/Ni 129.8c 5.2–6 5.2–6 – N/A 621 552 50
Published with permission from the IPC, 2215 Sanders Road, Northbrook, Illinois, USA. (Table from IPC-D-279 Design Guidelines for ReliableSurface Mount Technology Printed Circuit Board Assemblies, July 1996)aFR-4, G-10bPolyfunctional FR-4cZ-directiondPolymorphic pePTFE=Polytetrafluoroethylene
© Springer International Publishing Switzerland 2016B.D. Dunn, Materials and Processes, Springer Praxis Books,DOI 10.1007/978-3-319-23362-8
559
Appendix 3: Reagents for MicroetchingMetals and Alloys
A wide variety of techniques may be used for the identifi-cation of grain structures, phases, and other constituents inmetals and alloys. Metallographers are often able to predictthe chemical composition and processing history of ametallic sample by selectively etching its polished surfaceand comparing the microstructure to those of referencesamples in conjunction with published phase diagrams.
The following chemical reagents (etch compositions) arerecommended by the author for the etching of metals andalloys commonly encountered during the metallurgicalassessment of electrical and structural spacecraft materials.
Each chemical must be stored and handled according to themanufacturer’s recommendations. All chemicals are poten-tially dangerous and it is assumed that the person mixing,pouring, or etching is thoroughly familiar with their use. Ifthere is any uncertainty about their use, toxicity, or means ofdisposal, the user’s Chemical and Safety Department shouldbe contacted.
The concentrations of acids are given in terms of specificgravity (s.g.), or as a percentage (%) of the fully concen-trated value.
© Springer International Publishing Switzerland 2016B.D. Dunn, Materials and Processes, Springer Praxis Books,DOI 10.1007/978-3-319-23362-8
561
No.
Reagent
compositio
nRem
arks
Metal
Aluminium
anditsalloys
1Hydrofluoricacid
(40%)
0.5ml
15sim
mersion
isrecommended.
Particlesof
allcommon
microconstituentsareoutlined.
Colourindicatio
ns
Hydrochloricacid
(1.19)
1.5ml
Nitric
acid
(1.4)
2.5ml
Water
95.5
ml
Mg 2Si
andCaSi 2
Blueto
brow
n
α(A
lFeSi)and(A
lFeM
n)Darkened
β(A
lCuF
e)Light
brow
n
(Keller’setch)
MgZ
n 2,NiAl 3,(A
lCuF
eMn),Al 2CuMgandAl 6CuM
gBrownto
black
α(A
lCuF
e)and(A
lCuM
n)Blackened
Al 3Mg 2
Heavily
outlinedandpitted
The
coloursof
otherconstituentsarelittle
altered.
Not
good
forhigh
Sialloys
Desmut
in50
%nitric
acid
ifnecessary
2So
dium
hydroxide
1g
Specim
ensareetched
bysw
abbing
for10
s.Allusualconstituentsareheavily
outlined,
except
forAl 3Mg 2
(which
may
belig
htly
outlined)
and(A
lCrFe)
which
isboth
unattacked
anduncoloured.Colourindicatio
nsWater
99ml
FeAl 3andNiAl 3
Slightly
darkened
(AlCuM
g)Light
brow
n
α(A
lFeSi)
Dullbrow
n
α(A
lFeSi)
Rough
andattacked;slightly
darkened
MnA
l 6and(A
lFeM
n)Colouredbrow
nto
blue
(unevenattack)
MnA
l 4Tends
tobe
darkened
The
coloursof
otherconstituentsareonly
slightly
altered
Berylliu
m
3Hydrofluoricacid
(40%)
10ml
Etchby
immersion
for10
–30
sto
outline
grainboundaries
andmicroconstituents
Ethyl
alcohol
90ml
4Water
95ml
Bealloys
may
beetched
inthereagent(1–15
s)
Sulphuricacid
(1.84)
5ml
Note:during
thepreparationof
beryllium
samples,d
onotb
reathe
dust,asthisisextrem
elytoxic.Cuttin
goperations
mustb
edone
undercontrolledconditions,preferably
inaglovebox.
Seetext
fortheremovalof
mechanicaltwins.Po
lishing
clothwill
becontam
inated
with
berylliaandneedsto
bedisposed
ofaccordingto
localh
ealth
andsafety
requirem
ents.M
etallographersshould
wearrubber
gloves
andavoidcontactw
ithetchants
Chrom
ium
5Hydrochloricacid
(concentrated)
Show
sstriations
inelectrodeposits
Cop
per,
copp
eralloys,brass,bron
ze,e
tc.
6Ammonium
hydroxide
50ml
Usedforcopper,manycopper-richalloys
Water
50ml
Gives
agrainboundary
etch,a
ndalso
tendsto
darken
theαsolid
solutio
n,leavingtheβsolid
solutio
nlig
hter.T
hehydrogen
peroxide
contentmay
bevaried.Lessisrequired
thelower
thecopper
content
Hydrogenperoxide
(30vol.)
20ml
7Ferric
chloride,variousstrengthsandcompositio
nsUsedas
ageneralreagent
forc
opper,brass,bronze,n
ickel–silver,aluminium–bronze,and
othercopper-richalloys.It
darkenstheβconstituent
inbrassesandgivesgraincontrastfollo
wingam
moniacalo
rchromicacid
etches.T
hemost
suitablecompositio
nshould
befoundby
trialand
errorin
specificcases.Thisreagentg
enerally
emphasizes
scratches
inim
perfectly
prepared
specim
ens,andtendsto
roughenthesurface.
Forsensitive
workitisfrequently
agreat
advantageto
replacethewater
inthereagentby
a50:50water–alcoholmixture
orby
pure
alcohol
To100partsof
water
areadded
Hydrochloricacid
(1.19)
Ferric
chloride
(g)
201
105
505
(con
tinued)
562 Appendix 3: Reagents for Microetching Metals and Alloys
(con
tinued)
No.
Reagent
compositio
nRem
arks
8Po
tassium
dichromate
2g
Usedforcopper,and
copper
alloys
with
beryllium
,manganese,and
silicon.A
lsosuitablefornickel–silver,b
ronzes,
andchromium–copper
alloys.Thisreagentshould
befollo
wed
byaferric
chloride
etch
togive
addedcontrast
Water
100ml
Sodium
chloride
(saturated)
4ml
Sulphuricacid
(s.g.1.84)
8ml
Gold
9Hydrochloricacid
(concentrated)
60ml
Use
underahood,im
merse
forafew
seconds
Nitric
acid
(concentrated)
(AquaRegia)
40ml
10Po
tassium
cyanide,
10%
inwater
10ml
Usedforg
oldandits
alloys.A
freshsolutio
n,warmed
ifnecessary,mustb
eused
foreachoperation.The
etchingtim
evaries
from
0.5to
3min.T
heattack
may
bespeededup
bytheadditio
nof
2%
ofpotassium
iodide,b
utthisisliable
togive
staining
effects
Ammonium
persulphate,
10%
inwater
10ml
11Tinctureof
iodine,50
%solutio
nin
aqueouspotassium
iodide
Usedforgold
alloys.W
ithsilver-goldalloys
asilver
iodide
film
may
form
.Thismay
beremoved
byim
mersion
inpotassium
cyanidesolutio
n
Indium
andindium
alloys
12Hydrochloricacid
(1.19)
20ml
General
etchant,useby
immersion
forafew
seconds.[For
very
detailedstudiesof
indium
–gold
reactio
nlayers,see
Millares
andPeraggi(1992)]
Picric
acid
4g
Ethyl
alcohol
400ml
Iron
andsteel
13Nitric
acid
(1.40)
1.5–5mlto
100ml
Ferrite
g.b.’s
inlow-carbonsteels.Darkens
pearliteandgivescontrast
with
ferrite
orcementitenetwork.
Etches
martensite
andits
decompositio
nproductsin
manysteels.B
etterthan
Picralforlow-allo
ysteelsandforferriticgrain
boundaries
5–30
sdependingon
steel
Ethanol
(Nitaletch)
14Picric
acid
1g
Attacksprioraustenite
boundaries
Hydrochloricacid
(Vilella’s
reagent)
5ml
Goodforferriticsteels
15Nitric
acid
(1.40)
10ml
Immerse
upto
30s.Goodforhigh-chrom
ium
steels,austeniticstainlesssteel,etc.
Donotkeep,discardwhenyello
w,ifleftthisreagentcan‘explode’
Hydrochloricacid
(1.19)
20ml
Glycerol
30ml
16Ferric
chloride
2g
Intool
steelsattacksferrite
andmartensite,outlinescarbides,leaves
austenite
unattacked
Hydrochloricacid
(1.19)
5ml
Water
(Kallin
g’sreagent)
30ml
Immerse
1–5min
Molyb
denu
m
17(a)Po
tass,hydroxideWater
10gto
100ml
Mix
equalam
ountsof
(a)and(b)as
needed
Grain
boundary
etch
(b)Po
t.ferricyanide
Water
10gto
100ml
18Ammonia
(0.88)
50ml
Boilforup
to10
min
General
etch
Hydrogenperioxide(3
%)
50ml
Water
50ml
Nickelan
ditsalloys
19Nitric
acid
(1.40)
10ml
Pure
nickel,andnickel–chromium
alloys.Grain
boundaries
etched
Hydrochloricacid
(1.19)
20ml
Glycerol
30ml
20Nitric
acid
(1.40)
10ml
Usedforpure
nickel,cupro-nickel,Monel
metal,andnickel–silver
Acetic
acid
10ml
Acetone
10ml
(con
tinued)
Appendix 3: Reagents for Microetching Metals and Alloys 563
(con
tinued)
No.
Reagent
compositio
nRem
arks
21Hydrochloricacid
(1.19)
300ml
Standin
fumecupboard
for24
h;usediluted50:50with
water.G
oodforNilo
Ketc.Can
bekept
asstocksolutio
n
Nitric
acid
(1.40)
100ml
Ferric
chloride
25g
Cupricchloride
25g
(‘Green
specialetch’,also
know
nas
Pinder’s
etch)
Platinu
mgrou
pof
metals(e.g.Pt,Pd,
Rh,
Ru,
Ir,O
s)
–Use
AquaRegia—
seeEtchant
No.
9(m
ayneed
tobe
warmed)
Grain
contrasting
22Po
tasssium
ferricyanide
3.5g
Severalminutes
immersion
Mostalloys,forgeneraletchingof
grainboundaries
Sodium
hydroxide
1g
Water
150ml
Silver
23Ammonium
hydroxide
50ml
Recom
mendedforsilver,silver–nickel,andsilver–palladium
alloys.Alsouseful
fortheexam
inationof
silver-
soldered
joints
Hydrogenperoxide
(3%)
10–30
ml
24Su
lphuricacid
(10%
inwater)to
which
afew
crystalsof
chromic
acid
CrO
3
have
been
added(2
g)Thisreagentrevealsthegrainstructureof
silver
andsilver
rich-allo
ys
Tin
anditsalloys
25Nitric
acid
(1.40)
2%
inalcohol
Micro
etch
with
high
contrast,which
blackens
lead
anddarkenstin
tolig
htbrow
nafterprolongedim
mersion
26Silver
nitrate
5g
Micro
etch
recommendedforlead-richalloys.Darkens
prim
aryandeutectic
lead
andproduces
avery
high
grain
contrast
Water
100ml
Titan
ium
anditsalloys
27Hydrofluoricacid
(40%)
1–3ml
3–10
sMostuseful
generaletch,especially
forTi6A14V
alloy
Plastic
mountsmustbe
thoroughly
washedto
removeallhydrofluoricacid
asredisudalacid
will
etch
anddamage
glassmicroscopelens
Nitric
acid
(1.40)
2–6ml
Water
(Kroll’sreagent)
to100ml
28Po
tassium
hydroxide(40%)
10ml
3–20
sUsefulforα/βalloys,αisattacked
orstained.
βunattacked
Hydrogenperoxide
(30%)
5ml
Water
(can
bevaried
tosuitalloy)
20ml
Marinol
blue—
50%
Benzalconium
chloride
solutio
n10
–15
ml
Stainetch
toshow
alpha-stabilizedlayer
29Glycerol
40ml
The
specim
enmustb
edry,
andsw
abetchinggivesbestcontrol;tim
eof
etchingvaries;contin
ueuntil
specim
enturns
light-brown
Methylatedspirit
40ml
Hydrofluoricacid
(40%
)5–
10ml
Tun
gsten
30So
dium
hydroxide,
10%
inwater
10ml
Thisreagentisused
cold
and,
onim
mersion
ofthespecim
enforapproxim
ately10
s,develops
grainboundaries
(Murakam
i’sreagent)
Potassium
ferricyanide,10%
inwater
10ml
31Hydrogenperoxide,3%
inwater
Thisreagentdevelops
grainboundaries,butonly
aftersome30
–90
sin
theboiling
reagent
564 Appendix 3: Reagents for Microetching Metals and Alloys
Appendix 4: Conversion Table for MechanicalProperties
Conversion table for mechanical properties (N/mm2(MPa) to hbar,tonf/in2, lbf/in2and kgf/mm2)
N/mm2 hbar tonf/in.2 lbf/in.2 kgf/mm2
5 0.5 0.3 700 0.5
10 1 0.6 1500 1.0
15 1.5 1.0 2200 1.5
20 2 1.3 2900 2.0
25 2.5 1.6 3600 2.5
30 3 1.9 4400 3.1
35 3.5 2.3 5100 3.6
40 4 2.6 5800 4.1
45 4.5 2.9 6500 4.6
50 5 3.2 7300 5.1
55 5.5 3.6 8000 5.6
60 6 3.9 8700 6.1
65 6.5 4.2 9400 6.6
70 7 4.5 10,200 7.1
75 7.5 4.9 10,900 7.6
80 8 5.2 11,600 8.2
85 8.5 5.5 12,300 8.7
90 9 5.8 13,100 9.2
95 9.5 6.2 13,800 9.7
100 10 6.5 14,500 10.2
105 10.5 6.8 15,200 10.7
110 11 7.1 16,000 11.2
115 11.5 7.4 16,700 11.7
120 12 7.8 17,400 12.2
125 12.5 8.1 18,100 12.7
130 13 8.4 18,900 13.3
135 13.5 8.7 19,600 13.8
140 14 9.1 20,300 14.3
145 14.5 9.4 21,000 14.8
150 15 9.7 21,800 15.3
155 15.5 10.0 22,500 15.8
160 16 10.4 23,200 16.3
165 16.5 10.7 23,900 16.8
170 17 11.0 24,700 17.3
175 17.5 11.3 25,400 17.8(continued)
(continued)
N/mm2 hbar tonf/in.2 lbf/in.2 kgf/mm2
180 18 11.7 26,100 18.4
185 18.5 12.0 26,800 18.9
190 19 12.3 27,600 19.4
195 19.5 12.6 28,300 19.9
200 20 12.9 29,000 20.4
205 20.5 13.3 29,700 20.9
210 21 13.6 30,500 21.4
215 21.5 13.9 31,200 21.9
220 22 14.2 31,900 22.4
225 22.5 14.6 32,600 22.9
230 23 14.9 33,400 23.5
235 23.5 15.2 34,100 24.0
240 24 15.5 34,800 24.5
245 24.5 15.9 35,500 25.0
250 25 16.2 36,300 25.5
255 25.5 16.5 37,000 26.0
260 26 16.8 37,700 26.5
265 26.5 17.2 38,400 27.0
270 27 17.5 39,200 27.5
275 27.5 17.8 39,900 28.0
280 28 18.1 40,600 28.6
285 28.5 18.5 41,300 29.1
290 29 18.8 42,100 29.6
295 29.5 19.1 42,800 30.1
300 30 19.4 43,500 30.6
305 30.5 19.7 44,200 31.1
310 31 20.1 45,000 31.6
315 31.5 20.4 45,700 32.1
320 32 20.7 46,400 32.6
325 32.5 21.0 47,100 33.1
330 33 21.4 47,900 33.7
335 33.5 21.7 48,600 34.2
340 34 22.0 49,300 34.7
345 34.5 22.3 50,000 35.2
350 35 22.7 50,800 35.7
355 35.5 23.0 51,500 36.2(continued)
© Springer International Publishing Switzerland 2016B.D. Dunn, Materials and Processes, Springer Praxis Books,DOI 10.1007/978-3-319-23362-8
565
(continued)
N/mm2 hbar tonf/in.2 lbf/in.2 kgf/mm2
360 36 23.3 52,200 36.7
365 36.5 23.6 52,900 37.2
370 37 24.0 53,700 37.7
375 37.5 24.3 54,400 38.2
380 38 24.6 55,100 38.7
385 38.5 24.9 55,800 39.3
390 39 25.3 56,600 39.8
395 39.5 25.6 57,300 40.3
400 40 25.9 58,000 40.8
405 40.5 26.2 58,700 41.3
410 41 26.5 59,500 41.8
415 41.5 26.9 60,200 42.3
420 42 27.2 60,900 42.8
425 42.5 27.5 61,600 43.3
430 43 27.8 62,400 43.8
435 43.5 28.2 63,100 44.4
440 44 28.5 63,800 44.9
445 44.5 28.8 64,500 45.4
450 45 29.1 65,300 45.9
455 45.5 29.5 66,000 46.4
460 46 29.8 66,700 46.9
465 46.5 30.1 67,400 47.4
470 47 30.4 68,200 47.9
475 47.5 30.8 68,900 48.4
480 48 31.1 69,600 48.9(continued)
(continued)
N/mm2 hbar tonf/in.2 lbf/in.2 kgf/mm2
485 48.5 31.4 70,300 49.5
490 49 31.7 71,100 50.0
495 49.5 32.1 71,800 50.5
500 50 32.4 72,500 51.0
505 50.5 32.7 73,200 51.5
510 51 33.0 74,000 52.0
515 51.5 33.3 74,700 52.5
520 52 33.7 75,400 53.0
525 52.5 34.0 76,100 53.5
530 53 34.3 76,900 54.0
535 53.5 34.6 77,600 54.6
540 54 35.0 78,300 55.1
545 54.5 35.3 79,000 55.6
550 55 35.6 79,800 56.1
555 55.5 35.9 80,500 56.6
560 56 36.3 81,200 57.1
565 56.5 36.6 81,900 57.6
570 57 36.9 82,700 58.1
575 57.5 37.2 83,400 58.6
580 58 37.6 84,100 59.1
585 58.5 37.9 84,800 59.7
590 59 38.2 85,600 60.2
595 59.5 38.5 86,300 60.7
600 60 38.8 87,000 61.2
566 Appendix 4: Conversion Table for Mechanical Properties
Appendix 5: Aluminium Alloy Temper Designations
The compositions and temper conditions of aluminiumalloys are designated by the Aluminium Association (AA)and are recognized internationally. Further information canbe obtained from the AA.
The Basic Temper Designations are as follows:
F As fabricatedO AnnealedH Strained hardenedT Thermally treated to produce stable tempers other
than F, O, H
The Subdivisions of H temper are as follows:
(a) First digitH1 strain hardened onlyH2 strain hardened and partially annealedH3 strain hardened and stabilized
(b) Second digit1 1/8 hard2 quarter hard3 3/8 hard4 half hard5 5/8 hard6 three quarters hard7 7/8 hard8 fully hard
9 the minimum ultimate tensile strength exceeds thatof the fully hard by at least 10 MPa.
The second digit indicates the degree of hardening andis a number from 1 to 9.
(c) Third digitA third digit may be used to denote a further charac-teristic or variation.
Spacecraft aluminium alloys are generally subdivisionsof the T temper, as shown below
A more precise description of the T tempers is as follows,but whenever possible the original material specificationshould be consulted, as some deviations exist:
T1 Cooled from an elevated temperature-shapingprocess and naturally aged to a substantiallystable condition
T2 Cooled from an elevated temperature-shapingprocess, cold-worked, and naturally aged to asubstantially stable condition
T3 Solution heat-treated, cold-worked, and natu-rally aged to a substantially stable condition
T351 Solution heat-treated and stress-relieved bystretching to produce a permanent set of 2 %nominal but not less than 1.5 % nor more than3 %. Product shall receive no further straight-ening after stretching
© Springer International Publishing Switzerland 2016B.D. Dunn, Materials and Processes, Springer Praxis Books,DOI 10.1007/978-3-319-23362-8
567
T3510 Solution heat-treated and stress-relieved bystretching to produce a nominal permanent setof 1.5 %, but not less than 1 % nor more than3 %. Extrusions shall receive no straighteningafter stretching
T3511 Solution heat-treated and stress-relieved bystretching to produce a nominal permanent setof 1–1.5 %, but not less than 1 % nor more than3 %. Extrusions may receive minor straighten-ing, after stretching, of an amount necessary tomeet the tolerances
T352 Solution heat-treated and stress-relieved bycompression to produce a permanent set of 1.5–5 %. During compression, primary focus shallbe applied in the axial direction
T36 Solution heat-treated and cold-worked byreduction of approximately 6 %
T361 Solution heat-treated and cold-reduced approx-imately 6 % in thickness
T4 Solution heat-treated and naturally aged to asubstantially stable condition
T42 Material purchased in any temper and subse-quently solution heat-treated and naturally agedto a substantially stable condition by the user
T451 Rolled or cold-finished, stress-relieved bystretching to produce a nominal permanent set of1.5 % but not less than 1 % nor more than 3 %Product shall receive no further operations afterstretching unless specifically authorized bypurchaser
T4510 Solution heat-treated and stress-relieved bystretching to produce a permanent set of 1.5 %nominal, but not less than 1 % nor more than3 %. Material shall receive no further straight-ening after stretching
T4511 Solution heat-treated and stress-relieved bystretching to produce a permanent set of 1.5 %nominal, but not less than 1 % nor more than3 %. Material may receive minor straighteningafter stretching
T5 Cooled from an elevated temperature-shapingprocess and then artificially aged (wroughtproducts). Stress-relieved (castings)
T51 Precipitation heat-treated (castings)T6 Solution and precipitation heat-treatedT61 Solution heat-treated and precipitation
heat-treated. Quenching from the solution tem-perature shall be into water at 80–85 °C
568 Appendix 5: Aluminium Alloy Temper Designations
T611 Solution and precipitation heat-treated, lowresidual stressesMaterial may, after quenching from the solutionheat-treatment temperature, receive minorstraightening in an amount necessary to meettolerances specified on the drawing
T62 Solution heat-treated and then artificially agedby the user
T651 Solution heat-treated and stress-relieved bystretching to produce a permanent set of 2 %nominal but not less than 1.5 % nor more than3 %, and artificially aged. Product shall receiveno further straightening after stretching
T6510 Solution heat-treated and stress-relieved bystretching to produce a permanent set of 1.5 %nominal, but not less than 1 % nor more than3 % and artificially aged. Material shall receiveno further straightening after stretching
T6511 Solution heat-treated and stress-relieved bystretching to produce a permanent set of 1.5 %nominal, but not less than 1 % nor more than3 %, and artificially aged. Material may receiveminor straightening after stretching
T652 Solution heat-treated and stress-relieved bycompression to produce a permanent set of 1.5–5 %, and precipitation heat-treated. Duringcompression, primary focus shall be applied inthe axial direction and on individual ringsapproximately final dimensions
T66 Solution and precipitation heat-treatedT7 Solution heat-treated and overaged/stabilizedT71 Solution and precipitation heat-treated (castings)T72 Solution heat-treated and then artificially over-
aged by the userT73 See T74T7351 Solution heat-treated and stress-relieved by
stretching to produce a nominal permanent setof 2 % but not less than 1.5 % nor more than3 %, and precipitation heat-treated. Plate shallreceive no further straightening operations afterstretching
T73510 Solution heat-treated and stress-relieved bystretching to produce nominal permanent set of1.5 % but not less than 1 % nor more than 3 %,and precipitation heat-treated. Material shallreceive no further straightening after stretching
T7311 Solution heat-treated and stress-relieved bystretching to produce nominal permanent set of1.5 %, but not less than 1 % nor more than 3 %,and precipitation heat-treated. Material mayreceive minor straightening, after stretching, anamount necessary to meet required dimensionaltolerances
T7352 Solution heat-treated and stress-relieved bycompression to produce a permanent set of notless than 1 % nor more than 5 %, andprecipitation heat-treated. The method anddirection of compression shall be as agreed uponby purchaser and vendor
T736 See T74T73651 Solution heat-treated and stress-relieved by
stretching to produce a nominal set of 2 % butno less than 1.5 % nor more than 3 %, andprecipitation heat-treated
T736511 Solution heat-treated and stress-relieved bystretching to produce a nominal permanent setof 1.5 % but not less than 1 % nor more than3 %, and precipitation heat-treated. Materialmay receive minor straightening after stretching,to meet required dimensional tolerances
T73652 Solution heat-treated and stress-relieved bycompression to produce a permanent set of notless than 1 % nor more than 5 %, andprecipitation heat-treated. The method anddirection of compression shall be as agreed uponby purchaser and vendor
T74 (Previously T73 or T736.) Solution heat-treatedand artificially aged to resist stress-corrosioncracking
T7451 Solution heat-treated and stress-relieved bystretching to produce a nominal permanent setof 2 % but not less than 1.5 % nor more than3 %, and precipitation heat-treated. Plate shallreceive no further straightening operations afterstretching
T7452 Solution heat-treated and stress-relieved bycompressing to produce a permanent set of 1–5 % and overaged
T76 Solution heat-treated and artificially aged suffi-cient to produce improved resistance toexfoliation
T761 Solution heat-treated and precipitationheat-treated. The T7 tempers require closercontrol on ageing practice variables such astime, temperature, heating-up rates, etc
T7651 Solution heat-treated and stress-relieved bystretching to produce a permanent set of 2 %nominal but not less than 1.5 % nor more than3 %, and artificially aged sufficient to produceimproved resistance to exfoliation andstress-corrosion cracking. Plate shall receive nofurther straightening after stretching
T76511 Solution heat-treated and stress-relieved bystretching to produce a nominal permanent setof 1.5 %, but not less than 1 % nor more than3 %, and precipitation treated. Material may
Appendix 5: Aluminium Alloy Temper Designations 569
receive minor straightening, after stretching, ofan amount necessary to meet required dimen-sional tolerances
T77 Solution-treated and stabilizedT8 Solution heat-treated, cold-worked, and then
artificially agedT81 Solution heat-treated, cold-worked by the flat-
tening operation, and then artificially agedT851 Solution heat-treated and stress-relieved by
stretching to produce a permanent set of 2 %nominal but not less than 1.5 % nor more than3 %, and artificially aged. Plate shall receive nofurther straightening after stretching
T8511 Solution heat-treated and stress-relieved bystretching to produce a nominal permanent set
of 1.5 % but not less than 1 % nor more than3 %, and precipitation heat-treated
T852 Solution heat-treated and stress-relieved bycompression, to produce a permanent set of 1–5 %, and precipitation heat-treated
T86 Solution heat-treated, cold-worked by a reduc-tion of approximately 6 %, and then artificiallyaged
T861 Solution heat-treated, cold-reduced approxi-mately 6 % in thickness, and precipitationheat-treated
T9 Solution heat-treated, artificially aged, and thencold-worked
T10 Cooled from an elevated temperature-shapingprocess, cold-worked, and then artificially aged
570 Appendix 5: Aluminium Alloy Temper Designations
Appendix 6: Metal Alloy Comparison Tables
Introduction
Marshall Space Flight Center document MSFC-SPEC-522A,entitled ‘Design criteria for controlling stress corrosioncracking’, contains a list of alloys. Each alloy bears a five-digit classification number, which is made up as follows:
The first digit denotes the class:
1. Steels2. Nickel alloys3. Aluminium alloys4. Copper alloys5. Titanium alloys6. Magnesium alloys7. Miscellaneous
The second digit denotes the subclass.The last three digits are a serial number within the
subclass.The list contained in the following pages is based on the
list described above, which forms as it were the framework.Into this framework have been intercalated those British,French and German alloy specifications that most closelycorrespond to their American counterparts. If an Americanspecification is not followed by such a European specifica-tion, that means that diligent searching has failed to reveal anequivalent.
It is for the user to decide from the composition whetherthe related specifications are sufficiently similar to permit theBritish, French or German alloy to be regarded as a suitablesubstitute for the American alloy. In all critical applicationsthe individual alloy specifications must be consulted asprecise compositions, tolerance in composition, the presentof trace elements, etc. can be important. No attempt has beenmade to relate materials on the basis of form, but reference tothe specification numbers will give guidance in this matter.
In the case of the steels and the aluminium alloys, the listmust be used in conjunction with the notes appended at theend of the relevant section.
Following the list, there is an index that enables the five-digit table numbers to be related to the unified numberingsystem (UNS) of the Society of Automotive Engineers(SAE) and the American Society for Testing Materials(ASTM). The UNS numbers are prefixed by letter symbolsthat have the following meaning:
A Aluminium and aluminium alloysC Copper and copper alloysG AISI and SAE carbon steelsJ Cast steels (except tool steels)K Miscellaneous nonferrous metals and alloysN Nickel and nickel alloysR Reactive and refractory metals and alloysS Heat- and corrosion-resistant (stainless) steelsT Tool steels, wrought and cast
© Springer International Publishing Switzerland 2016B.D. Dunn, Materials and Processes, Springer Praxis Books,DOI 10.1007/978-3-319-23362-8
571
Alloy equivalents—steels
Composition
Country Designation C Si Mn P S Other
Carbon steels
11001 USA AISI/SAE 1005 (UNS G10050) <.06 *1 <.35 <.04 <.05 –
UK BS970 015A03 <.06 *1 <.3 <.05 <.05 –
F AFNOR FD5 .04–.07 – .2–.4 .02 .025 –
F AFNOR FD4 .04–.07 <.1 .2–.4 .025 .03 –
G DIN 17140 D6-2 Wk. 1.0314 <.06 *2 <.4 <.04 <.04 N < .007 *3
G DIN 17140 D5-1 Wk. 1.0312 <.06 *2 <.4 <.05 <.05 –
11002 USA AISI/SAE 1006 (UNS G10060) <.08 *1 .25–.4 <.04 <.05 –
UK BS970 030A04 <.08 *1 .2–.4 <.05 <.05 –
G DIN 17140 D7-1 Wk. 1.0311 <.08 *2 <.45 <.06 <.05 –
G DIN 17140 D8-2 Wk. 1.0313 <.08 *2 <.45 <.045 <.04 N < .007 *3
11003 USA AISI/SAE 1008 (UNS G10080) <.1 *1 .3–.5 <.04 <.05 –
UK BS970 040A04 <.08 *1 .3–.5 <.05 <.05 –
F AFNOR FdTu4 <.09 – .25–.5 – – N < .006
F AFNOR FdTu2 <.08 – .35–.6 – N < .014 Mn/S > 10
F AFNOR FdTu10 <.1 – .25–.5 – – N < .01
F AFNOR FdTu11 <.1 <.1 .25–.5 – –
F AFNOR Fd2 .04–.1 – .2–.45 – – N < .007
F AFNOR Fd12 .04–.1 – .2–.5 – – N < .007
G Ust4, US14 Wk. 1.0336 <.09 *2 .25–.5 <.03 <.03 N < .007
G DIN 1623; 1624; 5512; st2, st12 Wk.1.0330
<.1 *2 .2–.45 <.033 <.035 N < .007 *3
G DIN 1623. B11; 001624; st3, st13 Wk.1.0333
<.1 *2 .2–.4 <.025 <.023 N < .007
G DIN 17115; Ust35-2; Wk. 1.0207 .06–.14 *2 .4–.6 <.04 <.04 N < .007 *3—AlsoAISI 1010
G DIN 17115; Rst35-2; Wk. 1.0208 .06–.12 .03–25 .4–.6 <.04 <.04 Also AISI 1010
G DIN 17111; UQst 36-2; Wk. 1.0204 .08–.13 *2 1.25–.45 <.04 <.04 N < .007 *3—AlsoAISI 1010
G DIN 17111; Rst 36-2; Wk. 1.0205 <.13 <.4 25–.5 <.05 <.5 N < .007 *3-Also AISI1010
11004 USA AISI/SAE 1010 (UNS G10100) .08–.13 *1 .3–.6 <.04 <.05 –
UK BS970 040A10 .08–.13 *1 .3–.5 <.05 <.05 –
UK BS970 045A10 .08–.13 *1 .3–.6 <.05 <.05 –
F AFNOR Xc9 .06–.12 .05–.3 .3–.5 – – –
G DIN 17210; 1652 Ck10 Wk. 1.1121 .07–.13 .15–.35 .3–.6 <.035 <.035 –
G DIN 17210; 1652 c9 Wk. 1.0301 .07–.13 .15–.33 .3–.6 <.045 <.043 –
11005 USA AISI/SAE 1011 (UNS G10110) .08–.13 *1 .6–.9 <.04 <.05 –
UK BS970 060A10 .08–.13 *1 .5–.7 <.05 <.05 –
11006 USA AISI/SAE 1012 (UNS G10120) .1–.15 – .3–.6 <.04 <.05 –
UK BS970 040A12 .1–.15 *1 .3–.5 <.05 <.05 –
F AFNOR XC 12 .1–.16 .05–.3 .3–.5 – – –
G DIN 17210; 1652 Ck10Wk. 1.1121 .07–.13 .15–.35 .3–.6 <.035 <.035 –
G DIN 17210; 1652 c9 Wk. 1.0301 .07–.13 .15–.35 .3–.6 <.045 <.045 –
11007 USA AISI/SAE 1015 (UNS G10150) .13–.18 *1 .3–.6 <.04 <.05 –
UK BS970 040A15 .13–.18 *1 .3–.5 <.05 <.05 –
UK BS970 050A15 .13–.18 *1 .4–.6 <.05 <.05 –
F AFNOR XC12 .1–.16 .05–.3 .3–.5 – – –
G DIN 17210; 1652 Ck15 Wk. 1.1141 .12–.18 .15–.35 .3–.6 <.035 <.035 –
11008 USA AISI/SAE 1016 (UNS G10160) .13–18 *1 .6–.9 <.04 <.05 –
UK BS970 080A15 .13–.18 *1 .7–.9 <.05 <.05 –
G DIN 17111; Rst 44.2 Wk. 1.0419 <.18 <.45 <.8 <.05 <.05 N < .007
11009 USA AISI/SAE 1017 (UNS G10170) .15–.2 *1 .3–.6 <.04 <.05 –
UK BS970 040A17 .15–.2 *1 .3–.5 <.05 <.05 –
F AFNOR XC18 .16–.22 <.25 .4–.65 – – –
G DIN 17210; 1652 Ck15 Wk. 1.1141 .12–.18 .15–.35 .3–.6 <.035 <.035 –
(continued)
572 Appendix 6: Metal Alloy Comparison Tables
(continued)
Composition
Country Designation C Si Mn P S Other
11010 USA AISI/SAE 1018 (UNS G10180) .15–.2 *1 .6–.9 <.04 <.05 –
UK BS970 080A17 .15–.2 *1 .7–.9 <.05 <.05 –
G DIN 17172; st43.7 Wk. 1.0484 <.22 <.4 .5–1.1 <.04 <.045 –
11011 USA AISI/SAE 1019 (UNS G10190) .15–.2 *1 .7–1.0 <.04 <.05 –
UK BS970 080A17 .15–.2 *1 .7–.9 <.05 <.05 –
G DIN 17172; St43.7 VVk.1.0484 <.22 <.4 .5–1.1 <.04 <.045 –
11012 USA AISI/SAE 1020 (UNS G10200) .18–.23 *1 3–.6 <.04 <.05 –
UK BS970 040A20 .18–.23 *1 .3–.5 <.05 <.05 –
F AFNOR CC20 .15–.25 .1–.4 .4–.7 <.04 <.04 –
G DIN 17200; 17242; 17243; 1652. C22Wk. 1.0402
.18 .25 .15–.35 .3–.6 <.045 <.045 –
11013 USA AISI/SAE 1021 (UNS G10210) .18–.23 *1 .6–.9 <.04 <.05 –
UK BS970 080A20 .18–.23 *1 .7–.9 <.05 <.05 ––
G DIN 17172; St47.7 Wk. 1.0409 <.22 .2–.45 .7–1.3 <.04 <.035 N < .009
11014 USA AISI/SAE 1022 (UNS G10220) .18–.23 *1 .7–1.0 <.04 <.05 –
UK BS970 080A20 .18–.23 *1 .7–.9 <.05 <.05 –
G DIN 17172; St47.7 Wk. 1.0409 <.22 .2–.45 .7–1.3 <.04 <.035 –
11015 USA AISI/SAE 1023 (UNS G10230) .2–.25 *1 .3–.6 <.04 <.05 –
UK BS970 040A22 .2–.25 *1 .3–.5 <.05 <.05 –
F AFNOR XC18S .15–.22 <.25 .4–.65 <.04 <.035 –
G DIN 17200; 1652. Ck22 Wk. 1.1151 .18–.25 .15–.35 .3–6 <.035 <.035 Cr < .5
11016 USA AISI/SAE 1025 (UNS G10250) .22–.28 *1 .3–.6 <.04 <.05 –
UK BS970 060A25 .23–.28 *1 .5–.7 <.05 <.05 –
F AFNOR XC25 .23–.29 .1–.4 .4–.7 – – –
G Ck25 Wk. 1.1158 .22–.29 .15–.4 .4–.7 <.035 <.035 –
11017 USA AISI/SAE 1026 (UNS G10260) .22–.28 *1 .6–.9 <.04 <.05 –
UK BS970 080A25 .23–.28 *1 .7–.9 <.05 <.05 –
11018 USA AISI/SAE 1029 (UNS G10290) .25–.31 *1 .6–.9 <.04 <.05 –
UK BS970 080A27 .25–.30 *1 .7–.9 <.05 <.05 –
11019 USA AISI/SAE 1030 (UNS G10300) .28–.34 *1 .6–.9 <.04 <.05 –
UK BS970 080A30 .28–.33 *1 .7–.6 <.05 <.05 –
11020 USA AISI/SAE 1035 (UNS G10350) .32–.38 *1 .6–.9 <.04 <.05 –
UK BS970 080A35 .33–.38 *1 .7–.9 <.05 <.05 –
F AFNOR XC32 .3–.35 .1–.4 .5–.8 – –– –
G DIN 17200; 17240; 0017242. Ck35Wk. 1.1181
.32–.39 .15–.35 .5–.8 <.035 <.035 –
11021 USA AISI/SAE 1037 (UNS G10370) .32–.38 *1 .7–1.0 <.04 <.05 –
UK BS970 080A35 .33–.38 *1 .7–.9 <.05 <.05 –
F AFNOR XC35 .32–.38 .1–.4 .5–.8 <.04 <.035 –
G DIN 17200; 17240; 0017242 Ck35Wk. 1.1181
.32–.39 .15–.35 .5–.8 <.035 <.035 –
11022 USA AISI/SAE 1038 (UNS G10380) .35–.42 *1 .6–.9 <.04 <.05 –
UK BS970 080A37 .35–.4 *1 .7–.9 <.05 <.05 –
F AFNOR XC38 .35–.4 .1–.4 .5–.8 <.035 <.035 –
G Ck38 Wk. 1.1176 .35–.4 .35–.5 .5–.7 <.035 <.035 N < .007, *3
11023 USA AISI/SAE 1039 (UNS G10390) .37–.44 *1 .7–1.0 <.04 <.05 –
UK BS970 080A40 .38–.43 *1 .7–.9 <.05 <.05 –
F AFNOR XC42 .4–.45 .1–.4 .5–.8 <.035 <.035 –
G Ck42A1 Wk. 1.1190 .39–.44 .25–.4 .75–.9 <.035 <.035 N < .007 *3
11024 USA AISI/SAE 1040 (UNS G10400) .37–.44 *1 .6–.9 <.04 <.05 –
UK B 970 060A40 .38–.43 *1 .5–.7 <.05 <.05 –
G Ck40 Wk. 1.1186 .37–.43 .15–.35 .5–.8 <.035 <.035 N < .007 *3
11025 USA AISI/SAE 1042 (UNS G10420) .4–.47 *1 .6–.9 <.04 <.05 –
UK BS970 060A42 .4–.45 *1 .5–.7 <.05 <.05 –
F AFNOR XC42 .4–.45 .1–.4 .5–.8 <.035 <.035 –
G Ck42A1 Wk. 1.1190 .39–.44 .25–.4 .75–.9 <.035 <.035 N < .007 *3(continued)
Appendix 6: Metal Alloy Comparison Tables 573
(continued)
Composition
Country Designation C Si Mn P S Other
11026 USA AISI/SAE 1043 (UNS G10430) .4–.47 *1 .7–1.0 <.04 <.05 –
UK BS970 080A42 .4–.45 *1 .7–.9 <.05 <.05 –
G DIN 17200; 17242; 1652. C45 Wk.1.0503
.42–.45 .15–.35 .5–.8 <.045 <.045 –
11027 USA AISI/SAE 1045 (UNS G10450) .43–.50 *1 .6–.90 <.04 <.05 –
UK BS970 080M46 .42–.50 *1 .6–1.0 <.05 <.05 –
F AFNOR XC45 .42–.48 .1–.35 .5–.8 <.035 <.035 –
G DIN 17200; 1652; 0017242 Ck45 Wk.1.1191
.42–.5 .15–.35 .5–.8 <.035 <.035 N < .007 *3
G DIN 17200 Cm45 Wk. 1.1201 .42–.5 .15–.35 .5–.8 <.035 .020–.035 –
CEN EN 10083-1 2C45 (C45E) 1.1191 Near equivalent toBS970 070M55
11028 USA AISI/SAE 1046 (UNS G10460) .43–.5 *1 .7–1.0 <.04 <.04 –
UK BS970 080A47 .45–.5 *1 .7–.9 <.05 <.05 –
11029 USA AISI/SAE 1049 (UNS G10490) .46–.53 *1 .6–.9 <.04 <.05 –
UK BS970 080M50 .45–.55 *1 .6–1.0 <.05 <.05 –
F AFNOR XC50 .46–.52 .15–.35 .5–.8 <.035 <.035 –
G CK50 Wk. 1.1206 .47–.55 .15–.35 .6–.9 <.035 <.035 –
CEN EN 10083-1 2C50 (C50E) 1.1206 Near equivalent toBS970 080M50
11030 USA AISI/SAE 1050 (UNS G10500) (*4) .48–.55 *1 .6–.9 <.04 <.05 –
UK BS970 080A52 .5–.55 *1 .7–.9 <.05 <.05 –
11031 USA AISI/SAE 1053 (UNS G10530) .48–.55 *1 .7–1.0 <.04 <.05 –
UK BS970 080A52 .5–.55 *1 .7–.9 <.05 <.05 –
11032 USA AISI/SAE 1055 (UNS G10550) (*4) .5–.6 *1 .6–.9 <.04 <.05 –
UK BS970 070M55 .5–.6 *1 .5–.9 <.05 <.05 –
F AFNOR XC55 .52–.6 .1–.4 .5–.8 <.035 <.035 –
G DIN 17200 Cm55 Wk. 1.1209 .52–.6 .15–.35 .6–.9 <.035 .020–.035 –
CEN EN 10083-1 2C55 (C55E) 1.1203 Near equivalent toBS970 070M55
11033 USA AISI/SAE 1060 (UNS G10600) (*4) .55–.65 *1 .6–.9 <.04 <.05 –
UK BS970 080A57 55–.6 .1–.4 .7–.9 <.05 <.05 –
F AFNOR XC60 .57–.65 .15–.35 .4–.7 <.035 <.035 –
G DIN 17200 Cm60 Wk. 1.1223 .57–.65 .15–.35 .6–.9 <.035 .02–.035 –
G DIN 17200; 1652; 0017222 Ck60 Wk.1.1221
.57–.65 .15–.35 .6–.9 <.035 <.035 –
G DIN 17200; 1652; 17222 C60 Wk.1.0601
.57–.65 .15–.35 .6–.9 <.045 <.045 –
11034 USA AISI/SAE 1064 (UNS G10640) (*4) .6–.7 *1 .5–.8 <.04 <.05 –
UK BS970 060A62 .6–.65 .1–.4 .5–.7 <.05 <.05 –
UK BS970 060A67 .65–.7 .1–.4 .5–.7 <.05 <.05 –
F AFNOR XC65 .6–.69 .1–.4 .5–.8 <.035 <.055 –
G DIN 17223 Federstahldraht FD (VD)Wk. 1.1230
.6–.7 <.25 .5–.9 <.03 <.03 (<.02) –
G Ck65 .65 .3 .75 <.035 <.035 –
11035 USA AISI/SAE 1065 (UNS G10650) (*4) .6–.7 *1 .6–.9 <.04 <.05 –
UK BS970 080A62 .6–.65 .1–.4 .7–.9 <.05 <.05 –
UK BS970 080A67 .65–.1 .1–.4 .7–.9 <.05 <.05 –
11036 USA AISI/SAE 1069 (UNS G10690) .66–.75 *1 .4–.7 <.04 <.05 –
UK BS970 060A72 .7–.75 .1–.4 .5–.7 <.05 <.05 –
F AFNOR XC68 .65–.73 .15–.35 .4–.7 <.035 <.035 –
G DIN 0017222 Ck67 Wk. 1.1231 .65–.72 15–.35 .6–.9 <.035 <.035 –
11037 USA AISI/SAE 1070 (UNS G10700) .65–.75 *1 .6–.9 <.04 <.05 –
UK BS970 080A72 .7–.75 .1–.4 .7–.9 <.05 <.05 –
G DIN001 7222 Ck67 Wk. 1.1 231 .65–.72 .15–.35 .6–.9 <.035 <.035 –
(continued)
574 Appendix 6: Metal Alloy Comparison Tables
(continued)
Composition
Country Designation C Si Mn P S Other
11038 USA AISI/SAE 1074 (UNS G10740) .7–.8 *1 .5–.8 <.04 <.05 –
UK BS970 070A78 .75–.82 .1–.4 .6–.8 <.05 <.05 –
F AFNOR XC75 .7–.8 .15–.3 .4–.7 <.035 <.035 –
G DIN0017222 Ck75Wk. 1.1248 .7–.8 .15–.35 .6–.8 <.035 <.033 N < .007 *3
11039 USA AISI/SAE 1075 (UNS G10750) .7–.8 *1 .4–.7 <.04 <.05 –
UK BS970 060A78 .75–.82 .1–.4 .5–.7 <.05 <.05 –
F AFNOR XC75 .7–.8 .15–.3 .4–.7 <.035 <.035 –
G Wk. 1.1246 .7–.77 <.2 .4–.6 <.025 <.025 –
11040 USA AISI/SAE 1078 (UNS G10780) .72–.85 *1 .3–.6 <.04 <.05 –
UK BS970 060A78 .75–.82 .1–.4 .5–.7 <.05 <.05 –
F AFNOR XC75 .7–.8 .15–.3 .4–.7 <.035 <.035 –
G Wk. 1.1246 .7–.77 <.2 4–.6 <.025 <.025 –
11041 USA AISI/SAE 1080 (UNS G10800) .75–.88 *1 .6–.9 <.04 <.05 –
UK BS970 080A83 .7–.9 .1–.4 .7–.9 <.05 <.05 –
F AFNOR XC80 .75–.85 .1–.4 .5–.8 <.035 <.035 Cr < 2
G DIN 0017222 Ck75 .7–.8 .15–.35 .6–.8 <.035 <.035 N < .007 *3
G Ck80 .8 .35 .75 <.035 <.035 –
11042 USA AISI/SAE 1084 (UNS G10840) .8–.93 *1 .6–.9 <.04 <.05 –
