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System Training Manual
Operation,
System Build,
Configuration,
Programming,
Troubleshooting,
& Maintenance
For the AADvance
Programmable Controller
Revision 1.7
October 2012
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Copyright Notice and Disclaimers
Notice
In no event will Rockwell Automation be responsible or liable for indirect or consequential
damages resulting from the use or application of this equipment. The examples given in
this manual are included solely for illustrative purposes. Because of the many variables andrequirements associated with any particular installation, Rockwell Automation does not
assume responsibility or reliability for actual use based on the examples and diagrams.
No patent liability is assumed by Rockwell Automation, with respect to use of information,
circuits, equipment, or software described in this manual.Reproduction of this manual in whole or in part, without written permission of Rockwell
Automation is prohibited.
All trademarks are acknowledged.
Disclaimer
It is not intended that the information in this publication covers every possible detail about
the construction, operation, or maintenance of a control system installation. You shouldrefer to your own (or supplied) system safety manual, installation instructions and
operator/maintenance manuals.
Revision and Updating Policy
This document is based on information available at the time of its publication; however, the
document contents are subject to change from time to time. You should contact Rockwell
Automation Technical Support by e-mail [email protected] to check if you
have the latest version of this publication.
Copyright Notice, Rockwell Automation 2012This document contains proprietary information that is protected by copyright. All rights
are reserved.
Documentation Feedback
Your comments will help us to serve your documentation needs better. If you discover any
errors or have any suggestions on how to improve this publication send your comments toour product support group: [email protected]
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Table of Contents 3
Warning
Radio Frequency Interference
Most electronic equipment is influenced by radio frequency interference (RFI). Caution
should be exercised with regard to the use of portable communications equipment around
such equipment. Signs should be posted in the vicinity of the equipment cautioning againstthe use of portable communications equipment.
Maintenance
Maintenance must be performed only by qualified personnel. Otherwise personal injury or
death, or damage to the system may result.
Company BackgroundICS Triplex has been manufacturing and supplying safety critical shutdown and control
systems since 1969.
The Regent Triple Modular Redundant (TMR) system was introduced in 1986. Itincorporated Hardware-Implemented Fault Tolerance (HIFT). The Regent system has been
field-proven in hundreds of installation world-wide.
The Regent + Plus product family was introduced in 1995 and provided additional features
and lower cost to the marketplace.
The Trusted TMR system was introduced in 1997. The Trusted system is compatible with
legacy Regent and Regent + Plus systems allowing a direct migration path for existing
systems.
AADvance was released in 2008. AADvance is a flexible and scalable system designed to
enhance Trusted, not replace it. AADvance components can be configured as simplex, dual
or triplicated. Systems may be small and standalone, or large and distributed.
ApplicabilityThis Training Manual applies to release 1.3.
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Issue Record
Issue Date Comments
1.6 June 2011 Updated for Release 1.2
1.7 July 2012 Integrated with user manuals and updated for release 1.3
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Table of Contents 5
Table of Contents
Chapter 1: Introduction
Course Goals .................................................................................................................... 1-1Who This Course is Intended For .................................................................................... 1-2
Recommended Prerequisites ............................................................................................ 1-2
Course Length .................................................................................................................. 1-2
Chapter 2: System OverviewPurpose ............................................................................................................................. 2-1
Objectives ......................................................................................................................... 2-1AADvance System Overview .......................................................................................... 2-2
Features ......................................................................................................................... 2-2
General System Layout ................................................................................................. 2-3Internal Bus Structure ................................................................................................... 2-5
Flexible Configurations .................................................................................................... 2-6
Non-Redundant, Fail Safe Architecture ........................................................................ 2-7Dual Processor, Non-Redundant I/O ............................................................................ 2-8
Dual Architecture .......................................................................................................... 2-9
TMR Input & Processor, Fault Tolerant Output ......................................................... 2-10
Mixed Architecture ..................................................................................................... 2-11Distributed Architecture .............................................................................................. 2-12
Test Your Knowledge .................................................................................................... 2-13
Chapter 3: System ComponentsPurpose ............................................................................................................................. 3-1
Objectives ......................................................................................................................... 3-1
System Components ......................................................................................................... 3-2Hardware ........................................................................................................................ 3-2
Software .......................................................................................................................... 3-3
Processor Module ............................................................................................................. 3-4
Processor Base Unit ......................................................................................................... 3-8Digital Input Modules .................................................................................................... 3-10
Analog Input Modules ................................................................................................... 3-12
Digital Output Module ................................................................................................... 3-14I/O Module Base Unit .................................................................................................... 3-16
Field I/O Termination Assemblies ................................................................................. 3-18
Digital Input Termination Assemblies ......................................................................... 3-18Analog Input Termination Assemblies ......................................................................... 3-22
Digital Output Termination Assemblies ....................................................................... 3-26Test Your Knowledge .................................................................................................... 3-29
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Chapter 4: System BuildPurpose ............................................................................................................................. 4