UK BS970 080A86 .83–.9 .1–.4 .7–.9 <.05 <.05 –
F AFNOR XC85 .8 .2–.4 .4–.7 <.03 <.025 –
G DIN 0017222.Ck85 Wk. 1.1269 .8–.9 .15–.35 .45–.65 <.035 <.035 N < .007 *3
11043 USA AISI/SAE 1085 (UNS G10850) .8–.93 *1 .7-1.0 <.04 <.05 –
UK BS970 080A86 .83–.9 .1–.4 .7–.9 <.05 < –
G 90Mn4 Wk. 1.1273 .85–.95 .25–.5 .9–1.1 <.035 <.035 –
11044 USA AISI/SAE 1086 (UNS G10860) .8–.93 *1 .3–.5 <.04 <.05 –
UK BS970 050A86 .83–.9 .1–.4 .4–.6 <.05 <.05 –
F AFNOR XC90 .85–.95 .15–.3 .3–.5 <.03 <.025 –
G Mk83 Wk. 1.1262 .8–.84 .1–.25 .35–.55 <.03 <.03 N < .007 *3
G Mk82 Wk. 1.1261 .8–.84 .1–.25 .25–.45 <.025 <.025 –
11045 USA AISI/SAE 1090 (UNS G10900) .85–.98 *1 .6–.9 <.04 <.05 –
UK BS970 060A96 .93–1.0 .1–.4 .5–.7 <.05 <.05 –
11046 USA AISI/SAE 1095 (UNS G10950) .9–1.03 *1 .3–.5 <.04 <.05 –
UK BS970 060A99 .95–1.05 .1–.4 .5–.7 <.05 <.05 –
F AFNOR Xc90 .95–1.05 .15–.3 .2–.45 <.03 <.025 –
G Mk97 .9–1.05 .15–.25 .3–.5 .045–.055 .060–.070 N < .007 *3
Higher manganese steels
12001 USA AISI 1513 (UNS G15130) .1–.16 *1 1.1–1.4 <.04 <.05 –
F AFNOR 12M5 .1–.15 <.4 .9–1.4 <.04 <.035 –
12002 USA AISI 1518 (UNS G15180) .15–.21 *1 1.1–1.4 <.04 <.05 –
UK BS970 120M19 .15–.23 *1 1.0–1.4 <.05 <.05 –
F AFNOR 20M5 .16–.22 .1–.4 1.1–1.4 <.035 <.035 –
G 20Mn6 Wk. 1.1169 .17–.23 .3–.6 1.3–1.6 <.035 <.035 –
12003 USA AISI 1522 (UNS G15220) .18–.24 *1 1.1–1.4 <.04 <.05 –
UK BS970 120M19 .15–.23 *1 1.0–1.4 <.05 <.05 –
F AFNOR 20M5 .16–.22 .1–.4 1.1–1.4 <.035 <.035 –
F AFNOR 18M5 .16–.22 .1–.4 1.1–1.5 <.04 .18–.23 –
G 20Mn6 Wk. 1.1169 .17–.23 .3–.6 1.3–1.6 <.035 <.035 –
12004 USA AISI 1524 SAE 1024 (UNS G15240) .19–.25 *1 1.35–1.65
<.04 <.05 –
UK BS970 150M19 .15–.23 *1 1.35–1.7 <.05 <.05 –
G 20Mn6 Wk. 1.1168 .17–.23 .3–.6 1.3–1.6 <.035 <.035 –
12005 USA AISI 1525 (UNS G15250) .23–.29 *1 .8–1.1 <.04 <.05 –
UK BS970 080A25 .23–.28 *1 .7–.9 <.05 <.05 –
(continued)
Appendix 6: Metal Alloy Comparison Tables 575
(continued)
Composition
Country Designation C Si Mn P S Other
12006 USA AISI 1526 (UNS G15260) .22–.29 *1 1.1–1.4 <.04 <.05 –
UK BS970 120M28 .24–.32 *1 1.0–1.4 <.05 <.05 –
G 9S-24 Mn4 Wk. 1.1136 .20–.28 .3–.6 .9–1.2 <.035 <.035 –
12007 USA AISI 1527 SAE 1027 (UNS G15270) .22–.29 *1 1.2–1.5 <.04 <.05 –
UK BS970 150M28 .24–.32 *1 1.3–1.7 <.05 <.05 –
G DIN 17200 Wk. 1.1170 .25–.32 .15–.4 1.3–1.65 <.035 <.035 –
12008 USA AISI 1536 SAE 1036 (UNS G15360) .3–.37 *1 1.2–1.5 <.04 <.05 –
UK BS970 120M36 .32–.4 *1 1.0–1.4 <.05 <.05 –
UK BS970 150M36 .32–.4 *1 1.3–1.7 <.05 <.05 –
F AFNOR 35 M5 .32–.38 .1–.4 1.1–1.4 <.035 <.035 –
G 36Mn5, GS-36Mn5 Wk. 1.1167 .32–.4 .15–.35 1.2–1.5 <.035 <.035 –
12009 USA AISI 1541 SAE 1041 (UNS G15410) .36–.44 *1 1.35–1.65
<.04 <.05 –
F AFNOR 40Mn .36–.44 .1–.4 1.0–1.35 <.04 <.035 –
G 36Mn5, GS-36 Mn5, Wk. 1.1167 .32–.4 .15–.35 1.2–1.5 <.035 <.035 –
12010 USA AISI 1547 SAE 1047 (UNS G15470) .43–.51 *1 1.35–1.65
<.04 <.05 –
F AFNOR 45 M5 .39–.48 .1–.4 1.2–1.5 <.04 <.035 –
12011 USA AISI 1548 SAE 1048 (UNS G15480) .44–.52 *1 1.1–1.4 <.04 <.05 –
F AFNOR 45 M5 .39–.48 .1–.4 1.2–1.5 <.04 <.035 –
12012 USA AISI 1551 SAE 1051 (UNS G15510) .46–.56 *1 .85–1.15 <.04 <.05 –
UK BS970 080M50 .45–.55 *1 .6–1.0 <.05 <.05 –
CEN EN 10083-1 2C50 (C50E) 1.1206 Near equivalent toBS970 080M50
12013 USA AISI 1552 SAE 1052 (UNS G15520) .47–.55 *1 1.2–1.5 <.04 <.05 –
F AFNOR 55 M5 .5–.6 .1–.4 1.2–1.5 <.05 <.035 –
12014 USA AISI 1561 SAE 1061 (UNS G15610) .55–.65 *1 .75–1.05 <.04 <.05 –
UK BS970 080A57 .55–.60 *1 .7–.9 <.05 <.05 –
G Ck60 Wk. 1.221 .57–.65 .15–.35 .6–.9 <.035 <.035 –
12015 USA AISI 1566 SAE 1066 (UNS G15660) .6–.71 *1 .85–1.15 <.04 <.05 –
UK BS970 080A67 .65–.7 *1 .7–.9 <.05 <.05 –
12016 USA AISI 1572 SAE 1072 (UNS G15720) .65–.76 *1 1.0–1.3 <.04 <.05 –
Free cutting steels
Composition
Country Designation C Si Mn P S Other
13001 USA AISI/SAE 1108 (UNS G11080) .08–.13 *1 .5–.8 <.04 .08–.13 –
G DIN 17111, U7S10, Wk. 1.0700 <.l *2 .4–.7 <.08 .08–.12 N < .007
G 10320 Wk. 1.0721 .07–.13 .1–.4 .5–.9 <.06 .15–.25 –
13002 USA AISI/SAE 1109 (UNS G11090) .08–.13 *1 .6–.9 <.04 .08–.13 –
13003 USA AISI/SAE 1110 (UNS G11100) .08–.13 *1 .3–.6 <.04 .08–.13 –
The changes in manganese range at this carbon level are not reflected in European specifications
F AFNOR 12MF (approximate equivalent) .09–.15 .1–.4 .9–1.2 <.06 .12–.24 –
13004 USA AISI/SAE 1116 (UNS G11160) .14–.2 *1 1.1–1.4 <.04 .16–.23 –
UK BS970 220M07 <.15 *1 .9–1.3 <.07 .2–.3 –
G 9S20 Wk. 1.0711 <.13 <.05 .6–1.2 <.1 .18–.25 –
13005 USA AISI/SAE 1117 (UNS G11170) .14–.2 *1 1.0–1.3 <.04 .08–.13 –
F AFNOR13MF .1–16 .1–.4 .8–1.1 <.04 .09–.13 –
G 9SMN 28 Wk. 1.0715 <.14 <.05 .9–1.3 <.1 .24–.32 –
UK BS970 230M07 <.15 *1 .9–1.3 <.07 .25–.35 –
13006 USA AISI/SAE 1118 (UNS G11180) .14–.2 *1 1.3–1.6 <.04 .08–13 –
13007 USA AISI/SAE 1119 (UNS G11190) .14–.2 *1 1.0–1.3 <.04 .24–.33 –
13008 USA AISI/SAE 1132 (UNS G11320) .27–.34 *1 1.35–1.65 <.04 .08–.13 –
UK BS970 216M28 .24–.32 *1 1.1–1.5 <.06 .12–.2 –
(continued)
576 Appendix 6: Metal Alloy Comparison Tables
(continued)
Composition
Country Designation C Si Mn P S Other
13009 USA AISI/SAE 1137 (UNS G11370) .32–.39 *1 1.35–1.65 <.04 .08–.13 –
UK BS970 225M36 .32–.4 <.25 1.3–1.7 <06 .12–.2 –
F AFNOR 35 M6 .33–39 .1–.4 1.3–1.7 <.04 .09–.13 –
G Wk. 1.0726 .32–39 .1–.4 .5–.9 <.06 .15–.25 –
13010 USA AISI/SAE 1139 (UNS G11390) .35–.43 *1 1.35–1.65 <.04 .13–.2 –
13011 USA AISI/SAE 1140 (UNS G11400) .37–.44 *1 .7–1.0 <.04 .08–.13 –
13012 USA AISI/SAE 1141 (UNS G11410) .37–.45 *1 1.35–1.65 <.04 .08–.13 –
UK BS970 212A37 .35–.40 *1 1.0–1.3 <.06 .12–.2 –
13013 USA AISI/SAE 1144 (UNS G11440) .4–.48 *1 1.35–1.65 <.04 .24–.33 –
13014 USA AISI/SAE 1145 (UNS G11450) .42–.49 *1 .7–1.0 <.04 .04–.07 –
13015 USA AISI/SAE 1146 (UNS G11460) .42–.49 *1 .7–1.0 <.04 .08–13 –
UK BS970 212M44 .4–.48 *1 1.0–1.4 <.06 .12–.2 –
UK BS970 225M44 .4–.48 *1 1.3–1.7 <.06 .2–.3 –
F AFNOR 45 MF6 .41 .48 .1 .4 1.3–1.7 <.04 .24 .32 –
G 45S20 Wk. 1.0727 .42–.5 .1–.4 .5–.9 <.06 .15–.25 –
13016 USA AISI 12L 13 (UNS G12134) <.13 *1 .7–1.0 .07–.12 .24–.33 Pb .15–.35
13017 USA AISI/SAE 12L 14 (UNS G12144) <.15 *1 .85–1.15 .04–.09 .26–.35 Pb .15–.35
F AFNOR 10 Pb2 .05–.15 <.3 .3–.6 <.04 <.04 Pb .15–.30
G 9SMn Pb28 <.14 <.05 .9–1.3 <.1 .24–.32 Pb .15–.30
G 10 SPb 20 .07–13 .1–.4 .5 .9 <.06 .15–.25 Pb .15–.30
G 9SMn Pb 36 <.15 <.05 1.0–1.5 <.1 .32–.40 Pb .15–.30
Note Where USA grades are closely graded they have been grouped together with groups of approximating European specifications
Low alloy steels: Manganese—Molybdenum
Composition
Country Designation C Si Mn P S Cr Mo Ni Other
14001 USA AISI/SAE 4012 (UNSG40120)
.09–.14 .2–.35 .75–1.0 <.035 <.04 – .15–.25 – –
G 15Mn Mo53 Wk. 1.5418 (*5) <.2 .3–.5 1.1–1.4 <.04 <.04 – .35 – –
14002 USA AISI/SAE 4023 (UNSG40230)
.2–.25 .2–.35 .7–.9 <.035 <.04 – .2-3 – –
F AFNOR 18MD4.05 (*5) <.22 .1–.4 .9–1.5 <.035 <.035 <.3 .35–.6 – V < .04
G 20Mo3 Wk. 1.5416 .16–.24 .15–.35 .5–.8 <.04 <.04 – .25–.35 – –
14003 USA AISI/SAE 4024 (UNSG40240)
.2–.25 .2–.35 .7–.9 <.035 .035–.05 – .2–.3 – –
F/G See AISI 4023
14004 USA AISI/SAE 4027 (UNSG40270)
.25–.3 .2–.35 .7–.9 <.035 <.04 – .2–.3 – –
14005 USA AISI/SAE 4028 (UNSG40280)
.25–.3 .2–.35 .7–.9 <.035 .035–.05 – .2–.3 – –
G 15Mo3 Wk. 1.5415 (*5) .12–.2 .1–.35 .4–.8 <.04 <.04 <.3 .2–.35 – –
G 22Mo4 Wk. 1.5419 (*5) .18–.25 .2–.4 .4–.7 <.035 <.033 <.3 .3–4 – –
14006 USA AISI/SAE 4032 (UNSG40320)
.3–.35 .2–.35 .7–.9 <.035 <.04 – .2–.3 – –
14007 USA AISI/SAE 4037 (UNSG40370)
.35–.40 .2–.35 .7–.9 <.035 <.04 – .2–3 – –
UK BS970 605M30 (*5) .26–.34 1–.35 1.3–1.7 <.04 <.05 – .22–.32 – –
UK BS970 605M36 (*5) .32–.4 .1–.35 1.3–1.7 <.04 <.05 – .22–.32 – –
G GS-35Mn Mo5 Wk. 1.5411 .32–.38 .3–.5 1.0–1.4 <.035 <.035 – .15–.25 – –
14008 USA AISI/SAE 4042 (UNSG40420)
.4–.45 .2–.35 .7–.9 <.035 <.04 – .2–.3 – –
14009 USA AISI/SAE 4047 (UNSG40470)
.45–.5 .2–.35 .7–.9 <.035 <.04 – .2–.3 – –
UK BS970 608M38 (*5) .32–.4 .1–.35 1.3–1.7 <.04 <.05 – .4–.55 – –
G GS-40Mn Mo43 (*5) .36–.43 .3–.5 .9–1.2 <.035 <.05 – .25–.35 – –
Appendix 6: Metal Alloy Comparison Tables 577
Low alloy steels: Chromium–Molybdenum
Composition
Country Designation C Si Mn P S Cr Mo Ni Other
14010 USA AISI/SAE 4118(UNS G41180)
.18–.23 .2–.35 .7–.9 <.035 <.04 .4–.6 .08–.15 – –
14011 USA AISI/SAE 4130(UNS G41300)
.28–.33 .2–.35 .4–.6 <.035 <.04 .8–1.1 .15–.25 – –
14012 USA AISI/SAE 4135(UNS G41350)
.33–.38 .2–.35 .7–.9 <.035 <.04 .8–1.1 .15–.25 – –
F AFNOR 15CD3.5 .14–.18 <.35 .3–.6 <.04 <.035 .85–1.15 .15–.3 – –
F AFNOR12CD 4 .08–.14 .14–.4 .5–.8 <.04 <.035 .85–1.15 .15–.3 – –
F AFNOR 15CD4.05 <.2 .1–.4 .4–.85 <.035 <.035 .75–1.23 .4–.6 – V < .04
F AFNOR 18CD4(S) *6 .16–.22 .1–.4 .6–.9 <.035 <.035 .85–1.15 .15–.3 – –
F AFNOR 30CD 4 *6 .28–.34 .1–.4 .6–.8 <.035 <.035 .85–1.15 .15–.3 – –
F AFNOR 35CD 4 *6 .33–.39 .1–.4 .6–.9 <.035 <.035 .85–1.13 .15–.3 – –
G DIN 17155; 17175:0017243. 13Cr Mo4.4Wk. 1.7335
.1–.18 .1–.35 .4–.7 <.04 <.04 .8–1.15 .4–.65 – –
G 15Cr Mo5 .13–.17 .15–.35 .8–1.0 <.035 <.035 1.0–1.3 .2–.3 – –
G 20Cr Mo5 .18–.23 .15–.35 .9–1.2 <.035 <.035 1.1–1.4 .2–.3 – –
G DIN 17200: 001654.(GS)25Cr Mo4 Wk.1.7218
.22–.29 .15–.4 .5–.8 <.035 <.035 .9–1.2 .15–.3 – –
G DIN 17200: 001654.(GS)34Cr Mo4 Wk.1.7220
.3–.37 .15–.4 .5–.8 <.035 <.033 .9–1.2 .15–.3 – –
14013 USA AISI/SAE 4137(UNS G41370)
.35–.4 .2–.35 .7–.9 <.035 <.04 .8–1.1 .15–.25 – –
14014 USA AISI/SAE 4140(UNS G41400)
.38–.43 .2–.35 .75–1.0 <.035 <.04 .8–1.1 .15–.25 – –
UK BS970 708A37 .35–.4 .1–.35 .7–1.0 <.04 <.05 .9–1.2 .15–.25 – –
UK BS970 708M40 .36–.44 .1–.35 .7–1.0 <.04 <.05 .9–1.2 .15–.25 – –
F AFNOR 40CD 4 .39–.46 .2–.50 .5–.8 <.03 <.025 .95–1.3 .15–.3 – –
F AFNOR 42CD4 .39–.46 .1–.4 .6–.9 <.035 <.035 .85–1.15 .15–.3 – –
G DIN 17200; 001654.GS42CrMo4Wk.1.7225
.38–.5 .3–.5 .5–.8 <.035 <.035 .8–1.2 .2–.3 – –
G DIN 17200.34CrMoS4
.3–.37 .15–.4 .5–.8 <.035 .02–.035 .9–1.2 .15–.3 – –
CEN EN 10083-1 42CrMo4 1.17225Near equivalent to BS970 708M40
14015 USA AISI/SAE 4142(UNS G41420)
.4–.45 .2–.35 .75–1.0 <.035 <.04 .8–1.1 .15–.25 – –
14016 USA AISI/SAE 4145(UNS G41450)
.43–.48 .2–.35 .75–1.0 <.035 <.04 .8–1.1 .15–.25 – –
14017 USA AISI/SAE 4147(UNS G41470)
.45–.50 .2–.35 .75–1.0 <.035 <.04 .8–1.1 .15–.25 – –
UK BS970 708 H42 .39–.46 .1–.35 .65–1.05 <.04 <.05 .8–1.25 .15–.25 – –
F AFNOR 42CD 4 .39–.46 .1–.4 .6–.9 <.035 .035 .85–1.15 .15–.3 – –
G DIN 17200, 42Cr MoS4 Wk. 1.7227
.38–.45 .15–.4 .5–.8 <.035 .02–.035 .9–1.2 15–.3 – –
14018 USA AISI/SAE 4150(UNS G41500)
.48–.53 .2–.35 .75–1.0 <.035 <.04 .8–1.1 .15–.25 – –
14019 USA AISI/SAE 4161(UNS G41610)
.56–.64 .2–.35 .75–1.0 <.035 <.04 .7–.9 .25–.35 – –
G DIN 17200. 50CrMo4 Wk. 1.7228
.46–.54 .15–.4 .5–.8 <.035 <.035 .9–1.2 .15–.25 – –
G GS-58 Cr Mn Mo443Wk. 1.7266
.54–.62 .3–.5 .6–1.2 <.035 <.033 .8–1.2 .2–.3 – –
578 Appendix 6: Metal Alloy Comparison Tables
Low alloy steels: Nickel–Chromium–Molybdenum
Composition
Country Designation C Si Mn P S Cr Mo Ni Other
14020 USA AISI/SAE 4320(UNS G43200)
.17–.22 .2–.35 .45–.65 <.035 <.04 .4–.6 .2–.3 1.65–2.0 –
F AFNOR 20 NCD 7 .16–.22 .2–.33 .45–.65 <.03 <.023 .2–.6 .2–.3 1.65–2.0 Cu < 35
14021 USA AISI/SAE 4340(UNS G43400)
.38–.43 .2–.35 .6–.8 <.035 <.04 .7–.9 .2–.3 1.65–2.0 –
G DIN 0017242. 40 Ni Cr Mo73 Wk. 1.6562
.37–.44 <.4 .7–.9 <.02 <.015 .7–.95 .3–.4 1.65–2.0 –
14022 USA AISI/SAE 4718(UNS G47180)
.16–.21 – .7–.9 – – .35–.55 .3–.4 .9–1.2 –
F AFNOR 18NCD4 .16–.22 .2–.35 .5–.8 <.03 <.025 .35–.55 .15–.3 .9–1.2 Cu < .35
14023 USA AISI/SAE 4720(UNS G47200)
.17–.22 .2–.35 .5–.7 <.035 <.04 .35–.55 .15–.25 .9–1.2 –
See AISI 4718 (UNS G47180)Table No. 14022
14024 USA AISI/SAE 8115(UNS G81150)
.13–.18 .2–.35 .7–.9 <.035 <.04 .3–.5 .08–.15 .2–.4 –
UK BS970 805A15 .13–.18 1–.35 .7–.9 <.04 <.05 .4–.6 .15–.25 .4–.7 –
14025 USA AISI/SAE 8615(UNS G86150)
.13–.18 .2–.35 .7–.9 <.035 <.04 .4–.6 .15–.25 .4–.7 –
14026 USA AISI/SAE 8617(UNS G86170)
.15–.2
14027 USA AISI/SAE 8620(UNS G86200)
.18–.23
14028 USA AISI/SAE 8622(UNS G86220)
.2–.25 Other elements as AISI/SAE 8615
14029 USA AISI/SAE 8625(UNS G86250)
.23–.28
14030 USA AISI/SAE 8627(UNS G86270)
.25–. 3
14031 USA AISI/SAE 8630(UNS G86300)
.28–. 33
UK BS970 805A17 .15–.2 .1–.35 .7–.9 <.04 <.05 .4–.6 .15–.25 .4–.7 –
UK BS970 805A20 .18–.23
UK BS970 805A22 .2–.25 Other elements as BS970 805A17
UK BS970 805A24 .22–.21
F AFNOR15NCD2 .13–.18 .1–.4 .7–.9 <.04 <.035 .4–.6 .15–.25 .4–.7 –
F AFNOR 20NCD2 .18–.23 .1–.4 .7–.9 <.03 <.025 .4–.6 .15–.25 .4–.7 Cu < .35
F AFNOR 30NCD2 .3–.35 .1–.4 .7–.9 <.04 <.035 .4–.6 .15–.3 .5–.8 –
G DIN001654. 21 Ni Cr Mo2Wk. 1.6523
.17 .23 .15–.4 .6–.9 <.035 <.035 .35–.65 .15–.25 .4–.7 –
G 21 Ni Cr Mo22 Wk. 1.6543 .18–.23 .2–.35 .7–.90 <.035 <.035 .4–.6 .2–3 .4–.7 –
G 30 Ni Cr Mo22 Wk. 1.6545 .27–. .34 15–.34 .7–1.0 <.035 <.035 .4–.6 .15–.3 .4–.7 –
14032 USA AISI/SAE 8637(UNS G86370)
.35–.4 .2–.35 75–1.0 <.035 <.04 4–.6 .15–.25 4–.7 –
14033 USA AISI/SAE 8640 (UNSG86400)
.38–.43
14034 USA AISI/SAE 8642 (UNSG86420)
.4–.45
14035 USA AISI/SAE 8645 (UNSG86450) *7
.43–.48
14036 USA AISI/SAE 8650 (UNSG86500)
.48–.53 Other elements as AISI 8637
14037 USA AISI/SAE 8655 (UNSG86550)
.51–.59
14038 USA AISI/SAE 8660 (UNSG86600)
.56–. 64
UK BS970 805A60 .55–. 65 .1–.35 .7–1.0 <.04 <.05 .4–.6 .15–.25 .4–.7 –
F AFNOR 35 NCD2 .32–.40 .1–.4 .7–1.0 <.04 <.035 .4–.6 .15–.3 .4–.7 –
F AFNOR 40 NCD2 .37–.40 .1–.4 .6–.9 <.04 <.035 .4–.6 .15–.3 .4–.7 –
F AFNOR 40 NCD2TS .38–.44 .1–.4 .7–1.0 <.035 <.03 .4–.6 .15–.3 .4–.7 –
G 40Ni Cr Mo22 Wk. 1.6546 .37–.44 .15–.34 .7–1.0 <.035 <.035 .4–.6 .15–.3 .4–.7 –
Appendix 6: Metal Alloy Comparison Tables 579
Low alloy steels: Nickel–Molybdenum
Composition
Country Designation C Si Mn P S Cr Mo Ni Other
14039 USA AISI/SAE 4615 (UNS G46150) .13–.18 .2–.35 .45–.65 <.035 <.04 – .2–.3 1.65.–2.0 –
14040 USA AISI/SAE 4617 (UNS G46170) .15–.2
14041 USA AISI/SAE 4620 (UNS G46200) .17–.22 Other elements as AISI 4615
UK BS970 665A17 .15–.2 .1–.35 .45–.65 <.04 <.05 <.25 .2–.3 1.6–2.0 –
UK BS970 665A19 .17–.22 Other elements as BS970 665A17
14042 USA AISI 4621 (UNS G46210) .18–.23 .2–.35 .7–.9 <.035 <.04 – .2–.3 1.65–2.0 –
UK BS970 665M20 .17–.23 .1–.35 .35–.75 <.04 <.05 – .2–3 1.5–2.0 –
14043 USA AISI/SAE 4626 (UNS G46260) .24–.29 .2–.35 .45–.65 <.035 <.04 – .15–.25 .7–1.0 –
UK BS970 665A22 *5 .2–.25 .1–.35 .45–.65 <.04 <.05 <.25 .2–.3 1.6–2.0 –
UK BS970 665A24 *5 .22–.27 .1–.35 .45–.65 <.04 <.05 <.25 .2–.3 1.6–2.0 –
Low alloy steels: Chromium
Composition
Country Designation C Si Mn P S Cr Mo Ni Other
14044 USA AISI/SAE 5115 (UNS G51150) .13–.18 .2–.35 .7–.9 <.035 <.04 .7–9 – – –
14045 USA AISI/SAE 5120 (UNS G51200) .17–.22 Other elements as AISI 5115
UK BS970 523A14 *5 .12–.17 .1–.35 .3–.5 <.04 <.05 .3–5 – – –
UK BS970 527A19 .17–.22 .1–.35 .7–.9 <.04 <.05 .7–9 – – –
F AFNOR 18C4 .16–.21 .1–.4 .6–.8 <.04 <.035 .85–1.15 – – –
G DIN 17210:001654. 15Cr3 Wk. 1.7015 .12–.18 .15–.4 .4–.6 <035 <035 .4–7 – – –
G 20Cr MnS33 Wk. 1.7121 .17–.23 .2–.35 .6–1.0 <.04 <.02 .6–1.0 – – –
14046 USA AISI/SAE 5130 (UNS G51300) .28–.33 .2–.35 .7–.9 <.035 <.04 .8–1.1 – – –
14047 USA AISI/SAE 5132 (UNS G51320) .30–.35 .2–.35 .6–.8 <.035 <.04 .75–1.0 – – –
UK BS970 530A30 .28–.33 .1–.35 .6–.8 <.04 <.05 .9–1.2 – – –
UK BS970 530A32 .30–.35 .1–35 .6–.8 <.04 <.05 .9–1.2 – – –
F AFNOR 28 C4 .25–3 <.4 .6–.9 <.04 <.035 .85–1.15 – – –
F AFNOR 32 C4 .3–.35 .1–.4 .6–.9 <.035 <.035 .85–1.15 – – –
G DIN 17200:001654.34Cr4Wk. 1.17033 .3–.37 .15–.4 .6–.9 <.035 <.035 9–1.2 – – –
14048 USA AISI/SAE 5135 (UNS G51350) .33–.38 .2–.35 .6–.8 <.035 <.04 .8–1.05 – – –
14049 USA AISI/SAE 5140 (UNS G51400) .38–.43 .2–.35 .7–.9 <.035 <.04 .7–.9 – – –
UK BS970 530A36 .34–.39 .1–.35 .6–.8 <.04 <.05 .9–1.2 – – –
UK BS970 530A40 .38–.43 .1–.35 .6–.8 <.04 <.05 .9–1.2 – – –
F AFNOR 38 C4 .35–.4 .1–.4 .6–.9 <.035 <.035 .85–1.15 – – –
F AFNOR 42 C4 .39–.45 .1–.4 .6–.9 <.035 <.035 .85–1.15 – – –
G DIN 17200:001654. 34Cr4 Wk. 1.7034 .30–37 15–.4 .6–.9 <.035 <.035 .9–1.2 – – –
G DIN 17200:001654. 37Cr4 Wk. 1.7035 .34–.41 .15–.4 .6–.9 <.035 <.035 .9–1.2 – – –
14050 USA AISI/SAE 5145 (UNS G51450) .43–.49 .2–.35 .7–.9 <.035 <.04 .7–.9 – – –
14051 USA AISI/SAE 5147 (UNS G51470) .46–.51 .2–.35 .7–.95 <.035 <.04 .85–1.15 – – –
F AFNOR 42C4TS .38–.44 .1–.4 .6–.9 <.025 <.03 .85–1.15 – <.3 –
F AFNOR 45 C4 .41–.48 .1–.4 .6–.9 <.035 <.035 .85–1.15 – – –
14052 USA AISI/SAE 5150 (UNS G51500) .48–.53 .2–.35 .7–.9 <.035 <.04 .7–.9 – – –
14053 USA AISI/SAE 5155 (UNS G51550) .51–.59 .2–.35 .7–.9 <.035 <.04 .7–.9 – – –
14054 USA AISI/SAE 5160 (UNS G51600) .56–.64 .2–.35 .75–1.0 <.035 <.04 .7–.9 – – –
UK BS970 526M60 .55–.65 .1–.35 .5–.8 <.04 <.05 .5–.8 – – –
F AFNOR 50 C4 .46–.54 .1–.4 .6–.9 <.04 <.035 .8–1.15 – – –
14055 USA AISI E51100. SAE 51100 (UNSG51986)
.98–1.1 .2–.35 .25–.45 <.025 <.025 .9–1.15 – – –
14056 USA AISI E52100. SAE 52100 (UNSG52986)
.98–1.1 .2–.35 .25–.45 <.025 <.025 1.3–1.6 – – –
UK BS970 534A99 .95–1.1 .1–.35 .25–.4 <.04 <.05 1.2–1.6 – – –
F AFNOR 100 C6 .95–1.1 .15–.35 .2–.4 <.03 <.025 1.35–1.6 – – –
G DIN 0017230:LW. 100Cr6 Wk. 1.3505 95–1.1 .15–.35 .25–.4 <.03 <.025 1.35–1.6 – – –
G 100Cr6 Wk. 1.2067 .95–1.05 .15–.35 .25–.4 <.035 <.033 1.4–1.7 – – –
580 Appendix 6: Metal Alloy Comparison Tables
Low alloy steels: Chromium–Vanadium
Composition
Country Designation C Si Mn P S Cr Mo Ni Other
14057 USA AISI 6118 (UNS G61180) .16–.21 .2–.35 .5–.7 <.035 <.04 .5–.7 – – V .1–.15
G 21 CrV4 Wk. 1.7510 .18–.24 1–.2 .8–1.0 <.035 <.035 .9–1.2 – – V .07–. 12
14058 USA AISI/SAE 6150 (UNS G61500) .48–.53 .2–.35 .7–.9 <.035 <.04 .8–1.1 – – V > .15
UK BS970 735A50 .46–.54 1–.35 .6–.9 <.04 <.05 .8–1.1 – – V > .15
F Y50 CV4 .5 .3 .8 – – 1.0 – – V .15
G DIN 17200; 17221; 17225 (GS)50CrV40 Wk. 1.8159
.47–. 55 .15–.4 .7–1.0 <.035 <.035 .9–1.2 – – V. 1–.2
CEN EN 10083-1 51 CrV4 1.8159 Nearequivalent to BS970 735A50
Austenitic stainless steels
Composition
Country Designation C Si Mn P S Cr Mo Ni Other
15001 USA AISI 201 (UNS S20100) <.15 <1.0 5.5–7.5 <.06 <.03 16.0–18.0 – 3.5–5.5 –
15002 USA AISI 202 (UNS S20200) <.15 <1.0 7.5–10.0 <.06 <.03 17.0–19.0 – 4.0–6.0 N < .25
UK BS970 284S16 <.07 <1.0 7.0–10.0 <06 <.03 16.5–18.5 – 4.0–6.5 N .15–.25
G X8 Cr Mn Ni 189Wk. 1.4371 <1 <1.0 7.5–9.5 <.045 <.03 17.0–19.0 – 4.5–6.5 N .1–.2
15003 USA AISI 301 (UNS S30100) <.15 <1.0 <2.0 <.045 <.03 16.0–18.0 – 6.0–8.0 –
UK BS970 301S21 <.15 .2–1.0 .5–2.0 <.045 <.03 16.0–18.0 – 6.0–8.0 –
F AFNOR Z12CN17-08 .08–15 <1.0 <2.0 <.04 <.03 16.0–18.0 – 6.5–8.5 –
G DIN 17440:0017442.X5 Cr Ni 18.9 Wk. 1.4301
<.07 <1.0 <2.0 <.045 <.03 17.0–20.0 – 8.5–10.0 –
15004 USA AISI 302 (UNS S30200) <.15 <1.0 <2.0 <.045 <.03 17.0–19.0 – 8.0–10.0 –
UK BS970 302S25 <12 .2–1.0 .5–2.0 <.045 <.03 17.0–19.0 – 8.0–11.0 –
UK BS970 302S17 <.08 .2–1.0 .5–2.0 <.045 <.03 17.0–19.0 – 9.0–11.0 –
F AFNOR Z10CN 18-09 <.12 <1.0 <2.0 <.04 <.03 17.0–19.0 – 8.0–10.0 –
F AFNOR Z12CN 18-10 <.15 .2–.4 .2–.4 <.04 <.03 17.0–19.0 – 8.0–10.0 –
G X12Cr Ni 18 8 Wk. 1.4300 <.12 <.1.0 <2.0 <.045 <.03 17.0–19.0 – 8.5–10.0 –
15005 USA AISI 302 B (UNS S30215) <.15 2.0–3.0 <2.0 <.045 <.03 17.0–19.0 – 8.0–10.0 –
15006 USA AISI 303 (UNS S30300) <.15 <1.0 <2.0 <.2 >.15 17.0–19.0 – 8.0–10.0 –
UK BS970 303S21 <.12 .2–1.0 1.0–2.0 <.045 .15–.3 17.0–19.0 – 8.0–11.0 –
F AFNOR Z10 CNF 18-09 <12 <1.0 <2.0 <.06 >.15 17.0–19.0 – 8.0–10.0 –
G DIN 17440:0017442. X12 CrNi S18 8 Wk. 1.4305
<.15 <1.0 <2.0 <.045 .15–.35 17.0–19.0 – 8.0–10.0 –
15007 USA AISI 303 SE(UNS S30323)
<.15 <1.0 <2.0 <.2 <.06 17.0–19.0 – 8.0–10.0 Se > .15
UK BS970 303S41 <.12 .2–1.0 1.0–2.0 <.045 <.03 17.0–19.0 – 8.0–11.0 Se > .15–.3
15008 USA AISI 304 (UNS S30400) <.08 <1.0 <2.0 <.045 <.03 18.0–20.0 – 8.0–10.5 –
UK BS970 304S15 <.06 .2–1.0 .5–2.0 <.045 <.03 17.5–19.0 – 8.0–11.0 –
UK BS970 304S16 <.06 .2–1.0 .5–2.0 <.045 <.03 17.5–19.0 – 9.0–11.0 –
F AFNOR Z6CN 18-09 <.07 <1.0 <2.0 <.045 <.03 17.0–19.0 – 8.0–11.0 –
G X5 Cr Ni 18 9 Wk. 1.4301 <.07 <1.0 <2.0 <.045 <.03 17.0–20.0 – 8.5–10.0 –
15009 USA AISI 304 L (UNS S30403) <.03 <1.0 <2.0 <.045 <.03 18.0–20.0 – 8.0–12.0 –
UK BS970 304S12 <.03 .2–1.0 .5–2.0 <.045 <.03 17.5–19.0 – 9.0–12.0 –
F AFNOR Z2 CN 18-10 <.03 <1.0 <2.0 <.04 <.03 17.0–19.0 – 9.0–11.0 –
F G X2 Cr Ni 18 9 Wk. 1.4306 <.03 <1.0 <2.0 <.045 <.03 17.0–20.0 – 10.0–12.5 –
15010 USA AISI 305 (UNS S30500) <.12 <1.0 <2.0 <.045 <.03 17.0–19.0 – 10.5–13.0 –
UK BS970 305S19 <.1 .2–1.0 .5–2.0 <.045 <.03 17.0–19.0 – 11.0–13.0 –
F AFNOR Z8 CN 18-12 <.1 <1.0 <2.0 <.04 <.03 17.0–19.0 – 11.0–13.0 –
G DIN 17445 G-X10 Cr Ni 18 8Wk. 1.4312
<.12 <2.0 <1.5 <.045 <03 17.0–19.5 – 18.0–10.0 –
(continued)
Appendix 6: Metal Alloy Comparison Tables 581
(continued)
Composition
Country Designation C Si Mn P S Cr Mo Ni Other
15011 USA AISI 308 (UNS S30800) .08 <1.0 <2.0 <.045 <.03 19.0–21.0 – 10.0–12.0 –
15012 USA AISI 309 (UNS S30900) <.2 <1.0 <2.0 <.0.45 <.03 22.0–24.0 – 12.0–15.0 –
UK BS970 309S24 <.15 .2–1.0 .5–2.0 <.045 <.03 22.0–25.0 – 13.0–16.0 –
F AFNOR Z12 CNS 25-13 <.2 1.0–2.0 <2.0 <.04 <.03 20.0–23.0 – 12.0–14.0 –
G G-XI5 Cr Ni 25-12 Wk. 1.4830 1–2 <1.5 <2.0 <.045 <.03 24.0–26.0 – 12.0–14.0 –
15013 USA AISI 310 (UNS S31000) <.25 <1.5 <2.0 <.045 <.03 24.0–26.0 – 19.0–22.0 –
UK BS970 310S24 <.15 .2–1.0 .5–2.0 <.045 <.03 23.0–26.0 – 19.0–22.0 –
F AFNOR Z12 CN 25-20 <.15 <1.0 2.0 <.04 <.03 23.0–26.0 – 18.0–21.0 –
G G-X15 Cr Ni 25-20 Wk.1.4840
.1–.2 <1.5 <2.0 <.045 <.03 24.0–26.0 – 19.0–21.0 –
15014 USA AISI 310S (UNS S31008) <.08 <1.5 <2.0 <.045 <.03 24.0–26.0 – 19.0–22.0 –
G X5 Cr Ni 25 21 Wk. 1.4335 <.07 <1.0 <2.0 <.045 <.03 19.0–22.0 – 19.0–22.0 –
15C15 USA AISI 314 (UNS S31400) <.25 1.5–3.0 <2.0 <.045 <.03 23.0–26.0 – 19.0–22.0 –
15016 USA AISI 316 (UNS S31600) <.08 <1.0 <2.0 <.045 <.03 16.0–18.0 2.0–3.0 10.0–14.0 –
UK BS970 315S16 <.07 .2–1.0 .5–2.0 <.045 <.03 16.5–18.5 1.25–1.75 9.0–11.0 –
UK BS970 316S16 <.07 .2–1.0 .5–2.0 <.045 <.03 16.5–18.5 2.25–3.0 10.0 13.0 –
F AFNOR Z6 CND 17-11 <.07 <1.0 <2.0 <.04 <.03 16.0–18.0 2.0–2.5 10.0–12.0 –
G DIN 17440; 17445; 17224. X5Cr Ni Mo 18–10 Wk. 1.4401
<.07 <1.0 <2.0 <.045 <.03 16.5–18.5 2.0–2.5 10.5–13.5 –
15017 USA AISI 316 L (UNS S31603) <.03 <1.0 <2.0 <.045 <.03 16.0–18.0 2.0–3.0 10.0–14.0 –
UK BS970 316S12 <.03 .2–1.0 .5–2.0 <.045 <.03 16.5–18.5 2.25–3.0 11.0–14.0 –
F AFNOR Z2 CND 17-12 <.03 <1.0 <2.0 <.04 <.03 16.0–18.0 2.0–2.5 11.0–13.0 –
G DIN 17440; 17442:001654 X2Cr Ni Mo 18-10 Wk. 1.44041
<.03 <1.0 <2.0 <.045 <.03 16.5–18.5 2.0–2.5 11.0–14.0 –
15018 USA AISI 317 (UNS S31700) <.08 <1.0 <2.0 <.045 <.03 18.0–20.0 3.0–4.0 11.0–15.0 –
UK BS970 317S16 <.06 .2–1.0 .5–2.0 <.045 <.03 17.5–19.5 3.0–4.0 12.0–15.0 –
F AFNOR Z2 CND 19-15 <.03 <1.0 <2.0 <.04 <.03 18.0–20.0 13.0–4.0 14.0–16.0 –
G DIN 17440 X2 Cr Ni Mo 18-16Wk. 1.4438
<.025 <1.0 <.02 <.025 <.02 17.0–19.0 3.0–4.0 15.0–17.0 –
15019 USA AISI 321 (UNS S32100) <.08 <1.0 <2.0 <.045 <.03 17.0–19.0 – 9.0–12.0 Ti > 5 × C
UK BS970 321S12 <.08 .2–1.0 .5–2.0 <.045 .03 17.0–19.0 – 9.0–12.0 Ti 5 × C − .7
UK BS970 321S20 <.12 .2–1.0 .5–2.0 <.045 <.03 17.0–19.0 – 8.0–11.0 Ti 5 × C − .9
F AFNOR Z6 CN 18-10 .05–.1 <1.0 <2.0 <.03 <.03 16.0–20.0 – 8.0–10.0 Ti
F AFNOR Z6 CNT 18-11 <.08 <1.0 <2.0 <.04 <.03 17.0–19.0 – 10.0–12.0 Ti 5 × C − .6
G DIN 17440:43720 X10 Cr NiTi 18-9 Wk. 1.4541
<.1 <1.0 <2.0 <.045 <.03 17.0–19.0 – 9.0–11.5 Ti > 5 × C
15020 USA AISI 347 (UNS S34700) <.08 <1.0 <2.0 <.045 <.03 17.0–19.0 – 9.0–12.0 Nb + Ta > 10 × C
UK BS970 347S17 <.08 .2–1.0 .5–2.0 <.045 <.03 17.0–19.0 – 9.0–12.0 Nb 10 × C − 1.0
F AFNOR Z6 CN Nb 18-11 <.08 <1.0 <2.0 <2.0 <.03 17.0–19.0 – 10.0–12.0 Nb + Ta10 × C − 1.0
G DIN 17440 X10 Cr Ni Nb 18-9Wk. 1.4550
<.1 <1.0 <2.0 <.045 <.03 17.0–19.0 – 9.0–11.5 Nb > 8 × C
15021 USA AISI 348 (UNS S34800) <.08 <1.0 <2.0 <.045 <.03 17.0–19.0 – 9.0 .13.0
Nb + Ta > 10 × CTa < .1Co < .2
15022 USA AISI 384 (UNS S38400) <.08 <1.0 <2.0 <.045 <.03 15.0–17.0 – 17.0–19.0 –
582 Appendix 6: Metal Alloy Comparison Tables
Ferritic and martensitic stainless steels
Composition
Country Designation C Si Mn P S Cr Mo Ni Other
15023 USA AISI 403 (UNS S40300) <.15 <.5 <1.0 <.04 <.03 11.5–13.0 – – –
UK BS970 403S17 <.08 <.8 <1.0 <.04 <.03 12.0–14.0 – <.5 –
UK BS970 410S21 .09–.15
<.8 <1.0 <.04 <.03 11.5–13.5 – <1.0 –
F AFNOR Z10 C13 <.12 <1.0 <1.0 <.04 <.03 12.0–14.0 – – –
G X7 Crl4; G-X7 Cr 13 Wk.1.4001
<.08 <1.0 <1.0 <.045 <03 13.0–15.0 – – –
G DIN 17440; 001654 (G-)X10 Cr 13 Wk. 1.4006
.08–.12
<1.0 <1.0 <.045 <.03 12.0–14.0 – – –
15024 USA AISI 405 (UNS S40500) <.08 <1.0 <1.0 <.04 <.03 11.5–14.5 – – AI .1–.3
UK BS970 405S17 <.08 <.8 <1.0 <.04 <.03 12.0–14.0 – <.5 AI .1–.3
F AFNOR Z6 CA 13 <.08 <1.0 <1.0 <.04 <.03 11.5–13.5 – <.5 AI .1–.3
G DIN 17440 X7 Cr AI 13. Wk.1.4002
<.08 <1.0 <1.0 <.045 <.03 12.0–14.0 – – AI .1–.3
15025 USA AISI 410 (UNS S41000) <.15 <1.0 <1.0 <.04 <.03 11.5–13.5 – – –
UK BS970 410S21 .09–.15
<.8 <1.0 <.04 <.03 11.5–13.5 – <1.0 –
F AFNOR Z10C-13 <.12 <1.0 <1.0 <.04 <.03 12.0–14.0 – – –
F AFNOR Z12C-13 .08–.15 <1.0 .04 <.04 <.03 11.5–13.5 – <.5 –
G DIN 17440:0017442 X15Cr 13 Wk. 1.4024
.12–.17 <1.0 <1.0 <.045 <.03 12.0–14.0 – – –
15026 USA AISI 414 (UNS S41400) <.15 <1.0 <1.0 <.04 <.03 11.5–13.5 – 1.25–2.50
–
15027 USA AISI 416 (UNS S41600) <.15 <1.0 <1.25 <.06 >.15 12.0–14.0 <.6 – –
UK BS970 416S21 .09–.15 <1.0 <1.5 <.06 .15–.3 11.5–13.5 <.6 <1.0 –
F AFNOR Z12 CF 13 <.15 <1.0 <1.5 <.06 >.15 12.0–14.0 <.6 <.5 –
G X 12 Cr S 13 Wk. 1.4005 <.15 <1.0 <1.0 <.045 .15–.25 12.0–13.0 – – –
15028 USA AISI 416 SE (UNS S41623) <.15 <1.0 <1.25 <.06 <.06 12.0–14.0 – – Se > .15
UK BS970 416S41 .09–.15
<1.0 <1.5 <.06 <.06 11.5–13.5 <.6 <1.0 Se.15–.35
15029 USA AISI 420 (UNS S42000) >.15 <1.0 <1.0 <.04 <.03 12.0–14.0 – – –
UK BS970 420S29 .14–.2 <.8 <1.0 <.04 <.03 11.5–13.5 >.6 >1.0 –
UK BS970 420S37 .2–.28 <.8 <1.0 <.04 <.03 12.0–14.0 – <1.0 –
F AFNOR Z20 C13 .15–.24 <1.0 <1.0 <.04 <.03 12.0–14.0 – <1.0 –
G DIN 17440; 17224:0017442X20 Cr 13 Wk. 1.402
.17–.22 <1.0 <1.0 <.045 <.03 12.0–14.0 – – –
15030 USA AISI 420 F (UNS S42020) >.15 <1.0 <1.25 <.06 >.15 12.0–14.0 <.6 – –
15031 USA AISI 429 (UNS S42900) <.12 <1.0 <1.0 <.04 <.03 14.0–16.0 – – –
15032 USA AISI 430 (UNS S43000) <.12 <1.0 <1.0 <.04 <.03 16.0–18.0 – – –
UK BS970 430S15 <1 <.8 <1.0 <.04 <.03 16.0–18.0 – <.5 –
F AFNOR Z15 CN 16-02 <.18 .2–.4 2–.4 <.04 <.03 15.0–17.0 – 1.0–2.0 –
G DIN 17440; 001654 X8 Cr17 Wk. 1.4016
<.1 <1.0 <1.0 <.045 <.03 15.5–17.5 – – –
15033 USA AISI 430 F (UNS S43020) <.12 <1.0 <1.25 <.06 >.15 16.0–18.0 <.6 – –
15034 USA AISI 430 F SE (UNSS43023)
<.12 <1.0 <1.25 <.06 <.06 16.0–18.0 – – Se > .15
15035 USA AISI 431 (UNS S43100) <.2 <1.0 <1.0 <.04 <.03 15.0–17.0 – 1.25–2.5
–
UK BS970 431S29 .12–.2 <.8 <1.0 <.04 <.03 15.0–18.0 – 2.0–3.0 –
F AFNOR Z15 CN17-03 <.18 .2–.4 .2–.4 <.04 <.03 15.0–17.0 – 1.0–2.0 –
G DIN 17440;001654 X22 CrNi 17 Wk. 1.4057
.15–.23 <1.0 <1.0 <.045 <.03 16.0–18.0 – 1.5–2.5 –
(continued)
Appendix 6: Metal Alloy Comparison Tables 583
(continued)
Composition
Country Designation C Si Mn P S Cr Mo Ni Other
15036 USA AISI 434 (UNS S43400) <.12 <1.0 <1.0 <.04 <.03 16.0–18.0 .75–1.25
– –
UK BS970 434S19 <.1 <.8 <1.0 <.04 <.03 16.0–18.0 .9–1.3 <.5 –
F AFNOR Z8CD 17-01 <.1 <1.0 <1.0 <.04 <.03 16.0–18.0 .9–1.3 <.5 –
G DIN 17440 X6 Cr Mo 17Wk. 1.4113
<.07 <1.0 <1.0 <.045 <.03 16.0–18.0 .9–1.2 – –
15037 USA AISI 436 (UNS S43600) <.12 <1.0 <1.0 <.04 <.03 16.0–18.0 .75–1.25
– Nb+Ta5×C–.7
15038 USA AISI 440 A (UNS S44002) .6–.75 <1.0 <1.0 <.04 <.03 16.0–18.0 <.75 – –
F AFNOR Z50 CD 14 .5–.6 <1.0 <1.0 <.04 <.03 13.0–15.0 .5–.6 – –
G X65 Cr Mo 14 Wk. 1.4109 .6–.75 <1.0 <1.0 <.045 <.03 13.0–15.0 .5–.6 – –
G X55 Cr Mo 14 Wk. 1.4110 .5–.6 <1.0 <1.0 <.045 <.03 13.0–15.0 .5–.6 – –
15039 USA AISI 440 B (UNS S44003) .75–.95
<1.0 <1.0 <.04 <.03 16.0–18.0 <.75 – –
15040 USA AISI 440 C (UNS S44004) .95–1.2 <1.0 <1.0 <.04 <.03 16.0–18.0 <.75 – –
F AFNOR Z100CD17
G DIN 0017230 X105 Cr Mo17
.95–1.2 <1.0 <1.0 <.045 <.03 16.0–18.0 .4–.8 – –
15041 USA AISI 442 (UNS S44200) <.2 <1.0 <1.0 <.04 <.03 18.0–23.0 – – –
UK BS970 442S19 <.1 <.8 <1.0 <.04 <.03 18.0–22.0 – <.5
15042 USA AISI 446 (UNS S44600) <.2 <1.0 <1.5 <.04 <.03 23.0–27.0 – N < .25 –
F AFNOR Z10 C24 <.12 <1.5 <1.0 <.04 <.03 23.0–26.0 – – –
G X20 Cr 25 Wk. 1.3810 <.25 .5–2.0 <.5 – – 24.0–26.0 – – –
G X8 Cr 28 Wk. 1.4083 <.1 <1.0 <1.0 <.045 <.03 27.0–29.0 – – –
15043 USA AISI 501 (UNS S50100) >.1 <1.0 <1.0 <.04 <.03 4.0–6.0 .4–.65 – –
UK BS1504 Grade 1504-625 <.15 <.5 .3–.7 <.045 <.045 4.0–6.0 .45–.65 <.4 Cu < 4
G GS-12 Cr Mo 19 5 Wk. 1.7363
.08–.15 .3–.5 .4–7 <.035 <.035 4.5–5.5 .45–.55 – –
15044 USA AISI 502 (UNS S50200) <.1 <1.0 <1.0 <.04 <.03 4.0–6.0 .4–.65 – –
UK BS1504 Grade 1504–625 <.15 <.5 .3–.7 <.045 <.045 4.0–6.0 .45–.65 <.4 Cu < .4
G GS-12 Cr Mo 19 5 Wk.1.7363
.08–.15 .3–.5 .4–.7 <.035 <.035 4.5–5.5 .45–.55 – –
Specially named steels
Composition
Country Designation C Si Mn P S Cr Mo Ni Other
16001 USA Music Wire ASTMA228(UNS K08500)
.7–1.0 .1–.3 .2–.6 <.025 <.03 – – – –
See AISI 1078; 1086; 1095—(UNS G10780; UNS G 10860; UNS G 10950 Table Nos: 11040; 11044: 11046)
16002 USA HY80—ASTM A543(UNS J42015 (HY80))*8
<.18 .18–.37 <.4 <.02 <.02 1.0–1.5 .45–.60 2.25–3.25 V < .03
USA HY130- <.12 – .6–.9 – – .4–.7 .3–.65 4.75–5.25 V .05–.10
USA HY140—Designation nolonger in use
These steels are made inEurope to the USAanalyses
(continued)
584 Appendix 6: Metal Alloy Comparison Tables
(continued)
Composition
Country Designation C Si Mn P S Cr Mo Ni Other
16003 USA Carpenter 20 Cb Stainless (UNS N08020 (20Cb-3)) Now replaced by20Cb-3 below
USA Carpenter 20 Cb-3 <06 <1.0 <2.0 <.035 <.035 19.0–21.0 2.0–3.0 32.5–35.0 Cu 3.0–4.0 Nb+ Ta 8×C < 1.0
16004 USA Allegheny Ludlum—A286 (UNS K66286)
.08 .4 1.4 – – 15 1.25 26 Ti 2.15 Al .2.004
USA Bofors—A286 .06 – – – – 15 1.3 25 Ti 2.15 AI.2.004
F AFNOR Z6NCT25-15
G DIN0017225 X5 Ni Cr Ti26 15 Wk. 1.4980
<.08 <1.0 1.0–2.0
<.03 <.03 13.5–16.0 1.0–1.5 24.0–27.0 Al < .35 Ti 1.9–2.3 B.003–.010V.1–.5
G LN 1.4944.4
EUR AECMA FE PA92HT
16005 USA Allegheny LudlumAM350 (UNS S35000)
.08 .4 1.0 – – 16.5 2.7 4.3 N .1
16006 USA Allegheny LudlumAM355 (UNS S35500)
.15 .4 1.0 – – 15.5 2.75 4.25 N .1
16007 USA Carpenter. Custom 455(UNS S45500)
.03 – .25 – – 11.75 – 9.0 Ti 1.2 Cu 2.2Nb+ Ta 0.3
16008 USA 15-5 PH (UNS S15500) .04 – .8 – – 15.0 – 4.6 Cu 3.3 Nb .27
16009 USA PH 14–8 Mo(UNS S14800)
.04 – .6 – – 15.1 2.2 8.3 AI 1.2 + N
16010 USA PH 15–7 Mo(UNS S15700)
.07 – – – – 15 2.2 7 AI 1.1
16011 USA PH 17–7 (UNS S17700) .07 – – – – 17 – 7 AI 1.1
16012 USA SAE H11 Tool Steel(UNS T20811)
.3–.4 .8–1.2 .2–.4 – – 4.75–5.50 1.25–1.75 – V .3–.5
USA H11 MOD (UNS K74015)—Replaced by UNS T20811
USA Vascojet 1000
UK BS4659 BH11 .32–.42 .85–1.15
<.4 – – 4.75–5.25 1.25–1.75 – V .3–.5
F E-40CDV20
G (G-) X38 Cr Mo V 5 1Wk. 1.2343
.36–.42 .9–1.2 .3–.5 <.03 <.03 4.8–5.8 1.4 – –
G Wk. 1.7784
EUR AECMA FE-PM13S .37–.43 – .3 – – 4.75–5.25 1.3 – V .5
16013 USA 17/4 PH—ASTM A 579-AIS1630 (UNS J92200)Grade 61
<.07 <1.0 <1.0 <.025 <.025 15.5–17.5 – 3.0–5.0 Cu 3.0–5.0 Nb.15–45
16014 USA PH 13-8 Mo (UNS S13800)
.03 – <.1 – – 12.8 2.2 8.2 AI 1.1
16015 USA Maraging ASTM 579Grade 71 Yield 200 ksi(UNS K92820)
<.03 <.1 <.1 <.01 <.01 – 3.0–3.5 17.0–19.0 Ti .15–.25 Co8.0–9.0 AI .05–15Ca .06 Zr .02 B.003
16016 USA Maraging ASTM 579Grade 72 Yield 250 ksi(UNS K92940)
<.03 <.1 <.1 <.01 <.01 – 4.6–5.2 17.0–19.0 Ti .3–.5 Co7.5–8.3 AI.05–.15Ca .06 Zr .02 B.003
16017 USA Maraging ASTM 579Grade 73 Yield 275 ksi(UNS K93160)
<.03 <.1 <.1 <.01 <.01 – 4.6–5.2 18.0–19.0 Ti .5–.8 Co8.5–9.5 AI.05–.15Ca .06 Zr .02 B.003
(continued)
Appendix 6: Metal Alloy Comparison Tables 585
European CEN Designations for Steels
European EN specifications for metal alloys are currentlybeing generated and adopted. These will progressivelysupersede the various national standards for steels, as with
other materials. However, it will be some years before thisprocess is completed and fully implemented.
The European designation system for steels is set out inthe specification EN10027 and in the ECISS informationcircular DD214:1993 ECISS/IC10:1992. The EN designa-tions for steels will consist of three parts:
(continued)
Composition
Country Designation C Si Mn P S Cr Mo Ni Other
16018 USA ARMCO 21-6-9(UNS S21900)
<.08 <1.0 8.0–10.0
<.06 <.03 19.0–21.5 – 5.5–7.5 N .15–.4
UK BS970 284S16 <.07 <1.0 7.0–10.0
<.06 <.03 16.5–18.5 – 4.0–6.5 N .15–25
G X8 Cr Mn Ni 18 9Wk.1.4371
<.1 <1.0 7.5–9.5
<.045 <.03 17.0–19.0 – 4.5–6.5 N .1–.2
16019 USA ALMAR 362 (UNSS36200)
.03 .2 .3 <.015 <.015 14.5 – 6.5 Ti .8 Nominalcomp.
16020 USA Nitronic 33 <.08 <1.0 11.5–14.5
<.06 <.03 17.0–19.0 – 2.25–3.75 N .2–.4
USA Nitronic 32 <.1 .5 12 <.06 <.03 18 – 1.6 N .34
USA Nitronic 60 (UNSS21800)
<.1 3.5–4.5 7.0–9.0
<.06 <.03 16–18 – 8.0–9.0 N .08–.18
16021 USA Kovar (low expansionalloy)
<.04 <.2 <.5 <.2 <.2 29 Co 17.0 FeBalance.Nominal comp.
UK Nilo K 29 Co 17.0 FeBalance.Nominal comp.
F Dilver P0 29 Co 21.8 FeBalance.Nominal comp.
F Dilver P1 29 Co 18.0 FeBalance.Nominal comp.
G Dilaton 29/18 <.05 <.2 <1.0 – – – – 28–30 Co 17.0–19.0Fe Bal.Nominal comp.
Wk. 1.3981
16022 USA Invar .1 .2 .5 36 Nominal comp.
USA Invar 36 36 Nominal comp.
UK Nilo 36 36 Nominal comp.
16023 USA Invar 42 42 Nominal comp.
UK Nilo 42 42 Nominal comp.
Notes for steel tables<: less than, x–y range>: greater than, x approx*1: Silicon content depends on whether the steel is rimming, balanced or killed. For killed steel Si < 0.4. For AISI up to but excluding 1015 Si < 0.1. Ranges depend on sheetmaking practice*2: Traces*3: For electric steel N < 0.012*4: Spring Steel*5: Only very approximate equivalent*6: Can be alloyed with lead*7: Can have boron content of 0.0005 % minimum. Number then carries a B*8: Pressure vessel plate steels. Special conditions may be required. Vacuum treatment, special testing, impact testing, nondestructive testing
586 Appendix 6: Metal Alloy Comparison Tables
• European Standard number, e.g. “EN 10083-1”.• ‘Steel Name’ (grade)—Symbolic letters and numbers
expressing the application and principal characteristics,e.g. “2C50 (C50E)”.
• ‘Steel Number’—a 5 digit designation based on theexisting German Werkstoff (Wk.) number, with a furthertwo digits held in reserve, e.g. “1.1206”.
The examples given above make up the complete ENdesignation: EN 10083-1 2C50 (C50E) 1.1206; Seetable 11029. Within the alloy tables, the ‘Steel Name’ parthas been underlined (e.g. EN 10083-1 2C50 (C50E) 1.1206)to indicate the separate the parts of the designation.
In principal, EN steel numbers can be inferred for steelsby using the existing Werkstoff numbers, however there isno guarantee that such numbers have currently been eitheragreed or adopted by any particular country. New specifi-cations, once adopted, will be issued by each nationalstandards organisation, and any existing, competing speci-fications will be withdrawn.
The implementation of the new standards recognisesthree levels of equivalence between EN designations andexisting national grades of steel: ‘Close Equivalent’, ‘NearEquivalent’ and ‘Approximate Equivalent’. The new ENdesignations included in the above tables are all nearequivalents of BS970-1 steel grades.
Appendix 6: Metal Alloy Comparison Tables 587
Allo
yequiva
lent—Nickelba
sedalloys
Com
positio
n(N
i—balanceun
less
otherw
isestated)
Country
Designatio
nC
Co
Cr
Mo
VW
Al
Cu
Nb
Ta
Ti
FeOther
21001
USA
/UK
Hastello
yC
(UNSN10002
<.08
<2.5
14.5–16
.515
–17
<.35
3.0–4.5
––
––
–4.0–7.0
Si<1.0Mn<1.0
GWk2.4537
<.02
2.5
15.5
160.35
3.7
6Nibalance.
Nom
inal
comp.
GWk2.4602
1617
46
Nibalance.
Nom
inal
comp.
21002
USA
/UK
Hastello
yX(U
NSN06002)
.05–.15
.5–2.5
20.5–23
.08.0–10
.0–
.2–1.0
––
––
–17–20
Si<1.0Mn<1.0
GWk.
2.4613
21003
USA
/UK
Incoloy80
0(U
NSN08
800)
<.1
–19
.0–23
.0–
––
.15–.6
––
–.15–.6
Bal.
Ni30
.0–35
.0
GX10
NiCrA
ITi32
20.07
21*
*Ni3
1.0no
minal
comp.
UK
Wk.
1.4876
BS30
72NA
15<.1
–19
.0–23
.0–
––
.15–.6
<.75
––
.15–.6
Bal.
Ni+Co30
.0–35
.0
21004
USA
/UK
Incoloy90
1(U
NSN09
901)
<.1
–11
.0–14
.05–
7–
–<.35
<.5
––
2.35–3.1
Bal.
Ni4
0.0–40
.5Mn<1.0
Si<
.6B.01–.02
21005
USA
/UK
Incoloy90
3(U
NSN19
903)
–13
.0–17
.0–
––
–.3–1.5
–2.4–3.5
–1.0–1.25
Bal.
Ni36
.0–40
.0
21006
USA
/UK
Incoloy90
7(U
NSN19
907)
13.0
4.7
1.5
Bal.
Ni3
8.0no
minal
comp.
21007
USA
/UK
Incoloy90
9(U
NSN19
909)
.113
.04.7
1.5
Bal.
Ni3
8.0no
minal
comp.
21008
USA
/UK
Inconel6
00(U
NSN06
600)
<.15
–14
.0–17
.0–
––
–<.5
––
–6.0–10
.0Ni>72
.0
UK
BS3
072NA14
<.15
–14
.0–17
.0–
––
–<.5
––
–6.0–10
.0Ni+Co>72
.0Mn<1.0Si
<.5
GWk.
2.4816
.05
1610
Nom
inal
comp.
21009
USA
/UK
Inconel6
25(U
NSN06
625)
<.1
–20
.0–23
.08.0–10
.0–
–<.4
–3.15–4.15
<.4
<5.0
Nibalance
21010
USA
/UK
Inconel7
18(U
NSN07
718)
<.08
<1.0
17.0–21
.02.8–3.0
––
.2–.8
–4.75–5.5
.65–1.15
Bal.
Si<.35Mn<.35Ni
50.0–55
.0
F/AECMA
NI-P1
00HT
GWk.
2.4666
CEN
EN
2403PR
(NI-P1
00HTSo
lutio
ntreatedandprecipitatio
ntreatedprecisioncastings—
provisionalspec.)
EN
2404PR
(NI-P1
00HTSo
lutio
ntreatedandprecipitatio
ntreatedbars—
provisionalspec.)
EN
2405PR
(NI-P1
00HTSo
lutio
ntreatedandprecipitatio
ntreatedforgings—provisionalspec.)
EN
2407PR
(NI-P1
00HTSo
lutio
ntreatedandprecipitatio
ntreatedsheetandstrip,
a≤3mm—prov
isionalspec.)
EN
2408PR
(NI-P1
00HTSo
lutio
ntreatedandprecipitatio
ntreatedplates,a≤3mm—
provisionalspec.)
EN
2952PR
(NI-P1
00HTSo
lutio
ntreatedandcold
workedbarforho
tup
setforgingforfasteners,3mm
≤d≤30
mm—prov
isionalspec.)
EN
2961
PR(N
I-P1
00HTColdworkedandsolutio
ntreatedbarformachining
forfasteners,3mm
≤d≤50
mm—provisionalspec.)
EN
3666PR
(NI-P1
00Coldworked—
RM
≥15
00MPa—
barformachining
,3mm
≤d≤50
mm—provisionalspec.)
(con
tinued)
588 Appendix 6: Metal Alloy Comparison Tables
(con
tinued)
Com
positio
n(N
i—balanceun
less
otherw
isestated)
Country
Designatio
nC
Co
Cr
Mo
VW
Al
Cu
Nb
Ta
Ti
FeOther
21011
USA
/UK
InconelX75
0(U
NS
N07
750)
<.08
–14
.0–17
.0–
––
.4–1.0
–.7–1.2
2.25–2.75
5.0–9.0
Si<.5
Mn<1.0Ni
Balance
21012
USA
/UK
Mon
elK50
0(U
NS
N05
500)
<.25
––
––
–2.9
Bal.
––
.35–.85
<2.0
Si<.5
Mn<1.5Ni
63.0–70
.0
GWk.
2.4360
31.0
2.0
Nibalance.
Nom
inal
comp.
GWk.
2.4374
3.0
30.0
.81.5
Nibalance.
Nom
inal
comp.
GWk.
2.4375
.25
3.0
30.0
1.0
2.0
Nibalance.
Nom
inal
comp.
21013
USA
/UK
NI-SP
AN
C90
2(U
NS
N09
902)
<.06
–4.9–5.75
––
–.3–.8
––
–2.2–2.75
Bal.
Ni41
.0–43
.5Mn<.8
Si<1.0
21014
USA
/UK
RENE41
(UNSN07
041)
<.12
10.0–12
.018
.0–20
.09.0–10
.5–
–1.4–1.8
––
–3.0–3.3
<5.0
Si<.5
Mn<.1
B.003–.010
21015
USA
/UK
UNIT
EMP21
2.08
–16
.0–
––
.15
–.5
–4.0
Bal.
Si.15Mn.05B.06Zr
.05Ni25
.0
21016
USA
/UK
WASP
ALLOY
(UNS
N07
001)
.03–.1
12.0–15
.018
.0–20
.03.5–5.0
––
1.2–1.6
––
–2.75–3.25
<2.0
B.003–.010
Zr.02
–.12
F/AECMA
NI-P1
01HT
CEN
EN
2193PR
(NI-P1
01HTSo
lutio
ntreatedandprecipitatio
ntreatedbars—prov
isionalspec.)
EN
2194PR
(NI-P1
01HTSo
lutio
ntreatedandprecipitatio
ntreatedforgings—
provisionalspec.)
EN
2195PR
(NI-P1
01HTSo
lutio
ntreatedandprecipitatio
ntreatedsheetandstrip,
a≤3mm—prov
isionalspec.)
EN
2406PR
(NI-P1
01HTSo
lutio
ntreatedandprecipitatio
ntreatedbars
forforged
bolts,d≤25
mm—provisionalspec.)
EN
2959PR
(NI-P1
01HTSo
lutio
ntreatedandcold
workedbarforho
tup
setforgingforfasteners,3mm
≤d≤30
mm—prov
isionalspec.)
EN
2960PR
(NI-P1
01HTColdworkedandsolutio
ntreatedbarformachining
forfasteners,3mm
≤d≤50
mm—provisionalspec.)
Notes
forNickelalloys
Trade
Nam
es—Usually
nominal
compo
sitio
nson
lyavailable.
Somealloys
arebalanceiron,somebalancenickel
Appendix 6: Metal Alloy Comparison Tables 589
Allo
yequiva
lents—
Aluminium
alloys
(wroug
ht) Com
positio
n(m
ax.unless
otherw
isestated)
Others
Country
Designatio
nSi
FeCu
Mn
Mg
Cr
Zn
Ti
Each
Total
Almin.
Notes
31001
USA
AA
1050
(UNSA91050)
.25
.4.05
.05
.05
–.05
.03
.03
–99.5
(1050A
:Zn<.07)
UK
AA
1050A
(was
BS1B
).3
.4.05
.03
––
.1–
––
99.5
*35
UK
BS5L
36(A
A1050A)
.3.4
.05
.05
––
.10
–0.03
–99.5
FNFA-5
(AA
1050A)
.3.4
.05
.05
.03
.03
.1.05
––
Rem
.
GDIN
1712
AI99.5(A
A1050A)Wk.
3.0255
99.5
CEN
EN
2072
(1050A
-H14
sheetand
strip);
EN
2073PR
(1050A
-H14
tube
forstructures,5mm
<d<100mm—
provisionalspec.)
EN
2114PR
(1050A
-H14
wireforsolid
rivets,d≤10
mm—provisionalspec.)
31002
USA
AA
1060
(UNSA91060)
.25
.35
.05
.03
.03
–.05
.03
.03
–99.6
31003
USA
AA
1100
(UNSA91100)
1.0(Si+Fe)
.05–.2
.05
––
.1–
.05
.15
99.0
*31
UK
AA
1100
1.0(Si+Fe)
.05–.2
.05
––
.1–
.05
.15
99.0
*31
CEN
EN
3996PR
(1100-H14
sheetandstrip,
0.3mm
≤a≤6mm—
provisionalspec.)
31004
USA
AA
1145
(UNSA91145)
.55(Si+Fe)
.05
.05
––
––
.03
–99.45
UK
AA
1145
.55(Si+Fe)
.05
.05
––
––
.03
–99.45
31005
USA
AA
1175
(UNSA91175)
.15(Si+Fe)
.1–
––
.03
–.02
–99.75
*32
UK
AA
1080A
(was
BS1A
).15
.15
.02
.03
––
.06
––
–99.8
*33
FNFA8(A
A1080A)
.15
.15
.03
.03
.01
.02
.06
.05
–.2
Rem
.
GDIN
1712
AI99.7Wk.
3.0275
.20
.25
.03
––
–.07
.05
.02
.3Rem
.
GDIN
1712
AI99.8(A
A1080A)Wk.
3.0285
.15
.15
.02
––
–.06
.03
.01
.2Rem
.
31006
USA
AA
1200
(UNSA91200)
1.0(Si+Fe)
.05
.05
––
.1.05
.05
.15
99.0
UK
AA
1200
(was
BS1C
)1.0(Si+Fe)
.05
.05
––
.1.05
.05
.15
99.0
UK
BS6L
16;BS6L
17;BS4L
34.5
.7.1
.1–
–.1
–.05
–99.0
FNFA-4
.5.8
.1.1
.05
.05
.1.05
––
Rem
.
GDIN
1712
AI99Wk.
3.0205
.5.6
.07
––
–.08
.05
.04
1.0
Rem
.
31007
USA
AA
1230
(UNSA91230)
.7(Si+Fe)
.1.03
––
.1–
.05
–99.3
UK
AA
1230
.7(Si+Fe)
.1.03
––
.1–
.05
–99.3
31008
USA
AA
1235
(UNSA91235)
.65(Si+Fe)
.05
––
––
–.05
–99.35
UK
AA
1235
.65(Si+Fe)
.05
––
––
–.05
–99.35
31009
USA
AA
1345
(UNSA91345)
.3.4
.1–
––
––
.03
–99.45
UK,F,
G:SeeTable
31001(A
A1050)
31010
USA
AA
1350
(UNSA91350)
.1.4
.05
.01
–.01
.05
+V.02
.03
.199.5
Ga<.03B<.05
UK
AA
1350
(was
BS1E);BS2
897
.1.4
.05
.01
–.01
.05
+V.02
.03
.199.5
Ga<.03B<.05
FA
5L,A
5B99.5
GDIN
1712
AI99.5Wk.
3.0255
.3.4
.05
––
–.07
.05
.03
.5Rem
.
GDIN
1712
AI99.5Wk.
3.0257
31011
USA
1420
.05
4.5–6.0
Li1.9–
2.3Zr.08–.15
Nom
inal
comp.
31012
USA
1430
1.4–1.8
2.3–3.0
Li1.5–
1.9Zr.08–.14
Nom
inal
comp.
31013
USA
1440
1.2–1.9
.6–1.1
Li2.1–
2.6Zr.1–.2
Nom
inal
comp.
31014
USA
1460
2.6–3.3
.05
Li2.0–
2.5Zr<.15Sc
<.14
Nom
inal
comp.
31015
USA
AA
2011
(UNSA92011)
.4.7
5.0–6.0
––
–.3
–.05
.15
Rem
.*37
UK
AA2011
(was
BSFC
1);BS4
300/5;
EN
515;
EN
573-3;
EN
573-4
.4.7
5.0–6.0
––
–.3
–.05
.15
Rem
.*37
FA-U
5PbB
i5.5
Rem
.Nom
inal
comp.
GDIN
1725
AlCuBiPb
.Wk.
3.1655
.4.7
5.0–6.0
––
–.3
–.05
.15
Rem
.*37
31016
USA
AA
2014
(UNSA92014)
.5–1.2
.73.9–5.0
.4–1.2
.2–.8
.1.25
.15
.05
.15
Rem
.*310*31
(con
tinued)
590 Appendix 6: Metal Alloy Comparison Tables
(con
tinued)
Com
positio
n(m
ax.unless
otherw
isestated)
Others
Country
Designatio
nSi
FeCu
Mn
Mg
Cr
Zn
Ti
Each
Total
Almin.
Notes
UK
AA
2104A
(was
BSH15);BS
L102;
BSL103;
.5–.9
.53.9–5.0
.4–1.2
.2–.8
.1.2
+Zr.2
––
Rem
.Ni.2,Pb
.05,
Sn.05
BSL105;
BSL156-L159;
BSL163-L168;
BS2L
77;
BS2L
87;BS2L
93;BS3L
63;BS
7L37;DTD
5010A;
DTD
5030A;DTD5040A
FNFA
-U4S
G.5–1.2
.73.9–4.9
.4–1.2
.2–.8
.1.25
.2–
–Rem
.
GDIN
1725
AlCuSi
Mn.
Wk.
3.1255
.5–1.2
.73.9–5.0
.4–1.2
.2–.8
.1.25
.15
.05
.15
Rem
.
CEN
EN
2087PR
(2014A
-T6/T62
clad
sheetandstrip—
provisionalspec.)
EN
2088PR
(2014A
-T4/T42
clad
sheetandstrip—
provisionalspec.)
EN
2089
(2014A
-T6sheetandstrip)
EN
2100
(2014A
-T4511
baranddraw
nprofi
les)
EN
2323PR
(2014A
-T651bar≤200mm—
provisionalspec)
EN
2324PR
(2014A
-T6barandsection≤150mm—provisionalspec.)
EN
2325PR
(2014A
-T6bar≤100mm—provisionalspec.)
EN
2384
(2014A
-T6511
baranddraw
nprofi
les)
EN
2387PR
(2014A
-T6tube
forstructures,0.6mm
≤a≤12.5
mm—
provisionalspec.)
EN
2395
(2014A
-T4/T42
sheetandstrip)
EN
2634PR
(2014A
-T4511
bars
andsections
1.2mm
≤a/d≤200mm,peripheral
coarse
graincontrol—
provisionalspec.)
EN
2635PR
(2014A
-T6511
bars
andsections
1.2mm
≤a/d≤150mm,peripheral
coarse
graincontrol—
provisionalspec.)
EN
2639PR
(2014A
-T6extruded
bars
andsections
1.2mm
≤a/d≤150mm,peripheral
coarse
graincontrol—
provisionalspec.)
EN
2710PR
(2014A
-T4510
barandsection,
1.2mm
≤a/d≤200mm,peripheral
coarse
graincontrol —
provisionalspec.)
EN
2711
PR(2014A
-T6510
barandsection,
1.2mm
≤a/d≤150mm,peripheral
coarse
graincontrol—
provisionalspec.)
EN
3346PR
(2014A
-T3tube
forstructures,0.6mm
≤a≤12.5
mm—
provisionalspec.)
31017
USA
AA
2017
(UNSA92017)
.2–.8
.73.5–4.3
.4–1.0
.4–.8
.1.25
.15
.05
.15
Rem
.*310
UK
AA
2017
.2–.8
.73.5–4.3
.4–1.0
.4–.8
.1.25
.15
.05
.15
Rem
.*310
FNFA-U
49.3–.8
.73.5–4.7
.3–.8
.4–1.0
.1.25
.2–
–Rem
.
GDIN
1725
AlCuMg1.
Wk.
3.1325
.6.5
3.5–4.3
.3–1.0
.4–1.0
.1.5
.2.05
.2Rem
.
CEN
EN
2116PR
(2017A
-H13
wireforsolid
rivets,d≤10
mm—provisionalspec.)
EN
2393PR
(2017A
-T4draw
ntube
forstructures,0.6mm
≤a≤12.5
mm—
provisionalspec.)
EN
2509PR
(2017A
-T42
draw
ntube
forstructures—provisionalspec.)
EN
2640PR
(2017A
-T4extruded
bars
andsections
1.2mm
≤a/d≤150mm,peripheral
coarse
graincontrol—
provisionalspec.)
EN
2655PR
(2017A
-T42
extruded
bars
andsections
1.2mm
≤a/d≤150mm,peripheral
coarse
graincontrol—
provisionalspec.)
EN
2691
PR(2017A
-T3sheetandstrip,
0.4mm
≤a≤6mm—
provisionalspec.)
EN
2692PR
(2017A
-T3clad
sheetandstrip,
0.4mm
≤a≤6mm—provisionalspec.)
EN
2705PR
(2017A
-T44
draw
ntube
forstructures,0.6mm
≤a≤12.5
mm—provisionalspec.)
(con
tinued)
Appendix 6: Metal Alloy Comparison Tables 591
(con
tinued)
Com
positio
n(m
ax.unless
otherw
isestated)
Others
Country
Designatio
nSi
FeCu
Mn
Mg
Cr
Zn
Ti
Each
Total
Almin.
Notes
31018
USA
AA
2024
(UNSA92024)
.5.5
3.8–4.9
.3–.9
1.2–1.8
.1.25
.15
.05
.15
Rem
.*310
UK
AA
2024
.5.5
3.8–4.9
.3–.9
1.2–1.8
.1.25
.15
.05
.15
Rem
.*310
UK
BS2L
97;DTD
5100A;BS
AMD2433
(was
2L98)
.5.5
3.8–4.9
.3–.9
1.2–1.8
.1.2
+Zr.2
––
Rem
.Ni.05,
Pb.05,
Sn.05
FNFA-U
4G1
.5.5
3.8–4.5
.3–.9
1.2–1.8
.1.25
.2–
–Rem
.
GDIN
1725
AlCuMg2.
Wk.
3.1355
.4.4
4.0–4.8
.3–.9
1.2–1.8
.1.25
.2.05
.2Rem
.
ISO
ISO
AlCu4Mg1
CEN
EN
2090PR
(2024-T3clad
sheetandstrip,
0.4mm
<a<6mm—provisionalspec.)
EN
2091
PR(2024-T4clad
sheetandstrip,
0.4mm
<a<6mm—provisionalspec.)
EN
2318
(2024-T3511
baranddraw
nprofi
les,a>1.2mm
/d<150mm)
EN
2320PR
(2024-T3draw
nbar,a≤75
mm—
provisionalspec.)
EN
2321
PR(2024-T4barandsection,
a≤150mm—provisionalspec.)
EN
2319PR
(2024-T3510
draw
nbar,a≤75
mm—
provisionalspec.)
EN
2388PR
(2024-T351tube
forstructures,0.6mm
≤a≤12.5
mm—provisionalspec.)
EN
2419PR
(2024-T351plate,
6mm
≤a≤80
mm—provisionalspec.)
EN
251O
PR(2024-T42
draw
ntube
forstructures—
provisionalspec.)
EN
2633
(2024-T3511
baranddraw
nprofi
les,a>1.2mm
/d<150mm,peripheral
coarse
graincontrol)
EN
2638PR
(2024-T3extruded
bars
andsections,1.2mm
≤a/d≤150mm,peripheral
coarse
graincontrol—
provisionalspec.)
EN
2701
PR(2024-T3draw
ntube,6mm
≤d/a≤12.5—
provisionalspec.)
EN
2703PR
(2024-T42
clad
sheetandstrip,
0.4mm
≤a≤6mm—provisionalspec.)
EN
2704PR
(2024-T3511
draw
nbar,a≤75
mm—
provisionalspec.)
EN
2709PR
(2024-T3510
barandsection,
1.2mm
≤a/d≤150mm,peripheral
coarse
graincontrol—
provisionalspec.)
EN
2806PR
(2024-T42
extruded
sections,1.2mm
≤a≤100mm,peripheral
coarse
graincontrol—
provisionalspec.)
EN
2814PR
(2024-T3511
tube
forstructures,0.6mm
≤a≤12.5
mm—provisionalspec.)
EN
3347PR
(2024-T8511
extruded
bars
andsections,a/d≤150mm,peripheral
coarse
graincontrol—
provisionalspec.)
EN
3348PR
(2024-T62
plate,
6mm
≤a/d≤50
mm—provisionalspec.)
EN
3474PR
(2024-T81
sheetandstrip,
0.25
mm
≤a/d≤6mm—provisionalspec.)
EN
3550PR
(2024-T8511
extruded
barsandsections,a/d≤150mm—provisionalspec.)
EN
3657PR
(2024-T3510
draw
nbarformachining,d≤75
mm—provisionalspec.)
EN
3997PR
(2024-T3sheetandstrip,
0.4mm
≤a/d≤6mm—provisionalspec.)
EN
3998PR
(2024-T42
sheetandstrip,
0.4mm
≤a/d≤6mm—
provisionalspec.)
EN
4101
PR(2024-T4sheetandstrip,
0.4mm
≤a/d≤6mm—provisionalspec.)
31019
USA
AA
2048
(UNSA92048)
.15
.22.8–3.8
.2–.6
1.2–1.8
–.25
––
–
UK
AA
2048
.15
.22.8–3.8
.2–6
1.2–1.8
–.25
––
–
31020
USA
AA
2090
2.5–2.75
017–
.02
Li2.1–
2.2Zr.11–.12
Nom
inal
comp.
USA
2090
(proprietory)
2.4–3.0
.25
Li1.9–
2.6Zr.08–.15
Nom
inal
comp.
UK
AA
2090
2.5–2.75
.017–.02
Li2.1–
2.2Zr.11–.12
Nom
inal
comp.
31021
USA
AA
2091
.2.3
1.8–2.5
1.1–1.9
Li1.7–
2.3Zr<.1
Nom
inal
comp.
UK
AA
2091
.2.3
1.8–2.5
1.1–1.9
Li1.7–
2.3Zr<.1
Nom
inal
comp.
31022
USA
Welda
lite049(A
A2095)
4.0–6.3
.4Li1.3Zr.14Ag.4
Nom
inal
comp.
31023
USA
AA
2124
(UNSA92124)
.2.3
3.8–4.9
.3–.9
1.2–1.8
.1.25
.15
.05
.15
Rem
.*310
UK
AA
2124
.2.3
3.8–4.9
.3–.9
1.2–1.8
.1.25
.15
.05
.15
Rem
.*310
CEN
EN
2422PR
(2124–T351plate,
25mm
≤a<120mm—provisionalspec.);
(con
tinued)
592 Appendix 6: Metal Alloy Comparison Tables
(con
tinued)
Com
positio
n(m
ax.unless
otherw
isestated)
Others
Country
Designatio
nSi
FeCu
Mn
Mg
Cr
Zn
Ti
Each
Total
Almin.
Notes
31024
USA
AA
2195
3.7–4.3
.25–8
Li.8–1.2Zr.08–
.16
Nom
inal
comp.
31025
USA
AA
2214
.84.5
.6Nom
inal
comp.
UK
AA
2214
.84.5
.6Nom
inal
comp.
CEN
EN
2124PR
(2214-T651plate,
6mm
≤a≤140mm)
EN
2382PR
(2214-T6forgings,≤100mm)
EN
2383PR
(2214-T4forgings,≤100mm)
EN
2485PR
(2214-FExtrudedor
castforgingstock)
EN
2697PR
(2214-T6extruded
barandsection,
1.2≤a/d≤100mm,peripheral
coarse
graincontrol—
provisionalspec)
31026
USA
AA
2219
(UNSA92219)
.2.3
5.8–6.8
.2–.4
.02
–.1
.02–.1
.05
.15
Rem
.*311
UK
AA
2219
.2.3
5.8–6.8
.2–.4
.02
–.1
.02–.1
.05
.15
Rem
.*311
UK
DTD
5004A
.25
.35
5.7–6.5
.2–.35
.15
–.1
+Zr.2
––
Rem
.*312
FNFA-U
6MT
.2.3
5.5–6.5
.2–.3
––
–.05–.15
––
Rem
.
CEN
EN
4099PR
(2219-T62
clad
sheet.andstrip,
0.5mm
≤a≤6mm—provisionalspec.)
EN
4100PR
(2219-T62
sheetandstrip,
0.5mm
≤a≤6mm—provisionalspec)
EN
4102PR
(2219-T81
clad
sheet.andstrip,
0.5mm
≤a≤6mm—provisionalspec.)
31027
USA
AA
2419
.015
.18
5.8–6.8
.2–.4
.02
–.10
.02–.1
.05
.15
Rem
.*321
UK
AA
2419
.015
.18
5.8–6.8
.2–4
.02
–.10
.02–.1
.05
.15
Rem
.*321
31028
USA
AA
2618
.1–.25
.9–1.3
1.9–2.7
–1.3–1.8
–.1
.04–.1
.05
.15
Rem
.*322
UK
AA
2618A
(was
H16)
.1–.25
.9–1.4
1.8–2.7
.25
1.2–1.8
–.15
.04–.2
.05
.15
Rem
.Ni.8–1.4
UK
BS1472;Hid
RR58
.25
.9–1.4
1.8–2.7
.21.2–1.8
–.2
.2–
–Rem
.*322
UK
DTD717A
;731B
;745A
;5084A;5014A
.25
.9–1.4
1.8–2.7
.21.2–1.8
–.1
+Zr.2
––
Rem
.Pb
,Sn
.05,
Ni.8–1.4
FA-U
2GN
.25
.7–1.4
1.8–2.7
.21.2–1.8
–.15
––
–Rem
.*325
CEN
EN
2085PR
(2618A
-T6forgings,≤150mm)
EN
2086PR
(2618A
-T851[A
L-P11-T851]
forged
bars
andlabs,≤150mm)
EN
2123PR
(2618A
-T851plates,6mm
≤a≤140mm)
EN
2256PR
(2618A
-T852[A
L-P11-T852]
forged
bars
andslabs,≤150mm)
EN
2486PR
(2618A
-Fextruded
orcastforgingstock)
EN
3552PR
(2618A
-T6clad
sheetandstrip,
0.4mm
≤a≤6mm—provisionalspec.)
EN
3553PR
(2618A
-T6511
extruded
barandsection,
12mm
≤≤100mm—provisionalspec.)
31029
USA
AA
3003
(UNSA93003)
.6.7
.05–.2
1.0–
1.5
––
.1–
.03
.15
Rem
.*31
UK
AA
3003
(was
BS1470
NS3
).6
.7.1
.8–1.5
.1–
.2.2
––
Rem
.
FNFA-M
I.6
.7.2
1.0–
1.5
.05
–.1
.5–
–Rem
.
GDIN
1725
AlMnWk.
3.0515
.5.6
.1.9–1.4
0–.3
.05
.2.1
.05
.15
Rem
.
31030
USA
AA
3004
(UNSA93004)
.3.7
.25
1.0–
1.5
.8–1.3
–.25
–05
.15
Rem
.*31
UK
AA
3004
.3.7
.25
1.0–
1.5
.8–1.3
–.25
–05
.15
Rem
.*31
FNFA
.3.7
.25
1.0–
1.5
.8–1.3
–.25
.5–
–Rem
.
31031
USA
AA
3005
(UNSA93005)
.6.7
.31.0–
1.5
.2–.6
.1.25
.1.05
.15
Rem
.
UK
AA
3005
.6.7
.31.0–
1.5
.2–.6
.1.25
.1.05
.15
Rem
.
31032
USA
AA
3103
(UNSA93103)
.5.7
.1.9–1.5
.3.1
.2+Z
r.1
.05
.15
Rem
.
UK
AA
3103
.5.7
.1.9–1.5
.3.1
.2+Z
r.1
.05
.15
Rem
.
CEN
EN
4004PR
(3103-H16
sheetandstrip,
0.4mm
≤a≤6mm—
provisionalspec.)
31033
USA
AA
3105
(UNSA93105)
.6.7
.3.3–.8
.2–.8
.2.4
.1.05
.15
Rem
.
UK
AA
3105;ALCAN
E4S
.6.7
.3.3–.8
.2–.8
.2.4
.1.05
.15
Rem
.
UK
BSN31
(old
designation)
.25
.7.25
.4–1.1
.3–.6
.1.2
.2–
–Rem
.
GDIN
1725
AlMn0.5Mg0.5Wk.
3.0505
(con
tinued)
Appendix 6: Metal Alloy Comparison Tables 593
(con
tinued)
Com
positio
n(m
ax.unless
otherw
isestated)
Others
Country
Designatio
nSi
FeCu
Mn
Mg
Cr
Zn
Ti
Each
Total
Almin.
Notes
31034
USA
AA
4032
(UNSA94032)
11.0–13.5
1.0
.5–1.3
–.8–1.3
.1.25
–.05
.15
Rem
.*313
UK
AA
4032
11.0–13.5
1.0
.5–1.3
–.8–1.3
.1.25
–.05
.15
Rem
.*313
UK
ALCAN
GB38S
10.5–13.0
.6.7–1.3
.2.8–1.5
–.1
.2–
–Rem
.*314
FNFA-S12UN
10.5–12.5
–.7–1.3
–.8–1.5
––
.15
––
Rem
.*314
31035
USA
AA
5005
(UNSA95005)
.3.7
.2.2
.5–1.1
.1.25
–.05
.15
Rem
.
UK
AA
5005
.3.7
.2.2
.5–1.1
.1.25
–.05
.15
Rem
.
UK
BSN41
(old
designation)
.4.7
.2.5
.5–1.2
.1.2
.2–
–Rem
.
FNFA-G
0.6
.4.7
.2.2
.5–1.1
.1.2
.5–
–Rem
.
GDIN
1725
AlMg1.
Wk.
3.3315
.3.4
.05
.2.8–1.2
.1.2
.1.05
.15
Rem
.
31036
USA
AA
5050
(UNSA95050)
.4.7
.2.1
1.1–1.8
.1.25
–.05
.15
Rem
.*31
UK
AA
5050
.4.7
.2.1
1.1–1.8
.1.25
–.05
.15
Rem
.*31
FNFA-G
1.4
.7.2
.71.0–1.8
.1.25
.05
––
Rem
.
31037
USA
AA
5052
(UNSA95052)
.45(Si+Fe)
.1.1
2.2–2.8
.15–.35
.1.05
–.15
Rem
.*31
USA
AMS4015E;AMS4016E;AMS
4017E;
AMS4069;AMS4070F;
AMS
4071F;
AMS4114B
2.5
.25
Nom
inal
comp.
UK
AA
5052
.45(Si+Fe)
.1.1
2.2–2.8
.15–.35
.1.05
–.15
Rem
.*31
ISO
ISO
AlMg2
CEN
EN
4005PR
(5052-O
sheetandstrip,
0.3mm
≤a≤6mm—provisionalspec.)
31038
USA
AA
5056
(UNSA95056)
.3.4
.1.05–
.24.5–5.6
.05–.2
.1–
.05
.15
Rem
.*31
UK
AA
5056A;BS3L
58.4
.5.1
.1–.6
4.5–5.6
.2.2
.2.05
.15
Rem
.Mn+Cr.1–.6
UK
BSN6(old
designation)
.3.5
.1.5
4.5–5.3
.25
.2.2
Rem
.Mn+Cr.1–.5
FA-G
5M
(AA
5056A)
.4.4
.05
.55
4.3–5.5
.3.2
.1.05
.15
Rem
.
GDIN
1725
AlMg5.
(AA
5056A)
Wk.
3.3555
.4.4
.05
.55
4.3–5.5
.3.2
.1.05
.15
Rem
.
CEN
EN
2117PR
(5056A
-H32
wireforsolid
rivets,d≤
10mm—
provisionalspec.)
EN
2628PR
(5056A
-Owireforsolid
rivets,d≤
10mm—provisionalspec.)
31039
USA
AA
5083
(UNSA95083)
.4.4
.1.4–1.0
4.0–4.9
.05–.25
.25
.15
.05
.15
Rem
.
UK
AA
5083
.4.4
.1.4–1.0
4.0–4.9
.05–.25
.25
.15
.05
.15
Rem
.
UK
BSN8
.4.4
.1.5–1.0
4.0–4.9
.25
2.15
––
Rem
.
FA-G
4.5M
C.7
4.4
.1Nom
inal
comp.
GDIN
1725
AlM
g4.5MnWk.3.3547
.4.4
.1.6–1.0
4.0–4.9
.05–.25
.2.1
.05
.15
Rem
.
31040
USA
AA
5086
(UNSA95086)
.4.5
.1.2–.7
3.5–4.5
.05–.25
.25
.15
.05
.15
Rem
.
UK
AA
5086
.4.5
.1.2–.7
3.5–4.5
.05–.25
.25
.15
.05
.15
Rem
.
CEN
EN
2508PR
(5086-H111draw
ntube
forsturctures—provisionalspec.)
EN
2693
(5086-H
111sheetandstrip)
EN
2699PR
(5086-H111draw
nbar,6mm
≤d≤50
mm—
provisionalspec.)
31041
USA
AA
5154
(UNSA95154)
.45(Si+Fe)
.1.1
3.1–3.9
.15–.35
.2.2
.05
.15
Rem
.*31
UK
AA5154A
(was
BSN5)
.5.5
.1.5
3.1–3.9
.25
.2.2
.05
.15
Rem
.Mn+Cr.1–.5
*31
GDIN
1725
AlMg3.
Wk.
3.3535
.4.4
.05
.52.6–34
.3.2
.1.05
.15
Rem
.
31042
USA
AA
5251
(UNSA95050)
.4.5
.15
.1–.5
1.7–2.4
.15
.15
.15
.05
.15
Rem
.
UK
AA
5251;BS5L
44;BS3L
80;BS
3L81
.4.5
.15
.1–.5
1.7–2.4
.15
.15
.15
.05
.15
Rem
.
UK
BSN4(old
designation)
.5.5
.1.5
1.7–2.4
.25
.2.2
Mn+Cr
.5Rem
.
FA-G
2M
2Nom
inal
comp.
GDIN
1725
AlMg2.
Mn0.3Wk.
3.3525
.3.4
.05
.31.7–2.4
.3.2
.1.05
.15
Rem
.
(con
tinued)
594 Appendix 6: Metal Alloy Comparison Tables
(con
tinued)
Com
positio
n(m
ax.unless
otherw
isestated)
Others
Country
Designatio
nSi
FeCu
Mn
Mg
Cr
Zn
Ti
Each
Total
Almin.
Notes
31043
USA
AA
5252
(UNSA95252)
.08
.1.1
.12.2–2.8
––
–.03
.1Rem
.
UK
AA
5252
.08
.1.1
.12.2–2.8
––
–.03
.1Rem
.
FNFAG-G
33.0nom
Highpurity
base
31044
USA
AA
5254
(UNSA95254)
.45(Si+Fe)
.05
.01
3.1–3.9
.15–.35
.2.05
.05
15Rem
.
UK
AA
5154A
(was
BSN5)
.5.5
.1.5
3.1–3.9
.25
.2.2
.05
.15
Rem
.Mn+Cr.1–.5
*31
GDIN
1725
AlMg3.Wk.
3.3535
.4.4
.05
.52.6–3.4
.3.2
.1.05
.15
Rem
.
31045
USA
AA
5356
(UNSA95356)
.5(Si+Fe)
.1.05–
.24.5–5.5
.05–.2
.1.06–.2
.05
.15
Rem
.*31
UK
AA
5356
.5(Si+Fe)
.1.05–
.24.5–5.5
.05–.2
.1.06–.2
.05
.15
Rem
.*31
UK
AA
5056A;BS3L
58.4
.5.1
1–.6
4.5–5.6
.2.2
.2.05
.15
Rem
.Mn+Cr.1–.6
UK
BSN6(old
designation)
.3.5
.1.5
4.5–5.3
.25
.2.2
Mn+Cr
.1–.5
Rem
.
FA-G
5M
.4.4
.05
.55
4.3–5.5
.3.2
.1.05
.15
Rem
.
GDIN
1725
AlMg5.
Wk.
3.3555
.4.4
.05
.55
4.3–5.5
.3.2
.1.05
.15
Rem
.
31046
USA
AA
5454
(UNSA95454)
.4(Si+Fe)
.1.5–1.0
2.4–3.0
.05–.2
.25
.2.05
.15
Rem
.
UK
AA5454
(was
BSN51);EN515;
EN
573-3;
.4(Si+Fe)
.1.5–1.0
2.4–3.0
.05–.2
.25
.2.05
.15
Rem
.
EN
573-4
FA-G
2.5M
C.7
2.7
.1Nom
inal
comp.
FA-G
3.4
.5.1
.1–.6
2.6–3.8
.4.2
.2–
–Rem
.
GDIN
1725
AlMg2.7Wk.
3.3537
.45
2.7
Nom
inal
comp.
GDIN
1725
AlMg3.
Wk.
3.3585
.4.4
.05
.52.6–3.4
.3.2
.1.05
.15
Rem
.
31047
USA
AA
5456
(UNSA95456)
.4(Si+Fe)
.1.5–1.0
4.7–5.5
.05–.2
.25
.2.05
.15
Rem
.
UK
BSN61
.4(Si+Fe)
.1.6–1.0
5.0–5.5
.05–.2
.2.05–.2
––
Rem
.
FNFA-G
5.4
.5.1
.2–1.0
4.5–5.5
.4.2
.2–
–Rem
.
GDIN
1725
AlMg5.
Wk.
3.3555
.4.4
.05
.55
4.3–5.5
.3.2
.1.05
.15
Rem
.
31048
USA
AA
5457
(UNSA95457)
.08
.1.2
.15–
.45
.8–1.2
–.03
–.03
.1Rem
.
UK
AA
5457
(UNSA95457)
.08
.1.2
.15–
.45
.8–1.2
–.03
–.03
.1Rem
.
FA9-G1andseeAA
5005
1.0
Nom
inal
comp.
31049
USA
AA
5652
(UNSA95652)
.4(Si+Fe)
.04
.01
2.2–2.8
.15–.35
.1–
.05
.15
Rem
.*31
UK
AA
5652
.4(Si+Fe)
.04
.01
2.2–2.8
.15–.35
.1–
.05
.15
Rem
.*31
31050
USA
AA
5657
(UNSA95657)
.08
.1.1
.03
.6–1.0
–.03
–.02
.05
Rem
.*31
UK
AA
5657
.08
.1.1
.03
.6–1.0
.03
–.02
.05
Rem
.*31
UK
BSBTRS2
(old
designation)
1.0
Nom
inal
comp.
31051
USA
AA
6003
(UNSA96003)
.35–1.0
.6.1
.8.8–1.5
.35
.2.1
.05
.15
Rem
.
UK
AA
6003
.35–1.0
.6.1
.8.8–1.5
.35
.2.1
.05
.15
Rem
.
FNFAS–
GM
.6–1.5
.5.1
.1–1.0
.6–1.5
.3.25
.2–
–Rem
.
GDIN
1725
AlMgSi
1.75–1.3
.5.1
.4–1.0
.6–1.2
.3.2
.1.05
.15
Rem
.
31052
USA
AA
6005
(UNSA96005)
.6–.9
.35
.1.1
.4–.6
.1.1
.1.05
.15
Rem
.k
UK
AA
6005
.6–.9
.35
.1.1
.4–.6
.1.1
.1.05
.15
Rem
.
31053
USA
AA
6053
(UNSA96053)
*315
35.1
–1.1–1.4
.15–.35
.1–
.05
.15
Rem
.
UK
AA
6053
*315
.35
.1–
1.1–1.4
.15–.35
.1–
.05
.15
Rem
.
Seealso
AA
6003
(con
tinued)
Appendix 6: Metal Alloy Comparison Tables 595
(con
tinued)
Com
positio
n(m
ax.unless
otherw
isestated)
Others
Country
Designatio
nSi
FeCu
Mn
Mg
Cr
Zn
Ti
Each
Total
Almin.
Notes
31054
USA
AA
6061
(UNSA96061)
.4–.8
.7.15–.4
.15
.8–1.2
.04–
.35
.25
.15
.05
.15
Rem
.
USA
AMS4
025D
;AMS4
026D
;AMS4
027E
;AMS4
043
AMSnumbers
forvariousform
sandconditionsof
AA
6061
alloy
AMS4
053;
AMS4
079;
AMS4
080E
;AMS4
081A
AMS4
082E
;AMS4
083D
;AMS4
115;
AMS4
116A
AMS4
117A
;AMS4
127B
;AMS4
146;
AMS4
150C
;AMS4
160;
AMS4
161
UK
AA
6061;BSL117;
BSL118
.4–.8
.7.15–.4
.15
.8–1.2
.04–
.35
.25
.15
.05
.15
Rem
.
UK
BSH20
.4–.8
.7.15–.4
.2–.8
.8–1.2
*.2
.2Rem
.*E
ither
Mnor
Cr.04–.35
FA-G
SUC
.6.2
1.0
.15
Nom
inal
Cam
p.
GDIN
1725
AlM
gSi
1CuWk.3.3211
CEN
EN
2391
PR(6061-T4tube
forstructures,0.6mm
≤a≤12.5
mm—
provisionalspec.)
EN
2392PR
(6061-T6tube
forstructures,0.6mm
≤a≤12.5
mm—
provisionalspec)
EN
2629PR
(6061—
provisionalspec.)
EN
2694
(6061-T6/T62
sheetandstrip)
EN
2700PR
(6061-T6draw
nbar,6mm
≤d≤75
mm,peripheral
coarse
graincontrol—
provisionalspec.)
EN
2702PR
(6061-T6extruded
barandsection,
1.2mm
≤a/d≤150mm—
provisionalspec)
EN
2813PR
(6061-T6tube
forhydraulics,0.6mm
≤a≤12.5
mm—provisionalspec.)
EN
3341
PR(6061-T4sheetandstrip,
0.4mm
≤a≤6mm—provisionalspec.)
EN
3342PR
(6061-T4draw
nbarandsection,
10mm
≤d≤150mm—
provisionalspec.)
EN
3702PR
(6061-T4tube
forhydraulics,0.6mm
≤a≤12.5
mm—provisionalspec.)
31055
USA
AA
6063
(UNSA96063)
.2–.6
.35
.1.1
.45–.9
.1.1
.1.05
.15
Rem
.
UK
AA
6063;DTD
372B
.2–.6
.35
.1.1
.45–.9
.1.1
.1.05
.15
Rem
.
UK
H9(old
designation)
.3–.7
.4.1
.1.4–.9
.1.2
.2–
–Rem
.
FNFA-G
S(N
FA.57.350)
.8.8
Nom
inal
comp.
GDIN
1725
AlMgSi
0.5Wk.
3.3206
.35–
.8.3
.05
.1.4–.8
.05
.2.1
.05
.15
Rem
.
ISO
ISO
AlMgSi
––
31056
USA
AA
6066
(UNSA96066)
.9–1.8
.5.7–1.2
.6–1.1
.8–1.4
.4.25
.2.05
.15
Rem
.
UK
AA
6066
.9–1.8
.5.7–1.2
.6–1.1
.8–1.4
.4.25
.2.05
.15
Rem
.
UK
ALCAN
623;
BS2L
84.8–1.3
.71.0–2.0
1.0
.5–1.2
–.2
.3–
–Rem
.Ni.2
*316
31057
USA
AA
6070
(UNSA96070)
1.0–
1.7
.5.15–.4
.4–1.0
.5–1.2
.1.25
.15
.05
.15
Rem
.
UK
AA
6070
1.0–
1.7
.5.15–.4
.4–1.0
.5–1.2
.1.25
.15
.05
.15
Rem
.
UK
ALCAN
623;
BS2L
84.8–1.3
.71.0–2.0
1.0
.5–1.2
–.2
.3–
–Rem
.Ni.2
*316
31058
USA
AA
6081
CEN
EN
2695
(6081-T6sheetandstrip);
31059
USA
AA
6082
(UNSA96082)
.7–1.3
.5.1
.4–1.0
.6–1.2
.25
.2.1
.05
.15
Rem
.
UK
AA
6082
(was
H30)
.7–1.3
.5.1
.4–1.0
.6–1.2
.25
.2.1
.05
.15
Rem
.
ISO
ISO
AISi1
MgM
n
CEN
EN
2326
(6082-T6<2
00mm
baranddraw
nprofi
les)
EN
2636
(6082-T6<2
00mm
baranddraw
nprofi
les,peripheral
coarse
graincontrol)
EN
2389PR
(6082-T4tube
forstructures,0.6mm
≤a≤12.5
mm—
provisionalspec.)
EN
2390PR
(6082-T6tube
forstructures,0.6mm
≤a≤12.5
mm—
provisionalspec.)
EN
2420PR
(6082-T6bars—
provisionalspec.)
EN
2421
PR(6082-T4wireforrivets—
provisionalspec.)
EN
4006PR
(6082-T4/T42
sheetandstrip,
0.4mm
≤a≤6mm—
provisionalspec.)
EN
4007PR
(6082-T6/T62
sheetandstrip,
0.4mm
≤a≤6mm—
provisionalspec.)
(con
tinued)
596 Appendix 6: Metal Alloy Comparison Tables
(con
tinued)
Com
positio
n(m
ax.unless
otherw
isestated)
Others
Country
Designatio
nSi
FeCu
Mn
Mg
Cr
Zn
Ti
Each
Total
Almin.
Notes
31060
USA
AA
6101
(UNSA96101)
.3–.7
.5.1
.03
.35–.8
.03
.1–
.03
.1Rem
.B.06
UK
AA6101A;BS2
898:6101A
.3–.7
.4.05
–.4–.9
––
–.03
.1Rem
.
UK
BS91E
.3–.7
.5.04
–.4–.9
––
––
–Rem
.
GDIN
1725
E-A
IMgSi
Wk.
3.2305
.5–.6
.1–.3
.02
–.3–.5
–.1
–.03
.1Rem
.*317
31061
USA
AA
6151
(UNSA96151)
.6–1.2
1.0
.35
.2.45–.8
.15–.35
.25
.15
.05
.15
Rem
.
UK
AA
6151
.6–1.2
1.0
.35
.2.45–.8
.15–35
.25
.15
.05
.15
Rem
.
SeeAA
6101
31062
USA
AA
6162
(UNSA96162)
.4–.8
.5.2
.1.1–1.1
.1.25
.1.05
.15
Rem
.
UK
AA
6162
.4–.8
.5.2
.1.1–1.1
.1.25
.1.05
.15
Rem
.
SeeAA
6101
31063
USA
AA
6201
(UNSA96201)
.5–.9
.5.1
.03
.6–.9
.03
.1–
.03
.1Rem
.
UK
AA
6201
.5–.9
.5.1
.03
.6–.9
.03
.1–
.03
.1Rem
.
SeeAA
6101
31064
USA
AA
6253
(UNSA96253)
*315
.5.1
–1.0–1.5
.15–.35
1.6–2.4
–.05
.15
Rem
.
UK
AA
6253
*315
.5.1
–1.0–1.5
.15–.35
1.6–2.4
–.05
.15
Rem
.
31065
USA
AA
6262
(UNSA96262)
.4–.8
.7.15–.4
.15
.8–1.2
.04–.14
.25
.15
.05
.15
Rem
.*318
UK
AA
6262
.4–.8
.7.15–.4
.15
.8–1.2
.04–.14
.25
.15
.05
.15
Rem
.*318
31066
USA
AA
6351
(UNSA96351)
.07–1.3
.5.1
.4–.8
.4–.8
–.2
.2.05
.25
Rem
.
UK
AA
6351
.07–1.3
.5.1
.4–.8
.4–.8
–.2
.2.05
.25
Rem
.
31067
USA
AA
6463
(UNSA96463)
.2–.6
.15
.2.05
.45–.9
––
–.05
.15
Rem
.
UK
AA
6463;E6;
EN
515;
EN
573–
3;EN
573-4
.2–.6
.15
.2.05
.45–.9
––
–.05
.15
Rem
.
UK
BSBTR6
.2–.5
.15
.2.05
.4–.8
––
.05
––
Rem
.
31068
USA
AA
6951
(UNSA96951)
.2–.5
.8.15–.4
.1.4–.8
.2–
.05
.15
Rem
.
31069
USA
AA
7001
(UNSA97001)
.35
.41.6–2.6
.22.6–3.4
.18–.35
6.8–8.0
.2.05
.15
Rem
.
UK
AA
7001
.35
.41.6–2.6
.22.6–3.4
.18–.35
6.8–8.0
.2.05
.15
Rem
.
FNFA-Z8G
U1.6
2.7
.28.0
Nom
inal
comp.
31070
USA
AA
7009
(UNSA97009)
UK
AA
7009
CEN
EN
2093
(7009-T74
Forgings
>20mm
and<1
50mm)
EN
2094
(7009-T74
Die
Forgings
>3mm
and<1
50mm)
EN
2381
(7009-T7452
Forgings
>40mm
and<1
50mm)
EN
2385
(7009-T74511baranddraw
nprofi
les)
EN
2487PR
(7009-Fextruded
orcasr
forgingstock—
provisionalspec.)
EN
2630
(7009-T74511baranddraw
nprofi
les,a≤125mm,peripheral
coarse
graincontrol)
EN
2706PR
(7009-T736510
barandsection,
1.2mm
≤a/d≤125mm,peripheral
coarse
graincontrol—
provisionalspec.)
(con
tinued)
Appendix 6: Metal Alloy Comparison Tables 597
(con
tinued)
Com
positio
n(m
ax.unless
otherw
isestated)
Others
Country
Designatio
nSi
FeCu
Mn
Mg
Cr
Zn
Ti
Each
Total
Almin.
Notes
31071
USA
AA
7010
1.7
2.4
6.3
Nom
inal
comp.
UK
AA
7010
1.7
2.4
6.3
Nom
inal
comp.
UK
DTD
5120
.12
.15
1.5–2
.12.1–2.6
.05
5.7–6.7
–.05
.15
Rem
.*323
UK
DTD
5130A
.1.15
1.5–2
.32.2–2.7
.05
5.7–6.7
–.05
.15
Rem
.*323
UK
DTD
5636
.12
.15
1.5–2
.12.1–2.6
.05
5.7–6.7
.06
.05
.15
Zr.1–.16
CEN
EN
2681
PR(7010-T736dieforgings,a≤150mm—provisionalspec.)
EN
2682PR
(7010-T73652forgings,50
mm
≤a≤150mm—provisionalspec.)
EN
2683PR
(7010-T7651
forgings,80
mm
≤a≤160mm—
provisionalspec.)
EN
2684PR
(7010-T7651
plate,
6mm
≤a≤140mm—provisionalspec.)
EN
2685PR
(7010-T7652
forgings,80
mm
≤a≤160mm—
provisionalspec.)
EN
2686PR
(7010-T73651hand
forgings,50
mm
≤a≤150mm—provisionalspec.)
EN
2687PR
(7010-T73651plate,
6mm
≤a≤150mm—provisionalspec.)
EN
3337PR
(7010-T74511extruded
bars
andsections
a/d≤130mm,peripheral
coarse
graincontrol—
provisionalspec)
EN
3339PR
(7010-T76
dieforgings,a≤200mm—provisionalspec.)
EN
3343PR
(7010-T76511extruded
bars
andsections
1mm
≤a/d≤130mm,peripheral
coarse
graincontrol—
provisionalspec)
EN
3554PR
(7010-T7652
hand
forgings,a≤200mm—provisionalspec.)
31072
USA
AA
7020
.35
.4.2
.05–
.51.0–1.4
.1–35
4.0–5.0
–.05
.15
Rem
.*324
UK
AA
7020;BS4
300/14
/15;
EN
515;
EN
573-3;
EN
573-4
.35
.4.2
.05–
.51.0–1.4
.1–.35
4.0–5.0
–.05
.15
Rem
.*324
UK
BSH17
.4.4
.25
.2–.7
1.0–1.5
.25
3.8–4.8
.1–
–Rem
.Zr.25,
Mn+Cr.7
FA-Z5G
(NFA
.57-702)
.3.8
.15–.35
.4.4–.65
.35
4.5–5.5
.15–.25
.05
.15
Rem
.
GDIN
1725
AlZn4.5Mg1Wk.
3.4335
.5.5
.11–
.51–1.4
.24–5
.2.05
.15
Rem
.
CEN
EN
2807PR
(7020-T6extruded
sections
1.2mm
≤a≤100mm,peripheral
coarse
graincontrol—
provisionalspec.)
31073
USA
AA
7039
(UNSA97039)
.3.4
.1.1–.4
2.3–3.3
.15–.25
3.5–4.5
.1.05
.15
Rem
.
UK
AA
7039
.3.4
.1.1–.4
2.3–3.3
.15–.25
3.5–4.5
.1.05
.15
Rem
.
31074
USA
AA
7049
(UNSA97049)
.25
.35
1.2–1.9
.22.0–2.9
.1–.22
7.2–8.2
.1.1
.15
Rem
.
UK
AA
7049
.25
.35
1.2–1.9
.22.0–2.9
.1–.22
7.2–8.2
.1.1
.15
Rem
.
31075
USA
AA
7050
(UNSA97050)
.12
.15
2.0–2.6
.11.9–2.6
.04
5.7–6.7
.06
.05
.15
Rem
.Zr.0
8–.15
UK
AA
7050
.12
.15
2.0–2.6
.11.9–2.6
.04
5.7–6.7
.06
.05
.15
Rem
.Zr.0
8–.15
CEN
EN
2688PR
(7050-T736dieforgings,a≤150mm—
provisionalspec.)
EN
2689PR
(7050-T73651plate,
6mm
≤a≤150mm—provisionalspec.)
EN
2690PR
(7050-T73652hand
forgings,a≤125mm—
provisionalspec.)
EN
3334PR
(7050-T651plate,
6mm
≤a≤60
mm—provisionalspec)
EN
3338PR
(7050-T74511extruded
bars
andsections
a/d≤130mm,peripheral
coarse
graincontrol—
provisionalspec.)
EN
3340PR
(7050-T76
dieforgings,a≤200mm—provisionalspec.)
EN
3344PR
(7050-T76511extruded
bars
andsections
a/d≤130mm,peripheral
coarse
graincontrol—
provisionalspec.)
(con
tinued)
598 Appendix 6: Metal Alloy Comparison Tables
(con
tinued)
Com
positio
n(m
ax.unless
otherw
isestated)
Others
Country
Designatio
nSi
FeCu
Mn
Mg
Cr
Zn
Ti
Each
Total
Almin.
Notes
31076
USA
AA
7075
(UNSA97075)
.4.5
1.2-2.0
.32.1–2.9
.18–.35
5.1–6.1
.2.05
.15
Rem
.Zr+Ti.25
UK
AA
7075
.4.5
1.2–2.0
.32.1–2.9
.18–.35
5.1–6.1
.2.05
.15
Rem
.Zr+Ti.25
UK
DTD5074A
(now
DTD5121)
1.6
2.5
.16
6.2
Nom
inal
comp.
UK
DTD5121
(partsuperceded
byL170);DTD5110
.4.5
1.2–2.0
.32.1–2.9
.1–.25
5.1–6.4
+Zr.2
––
Rem
.Ni,Pb
andSn
<.05
UK
BSL160;
BSL161;
BSL162;
BS
L170
.4.5
1.2–2.0
.32.1–2.9
.18–.28
5.1–6.1
.2.05
.15
Rem
.Zr+Ti.25
FNFA-Z5G
U.4
.51.2–2.0
.1–.9
2.0–3.5
.35
5.0–6.5
.2–
–Rem
.
GDIN
1725
AlZnMgCu1.5Wk.
3.4365
.5.7
1.2–2.0
.32.1–2.9
.18–.35
5.1–6.1
.2.05
.15
Rem
.
CEN
EN
2092
(7075-T6/T62
.4–6mm
sheetandstrip)
EN
2126
(7075-T6516–
80mm
sheet)
EN
2127
(7075-T73511<1
00mm
baranddraw
nprofi
les)
EN
2128
(7075-T7351
6–75
mm
draw
nbars)
EN
2315PR
(7075-T73510/T73511bars
andsections
≤100mm—provisionalspec.)
EN
2316PR
(7075-T73
bars
andsections
≤100mm—provisionalspec.)
EN
2317PR
(7075-T73
draw
nbars
≤75
mm—provisionalspec.)
EN
2380PR
(7075-T73
forgings
≤125mm—provisionalspec.)
EN
2386PR
(7075-T7352
hand
forgings
≤150mm—
provisionalspec.)
EN
2394PR
(7075-T6511
bars
andsections
≤125mm—provisionalspec.)
EN
2488PR
(7075-Fextruded
orcastforgingstock—
provisionalspec.)
EN
2511
PR(7075-T7351
plate,
6mm
≤a≤100mm—provisionalspec.)
EN
2631
PR(7075-T6511
bars
andsections
1.2mm
≤a/d≤125mm,peripheral
coarse
graincontrol—
provisionalspec.)
EN
2632
(7075-T73511<1
00mm
baranddraw
nprofi
les,<1
00mm,controlledgrainsize)
EN
2637PR
(7075-T73
extruded
bars
andsections
1.2mm
≤a/d≤100mm,peripheral
coarse
graincontrol—
provisionalspec)
EN
2696
(7075-T6/T62
.4-6
mm
sheetandstrip)
EN
2698PR
(7075-T6510
extruded
barandsection,
1.2mm
≤a/d≤100mm—provisionalspec.)
EN
2707PR
(7075-T6510
barandsection,
1.2mm
≤a/d≤125mm,peripheral
coarse
graincontrol—
provisionalspec.)
EN
2708PR
(7075-T73510barandsection,
1.2mm
≤a/d≤100mm,peripheral
coarse
graincontrol—
provisionalspec.)
EN
2804PR
(7075-T7651
plate,
6mm
≤a≤25
mm—
provisionalspec.)
EN
3555PR
(7075-T79510extruded
barandsection,
1.2mm
≤a/d≤100mm,coarse
graincontrol—
provisionalspec.)
31077
USA
AA
7079
(UNSA97079)
.3.4
.4–.8
.1–.3
2.9-3.7
.1–.25
3.8–4.8
.1.05
.15
Rem
.
UK
AA
7079
.3.4
.4–.8
.1–.3
2.9–3.7
.1–.25
3.8–4.8
.1.05
.15
Rem
.
UK
BSH17
.4.4
.25
2–.7
1.0–1.5
.25
3.8–4.8
.1–
–Rem
.Zr.25,
Mn+Cr.7
*319
GDIN
1725
AlZnMgCu0.5Wk.
3.4345
.5.5
.5–1.0
.1–.4
2.6–3.6
.1–.3
4.3–5.2
.2.05
.15
Rem
.
31078
USA
AA
7175
(UNSA97175)
.15
.21.2–2.0
.12.1–2.9
.18–.28
5.1–6.1
.1.05
.15
Rem
.
UK
AA
7175
.15
.21.2–2.0
.12.1–2.9
.18–.28
5.1–6.1
.1.05
.15
Rem
.
CEN
EN
2512PR
(7175-T7351
plate,
6mm
≤100mm—provisionalspec.);
31079
USA
AA
7178
(UNSA97178)
.4.5
1.6–2.4
.32.4–3.1
.18–.35
6.3–7.3
.2.05
.15
Rem
.
UK
AA
7178
.4.5
1.6–2.4
.32.4–3.1
.18–.35
6.3–7.3
.2.05
.15
Rem
.
FNFA-Z5G
U.4
.51.2–2.0
1–.9
2.0–3.5
.35
.5.0–6.5
.2–
–Rem
.
31080
USA
AA
8090
.2.3
1.0–1.6
.6–1.3
Li2.1–
2.7Zr<.16
Nom
inal
comp.
UK
AA
8090
.2.3
1.0–1.6
.6–1.3
Li2.1–
2.7Zr<.16
Nom
inal
comp.
31081
USA
AA
8091
.3.5
1.8–2.2
.5–1.2
Li2.4–
2.8Zr<.16
Nom
inal
comp.
UK
AA
8091
.3.5
1.8–2.2
.5–1.2
Li2.4–
2.8Zr<.16
Nom
inal
comp.
Appendix 6: Metal Alloy Comparison Tables 599
Alloy equivalents—Aluminium alloys (cast)
Composition (max. unless otherwise stated) Others
Country Designation Si Fe Cu Mn Mg Cr Zn Ti Each Total Almin.
Notes
32001 USA AA 295.0 (UNSA02950)
.7–1.5 1.0 4.0–5.0 .35 .03 – – .35 .25 .05 .15 –
32002 USA AA B295.0 2.0–3.0 1.2 4.0–5.0 .35 .05 – .35 .5 .25 – .35 –
UK AA 295.0 .7–1.5 1.0 4.0–5.0 .35 .03 – – .35 .25 .05 .15 –
UK BS LM 11 .25 .25 4.0–5.0 .1 .1 – .1 .1 .3 – – Sn .05 Pb .05
UK BS L154; BS L155 1.0–1.5 .25 3.8–4.5 .1 .1 – .1 .1 .05–.25 .05 .15 Sn .05 Pb .05
F NF A-USG7 .3 .35 4.2–5.0 .1 .15–.33 – .05 .1 .3 – – Pb .05
G DIN 1725 Al Cu4 Ti Mg. Wk. 3.1371
.18 .2 4.2–4.9 .05 .15–.3 – – .07 .15–.3 .03 .1 –
32003 USA AA 319.0 (UNSA03190)
5.5–6.3 1.0 3.0–4.0 .5 .1 – .35 1.0 .25 – .5 –
32004 USA AAA319.0 5.5–6.5 1.0 3.0–4.0 .3 .1 – .35 3.0 .25 – .5 –
UK AA 319.0 5.5–6.3 1.0 3.0–4.0 .5 .1 – .35 1.0 .25 – .5 –
UK BS LM4 4.0–6.0 .8 2.0–4.0 .2–.6 .2 – .3 .5 .2 – – Sn .1 Pb .1
UK BS LM22 4.0–6.0 .7 2.8–3.8 .3–.6 .05 – .15 .15 .2 – – Sn .05 Pb .1
F NF A-S5U; NF A-S5U3
5.0 3.2 Nominal comp.
G DIN 1725 Al Si 6Cu 4. Wk. 3.2151
5.0–7.5 1.0 3.0–5.0 .1–.3 .1–.3 – .3 2.0 .15 .03 .15 –
ISO ISO AI-Si5Cu3
32005 USA AA 333.0 (UNSA03330)
8.0–10.0 1.0 3.0–4.0 .5 05–.5 – .5 1.0 .25 – .5 –
32006 USA AA A333.0 8.0–10.0 1.0 3.0–4.0 .5 .05–.3 – .5 3.0 .25 – .5 –
UK AA 333.0 8.0–10.0 1.0 3.0–4.0 .5 05–.5 – .5 1.0 .25 – .5 –
UK BS LM24 7.5–9.5 1.3 3.0–4.0 .5 .1 – .5 3.0 .2 – – Sn .2 Pb .3
F A-S9U3Y4 8.2 3.5 Nominal comp.
F A-S10U4 9.0–11.0 1.3 3.0–4.0 .3 .5 – .5 .8 .2 – – Sn .1Fe + Zn− +Mg + Ni + Sn2.5
G DIN 1725 Al Si 8 Cu3. Wk. 3.2161
7.5–9.5 .8 2.0–3.5 .2–.5 .3 – .3 1.2 .15 .05 .15 Sn .1
ISO ISO AI-Si8Cu3Fe
32007 USA AA 355.0 (UNSA03550)
4.5–5.5 .6 1.0–1.5 .5 .4–.6 .25 – .35 .25 .05 .15 –
32008 USA AA C355.0 (UNSA33550)
4.5–5.5 .2 1.0–1.5 .1 .4–.6 – – .1 .2 .05 .15 –
UK BS LM16 4.5–5.5 .6 1.0–1.5 .5 .4–.6 – .25 .1 .2 – – Sn .1 Pb .1
UK AA 355.0 4.5–5.5 .6 1.0–1.5 .5 .4–.6 .25 – .35 .25 .05 .15 –
F A-S4UG
G Alloy No. 234 5.0–6.0 .7 1.0–1.5 .5 .3–.6 – .3 .5 .15 .05 .15 Sn .1 Pb .2 *320
ISO ISO Al-Si5Cu1 Mg
32009 USA AA 356.0 (UNSA03560)
6.5–7.5 .6 .25 .35 .2–.4 – – .35 .25 .05 .15 –
32010 USA AA A356.0 6.5–7.5 .2 .2 .1 .2–.4 – – .1 .2 .05 .15 –
UK BS LM25 6.5–7.5 .5 .1 .3 .2–.45 – .1 .1 .05–.2 – – Sn .05 Pb .1
UK BS 2L99 6.5–7.5 .2 .1 .1 .2–.45 – .1 .1 .2 – – Sn .05 Pb .05
UK BS L173; BS L174 6.5–7.5 .2 .2 .1 .25–.45 – – .1 .04–.25 – – Be .07 max.
UK AA 356.0 6.5–7.5 .6 .25 .35 .2–.4 – – .35 .25 .05 .15 –
F NF A-S7G
G DIN 1725 Al Si7 Mg Wk. 3.2371
6.5–7.5 .18 .05 .05 .2–.4 – – .07 .15 .03 .1 –
ISO ISO AI-Si7 Mg(continued)
600 Appendix 6: Metal Alloy Comparison Tables
(continued)
Composition (max. unless otherwise stated) Others
Country Designation Si Fe Cu Mn Mg Cr Zn Ti Each Total Almin.
Notes
32011 USA AA 357.0 (UNSA03570)
6.5–7.5 .15 .05 .03 .45–.6 – – .05 .2 .05 .15 –
UK AA 357.0 6.5–7.5 .15 .05 .03 .45–.6 – – .05 .2 .05 .15 –
UK BS L169 6.5–7.5 .2 .1 .1 .5–.75 – .05 .1 .1–.2 .05 .15 Pb .05 Sn .05 Be.07
F A-S7G 7.0 .3 Nominal comp.
G DIN 1725 Al Si7 Mg Wk. 3.2371
6.5–7.5 .18 .05 .05 2–.4 – – .07 .15 .03 .1 –
32012 USA AA B358.0 (Tens50)
7.6–8.6 .3 .2 .2 .4–.6 .2 – .2 .1–.2 .05 .15 Be .1–.3
32013 USA AA 359.0 (UNSA03590)
8.5–9.5 .2 .2 .1 .5–.7 – – .1 .2 .05 .15 –
32014 USA AA 380.0 (UNSA03800)
7.5–9.5 2.0 3.0–4.0 .5 .1 – .5 3.0 – – .5 Sn .35
32015 USA AA A380.0 7.5–9.5 1.3 3.0–4.0 .5 .1 – .5 3.0 – – .5 Sn .35
UK BS LM24 7.5–9.5 1.3 3.0–4.0 .5 .1 – .5 3.0 .2 – – Sn .2 Pb .35
F A-S9U3Y4 8.2 3.5 Nominal comp.
F A-S10U4 9.0–11.0 1.3 3.0–4.0 .3 .5 – .5 .8 .2 – – Sn .1 Fe+Zn-+Mg+Ni+Sn 2.5
G DIN 1725 Al Si 8 Cu3. Wk. 3.2161
7.5–9.5 .8 2.0–3.5 .2–.5 .3 – .3 1.2 .15 .05 .15 Sn .1
ISO ISO Al-Si8Cu3Fe
32016 USA AA 514.0 (UNSA05140)
.35 .5 .15 .35 3.5–4.5 – – .15 .25 .05 .15 –
UK AA 514.0 .35 .5 . .15 .35 3.5–4.5 – – .15 .25 .05 .15 –
UK BS LM5 .3 .6 .1 .3–.7 3.0–6.0 – .1 .1 .2 – – Sn .05 Pb .05
F NF A-G3T .4 .5 .1 .5 2.5–3.5 .15 .05 .2 .2 – – Sn .05 Pb .05
F NF A-G6 .4 4.5 Nominal comp.
G DIN 1725 Al Mg 3 1.3 .6 .3 .6 2.0–4.0 – – .3 .2 .05 .15 –
G DIN 1725 Al Mg 5 1.0 .2 5.0 Nominal comp.
ISO ISO AI-Mg5Si1; ISOAl-Mg6
32017 USA AA 518.0 (UNSA05180)
.35 1.8 .25 .35 7.5–8.5 – .15 .15 – – .25 Sn .15
UK AA 518.0 .35 1.8 .25 .35 7.5–8.5 – .15 .15 – – .25 Sn .15
G DIN 1725 Al Mg 9Wk. 3.3292
.5 .05 .2–.5 7.0–10.0 .1 .15 .05 .15 Nominal comp.
32018 USA AA 520.0 (UNSA05200)
.25 .3 .25 .15 9.5–10.6 – – .15 .25 .05 .15 –
UK AA 520.0 .25 .3 .25 .15 9.5–10.6 – – .15 .25 .05 .15 –
UK BS LM10; Hid 90 .25 .35 .1 .1 9.5–11.0 – .1 .1 .2 – – Sn .05 Pb .05
F NF A-G10 .5 1.3 .2 .6 8.5–11.0 – .1 .4 .2 – 2.0 Sn .1
F NF A-G10Y4 10.2 Nominal comp.
G DIN 1725 Al Mg 10Wk. 3.3591
.3 .3 .05 .3 9.0–11.0 – .1 – .15 .05 .15 Sn .05 Pb .05
32019 USA AA 535.0 (UNSA05350)
.15 .15 .05 .1–25 6.2–7.5 – – – .1 –.25 .05 .15 Be .003–.007 B.002
UK AA 535.0 15 .15 .05 .1–.25 6.2–7.5 – – – .1–25 .05 .15 Be .003–.007 B.002
UK DTD 5018A .25 .35 .2 1–.3 7.4–7.9 – .1 .9–1.4 .25 – Sn .05 Pb .05
G DIN 1725 Al Mg 9Wk. 3.3292
.5 .05 .2–5 7.0–10.0 .1 .15 .05 .15 Nominal comp.
32020 USA AA 707.0 (UNSA07070)
.2 .8 .2 .4–.6 1.8–2.4 .2–.4 – 4.0–4.5 .25 .05 .15 –
UK AA 707.0 .2 .8 .2 .4–.6 1.8–2.4 .2–.4 – 4.0–4.5 .25 .05 .15 –
(continued)
Appendix 6: Metal Alloy Comparison Tables 601
(continued)
Composition (max. unless otherwise stated) Others
Country Designation Si Fe Cu Mn Mg Cr Zn Ti Each Total Almin.
Notes
32021 USA AAA712.0 (UNSA07120)
.15 .5 .35–65 .05 .6–.8 – – 6.0–7.0 .25 .05 .15 –
32022 USA AAC712.0 .3 .7–1.4
.35–65 .05 .25–.45 – – 6.0–7.0 .2 .05 .15 –
UK AA 712.0 .15 .5 .35–.65 .05 .6–.8 – – 6.0–7.0 .25 .05 .15 –
UK BS LM31; DTD5008B
.25 .5 .1 .1 .5–.75 .4–.6 .1 4.8–5.7 .05–.25 .05 .15 Sn .05 Pb .05
F A-Z5G .3 .8 .15–.35 .4 .4–.65 .15–.35 .05 4.5–5.5 .15–.25 – – Sn .05 Pb .05
F NF A-Z5G .6 .5 5.2 Nominal comp.
Notes for wrought and cast aluminium alloys*31: .0008 max. Be for welding electrodes and filler wire*32: .03 max. Ga*33: Cu + Si + Fe + Mn + Zr .2 max*34: Cu + Si + Fe + Mn + Zr 1.0 max*35: Cu + Si + Fe + Mn + Zr 0.5 max*36: .05 B max*37: .2–.6 Bi; .2–.6 Pb*38: .2–.7 Pb; .05 max. Sn; .2–.7 Bi; .05 max. Sb*39: .2–.6 Pb; .2–.6 Bi*310: .2 max. Zr + Ti*311: .05–.15V; .1–.25 Zr*312: .1 max Ni; .05 max. Sn; .05 max. Pb*313: .5–1.3 Ni*314: .05 max. Sn; .05 max. Pb; .7–1.3 Ni*315: 45–65 % of Mg*316: .05 max Sn; .05 max Pb; .05 max Sb*317: Cr + Mn + Ti + V .03 max*318: .4–.7 Bi; .4–.7 Pb*319: Not closely equivalent, Mg lower than AA 7079*320: Fe + Mn 1.1 max*321: .1–.25 Zr; .05–.15V*322: .9–1.2 Ni*323: .11–.17 Zr*324: Ti + Zr .08–.25, Zr .08–.2*325: .8–1.4 Ni + .25 Zr
602 Appendix 6: Metal Alloy Comparison Tables
European CEN Specifications forAluminium Alloys
European EN specifications for metal alloys are currentlybeing generated and adopted. These will progressivelysupersede the various national standards for aluminiumalloys, as with other materials. However, it will be someyears before this process is completed and fully imple-mented. EN designations specific to particular alloys, formsand conditions have been included in the above alloy tables(many of these are still at the provisional stage). However,there are several EN specifications which cover the basiccharacteristics of aluminium alloys:
• Chemical composition specifications for wrought alu-minium alloys are now contained in a single CEN spec-ification: EN 573—Aluminium and aluminium alloys—Chemical composition and form of wrought products.
• Temper designations for wrought aluminium alloys arealso contained in a single CEN specification: EN 515—Aluminium and aluminium alloys—Wrought productstemper designations.
• In addition EN 485 now contains conditions for delivery,properties and tolerances for wrought aluminium alloyproducts.
Similar specifications will be issued in the future to covercast aluminium alloys.
Alloy equivalents—Copper Alloys
Composition
Country Designation Zn Sn Pb Be Fe Al Other
41001 USA CDA 110 (UNS C11000) – – – – – – Cu + Ag > 99.9
UK C101 (CW 003A) – – <.005 – – – Cu + Ag > 99.9
F NF Cu a1 A53-100 – – – – – – Cu 99.9 oxygen free. Nominal comp.
G DIN 1708 E-Cu57 Wk.2.0060
– – – – – – Cu 99.95, Ag 0.03, O .005–.040 nominal comp.
41002 USA CDA 170 (UNS C17000) – – – 1.6–1.79 – – Cu > 99.5 Co + Ni > .2 Co + Fe + Ni < .6
UK CB101 (CW101C) – – – 1.7–1 9 – – Ni + Co .05–.4 Other < .5
G CuBe1.7Wk. 2.1245
41003 USA CDA 172 (UNS C17200) – – – 1.8–2.0 – – Cu > 99.5 Co + Ni > .2 Co + Fe + Ni < .6
G Cu Co Be Wk. 2.1285 Co + Fe + Ni < .6
41004 USA CDA194 (UNS C19400)ASTM B465
.05–.2 – <.03 – 2.1–2.6 – P .015–.15 Cu 97.0–97.8 others < .15
41005 USA CDA 195 (UNS C19500) <2 .1–1.0 <.02 – 1.0–2.0 <.02 P .01–.35 Co .3–1.3
41006 USA CDA 230 (UNS C23000) Balance – <.05 – <.03 – Cu 84.0–86.0
ASTM B36: B43: B111:B134: B135:
B359: B395: B543: B587
UK CZ102 (CW502L) Balance – <.l – <.1 – Cu 84.0–86.0 other < .4
G DIN 17660 DIN 17670Wk. 2.0240
Balance <.05 <.05 – <.05 <.02 Cu 84.0–86.0 Mn < .05 Ni < .2 Sb < .01 other .05total other (except Ni) .3
F NFU-Z15 15 Nominal comp.
41007 USA CDA 260 (UNS C26000) Balance – <.07 – <.05 – Cu 68.5–71.5
UK CZ106 (CW505L) Balance – <.05 – <.05 – Cu 68.5–71.5 other < .3
F UZ-30
G DIN 17660 Cu Zu 30 Wk.2.0265
Balance <.05 <.05 – <.05 <.02 Cu 69.0–71.0 Ni < .2 Sb < .01 other .05 total other(except Ni) .3
41008 USA CDA 353 (UNS C35300) Balance – 1.3–2.3 – <1 – Cu 59.0–64.5
UK CZ119 (CW601 N) Balance – 1.0–2.5 – – – Cu 61.0–64.0
G DIN 17660 CuZu 36 Pb1.5 Wk. 2.0331
Balance <.1 .7–2.5 – <.2 <.05 Cu 62.0 –64.0 Mn < .1 Ni < .3 5b < .01 others total .1.Any other except Ni < .5
41009 USA CDA 422 (UNS C42200)ASTM B591
Balance .8–1.4 <.05 – <.05 – Cu 86.0–89.0 P < .35
41010 USA CDA 443 (UNS C44300) Balance .9–1.2 <.07 – <.06 – Cu 70.0–73.0 As .01–.1
ASTM B111: B171:B359: B395:
B432: B543(continued)
Appendix 6: Metal Alloy Comparison Tables 603
(continued)
Composition
Country Designation Zn Sn Pb Be Fe Al Other
G DIN 17660 CuZn 28 SnWk. 2.0470
.9–1.3 <.07 – <.07 – Cu 70.0–72.5 As .02–.035 Mn < .1 Ni < .1 P < .01As + P < .035 other total < .1
41011 USA CDA 510 (UNS C51000) <.3 4.2–5.8 <.05 – <1 – Cu + Sn + P > 99.5 P 03–.35
ASTM B100: B103:BI39: BI59
UK PB102 (CW451 K) – 4.5–6.0 <.02 – – – P .02–.4 others < .2
F NF U-E5P – – – – – – –
G DIN 17662 CuSn 6 Wk.2.1020
<.3 5.5–7.5 <.05 – <.1 – P .01–.4 Ni < .3 other < .2
Alloy equivalents—Copper Alloys
Composition
Country Designation Zn Sn Pb Be Fe Al Other
41012 USA CDA 521 (UNS C52100) ASTM139:159
<.2 7.0–9.0 <.05 – <1 – Cu + Sn + P > 99.5 P 03–.35
UK PB103 (CW452 K) – 6.0–7.5 <.02 – – – P .02–.4 others < .2
UK PB104 (CW459 K) – 7.5–9.0 <.02 – – – P .02–.4 others < .2
F NF U-E7P
G DIN 17662 Cu Sn 8 Wk. 2.1030 <.3 7.5–9.0 <.05 – <.1 – P .01–.4 Ni < .3 other together < .2
41013 USA CDA 619 (UNS C61900) <.8 <.6 <.02 – 3.0–4.5 8.5–10.0 Cu + Ag 83.6–88.5Cu + Fe + AI > 99.5
ASTM B129: B150: B283
UK CA103 <.4 <1 <.05 – Fe + Ni < 4.0 8.8–10.0 Mn < .5 Mg < .05 total impuritiesnot Mn < .5
F NF U-A8
G DIN 17665 Cu Al 8 Wk. 2.0920 <.5 – <.02 – <.5 7.0–9.0 Mn < .8 Ni < .8 Si < .2 othertotal < .3
41014 USA CDA 687 (UNS C68700) Balance – <.07 – <.06 1.8–2.5 Cu + Ag 76.0–79.0 As .02–.06
ASTM B111: SB359: SB395:SB543
UK CZ110 (CW702R) Balance – <.07 – <.06 1.8–2.3 Cu 76.0–78.0 As .02–.06
G DIN 17660 Cu Zn 20 Al Wk. 2.0460 Balance – <.07 – <.07 1.8–2.3 Cu 76.0–79.0 As .02–.035 Mn < .1Ni < .1 P < .01 As + P < .035 othertogether < .1
41015 USA CDA688 (UNS C68800) ASTMB592
21.3–24.1 – <.05 – <.05 3.0–3.8 Co .25–.55
41016 USA CDA 706 (UNS C70600) <1.0 – <.05 – 1.0–1.8 – Ni 9.0–11.0 Mn < 1.0Cu + Ag > 86.5Cu + Fe + Ni > 99.5
ASTM B111: B122: B151: B171:B359: B395: B402:B432: B466:B467: B543: B552
UK CN102 (CW352H) – – <.01 – 1.0–2.0 – Ni 10.0–11.0 Mn .5 1.0 S < .05total impurities < .3 C < .05
F NF Cu Ni 10 Fe Mn – – – – * – Ni 10.0 + Fe + Mn, nominal comp.
G DIN 17664 Cu Ni 10 Fe Wk. 2.0872 <.5 – <.03 – 1.0–1.8 – Ni 9.0–11.0 Mn 0.5–1.0 S < .05total other < .1
41017 USA CDA 725 (UNS C72500) <.5 1.8–2.8 <.05 – <.6 – Ni 8.5–10.5 Mn < .2Cu + Ni + Sn + Co > 99.8
41018 USA CDA 762 (UNS C76200) ASTMB122
Balance – <.1 – <.25 – Ni 11.0–13.5 Mn < .5 Cu 57.0–61.0
UK NS104 (CW403 J) Balance – <.04 – <.25 – Ni 11.0–13.0 Mn .05–.3 Cu 60.0-65.0 total Impurities < .5
G DIN 17663 Cn Ni 12Zn 24 Balance <.2 <.05 – <.3 – Ni 11.0 13.0 Mn < .5 Cu 63.0–66.0other together < .1
(continued)
604 Appendix 6: Metal Alloy Comparison Tables
(continued)
Composition
Country Designation Zn Sn Pb Be Fe Al Other
41019 USA CDA 766 (UNS C76600) FEDQQ-C-585
Balance – <.1 – <.25 – Ni 11.0–13.5 Mn < .5 Cu 55.0–58.0
41020 USA CDA 770 (UNS C77000) Balance – <.l – <.25 – Ni 16.5–19.5 Mn < .5 Cn 53.5–56.5
ASTM B122: B151: B206
UK NS107 (CW410 J) Balance – <.03 – <.3 – Ni 17.0–19.0 Mn .05–.35 Cu54.0–56.0
G DIN 17663 Cu Ni 18 Zn 27 Wk.2.0740
Balance <.2 <.03 – <.3 – Ni 17.0–19.0 Mn < .7 Cu 60.0–63.0
41021 USA CDA 782 (UNS C78200) Balance – 1.5–2.5 – <.35 – Ni 7.0–9.0 Mn < .5 Cu 63.0–67.0
UK NS101 (CW402 J) Balance – 1.0–2.5 – <.4 – Ni 9.0–11.0 Mn .2–.5 Cu 44.0–47.0
G DIN 17663 Cu Ni 10Zn 42 Pb Balance <.3 .5–2.0 – <.5 – Ni 9.0–11.0 Mn < .5 Cu 45.0–48.0others total < .1
Alloy equivalents—Magnesium Alloys
Composition
Country Designation Al Zn Mn Other
61001 USA M1A ASTM B107, B275; SAE 51, 522, 533(UNS M15100)
– – >1.2 Si < .1 Cu < .05 Ni < .01 Ca < .3other < .3
UK 1428:7378 – – – –
G W3501 DIN 1729 Wk. 3.5200 <.05 <.03 1.2–2.0 Si < 1 Cu < 05 Fe < .005 others < .1
61002 USA LA141 ASTM B270; MIL SPEC M-46130(UNS M14142)
<.05 – 1.5 Cu < .05 Fe < .005 Li 12.0–15.0Ni < .005 Si .5–.6 Na < .005
61003 USA AZ31B ASTM B107, B273; FED QQ-M-31,M-40, M44, WW-T-825 (UNS M11311)
2.3–3.5 .6–1.4 >.2 Si < .1 Cu < .03 Ni < .005 Fe < .003Ca < .04 other < .3
UK BS 3370-MAG-S-111; BS 3373-MAG-E-111;DTD 742
2.5–3.5 .6–1.4 .15–.7 Ca < .3 Si < .3 Cu .05 Ni < .005Fe < .005
G DIN 1729 Mg Al 3 Zn Wk. 3.5312 2.5–3.5 .5–1.5 .15–.4 Si < .1 Cu < .1 Fe < .003 Ni < .005Ca < .04 other < .1
61004 USA ZK60A ASTM B91, B107, B275; FED QQ-M-31, M-40, WW-T-825 (UNS M16600)
– 4.8–6.2 – Zr > .45 others < .3
USA ZK61A ASTM B403 6.0 Zr .8 nominal comp.
UK BS 3373-MAG-E-161 5.0 Zr .6 nominal comp.
UK DTD 5041A 5.5 Zr .7 nominal comp.
F G-Z 5 Zr <.02 3.5–5.5 <.15 Zr .4–1.0 Cu < .03 Si < .01Fe < .01 N < 001
G Dl N 1729 Mg Zn 6Zr Wk. 3.5161 4.8–6.2 Zr .45–.8 others < .3
61005 USA AZ61A ASTM B91, B107, B275; FED QQ-M-31, M40, WW-T-825 (UNS M11610)
5.8–7.2 .4–1.5 .15 Si < .1 Cu < .05 Ni < .005 Fe < .005other < .3
UK DTD 259A 5.5–8.5 <1.5 .2–.4 Si < .1 Cu < .1 Ni < .005 Fe < .03
F G-A 7 Z1 6.5–8.5 .5–1.5 >.12 Si < .3 Cu < .05 Ni < .005 Fe < .007others < .3
G DIN 1729 Mg AI6Zn Wk. 3.5612 5.5–7.0 .5–1.5 .15–.4 Si < .1 Cu < .1 Ni < .005 Fe < .03others < .1
61006 USA AZ80A ASTM B91, B107, B275; FED.QQ-M-31, M-40 (UNS M11800)
7.8–9.2 .2–.8 >.12 Si < .1 Cu < .05 Ni < .005 Fe < .005other < .3
UK BS 2L121; BS 2L122 7.5–9.0 .3–1.0 .15–.4 Si < .3 Cu < .15 Ni < .01 Fe < .05Sn < .1 Cu + Si + Fe + Ni < .4
F G-A 7 Z1 SeeAZ61A
G DIN 1729 Mg Al 8 Zn Wk. 3.5812 7.8–9.2 .2–.8 .12–.3 Si < .1 Cu < .05 Ni < .003 other < .3
61007 USA LAZ933—Ballette Mem. Institute 3.0 3.0 – Li 9.0, nominal comp.
61008 USA ZK21A 2.3 Zr .45 nominal comp.
UK BS 3373-MAG-E-151, BS 3374-MAG-P-151,ZW3
3.0 Zr .6 nominal comp.
61009 UK RZ5—Magnesium Elektron 4.0 Zr .7 rare earth 1.2 nominal comp.
Appendix 6: Metal Alloy Comparison Tables 605
References for Alloy Equivalents
BSI Catalogue 1995/96.British Standards Institution
‘Iron and Steel Specifications’, 8th Edition.British Iron and Steel Producers Association, December1994.
‘Unified Numbering System’, 4th Edition.SAE/ASTM 1986
Stahlschüssel, 1977.‘Properties of Aluminium and its Alloys’Aluminium Federation, 2002
‘Buyers Guide to progress on European Standards’Aluminium Federation, UK. February 1996
AFNOR Catalogue, 1996ICS: 77—Métallurgie
ICS: 49—Aéronautique et Espace
‘Work Programme 1995’CEN—European Committee for Standardization, Brussels.ISBN: 92-9097-432-X
MIL-HDBK-5 J: Metallic Materials and Elements forAerospace Vehicle Structures, Vols. 1 and 2.Department of Defense, USA. 2003
‘Metallic Materials Specification Handbook’, 4th EditionRobert B. RossChapman & Hall, 1992, ISBN: 0-412-36940-0
‘Smithells Metals Reference Book’, 8th Edition.2002, Butterworth-Heinemann
ECSS Q-ST-70-71: Data for the Selection of SpaceMaterials.
Alloy equivalents—Miscellaneous Alloys
Country Designation Composition
71001 USA Beryllium S-100C QMV Grade. BrushBeryllium Corp.
BeO 1.2, Be 98.5
71002 USA Beryllium S-200C QMV Grade. BrushBeryllium Corp.
BeO 2.0, Be 98.0
Beryllium SR-200 QMV Grade. BrushBeryllium Corp.
BeO 2.0, Be 98.0 Hot rolled sheet
71003 USA Beryllium S-300C QMV Grade. BrushBeryllium Corp.
BeO 3.0, Be 97.4
71004 USA MP35N Multiphase (UNS R30035) C < .025, Cr 19–21.0, Mo 9–10.5, Ni 33–37, Fe < 1.0, Mn < .15, P < .015, S < .01, Si < .15,Ti < 1.0, Co balance
71005 USA HS25; L-605; Haynes 25 C .05–.15, Cr 19.0–21.0, Ni 9.0–11.0, W 14.0–16.0, Fe < 3.0, Co balance
UK BS 3531/1-4 C .1, Cr 20, Ni 10, W 15, Co balance. Nominal comp.
G Co Cr20 W 15 Ni Wk. 2.4967 C .05–.13, Cr 19.0–21.0, Ni 9.0–11.0, W 14.0–16.0, Fe < 3.0, Si < 1.0, Mn 1.0–2.0, P < .045,S < .03, Co balance
71006 USA HS188—Haynes Alloy (UNS R30188) C .05–.15, Cr 20–24, Ni 20–24, W 13–16, Fe < 3.0, Mn < 1.25, La .03–.15, Si .2–.5, Cobalance.
606 Appendix 6: Metal Alloy Comparison Tables
Alloy equivalents—Titanium Alloys
Composition
Country Designation Al V Cr Other
51001 USA CP Ti (UNS R52250) ASTM B265 C 0.1: H 0.01: Fe 0.2, Commercialpurity Titanium
UK BS TA1: IMI 115: Ti 115: H 0.012: Fe 0.2, Commercial purityTitanium
F AFNOR T35
G Wk. 3.7024
51002 USA 3AI-2.5V (UNS R56320) 2.5–3.5 2.0–3.0 – C < .05: H < .013: Fe < .25: N < .02O < .12 Ti BalanceAMS 4943.4944 ASTM B337
51003 USA 6AI-4V (UNS R56401) 5.5–6.75 3.5–4.5 – C < .1: H < .015: Fe < .4: N < .05O < .2 Ti Balance
AMS 4906: 4911: 4934, 4935:4954:4965:4967ASTM B265, B348: B367: B381:AWS A5-16MIL. SPEC. F83142: T9046: T9047:T81556: T81915
UK BS TA56: 2TA10: 2TA13: 2TA28: 5.5–6.75 3.5–4.5 – H < .025: Fe < .3: O + N < .25 TiBalance
IMI318: Ti 318A
UK DTD5163: 5173: 5303: 5313: 5323 6.1 4.0 – H < .012 nominal comp.
F TA6V 6.0 4.0 – Nominal comp.
G Ti Al 6V 4 Wk. 3.7164 6.0 4.0 – Nominal comp.
AECMA TI-P63
CEN EN 2517PR (TI-P63 alloy: annealed—sheet, strip and plate, a ≤ 100 mm—provisional spec.)
EN 2530PR (TI-P63 alloy: annealed—900 MPa ≤ RM ≤ 1160 MPa—bars, d ≤ 100 mm—provisional spec.)
EN 2531 PR (TI-P63 alloy: annealed—900 MPa ≤ RM ≤ 1160 MPa—forgings, d ≤ 100 mm—provisional spec.)
EN 3310PR (TI-P63 alloy: not heat treated—reference heat treatment—annealed—grade 2 forging stocks, d ≤ 360 mm—provisional spec.)
EN 3311 PR (TI-P63 alloy: annealed—900 MPa ≤ RM ≤ 1160 MPa—bar for machining, d ≤ 150 mm—provisionalspec.)
EN 3312PR (TI-P63 alloy: annealed—900 MPa ≤ RM ≤ 1160 MPa—forgings, d ≤ 150 mm—provisional spec.)
EN 3313PR (TI-P63 alloy: not heat treated- reference heat treatment—solution treated and aged—grade 2 forgingstocks, d ≤ 360 mm—provisional spec.)
EN 3314PR (TI-P63 alloy: solution treated and aged—RM > = 1070 MPa—bar for machining, d ≤ 50 mm—provisionalspec.)
EN 3315PR (TI-P63 alloy: solution treated and aged—RM > = 1070 MPa—forgings, d < = 50 mm—provisional spec.)
EN 3456PR (TI-P63 alloy: annealed—920 MPa ≤ RM ≤ 1180 MPa—sheet and strip, a ≤ 6 mm—provisional spec.)
EN 3457PR (TI-P63 alloy: not heat treated—reference heat treatment—solution treated and aged—grade 2 forgingstock for fasteners, d ≤ 25 mm—provisional spec.)
EN 3458PR (TI-P63 alloy: annealed—900 MPa ≤ RM ≤ 1160 MPa—bar and wire for machined fasteners, d ≤ 25 mm—provisional spec.)
EN 3464PR (TI-P63 alloy: annealed—900 MPa ≤ RM ≤ 1160 MPa—plate, 6 mm ≤ a ≤ 100 mm—provisional spec.)
51004 USA 13V-11Cr-3AI (UNS R58010)AMS4917:4959
2.5–4.0 12.5–14.5 10–12 Fe < 0.35: C 0.05–0.1
AWS A5 MIL SPEC. F-83142: T-9046: T-9047: T-81588
51005 UK IMI 685 6.0 Zr 5.0: Mo 0.5: Si 0.5, nominal comp.
51006 UK IMI 829 5.5 Sn 3.5: Zr 3.0: Nb 1.0: Mo 0.3: Si0.3, nominal comp.
Appendix 6: Metal Alloy Comparison Tables 607
UNS No. Table No.
Carbon steels and alloy steelsG10050 11001
G10060 11002
G10080 11003
G10100 11004
G10110 11005
G10120 11006
G10150 11007
G10160 11008
G10170 11009
G10180 11010
G10190 11011
G10200 11012
G10210 11013
G10220 11014
G10230 11015
G10250 11016
G10260 11017
G10290 11018
G10300 11019
G10350 11020
G10370 11021
G10380 11022
G10390 11023
G10400 11024
G10420 11025
G10430 11026
G10450 11027
G10460 11028
G10490 11029
G10500 11030
G10530 11031
G10550 11032
G10600 11033
G10640 11034
G10650 11035
G10690 11036
G10700 11037
G10740 11038
G10750 11039
G10780 11040
G10800 11041
G10840 11042
G10850 11043
G10860 11044
G10900 11045
G10950 11046
G11080 13001
G11090 13002
G11100 13003
G11160 13004(continued)
(continued)
UNS No. Table No.
G11170 13005
G11180 13006
G11190 13007
G11320 13008
G11370 13009
G11390 13010
G11400 13011
G11410 13012
G11440 13013
G11450 13014
G11460 13015
G12134 13016
G12144 13017
G15130 12001
G15180 12002
G15220 12003
G15240 12004
G15250 12005
G15260 12006
G15270 12007
G15360 12008
G15410 12009
G15470 12010
G15480 12011
G15510 12012
G15520 12013
G15610 12014
G15660 12015
G15720 12016
Low alloy steelsG40120 14001
G40230 14002
G40240 14003
G40270 14004
G40280 14005
G40320 14006
G40370 14007
G40420 14008
G40470 14009
G41180 14010
G41300 14011
G41350 14012
G41370 14013
G41400 14014
G41420 14015
G41450 14016
G41470 14017
G41500 14018
G41610 14019
G43200 14020(continued)
608 Appendix 6: Metal Alloy Comparison Tables
(continued)
UNS No. Table No.
G43400 14021
G46150 14039
G46170 14040
G46200 14041
G46210 14042
G46260 14043
G47180 14022
G47200 14023
G51150 14044
G51200 14045
G51300 14046
G51320 14047
G51350 14048
G51400 14049
G51450 14050
G51470 14051
G51500 14052
G51550 14053
G51600 14054
G51986 14055
G52986 14056
G61180 14057
G61500 14058
G81150 14024
G86150 14025
G86170 14026
G86200 14027
G86220 14028
G86250 14029
G86270 14030
G86300 14031
G86370 14032
G86400 14033
G86420 14034
G86450 14035
G86500 14036
G86550 14037
G86600 14038
Stainless steelsS20100 15001
S20200 15002
S30100 15003
S30200 15004
S30215 15005
S30300 15006
S30323 15007
S30400 15008
S30403 15009
S30500 15010
S30800 15011(continued)
(continued)
UNS No. Table No.
S30900 15012
S31000 15013
S31008 15014
S31400 15015
S31600 15016
S31603 15017
S31700 15018
S32100 15019
S34700 15020
S34800 15021
S38400 15022
S40300 15023
S40500 15024
S41000 15025
S41400 15026
S41600 15027
S41623 15028
S42000 15029
S42020 15030
S42900 15031
S43000 15032
S43020 15033
S43023 15034
S43100 15035
S43400 15036
S43600 15037
S44002 15038
S44003 15039
S44004 15040
S44200 15041
S44600 15042
S50100 15043
S50200 15044
Named steels
J42015 16002
J92200 16013
K08500 16001
K66286 16004
K92820 16015
K92940 16016
K93160 16017
N08020 16003
S13800 16014
S14800 16009
S15500 16008
S15700 16010
S17700 16011
S21900 16018
S35000 16005
S35500 16006(continued)
Appendix 6: Metal Alloy Comparison Tables 609
(continued)
UNS No. Table No.
S36200 16019
S45500 16007
T20811 16012
Nickel alloysN05500 21012
N06002 21002
N06600 21008
N06625 21009
N07001 21016
N07041 21014
N07718 21010
N07750 21011
N08800 21003
N09901 21004
N09902 21013
N10002 21001
N19903 21005
N19907 21006
N19909 21007
Aluminium alloys (wrought)A91050 31001
A91060 31002
A91100 31003
A91145 31004
A91175 31005
A91200 31006
A91230 31007
A91235 31008
A91345 31009
A91350 31010
A92011 31015
A92014 31016
A92017 31017
A92024 31018
A92048 31019
A92124 31023
A92219 31026
A93003 31029
A93004 31030
A93005 31031
A93103 31032
A93105 31033
A94032 31034
A95005 31035
A95050 31036
A95050 31042
A95052 31037
A95056 31038
A95083 31039
A95086 31040(continued)
(continued)
UNS No. Table No.
A95154 31041
A95252 31043
A95254 31044
A95356 31045
A95454 31046
A95456 31047
A95457 31048
A95652 31049
A95657 31050
A96003 31051
A96005 31052
A96053 31053
A96061 31054
A96063 31055
A96066 31056
A96070 31057
A96082 31059
A96101 31060
A96151 31061
A96162 31062
A96201 31063
A96253 31064
A96262 31065
A96351 31066
A96463 31067
A96951 31068
A97001 31069
A97009 31070
A97039 31073
A97049 31074
A97050 31075
A97075 31076
A97079 31077
A97175 31078
A97178 31079
Aluminium alloys (cast)A02950 32001
A03190 32003
A03330 32005
A03550 32007
A03560 32009
A03570 32011
A03590 32013
A03800 32014
A05140 32016
A05180 32017
A05200 32018
A05350 32019
A07070 32020
A07120 32021(continued)
610 Appendix 6: Metal Alloy Comparison Tables
(continued)
UNS No. Table No.
A33550 32008
Copper alloysC11000 41001
C17000 41002
C17200 41003
C19400 41004
C19500 41005
C23000 41006
C26000 41007
C35300 41008
C42200 41009
C44300 41010
C51000 41011
C52100 41012
C61900 41013
C68700 41014
C68800 41015
C70600 41016
C72500 41017(continued)
(continued)
UNS No. Table No.
C76200 41018
C76600 41019
C77000 41020
C78200 41021
Titanium alloysR52250 51001
R56320 51002
R56401 51003
R58010 51004
Magnesium alloysM11311 61003
M11610 61005
M11800 61006
M14142 61002
M15100 61001
M16600 61004
Miscellaneous alloysR30035 71004
R30188 71006
Appendix 6: Metal Alloy Comparison Tables 611
Appendix 7: Variation of Standard Free Energyof Formation of Oxides with Temperature
These are graphs showing how free energy values vary withtemperature. The network is based on work by Ellinghamand Richardson in the 1940s and 1950s and is still veryuseful today (see for instance Ellingham, H.J.T. (1944)J. Soc. Chem. Ind., 63, 125–133). The diagram indicates atany temperature what is thermodynamically possible formetallurgical reactions that are based on either thermalreduction processes or thermal oxidation processes.
At the point of intersection of any two curves the standardfree energy for the chemical reaction is zero and this is thepoint of equilibrium. The diagram can be used to showapproximately whether reduction or oxidation will takeplace.
As an example, below a temperature of about 1600 °C,pure magnesium is expected to reduce aluminium oxide. Attemperatures higher than 1600 °C, when the curve formagnesium oxide is above that of aluminium oxide, onewould expect that pure aluminium would reduce magnesiumoxide to metallic magnesium. The approximate temperatureswhen gases such as carbon monoxide might reduce metaloxides can, in a similar way, be deduced from the variouspoints of graph intersections.
It is possible to determine the partial pressure of oxygenin equilibrium at a given temperature with the couples Fe/FeO, Fe/Fe3O4, Ni/NiO, and the like. The diagrams showsthat up to very high temperatures (>1500 °C) the oxides FeO
and Fe3O4 are more stable than NiO, and that the oxideFe2O4 are more stable than NiO, and that the oxide Fe2O3 isthe least stable of all.
Reduced pressures will enhance most reducing reactionsas will increasing the ratio of hydrogen or carbon monoxidepresent in a gaseous mixture—these effects can also beestimated from intersection points. The techniques aredescribed in books such as Metallurgical Thermochemistry,6th Edition, (1993) by O. Kubaschewski, C. Alcock and P.J. Spencer, (Pergamon, Oxford) and Free Energy of For-mation of Binary Compounds (1971), by T.B. Reed (MITPress, London).
It is important to note that the Ellingham diagrams relateto the equilibrium conditions—they take no account of thekinetics of any oxidation or reduction reaction.
For alloys, it is worth noting that the most easily oxidizedconstituent should be considered when consulting the dia-gram. It is usual to discount elements that have a concen-tration less than about 1 % as they are not able to formcontinuous surface films.
A recent, short but very useful article—Ellingham dia-grams, their Use and Misuse—takes account of several caseexamples where diagrams can be used for trouble shootingduring processes such as heat treatment, brazing and brightannealing (Stratton 2013).
© Springer International Publishing Switzerland 2016B.D. Dunn, Materials and Processes, Springer Praxis Books,DOI 10.1007/978-3-319-23362-8
613
Based on a diagram supplied by the British Iron and Steel Research Association
614 Appendix 7: Variation of Standard Free Energy of Formation of Oxides with Temperature
Appendix 8: Simplied Procedurefor the Management of Materials, Processesand Mechanical Parts—Possible Guidelinesfor a Cubesat or Small University Spacecraft
Flow Chart for M,P and MP Lists
Company Structure Exists
Responsible for company Product Assurance:
Responsible for Materials and Process, Plus Mechanical Parts (eg Materials Manager):
Responsible for Design and Verification:
Selection
Evaluation:Verification of ProcessesValidation of Materials
Qualification of Mechanical PartsCriticality Analysis
Evaluation Necessary
Verification by Similarity
Evaluation:Test Results
Critical
Accept
Add Material, Process or Mechanical Part to:DML, DPL, DMPL
Declared Material List Declared Process List Declared Mech. Parts List
Accept
Accept
Reject New Test or Request for Deviation
Yes
No
RejectNew Selection
Non - Critical
Yes
No
© Springer International Publishing Switzerland 2016B.D. Dunn, Materials and Processes, Springer Praxis Books,DOI 10.1007/978-3-319-23362-8
615
Management of Lists (see Flow Chart)
1. List should be initiated and maintained during the life ofthe project by the Material and Processes (M&P)Manager.
2. Inputs mainly from Design Manager (e.g. engineeringdrawings).
3. Lists need to be reviewed at PDR (they will be incom-plete but may identity critical items) and again at CDR.
4. SuitabiIity of the items on the 3 Iists should be assessedby an independent material and process specialist.
5. Technical criteria for the selection of material willinclude:
(a) Effect of temperature and thermal cycling(b) Effect of vacuum (outgassing of organic materials and
sublimation of metaIs such as cadmium (forbidden))(c) Effect of radiation (not generally an issue except for
solar cell cover glasses, white paints)(d) Corrosion and galvanic compatibility (i.e. high
strength aIuminium alloys need a chemical conver-sion coating that enabIes resistace to surface corro-sion prior to launch and electrical grounding betweenelectronic boxes and structure).
Note:PDR—preliminary design review (usually an in-depth assessment, by an interdependent team of disciplineexperts and managers, that the design and materials/pro-cesses are realistic); CDR—critical design review (to ensurethe spacecraft's designed hardware is ready for launch).
Lay-Out of Lists (see also Appendices 10and 11 for examples)
(a) These can be formatted prior to PDR and Materials aregrouped according to Table 7.A.1
(b) All lists need issue status for configuration control(c) Columns will provide—Unique Item number
Material designation (e.g. commercial or recognisableidentification)International code, e.g. AISI, AA, CDA, etc. (forinstance as listed in Appendix 6)Manufacturers nameSurface finish
Processing parameter (e.g. heat-treatment for metalsand mix ratio/curing time/temp for organic)Use and end locationAny test date (reference to reports, literature, etc.)Last column is for Approval by M&P specialist andprojeet manager who gives final approval.
(d) All acronyms need to be defined(e) Items with a limited life such as two part adhesives,
paints, etc. must be identified under processingparameter.
Evaluation, Procurement, Inspection,Traceability, and Storage
EvaluationSome materials may need to be evaluated for outgassing.
ProcurementSome materials have long lead times (versus the projectschedule); these need to be identified before PDR.
InspectionInspection is needed at “in-coming” to ensure suitability,check materials are “in-life”, damage to surface, castingsmay need to be x-rayed etc.
TraceabilityWhen possible each material and batch should have aunique reference number.
StorageGood controls needed regarding: humidity, cleanliness,refrigeration for certain items, health and safety (regardingtoxic materials), flammable materials.
Mechanical Parts and Process Controls
• The DPL and DMPL will need to be designed in a similarmanner to the DML.
• Exact requirements for DPL and DMPL should be agreedwith the M and P specialist.
• The DMPL needs to list all mechanisms—each should beassessed by the M and P specialist (e.g. that lubricating
616 Appendix 8: Simplified Procedure for the Management of Materials, Processes and Mechanical Parts …
greases and oils to not outgas and contaminate opticalsystems, that rotating parts in vacuum do not cold-weldetc.).
• The DPL should also be reviewed and possibly com-piled by the M and P specialist to ascertain if eachprocess can be considered “non- critical” or “critical”based on previous usage, reliability, inspect ability,possibility to re-work in case of human or materialerrors (Table 7.A.1).
Processes—Controls and PossibleAssessment for Quality
It would be beneficial to review all spacecraft systems andsub-systems with a mind to check if suitable controls arebeing made, and whether some minimal verification ofunusual processes should be Verified:
– Structure, mechanical assembly or welding process,simple corrosion protection
– Black boxes, manufacture, painting, grounding– Harness, crimping to ECSS standard?, wire type (silver
or tin-plated?)– General welding (are materials suitable), bonding,
painting– Pcb assembly methods, repair, controls (ECSS standard?)– Make an attempt to list processes and critical ones may
need laboratory testing on in-line samples.
Need for Access to Space MaterialsLaboratory to Assess Qualityand Suitability for Use in Vacuum
– Microsectioning of welded and crimped joints*– Tensile testing of welds and crimps*– NDT occasionally for welds*– Outgassing tests to ECSS standard (can be done at ded-
icated European labs), needed for a few organic materials(glues, paints, etc.) in vicinity of optical systems (line ofsight to consider condensation). Some laboratoriesoffering testing for outgassing are mentioned on page 40.
*Note—could use local university or industry
Table 7.A.1 Material group numbers
Groupnumber
Description
1 Aluminium and aluminium alloys
2 Copper and copper alloys
3 Nickel and nickel alloys
4 Titanium and titanium alloys
5 Steels
6 Stainless steels
7 Filler metals: welding, brazing soldering
8 Miscellaneous metallic materials
9 Optical materials
10 Adhesives, coatings, vamishes
11 Adhesives tapes
12 Paints an inks
13 Lubricants
14 Potting compounds, sealants, foams
15 Reinforced plastics (including PCBs)
16 Rubbers and elastomers
17 Thermoplastics [e.g non-adhesive tapes and folls(MLI)]
18 Thermoset plastics (including PCBs)
19 Materials aspects of wires and cables
20 Miscellaneous non-metallic materials, e.g ceramics
From ECSS Q-ST-70B
Appendix 8: Simplified Procedure for the Management of Materials, Processes and Mechanical Parts … 617
Appendix 9: Materials and Processes StandardsRelated to Space (Released by ECSS, JAXA andNASA) as of 2015
ECSS-Q-ST-10-04C Critical-item controlECSS-Q-ST-10-09C Nonconformance control systemECSS-Q-ST-20C Rev.1 Quality assuranceECSS-Q-ST-20- Quality and safety assurance for space testcentresECSS-Q-ST-20-08C Storage, handling and transportationof spacecraft hardwareECSS-Q-ST-20-10C Off-the-shelf items utilization in spacesystemsECSS-Q-ST-30 C DependabilityECSS-Q-ST-30-02C Failure modes, effects (and criticality)analysis (FMEA/FMECA)ECSS-Q-ST-30-09C Availability analysisECSS-Q-ST-30-11C Rev.1 Derating—EEE componentsECSS-Q-ST-40C SafetyECSS-Q-ST-40-02C Hazard analysisECSS-Q-ST-40-12C Fault tree analysis—Adoption noticeECSS/IEC 61025ECSS-Q-ST-60 C Rev.2 Electrical, electronic and elec-tromechanical (EEE) componentsECSS-Q-ST-60-02C ASIC and FPGA developmentECSS-Q-ST-60-05C Rev.1 Generic procurement require-ments for hybridsECSS-Q-ST-60-12C Design, selection, procurement anduse of die form monolithic microwave integrated circuits(MMICs)ECSS-Q-ST-60-13C Commercial electrical, electronic andelectromechanical (EEE) componentsECSS-Q-ST-60-14C Re-lifing procedure—EEEcomponentsECSS-Q-ST-60-15C Radiation hardness assurance—EEEcomponentsECSS-Q-ST-70C Rev.1 Materials, mechanical parts andprocessesECSS-Q-ST-70-01C Cleanliness and contamination control
ECSS-Q-ST-70-02C Thermal vacuum outgassing test forthe screening of space materialsECSS-Q-ST-70-03C Black-anodizing of metals with inor-ganic dyesECSS-Q-ST-70-04C Thermal testing for the evaluation ofspace materials, processes, mechanical parts and assembliesECSS-Q-ST-70-05C Detection of organic contaminationsurfaces by infrared spectroscopyECSS-Q-ST-70-06C Particle and UV radiation testing forspace materialsECSS-Q-ST-70-07C Verification and approval of automaticmachine wave solderingECSS-Q-ST-70-08C Manual soldering of high-reliabilityelectrical connectionsECSS-Q-ST-70-09C Measurements of thermo-opticalproperties of thermal control materialsECSS-Q-ST-70-10C Qualification of printed circuit boardsECSS-Q-ST-70-11C Procurement of printed circuit boardsECSS-Q-ST-70-12C Design rules for printed circuit boardsECSS-Q-ST-70-13C Rev.1 Measurements of the peel andpull-off strength of coatings and finishes using pressure-sensitive tapesECSS-Q-ST-70-18C Preparation, assembly and mountingof RF coaxial cablesECSS-Q-ST-70-20C Determination of the susceptibility ofsilver-plated copper wire and cable to "red-plague"corrosionECSS-Q-ST-70-21C Flammability testing for the screeningof space materialsECSS-Q-ST-70-22C Control of limited shelf-life materialsECSS-Q-ST-70-26C Crimping of high-reliability electricalconnectionsECSS-Q-ST-70-28C Repair and modification of printedcircuit board assemblies for space useECSS-Q-ST-70-29C Determination of offgassing productsfrom materials and assembled articles to be used in amanned space vehicle crew compartment
© Springer International Publishing Switzerland 2016B.D. Dunn, Materials and Processes, Springer Praxis Books,DOI 10.1007/978-3-319-23362-8
619
ECSS-Q-ST-70-30C Wire wrapping of high-reliabilityelectrical connectionsECSS-Q-ST-70-31C Application of paints and coatings onspace hardwareECSS-Q-ST-70-36C Material selection for controllingstress-corrosion crackingECSS-Q-ST-70-37C Determination of the susceptibility ofmetals to stress-corrosion crackingECSS-Q-ST-70-38C High-reliability soldering for surface-mount and mixed technologyECSS-Q-ST-70-45C Mechanical testing of metallicmaterialsECSS-Q-ST-70-46C Rev.1 Requirements for manufacturingand procurement of threaded fastenersECSS-Q-ST-70-50C Particles contamination monitoring forspacecraft systems and cleanroomsECSS-Q-ST-70-53C Materials and hardware compatibilitytests for sterilization processesECSS-Q-ST-70-55C Microbial examination of flight hard-ware and cleanroomsECSS-Q-ST-70-56C Vapour phase bioburden reduction forflight hardwareECSS-Q-ST-70-57C Dry heat bioburden reduction for flighthardwareECSS-Q-ST-70-58C Bioburden control of cleanroomsECSS-Q-ST-70-71C Materials, processes and their dataselectionECSS-Q-ST-80C Software product assuranceISO 24113: Space systems—Space debris mitigationrequirementsJAXA-QTS-2120 Wire, Electric, Fluorine Resin/PolyimideInsulatedJAXA-QTS-2140 Printed Wiring Boards, Rigid-FlexibleNASA-HDBK-5010 FRACTURE CONTROL IMPLE-MENTATION HANDBOOK FOR PAYLOADS,EXPERIMENTS, AND SIMILAR HARDWARENASA-HDBK-6024 Spacecraft polymers atomic oxygendurability handbookNASA-HDBK-6025 Guidelines for the specification andcertification of titanium alloys for NASA flight applicationsNASA-HDBK-8719.14 Handbook for limiting orbitaldebris
NASA-HDBK-8739.23 NASA complex electronics hand-book for assurance professionalsNASA-STD-4003 ELECTRICAL BONDING FOR NASALAUNCH VEHICLES, SPACECRAFT, PAYLOADS,AND FLIGHT EQUIPMENTNASA-STD-5001 structural design and test factors of safetyfor spaceflight hardwareNASA-STD-5002 Load analyses of spacecraft and payloadsNASA-STD-5005 Standard for the design and fabrication ofground support equipmentNASA-STD-5006 General fusion welding requirements foraerospace materials used in flight hardwareNASA-STD-5008 Protective coating of carbon steel, stain-less steel, and aluminum on launch structures, facilities, andground support equipmentNASA-STD-5009 Nondestructive evaluation requirementsfor fracture critical metallic componentsNASA-STD-5019 Fracture control requirements for space-flight hardwareNASA-STD-5020 Requirements for threaded fasteningsystems in spaceflight hardwareNASA-STD-6001 Flammability, offgassing, and compati-bility requirements and test proceduresNASA-STD-6008 NASA Fastener procurement, receivinginspection, and storage practices for spaceflight hardwareNASA-STD-6012 Corrosion protection for space flighthardwareNASA-STD-6016 Standard materials and processesrequirements for spacecraftNASA-STD-8719.14 Process for limiting orbital debrisNASA-STD-8719.9 Standard for lifting devices andequipmentNASA-STD-8739.1 Workmanship standard for polymericapplication on electronic assembliesNASA-STD-8739.4 Crimping, interconnecting cables, har-nesses, and wiringNASA-STD-8739.5 Fiber optic terminations, cable assem-blies, and installationNASA-STD-8739.6 Implementation requirements for nasaworkmanship standards (includes requirements for solderedelectrical and electronic assemblies per IPC J-STD-001ES)
620 Appendix 9: Materials and Processes Standards Related to Space (Released by ECSS, JAXA and NASA) as of 2015
Appendix 10: Examples of DeclaredProcess Lists (DPL)
The Processes selected and used on any spacecraft will needto be approved by the end customer. They are compiled bythe “Prime Contractor”. Critical processes are usually eval-uated by Testing “technology samples” for which laboratory
reports are generated: on critical processes are “verificationtested”.1
Common practice is to tabulate all processes according tothe following “Group Numbers”:
Groupnumber
Description
1 Adhesive bonding
2 Composite manufacture
3 Encapsulation/moulding
4 Painting/coating
5 Cleaning
6 Welding/brazing
7 Crimping/stripping/wire wrapping
8 Soldering
9 Surface treatments
10 Plating
11 Machining
12 Forming
13 Heat treatment
14 Special fabrication: processes developedspecifically for the programme
15 Marking
16 Miscellaneous processes
17 Inspection procedures
1Critical processes are often specified by the end customer and willdepend on the service life and operational condition of individualspacecraft (e.g. “manned space vehicles” may have more criticalprocesses). Often the process is considered critical if there are majordifficulties or uncertainties in the manufacturing, assembly, inspectionand testing. The process will also be considered critical if it has provento be difficult to perform by trained operators, and if it has raisedproblems in the past that have not been resolved.
© Springer International Publishing Switzerland 2016B.D. Dunn, Materials and Processes, Springer Praxis Books,DOI 10.1007/978-3-319-23362-8
621
App
endix10
.A.1
Outerspacecompany
Declaredprocesslist
DOC.NO.:DPL
/PIT/3401/OSC
Issue:
3Date:
10/04/14
Page:16
Spacecraft:PITCAIRNSA
T1
Subsystem:
Equipment:
Group
1adhesive
bonding
Item
Process
Specificatio
nR E V
Descriptio
n/Identifi
catio
nUse
Locationcode
User
code
Assoc.
DML
Item
s
C R I T
Approval
Customer
commentsand
approval
Status
C
1.07.00
PON
Preparationof
VESP
ELand
DELRIN
surfaces
priorto
bond
PON
H-
A011
8Bonding
processes
LLMKTRA
IOLACADM
18.018.00
NPS
U:
ROSE
TTA
A
1.018.00
ZTN
Bonding
byconductiv
eresins
with
EPO
TEX
H20
EHR-012.IN
T1
CURE:15
min
at120°C
Shieldingof
SSPA
structure
LLMKHPA
10.013.00
NPS
U:
METRO
6A
1.019.00
ZTN
Screw
lockingwith
SOLITHANE113
Screw
locking
HR-013/INT
1CURE:48
hat
RTor
3hat
65°C
LLMKHPA
10.009.00
NPS
U:
METRO
6A
1.021.01
ZTN
Bonding
with
SOLITHANE
113
HR-411/INT
1CURE:48
hat
RTor
3hat
65°C
Com
ponents
bonding
KSP
A10.009.00
NPS
U:
METRO
6A
1.025.00
ZTN
Bonding
with
ECCOSIL
4952
HR-410/INT
2CURE:18
hat
RTor
3hat
65°C
RFAbsorber
bonding
LLMKHPA
10.069.03
NPS
U:
METRO
6A
12.012.00
16.006.02
1.026.00
ON
Bonding
with
EA9321
PLUS
EA
9210
PRIM
ER
SP4413
SP4414
TC
LLMCHRM
APS
APA
IOLACHRM
10.002.03
A
1.030.00
ON
Preparationof
BSL312
SP8841
CURE:1Hrat
120°C
Insertsand
bondingof
honeycom
b
LLMCHRM
IOLACHRM
10.015.05
A M
1.031.00
CAT
Bonding
with
FOAM
410-1
M-O
-993
8CURE:0
.5hat120°C
+1h
180°C
Splicing
honeycom
bpart
STR
LLMCADM
IOLACADM
10.027.01
NPS
U:
HELIO
SISO
ARIA
NE5
A
1.094.00
PIN
Locking
ofnutsandscrews
PIV/20/2014
3Perm
enentandnon-
perm
anentlocking
ofscrews
andnuts
APS
IAPC
NA
622 Appendix 10: Examples of Declared Process Lists (DPL)
App
endix10
.A.2
Outerspacecompany
Declaredprocesslist
DOC.NO.:DPL
/PIT/340
1/OSC
Issue:
3Date:
10/04/14
Page:61
Spacecraft:PITCAIRNSA
T1
Subsystem:
Equ
ipment:
Group
6welding
/brazing
Item
number
contractor
Process
Specificatio
nR E V
Descriptio
n/identifi
catio
nUse
Location
code
User
code
Assoc.
DML
items
C R I T
App
roval
Customer
comments
and
approv
al
Status
C
6.01
8.00
PNT
Vacuu
mbrazing
PPCPIC
101
1Joiningmetal/or
metallised
ceramic
compo
nents
Thruster
IPPE
IT7.03
8.00
20.051
.03
3.01
1.03
6.00
1.36
6.01
3.15
3.03
6.00
CAwaitin
gvacuum
herm
eticity
testingand
DPA
O O
6.02
0.00
TOT
Filling
tube
welding
SPECWELD
491
Laser
welding
Tub
eon
topDOME
PWSB
TA
3.01
5.01
3.01
5.03
NRPT
OSC
4448
A N
6.02
1.00
TOT
Cellclosure
welding
M.T.U.
1199
7TIG
Welding
Terminal
toDOME
PWSB
TA
3.00
1.01
3.00
1.02
21.017
.01
NRPT
OSC
4521
A N
6.02
2.00
FOB
Brazing
with
VH
950
TBD
Hardbazing
ofCu-
wireof
2.00
40/ano
descrew
1.49
44
IPPE
IT6.00
8.03
7.03
6.02
NO N
6.02
3.00
FOB
Microwelding
FOP
99-22/13
Plasmajet
microwelding
ofHF-RF-CABLE/Cu
wire
IPPE
IT2.00
1.32
19.019
.03
NA N
Appendix 10: Examples of Declared Process Lists (DPL) 623
App
endix10
.A.3
Outerspacecompany
Declaredprocesslist
DOC.NO.:DPL
/PIT/3401/OSC
Issue:
3Date:
10/04/14
Page:99
Spacecraft:PITCAIRNSA
T1
Subsystem:
Equipment:
Group
9spaceconversion
treatm
ent
Item
number
contractor
Process
identifi
catio
nSp
ecificatio
nR E V
Descriptio
n/identifi
catio
nUse
Locationcode
User
code
Assoc.
DML
Item
s
C R I T
Approval
Customer
commentsand
approval
Status
C
9.012.00
XYZ
Anodising
ofTA6V
titanium
alloy
33448/22/4
AProtectio
nRCPR
OMD
FREPF
KOF
FREPF
KTF
RREPR
KPD
FREPF
KIF
FREPF
BOF
RREPR
KIF
4.001.43
21.004.19
21.007.30
21.008.51
NRPT
:XYZ/BOT/FT.236
PSU:TDF
8TVSA
T8
TLC
8
A
POS
Anodising
ofTA6V
titanium
alloy
33448/22/4
AProtectio
nFR
EPF
KLA
FREPF
ISC
FREPA
IT
FREPF
ICA
FREPR
SIR
4.001.43
21.004.19
21.007.30
21.008.51
NPS
U:ECSIN
TE-V
1GIO
TTO
ERS-1
A N
9.013.00
XYZ
Surfacepassivation
62410/99/1
Passivationof
silver
Protectio
nRCPR
OMD
FREPF
KOF
FREPF
KIF
RREPR
KPD
FREPF
KIF
FREPF
BOF
RREPR
KIF
1.029.03
3.005.18
4.007.01
NRPT
:BAB/QT/
81.044
PSU:TVSA
T2
SPLAB
TLC
8
A
POS
Surfacepassivation
44291/20/1
Passivationof
silver
Protectio
nFR
EPF
KLA
FREPF
ISC
FREPF
ICA
FREPR
SIR
3.002.11
1.029.02
1.029.03
1.040.00
1.029.04
NRPT
:BAB/QT/
81.044
PSU:IN
TE.V1
ERS-1
EURECA
EUTE.2
AN
9.014.00
MOM
Anodising
DTD
942
Surfacetreatm
enton
Ti
alloys
Surface
protectio
non
fixings
FREPF
CFK
21.004.21
NMARS-2
AN
9.015.00
LIN
Anodising
ofalum
inium
ALLOY
LIN
.914.2.
rev.1
ASu
pportand
coolingplate
RREPR
ICA
RREPR
IKC
RREPR
KPA
1.017.04
NCLUST
-2AN
9.018.00
POS
Hardanodising
49326/20/1
BTreatmentof
alum
inium
andalum
inium
alloy
Insulatio
nFR
EPF
KLA
FREPF
ISC
FREPF
ICA
FREPR
SIR
1.002.34
1.007.15
1.029.05
NPS
U:IN
TE.V1
GIO
TTO
EURECA
TLC2
AN
9.020.00
POS
Chrom
ate
conversion
coating
40441/20/2
BTreatmentof
alum
inium
andalum
inium
alloy
Protectio
nFR
EPF
KLA
FREPF
ICA
1.002.35
1.002.38
1.007.16
1.007.19
1.029.06
1.040.02
NRPT
:R:
XYZ/BOT/FT
PSU:ECS
INTE.V1
ISSTDF8
FREPF
ISC
FREPR
SIR
FREPA
IT
624 Appendix 10: Examples of Declared Process Lists (DPL)
Appendix 11: Examples of DeclaredMaterials Lists (DMLs)
The materials selected and used on any spacecraft will needto be approved by the end customer. They are compiled bythe “Prime Contractor”.
Critical materials are tested and “Validated”. Dependentupon the criticality of the spacecraft, tests may include:outgassing-under-vacuum, stress corrosion testing,
flammability, etc. The Material Group numbers have beendetailed in Appendix 8.
The contents of the DMLs will depend on the end cus-tomer’s requirements, these may follow ECSS-Q-ST-70 orcan be relaxed in view of the specific contractual require-ments. Further description is given in Sect. 4.2.1.
© Springer International Publishing Switzerland 2016B.D. Dunn, Materials and Processes, Springer Praxis Books,DOI 10.1007/978-3-319-23362-8
625
App
endix11
.A.1
Outerspacecompany
Declaredmateriallist
DOC.NO.:DML/PIT/3466/OSC
Issue:
3Date:
10/04/14
Page:49
Spacecraft:PITCAIRNSA
T1
Subsystem:
Equipment:
Group
2copper
andcopper
alloys
Item
Com
mercial
identifi
catio
nChemical
nature
and
type
ofproductfor
appliedcondition
Procurem
ent
inform
ation
supplies
specificatio
n
Summaryof
processing
parameters
Use
andlocatio
ncode
ENVIR.
code
Size
Approval
Customers
comments
andapproval
Use
Code
RA
TStatus
C
2.021.01
FOK
Brass
40Zn
Cu60/Zn40
QQ-B-626
TIN
plating8A
B00526
AAAA
Mechanicalparts
RREPR
KIC
FREPF
IKC
FREPF
KIC
RCPF
RGU
GS
V3 4
V1
PSU:BSA
TD
Nopure
tinperm
itted
2.022.00
FOK
Brass
38zn
2Pb
CuZn38,2P
bVAR.TUN.SCREW
NRS
VAR.TERMIN
AL
NRS
734.662.E
Goldplating4µm
Copperunderplatin
g5µm
770-82608-AASG
Mechanicalparts:
bondingstud
term
inal,screw
lock
RREPR
KIC
FREPF
IKC
FREPF
KIC
RCPF
RGU
GS
V3 4
V0
PSU:ECSBSA
TEUR
A
2.022.01
MOM
Brass
CZ121
Cu58,
ZN38-39,
Pb3-4
ROD
Aluminium
suppliesBS2874
Silver
plating
Solder
CDP7.10E
CDP7.03
Centerconductor
Low
pass
filter
Probeandtube
FREPF
CFK
FREPS
DIP
PREPR
INF
GS
V3 4
W1
PSU:SP
OT
A N
2.022.02
FOK
Brass
38Zn
2Pb
CuZn38,2P
bVAR.TN.SCREW
NRS
VAR.TERMIN
AL
NRS
734.662.E
SnplatingdeletedAg
plating
8AB
00526AAAA
Mechanicalparts
Bonding
stud,
term
inal,screw
lock
RREPR
KIC
FREPF
IKC
FREPF
KIC
RCPF
RGU
GS
V3 4
V0
PSU:ECSBSA
TEUR
A NTin
nolonger
used
2.023.00
LIN
Copper
CDA
510
CuSn
6ROD
DIN
1756
Pretinning
GZ.1991.209.1
Piece,
Parts
RREPR
KPA
GS
V3 4
W1
PSU:
TELECOM
HISPA
S.IN
T.V11
EUTELS
ECSS
-Q-ST-70-36
A
FREPF
KPA
2.024.00
SINT
Copper
AVIO
METAL
131N
22Electrolytic
surface
coatingSn
andreflow
edMIL-T-107-271
IP5009
Electrical
connectio
nsIPPP
SCU
GS
V3 4
W2
PSU:GIO
TTO
ERS
PINSA
TA M
2.026.00
LIN
Copper
CDA
260
Cu65%
zn35
%TELKRON
CRS-EPT
-6016
Plated
with
Cu
5µm
+Sn
/Pb
EYELET
PCDICU
PCDPK
DU
GS
V3 4
W2
PSU:ISO
AN
2.027.00
FON
Brass
Grommet
with
Spur
Atlantahardware
MS20230
INSE
RT
MLIgrounding
grom
met
plain
IOLAIK
CM
GS
V3
W3
A N
626 Appendix 11: Examples of Declared Materials Lists (DMLs)
App
endix11
.A.2
Outerspacecompany
Declaredmateriallist
DOC:NO.:DML/PIT/3466/OSC
Issue:
3Date:
10/04/14
Page:88
Spacecraft:PITCAIRNSA
T1
Subsystem:
Equipment:
Group
6stainlesssteels
Item
Com
mercial
identifi
catio
nChemical
nature
andtype
ofproductforappl.condition
Procurem
entinform
ation
suppliesspecificatio
nSu
mmaryof
processing
parameters
Use
andlocatio
ncode
ENVIR.
Code
Size
Approval
Customers
commentsand
approval
Use
Code
RA
TStatus
C
6.034.00
FIN
SS2343-08
TIN
GST
AD
A/S
F9967.1
Lockwire
IPPF
VV
GS
E3 4
W1
A N
6.035.00
SMM
AISI304L
LEEJEVA
09-TSL
Passivated
MIL-S-5002
FLO
restrictor
in107series
valve
IPPP
SME
GS
V3 4
W1
RPT
3991-
02099-DPQ
A N
6.036.00
CPP
AISI348
Stainlesssteelsheet
Various
PPC823-170-95911
PPC823-170-95981
Form
edSp
otwelded
Cathode,main
flange
IPPE
ITGS
V4
SCCI
NASA
NASA
-HDBK-527
10119
A N
6.036.01
CPP
AISI348
Stainlesssteel
ROT
PPC8213-170-95921
Machined
Spot
welded
Structural
parts
IPPE
ITGS
V4
W1
SCCI
NASA
NASA
-HDBK-527
10119
A N
6.037.00
BET
Nitriding
steel
BSS1
06D
Plasmanitride
4hat
555°C
ESP
4443
Gear
SADM
GS
V3
W2
?O N
Moredata
required
4
6.038.00
BET
Maraging
steel
Bar
DTD
5212
Plasmanitride
4hat
485°C
ESP
4443
Pinion
SADM
GS
V3 4
W1
?O N
Moredata
required
6.039.00
BET
Corrosion
resistingsteel
Sheet
BSS5
27Washer
SADM
GS
V3 4
W1
A N
6.040.00
BET
Stainless
steel
BSS8
0PA
SSIV
EPS
2089
SADM
GS
V3 4
W2
A N
6.041.00
XIL
AISI304
X8CrNi19/10
MULTISO
URCE
AMS-5513/AMS5639
USE
ASIS
Ballforsealing
IPPF
CU
GS
V3 4
W1
PSU:
OLYMPU
SHIPPA
RMETEO
A
6.042.00
ON
AISI1017
Nickelplated
5to
20µm
Electical
stop
Tooth
APS
APA
GS
V2 4
W2
A N
Appendix 11: Examples of Declared Materials Lists (DMLs) 627
App
endix11
.A.3
Outerspacecompany
Declaredmateriallist
DOC.NO.:DML/PIT/3466/OSC
Page:151
Issue:
3Date:
10/04/14
Spacecraft:PITCAIRNSA
T1
Group
10adhesive,coatings,varnishes
Subsystem:
Equipment:
Item
Com
mercial
identifi
catio
nChemical
nature
and
type
ofproductfor
Appl.condition
Procurem
ent
inform
ation
supplies
specificatio
n
Summaryof
processing
parameters
Use
andlocatio
ncode
ENVIR.
Code
Size
Approval
Customers
comments
andapproval
Use
Code
RA
TStatus
C
10.014.03
MOM
EPO
-TEK
H74
EPO
XresinA/B
twocomponent
electric.conductiv
e
Epoxy
technol.
CDP9.39
MIX
:100pp/
3pp
CURE:2hat
100°C
CDP7.08
Bonding
loopsand
supportsinto
housing/
bondingferrites
RREPR
IWF
FREPF
CFK
FREPS
DIP
TTCSB
DN
GS
V3 4
W1
PSU:O
ECS
TTL
NASA
:NASA
RP
1124
A
10.015.03
CAT
REDUX
312L
Epoxy
resinfilm
CIBA
GEIG
Y1+
D-N
-15
1+D-N
-200
CURE:
90min
at120°C
1+D-P-70
Skinsto
core
bonding
LLMKTRA
GS
GL
V1 3
W3
RFA
:RFW
/KANT-01/CAS
ECSS
-Q-ST-70-01
TVS14
W
10.015.04
CAT
REDUX
312U
L+
REDUX
Epoxy
resinfilm
CIBA
GEIG
Y1+
D-N
-15
CURE:
60min
at120°C
1+D-P-70
Skinsto
core
SKDRKANA
STR
GS
GL
V1 3
W2
RFA
RFW
/KANT-01/CAS
ECSS
-Q-ST-70-01
TVS14
WM
10.015.05
ON
REDUX
312L
Epoxy
resinfilm
CIBA
GEIG
YDSN
.0016
Insertplate
LLMCHRM
IOLACHRM
GS
V3
V2
RPT
:LT33
A
10.015.06
CAT
REDUX
312/P1
12Epoxy
adhesive
film
CIBA
GEIG
Y1+
D-N
-15E
1+D-E-159
CURIN
G:
1h/120°C
1+D-P-70
Structural
bondingin
sandwich
manufacturing
IOLACADM
LLMCADM
GS
V3
W3
RPT
:BOTREP.002
PSU:HELIO
S,ISO
ARIA
NE6
TVS14
A N
10.015.07
ON
REDUX
312/5
Epoxy
resinfilm
CIBA
CEIG
YNT16101/AQEN
NT16102/AQEN
Bonding
UPS
GT
GS
E3
V2
RPT
LT33
ECSS
-Q-ST-70-01
TVS14
A
10.015.08
KOF
REDUX
312L
Epoxy
resinfilm
CIBA
CEIG
YTH5.
917/4/5/6
CURE:
90min
at120°C
TH24.3006
Bonding
ofpanels
SAW
GL
V2 4
A4
RPT
ESA
I668
PSU:ARA
IRAS
OLYMPU
SULYSS
ES
TVS14
A N
10.015.09
ON
REDUX312L
/112
Epoxy
resinplus
prim
erfilm
CIBA
CEIG
YDatasheet/G
ENES
0021-1184/1179
CURE:1hat
120°C
Beam
APS
APA
GS
V2 4
W2
RFA
RFW
/GOT-A
PA/01
PSU:EUT
TVS14
W N
628 Appendix 11: Examples of Declared Materials Lists (DMLs)
Glossary
Acicular alpha A product of nucleation and growth frombeta to the lower-temperature allotrope alpha phase. It mayhave a needlelike appearance in a photomicrograph and mayhave needle, lenticular, or flattened bar morphology in threedimensions. Its typical aspect ratio is about 10:1
Activation The changing of a passive surface of a metal to achemically active state. (Contrast with passivation.)
Age hardening Hardening by ageing, usually after rapidcooling or cold working. (See also ageing.)
Ageing A change in the properties of certain metals andalloys that occurs with time at ambient or moderately ele-vated temperatures after working or a heat treatment (naturalor artificial ageing) or after a cold-working operation (strainageing). The change in properties is often, but not always,due to a phase change (precipitation), but it never involves achange in chemical composition of the metal or alloy
Alloy A substance having metallic properties and beingcomposed of two or more chemical elements of which atleast one is a metal
Alpha–beta structure A microstructure containing α and βas the principal phases at a specific temperature
Alpha case The oxygen-, nitrogen-, or carbon-enriched, α-stabilized surface resulting from elevated temperatureexposure
Analysis The determination of the essential qualities, per-formance, and limitations of an item by cognitive or com-putational methods
Anomaly Any deviation from the expected situation
Assurance All the planned and systematic activitiesimplemented, and demonstrated as needed, to provide ade-quate confidence that an entity will fulfil its requirements
Annealing A generic term denoting a treatment, consistingof heating to, and holding at, a suitable temperature followedby cooling at a suitable rate. It is used primarily to softenmetallic materials, but also to simultaneously producedesired changes in other properties or in microstructure. Thepurpose of such changes may be, but is not confined to:improvement of machinability, facilitation of cold work;improvement of mechanical or electrical properties, and/orincrease in stability of dimensions. When the term is usedwithout qualification, full annealing is implied. Whenapplied only for the relief of stress, the process is properlycalled stress relieving or stress-relief annealing
Assembly A functional subdivision of a component, con-sisting of parts or subassemblies that perform functionsnecessary for the operation of the component as a whole.Examples: regulator assembly, power amplifier assembly,gyro assembly, etc
Assurance All the planned and systematic activitiesimplemented, and demonstrated as needed, to provide ade-quate confidence that an entity will fulfil its requirements
Axial lead Lead wire extending from a component ormodule body along its longitudinal axis
AWG American wire gauge
Basketweave Alpha platelets with or without interleaved βplatelets that occur in colonies in a Widmanstätten structure
Batch That quantity of material that was subjected to unitchemical processing or physical mixing, or both, designed toproduce a product of substantially uniform characteristics
Bifurcated (split) terminal A terminal with a slot or splitopening in which conductors are placed before soldering
Billet (1) A solid, semi-finished round or square productthat has been hot-worked by forging, rolling, or extrusion;
The majority of terms have been compiled from documents issued by ESA, IOM, ISO, NASA and TMS.
© Springer International Publishing Switzerland 2016B.D. Dunn, Materials and Processes, Springer Praxis Books,DOI 10.1007/978-3-319-23362-8
629
usually smaller than a bloom. (2) A general term for wroughtstarting stock used in making forgings or extrusions
Blister Undesirable rounded elevation of the surface of apolymer, whose boundaries may be more or less sharplydefined
Body-centred cubic lattice structure A unit cell whichconsists of atoms arranged at cube corners with one atom atthe centre of the cube
Brazeability The capacity of a metal to be brazed under thefabrication conditions imposed into a specific suitablydesigned structure and to perform satisfactorily in theintended service
Brazing A group of processes that join solid materialstogether by heating them to a suitable temperature and byusing a filler metal having a liquidus above about 450 °C(840 °F) and below the solidus of the base materials. Thefiller metal is distributed between the closely fitted surfacesof the joint by capillary attraction
Bridging A build-up of solder or conformal coatingbetween parts, components leads, and/or base substrateforming an elevated path (see ‘Fillet’)
Brittle Permitting little or no plastic (permanent) deforma-tion prior to fracture
Brittle fracture Separation of a solid accompanied by littleor no macroscopic plastic deformation. Typically, brittlefracture occurs by rapid crack propagation with lessexpenditure of energy than for ductile fracture
Cable Two or more insulated conductors, solid or stranded,of equal length, contained in a common covering; or two ormore insulated conductors, of equal length, twisted ormoulded together without common covering; or one insu-lated conductor with a metallic covering shield or outerconductor (shielded cable or coaxial cable)
Cast or casting Top fabricate an item by pouring moltenmetal into a shaped cavity and permitting the metal tosolidify. A cast can relate to the item or may be a synonymfor heat, that is an identifiable chemistry lot
Catalyst A substance that changes the rate of a chemicalreaction without undergoing permanent change in its com-position; a substance that markedly speeds up the cure of acompound when added in minor quantity as compared to theamount of primary reactants
Certification The act of verifying and documenting thatpersonnel have completed required training and havedemonstrated specified proficiency and have met otherspecified requirements
Chemical vapour deposition (CVD) The precipitation of ametal from a gaseous compound onto a solid or particulatesubstrate
Coarse grains Grains larger than normal for the particularwrought metal or alloy or of a size that produces a surfaceroughening known as orange peel or alligator skin inwrought alloys
Cold flow Movement of insulation (e.g. Teflon) caused bypressure
Cold solder connection A solder connection exhibitingpoor wetting and a greyish, porous appearance due toinsufficient heat, inadequate cleaning before to soldering, orexcessive impurities in the solder
Cold working Deforming metal plastically under condi-tions of temperature and strain rate that induce strain hard-ening. Usually, but not necessarily, conducted at roomtemperature. (Contrast with hot working.)
Cold-worked structure A microstructure resulting fromplastic deformation of a metal or alloy below its recrystal-lization temperature
Colophony A natural resin obtained as the residue afterremoval of turpentine from the oleoresin of the pine tree,consisting mainly of abietic acid and related resin acids, theremainder being resin acid esters
Component A functional subdivision of a system, generallya self-contained combination of assemblies performing afunction necessary for the system’s operation. Examples:power supply, transmitter, gyro package, etc
Conductor A lead, solid or stranded, or printed wiring pathserving as an electrical connection
Configuration Functional and physical characteristics of aproduct as defined in technical documents and achieved inthe product (ISO 10007:1995)
Conformal coating A thin electrically nonconductive pro-tective coating that conforms to the configuration of thecovered assembly
Contact angle The angle enclosed between half-planes,tangent to a liquid surface and a solid–liquid interface at theirintersection. In particular, the contact angle of liquid solder incontact with a solid metal surface. An approximate value forthis may be determined by shadow projection or other means,by measuring after the solder has solidified. Note that thecontact angle is always the angle inside the liquid
Contaminant An impurity or foreign substance present in amaterial that affects one or more properties of the material.
630 Glossary
A contaminant may be either ionic or nonionic. An ionic, orpolar, compound forms free ions when dissolved in water,making the water a more conductive path. A nonionic sub-stance does not form free ions, nor increases the water’sconductivity. Ionic contaminants are usually processingresidue such as flux activators, finger prints, and etching orplating salts
Contractor Supplier in a contractual situation (ISO8402:1994)
Corrective action Action taken to eliminate the causes ofan existing nonconformity, defect, or other undesirable sit-uation in order to prevent recurrence (ISO 8402: 1994)
Corrosion The deterioration of a metal by a chemical orelectrochemical reaction with its environment
Corrosion fatigue Cracking produced by the combinedaction of repeated or fluctuating stress and a corrosiveenvironment at lower stress levels or fewer cycles thanwould be required in the absence of a corrosive environment
Creep Time-dependent strain occurring under stress. Thecreep strain occurring at a diminishing rate is called primary,or transient, creep; that occurring at a minimum and almostconstant rate, secondary, or steady-rate creep; that occurringat an accelerating rate, tertiary creep
Crevice corrosion A type of concentration cell corrosion;corrosion caused by the concentration or depletion of dis-solved salts, metal ions, oxygen, or other gases, and such, increvices or pockets remote from the principal fluid stream,with a resultant building up of differential cells that ulti-mately cause deep pitting. Localized corrosion of a metalsurface at, or immediately adjacent to, an area that is shiel-ded from full exposure to the environment because of closeproximity between the metal and the surface of anothermaterial
Critical item Any item that introduces risk which could beunacceptable to the project and requires specific attention orcontrol in addition to that given to items not so categorized
Cure A chemical reaction that hardens and changes thephysical properties of a material
Deformation A change in the form of a body due to stress,thermal change, change in moisture, or other causes. Mea-sured in units of length
Delamination A separation between plies within a basematerial or any planar separation within a multilayer printedcircuit board (PCB)
Design (1) Set of information which defines the essentialcharacteristics of a product. (2) The process used to generate
the set of information describing the essential characteristicsof a product
Dewetting The condition in a soldered area in which theliquid solder has not adhered intimately, but has receded,characterized by an abrupt boundary between solder andconductor, or solder and terminal/termination area leavingirregularly shaped mounds of solder separated by areascovered with a thin-solder film
Diffusion welding (DFW) A high-temperature, solid-statewelding process that permanently joins faying surfaces bythe simultaneous application of pressure and heat. The pro-cess does not involve macroscopic deformation, melting, norrelative motion of parts. A solid filler metal (diffusion aid)may or may not be inserted between the faying surfaces
Disturbed solder joint Unsatisfactory connection resultingfrom relative motion between the conductor and terminationduring solidification of the solder
Dross Oxide and other contaminants that form on the sur-face of molten solder
Ductility The ability of a material to deform plasticallybefore fracturing. Measured by elongation or reduction ofarea in a tension test, by height of cupping in a cupping test,or by the radius or angle of bend in a bend test. (Contrastwith brittleness; see also plastic deformation.)
Electron beam welding (EBW) A welding process whichproduces coalescence of metals with the heat obtained froma concentrated beam composed primarily of high-velocityelectrons impinging upon the surfaces to be joined
Elongated grain A grain with one principal axis signifi-cantly longer than either of the other two
Elongation A term used in mechanical testing to describethe amount of extension of a test-piece when stressed. Intensile testing, the increase in the gauge length, measuredafter fracture of the specimen within the gauge length, usuallyexpressed as a percentage of the original gauge length
Embrittlement The severe loss of ductility and/or tough-ness of a material, usually a metal or alloy
Encapsulating compound An electrically nonconductivecompound used to completely enclose and fill in voidsbetween electrical components or parts
Environment Conditions in which an item exists or isoperated
Equiaxed structure A polygonal or spheroidalmicrostructural feature having approximately equal dimen-sions in all directions. In alpha–beta titanium alloys, such a
Glossary 631
term commonly refers to a microstructure in which most ofthe minority phase appears spheroidal
Equilibrium A dynamic condition of physical, chemical,mechanical, or atomic balance, where the condition appearsto be one of rest rather than change
Equipment An item designed and built to accomplish aspecified purpose, which can be disassembled and retain itscapabilities after reassembly
Eutectic alloy An alloy of two or more metals that has onedistinct melting point. Eutectic solder is a tin–lead alloycontaining 63 %Sn and 37 %Pb which melts at 183 °C
Excessive solder joint Unsatisfactory solder connectionwherein the solder obscures the configuration of theconnection
Face-centred cubic lattice structure A unit cell whichconsists of atoms arranged at cube corners with one atom atthe centre of each cube face
Failure The termination of the ability of an item to performa required function
Fatigue The phenomenon leading to fracture under repeatedor fluctuating stresses having a maximum value less than thetensile strength of the material. Fatigue fractures are pro-gressive, beginning as minute cracks that grow under theaction of the fluctuating stress
Fatigue failure Failure that occurs when a specimenundergoing fatigue completely fractures into two parts, orhas softened, or been otherwise significantly reduced instiffness by thermal heating or cracking. Fatigue failuregenerally occurs at loads which, if applied statically, wouldproduce little perceptible effect. Fatigue failures are pro-gressive, beginning as minute cracks that grow under theaction of the fluctuating stress
Fault mode The observable effect of the mechanismthrough which the failure occurs, e.g. short, open, fracture,excessive wear
Fillet A smooth concave build-up of material between twosurfaces, e.g. a fillet of solder between a component lead anda solder pad or terminal, or a fillet of conformal coatingmaterial between a component and printed circuit board(PCB)
Filler metal The metal to be added in making a welding,brazed, or soldered joint
Flake Powder of an essentially two-dimensional nature
Flatpack A part with two straight rows of leads that areparallel to the part body
Flux A chemically active compound which, when heated,removes minor surface oxidation
Foil Among many definitions is: a flat-rolled product0.127 mm (0.005 in.), or less, in thickness, regardless ofwidth. (Any flat-rolled product thicker than this dimension isnot considered foil.) Only thickness, not width, is a factor indetermining foil
Forging (1) Plastically deforming metal, usually hot, intodesired shapes with compressive force, with or without dies.(2) Reshaping a billet or ingot by hammering. (3) The processof placing a powder in a container, removing the air from thecontainer, and sealing it. This is followed by conventionalforging of the powder and container to the desired shape
Fracture (1) The irregular surface produced when a pieceof metal is broken. (2) To separate a metal or alloy into twoor more pieces by an applied load
Friction welding A solid-state process in which materialsare welded by the heat obtained from rubbing together sur-faces that are held against each other under pressure
Glass meniscus The glass fillet of a lead seal which occurswhere an external lead leaves the package body
Grounding The connection of two or more areas to thesame potential difference. The space environment can resultin high potential voltage and destructive arcing, most sub-systems are grounded to the structure, but the grounding ofelectronic units is complex and can use a ‘floating ground’concept
Ground segment The hardware and software required tolaunch and control a space vehicle, usually the launcher
Hardness A measure of the resistance of a material tosurface indentation or abrasion; may be thought of as afunction of the stress required to produce some specifiedtype of surface deformation. There is no absolute scale forhardness; therefore, to express hardness quantitatively, eachtype of test has its own scale of arbitrarily defined hardness.Indentation hardness may be measured by Brinell, Knoop,Rockwell, Scleroscope, and Vickers hardness tests
HAZ See heat-affected zone
Heat-affected zone That portion of the base metal whichhas not been melted, but whose mechanical properties ormicrostructure have been altered by the heat of welding,brazing, soldering, or cutting
Heat treatment Heating and cooling a solid metal or alloyin such a way as to obtain desired conditions or properties.Heating for the sole purpose of hot working is excluded fromthe meaning of this definition
632 Glossary
Hermetic seal A seal which protects an enclosed circuitfrom corrosion by preventing the entry of such contaminantsas water vapour
HIP See hot isostatic pressing
Hot isostatic pressing (1) A process for simultaneouslyheating and forming a powder metallurgy compact in whichmetal powder, contained in a sealed flexible mould, is sub-jected to equal pressure from all directions at a temperaturehigh enough for sintering to take place. (2) A process similarto the one explained in (1), but applied to castings in order toclose internal porosity
Hot working Deforming metal plastically at such a tem-perature and strain rate that recrystallization takes placesimultaneously with the deformation, thus avoiding anystrain hardening
HV See Vickers hardness number
Hydride phase For instance, the phase TiHx formed intitanium when the hydrogen content exceeds the solubilitylimit, generally locally due to some special circumstance
Hydrogen embrittlement A condition of low ductility inmetals resulting from the absorption of hydrogen
Immersion cleaning Cleaning where the work is immersedin a liquid solution. Impurities, Undesirable elements orcompounds in a material
Inclusion A particle of foreign material in a metallic matrix.The particle is usually a compound (such as an oxide, sul-phide, or silicate), but may be of any substance that is for-eign to (and essentially insoluble in) the matrix
Ingot A casting of simple shape, suitable for hot working orremelting
Inspection An activity such as measuring, examining,testing, or gauging one or more characteristics of an entityand comparing the results with specified requirements inorder to establish whether conformity is achieved for eachcharacteristic (ISO 8402:1994)
Insufficient solder connection A solder connection char-acterized by incomplete coverage of one or more of themetal surfaces being joined or by incomplete solder fillets
Integrated-circuit component An individually packagedfunctional circuit formed by depositing an active or passiveelectronic element on to a substrate
Intermetallic compound A phase in an alloy system hav-ing a restricted solid solubility range. Nearly all are brittleand of stoichiometric composition
Interstitial element An element with a relatively smallatom which can assume a position in the interstices of a
metal, or metal alloy lattice. Common examples are oxygen,nitrogen, hydrogen, and carbon
Interstitial solid solution A type of solid solution thatsometimes forms in alloy systems having two elements ofwidely different atomic sizes. Elements of small atomic size,such as carbon, hydrogen, oxygen, and nitrogen, often dis-solved in solid metals to form this solid solution. The spacelattice is similar to that of the pure metal, and the atoms ofcarbon, hydrogen, oxygen, and nitrogen occupy the spacesor interstices between the metal atoms
Item Anything which can be individually described andconsidered
Lap joint Joining or fusing of two overlapping metal sur-faces with solder without use of any other mechanicalattachment or support
Liquidus In a constitution or equilibrium diagram, the locusof points representing the temperatures at which the variouscompositions in the system begin to freeze on cooling orfinish melting on heating. (See also solidus.)
Longitudinal direction Usually, the direction parallel tothe direction of working in wrought alloys or the direction ofcrystal growth in directionally solidified or single-crystalcast alloys. Commonly, it corresponds to the direction par-allel to the direction of maximum elongation in a workedmaterial. (See also normal direction and transversedirection.)
Machinability The relative ease of machining a metal
Machining Removing material from a metal part, usuallyusing a cutting tool, and usually using a power-drivenmachine
Macrostructure The structure of metals as revealed bymacroscopic examination of a specimen. The examinationmay be carried out using an as-polished or a polished andetched specimen
Martensite (1) The alpha product resulting from coolingfrom the beta phase region at rates too high to permittransformation by nucleation and growth. Martensite is sat-urated with beta stabilizer. Also called martensitic alpha. (2)A generic term for micro-structures formed by diffusionlessphase transformation in which the parent and product phaseshave a specific crystallographic relationship. Martensite ischaracterized by an acicular pattern in the microstructure inferrous and nonferrous alloys. The amount of high-temper-ature phase that transforms to martensite upon coolingdepends to a large extent on the lowest temperature attained,there being a distinct starting temperature (Ms) and a tem-perature at which the transformation is essentially complete(Mf), which is the martensite finish temperature
Glossary 633
Maintainability The ability of an item under given condi-tions of use, to be retained in, or restored to, a state in whichit can perform a required function, when maintenance isperformed under given conditions and using stated proce-dures and resources (IEC 50:1992)
Material A raw or semi-finished substance or compound, ofspecified characteristics, which is processed to form a part ofa finished product
Matrix The constituent which forms the continuous ordominant phase of a two-phase microstructure
Measling/measles A condition existing in the base laminateof printed-circuit board in the form of discrete white spots or‘crosses’ below the surface of the base laminate, reflecting aseparation of fibres in the glass cloth at the weave intersec-tion. During soldering, may be caused by excessive heat,mechanical stresses, or chemical attack
Mechanical part A piece of hardware which is not elec-trical, electronic, or electromechanical, and which performsa simple (elementary) function or part of a function in such away that it can be evaluated as a whole against expectedperformance requirements and cannot be disassembledwithout destroying this capability
Mechanical properties The properties of a material thatreveal its elastic and inelastic (plastic) behaviour when forceis applied, thereby indicating its suitability for mechanical(load-bearing) applications. Examples are elongation, fatiguelimit, hardness, modulus of elasticity, tensile strength, andyield strength
Melting point The temperature at which a pure metal,compound, or eutectic changes from solid to liquid; thetemperature at which the liquid and the solid are inequilibrium
Mission The specific task, duty, or function defined to beaccomplished by a system
Modulus of elasticity A measure of rigidity or stiffness of ametal; the ratio of stress, below the proportional limit, to thecorresponding strain
Nonconformance Nonfulfilment of a specified requirement(ISO 8402:1994—definition of Nonconformity)
Nonwetting A condition whereby a surface has contactedmolten solder, but the solder has not adhered to all of thesurface; basis metal remains exposed
ODS Oxide dispersion strengthening
Outgassing The release of volatile parts from a substancewhen placed in a vacuum environment
Overageing Ageing under conditions of time and temper-ature greater than those required to obtain maximum changein a certain property. (See ageing.)
Overheated joint An unsatisfactory solder joint, charac-terized by rough solder surface; dull, chalky, grainy, porousor pitted
Oxidation (1) A reaction in which there is an increase invalence resulting from a loss of electrons. (Contrast withreduction.) (2) A corrosion reaction in which the corrodedmetal forms an oxide; usually applied to reaction with a gascontaining elemental oxygen, such as air
Part An element of a component, assembly, or subassemblythat is not normally subjected to further subdivision or dis-assembly without destruction of designed use
Passivation The changing of a chemically active surface ofa metal to a much less reactive state
Performance Those generally quantified aspects of an itemobserved or measured from its operation or function
Pickling Removal of the oxide film on a casting by achemical process; pickling is sometimes used solely to showup defects
Physical properties Properties of a metal or alloy that arerelatively insensitive to structure and can bemeasuredwithoutthe application of force; for example, density, electrical con-ductivity, coefficient of thermal expansion, magnetic perme-ability, heat capacity, and lattice parameter. Does not includechemical reactivity. (Compare with mechanical properties.)
Plastic deformation The permanent (inelastic) distortion ofmetals under applied stresses
Plate A flat-rolled metal product of some minimum thick-ness and width—at times less than 610 mm (24 in). (It isrelatively thick when compared with sheet.)
Plated-through hole A plated-through hole is one formedby a deposition of metal on the inside surface of a throughhole. Also known as a supported hole. The configuration isused to provide additional mechanical strength to the sol-dered termination or to provide an electrical interconnectionon a multilayer PCB
Potting compound An electrically nonconductive com-pound used to partially encapsulate or for a filler betweenparts, conductors, or assemblies
ppm Parts per million
Precipitation (1) Separation of a new phase from solid orliquid solution, usually with changing conditions of time,temperature, and stress. (2) The removing of a metal from a
634 Glossary
solution caused by the addition of a reagent by displacement.(3) The removal of a metal from a gas by displacement
Precipitation hardening Hardening caused by the precip-itation of a constituent from a supersaturated solid solution
Preform An initially pressed compact to be subjected torepressing or forging
Preheat An early stage in the sintering procedure when, in acontinuous furnace, lubricant or binder burnoff occurswithout atmosphere protection prior to actual sintering in theprotective atmosphere of the high heat chamber
Pressure vessel A container which stores pressurized fluidsand: (a) contains stored energy of 19,310 joules or greater,based on the adiabatic expansion of a perfect gas; or (b)contains a gas or liquid which may result in a hazardousevent if released (c) will experience a design limit pressuregreater than 0.69 MPa.
Printed circuit board (PCB) A product resulting from theprocess of selectively etching unwanted copper from one orboth surfaces of a copper-clad insulating substrate to form adesired circuity pattern which is subsequently solder- orgold-plated. Holes may, or may not, be drilled in the board,depending on the intended technique for attachingcomponents
Procedure Specified way to perform an activity
Process Set of interrelated resources and activities whichtransform inputs into outputs
Product The result of activities or processes and mayinclude service, hardware, processed materials, software, ora combination thereof
Product assurance A discipline devoted to the study,planning, and implementation of activities intended toensure that the design, controls, methods, and techniques ina project result in a satisfactory level of quality in a product
Project A unique set of coordinated activities, with definitestarting and finishing points, undertaken by an individual ororganization to meet specific objectives within definedschedule, cost, and performance parameters (BS 6079)
Qualification The process of determining that the product, asdesigned, is capable of meeting all its specified performancerequirements in its operational environment with marginsappropriate for the technologies used and the intendedapplication
Quality The totality of characteristics of an entity that bearon its ability to satisfy stated and implied needs
Quality assurance All the planned and systematic activitiesimplemented within the quality system and demonstrated asneeded, to provide adequate confidence that an entity willfulfil requirements for quality
Quality control Operational techniques and activities thatare used to fulfil requirements for quality
Quenching Rapid cooling. When applicable, the fol-lowing more specific terms should be used: directquenching, fog quenching, hot quenching, interruptedquenching, selective quenching, spray quenching, andtime quenching
Ram direction he side that points in the direction of thespacecraft’s motion. In low earth orbit, it is the sideimpacting/ramming into the rarefied atmosphere that con-tains reactive atomic oxygen (AO, or ATOX)
Recrystallization (1) Formation of new, strain-free grainstructure from the structure existing in cold-worked metal.(2) A change from one crystal structure to another, such asthat occurring upon heating or cooling through criticaltemperature
Reducing atmosphere A chemically active protectiveatmosphere which at elevated temperature will reduce metaloxides to their metallic state. (Reducing atmosphere is arelative term and such an atmosphere may be reducing toone oxide but not to another oxide.)
Reduction in area (1) Commonly, the difference, expressedas a percentage of original area, between the original cross-sectional area of a tensile test specimen and the minimumcross-sectional area measured after complete separation. (2)The difference, expressed as a percentage of original area,between original cross-sectional area and that after strainingthe specimen
Reliability The probability that an item can perform arequired function under given conditions for a given timeinterval
Rem Remainder
Repair Operations performed on a nonconforming article toplace it in usable condition. Repair is distinguished fromrework in that alternate processes rather reprocessing areemployed
Residual stress Stress remaining in a structure or memberas a result of thermal or mechanical treatment or both.Stress arises in fusion welding primarily because the weldmetal contracts on cooling from the solidus to roomtemperature
Glossary 635
Resistance brazing Brazing by resistance heating, the jointbeing part of the electrical circuit
Rework The reprocessing of an article or material that willmake it conform to drawings, specifications, and contract
Risk A quantitative measure of the magnitude of a potentialloss and the probability of incurring that loss
Safety A state in which the risk of harm (to persons) ordamage is limited to an acceptable level
Scaling (1) Forming a thick layer of oxidation products onmetals at high temperature. (2) Depositing water-insolubleconstituents on a metal surface, as in cooling tubes and waterboilers
SCC Stress-corrosion cracking
Sheet A flat-rolled metal product of some maximumthickness and minimum width arbitrarily dependent on thetype of metal. It is thinner than plate and has a width-to-thickness ratio greater than about 50
Shield A metallic sheath surrounding one or more wires,cables, cable assemblies, or a combination of wires andcables that is used to prevent or reduce the transmission ofelectromagnetic energy to or from the enclosed conductors.The shield also includes an insulating jacket that may coverthe metallic sheath
Solder A nonferrous, fusible metallic alloy used to joinmetallic surfaces
Solderability The property of a surface that allows it to bewetted by a molten solder
Solder connection An electrical/mechanical connectionthat employs solder for the joining of two or more metalsurfaces
Solder mask Coating material used to mask or protectselected areas of a pattern from the action of an etchant,solder, or plating
Solder spike A cone-shaped peak or sharp point of solderusually formed by the premature cooling and solidificationof solder on removal of the heat source
Solidification The change in state from liquid to solid oncooling through the melting temperature or melting range
Solid solution A solid crystalline phase containing two ormore chemical species in concentrations that may varybetween limits imposed by phase equilibrium
Solid solution strengthening A mechanism for strength-ening the alloy by dissolved elements in solid solution
Solidus In a constitution or equilibrium diagram, the locusof points representing the temperatures at which various
compositions finish freezing on cooling or begin to melt onheating. (See also liquidus.)
Solution heat treatment A heat treatment in which an alloyis heated to a suitable temperature, held at that temperaturelong enough to cause one or more constituents to enter intosolid solution, then cooled rapidly enough to hold theseconstituents in solution
Specification Document stating requirements
Spot welding Welding of lapped parts in which fusion isconfined to a relatively small circular area. It is generallyresistance welding, but may also be gas tungsten-arc, gasmetal-arc, or submerged-arc welding
Stress The intensity of the internally distributed forces orcomponents of forces that resist a change in the volume orshape of a material that is or has been subjected to externalforces. Stress is expressed in force per unit area and is cal-culated on the basis of the original dimensions of the cross-section of the specimen. Stress can be either direct (tensionor compression) or shear. Usually expressed in megapascals(MPa)
Stress-corrosion cracking Failure of metals by crackingunder combined action of corrosion and stress, residual orapplied. In brazing, the term applies to the cracking ofstressed base metal due to the presence of a liquid filler metal
Stress relief Related to electronic assemblies: the formedportion of a conductor that provides sufficient length tominimize stress between terminations
Stress-relief heat treatment Uniform heating of a structureor a portion thereof to a sufficient temperature to relieve themajor portion of the residual stresses, followed by uniformcooling
Stress relieving Heating to a suitable temperature, holdinglong enough to reduce residual stress, and then cooling slowlyenough to minimize the development of new residual stresses
Striation A fatigue fracture feature often observed in elec-tron micrographs that indicates the position of the crack frontafter each succeeding cycle of stress. The distance betweenstriations indicates the advance of the crack front across thatcrystal during one stress cycle, and a line normal to thestriation indicates the direction of local crack propagation
Substrate The layer of metal underlying a coating,regardless of whether the layer is base metal
Subsystem Set of interdependent elements constituted toachieve a given objective by performing a specified function,but which does not, on its own, satisfy the customer’s need
Supplier An organization that provides a product to thecustomer
636 Glossary
Surface hardening A generic term covering several pro-cesses applicable to a suitable ferrous alloy that produces, byquench hardening only, a surface layer that is harder or morewear resistant than the core
Surface mounting The electrical connection of componentsto the surface of a conductive pattern that does not utilizepart holes
Technology Readiness Level (TRL) Levels 1–9 used todefine the maturity of a technical concept, from basic prin-ciple to mission proven
Temper In nonferrous alloys the hardness and strengthproduced by mechanical or thermal treatment, or both, andcharacterized by a certain structure, mechanical properties,or reduction in area during cold working
Tensile strength In tensile testing, the ratio of maximumload to original cross-sectional area. Also called ultimatestrength
Test A formal process of exercising or putting to trial asystem or item by manual or automatic means to identifydifferences between specified, expected, and actual results
Thermal shunt A device with good heat-dissipation char-acteristics used to conduct heat away from an article beingsoldered
Tinning The coating of a surface with a uniform layer ofsolder
Traceability Ability to trace the history, application, orlocation of an entity by means of recorded identifications
Transverse direction Literally ‘across’. Usually signifyinga direction or plane perpendicular to the direction of work-ing. In rolled plate or sheet, the direction across the width isoften called long transverse, and the direction through thethickness, short transverse
Ultimate strength The maximum stress (tensile, compres-sive, or shear) a material can sustain without fracture,determined by dividing maximum load by the original cross-sectional area of the specimen. Also known as nominalstrength or maximum strength
Unaided eye Normal Snellen 20/20 vision, including eyeglasses required to correct defective vision to 20/20 equiv-alent. Does not include microscopes, eye loupes, or anyother magnifying device
Vacuum melting Melting in a vacuum to prevent contam-ination from air, as well as to remove gases already dis-solved in the metal; the solidification may also be carried outin a vacuum or at low pressure
Verification Confirmation by examination and provision ofobjective evidence that specified requirements have beenfulfilled
Vickers hardness number (HV) A number related to theapplied load and the surface area of the permanent impres-sion made by a square-based pyramidal diamond indenterhaving included face angles of 136°
Viscosity A measure of the resistance of a fluid to flow
Waiver Written authorization to use or release a productwhich does not conform to the specified requirements
Wake The side opposite to the Ram side of a spacecraft. Itfaces away from the spacecraft’s motion
Wave soldering A process wherein printed circuit boardsare brought in contact with the surface of continuouslyflowing and circulating solder
Weave exposure A surface condition of a printed-circuit-board laminate in which the unbroken woven-glass cloth isnot uniformly covered by resin
Weldability A specific or relative measure of the ability ofa material to be welded under a given set of conditions.Implicit in this definition is the ability of the completedweldment to fulfil all service designed into the part
Wetting Flow and adhesion of a liquid to a solid surface,characterized by smooth, even edges, and a low dihedralangle
Wicking A flow of molten solder or cleaning solution bycapillary action. Occurs when joining stranded wire; solderis drawn within the strands, but may not be visible on outersurface of strands. Wicking may also occur within the stress-relief bend of a component lead
Widmanstätten structure A structure characterized by ageometrical pattern resulting from the formation of a newphase along certain crystallographic planes of the parentsolid solution. The orientation of the lattice in the newphase is related crystallographically to the orientation ofthe lattice in the parent phase. The structure was origi-nally observed in meteorites, but is readily produced inmany alloys, such as titanium, by appropriate heattreatment
Wire A thin, flexible, continuous length of metal, usually ofcircular cross-section, and usually produced by drawingthrough a die
Workmanship The physical characteristics relating to thelevel of quality introduced by the manufacturing andassembly activities
Glossary 637
Wrought A metal or alloy which has been deformed plas-tically one or more times and which exhibits little or noevidence of cast structure
Yield point The first stress in a material, usually less thanthe maximum attainable stress, at which an increase in strainoccurs without an increase in stress. Only certain metals
exhibit a yield point. If there is a decrease in stress afteryielding, a distinction may be made between upper andlower yield points
Yield strength The stress at which a material exhibits aspecified deviation from proportionality of stress and strain.An offset of 0.2 % is used for many metals
638 Glossary
References
Adams, D. M. (1994). Failure investigation into HST solar array driveelectronics. ESTEC Metallurgy Report No. 2038 (confidential).
Adile, E., & Dunn, B. D. (1999). Effecto della geometria del raccordodi lega saldante sul comportamento a fatica meccanica di saldaturedi component elettronici a montaggio superficiale. Rivista Italianadella Saldatura,4, 401–412.
Adler, I. (1988). The analysis of extraterrestrial materials. In Chemicalanalysis (Vol. 81). New York: Wiley.
Akinade, K., et al. (1995). Lead-free solder pastes evaluation. Solderingand SMT Journal,20, 50–53.
Allen, J. S., & Jubb, J. E. M. (1991). Dispute resolution—Theincreasing role of the expert. Welding and Metal FabricationJournal, 81–84.
Ambat, R., et al. (2009). Solder flux residues and electrochemicalmigration failures of electronic devices. In Proceedings of Eurocorr2009 (pp. 1–14), paper 8141, Nice, France, September 2009.
AMS 4942C. (1984). Titanium tubing, seamless. Society of Automo-tive Engineers.
AMS International. (1991). Practical applications of residual stresstechnology. In Conference Proceedings, Indianapolis, USA, May15–17.
Anderson, P., & Wiktorowicz, R. (1995). Ozone emissions during arcwelding. Welding and Metal Fabrication Journal, 385–388.
Anderson, M. J., et al. (1995). A post-flight tribological assessment ofthe Hubble Space Telescope solar array mechanism. In Proceedingsof the 6th European Space Mechanisms and Tribology Symposium(pp. 203–210). Zurich, October 4–6 (ESA SP-304).
Anon. (1981). Keys to improved brazing technology. IndustrialHeating Journal, 31.
Anon. (1994). EURECA, the European retrievable carrier, ESA WPP-069.
Anon. (1995). Feasibility study of power generation system with shapememory alloys. New Energy Development Organisation, Tokyo,NEDO-P-9324 (in Japanese).
Anon. (2011). Easy lead—Industry and innovations. Materials World:4–5.
ANS (American National Standard). (1996). Requirements for solderedelectrical and electronic assemblies, J-STD-001B.
Anthony, P. L., & Brown, O. M. (1965). Red plague corrosion.Materials Protection,4(3), 8–18.
Arblaster, J. W. (1996). Thermodynamic properties of the platinummetals. Platinum Metals Review,40, 62–63.
Ashworth, M., & Dunn, B. D. (2015). An investigation into tin whiskergrowth over a 32-year period (to be published).
Asma, C. O., et al. (2010). Infrared thermography measurements onablative thermal protection systems for interplanetary spacevehicles, QIRT Symposium, paper 007, Quebec, Canada, July 27–30.
ASTM D3359. (2010). Standard test methods for measuring adhesionby tape test.
ASTM E595. (2007). Standard test method for total mass loss andCVCM from outgassing in a vacuum environment.
ASTM E835-94A. (1994). Standard method for determining residualstresses by the hole-drilling strain gage method.
ASTM E2089. (2014). Standard practices for ground laboratory atomicoxygen interaction evaluation of materials for space applications.
Athimoolam, M., & Moorthy, T. V. (2012). Polymer nanocompositematerials and shape memory applications—A review. ProcediaEngineering,38, 3399–3408.
Autumn, K., et al. (2000). Adhesive force of a single gecko foot-hair.Nature,405, 681–685.
Babel, H. W., et al. (1994). Understanding and controlling thedegradation of silicone on exposed spacecraft surfaces. In Proceed-ings of the 6th International Symposium on Materials in SpaceEnvironment, ESTEC (pp. 19–26). ESA SP-368.
Bacquias, G. (1982). La formation des ‘whiskers’ en bain d’etain acidebrillant sur un support en maillechort. Oberfläche-Surface,23,194–196.
Ballinger, I. A., & Sims, D. (2003). Development of an EPDMelastomeric material for use in hydrazine propulsion systems. In39th AIAA Propulsion Conference, Huntsville, AL, July 21. AIAA2003-4611.
Banks, B. (2003). Atomic oxygen effects on spacecraft materials,NASA TM-2003-212484.
Banks, D. R., et al. (1990). Sn–Pb–In solder corrosion with watersoluble flux. In ASM 3rd International Electronic Materials andProcessing Conference (pp. 359–364). San Francisco, CA, August20–23.
Banks, S. (1995). Reflow soldering to gold. In Electronic packagingand production (pp. 69–72).
Barber, A. H., Lu, D., & Pugno, N. M. (2015). Extreme strengthobserved in limpet teeth. Journal of the Royal Society Interface,12,20141326.
Barbier, P., & Le Floch, C. (1985). Holography—The NDT ofcomposite structures. In Proceedings of the Third EuropeanSymposium on Spacecraft Materials in Space Environment,Noordwijk, ESA SP-232 (pp. 161–165).
Barbier, C., et al. (1992). ATOX—The ESTEC atomic oxygensimulation facility. Preparing for the Future,2(2), 12–14.
Baumgartner, R. I., & Elvin, J. D. (1995) Lifting body—An innovativeconcept (pp. 95–3531). AIAA publication.
Beal, J. D., et al. (2006). Forming of titanium and titanium alloys (Vol.14B, pp. 656–669). ASM Handbook.
Bergendahl, C. G., & Dunn, B. D. (1984). Evaluation of test equipmentfor the detection of contamination on electronic circuits. ESA STM-234.
© Springer International Publishing Switzerland 2016B.D. Dunn, Materials and Processes, Springer Praxis Books,DOI 10.1007/978-3-319-23362-8
639
Bernard, D. (2007). A practical guide to X-ray inspection criteria andcommon defect analysis. Nordson-Dage Publication.
Bernard, D., & Blish, R. C. (2005). Considerations for minimizingradiation doses to components during X-ray inspection. In Pro-ceedings ofthe 7th Electronic Packaging Technology Conference(EPIC), Singapore, December 7–9.
Bernard, D., & Golubovic, D. (2012). 3D board level X-ray inspectionvia limited angle computer tomography. In SMTA InternationalConference, Orlando, FL, USA, October 14–28.
Berthoud, L. (1994). Micro-impacts on Eureca solar panels. In 6thInternational Symposium on Materials in a Space Environment,Noordwijk, 239–248 (ESA SP 368).
Bester, M. H. (1968). Metallurgical aspects of soldering to gold.Internepcon (pp. 211–231).
Beurs, J., et al. (1987). TEM-in situ deformation of beryllium singlecrystals. Acta Metallurgical,35(9), 2277–2289.
Billot, M., et al. (1982). Ensuring solderability in electronic compo-nents for space applications. Tin and Its Uses,131, 1–3.
Black, J. R. (1969). Electromigration failure modes. Proceedings of theIEEE,57, 1587–1594.
Blackman, B. R. K., et al. (2012). The fracture behaviour of adhesively-bonded composite joints: Effects of rate of test and mode of loading.International Journal of Solids and Structures,49(13), 1434–1452.
Blawert, C., & Srinivasan, P. B. (2010). Plasma electrolytic oxidationtreatment of magnesium alloys. In H. Dong (Ed.), Surface Engi-neering of Light Alloys. Cambridge, UK: Woodhead Publishing Ltd.
Blech, I. A., et al. (1975). Whisker growth in aluminium thin films.Journal of Crystal Growth,32, 161–169.
Borom, M. C., & Pask, J. A. (1966). Role of adherence oxides in thedevelopment of chemical bonding in glass seals. Journal of theAmerican Ceramic Society,49, 1.
Bosma, S. J., et al. (1978). Evaluation of grounding systems. ESA STM204, ESA STM 212 and ESA STM 213.
Bosma, J. (2009). Powerhouse for Quality. ESA Bulletin, May 3–11.Bouilly, J.-M., et al. (2006). Ablative TPS for entry in Mars
atmosphere. In 4th International Planetary Probe Workshop,Pasadena, CA, USA, June 27–30.
Bouilly, J.-M., et al. (2013). Aerofast: Development of innovativethermal protections. In 7th European Workshop on TPS and HotStructures, Noordwijk, The Netherlands, April 8–10.
Bousfield, B. (1988). A systematic approach to sample preparation.Metals and Materials,4(12), 758–761.
Bousfield, B. (1992). Surface preparation and microscopy of materials.Chichester, UK: Wiley.
Bousfield, B. (1997). The metallography of deformation by materialremoval. Praktische Metallographie,34(1), 2–22.
Boustedt, K., & Hedemalm, P. (1995). The Nordic flip-chip project. InProceedings of the 1995 International Flip Chip, Ball grid, TAB andadvanced packaging Symposium (pp. 294–299), San Jose, Ca., USA.
Boving, H. J., & Hintermann, H. E. (1987). Properties and perfor-mances of chemical-vapour-deposited TiC-coated ball-bearingcomponents. Thin Solid Films,153, 253–266.
Bradley, E. (2007). Lead-free electronics: iNEMI projects lead tosuccessful manufacturing, pub. Hoboken, USA: Wiley.
Brandes, E. A. (1992). Smithells metals reference book (7th ed.).Oxford, UK: Butterworth-Heinemann.
Brewer, D. H. (1970). Solders for thick gold plate. Welding ResearchSup (pp. 465–470).
Briscoe, H. M. (1982). Proceedings of the international symposium onspacecraft materials in space environment (pp. 27–34). ESA SP-178.
Brizuela, M., et al. (2009). Tribolab: An experiment on space tribology,in orbit data at the IIS. In Proceedings of the 13th European SpaceMechanisms and Tribology Symposium (ESMATS 2009). Vienna,Austria, September 23–25.
Brooker, M. J., et al. (2001). Applying FSW to the Ariane 5 main motorthrust frame. ESA SP-468 (pp. 507–511).
Brown, B. F. (1972). Stress-corrosion cracking in high-strength steels,and in titanium and aluminium alloys. U.S: Naval ResearchLaboratory.
Brown, B. F. (1977). Stress corrosion cracking control measures, NBSMonograph 156, Ch. 5 (pp. 35–41).
Bruno, G., Dunn, B. D., et al. (2000). Neutron diffraction measure-ments for the determination of residual stress in Ti6Al4V weldedplates. Material Science Forum,347–349, 674–690.
Bruno, G., & Dunn, B. D. (2004). Surface and bulk residual stress inTi6Al4V welded aerospace tanks. Transactions of the ASME,126,284–292.
Brusciotti, F., et al. (2014). MAGNOLYA: Advanced environmentallyfriendly chemical surface treatments for cast magnesium helicoptertransmission alloys preservation. In Eurocorr 2014, Poster, Pisa,Italy, September 8–12.
Bruzzone, P. (1987). Electrical properties of low MP alloys at 4.2 K.Cryogenics,27, 433–436.
Buckley, D. H. (1981). Surface effects in adhesion, friction, wear andlubrication. Amsterdam: Elsevier.
Buis, A., & Schijve, J. (1992). SCC of Al–Li 2090-T83 in artificialseawater. Corrosion,48(11), 898–909.
Bullettti, A., Dunn, B. D., et al. (2012). Investigation of resistivityvariation of PCB laminates due to aging. IEEE Transactions onComponents, Packaging, and Manufacturing Technology,2, 2001–2012.
Bulwith, R. A. (1986). The rough of grainy solder phenomenon.Printed Circuit Assembly,1(1), 14–23.
Burnette, T., & Koschmeider, T. (2003). Solder joint failure analysis—Dye penetrant technique. Advanced Packaging, 12, 25–27.
Burrell, M. C., & Keane, J. J. (1988). Characterization of copper/enamel interfacial reactions during aging. Surface and InterfaceAnalysis,11, 487–496.
Bushmire, D. W. (1977). Resistance increases in gold aluminiuminterconnects with time and temperature. IEEE Transactions onParts, Hybrids and Packaging,PHP-13(2), 152–156.
Bussu, G. (2009). Stress-corrosion cracking (Ch 12, materials andsafety). In G. E. Musgrave (Ed.), Safety Design for Space Systems.Oxford, UK: Elsevier Ltd.
Bussu, G., & Dunn, B. D. (2002). ESA approach to the prevention ofstress corrosion cracking in spacecraft hardware. In Joint ESA-NASA Space Flight Safety Conference. ESA-Estec, Noordwijk, TheNetherlands.
Buttery, M., et al. (2011). Modern self-lubricating composites for spaceapplications: PGM-HT and Sintimid 15 M. In 14th European SpaceMechanisms and Tribology Symposium (ESMATS 2011). Con-stance, Germany, September 28–30.
Cable, N. (1988). Use of pyrotechnics on spacecraft. ESA Bulletin,54,66–71.
Cahn, R. W., & Haasen, P. (1996). Physical metallurgy. Netherlands:Elsevier Science B.V. (see Chapter 29).
Calle, L. M. (2014). NASA’s corrosion lab at KSC: Anticipating,managing, and preventing corrosion. In International Workshop onEnvironmental and Alternate Energy. Kennedy Space Centre,October 21–24.
Calow, C. A. (1974). Are metal matrix composites viable? Practicalmetallic composites 3. Spring Meeting, Institution of Metallurgists.
Campbell, J. E. (1980). Alloys for structural applications at subzerotemperatures.Metals Handbook (9th ed., Vol. 3, pp. 721–772). ASM.
Capineri, L., Dunn, B. D., et al. (2003). Partial discharge testing ofsolder fillets on PCBs in a partial vacuum: new experimental results.IEEE Transactions on Electronics Packaging Manufacturing,26,294–305.
640 References
Case, R. K., et al. (1984). Beryllium—The lightweight contender.Machine Design, 56, 58–61.
Ceccanti, F., et al. (2010). 3-D printing technology for a Moon outpostexploiting lunar soil. 61st International Astronautical Congress(pp. 1–9). Prague, CZ (IAC-10-D3.3.5).
Chaffin, R. J. (1981). Migration of silver from silver-loaded polyimideadhesive chip bonds. In IEEE Transactions on C.H.M. Technology(Vol. 4, No. 2, pp. 214–216). June.
Chaillot, A., et al. (2014). ENEPIG finish: An alternative solution forprinted circuit boards. In Electronic Materials and ProcessesWorkshop (EMPS-5). Estec, Noordwijk, The Netherlands, May20–24.
Charrier, I., Dunn, B. D., et al. (2003). Moisture pick-up and minimumdrying conditions of epoxy and polyimide-glass printed circuitboards. In Brasage/Soldering, International Conference. Brest,France, October 8–10.
Chelladurai, T., et al. (1995). Acoustic emission response of 18 % Nimaraging steel weldment with inserted cracks of varying depth tothickness ratio. Materials Evaluation,53(6), 742–746.
Chen, Y., et al. (2014). A comprehensive investigation of the galvaniccorrosion induced Ag-Al bond degradation in microelectronicpackaging using argon ion milling, SEM, dual beam FIB-SEM,STEM-EDS and TOF-SIMS. 40th ISTFA, Houston, TX, USA,November 9–13.
Chenard, S. (1990). Space: Dirty and dangerous? Space Markets,5,253–256.
Choi, S. J., et al. (1996). A Nitinol-based solar array deploymentmechanism. In 30th Aerospace Mechanisms Symposium, Hampton,Va. (103–118). NASA Conf. Pub. No. 3328. May.
Chollet, L., et al. (1985). Journal of Mater Energy System,6(4), 293–299.Chudnovsky, B. H. (2002). Degradation of power contacts in industrial
atmospheres: silver corrosion and whiskers. In Proceedings of the48th IEEE Holm Conference on Electrical Contacts, Orlando, USA.
Chuvilin, A., et al. (2014). Using TEM to simulate and understand theformation of defects in graphine. In Microscopy and Analysis,November/December 7–10.
Cleave, J. F., & Morton, J. R. (1989). The effects of impurity levels oflithium on aluminium casting alloys. The Foundryman,82, 549–592.
Clemens, H., & Schretter, P. (1996). Microstructure and properties ofGamma-TiAl based alloys. Practical Metallogarphy Journal,33(1),17–35.
Clements, H., et al. (1996). Intermetallic gamma titanium aluminides—Potential candidates for spacecraft structures. ESA Conference onSpacecraft Structures, Materials and Mechanical Testing, Noord-wijk, March 27–29.
Coelho, A. (2009). Comeback for cork. Materials World, 17, 24.Cohen, A. (1995). Copper and copper alloy wires, cables and
conductors. ASTM Standardization News, 23–27.Cole, L. S., et al. (2004). Some recent trends in corrosion science and
their application to conservation. In Proceedings of Metal (NationalMuseum of Australia, Canberra), October 2–16.
Cole, P. T., & Thomas, N. (1989). Ariane IV Spelda-Flight proving byacoustic emission. In Proceedings of AECM-3 (pp. 144–150). Paris,July 17–21.
Colla, V., et al. (2014). Monitoring concepts for a 3-D printer applied tobuild a human outpost on the Moon. In UKSim-AMSS 16thInternational Conference on Computer Modelling and Simulation(pp. 205–210).
Comiskey, J. M. (1979). Materials that make wire for spacecraft use. InAerospace Corporation,Proceedings of Symposium on Wire Appli-cations in Spacecraft, December.
Cooke, R. W. (2010). Red plague control plan (RPCP), the control ofcuprous/cupric oxide corrosion. http://ntrs.nasa.gov/archive/nasa/-casi.ntrs.nasa.gov/20100009723.pdf.
Coope, T. S., et al. (2014). Repeated self-healing of microvascularcarbon fibre reinforced polymer composites. Smart Materials andStructures, 23(11), 115002.
Corocher, G., et al. (2009). Evaluation of different test techniques toassess the effect of environmental exposure on the assembly ofMCGA packages for printed circuit boards. 11th ISMSE Interna-tional Symposium, Aix-en-Provence, France, September 15–18.
Cornec, L., & Clariou, J.-P. (1994). Carbon–magnesium MMC forlight-weight aerospace structures. In Proceedings of the Interna-tional Symposium on Advanced Materials, ESTEC, Noordwijk(pp. 563–567). ESA WPP-070.
Craig, B. (1994). Lead-free solder: An update. Electronic Production,21–25.
Craven, E. (1993). Solderability—The effect on quality manufacturing.Electronic Production, 33–35.
Damskey, R. G. (1988). A satellite structure—Manager’s look atberyllium. The Beryllium Users’ Symposium,Europe.
Danford, M. D. (1994). The corrosion protection of several aluminiumalloys by chromic acid and sulphuric acid anodizing. NASATechnical Paper 3490.
de Salazar, Gomez, et al. (1988). Diffusion bonding of aluminiumalloys using silver coatings. Practice Metals,25, 532–542.
de Rooij, A. (1985). The degradation of metal surfaces by atomicoxygen. In Proceedings of 3rd European Symposium on SpacecraftMaterials in Space Environment (p. 99). ESA SP-232, October.
de Rooij, A. (1989). Bimetallic compatible couples. ESA Jnl.,13, 199–209.
de Rooij, A. (1989b). An approach to long term prediction of theatomic oxygen effect on materials (to be published).
de Rooij, A. (1995a). Atomic oxygen effects on HST-SA1 metals. InHubble Space Telescope Solar Array Workshop (pp. 341–353),Noordwijk, May.
de Rooij, A. (1995b). Space exposure of HST-SA1 tagboards. HubbleSpace Telescope Solar Array Workshop, ESTEC (pp. 449–462).ESA WPP-77.
de Rooij, A., & Collins, D. C. (1995). SLAM investigations on HST-SA1 solar cell welds. In Hubble Space Telescope Workshop—Results from Post-flight Investigations, ESTEC, Noordwijk, May30–31. ESA WPP-77.
de Rooij, A. (2010). Exposure of silver to atomic oxygen. InEUROCORR 2010, Moscow, Russia, September 13–17.
De Rooij, N., et al. (2009). MEMS for Space. IEEE TransducersConference (pp. 17–24). Denver, CO, USA, June 21–25.
Dauphin, J. (1984). Selection and control of materials for spaceapplications. ESA Journal,8(1), 53.
Dauphin, J. (1986). Space materials in Europe. In Proceedings of theSAMPE Conference (pp. 276–290), Las Vegas.
Dauphin, J. (1987). In J. de Bossu (ed.), Atomic oxygen—A low orbitplague. Looking ahead for materials and processes (pp. 345–367).Amsterdam: Elsevier Science Publishers B.V.
Dauphin, J. (1992). Touchstone for success: The materials andprocesses laboratory, ESA BR-52.
Dauphin, J. (1993). Radiation effects in materials. Radiation Physicsand Chemistry,43, 47–56.
Dauphin, J., Dunn, B. D., Judd, M. D., & Levadou, F. (1991). Materialsfor space application. Metals and Materials, 422–430.
David, L. (1995). Radarsat built to resist debris bumps. Space News.David, L. (1996). Incredible shrinking spacecraft. Aerospace America,
20–24.Davy, J. G., & Skold, R. (1985). Computer-aided solderability testing
for receiving inspection. Circuit World, 34–41.DeBold, T. A., & Kosa, T. (2004). Pasivating stainless stell parts.
NASA Technical Briefs, 51–52.Degisher, H. P., & Simancik, F. (1995). Recyclable foamed aluminium
as an alternative to composites. In H. Warlimont (Ed.),
References 641
Environmental Aspects in Materials Research (pp. 137–140). DGMInformations gesellschaft.
Delahais, M. L. L. (1985). Materials and processes in scientificspacecraft. In Proceedings of the 3rd European Symposium inSpacecraft Materials in Space Environment. ESA SP-232, October5–7.
Deloo, P., et al. (1995). HST Solar Array 1 Dynamic Performance. HSTSolar Array Workshop (pp. 89–100). ESTEC, ESA WPP-77, May30–31.
De Marco, M., et al. (2015a). Introduzione ai modi di frattura edall’analisi fracttografica. Parte 1. Rev. It. Della Saldatura, 1, 95–106.
De Marco, M., et al. (2015b). Introduzione ai modi di frattura edall’analisi fracttografica. Parte 2.Rev. It. Della Saldatura, 2, 229–242.
Dittes, M., et al. (2003). The effect of temperature cycling on tinwhisker formation. In Proceedings of the Electronics PackagingTechnology Conference (pp. 183–188).
Didziulis, S. V. (1994). Detergent cleaning of bearings for spacecraftapplications. In Non-Ozone Depleting Chemical Cleaning andLubrication of Space System Mechanical Components for Multi-Year Operations, EPA Workshop, Denver, Co, September 26–27.
Dohle, G. R., et al. (1996). A new bonding technique for microwavedevices. IEEE Transactions on Components Hybrids and Manu-facturing Technology,19(1), 57–63.
Dorsey, J. T., et al. (2012). An efficient and versatile means forassembling and manufacturing systems in space. In AIAA SpaceConference and Exposition, Pasadena, CA, USA, September 11–13.
Downs, K. S., & Hamstad, M. A. (1995). High sensor density A.E.monitoring of graphite/epoxy pressure vessels. In The AmericanSociety for Nondestructive Testing, Proceedings of AECM-4(pp. 13–22). Sundsvall, July 10–14.
Doyle, D. P., et al. (1963). A rapid method for determining thecorrosivity of the atmosphere at any location. Nature,200(4912),1167–1168.
Doyle, E., & Hubbard, P. (2010). Innovation in nitriding. InternationalHeat Treatment and Surface Engineering,4(1), 33–39.
Dricot, F., et al. (1994). Programme for the evaluation of materials usedin low Earth orbit and manned spacecrafts. In 6th InternationalSymposium on Materials in a Space Environment (pp. 293–297).Noordwijk, (ESA SP-368).
Drolshagen, G. (1994). Eureca meteoroid/debris analysis. In EurecaTechnical Report (pp. 507–512). ESA WPP-069.
Drolshagen, G., et al. (1996). Optical survey of micrometeoroid andspace debris impact features on Eureca. Planetary Space Science,44(4), 317–340.
Drogoul, S. (2005). From the failure to the success—The return toflight of the Ariane 5 ECA launcher. In 56th InternationalAstronautical Congress, Session D2.2, IAC-05-D2.2.08, Fukuoka,Japan.
Dunkerton, S., Dunn, B. D., & Fernie, W. B. (2001). Welding andjoining in a space environment. Revista Italiana della Saldatura,Anno LIII,5, 615–627.
Dunn, B. D. (1973). European team visit TRW Systems to learntechniques for the future. TRW Sentinel (p. 6), November 9.
Dunn, B. D. (1975). The properties of near-eutectic tin/lead solderalloys tested between +70 and −60 °C and the use of such alloys inspacecraft electronics, ESA TM-162, September.
Dunn, B. D. (1977). Metallurgical evaluation of tin–lead finishes onPCBs. Transactions of the Institute of Metal Finishing,55, 86–92.
Dunn, B. D. (1978). Examination of new types of solder-splices. ESATM-210, September.
Dunn, B. D. (1979). The resistance of space quality solder joints tothermal fatigue. Circuit World part 1 5(4), 11–17; part 2 6(1), 16–27.
Dunn, B. D. (1980). The Fusing of tin–lead plating on high qualityprinted circuit boards. Transactions of the Institute of MetalFinishing,58, 26–28.
Dunn, B. D. (1982a). Evaluation of various solar cell-to-interconnectorwelds by means of scanning laser acoustic microscopy andmetallography. ESA STM-225, August.
Dunn, B. D. (1982b). Evaluation of various solar cell to interconnectorwelds by SLAM and metallography. ESA STM-225.
Dunn, B. D. (1984). The corrosion properties of Spacelab structuralalloy aluminium 2219-T851, ESA STR-212.
Dunn, B. D. (1987). A laboratory study of tin whisker growth. ESASTR-223.
Dunn, B. D. (1988). Mechanical and electrical characteristics of tinwhiskers. ESA Journal,11 and 12, 1–17.
Dunn, B. D. (2001). Innovative Materials and Processes. SpaceTechnology Innovation Workshop (pp. 21–134). Copenhagen.ESA WPP-197, September 6–7.
Dunn, B. D. (1993). Metallurgical evaluation of steam aged LCCCdevices following solderability testing. Soldering and SMT,15,26–32.
Dunn, B. D. (2008). Workmanship standards and their application onESA projects. Soldering and SMT Journal,20(4), 37–44.
Dunn, B. D. (2008). ESA-approved skills training schools—Electronicassembly techniques, ESA-STR-258, November.
Dunn, B. D. (2012). Guidelines for a creating a lead-free control plan.ESA STM-281, October.
Dunn, B. D., & Bergendahl, C. G. (1987). An evaluation of the solventextraction method for the detection of ionic contamination onsubstrates supporting large surface mounted devices. Brazing andSoldering Journal, 20–27, 32.
Dunn, B. D., & Chandler, C. (1980). The corrosive effect of solderingfluxes and handling on some electronic materials. WeldingJournal,59, 289–307.
Dunn, B. D., & Collins, D. S. (1978). Materials investigation for afailed spacecraft antenna. ESA Journal,2, 223–235.
Dunn, B. D., & Desplat, P. (1994). Evaluation of conformal coatingsfor future spacecraft applications. ESA SP-1173, August.
Dunn, B. D., & Nicholas, D. (1998). Elemental distribution of parts andmaterials making up an electronic box. Circuit World,24(2), 21–23.
Dunn, B. D., & Mozdzen, G. (2014). Tin oxide coverage on tin whiskersurfaces, measurements and implications for electronic circuits.Soldering and SMT Jnl.,26(3), 139–146.
Dunn, B. D., & Papenburg, H. (1986). Material investigation into thedeactivation of catalyst particles for hydrazine decomposition. InProceedings of the Fifteenth Inernational Symposium on SpaceTechnology and Science, Tokyo.
Dunn, B. D., & Stanyon, R. (1997). An Inspection of SpacelabHardware. ESA STR-241, September.
Dunn, B. D., & Steinz, J. A. (1974). Contamination and heating effectsof a hydrazine thruster intended for use on-board the scientificgeostationary satellite. ESRO (ESA) TM-152, April.
Dunn, B. D., et al. (1983). Evaluation of the temperatures attained byelectronic components during various manual soldering operations.Brazing and Soldering Journal,5, 45–53.
Dunn, B. D., et al. (1984). Corrosion of silver plated copper conductors.ESA Journal,8, 307–335.
Durin, C., et al. (1993). System results from FRECOPA. In 3rd PostRetrieval Conference (pp. 1153–1165). Williamsburg, November8–12, NASA Pub. 3275 part 3.
Dzhanibekov, V. A., et al. (1991). Welding equipment for spaceapplications. In Proceedings of the “Welding in Space and theConstruction of Space Vehicles by Welding”, sponsored byAmerican Welding Society, USA and E O Paton Welding Institute,Ukraine, September 1991.
Ecord. G. M. (1972). Apollo Experience report—Pressure vessels.NASA TN-D-6975, September.
ECSS-Q-ST-70. (2014). Materials, mechanical parts and process—Space product assurance requirements.
642 References
Ehmann, D. (1994). Space structures of high precision. Dornier Post,1,15–17.
Elking, M. J., & Hughes, H. E. (1969). Prevention of stress corrosionfailure in semiconductor leads. Bell Telephone Report in: Physics ofFailure in Electronics, 5, 447–495.
Ellis, B. N. (1996). The correlation between short- and long-term SIRtesting. Circuit World,22(2), 49–50.
Ellis, M. B. D. (1996). Fusion welding of aluminium-lithium alloys.Welding and Metal Fabrication Journal. 55–60.
Ellis, M. B. D., & Gittos, M. F. (1995). Tungsten inert gas weldingof titanium and its alloys. Welding and Metal Fabrication Journal,9–12.
Ely, J. K. (1942). Method of making electrical contact members. U.S.patent 2295338 of 8 September.
Engel, L., & Klingele, H. (1981). An Atlas of Metal Damage. London:Carl Hanser Verlag and Wolfe Publishing Ltd.
Engelmaier, W. (1995). Fatigue life of leadless chip carrier solder jointsduring power cycling. In Solder Joint Reliability Workshop Notes,Engelmaier Associates Inc., Mendham, NJ, USA (see also IEEETransactions Components, Hybrids and Manufacturing Technol-ogy6(3), 232–237, 1983).
Engemann, J. (1996). Chancen und moglichkeiten der plasmatechnolo-gie: eine bestandsaufnahme. Vakuum in Forschung und Praxis,1,25–30.
EPA–US Environmental Protection Agency. (1994). Replacing solventcleaning with aqueous cleaning, EPA-600/R-94-131.
Erdman, N., Campbell, R., & Asahina, S. (2006). Argon beam crosssectioning. Advance Materials and Processes, 33–35.
ECSS-E-ST-32-08. (2013). Space engineering: Materials, draft,December.
ECSS-Q-ST selected ECSS standards related to materials and processescan be seen listed in Appendix 9.
ESA PSS-01-401. (1994). EAS fracture control requirements.ESA PSS-01-701. (1994). Data for selection of space materials. Issue 1,
rev. 3.ESA PSS-01-703 A method for black anodising aluminium with
inorganic dyes.ESA PSS-01-708. The manual soldering of high-reliability electronics.ESA PSS-01-721. Application and testing of Cuvertin 306, a black
paint for space use.ESA PSS-01-730. (1981). The wire-wrapping of high-reliability
electrical connections.ESA PSS-01-736. (1981). Material selection for controlling stress-
corrosion cracking of ESA spacecraft and associated equipment, May.ESA PSS-01-737. (1982). Test method for determination of the stress-
corrosion susceptibility of spacecraft structural alloys.ESA PSS-01-738 (Issue 1). (1991). High-reliability soldering for
surface-mount and mixed technology printed.ESA PSS-01-746. (1993). General requirements for threaded fasteners.E. S. K. (1995). Engineered ceramics. Paper from Elektroschmelzwerk
Kempten GmbH, Munich, Germany.Evans, R. (1995). Fume extraction. Electronic Production, 14–16.Eyre, T. S. (1991). Friction and wear control in industry. Metals and
Materials, 143–148.Fang, D., & Berkovits, A. (1995). Fatigue design model based on
damage mechanisms revealed by AE. Trans ASME,117, 200–208.Favre, J.-P., & Raud, C. (1995). Acoustic emission to monitor crack
accumulation in crossply CFRP under mechanical loading or thermalcycling. In The American Society for Nondestructive Testing,Proceedings of AECM-4 (pp. 33–42). Sundsvall, July 10–14.
Feest, A. (1994). Interfacial phenomena in metal-matrix composites.Composites Journal,25(2), 75–86.
Fellas, C. (1982). Anti-static coat for solar arrays. In Proceedings of the3rd European Symposium on Photovoltaic Generators in Space,Bath, UK (p. 305).
Felton, L. E., et al. (1991). Cu-Sn precipitates in solder joints. ScriptaMetallurgica et Materialia,25, 2329–2333.
Feng, W., et al. (2013). Electro-migration model parameters sensitivityanalysis based on Monte Carlo method. Chemical EngineeringTransactions,33, 1093–1098.
Fernie, J. A., & Sturgeon, A. (1992), Joining ceramic materials. Metalsand Materials, 212–217
Fink, M., & Dunn, B. D., et al. (2006). Characterisation of Teflon FEP(Hubble ST and LDEF) following long term exposure to LEO. In 11thInternational Symposium on ISMSE, Collioure, France, June 19–23.
Fink, M., Dunn, B. D., et al. (2008). Measurement of mechanicalproperties of electronic materials down to 4.2K. CryogenicsJournal,48, 497–510.
Fink, M., Semerad, E., & Dunn, B. D., et al. (2009). Electricalresistivity of solders at low temperatures. In 11th InternationalSymposium on ISMSE, Aix-en-Provence, France, September 15–16.
Fink, M., et al. (2009). In Proceedings of the 13th European SpaceMechanisms and Tribology Symposium, Vienna, September 23–25.
Fletcher, P. (1978). Problems encountered with the use of semi-rigidco-axial cable in spacecraft electronics, ESA-STM-209, September.
Flin, E. D. (2005). Soldering in space holds surprises, AerospaceAmerica, 24–25.
Flom, Y. (2005). Brazing in space—Enabling the next frontier. InTheAWS 35th International Brazing and Soldering Symposium,Dallas, TX, USA, April 26.
Flom, Y. (2006). Electron beam brazing of titanium for construction inspace, NASAGSFC. InProceedings of the 3rd International Brazingand Soldering Conference, San Antonio, TX, USA, April 24–26.
Flury, W. (Eds.). (1993). First European conference on space debris.ESA SD-01.
Foster, C. L., et al. (1995). The solar array-induced disturbance of theHST pointing system. NASA Technical Paper3556, May.
Fox, V. C., et al. (1999). The structure of tribologically improvedMoS2—Metal composite coatings and their industrial applications.Surface and Coatings Technology,116–119, 492–497.
Fox, R. M., et al. (2010). Chemistry and technology of lubricants, Ch.13, Liquid lubricants for space applications. Heidelberg: SpringerPublishing.
Frankel, H. E. (1969). Effect of vacuum on materials, ESRO TN-77.Frear, D. R., & Vianco, P. T. (1994). Intermetallic growth rate and
mechanical behaviour of low and high melting temperature solderalloys. Metallurgical and Materials Transactions A,25, 1509–1523.
Frear, D. R., et al. (1993). The mechanics of solder alloy interconnects.New York: Van Nostrand Reinhold.
Gabe, D. R. (1978). Principles of metal surface treatment andprotection. Oxford: Pergamon Press.
Galleo, K. (1995). Assembly with conductive adhesives. IPC TechnicalReview, 20–28.
Galvao, I., et al. (2011). Formation and distribution of brittle structuresin FSW of aluminium and copper: Influence of process parameters.Science and Technology of Welding and Joining,16(8), 681–689.
Gamwell, W. R. (1995). NASA-wide fastener technical interchangemeeting. NASA Conference Publication 3308, July.
Garner, H. R., et al. (1976).Whisker growth from decorative zinc deposits.In Proceedings of the 9th World Congress on Metal Finishing.
Garrison, A., et al. (1995). How much rework is too much. Solderingand SMT Journal,19, 48–51.
George, E., & Pecht, M. (2013). Tin whisker analysis of an automobileengine control unit, microelectronics reliability. http://dx.doi.org/10.1016/j.microrel.2013.07.134.
Gerlach, L. (1995). Co-ordinator. In Proceedings of the Hubble SpaceTelescope Solar Array Workshop, ESA WPP-077.
Ghate, P. B. (1982). Electromigration-induced failures. In IEEE 20thAnnual Proceedings, Reliability Physics (pp. 292–299). San Diego,March–April.
References 643
Ghaffarian, R. (2013). 3D X-ray CT for BGA/CGA workmanship defectdetection. NASA JPL Publication 12-21 12/12.
Ghidini, T., et al. (2008). Stress-corrosion cracking assessment inspacecraft propulsion systems, Technology Evaluation for Envi-ronmental Risk Mitigation (TEERM) Workshop, San Diego, CA,USA, November 18–20.
Gilbrech, J., et al. (2005). Cloud-aerosol LIDAR and IR Pathfindersatellite observation (CALIPSO) spacecraft—Independent technicalassessment, NASA/TM-2005-213231/Version 2.0, March.
Gobbi, S. L., & Zhang, L. (1994). Laser welding for lightweightstructures. In International Symposium on Advanced Materials forLightweight Structures, ESA-ESTEC (pp. 107–113). 22–24 March.ESA WPP-070.
Goddard, D. M. (1984). Report on graphite/magnesium castings. MetalProgress, 49–52.
Golberg, D., et al. (1995). High-temperature shape memory effect.Materials Letters,22, 241–248.
Goldberg, I. B., et al. (1990). Magnetic susceptibility of Inconel alloysat cryogenic temperature. Advances in Cryogenic Engineering(Materials) Journal,36, 755–761.
Goldmann, L. S., et al. (1977). Lead–indium for controlled-collapsechip joining. In Electronic Components Conference (pp. 25–29).
Goldstein, J. I., et al. (1981). Scanning electron microscopy and X-raymicroanalysis. New York: Plenum Press.
Gonnet, L. (1995). Towards an ergonomic design of welding stations.Rivista Italiana della Saldatura,2, 177–183.
Goodhew, P. J. (1988). Modular MSc degrees: A way of keeping upwith materials and techniques. Metals and Materials,4(2), 112.
Grady, M. M., & Wright, I. P. (1996). Space invaders. EuropeanMicroscopy and Analysis Journal 42, June 13–14.
Grande, D. H., et al. (1988). Fibre–matrix bond strength studies.Journal of Materials Science,23, 311–328.
Grant, L. A. (1983) Beryllium sheet materials to satellite structure. In24th Annual AIAA SDM Conference, Lake Tahoe, May.
Greenberg, M. A., et al. (2013). Inhomogenieties of the interfaceproduced by explosive welding. Physics of Metals and Metallog-raphy,113(2), 176–189.
Gregoratti, L., et al. (2013). Large gecko mimetic tapes as new joiningtechnology. In Proceedings of the 12th International Symposium onMaterials in Space Environment, Noordwijk, The Netherlands(ESA SP-705).
Grey, M. W. (1989). Inner layer or post cracking on multilayer printedcircuit boards. Circuit World,15(2), 22–29.
Grilli, R., Dunn, B. D., et al. (2010). Locallised corrosion ofAluminium 2219 alloy exposed to a 3.5 %NaCl solution. CorrosionScience,52, 2855–2866.
Grilli, R., Dunn, B. D., et al. (2010). Localized corrosion on 2219aluminium alloy coated with a titanium based conversion coating.Surface and Interface Analysis Journal,42(6–7), 610–615.
Grinberg, N. M. (1982). The effect of a vacuum on fatigue crackgrowth. International Journal of Fatigue, April 83–95.
Griner, C. S. (1968). Redeposition of vacuum outgassed products.NASA TM X-53 801, MSFC, November.
Gross, J. H. (2011). Mass spectroscopy. Heidelberg: Springer.Gruenbaum, P., & Dursch, H. (1993). Space environment effects on
solar cells: LDEF and other flight test. In 3rd Post RetrievalConference (pp. 1167–1177). Williamsburg, November 8–12,NASA Publication 3275 part 3.
Gruhl, W. (1984). Stress corrosion cracking of high strength aluminiumalloys. Z. Metallkde,75, 819–826.
Gurklis, J. A. (1972). Non-traditional machining of beryllium. Metalsand Ceramics Information Center, Battelle, MCIC, January 3.
Guyenne, T.-D. (1994). Compiler. In 6th International Symposium onMaterials in a Space Environment, ESA SP-368.
Hagge, J. K., & Davis, G. J. (1984). Ageing, solder thickness, andsolder alloy effects on circuit board solderability. IPC TechniqueReview,25(9), 13–23.
Hagge, J. K., & Davis, G. J. (1985). Ageing, solder thickness and soldereffects on circuit board solderability. Circuit World,11(3), 8–15.
Haines, J. E., et al. (1995). HST solar array drive electronics: In-flighthistory and servicing mission activities. In HST Solar ArrayWorkshop, ESTEC, (ESA WPP-77) (pp. 111–118).
Hall, W., & Williams, P. (2007). Processing waste pc boards formaterial recovery. Circuit World,33, 43–50.
Halpin, J. C. (1985). Proceedings of the 31st Annual Technical Meetingof the Meeting of the Institute of Environmental Sciences (pp. 206–218). Las Vegas, April 30–May 2.
Hamacher, H., et al. (1995). Surface erosion in low Earth orbit. InATOXSymposium on Scientific Results on the German SpacelabMission. D-2, Norderney: WPF publication.
Hammesfahr, A. E., et al. (1995). An X-ray mirror assembly based oncarbon fibre technology. Space Technology,14(6), 391–397.
Hamstad, M. A. (1986). A review: Acoustic emission, a tool forcomposite-material studies. Experimental Mechanics, March 7–13.
Hannech, E. B., & Hall, C. R. (1992). Diffusion controlled reactions ingold/solder system. Materials Science and Technology,8, 817–824.
Hansen, M. (1958). Constitution of binary alloys. New York: McGraw-Hill.
Haq Qureshi, A., & Dayton, J. A. (1995). Insulation requirements ofhigh-voltage power systems in future spacecraft. NASA TechnicalPaper No.3520, June.
Harris, P. G., et al. (1992). Stripping and replacement of damagedsolderable coatings. Soldering and SMT Journal,12, 21–26.
Harris, P. G. (1995). Conductive adhesives a critical review of progressto date. Soldering and SMT Journal,20, 19–21.
Haschiguchi, D., et al. (1992). Aluminium–beryllium alloys foraerospace applications. In Proceedings of the International Sympo-sium Advanced Materials for Lightweight Structures (pp. 165–169).ESTEC, March 25–27, ESA SP-336.
Hashemzadeh, M. N. (2005). Study of tin whisker growth and theirmechanical and electrical properties (PhD thesis, LinkopingsUniversitty, Stockholm, 2005), September.
Hashimoto, K., et al. (1991). Flip chip interconnection technology forGLSI packages operated in liquid nitrogen. IEICE Transactions,E74, 2362–2368.
Hassan, J., et al. (2014). Recent advancements in focused ion beamapplications: A review. International Journal of Recent ScientificResearch,5, 123–127.
Hauer, H. (1977). Properties of soft soldered joints on gold plated thinfilm conductors. In International Conference on Thin Film Tech-nology (Vol. 60, pp. 185–190). NTG-Facher.
Haupt, C. W. (1996). Residual stress measurement of titanium weldcertification rings. In 32nd AIAA Joint Propulsion Conference(p. 10). Lake Buena Vista, FL, paper AIAAA-96-2750, July 1–3.
Hawkins, T.W., et al. (2010). Reduced toxicity, high performancemonopropellant at the US air force laboratory. In 4th InternationalAssociation for the Space Safety Conference, Huntsville, AL, May.
Healy, T. J., et al. (1995). Key technologies being developed for RLV(pp. 1995–3608). AIAA paper.
Hegin, B. V. (n.d). Electroplating and black anodisation of aluminium.Galvanische Industrie, Heerde, Holland (trade leaflet).
Hehemann, P. F. (1985). Stress corrosion cracking of stainless steels.Metallurgy Transactions A,16A, 1909–1923.
Heiken, G. H., et al. (1974). Lunar deposits of possible pyroclasticorigin. Geochimica Cosmochimica Acta,38, 1703–1718.
Hemptenmacher, J., et al. (1994). Characteristics of SiC–Fibre/Ti6A14V–Matrix composites by macro-indentation tests. PracticalMetals,31(3), 110–119.
644 References
Hendrich, CH., et al. (2014). Influence of water content in an ADN-based liquid monopropellant on performance characteristics. InSpace propulsion, May 19–22. Germany: Cologne.
Hepp, A. F., et al. (1999). Metal alloy propellants produced from lunarresources. In Symposium Materials in Space—Science, Technologyand Exploration (pp. 39–47). Boston, MA, USA, 29th November–2nd December.
Heltzel, S. (2014). Latent short circuits failure in high-rel pcbs causedby lack of cleanliness of pcb processes and base materials, 5thEMPS Workshop, Estec, Noordwijk, The Netherlands, May 22.
Hinton, Y. L. (1995). Acoustic emission. ASTM Standardization News,36–39.
Hipolite, W. (2015). NASA 3D prints copper rocket engine part. 3DPrinting, April 22.
Heycock, C. T., & Neville, F. H. (1900). Philosophical Transactions ofthe Royal Society, 194A: 201
Hillman, D. D., & Chumbley, L. S. (2006). Characterization of tinoxidation products using sequential electrochemical reductionanalysis (SERA). Soldering and SMT Journal,8(3), 31–41.
Hinch, S. W. (1988). Hand book of surface mount technology. Harlow,England: Longman Scientific and Technical publishers.
Hirnyj, S., & Indacochea, J. E. (2008). Phase transformations inAg70.5Cu26.5Ti3 filler alloy during brazing processes. ChemistryMetals Alloys,1, 323–332.
Holt, T. (1995). New applications in high power laser welding.Weldingand Metal Fabrication Journal, 230–234.
Homes-Siedle, A., & Adams, L. (1993). Handbook of radiation effects.Oxford, UK: Oxford University Press.
Hornbogen, E., & Schemme, K. (1990). Prospects of superlight metalsand their laser surface alloying with ceramic phases. In Proceedingsof the First Thermal Structures Conference (pp. 99–109). Char-lottesville, VA, November 14–16.
Houlberg, K. (1988). Printed circuit boards for surface mounteddevices. Unpublished report.
Hu, S. J., et al. (1995). Gold wire weakening in the thermosonicbonding of the first bond. IEEE Transactions, Components,Hybrids, Manufacturing Technology,18(1), 228–234.
Huang, C.-Y., et al. (2011). Material characterization and failureanalysis for microelectronics assembly processes. Available from:http://www.intechopen.com /books/wide-spectra-of-quality-con-trol/material-characterization-and-failureanalysis-for-microelectron-ics-assembly-processes.
Hummel, R. E. (1994). Electromigration and related IC failuremechanisms. International Materials Review,39, 97–113.
Hunt, C. (2009). Implementation and reliability issues with lead-freesolders. In SMTA International Conference and AIMS Workshop,San Diego, CA, USA, October 4–8.
Hunt, C. (2011). Reliability isues with lead-free, EMPS-2 Workshop,Institut Du Soudure, Paris, France, May 4.
Hunt, C., Dunn, B.D., et al. (2012). Increased shorting in tinwhiskers dueto electric fields and contact pressure. In 6th International Symposiumon Tin Whiskers, Loughborough, UK, November 27–28.
Hutchings, M., & Krawitz, A. D. (1992). Measurements of residual andapplied stress by neutron diffraction. In NATO ASI series E: AppliedScience (Vol. 216). Dordrecht, The Netherlands: Kluwer.
Hutchinson, B., et al. (2004). Whisker growth from tin coatings, IM-2004-708. Stockholm: Swedish Institute for Metal Research.
Hwang, J. S. (2014). Tinwhiskers: capsulization. SMTMagazine, 16–29.Ilyushenko, R. V. (1993). Weldability of commercial aluminium–
lithium alloys. Aluminium-Verlag,69(4), 364–370.Iman, R. L., et al. (1995). Evaluation of low-residue soldering for military
and commercial applicatons: Sandia National Labs Report, June.IEC 60068-2-82. (2007). Environmental testing—Whisker test methods
for electronic and electric components.
Jagt, van der, et al. (1991). Anti-wear/corrosion treatment for austeniticsteel: The Hardcor process. Materials & Design,12(1), 41–46.
IPC-7095A. (2004). Design and assembly process implementation forBGAs, October.
IPC-D-279. (1996). Design guidelines for reliable surface mounttechnology printed board assemblies, July.
IPC-SM-780. (1987). Advanced packaging and interconnection ofelectronic components.
IPC-SM-782. (1992). Surface mount land patterns (configuration anddesign rules).
IPC-TM-650. (2000). Electrochemical migration resistance test.Irving, B. (1992). SCC: Welding’s No. 1 nemesis. Welding Journal,
37–40.Isakowitz, S. J. (1995). International reference guide to space launch
systems (2nd ed.). Waldorf, MD, USA: AIAA publication.Jackson, B. C. (1987). Oxide coatings for bonding multilayer PCBs.
Transactions IMF,65(8), 8–9.Jackson, C. R. (1973). Lead–indium solder alloy won’t embrittle in
gold. Circuit Manufacturing, 40–41.Jacobson, D. M., & Humpston, G. (1992). Diffusion soldering.
Soldering and SMT Journal,10, 27–32.Jacobson, D., & Humpston, G. (1995). Depressing the melting point of
solders and brazes by eutectic alloys. GEC Journal of Research,12(2), 112–121.
Jacobson, D. M., & Sangha, S. (1996). Novel applications of diffusionsoldering. Soldering and SMT Journal,23, 12–15.
Jaggers, C. H. (1993). Exposure of LDEF materials to A.O. In 3rdPost-Retrieval Symposium (pp. 931–941). Williamsburg, November8–12.
Jalbert, M., et al. (1994). Risque saturnin des opérations demicrosoudure en électronique. Archives des maladies profession-nelles et de médecine du travail,55(8), 589–594.
Janu, P., et al. (2009). Electric propulsion pointing hold down andrelease mechanism test results. In Proceedings of the 13th EuropeanSpace Mechanisms and Tribology Symposium (p. 8)., Vienna,Austria, September 23–25
Jaworske, D. A. (2002). Solar selective coating for power application,NASA/TM-2002-211333.
JAXA-QTS selected JAXA standards related to materials and processescan be seen listed in Appendix 9.
Jellison, J. (1986). Evaluation of multilayer printed wiring boards bymetallographic techniques. NASA Reference Publication 1161.
Jenkins, P. P., & Landis, G. A. (1995). A rotating arm using shape-memory alloy. In 29th Aerospace Mechanism Symposium, LeagueCity, Texas (pp. 167–171). May 17–19.
JESD22-A121A. (2008). Measuring whisker growth on tin and tinalloy surface finishes, reaffirmed, May 2014.
Jha, A. K., et al. (1996). Failure of AA 2024 aluminium alloy rivets.Praktische Metallographie,33(5), 264–272.
Jiang, B. L., & Wang, Y. M. (2010). Plasma electronic treatment ofaluminium and titaniumalloys. InH.Dong (Ed.), Surface engineeringof light alloys. Cambridge, UK: Woodhead Publishing Ltd.
Johnson, G. W. (1979). How metallography and SEM analysis can beused in quality control for microelectronics. In Metallography as aQuality Control Tool, Symposium of A.S.M. (pp. 261–278). July 8–9.
Johnson, M.R. (1989). The Galileo High Gain Antenna DeploymentAnomaly. California Institute of Technology, Jet Propulsion Lab-oratory (JPL), Pasadena, CA.
Johnson, R.E., et al. (1966). A case history of titanium stress corrosionin nitrogen tetroxide. American Society Metals
Johnson, R. E. (1973). Apollo experience report—The problem of stresscorrosion cracking. NASA TN D-7111, March.
Johnston, R. L., et al. (1967). Stress corrosion cracking of Ti–6Al–4 Valloy in methanol. NASA TN D-3868, February.
References 645
Kallee, S. W., Nicholes, D., & Thomas W. (2001). Friction stir welding—Invention, innovations and applications. In INALCO 8th Inter-national Conference on Joints in Aluminium, Munich, Germany,March 28–30.
Karavakis, K., & Bertling, S. (2004). Conductive anodic filament(CAF). MEPTEC Report, Quarter 4, 24–27.
Kauffmann, B., & Wolf, D. (2013). Development of low fluorideevolution fluoropolymer wiring materials for aerospace systems. InAerospace Electrical Interconnect Symposium, Tampa, FL, USA,October.
Kelly, M. A., et al. (1984). Using ESCA in failure analysis—Somerecent developments. In Proceedings of ISTFA (pp. 35–39). LosAngeles.
Kephart, A. R., & Hayden, S. Z. (1993). Benefits of thread rollingprocess to the stress corrosion cracking and fatigue resistance ofhigh strength fasteners. In 6th International Symposium on Envi-ronmental Degradation of Materials in Nuclear Power Systems(pp. 1833–1847). San Diego, CA, August 3–5.
Kessowsky, R., et al. (1978). Corrosion of indium based solders. In16th Annual Proceedings, IEEE Reliability Physics (pp. 200–205).
Keusseyan, R. L., & Dilday, J. L. (1993). Electric contact phenomenain conductive adhesive connections. In Proceedings of InternationalSurface Mount Conference and Exposure (pp. 567–571). San Jose,Surface Mount International.
Ki, Young-Won. (1995). Gamma titanium aluminides: their status andfuture. JOM,47(7), 39–41.
Kim, K.-H., et al. (2011). Observation of high resolution microstruc-tures in thermal sprayed coatings and single deposited splats usingion beam milling. Materials Transactions,52(3), 439–446.
King, D. B., et al. (1976). Effects of inclusions on mechanicalproperties of Be. AFML-TR-76-33 Brush Wellman Inc., April.
King, R. L. (1988). Review, opportunities for advanced composites inspacecraft. Advanced Composite Bulletin,2(1), 4–10.
Kingsley, N. (2008). Liquid crystal polymer: Enabling next generationconformal and multilayer electronics. Microwave Journal, 51, 188–200.
Klein, A. J. (1988). Specialty reinforcing fibres. Advanced Compos-ites,3(3), 32–44.
Kleinteich, T., et al. (2015). What’s inside a fishy suction cup?Microscopy and Analysis,17, S8–S10.
Klein Wassink, R. J. (1984). Soldering in electronics. Ayr, Scotland:Electrochemical Publications Ltd.
Klinkrad, H. (2006). Space debris: Models and risk analysis. Heidel-berg, Germany: Springer-Praxis Publishing.
Kocker, H. H., & Stockel, D. (1979). Material transfer of compositecontact materials. In IEEE Transactions on Components, Hybridsand Manufaturing Technoloby (pp. 15–19). CHMT-2.
Kodama, S., et al. (2010). Development of stainless steel weldingwire forgalvanized steel sheet, Rivista Italiana della Saldatura4: 479–486.
Koh, D., et al. (1990). Dermatological hazards in the electronicsindustry. Contact Dermatitis,22, 1–7.
Koh, D., et al. (1994). Skin disorders among hand solders in theelectronics industry. Occupational Medicine,44(1), 24–28.
Kohman, G. T., et al. (1955). Silver migration problem encountered in atelephone exchange. Bell Systems Technology Journal,34, 1115–1147.
Konoza, A., et al. (2012). Analysis of the electronic assembly repairprocess for lead-free parts under combined loading conditions.IEEE Transactions Components Packaging Manufacturing Tech-nology,2(9), 1558–1567.
Koons, H. C., et al. (1980). Spacecraft charging—Results from theSCATHA satellite. Astronautics and Aeronautics,18(11), 44–47.
Korb, G.,&Dunn, B.D. (1996).Assessment of cleaningmethods for spacemechanisms. ESTEC Metallurgy Report No. 2261 (confidential).
Korb, L. J., et al. (1985). A metallurgical analysis of the failure of twoAPU’s of the spacecraft Columbia. In Space Technology Confer-ence Proceedings, Anaheim, USA, September 23–25, 5.1–5.34.
Kostic, A. D. (2011). Lead-free electronics reliability—And update,GEOINT Development Office, Aerospace Corporation, August.
Kleiman, J., Tagawa, M., & Kimoto, Y. (2013). Protection of materialsand structures from the space environment. Heidelberg: Springer.
Kramer, P. A., et al. (1994). The effect of low gold concentrations onthe creep of eutectic tin-lead joints. Metallurgical and MaterialsTransactions A,25, 1249–1257.
Krishnadev, M. R. (1993). The structure and properties of magnesium–
matrix composites. JOM,45(8), 52–54.Krumbein, S. J. (1988). Metallic electromigration phenomena. IEEE
Transactions Components, Hybrids, Manufacturing Technology,CHMT-11, 5–15.
Kuchler, G. (1995). Assessment of flexible substrate integrity. InHubble Space Telescope Solar-Array Workshop, ESTEC, Noord-wijk (pp. 253–256). ESA Pubn WPP-77, May 1995.
Kugel, U., Verain, M., & Zarraga, F. M. (1995). Post-flight investi-gations of the Eureca Mechanisms. In Proceedings of SixthEuropean Space Mechanisms Symposium (pp. 195–201). Zurich,(ESA SP-374).
Labruyère, G., & Urmston, P. (1995). ESA mechanisms requirements.In Proceedings of 6th European Space Mechanism and TribologySymposium, Zurich, (ESA SP-374), October 4–6
Lamouroux, F., et al. (1994). Kinetics and mechanisms of oxidation of2-D woven C/SiC composites: Experimental approach. Journal ofAmerican Ceramic Society,77(8), 2049–2057.
Lansdown, A. R., & Price, A. L. (1986). Materials to resist wear.Oxford: Pergamon Press.
Laporte-Weywada, H. J, et al. (1993). CNES policy about launcherspace debris mitigation—Ariane V application. In Proceedings ofthe First European Conference on Space Debris (pp. 585–589).Darmstadt, Germany, April 5–7, ESA SD-01.
Larsson, A., & Wingborg, N. (2011). Green propellants based onammonium dinitramide (ADN). www.intechopen.com/download/pdf/13473.
Lau, J., & Rice, D. (1985). Solder joint fatigue in SMT: State of the art.Solid State Technology, 91–104.
Le May, I., & Deckker, E. (2009). Reducing the risk of failure by bettertraining and education.EngineeringFailure Analysis,16, 1153–1162.
Lea, C. (1988). Restrictions on the use of chlorofluorocarbons forcleaning soldered PCBs. Circuit World,14(4), 4–12.
Lea, C. (1988). A scientific guide to surface mount technology. Ayr,Scotland: Electrochemical Publications.
Lea, C. (1991). Evidence that visual inspection criteria for solderedjoints are no indication of reliability. Soldering and SMT Journal,9,19–24.
Lee, H. S., et al. (1994). Symptoms in peak expiratory flow rate amongfemale solderers. American Journal of Industrial Medicine,26,613–619.
Lee, S.-B., et al. (2006). Electrochemical migration characteristics ofeutectic SnPb solder alloy in printed circuit board. Thin SolidFilms,504, 294–297.
Lee, Shen, Y. (1990). Thermomechanical properties of polymericmaterials and related stresses. SAMPE Quarterly, 48–51.
Leitao, C. M. A. (2013). Influence of base material plastic propertiesand process parameters on friction stir weldability (Dissertation forPhD, Department of Mechanical Engineering, University of Coim-bra, Portugal, 2013).
Lestrat, D., & Prel, Y. (1994). Evolution et choix technologiques pourles reservoirs des lanceurs Ariane. In Proceedings of the Interna-tional Symposium on Advanced Materials for Lightweight Struc-tures, ESTEC (pp. 441–453). Noordwijk, March (ESA WPP-070).
646 References
Levine, A. S. (Eds.). (1993). Third post-retrieval symposium. NASAConference Publication 3275, Part 3.
Lewis, P. L., Kolody, M., & Curran, J. (2013). Alternative to nitric acidpassivation of stainless steel alloys. NASA Report, casi.nts.02809.
Leyva, I. A., et al. (2011). Space Mission and Design Analysis,Chap. 18—Propulsion Systems, Air Force Research Lab., EdwardsAFB., CA., USA. Report No. AFRL-RZ-ED-BK-2011-057.
Li, H., & Zhang, J. (2014). Preparation of microarc oxidation ceramiclayer on Ti6Al4V titanium alloy and its oxidation resistanceproperty. International Heat Treatment and Surface Engineering,8(2), 51–54.
Li, X., & Dong, H. (2010). Ceramic conversion treatment of titanium-based alloys. In H. Dong (Ed.), Surface engineering of light alloys.Cambridge, UK: Woodhead Publishing Ltd.
Liedke, V., & Dunn, B. D., et al. (2008). Cleaning of siliconecontaminations: development of test methods and assessment ofcleaning efficiency. In 11th ISMSE Symposium, Aix-en-Provence,France, September.
Liejtens, J. (2015). Will the future of hirel components be pure SCOTSor only SCOTTish, IAA-B10-1203. In Deutsches Zentrum fur Luft-und Raumfahrt 10th Symposium, Berlin, Germany, April 20–23.
Lin, C.-C., et al. (2012). High temperature brazing of molybdenum.Advanced Material Research Journal,586, 69–73.
Liu, H., et al. (2014). Laser nanocrystallisation and corrosion behaviorof electroless Ni-W-P coating with high phosphorous content.Transactions IMF,92(4), 212–217.
Liu, J., et al. (1996). Development of flip-chip joining technology.Circuit World,22(2), 19–24.
Liu, X., & Lu, G.-Q. (2003). Effects of solder joint shape and height onthermal fatigue lifetime. IEEE Transactions on Components andPackaging Technologies26(2): 445–465.
Lobley, G. R. (1990). Soldering problems on printed circuit boards.Practice Metals,27, 627–631.
Lucas, J. P., & Zhou, J. (1993) The effects of sorbed moisture on resin–matrix composites. J.O.M., December issue, 37–40.
Lucas, W. (1995). Electromagnetic emission from TIG weldingsystems. Welding and Metal Fabrication,63(7), 261–265.
Luciano, G., & Galet, G. (1995). Space mechanism actuated by a shapememory alloy component. In Proceedings of the 6th EuropeanSpace Mechanical and Tribology Symposium (pp. 221–225).Zurich, October 4–6. ESA SP-374.
Lumsden, J. B., & Allen, A. T. (1988). The stress corrosion crackingbehaviour of AlLi alloy 8090. Corrosion Science-Nace,44(8), 527–532.
Lumsden, J. M., & Whittlesey, A. (1981). Automatic ARC welding ofpropulsion system tubing in close proximity to sensitive electronicdevices. In AIAA/SAE/ASME 17th Joint Propulsion Conference,Colorado Springs, July, (AIAA-81-1569).
Lund, A. (2011). Principals and applications of ESR Spectroscopy.Heidelberg: Springer.
Lupton, D. F. (1990). Heraeus GmbH, private communication.Luzin, V., et al. (2010). Use of neutron diffraction for stress
measurements in thin and thick thermal sprayed coatings. Interna-tional Heat Treatment and Surface Engineering,4(1), 17–24.
Ma, H., et al. (2012). Effects of rework on the accelerated thermalcycling and shock performance of lead-free BGAs. IEEE Transac-tions on Components Packaging Manufacturing Technology,2(11),1824–1830.
Ma, Y., et al. (2012). A large-scale fabrication of flower-lie sub-micrometer-sized tungsten whiskers via metal catalysis. NanoscaleResearch Letters,7(325), 1–7.
Ma, H., & Lee, T.-K. (2013). Effects of board design variations on thereliability of lead-free solder joints. IEEE Transactions on Compo-nents Packaging Manufacturing Technology,3(1), 71–78.
Maciolek, R. B., et al. (1978). Thermal aging characteristics of In–Pbsolder bonds to gold. Honeywell Report.
McCormick, J., & Zakraysek, L. (1979). A metallographic test forglass-to-metal seals. In 17th Annual Proceedings of ReliabilityPhysics, IEEE (pp. 44–50). San Francisco, April.
McCormack, S., & Meschter, S. (2009). Probabilistic assessment ofcomponent lead-to-lead tin whisker bridging. In International Confer-ence on Soldering and Reliability, Toronto, Canada, May 20–22.
McCrone, W. C., & Delly, J. C. (1973). The particle atlas (2nd ed.,Vol. 1–3). Michigan, USA: Ann Arbor Science Publishers.
McCune, T. B., et al. (1970). Heat ageing evaluation of common coatedcopper conductors. In 19th International Wire and Cable Sympo-sium, Atlantic City, N.J., December 2–4.
McDonald, G. E. (1974). Refinement in black chrome for use as a solarselective coating. NASA TMX-3136, December.
McDonnald Schetky, L. (1991). Shape memory alloy applications inspace systems. Materials and Design,12(1), 29–32.
McDowell, M. E. (1993). Tin whiskers—A case study. In 1993 IEEEAerospace Applications Conference (14th) (pp. 207–215). Steam-board Springs, CO, USA, January 31–February 5.
McKay, C. A. (1983). Causes and effects of solder contamination, part2, Electronics: 41–44.
Maillat, M., et al. (1995). Adhesion of materials by impact contacts invacuum. In Proceedings of 6th European Space MechanismsConference, (pp. 431–436). Zurich, Switzerland, (ESA SP-374).
Mair, P. (2005). Assessment of EMF and biological effects in arcwelding applications. In International Institute of Welding Manu-facturing (pp. 1–10). IIW Document XII-1848-05.
Majid, W. A. (1988). Controlling SCC in mechanism components ofground support equipment. In 22nd Aerospace Mechanisms Sym-posium (pp. 163–174). Hampton Virginia, May 4–6 (NASAConference Publication 2506).
Maliutina, I. N., et al. (2014). Structure and microhardness of Cu-Tajoints produced by explosive welding. Rivista Italiana dellaSaldatura5: 839–848.
Malla, R. B., & Ghoshall, A. (1994). Thermally induced vibrations ofstructures in space. Progress in Astronautics and Aeronautics,168,68–89.
Marchaise, M., & Glodowski, K. A. (1991). Real-time microfocusradiography for electronic failure analysis. Materials Evaluation:1481–1485.
Marrocco, T., & Harvey, D. (2012). Cold Standard—The cold sprayprocess. Materials World: 30–31.
Martell, S., & Adams, T. (1996). Virtual cross-sectioning of materials.Materials World,3(7), 323–324.
Martin, J. W. (1976). A new laboratory procedure for determiningcompatibility of positive expulsion elastomers with liquid propel-lants. In Symposium—Compatibility of Plastics (pp. 1–6). IndianHead, Md., USA, paper III-E, April.
Mason, M., & Eng, G. (2007). Understanding tin plasmas: a newapproach to tin whisker plasma risk assessment. In IEEE IRPS,CALCE, University of Maryland, USA, April.
Materassi, M., Dunn, B. D., & Capinari, L. (2000). The influence ofsolder fillet geometry on the occurance of corona discharge duringoperation between 400 and 900 V in partial vacuum. IEEETransactions on Electronics PackagingManufacturing,23, 104–115.
Matloff, G. L. (2013). The speed limit for graphine interstellar solarproton sails. Journal of the British Interplanetary Society,66,377–380.
Maurer, R. H., et al. (2008). Harsh environments: Space radiationenvironment, effects, and mitigation. John Hopkins APL TechnicalDigest,28(1), 17–29.
Mayo, M. J., & Nix, W. D. (1989). Direct observation of superplasticflow mechanism in torsion. Acta Met,37(4), 1121–1134.
References 647
Maxwell, J. L., et al. (2013). High-temperature nano-composites fornuclear thermal propulsion and in-space fabrication by HP-LCVD.JBIS,66, 328–333.
Mc Brien, C. M., & Heltzel, S. (2013). Insulation resistance of dielectricmaterials under environmental testing. In IPC APEX EXPO Confer-ence Proceedings, San Diego, Ca, USA, February 19–21.
Meaker, A. J., et al. (2006). Hydrogen peroxide—From bridesmaid tobride. In 3rd ESA International Conference on Green Propellantsfor Space Propulsion, Poitier, France, September.
Medgyes, B., et al. (2011). In situ optical inspection of electrochemicalmigration during THB tests. The Journal of Materials Science:Materials in Electronics,22, 694–700.
Meltsner, K. J. (1995). Understanding the INTERNET: A guide formaterials scientists and engineers. JOM,47(4), 9–13.
Merstallinger, A., & Semerad, E. (1996). Test method to evaluate cold-welding under static or impact loading. Unpublished ESTECMetallurgy Report 2222
Merstallinger, A., & Semerad, E. (1996). Test method to evaluate thesublimation of metals by weight loss. Unpublished ESTEC Metal-lurgy Report 2242.
Merstallinger, A., et al. (1995). Study on adhesion/cold-welding undercyclic load and high vacuum. In Proceedings of the 6th EuropeanSpace Mechanisms Conference (pp. 293–298). Zurich, Switzerland,(ESA SP-374).
Merstallinger, A., et al. (1995). Wire bend test. Unpublished report.Merstallinger, A., & Dunn, B. D., et al. (2009). Assessment of cold
welding between separable contact surfaces due to impact andfretting under vacuum, ESA STM-279, and, (2015) http://esamul-timedia.esa.int/multimedia/publications/STM-279/.
Mertens, J., & Gessford, D. (1995). Implementation of alternativecleaning solvents. Precision Cleaning Journal,3(2), 45–50.
Mielke, E. W. (2002). Silver filled conductive epoxies, NASA MaterialsEngineering Branch, TIP No. 079, rev. October.
Mikaelian, T. (2001). Spacecraft charging and hazards to electronicsin space, York University publication, May.
MIL-C-13924 Coating, oxide, black, for ferrous metals.MIL-Handbook-697A. (1974). Titanium and titanium alloys, June.Millares, M., & Peraggi, B. (1992). Metallography of gold–indium
couples and electronic components soldered with indium alloys.Praktische Metallographie,29, 555–563.
Miller, N. H. (1906). The amounts of nitrogen as ammonia and nitricacid, and of chlorine in the rainwater collected at Rothamsted.Journal of Agricultural Sciences,1, 280–303.
Minges, M. L. (1989). Electronics materials handbook (Vol. 1). MetalsPark, OH, USA: ASM International.
Mohrbacher, H., et al. (1995). The influence of humidity on the frettingbehaviour of PVD TiN coatings. Wear,180, 43–52.
Moliterni, L. (2010). Il saldatore “manual” utilizzato nella saldatura inelettronica.Rivista Italianadella Saldatura,Lugili/Agosto 4: 455–459.
Moliterni, L. (2012). L’affidabilita degli assemblaggi elettronici. RivistaItalianadella Saldatura, Maggio/Giugno 3: 351–362.
Morilla, D. J., et al. (2015). Tin whisker growth on surface mountdevices: A study using standardized test conditions. In EMPS-6,Wessling, Germany, April 15–16.
Morris, J. W. (1996). The metallurgical control of electromigration.JOM,48, 43–46.
Moser, M. (2002). Calculation of stresses produced in the tin-platedterminations of resistors during thermal cycling. Unpublished EstecMGI report 3496.
Motz, J. M. (1988). Microsegregations—An easily unnoticed influenc-ing variable in the structural description of cast materials. PracticeMetals,25, 285–293.
Mueller, R. P., et al. (2014). Space mining and planetary surfaceconstruction. In ASCE Earth and Space Conference, St. Louis,Missouri, USA, October 27–29.
Mueller, R. P., et al. (2015). Additive construction using basalt regolithfines, NASA KSC, casi.ntrs.nasa.gov/20150000305.pdf [citedaccess June 2015].
Muller-Wiesner, A., et al. (1994). Materials and manufacturingtechnologies for the tank and thruster components of the Ariane 5SCA-system. In Ariane V structures and technologies, Cepadues-Editions. Toulouse: CNES publication.
Munns, I. (1995). Adhesive bond inspection using NDT. MaterialsWorld,3(11), 527–529.
Munson, T. (2006). White residues: are they or aren’t they? CircuitAssembly, page unknown, January.
Nabarro, F. R., & Jackson, P. J. (1958). Growth of crystal whiskers.Growth and perfection of crystals (pp. 11–101). New York: Wiley.
Naisbitt, G. (2015). How clean is clean to be functionally good? EMPS-6 Workshop, DLR, Oberpfaffenhofen, Germany, April 15–16.
Nakasa, K., & Liu, J. (1993). The effect of stress on hydride formationin Ti6A14V alloy. In Titanium (Vol. 92, 1st ed., pp. 619–627).TMS publication.
NASA NAS 5300.4 (3J). (1996a). Workmanship standard for stakingand conformal coating of printed wiring boards and electronicassemblies, May.
NASA NAS 5300.4 (3M). (1996b). Workmanship standard for surfacemount technology, May.
NASA-STD selected NASA standards related to materials andprocesses can be seen listed in Appendix 9.
Nasta, M. A., et al. (1990). Contaminant particles in electronic solderfluxes. Soldering and SMT Journal,4, 6–7.
Nelson, H. G. (1988). Hydrogen and advanced aerospace materials.SAMPE Quarterly,20(1), 20–23.
NEMA. (1972). High temperature insulated wire. Report on CopperCorrosion, NEMA Standards Publication, No. HP 2-1968 (reaf-firmed by NEMA).
Nemoto, N. (2007). Evaluation of tin whisker growth in vacuumthermal cycling condition. In 3rd International Symposium on TinWhiskers, Lyngby, Deenmark, June 23–24.
Newman, R. C. (1990). Stress corrosion cracking: 1965–1990. BritishCorrosion Journal,25, 259–269.
Niefhof, J. (1995). An empirical model for electromigration. Solid-StateElectronics,38, 1817–1827.
Noller, E. W. (1996). Unique application of plastics and compositematerials in the design of magnetometer instruments. In 41stInternational SAMPE Symposium and Exhibition (Vol. 1, pp. 841–846). Anaheim, Ca, March 24–28.
Nordwall, B. D. (1986). Air force links radar problems to growths of tinwhiskers. Aviation Week and Space Technology30: 65–69.
Norwood, L. B. (1985). How beryllium proved successful on the spaceshuttle orbiter. Journal of Spacecraft and Rockets,22, 560–566.
Novikov, I., & Grushko, O. (1995). Hot cracking of Al-Cu-Li alloys.Materials Science and Technology,11, 926–932.
Nuez, D., & Tan, P. (2014). Failure localization of intermittent shortcircuit failures caused by vertical CAF formation. In ISTFAConference Proceedings, Houston, TX, USA, November 9–13.
Nurse, M. (1996). Caution remains on aluminium–lithium alloys. MBM(pp. 42–45). February.
O’Clock, G. D., et al. (1987). Pb-Sn microstructure: potential reliabilityindicator for interconnects. IEEE Transactions Components,Hybrids, Manufacturing Technology,10, 82–88.
Okuyama, F. (1974). Vapor-grown tungsten whiskers induced byvacuum discharges. Journal of Applied Physics,45(10), 4239–4241.
Pantazopoulos, G., & Vazdirvanidis, A. (2008). Characterization of themicrostructural aspects of machinable Alfa Beta phase brass(pp. 13–16). Microscopy and Analysis, September.
Paprocki, S. J. (1988). Metal matrix composites for space applications.In Composite Technology, 5th Annual Conference on MaterialsTechnology (pp. 33–43). Carbondale, IL, April 14–15.
648 References
Parker, D. L. (1977). Special devices fabricated in heat shrinkableplastics. In Proceedings of the Technical Program, Internepcon’77(pp. 133–136). Brighton UK, October 18–20.
Parker, D. S. (1991). Analysis of a failed helicopter main rotor bladegrip. In International Conference on Failure Analysis (pp. 141–145). Montreal, Canada, July 8–11 (published 1992 by ASM).
Parquet, D. T., & Boggs, D. W. (1995). Alternatives to HASL. InElectronic Packaging and Production (pp. 38–42). August.
Pask, J. A. (1948). New techniques in glass-to-metal sealing.Proceedings of the IRE, Waves and Electrons Section,36, 286–289.
Paton, B. E. (2003). Space: Technologies, Materials, Structures. InWelding and allied processes (Vol. 2). Ukraine: E. O. Paton ElectricWelding Institute. Published in English by Taylor and Francis Inc.,New York, USA.
Patterson, R. F., & Mykytiuk, P. D. (1996). Solid-state, vapour phase,and aqueous cleaners for aerospace manufacturing operations.Sampe Journal,32(3), 40–49.
Pearce, R. (1987). Superplasticity—An overview (pp. 1–1 to 1–24).AGARD Lecture Series No. 154, August.
Pecht, M. G., et al. (1999). Moisture ingress into organic laminates.IEEE Transactions on Components and Packaging Technology,22,104–110.
Pedley, M. D. (2009).Materials safety, Ch. 12 in book safety design forspace systems. Amsterdam, The Netherlands: Elsevier Publishing.
Peel, C. J., & McDarmaid, D. S. (1989). The present status of thedevelopment and application of Al-Li alloys 8090 and 8091.Aerospace,16(5), 18–23.
Peng, X., et al. (2014). Conductivity improvement of silver flakes filledECAs via introducing silver-graphine nanocomposites. Journal ofMaterials Science: Materials in Electronics,25, 1149–1155.
Perami, R., et al. (1992). Applications of AE to the study ofmicrofissure damage to composites used in the aeronautics andspace industries. In The American Society for NondestructiveTesting, Proceedings of AECM-4, (pp. 99–108), Seattle, July 27–31.
Pereira, A., Pimenta, G., & Dunn, B. D. (2008). Assessment of chemicalconversion coatings for the protection of aluminium alloys, (Acomparison of Alodine 1200 with Chromium Free ConversionCoatings), ESA-STM-276, February.
Peres, P., Semerad, E., & Dunn, B. D. (1994). Material characteristicsof SiC/MAS-L fibre re-inforced glass composites. In Proceedings of6th International Symposium on Materials in Space Environmental(pp. 309–314). Noordwijk, September 19–23, 1994, (ESA SP-368).
Perez, F., & Eymard, P. (1985). Increasing use of composite structureson Ariane launchers (pp. 239–244). ESA SP-243.
Pergola, P., et al. (2011). Low-thrust missions for expanding foam spacedebris removal. In IEPC-2011-126, 32nd International ElectricPropulsion Conference, Wiesbaden, Germany, September 11–15.
Peters, S. T., & Wesling, N. (1968). Corrosion of silver plated copperconductors. In SAMPE 13th National Symposium.
Pettersson, C., et al. (2007). Corrosion testing of welds, a review ofmethods. Rivista Italiana Saldatura,4, 529–553.
Pettit, R. B., & Sowell, R. R. (1976). Solar absorptance and emittanceproperties of several solar coatings. Journal of Vacuum Science andTechnology, 13(2).
Pinaud, G., et al. (2014). Aerofast: Development of cork TPS materialand a 3D comparative thermal/ablation analysis of an Apollo and abiconic sled shape for an aerocapture mission. http://solarsystem.-nasa.gov/docs/7_aerofast_paper.pdf (2015).
Pippin, H. G. (1995). Analysis of silverized teflon thermal controlmaterial flow on LDEF. NASA Contractor Report 4663, July.
Pippin, H. G., & Bourassa, R. J. (1995). Effects of space exposure onmetals on LDEF. NASA Contractor Report 4662, June.
Pirnnack, S. (2012). Lessons learned to avoid coax cable failure inmoving mechanical mechanisms. In Proceedings of the 41st Aero-space Mechanisms Symposium, NASA JPL, Pasadena, CA, USA.
Piskoty, G., et al. (2009). Structural failures of rope-based systems.Journal of Engineering Failure Analysis,16, 1929–1939.
Plumbridge, W. J. (2011). Tin pest in lead-containing solders.Soldering and SMT Journal,22(1), 56–57.
Poe, R. F., & Ruckner, M. A. (1993). Evaluation of pressurized vesselsfollowing hypervelocity particle impact. In Proceedings of the FirstEuropean Conference on Space Debris (pp. 441–446). Darmstadt,Germany, April 5–7, (ESA SD-01).
Pohl, D. (1996). Advances in scanning electron microscopy. PraktischeMetallographie,33(5), 235–245.
Polat, A., et al. (2008). Properties of alumina coating formed bymicroarc oxidation technique on 6061 aluminium alloy. PraktischeMetallographie,12, 594–606.
Pollack, A. A. (1989). Acoustic emission inspection. In MetalsHandbook (Vol. 17, 9th ed., pp. 278–294). ASM International.
Pops, H. (1985). Copper rod requirements for magnetic wire. InProceedings of the 17th Electrical/Electronics Insulation Confer-ence (pp. 329–337). Boston, USA, September 30–October 3.
Pradier, A. L., & Dosio, D. (1996). Technology development instructures for reusable launch vehicles. In Reaching for the Skies(Vol. 15, p. 7). ESA Publication.
Premat, G. (1977). Astudy of the outgassing of solder splices. ESA TM-158.
Pretsch, E. (2009). Structure determination of organic compounds.Heidelberg: Springer.
Prymak, J. D., & Bergenthal, J. (1995). Capacitance monitoring whileflex testing. IEEE Transactions on CPMT, Part A,18(1), 180–186.
Puig, C. (2006). When space adheres to bonding—An interview.Qualite Espace,43, 57–63. Mars.
Puippe, J-Cl. (1999). Surface treatments on aluminium for spaceapplications. Galvanotechnique,90(10), 3003–3009.
Puttlitz, J. K. (1990). Preparation, structure and fracture modes. IEEETransactions Parts, Hybrids, Packaging,13, 648–655.
Quinn, G. D. (2008). Fractography of brittle materials: Analysisof fractures in ceramics and glasses. Microscopy and Analysis:21–24.
Raiser, G. F., & Amir, D. (2005). Solder joint reliability improvementusing cold ball pull metrology. In Proceedings of InterPACK’05,San Francisco, CA, USA, July 17–22.
Raman, V., & Reiley, T. (1987). Cavitation and cracking ofsuperplastic Pb–Sn eutectic during high-temperature fatigue. Jour-nal of Materials Science Letters,6, 549–551.
Rameriz, P., & Adams, T. (2002). Acoustic imaging and screening ofceramic chip capacitors. Passive Component Industry: 16–20.
Rampini, R., et al. (2009). Dynamic outgassing test: Revisited. In 11thISMSE Symposium, Aix-en-Provence, September 15–18, Poster.
Ratchev, P., et al. (2005). A study of brittle to ductile fracture transitintemperatures in bulk lead-free solders, EMPC, Brugge, Belgium,June 12–15.
Ray, U., et al. (1995). Influence of temperature and humidity on thewettabiality of immersion tin coated pwb’s. IEEE Transactions onCPM Technology Part A,18(1), 153–161.
Raymond, L. (1988). Hydrogen embrittlement: Prevention and control.No: ASTM Special Technical Publication. 962.
Redahan, E. (2014). 3D printing—Material wise to grain size—A reviewof the 3D printing and additive manufacturing industrial applicationssummit (London 2013). In Materials World, January 10–12.
Reed, R. P., & Clark, A. F. (1983). Materials at low temperature.ASM.
Reid, P. (2009). PWB reliability—The next step. Circuit World,33(4),51–59.
Rendu, M., & Tawil, D. (1988). Improved protection of magnesiumalloys against synthetic aviation lubricants at elevated temperatures,paper 880869. In 24th Annual Aerospace/Airline Plating and MetalFinishing Forum, Phoenix, April.
References 649
Reuther, J. (2010). Orion thermal protection system, advanceddevelopment project. In 7th International Planetary Probe Work-shop, NASA Ames Research Centre, June 16.
Richards, B. P., & Footner, P. K. (1990). Failure mechanisms in activesurfacemount components.GEC Journal of Research,7(3), 146–156.
Ries, W. (1996). The combined plasma cleaning facility. ProductFinishing,49(1), 6–8.
Roman, I., et al. (1992). Interfacial shear properties and acousticemission behaviour of model aluminium and titanium matrixcomposites. In The American Society for Nondestructive Testing,Proceedings of AecM-4 (pp. 109–114), Seattle, July 27–31.
Richards, B. P., & Footner, P. K. (1984). Morphological aspects ofelectromigration. GEC Journal of Research,2(3), 157–168.
Ring, K. (2010). Protection of electronic assemblies in condensingatmospheres. EMPS-1, Portsmouth, UK, February 17.
Roach, T. A. (1984). Aerospace high performance fasteners resist stresscorrosion cracking. Material Performance,239, 42–45.
Robertson, I. M., & Teter, D. (1996). Microscopic studies on hydrogeneffects on mechanical properties. JOM,48(11), 55–60.
Rogers, K., et al. (1999). Conductive filament formation in a pcb.Circuit World,25, 6–9.
Ross, C. A., & Evetts, J. E. (1987). A model for electromigration.Scripta Metals,21, 1077–1082.
Ross, R. G. (1989). Magellan/Galileo solder joint failure analysis andrecommendations. NASA-CR-186294, September.
Rothschild, B. F. (1981). Electroplating of solderable coatings. MetalProgress: 25–29.
Rowntree, R. A., & Todd, M. J. (1988). Tribology for spacecraft.Chartered Mechanical Engineer Journal: 28–30.
Rubinstein, M. (1978). High speed electroplating of gold. GoldBulletin,11(1), 3–8.
Russell, C., et al. (2014). Welding technology takes flight with NASA.Welding Journal,93(5), 38–44.
Rustichelli, F., & Dunn, B. D. (1997). Assessment of residual stressesin AA 2219 weldments by neutron diffraction. To be published inMaterials Science and Engineering.
Ryan, R. S., et al. (1995). Development problems and their solutionsfor the Space Shuttle main engine. NASA Technical Paper 3533,May.
Saber-Samandari, S., & Berndt, C. C. (2010). IFTHSE Global 21: Heattreatment and surface engineering in the twenty-first century.International Heat Treatment and Surface Engineering,4(1), 7–13.
Said, A. F., et al. (2012). Automated void detection in solder balls inthe presence of vias and other artifacts. IEEE Transactions on CPMTechnology,2(11), 1890–1901.
Saltzman, M., et al. (2009). Problems encountered during therecertification of a solar array drive actuator. In 13th SpaceMechanisms and tribology Symposium, Vienna, Austria, September23–24.
Sampson, B. (2007). Soldering on—Training focus. In ProfessionalEngineering (p. 48), April.
Sandera, J. (1996). Investigation into the mode of degradation ofcrimped joints due to corrosive effects. Unpublished ESTECMetallurgy Report 2256.
Saunders, C. G. (1988). Ion techniques in surface engineering. Metalsand Materials,4(11), 678–682.
Saxer, W. (1977). Moeglichkeiten funktioneller Edelmetallueberzuegeanhand aktueller Beispiele aus der Praxis. Galvanotechnik, 68(11)(Black inorganic coating developed by Werner Fleuhmann AG,Dueberdorf, Switzerland).
Saxty, P. (1995). Ultrasonic soldering in the electronics industry.Metallurgica: 287.
Scala, E. P. (1996). A brief history of composites in the US. JOM,48(2), 45–48.
Schatz, et al. (1979). Development and flight experience of the Voyagerpropulsion system. In AIAA/SAE 15th Joint Propulsion Conference(pp. 1–13), Las Vegas, June.
Schedler, A. (1988). Fibre composites in satellites. Cryogenics,28,220–223.
Scheel, W. (2004). Electronics assembly handbook (2nd ed.). Port Erin,I.O.M, UK: Electrochemical Publications.
Schelling, P., et al. (2005) Managing heat for electronics. MaterialsToday: 30–35.
Schemme, K., & Wittkamp, I. (1993). Microstructure development andexamination of Mg–Li alloys. Praktische Metallographie,30(7),334–343.
Schlesinger, M. (2010). Electroless deposition of nickel. In M.Schlesinger & M. Paunovic (Eds.), Modern electroplating. Chich-ester, UK: Wiley.
Schliekelmann, R. J. (1972). Holographic interference as a means forquality determination of adhesive bonded metal joints. In 8thCongress of the International Council of the Aeronautical Sciences,Paper No. 72-06.
Schmidt, E. W. (1984). Hydrazine and its derivatives. New York:Wiley.
Schoenbeck, J., & Dunn, B. D. (2004). Evaluation of a process for therepair of area array and other surface mounted packages, ESASTM-272, September.
Schoenthaler, D. (1984). Accelerated ageing for solderability evalua-tions. IPS-TR-464.
Schoyer, H. F. R. (1996). ESA’s new solid propellant based onhydrazinium nitroformate. Preparing for the Future,6(1), 6–7.
Schreib, R., et al. (1979). Flow anomalies in small hydrazine thrusters.In AIAA 15th Joint Propulsion Conference (pp. 1–7), Las Vegas,June.
Schrunk, D., et al. (1999). The Moon—Resources, future developmentand colonization. Chichester, UK: Wiley-Praxis.
Schubert, Th, et al. (2008). Interfacial design of Cu-based compositesprepared by powder metallurgy for heat sink applications. MaterialsScience and Engineering: A,475, 39–44.
Schuerch, H. U. (1968). Certain properties and applications of NitinolNASA CR-1232.
Schweigart, H. (2007). Conformal coating issues: When reliability goesastray. Global SMT and Packaging, 3.
Scott, B. C. (1987). Zinc diffusion in tin coatings on brass. Transac-tions on IMF,65, 90–98.
Scott, P. G. (1985). An investigation of alodine surface finish on threealuminium alloys. EWP No. 1435 (Unpublished).
Sechi, Y., et al. (2009). Composition dependence of titanium in Ag-Cu-Ti alloy braze metals for laser brazing of boron nitride ceramics andcemented carbides. Material Transactions,50(6), 1294–1299.
Seghesio, J. L. (1986). Heurs et malheurs de la corrosion—le tore d’eaud’Ariane. CNES Quality Espace,16(5), 29–32.
Selman, G. L., et al. (1974). Dispersion strengthened platinum.Platinum Metals Review,18(2), 2–13.
Semerad, E., & Dunn, B. D. (1990). Evaluation of black anodisedberyllium (Unpublished report).
Semprimoschnig, C., & Eesbeek, M. (2007). Materials research at Estec—focus on self-healing materials for space applications. In STFCMaterials Workshop, London, October 10.
Sharkov, E. A. (2008). Breaking Ocean Waves - geometry, structureand remote sensing. Heidelberg, Germany: Springer-Praxis.
Sharma, A. K. (1989). Gold plating on aluminium alloys for spaceapplications. Transactions of the Institute of Metal Finishing,67,87–88.
Shashkov, P. (2013). Aluminium nanoceramic substrates for thermalmanagement in electronics. In Electronic Materials and Proceed-ings For Space Workshop, (EMPS-4), Aalborg, Denmark.
650 References
Sheldahl Inc. (2004). Thermal control material and metallised films.General Trade Literature and Specifications, and The Little RedBook.
Shibutani, T. (2009). Effect of grain size on pressure-induced tinwhisker formation. In 3rd International Tin Whisker Symposium,Lyngby, Denmark, June 23–24.
Shiganov, N. V. (1973). Some special features of arc welding with ahollow electrode in vacuum. Welding Production, 20(9), 30–33
Shipley, E. A. (1988). Developments in ultra high tensile wire ropes. InProceedings of Conference on the Hoisting of Men, Materials andMinerals (pp. 1295–1307), Toronto.
Shrestha, S., Merstallinger, A., Sickert D., & and Dunn, B.D. (2003).Some preliminary evaluations of black coating on aluminiumAA2219 alloy produced by plasma electrolytic oxidation (PEO)process for space applications. In Proceedings of 9th InternationalSymposium on Materials in a Space Environment (pp. 57–65), TheNetherlands, June 16-20.
Shrestha, S., et al. (2007). Recent developments in black finish coatingson aluminium by Keronite plasma electrolytic oxidation. Proceed-ings of the Global Power Train Congress, Engine, Transmissionand Propulsion, Berlin,39–42, 207–215.
Shrestha, S., & Dunn, B. D. (2010). Plasma electrolytic oxidation andanodizing of aluminium alloys for spacecraft applications. In H.Dong (Ed.), Surface engineering of light alloys. Cambridge, UK:Woodhead Publishing Ltd.
Shrestha, S., et al. (2015). Silk corrosion and stress corrosion crackingbehavior of Plasma electrolytic oxidized Al-SiC metal matrixcomposite, to be published.
Shumka, A., & Pietry, R. (1975). Migrated-gold resistive shorts inmicrocircuits. In Proceedings of 13th IEEE International ReliabilityPhysics Conference (pp. 93–98), Las Vegas.
Sicking, R. (2005). Brazing of aluminium heat exchangers. Weldingand Cutting Journal,4(3), 150–159.
Silverman, E. M. (1995). Space environmental effects on spacecraft:LEO materials guide. NASA Contractor Report 4661 Part 1,August.
Simpson, P. R., & Bowie, S. H. U. (1970). Quantitative optical andelectron-probe studies of the opaque phases. Science,167, 619–621.
Sinclair, J. D., et al. (1985). Volatile components in rosin flux:characterisation and reliability effects. In 35th IEEE ElectronicComponents Conference (pp. 144–150), Washington DC,May 20–22.
Singh, J., et al. (2005). Welding in Space. Advanced Materials andProcesses Journal: 52–57.
Smith, C. A. (2007). Chemical characterization of materials inelectronic systems using infrared spectroscopy. Circuit World,33(3), 38–47.
Sogame, E., et al. (1990). Recent developments in the hydrazine relatedpropulsion technology in NASDA. In Proceedings of 17th Inter-national Symposium on Space Technology and Science (Vol. 1,pp. 107–112), Tokyo.
Sohn, J. E., & Ray, U. (1995). Weak organic acids and surfaceinsulation resistance. Circuit World,21(4), 22–25.
Solari, G., & Repetto, M. P. (2014). IL comportamento delle structuremetalliche saldate nei confronti delli’azione del vento. RivistaItalianadella Saldatura: 851–859.
Soli, L., & Dunn, B. D., et al. (2015). An electron beam brazing reflowtechnique. Giorate Nazionali di Saldatura, GNS8, Genoa, Italy,May 28–29.
Somiya, I., et al. (2013). Products with special electrical and magneticproperties, Ch. 7. In Handbook of advanced ceramics: Materials,applications, processing and properties. Amsterdam, The Nether-lands: Elsevier Inc.
Sood, B., et al. (2011). Whisker analysis of electronic throttle controls.Circuit World,37(3), 4–9.
Spedding, V., & Hargreaves, P. (1995). Materials on line. MaterialsWorld,3(10), 483–484.
Sriveeraraghavan, S., et al. (1995). Chemical removal of solder andsolder electroplates. Metal Finishing: 34–36.
Stanley, J. K. (1968). Solutions to some stress corrosion crackingproblems in aerospace situations. In Proceedings of 1st Interna-tional Aerospace and Marine Corrosion Technical Seminar,NACE, LA, USA, July.
Stoltz, R. E., & Stulen, R. H. (1979). Slid metal embrittlement of Ti–6A1–6V–2Sn by cadmium, silver and gold. Corrosion-NACE,35(4), 165–169.
Strachan, W. (2000). Processes for manual solder assembly of highheat capacity boards (Unpublished).
Stratton, P. (2013). Ellingham diagrams—Their use and misuse.International Heat Treatment and Surface Engineering Journal,7(2), 70–73.
Sterjovski, Z., et al. (2010). The effect of voltage and metal transfermode on particulate fume size. Rivista Italiana della Saldatura,6,765–780.
Sturgeon, A., & Dunn, B. D. (2006). Cold sprayed coatings for polymercomposite structures. In Proceedings of 10th ISMSE Conference,Collier, France, June 19–23 (ESA SP-616).
Suchentruck, R. (1986). Electroforming of complex parts. TransactionsIMF,64, 19–23.
Sun, J., et al. (2012). Kinetic study of the pyrolysis of waste pcbssubject to conventional and microwave heating. Energies,5, 3295–3306.
Surkov, Y. (1997). Exploration of terrestrial planets from spacecraft(2nd ed.). Chichester, UK: Wiley-Praxis.
Suslov, D. I., et al. (2010). Convective and film cooled nozzleextension for a high pressure rocket subscale combustion chamber,AIAA 2010-1150. In 48th AIAA Aerospace Sciences MeetingIncluding New Horizons Forum, Orlando, FL, USA, January 4–7.
Tak, W, et al. (2009). SMA actuator based satellite separation deviceusing plastic deformation. In 13th European Space Mechnisms andTribology Symposium—ESMATS, Vienna, September 23–25 (ESASP-670).
Tamai, T. (1995). Effects of silicone vapour and humidity on contactreliability. In Proceedings of IEEE Holm Conference (pp. 252–259).
Tamai, T., & Aramata, M. (1993). Safe levels of silicone contaminationfor electrical contact. In Proceedings of IEEE Holm Conference onElectrical Contact Phenomena (pp. 269–273), England
Teare, M. (1994). Manufacture of a multi-horn feed by electroforming.In International Symposium on Advanced Materials for LightweightStructures, ESA-ESTEC (pp. 305–309), March 22–24. ESA WPP-070.
Teer, D. G. (2001). New solid lubricant coatings. Wear,251, 1068–1074.
Tegehall, P.-E. (1991). The impact of crevices beneath smds on thecleaning efficiency. Soldering and SMT Journal,8, 46–52.
Tegehall, P.-E., & Dunn, B. D. (1992). Influence of flux residues andconformal coating on the SIR properties of spacecraft pcb’s. ESAJournal,16(3), 255–274.
Tegehall, P.-E., & Dunn, B. D. (2001). Assessment of the reliability ofsolder joints to ball and column grid array packages for spaceapplications, ESA-STM-266.
Tegehall, P.-E., & Dunn, B. D. (2001a). Evaluation of thermallyconductive adhesives as staking compounds during the assembly ofspacecraft electronics. ESA STM-265, August.
Tegehall, P.-E., & Dunn, B. D. (2003). Impact of cracking beneathsolder pads in PCB laminate on reliability of solder joints made toceramic ball grid array packages. ESA-STM-267.
Tegehall, P.-E., & Dunn, B. D. (2005). Impact of reworking ceramicAGAs on the integrity of PCB laminates. ESA STM-273, June.
References 651
Tegehall, P.-E., & Dunn, B. D. (2006) Evaluation of cleanliness testmethods for spacecraft PCB assemblies. ESA-STM-275.
Tegehall, P.-E., & Wetter, W. (2015). Impact of laminate cracks undersolder pads on the fatigue lives of BGA solder joints, Microelec-tronics Reliability, article in press.
Thiel, C., et al. (1993). Functional activity of plasmid DNA after entryinto the atmosphere of Earth investigated by new biomarkerstability assay for ballistic spaceflight experiments. PLOS One,November 26.
Thiel, M., et al. (2003). The Rosetta Lander Anchoring System. InProceedings of the 10th European Space Mechanisms and Tribol-ogy Symposium (pp. 239–246), San Sebastian, Spain, September24–26.
Thoma, W. (1981). Product liability. In 2nd ESA Product AssuranceSymposium (pp. 31–33), ESA SP-163.
Thomas, G., et al. (1993). The effect of pre- and post-weld heattreatments on the mechanical properties of EB welded Ti6A14V.Journal of Material Science,28, 4892–4899.
Thomas, G., & Dunn, B. D. (1999). Assessment of electricallyconductive adhesives (ECAs) for joining surface mount devices toprinted circuit boards. In 2nd IEEE Symposium on PolymericElectronic Packaging (PEP 99) (pp. 9–13), Gothenburg, Sweden,October 24–28.
Thomas, R. W., & Calabrese, D. W. (1983). Phenomenologicalobservations on electromigration. In 21st Annual Proceedings inReliability Physics (pp. 1–9), Phoenix, Arizona, April 5–7.
Thompson, D. H. (1961). A simple stress corrosion cracking test forcopper alloys. Materials Research and Standards,1(2), 108–111.
Thomson, P., et al. (1995). The use of shape memory alloys for passivestructural damping. Smart. Materials and Structures,4, 36–42.
Tighe, A. et al (2010) Overview of results from the materials exposureand degradation experiment (MEDET) after 18 months in orbit onthe ISS, ESA paper.
Tillmann, W., & Boretius, H. (2008). Properties of nickel-based jointsbetween diamond and steel for diamond grinding tools. Weldingand Cutting,7(4), 228–234.
Toensmeier, P. A. (2009). Shape memory polymers reshape productdesign. In Plastics engineering, April 2.
Towner, J. M., et al. (1984). Grain growth in Al alloy conductors as aresult of rapid annealing. Applied Physics Letters,44, 198–199.
Tondu, T., et al. (2011). Cesium droplet evaporation as contaminationroute by cesium field effect electric propulsion. Journal ofSpacecraft and Rockets,48(3), 513–519.
Troughton, M., et al. (2013). State of the art in welding thermoplasticsand in assessing thermoplastic welded joints. Rivista Italiana dellaSaldatura,6, 887–895.
Tsuda, N. (2000). Electronic conduction in oxides (p. 243). Heidelberg,Germany: Springer.
Tsukada, M., et al. (2012). A new strategy for assessing off-gassingfrom museum materials. AIC News,37(1), 1–7.
Tulsi, S. S. (1986). Properties of electroless nickel. TransactionsIMF,64, 73–76.
Turlach, G. (1985). Improving fatigue strength of aerospace metalfasteners by surface work hardening. Surface Engineering,1(1),17–22.
Turner, I., Dunn, B. D., & Barrnes, C. (2013). A study into the re-processing of pure tin termination finishes into tin-lead. Solderingand SMT Journal,25(4), 218–228.
Turner, R. F. (1995). Chapter 9. In P. Fortescue & J. Stark (Eds.),Spacecraft systems engineering (2nd ed.). Chichester: Wiley.
Turner, T. E., & Parsons, R. D. (1982). A new failure mechanism: A1–Si bond pad whisker growth. IEEE Transaction on Components,Hybrids and Manufacturing Technology,CHMT-5, 431–435.
Tyler, D. (2015) Reliability of ball grid arrays converted from lead-freeto tin-lead by robotic hot solder dipping, EMPS-6, Wessling,Germany, April 15–16.
Vail, J. R., et al. (2011). Polytetrafluoroethylene fiber reinforcedpolyetheretherketone composites. Wear,270, 737–741.
Vander Voort, G. F. (2008) Titanium—specimen preparation,Advanced Material and Processes, February 25–27.
van Eesbeek, M., et al. (1994) Degradation of Teflon FEP due to VUVand atomic oxygen exposure. In Proceedings of 6th InternationalSymposium on Matls in Space Environment, ESTEC (pp. 165–173).ESA SP-368.
Vancso, J, et al. (2009) Whats new in atomic force microscopes forpolymers. Microscopy and Analysis, May 5–11.
Vaughn, R. L. (1985). Space shuttle—A triumph in manufacturing.Dearborn, USA: Society of Manufacturing Engineers.
VEGA. (2006) User’s Manual, Issue 3 rev.0, and ESA-BR-257 (2007).Veit, H. M., et al. (2002). Using mechanical processing in recycling
printed wiring boards. JOM, June 45–50.Verbraak, C. A., TNO Metaalinstituut. Delft: Private Communication.Verderaime, V., & Vaughan, R. (1995) Aluminium U-groove weld
enhancement based on experimental stress analysis. NASA Techni-cal Paper3581.
Verdin, D., & Duck, M. J. (1985). Conductive coatings to minimise theelectrostatic charging of Kapton. 3rd European Symposium onSpacecraft Materials in Space Environment (pp. 125–131). ESASP-232.
Vine, M. K., & Price, W. B. (1992) A literature review of fretting inlaunch, re-entry and space environments. ESTEC Contractor Reportfrom ESTL (TM-106).
Vitt, B. (1987). Black-cobalt coating for solar collectors. PhilipsTechnical Review,43, 244–252.
Voigtlander, B. (2015). Scanning Probe Microscopy. Heidelberg:Springer.
Volkert, C., & Minor, A. M. (2007). Focused ion beam microscopy andmicromachining. MRS Bull,32, 389–395.
Vranish, J. M., & Gorevan, S. (1995). Basic space payload fastener.29th Aerospace Mechanisms Symposium, NASA JSC (pp. 152–157).NASA Conf. Publication 3293.
Wagner, R. (1992). Metallized CFRP technology. Germany: PrivateCommunication, Dornier Space Systems.
Walmsley, M. (2015). Ruggedised solder joint technology for leadlesssemiconductor packages. EMPS-6, Wessling, Germany, April 15–16.
Ward, P. (1994). Effects of bearing wash procedures in performance.Non-Ozone depleting Chemical Cleaning EPA Workshop, Denver,Co, September 26–27.
Ward, P. P. (1996). Plasma cleaning techniques and future applicationsin environmentally conscious manufacturing. SAMPE Journal,32(1), 51–54.
Warwick, M. E., & Muckett, S. J. (1983). Observations on the growthof intermetallics on tin-coated substrates. Circuit World,9(4), 5–11.
Watson, J. A., et al. (2002) A history of astronaut construction for largespace structures at NASA LRC. In IEEE International SpaceStation Conference. Nyact, NY, USA, March 9–16.
Webster, D. (1994). Aluminium–lithium, the next generation.Advanced Materials and Processes,145(5), 18–24.
Wedgewood, A. (1994). Measuring residual stress. Materials World,3(1), 5–7.
Weirick, L. J. (1975). A metallurgical analysis of stress corrosioncracking of Kovar package leads. Solid State Technology,18(3), 25–30.
Wescon. (1965). Session 16B Papers (Western Electronic Show andConvention, California, 1965), July.
652 References
Wetzer, J. M., & Wouters, P. (1993). The effect of insulator charging onbreakdown and conditioning. IEEE Transactions,EI 28(4), 681–691.
Wetzer, J. M., & Wouters, P. (1994). High-voltage design of spacecraftvacuum components. Paper from the High-voltage and EMCGroup, Eindhoven University of Technology, The Netherlands
Whalen, M. V. (1988). The compatibility of dispersion-strengthenedplatinum with propellants. Platinum Metals Rev,32(1), 2–10.
Wickham, M., Hunt., Adams, D., & Dunn, B. D. (1999). Aninvestigation into ball grid array inspection techniques, ESASTM-261.
Wickham, M. et al. (2014). Whisker mitigation measurements using atest vehicle based on a printed circuit assembly. 8th InternationalSymposium on Tin Whiskers. Raleigh, NC, USA, October 29.
Wild, R. N. (1975) Some fatigue properties of solders and solder joints.INTER-NEPCON, Brighton, UK. IBM report No. 74Z000481,October.
Williams, D. N, et al. (1970). Hydrogen segregation in Ti–6A1–4Vweldments made with unalloyed titanium filler material. WeldingJournal Research Supplement, May 207–212.
Wingborg, N., de Flon, J., Johnson, C., & Whitlow, W. (2008) GreenPropellants Based on ADN. Space Propulsion 2008. Heraklion,Crete, Greece. ESA, 3AF, SNPE, May 5–8, 2008.
Winkler, W. (1975). Conductive coating: problem of electrostaticcleanliness. Acta Astronautica,2(7–8), 745–754.
Wolfenden, R. T. (1996). Problems with solvent vapours in arc weldingfabrication environments. Welding and Metal Fabrication,64(4),136–139.
Wolff, R. H. (1963). Corrosion of plated metals after heating invacuum. Plating Journal, 905–910, October.
Wright, C. (1977). The effect of solid-state reactions upon solder lapshear strength. IEEE PHP,13(3), 202–207.
Wu, X. J., et al. (1994). The orientation dependence of fatigue crackgrowth in 8090 A1–Li plate. Metallurgical and Materials Trans-actions A,25, 575–588.
Xu, H., et al. (2009). A re-examination of the mechanism ofthermosonic copper ball bonding on aluminium metallised pads.Scripta Meterialia,61(2), 165–168.
Xu, H., et al. (2010). The role of bonding duration in wire bondformation: a study of footprints of thermosonic gold wire onaluminium pad. Microelectronics International,27(1), 11–16.
Xu, H., et al. (2013). Wafer-level SLID bonding for MEMS encap-sulation. Advances in Manufacturing,1, 226–235.
Yao, W., & Basaran, C. (2014). Damage mechanics of electromigrationand thermomigration in lead-free solder alloys under alternatingcurrent: An experimental study. International Journal of DamageMechanics,23(2), 203–221.
Yao, Y., Zhou, Y., & He, L. (2013). Corrosion behavior of molybdateconversion coating on AZ31 magnesium alloy in NaCl solution.Anti-Corrosion Methods and Materials,60(6), 301–311.
Yext, W. F., et al. (1983). Improved glass-to-metal sealing throughfurnace atmosphere control. IEEE Transactions on Components,Hybrids and Manufacturing Technology CHMT-6 (pp. 455–459),December
Ylikorpi, T., et al. (1995). Development of an actuator for CAPS onspacecraft Cassini. In Proceedings of 6th European Space Mecha-nisms Conference (pp. 97–101). Zurich, Switzerland, (ESA SP-374).
Yoder, D. D., et al. (1993). Technical article on plated through holefatigue life, Part 2. IPC Review,34(5), 20–27.
Yost, F. G. (1976). Indium soldering on gold. In Proceedings ofInternational Microelectronics Symposium (p. 61).
Yost, F. G., et al. (1976). Layer growth in Au-Pb/In solder joints.Metallurgical Transactions A,7A, 1141–1156.
Zhang, W., & Jin, H. (2009). Study of tungsten metallization surfacestates for multilayer ceramics. In IEEE Proceedings of ICEPT-HDP’09 International Conference. Beijing, China, August 10–13.
Zhao, H., et al. (2013). Controlled atmosphere brazing of aluminiumheat exchangers. Welding Journal, February 44–46.
Zimcik, D. G. (1987). Effect of long-term exposure to LEO spaceenvironment on spacecraft materials. Canadian Aeronautics andSpace Journal,33(1), 4–10.
Zirker, L. R., et al. (2007). Weld tests conducted by the Idaho NationalLaboratory, INL/EXT-07-12289.
Zou, L., Dunn, B. D., et al. (1999). An evaluation of the effect of ageingon the cleanability of solder flux residues. Soldering and SMTJournal,11, 27–35.
Zwanenburg, R. (1995) The qualification test programme of the Envisatsolar array mechanism. In Proceedings of 6th European SpaceMechanisms Conference (pp. 65–72), Zurich, Switzerland. ESASP-374..
References 653
Index
0–90.5 N thruster, 2902 m diameter L-band dish antenna after test, 2983D printing (or Additive manufacturing), 12, 3350In50Pb, 45450In50Pb solder joints, 3556061, 17996Sn–4Ag solder alloy, 356
AAA 2017, 253AA 2024-T81 (bar, rod), 539AA 2219, 33, 51, 103, 217, 225, 325, 545AA 2219-T81, 539AA 2618, 183AA 7020, 325AA 8090-T8771, 249Ablation, 46Ablative material, 34, 36, 37, 46, 262, 502, 524. See also Re-entryAblebond 8175A, 415Accredited laboratories, 105Acicular alpha, 126Acoustic emission, 89Acoustic emission sensors, 94Acoustic emission signals, 93Acoustic microscope, 88Acoustic microscopy, 85Active metal process, 402Active systems, 23Additive layer manufacturing, 12Adhesive, 50, 56, 125, 413, 507Adhesive compounds, 533Adhesive filler, 304Adhesive film, 295Adhesive tape, 42, 188, 284Adhesive tape residues, 208Adhesive wear, 26Aeroshell, 46AF-E-332, 43, 290, 294Ag–Cu eutectic, 402Ageing tests, 339Airborne salt, 139AISI 304, 98AISI 440C, 296AISI E52100, 296Al-2195, 274Al-2219, 132, 133, 137, 237
Al-2219 wrought product, 136Alclad products, 134Al–Li alloy plate, 143Al–Li alloys, 103Al–Li cryogenic tank, 232Alodine, 529, 545Alodine 1200, 329Alodine 1200 coating on Al-2024-T3, 135Alodine finishes on common spacecraft aluminium alloys, 134α and ɛ for common spacecraft surfaces, 267α/ɛ for a selection of surfaces and finishes, 267α/ε values, 23Alpha-case embrittlement, 323Alphasat, 8Al–Si brazing filler metal, 181Alternate immersion test, 250Alulight®, 202Aluminides, 535Aluminium alloy, 19Aluminium alloy 2219, 98Aluminium alloy cooling loop, 129Aluminium Alloys Designations, 567Aluminium alloy temper designations, 567Aluminium-Beryllium Alloys, 288Aluminium honeycomb to face-skin, 304Aluminium-lithium alloy, 36, 83, 273Aluminium metallization, 469Aluminium metal matrix composites, 229Aluminium on carbon fibre reinforced PEEK, 224Aluminium-to-gold wire bond, 337Aluminium whisker growth, 470Aluminized FEP Teflon, 322AM-350, 318American Welding Society, 340Ammonium di-nitramide, 328Ammonium perchlorate, 328Amorphous silica, 290Analysis of surfaces, 99Anodized beryllium, 529, 532Anodized film, 308Anodizing, 134Antenna face-skin, 223Apogee-boost motors, 167AQ 60 I, 526Aqueous cleaning systems, 212ARALDIT, 539Araldite AV 138, 42ArallR, 45
Note: Bold page numbers are used for main references. An italic number refers to an illustration on the page.
© Springer International Publishing Switzerland 2016B.D. Dunn, Materials and Processes, Springer Praxis Books,DOI 10.1007/978-3-319-23362-8
655
Area grid array (AGA), 122, 426Area Grid Array packaging, 434Area Grid Array packages, 352Argon ion milling, 70Argweld enclosure, 182Ariane IV, 31Ariane 5, 232, 328Ariane 5 systems where white paint is applied, 238Ariane launchers, 325Ariane V, 32, 33Ariane V ‘half-fairing’, 66Asymptotic heating strategy, 150Atmospheres for Brazing, 404Atomic force microscope, 70Atomic oxygen, 168, 505, 522, 525, 540, 547, 554Atomic oxygen on materials, 517Atomic oxygen protective coatings, 505Atomic oxygen testing, 97Atomic oxygen with selected metals, 524Au2Al, 335AuAl2, 334AU4GN, 30Au80Sn20 braze alloy, 243AuIn2, 348, 365, 366AuSn4, 339, 360, 361Austenitic steels, 318Automatic electrical test equipments, 422Avcoat ablative material, 36AZ31, 129, 306AZ5GU, 30
BBacteria, 68, 72Bacterial and fungal growth, 42Baffle Cover Mechanism, 309Baffle hinge, 311Bake-out times and temperatures for PCBs, 392Balinite, 310Ball bonding, 332Barium-impregnated cathodes, 291Barrier layer, 358Beach marks, 271Beagle 2, 48Bearing friction, 299Bearing lifetimes, 304Bearing materials, 148Bearings coated with titanium carbide, 299Bearings under vacuum, 299Belleview spring fracture surface, 250Belleville spring, 250Benzene-based solvents for cleaning, 210Be-oxide layer, 530BepiColumbo, 25Berylliosis, 281Beryllium, 280, 283, 405Beryllium as a heat shield, 528Beryllium as-received parts, 285Beryllium foil, 286Beryllium foil with resulting mechanical properties and grain
structures, 287Beryllium machining, 281Beryllium S-200C, 20Beryllium sheet, 529Beryllium structures, 259Beryllium thermal protection, 526
BETA cloth, 540Bimetallic contacts, 18Bimetallic corrosion-related failures, 128Bi-stem deployment, 322Bi-stem deployment booms, 322Black anodized aluminium, 267Black anodizing, 270Black arrow, 111Black chromium, 269Black cobalt, 269Black pad, 176, 358, 359Black patina, 360Black-anodized aluminium housing, 317Black-anodized electrical connector, 308Black-anodized finish, 311Black-anodized layer, 311Black-body calibration mechanism, 306, 307Black-nickel plating, 269Blind bolt fasteners, 259Blow-hole, 160, 411Board distortion, 423Borosilicate glass, 35Brass turret terminal, 358Brass turret terminal pins, 359Braycoat, 539Brazeability, 400Braze alloy compositions, 400Braze alloy filler metals, 399Brazed joint, 341Brazing, 51, 239, 245, 329, 399Brazing alloy foil, 180Brazing fluxes and their removal, 403Brazing furnace, 404Brittle fracture, 247, 332Brittle-to-ductile fracture transition temps. in Pb-free and SnPb solders,
457Brominated flame retardants, 109Brush alodined weld zones, 59Brush debris, 506Brush plating at NASA MSFC, 236BS L93 alloy plate, 142Burn-in procedures, 341Butt joint between copper and nickel, 206Butt-welding process, 332
CCable cutter, 28Cadmium, 24, 108, 272, 327Cadmium fumes, 405Cadmium plating, 255Cadmium slivers, 313CAF growth, 396Calomel electrode, 387Capacitor, 352Capillary action, 341Capillary attraction, 399Capillary gaps, 214Capillary management systems, 327Capillary pump, 327Capillary screens, 172Carbon fibres, 36, 45, 164, 166, 168, 172, 247, 518, 532Carbon fibre reinforced polymers, see CFRPCoefficient of expansion, 557Carbon nanotubes (CNT), 44, 46Carbon nanotube structure, 44
656 Index
Carbon–carbon composites, 170, 531Carbon–carbon decelerator, 526Carbon-epoxy, 36Carbon fibre mesh, 44Carbon–silicon carbide composites, 531Cassini, 526, 528Catalyst deactivation, 290Catalyst particles for hydrazine decomposition, 288Catalyst particles, 289, 290Catalytic bed thruster motors, 512Cathode emitter degradation, 291Cathode emitter degraded by sintering of porous tungsten, 298Cathode emitter surface, 293, 296Cavitation at the inclusion-to-matrix interface, 265Ceramic capacitors, 410Ceramic chip capacitor with internal voiding, 88Ceramic matrix composite fasteners, 535Ceramic matrix composites, 534Ceria doped micro-sheets, 28Cesium, 24CFRP, 11, 26, 36, 91, 166, 293, 505CFRP delaminations and fractures, 295CFRP face-skins with an aluminium honeycomb, 293CFRP waveguides, 168Charcoal black finish, 227Chemglaze, 547CHEMGLAZE, 539Chemglaze Z306 black paint, 275Chemical analysis, 71Chemical conversion, 329Chemical conversion coating for magnesium alloys, 129Chemical conversion coatings, 134Chemical (elemental) content of a typical spacecraft electronic box, 112Chemical stripping, 496Chromate conversion coating, 129Chromate conversion coating on cadmium-plated steel, 275Chromate primers, 107Chromium and nickel sublimation, 276Circuit design, 423Circumferential in-place pipe welding, 196Cleaning efficiency, 391Cleaning method, 275Cleaning of flux-contaminated surfaces, 389Cleaning of flux residues, 351Cleaning of individual parts, 210Cleaning of metallurgically joined assemblies, 212Cleaning processes associated with spacecraft mechanical systems, 207Cleaning silicone contaminated surfaces, 219Cleanliness, 216, 218Clean-room practice, 313Cleavage cracks, 248Coatings and conversion coatings, 268Coatings for soldering applications, 357Coaxial cable assembly, 356Coefficient of expansion, 557Coefficient of (linear) thermal expansion, 349, 401, 557Coil spring, 309Coin or tap test, 83Cold-drawn springs, 318Cold pressure weld, 299Cold sprayed coatings, 223Cold-weld, 339, 549Cold weld database summary tables, 307Cold-welded particle, 309Cold welding, 25, 26, 83, 120, 299, 305, 354, 381Cold welding due to cyclic, impact loading, 306
Cold welding of mechanisms, 304Cold welding of stranded wires, 380Colinal, 269Collected volatile condensable material, 40Colophony fumes, 398Column grid array interconnections, 440Column grid arrays, 426Combustion chamber, 33Commercial off-the-shelf components (“COTS”), 63Communication satellite systems, 7Company cleaning plan, 210Comparison Tables (Alloys), 571Compatibility of Liquid and Solid Propellants with Components and
Subsystems, 326Compatibility testing, 210Compatible coupling, 17Component cracking, 424Component part selection, 66Component part selection, and procurement, 61Composite contact rivets, 165Computer tomographic scan, 438Computerized X-ray tomography, 88CONATHANE, 432Condensation of outgassing products, 505Condensation rates, 273Condensed cadmium contaminant on surface of painted shroud, 275Condensed moisture, 129Condensed organic contamination, 259Conductive adhesives, 425Conductive Anodic Filament (CAF), 393, 394Conductive coatings, 238Conductive silicone adhesive, 271Conductor track failure, 428Conformal coating, 393, 428, 432, 540Connector bodies, 313Connector-to-coax assemblies, 356Contact devices, 164Contaminant particles, 309, 549Contamination, 65Contamination of Invar moulding tool, 312Controlled atmosphere brazing, 181Conversion table for mechanical properties, 565Co-planarity problems, 423Copper comb patterns, 392Copper-palladium alloy, 165Copper ribbon column fracture, 440Copper–silver eutectic preforms, 132Copper sulphate test for ferrite, 138, 318Copper–tin intermetallic layer, 149Copper-to-enamel interface, 370Copper-to-silver-plating interface, 358Cork, 37, 46–48, 524Cork TPS tiles, 48Corona, 27, 390, 442, 445, 504Corona discharge, 444Corona effects, 371Corrosion adjacent to dip brazed fillet, 179Corrosion of stored spacecraft electronic components, 40Corrosion potential, 17Corrosion potential of metals, 14Corrosion prevention, 17Corrosion product, 541, 546Corrosion testing, 75Corrosion, 390, 540Corrosion-resistant fastener materials, 253Cosmetic defect, 119, 411
Index 657
Cosmetics of solder fillets, 410Cosmic ray detectors, 451Counterfeit fasteners, 253Cracked barrel, 120Cracked ceramic chip capacitor due to vibration, 421Cracked leads on a thick-film carrier package, 174Cracking of glass-to-metal seals, 410Crack initiation, 349Crack propagation rate, 27Cracks in CFRP, 300Cracks in Inconel heater housing, 278Cranes, 63Crimpability, 370Crimping tools, 339Crimp joint, 337Crimp-termination characteristics, 343Critical design review, 22Critical processes, 621Cross section polisher, 337Cross-section through a solar array, 190Cryocon®, 198Cryofit®, 198, 201Cryogenic bearing, 229Cryogenic propellants, 29Cryogenic temperatures, 369, 455Cryogenic temperature materials, 26, 43, 149, 220, 229, 318, 320, 329,
369, 379, 454, 490Cryostats, 27Crystallographic planes, 98C-SAM, 439Cu2O, 370Cu3Sn, 361, 372, 376, 412Cu6Sn5, 330, 361, 364, 412, 413, 474CuA12, 131CuAl2, 133CubeSat, 11, 45, 63, 615Curie temperature, 318Custom 455, 146CV 1140–0, 431CV 1144-0, 432
DD6AC, 34DC93-500 space grade, 42Debond and fracture of CFRP, 299Debris, 509, 512Declared Materials List (DML), 10, 58, 116, 262, 309, 625Declared Process List (DPL), 58, 419, 621Defective solid rocket motor case, 28Defects in titanium piece-parts, 323De-golding by immersion, 360Delamination, 84, 303, 392Delrin, 505Delta ferrite, 315Dendrites, 395Densimet, 306Deployable nitinol strut, 200Dermatitis, 398Design margins, 11Destructive physical analysis, 57Dewetted area of pad, 152Dewetting of pad, 153Dewetting on areas to be soldered, 150Dewpoint, 405Diamond, 220
Diamond grit metal matrix composite, 222Diamond pyramid hardness impressions, 336Diaphragm, 38, 288Dichloromethane, 211Dicronite, 310Dielectric breakdown, 359Dielectric properties, 392Differential heating, 509Diffusion bonding, 197, 203, 206Diffusion brazing, 399Diffusion of zinc, 359Diffusion soldering/brazing, 408Diffusion soldering process, 409Diffusion welding, 105DIGESIL, 315Dimensional stability, 170Dip brazing of aluminium alloys, 179Dip brazing, 181, 399, 405Dipole connection, 362Disassembly of orbiting space hardware by astronauts, 305Disposable mandrels, 177Dissimilar FSW, 233DNA, 70Dog bone tensile sample, 47DOW 17, 129Dry-heat ageing, 371Ductile dimple fracture, 249Ductile intermetallic compounds, 365Dye penetrant, 442Dye penetrant testing, 58, 139, 208, 255, 323, 408Dye penetrant test method, 439Dynamic outgassing testing, 97
EEarth’s magnetic field, 508EB brazed joints with Au80Sn20, 242Ebonol black, 269EB-welded 2219-T851, 141EB welding machine for reflow brazing, 239ECCOBON, 539ECCOFOAM, 539Eccoshield tape, 196ECM failures, 394ECSS-Q-ST-70-02, 38ECSS-Q-ST-70-38, 353EG8050HC, 415Elastomer type AF-E-332, 288Electrical bonds, 329Electrical conductive adhesives (ECAs), 413Electrical feedthrough, 444Electrical grounding, 17, 223, 235, 329Electrical interconnections, 329Electrical open-circuit, 320Electrical resistance testing at room and cryogenic temperature, 455Electrical resistance weld, 330, 331Electrical resistivity, 339, 458Electrochemical migration (ECM), 359, 360, 392, 393, 393, 462, 540Electrode housing, 240Electrode housing materials, 242Electro-etch cleaning, 237Electro-explosive devices, 264Electroforming processes, 176Electroless nickel deposits, 173Electroless nickel plating, 318Electroless nickel plating of aluminium electronic housings, 175
658 Index
Electromagnetic emission, 196Electromagnetic emission from TIG welding equipment, 195Electromigration, 468, 470Electron beam weld, 132, 184Electron beam welding, 51, 184, 185Electron-beam-welded titanium alloy, 185Electronic box, 62, 88, 110Electronic circuitry, 329Electronic housings, 329Electronic package, 427Electroplated nickel, 174Electrostatic discharge, 418Elemental analysis, 97Ellingham diagrams, 400, 613Emafil Technology, 370Embrittlement of copper, 127Embrittlement of titanium alloys, 255Enamel-coated copper, 370Energy conversion element, 200Energy-dispersive x-ray analyser, 71Engineering drawing, 116Environmental conditions, 20Epotek E2116, 415Epoxy smearing, 159Epoxy top-coat, 394ePTFE, 46ERS-1 spacecraft, 167Etchants, 561Etching of metals, 561Etching solutions for beryllium, 285Ethical issues, 104Eureca, 520European retrievable carrier (EURECA), 503Eutectic tin–lead solder alloy, 341EVA joining/cutting activities, 50Evaluation of solderability, 372Evaporation rates, 272Examination of fracture surfaces, 247Exhaust plume, 328Expendable launch vehicles, 28Explosively welded transition ring, 187Explosive welding, 186
FFailed ABM case, 264Failed ball-bearing, 304Failed component lead, 384Failed rhenium tube from electrothermal thruster, 283Failed spacecraft antenna, 293Failed video camera electronic circuit, 541Failure investigation, 99Failure mechanism associated with surface-mounted devices, 425Failure mode analysis, 57Failure of RF cables connected by SMT, 428Failure review board (FRB), 21, 102Failures due to board flatness problems, 422Faraday shielding, 37Fastener failure due to forging defect, 254Fastener manufacturers, 253Fastener specifications, 255Fasteners, 251, 533Fatigue life, 367Fatigue striations, 248Fatigue tests, 78Ferromagnetic materials, 317
Fibre-reinforced glass ceramics, 170Fibre-reinforced plastic composites, 166Fill and drain nozzle, 198Fingerprint greases, 127Finishes for titanium and its alloys, 310First-aid equipment, 405Five-stage model for whisker growth, 483Flammability, 42, 540Flammability hazard, 370Flat-packs, 351Flatwise tensile tests, 296Flawed primary mirror, 11, 60Flexible circuits, 159Flexible second surface mirrors, 271Flexible waveguide, 121Flight harness materials, 550Floating grains, 349Fluorescent penetrant inspection, 262Fluorides, 405Fluorinated ethylene propylene, 159Fluorine attack, 375Flux residue, 384, 391, 546Flux types for engineering metals, 387Flux-corrosion of silver-plated stranded wires, 383Foamed aluminium for damping, 202Focused ion beam (FIB) microscope, 70Fourier transformation infrared (FT-IR) spectrometers, 100Four-point bending test, 76Fracture at cryogenic temperatures, 454Fracture locations in coating, 237Fracture mechanics testing, 76Fracture surface of a circular metallized (Ti–Pd–Ag) contact pad, 271Fracture toughness, 83Fretting, 83Fretting test, 229Friction, 25Friction stir joining and welding, 12, 34, 36, 52, 189, 231, 234Friction stud welding, 234FTIR, 391FT-IR analysis, 317Fuel lines, 324Fusion welding, 182Futuristic ideas, 11
GGalileo spacecraft, 308Gallium–palladium–silver braze alloy, 403Galvanic compatibility, 388Galvanic copper corrosion, 378Galvanic corrosion, 386, 389Galvanic corrosion of fasteners, 257Gamma-ray detectors, 286Gamma-rays, 83Gamma-TiAl alloys, 196Gapasil brazing alloy, 273Gas-tight joint, 120Gas-tightness, 339, 340Gas-tightness test, 338GCMS, 40Gecko biomimetic adhesive tape, 45Girth weld, 68GlareR, 45Glass to metal seal, 467Glass-rich oxide whiskers, 467Glossary, 629
Index 659
Gold, 110Gold–aluminium system, 332Gold-embrittled solder joint, 363Gold embrittlement, 360Gold embrittlement of solder, 362Gold in solidified solder, 361Gold-plated conductor material, 363Gold-plated dipoles, 361Gold-plated surfaces, 360Gold removal, 348Gold-rich intermetallic phases, 334Gold-tin binary phase diagram, 242Gold wires, 332Grain boundary embrittlement, 127Grain boundary embrittlement in beryllium, 286Grain growth, 332Grain growth and internal cavitation, 280Graphine, 43, 44, 220Graphite fibre thermal strap assemblies, 221Graphite lubricants, 258Graphitization treatment, 166Greases, 311Green chromated, 274Green CuCl corrosion, 133Greener spacecraft, 106Green plague, 375, 386, 542Green propellant, 109, 327, 328Griffith cracks, 324Ground activities, 20Ground handling, 65Ground-handling facilities, 63Guianese Space Centre, 325
HHabitable structure, 12Hairline cracks, 184Hard-anodised layer on AA7075 alloy, 225Hard anodizing of Al-7075 alloy, 225Hard anodizing treatments, 129Hard chromium, 27Hardness testing, 73Harness, 319Health Hazards in the Electronic Assembly Area, 398Heat Affected Zone (HAZ), 126, 184, 185Heat-affected zone of laser welds, 186Heat exchanger, 546Heat shield, 34Heat shield materials, 524, 531Heat transfer in vacuum, 221Heater filament, 90Heater investigation, 277Heater sublimation problem associated with thruster motor, 276Heat-shrinkable sleeves containing solder preforms, 381Hemispherical emittance, εn, of the anodized, 531Hermes spaceplane, 532Hermetically sealed assemblies, 399High-absorption surfaces, 269High-definition radiography, 86High-definition X-radiography, 276High-performance fasteners, 262High-precision bearings, 296High-temperature brazing, 404High-temperature fasteners, 533High temperature rating, 370High voltage interconnections, 442
Hillocks, 469, 470Hi-lok TM fasteners, 34Hinged-tube, 198Hipparcos, 308Holddown and release unit, 308Hold-down button, 554Hold-down points, 229Hole-drilling strain-gauge method, 94Holographic interface bond tester, 294Holographic interface tester, 85Holographic interference inspection of failed antenna, 301Hot-air-levelled coatings, 160Hot-dipped galvanization, 139Hot oil fusing of tin–lead, 148Hot plate method, 161Hot-pressed beryllium, 259hot-pressure mounting of samples, 343HST solar array, 506Hubble Space Telescope, 11, 50, 60, 190, 321, 322, 505Human activities on the Moon, 502Human contaminants, 100Human error, 115Humid environment (moisture), 170Huygens probe, 527Hybrid packages, 415Hydrazine, 327Hydrazine contamination levels, 295Hydrazine (N2H4), 30Hydrazine propulsion tank, 68Hydrazine tank, 288Hydrazine tank diaphragm, 294Hydrazinium nitroformate, 328Hydrogen bake-out, 124Hydrogen embrittlement, 122, 255Hydrogen embrittlement of spring steel, 123Hydrogen embrittlement of steel fasteners, 255Hydrogen embrittlement relief, 176Hydroxylammonium nitrate, 328Hygroscopic contaminants, 394
IIdentification of leak paths, 279Impact crater, 555Impact feature, 520Impact records, 517Impact test facility, 84Impact testing, 310Impact/fretting test equipment, 307Inconel 600, 265Inconel 718, 20, 27, 126, 147, 253, 319INCONEL 718-PH, 539Inconel alloys, 318Indium solder alloys, 363Indium–lead soldered to various gold interfaces, 365Indium–tin oxide, 271Industrial placements, 103Infrared Space Observatory, 27Infrared Space Observatory cryostat, 320Infrared spectroscopy, 101Inorganic glasses, 507Inspection, 434Inspection criteria for brazed joints, 407Inspection criteria, 406Insulation materials, 369Insulation stripper, 337
660 Index
Interference fit, 259, 337Intergranular cracking attributed to stress corrosion, 249Intergranular cracks, 184Intermetallic compounds, 361Intermetallics, 331International Space Station (ISS), 42, 236, 501, 536Invar, 314, 319Ion chromatography, 391Ionic contamination levels, 391IPC J-STD-001, 353Iridium catalyst, 290Iron–nickel–copper alloy, 318ISO 9001, 56Isopropyl alcohol (IPA), 212, 390
JJames Webb Telescope, 229, 509J-leads, 424, 425Joining metals to thermoplastics, 12Jupiter space probe, 285
KKapton, 518, 523, 550Kapton films, 271Kapton thermal blanket, 548Keronite coating, 227Keronite PEO, 225Kevlar, 63, 516Kevlar-49 reinforced plastic, 166, 169Kirkendall voiding, 335Kovar, 132, 174, 330, 363, 357, 423, 467Kovar lead material, 173, 348Kovar leads, 383
LLaboratories, 56Laboratory notebooks, 100Laboratory records, 100Laminar flow bench, 81Laminography, 88Lap welds, 332Large diameter stranded wires, 340Laser annealing, 176Laser beam welding, 185Laser welding, 52Laser-welded spacecraft axle shaft, 186Laser-welded Ti6A14V, 186Launch, 20Launch and operations readiness review, 22Launch site exposure and corrosion, 138Launch vehicle connector, 311Launch vehicle release gear mechanism, 314LDEF, 503, 516, 517, 520Leaching of silica, 291Lead coatings, 505Lead-free control plans, 494Lead-free solder alloys, 341Leadless ceramic chip carriers, 355, 360Leadless chip carrier, 431Leadless surface-mounted devices, 351Leaking battery cell, 194Leaking cartridge, 265Leaking ceramic-to-metal seal, 131
Leaking detector, 286, 288Leaking heaters, 276, 277Leaking kerosene cans, 448Leaking lead glass seals, 468Leaking lower seal joint, 61Leaking tanks, 325Leak tests, 317Liberator TM, 49Lifting gear, 63Lightening, 139Lightning, 37Light pollution, 107Limited shelf life, 56Limpet teeth, 45Limpet tooth material tooth, 47Liquid and gas chromatographic techniques, 97Liquid crystal polymers (LCPs), 48Liquid helium, 312Liquid helium cryostate, 319Liquid helium temperature, 451Liquid metal embrittlement (LME), 139Liquid penetrant tests, 82Liquid phase infiltration, 532Liquid propellants, 326LISA Pathfinder mission, 239Lock-nuts, 261Low Earth Orbit (LEO), 501, 518Low-emissivity surfaces, 268Low-expansion materials, 163Low-temperature magnetic properties, 319Low-voltage applications, 340Lubricants, 42, 503Lubricants suitable for use under high vacuum, 258Lubricating oils with low outgassing properties, 209Lubrication, 21Lunar soil, 13
MMAPSIL 213, 432Macroscopic examination, 67MAGE apogee boost motors, 90MAGE motor, 169Magnesium, 20, 24Magnesium alloys, 129Magnesium–lithium alloys, 273Magnet, 318Magnetic cleanliness, 175Magnetic coercivity, 175Magnetic field generated by a spacecraft, 317magnetic moment, 370Magnetic permeability, 318, 319Magnetic problems, 317Magnetic shield materia, 318Magnetically clean, 62Magnetometers, 317MAGNOLYA chemical surface treatment, 130Mandrel materials for electroforming, 176Manganin wire, 379Manned compartments, 535Manned spacecraft, 432Manned volumes, 538Manual tungsten inert gas (TIG) arc welding, 181Manual welding, 182Manufacturing processes, 116MAPSIL 213, 42, 431
Index 661
Maraging steels, 30Martensitic high-strength alloys, 138Martensitic stress induced transformation, 318Martensitic transformation, 202Material group numbers, 617Material review boards, 408Materials and processes, 58Materials and processes standards related to space, 619Materials engineer, 21Materials laboratory, 64Materials making up soldered joints, 349Materials review board, 102Mean time before failure, 469Mechanical electrical connections, 337Mechanical fastener tool, 50Mechanical finishes, 134Mechanical parts and process controls, 616Mechanical properties
AA 8090 and other Al-Li alloys, 102, 143AA 2219 various heat treatments, 102, 141beryllium, 287BS L93, 142electronic materials at different temperatures, 368, 451, 458fastener materials, 253spring materials, 146tin whiskers, 487
Mechanical properties conversion table, 565Mechanical properties of near-eutectic tin–lead alloys, 451Mechanical shock, 422Mechanical testing, 73Mechanical-type strippers, 338Mechanism and the grounding plane, 305MEDET instruments, 231MEMS, 11Metal alloy comparison tables, 571, 611Metal matrix composites for spacecraft pressure vessels, 172Metal migration, 164Metal oxide precipitation in glass seal., 467Metal oxide whisker, 466Metallic contamination particles, 312Metallic fragment, 314Metallic particle generation, 258Metallic particles, 309Metallographic control, 330Metallographic examination, 343Metallographic presentations, 102Metallography, 97Metallurgical joint, 358Metallurgical laboratory practice, 69Metallurgical reaction, 331Metal-matrix composite, 427, 161Micro-arc oxidation, 224Microcracked electroless nickel, 173Microcracked thin-foil detector windows, 286Microcracking of diode lead surface, 173Microfocus x-radiography, 91Micrographs of tin-plated strands, 375Micrometeoroid, 509, 512, 555Micrometeoroid impact, 506, 518Microscopic examination, 67Microspheres, 36Microstructure of milled and stress-relief-treated beryllium, 284Microstructure of solder alloys, 343Microtome, 70, 292Microtome section of life-tested cathode, 297Micro-VCM test, 97
Micro-VCM test equipment, 41Microwave horn, 176, 177Microwelding, 182Microweldments, 330Migration of silver sulphide tarnish, 269Mir space station, 52, 537MISSE, 503Model philosophy, 21Modern assembly room, 341Modern bearings, 299Modification, 409Moisture ingress, 392Moisture pick-up, 26Molybdenum, 240, 277, 280, 462Molybdenum disulphide, 25, 305, 506, 518Molybdenum–titanium phase diagram, 244Molybdenum whiskers, 462, 464Mo–Mn metallization system, 360Mono-methyl hydrazine (MMH) and nitrogen tetroxide, 327Monopropellant hydrazine thrusters, 276Monopropellants, 328Moon rock, 502Moon-rock analyses, 501Moore’s law, 461Morphology of wear particles generated from sliding contacts, 165MoS2, 217MoSTTM, 257Motor exhaust plume, 514Motor thrust frame, 34, 232Moulding tools, 312Mounting of chip parts, 416MP 35N, 147Multilayer board internal connections, 155Multilayer boards with high heat capacity, 161Multilayer ceramic capacitors, 351Multi-layer insulation blankets, 28Multilayer PCB, 84Multiphase MP35 N, 253Mumetal, 318Mutually soluble in the solid state, 165Mylar films, 271
NNano-ceramic technology, 222Nanocomposites, 414Nano-grained alumina, 220Narloy-Z, 32, 33Natural rosin, 391Neutron diffraction method, 94Neutron radiographs, 92Neutron radiography, 86Nextel ceramic cloth, 516Ni3P, 176Ni3Ta, 332, 333Nichrome heater coil, 278Nickel alloys, 19Nickel coatings on Ti6Al4V, 235Nickel finishes, 370Nickel phosphide (Ni3P), 174Nickel phosphide precipitates, 358Nickel ribbon, 331Nickel sulphide process, 308, 317Nickel–cadmium battery cell, 117, 131Nickel-clad conductive LCP fibres, 49Nickel-plated copper braid, 49
662 Index
Nickel-to-copper brazed joint, 402Nickel-to-nickel electrical resistance microwelds, 332Nickel-to-nickel welded electronic circuits, 330Nickel-to-phosphorus ratio, 175Nickel-to-titanium alloy brazed joint, 403Niobium, 535Nitinol, 197, 200, 201Nitinol-deployed lattice mast, 199Nitrided stainless steel, 138Nitrogen tetroxide (N2O4), 30, 327Nomex cloth, 548Non-captive nut, 356Non-conformance board, 102Non-conformance reports, 544Nonconforming fasteners, 262Noncoplanarity, 423Nondestructive testing, 82Non-metallic materials, 38
OOddy test method, 40Odour, 540Offgassing, 40Open circuit, 358, 390, 431Open-circuit failures, 320Optical fibres, 42Optical materials, 42Optical microscopy, 67Optical properties (α/ɛ ratio) before and after testing, 268Optical solar reflectors (OSR), 270Optical spectroscopy, 97Orbital test satellite (OTS), 7, 28Organic chemistry, 97Organic fastener lubrication systems, 257Organic materials, 503O-ring, 61O-ring seals, 43Orion crew module pressure vessel, 274Orion spacecraft, 36OTS-2, 9Outgassing, 38, 540Outgassing data for flux residues, 390Oven bake-outs, 423Over-ageing, 251Oxyacetylene gas welding, 182Ozone-depleting chemicals, 107
PPaints, 42Parameters for bake out, 393Particle radiation, 23Particle size, 72Particles generated from spacecraft fasteners, 261Particles of beryllium, 262Particulate contamination, 398Parting compound, 314Paschen-like curves, 446, 447Passivation treatment, 138Passive systems, 23Passive thermal control systems, 266Pathfinder mission, 200Payload-support structures, 167Pcb finishes, 148PCB laminates properties, 557
PEEK, 308PEEK composite, 223Peel strength versus ageing time, 368Phase diagram, 25Philips Globule method, 371Phosphorous-rich surface, 359Pinch-off for tube sealing, 317Pinch-off seals, 317Pinhole, 121, 129Pitting and leakage of an aluminium cooling channel, 131Pitting corrosion, 328Plagues, see Green, Purple, Red and White plaguesPlasma cleaning technology, 212Plasma electrolytic oxidation (PEO), 224, 225, 229Plasma electrolytic oxidation treatment, 308Plated finish on copper conductors, 369Plated-through hole, 152, 410Platinum grain growth, 281Platinum group metals, 534Platinum ribbon, 277Platinum ribbon grain boundary, 277Polyacrylonitrile, 166Polybutaidene acrylonitrile, 30Polyglycidylazide, 328Polyvinyl chloride (PVC), 369Polyxylene, 429Porosity during a solderability test, 160Porosity in weld bead, 118Porous gold plating, 269Positive air pressure, 344Post-flight inspection, 190Post-flight materials, 501Post-flight observations, 501Post-flight tribological assessment of the Hubble Space Telescope solar
array mechanisms, 303Potting compounds, 42Power cycling, 352Power (I2R) loss, 370Power system weldments, 189Precipitation hardening, 138, 251, 252Precipitation-hardening stainless steels, 403Preconditioning, 357Preferred materials for short-term evaluation, 539Preliminary design review, 22Pressure vessel steel, 93Primer coating, 274Printed circuit board assemblies, 559Printed circuit boards, 148Printed-circuit-board (PCB) evaluations, 79Problems associated with brazing, 399Process documents, 405Process identification document, 420, 422Process identification documentation, 418Produce assurance applied to brazing operations, 405Product assurance management, 55Project review boards, 21Propellant, 29Propellant Management Device (PMD), 172Propellant motors, 30Propellant tanks for the Ariane-5 launch vehicle., 205Propellant tanks manufactured from Ti6Al4V, 171Properties of fluxes, 396Properties of printed circuit laminates, 559Properties of tin whiskers, 485Protection shields, 515PTFE, 25, 43, 49, 175, 188, 211, 258, 305, 310, 315, 353, 356
Index 663
Pull-off strength of coatings, 238Pulsed laser to repair solar cell interconnection welds, 186Purple Plague, 334–336, 332Pyrel foam, 552Pyrex glass, 319Pyrotechnic, 92Pyrotechnic actuator device, 422Pyrotechnic cutter, 265
QQuad flat packages, 422Qualification review, 22Quality assurance, 55, 66Quality assurance controls for fasteners, 261Quartz optical solar reflector, 271
RRadiation effects, 507Radiation testing, 63Radiation, 25, 62, 547Radiography, 83Random vibration, 420Rapid protyping, 12REACH, 42, 106Re2O7, 278Recovered mass loss, 40Recuperation of unsolderable PCBs and component leads, 413Recycling, 106, 108Recycling electronic waste, 110Red plague, 370, 375, 376, 377, 378Re-entry, 520, 536Re-entry vehicles, 170Reflow of capacitor solder, 158Refractory metals, 534Regolith, 12, 13, 502, 503Reinforced carbon/carbon, 35Release triggers made of Nitinol, 199Reliability and safety, 57, 66Removal of silicone polymers, 314Removal of work-hardened layers, 285Repair, 409, 432Repair and modification of assemblies, 341Reprocessing pure tin terminations, 495Residual fluxes on spacecraft PCBs, 393Residual stress, 93, 98Residual stress measurements, 477Residual Stresses in Weldments, 195Resistance measurements, 329Resistance pressure welding, 330Resistance spot welding, 116, 329Resistance to thermal cycling environment, 432Resistance-welded silver–mesh interconnector, 191Resonance, 422Reusable tanks, 183Rework, 409Rework and repair of AGAs, 441Rework of soldered joints, 408Rework on composition of joint, 412Reworking of spacecraft assemblies, 410Rhenium, 278River patterns, 248Rivet compositions, 253Rocket motor nozzles, 170RoHS, 107, 494
Rosetta, 28Rotary dip method, 153Rotating weld pin during FSW, 232RTV 560, 35, 533RTV 566 silicone, 42Rubber diaphragm, 290Rubbers, 42
SSADM off-load device, 202Salinity maps, 139Salt spray corrosion tests, 308Salt-spray cabinet, 80Sapphire crystals, 245SAX spacecraft, 187Scanning electron microscope (SEM), 68, 71, 247Scanning laser acoustic microscope (SLAM), 85, 87SCC evaluation, 140Scotchcast, 431SCOTCHCAST, 432SCOTCH-WELD, 539Screen out magnetic items, 318Sea coast corrosion, 82Sealing of glass and beryllium windows, 369SEAMS introduced during rolling, 256Second phase precipitates, 251Secondary ion mass spectrometry, 99Selection of materials and processes, 10Selective brush electroplating, 234Selective brush plating, 235Self-healing materials, 45Semi-rigid cables, 341Semi-rigid cable solder joint fracture due to gold embrittlement, 362Semi-rigid RF cables, 428Shape-memory alloys, 197Shape memory polymers, 44Sharp fillets, 444Shell 405 catalyst, 289Shielding gases, 127Shock loading, 458Shock wave, 265Short circuit, 313, 360, 395, 486Shuttle tile, 35, 533Silica glass microspheres, 46SiC fibres embedded in a matrix of Ti6A14V, 162SiC monofilaments in an aluminium matrix, 171SiC monofilaments within an AA 2014 matrix, 164SILGEST, 315Silicide-coated fasteners, 536Silicon carbide fibre reinforced metal matrix composites, 37Silicon carbide fibre reinforced titanium alloy matrix, 39Silicone contaminants, 317Silicone contamination, 219, 310, 505Silicone oil, 311, 418Silicone oil contaminant, 317Silicone products, 219, 311, 505Silver coatings, 360Silver finishes, 370Silver mesh, 525Silver migration, 359Silver wire, 331Silver-coated molybdenum interconnector weld, 193Silver-filled thermosetting epoxy resins, 413Silver-graphine, 414Silver-loaded epoxy, 415
664 Index
Silver-plated conductors, 371Silver-plated solid copper wire, 337Silver-plated steel stiff-nuts, 261Silver-plated wire, 339Silver-plated wire strands after solderability testing, 373Sine vibration, 420Skin effects for RF transmissions, 370Skin-flake, 100Skin secretions, 100Slip rings, 23, 311SMT solder joint failure due to Conformal Coatings, 428SMT verification sample, 430Sodium polysulfide test, 377Solamide 301 foam, 552Solar absorbers, 267Solar absorptance, 270Solar array, 358Solar array deployment/retraction system, 322Solar-Array Drive Mechanism (SADM), 199Solar blankets, 547Solar reflectors, 267Solder assembly facility, 344Solder column, 426, 439, 441Solder copper wire joint failure, 364Solder dipping, 497Solder fillet, 352, 443Solder flux, 540Solder flux vapour, 339Solder joint repair, 540Solder paste, 436Solder Sleeves, 551Solder sphere, 511Solderability, 155, 371, 386Soldered interconnections, 340Soldering, 329, 340Soldering fluxes, 380Soldering parameters, 341Solder-plated lead wire, 330Solders, 108Sold propellants, 328Solid lubricants, 26Solid solution, 25Solid-state diffusion of platinum, 277solid-state interdiffusion, 333Solithane, 509, 510SOLITHANE, 432Solithane 113, 454Solvent resistance, 432Sound absorption coefficient of different foamed aluminium, 203Sources of Failure, 115South Atlantic Anomaly, 508Space-approved greases, 257Spacecraft antennae, 312Spacecraft antenna face-skins, 167Spacecraft charging, 27Spacecraft detectors, 187Spacecraft failures, 61Space environment, 22, 23Space environment effects, 504Spacelab, 27, 42, 339, 501Spacelab post-flight hardware, 542Spacelab processing and integration, 543Spacelab-1 located in the shuttle cargo bay, 544Space launch vehicles, 28Space radiation environment, 507Space Shuttle, 319
Space Shuttle External tanks, 231Space tribology, 305Spalling, 270Specimens made from beryllium, 281Spectroscopic methods, 72SPELDA, 94Spliced wire joints, 551Spot-welding, 179Spring clip, 337Spring materials, 144Stablecore®, 353Staking compounds, 422, 426Standard free energy of formation of oxides with temperature, 613Standard reference electrode, 389Standards for soldering spacecraft electronics, 342Standards related to space, 619Stand-off height, 351, 353, 391Steam ageing, 371Steel alloys, 19Steel alloys generally considered suitable for spring manufacture, 146Steel wires, 320Steel wire-to-nickel tube welding operatio, 320Stress corrosion, 327Stress-corrosion crack in the tank wall, 326Stress-corrosion cracking (SCC), 19, 139, 325, 384, 540Stress-corrosion failure, 249Stress corrosion of component lead material, 383Stress-corrosion tests, 75Stress-induced deformations, 319Stress-raising defect, 254Stress-relaxation by thermal gradients, 319Stress-relief bend, 412Structural panels made from high-temperature titanium alloys, 207Students, 103Sublimation, 24, 272, 283, 508Sublimation of aluminium alloys, 181Sublimation of and condensation of cadmium and zinc, 274Sublimation of klystron cathode-heaters, 276Sublimation of Rhenium, 278Sublimation rate against temperature for Nichrome, 280Sublimation tests, 273Subsurface structures, 283Sulphur hexafluoride (SF6), 317Sun sensor experimental baffle, 230Sun-sensor, 63, 64, 209Superconducting at 4.2 K, 458Superconductive SnPb solders, 457, 458Superplastic forming, 196, 203, 206Surface analysis, 96Surface colourations, 127Surface-corrosion residue, 216Surface-diffusion layers, 323Surface electrical grounding, 329Surface insulation resistance (SIR), 392, 395Surface insulation resistance testing, 391Surface mount technology, 341, 419Surface of an FR-4 PCB board laminate, 392Surface protection treatments for aluminium alloys, 134Surface-tension tanks, 172Sustained stresses, 145SYLGARD 184, 432
TTack-weld, 179Tantalum foil capacitors, 333
Index 665
Tantalum lead wire, 332Tantalum wire lead, 333Tape testing (for coatings), 224, 234, 236, 237Technology Readiness Levels (TRLs), 10Technology samples, 419Teflon FEP, 505Temperature cycling, 509Temperature dependence of specific resistance, 456, 457Temperature gradients, 319Temper conditions of aluminium alloys, 567Tensile testing at 4.2 K, 451Test chamber, 8Textiles, 38Thermal control, 270Thermal control paints and coatings, 268Thermal cracking, 311Thermal cycling on work-hardened beryllium, 284Thermal cycling systems, 74Thermal fatigue, 271Thermal fatigue cracking, 79Thermal fatigue cracking of copper conductor, 429Thermal fatigue cracks, 349Thermal fatigue failures in printed-circuit-board, 78Thermal fatigue on leadless components, 351Thermal fatigue on semi-rigid cable connections, 353Thermal fatigue on solder-assembled leaded components, 344Thermal fatigue programme, 345Thermal history from microstructure, 262Thermal management, 509Thermal management materials, 220Thermal mismatch between SMD and substrate, 425Thermal protection system, 47, 536Thermal straps, 44Thermal strippers, 337Thermal–compression bonding technique, 332Thermal-cycled solder joints, 509Thermally conductive adhesives, 426, 427Thermally induced bending, 321Thermally induced vibrations, 321Thermo-compression, 334Thermoelectric generators, 28Thermomechanical test facility, 218Thermo-optical properties, 529Thermoplastics, 43Thermosetting plastics, 43Thermosetting resins, 319Thermount, 353Thick-film hybrid, 425, 426Threaded fasteners, 252Thread-rolling work-hardening, 252Throw-away modules, 105Thruster chamber, 132Ti–6A1–4V system and schematic representation of microstructures,
264Ti6A14V, 323, 403Ti6Al4V superplastically formed propellant tank, 204TiC coatings on steel, 299TiC-coated 440C steel ball, 305TIG-welded 2219-T851, 141TIG-welded aluminium–lithium alloy plates, 188Tin oxide, 489Tin pest, 448Tin plague, 448Tin whisker growths, 472Tin whiskers, 490Tin–lead coating procedure, 150
Tin-plated conductors, 371Tin-plated copper, 369Tin-plated wire, 339Tin-plated wire strands after solderability testing, 374Titanium, 20Titanium aluminide, 196, 531Titanium aluminides for high-temperature applications, 196Titanium carbide surfaces, 305Titanium filler metal, 125Titanium hydride embrittlement, 324Titanium hydride precipitates, 125Titanium hydrides, 323Titanium MMCs, 37Titanium nitride, 259, 299Titanium nitride coatings, 303Toe, 34, 291, 302, 314Toolboxes, 552Toroidal water tanks, 325Total mass loss, 40Toxicity, 42, 540Traceability, 56, 67, 101, 110, 255, 327, 379, 435, 495, 616Trained operators, 621Training and certification, 341, 415Training, 21, 82, 103, 115, 161, 208, 210, 323Transcrystalline fracture, 247Transistor circuit, 333Transmission electron micrographs of beryllium foils, 289Transmission electron microscope (TEM), 68, 250Travelling wave tubes, 274, 291, 318, 442, 464Trunnion, 27, 549Tube-to-tube TIG welding, 324Tungsten heater elements, 274Tungsten whisker, 464, 466Tungsten-inert-gas (TIG)-welded, 125Type I high modulus fibres, 166Type II high strength fibres, 166
UUltrasonic testing, 83ultrasonic vibration, 332Ultrasonics and other mechanical agitation, 209Ultraviolet (UV) radiation, 505Unequal (asymmetric) solder fillets, 354University, 10, 22, 63, 103, 617University Spacecraft, 615URALANE, 432Urban miners, 110
VVacuum, 22, 40, 49, 135, 258, 272, 380, 508, 551, 617. See also
outgassing and sublimationVacuum test chambers, 274Vapour-deposited aluminium, 259Vapour deposition, 134Vapour phase machines, 435Vapour pressure curves, 272VectranTM, 49Vega, 36Velcro tape, 553Verification programme, 420Verification testing, 419Vespal valve seat, 312Vespel, 28, 43, 229, 307Vibrations caused by thermal distortions, 322
666 Index
Video camera electronics, 541Visual criteria, 406Visual inspections, 421VITON B, 540Void formation, 337Voids and blow-holes in solder fillets, 410Volatile organic compounds, 109Volatile oxides, 534VPPA welding, 217Vulcain engine, 33, 318Vulcain-2 engine, 34
WWarp or twist, 423Waspaloy, 534Water tank, 326waveguide–flange assembly, 407Waveguides, 176Waveguide switch, 124Waveguide-to-Flange Joints, 406Wave soldering, 161Wear, 25Wear of ball bearings, 296WEEE, 107Weld bead width and the degree of permitted meander, 119Weld decay, 328Welded battery cells, 193Welded cryogenic tank, 183Welded galvanized steel, 139welded joint, 341Welded lead wire interconnections, 329Welded plate, 98Welded solar arrays, 189Welding, 329
all methods of welding, 181butt, 206, 332‘cold’, see cold weldingdiffusion, 105Diffusion, 105EB, see electron beam weldingelectromagnetic emission, 196explosive, 186friction, see friction stir and stud weldinglaser, 52, 186manual, 181pulsed laser, 186resistance pressure, 330resistance spot, 116, 329thermoplastics, 188
Welding and joining in a space environment, 49Welding in space, 52, 53Welding methods and controls, 181Welding of aluminium–lithium alloys, 187Welding of apogee boost motors, 123Welding of commercially pure titanium, 125Welding of thermoplastics, 188
Welding parameters, 118Welding rods, 126Weld in nickel alloy pressurized housing., 118Weld nugget, 330, 332Weld penetration, 132Weld porosity, 127Weld profiles for tube welds, 119Weld sputter particles, 68Weld strike, 196Wettability of solder, 412Whisker bridging, 499Whisker growths, 461Whisker nucleation and growth, 499Whiskers
aluminium, 468C-ring experiment, 482, 485metal oxide, 466mitigation, 498molybdenum, 462precautions, 491silver sulphide, 463tin, 472–490tungsten, 464, 465
White paints (α/ɛ less than 0.2), 267White plague, 375White residues, 432, 433Wire ropes, 63, 64Wires and cables, 62, 369Wire strands, 339Wire-to-barrel interface, 341Wire-wrapped joints, 338Wire wrapping, 337Wire-wrapping pins, 338Workmanship, 417, 434Workmanship drawings, 339Workmanship standards, 116, 119, 342Workmanship standards for resistance spot welds, 117Workmanship standards related to Area Grid Arrays, 122Worn out cathode pellet, 296
XX-radiation, 185X-ray diffraction, 94X-ray inspection, 436X-ray laminography, 434X-ray radiography, 86X-rays, 83, 185
ZZinc, 24, 272Zinc diffusion, 359, 387Zinc emissions, 405zinc oxide, 359Zinc-plated-steel support structure, 108
Index 667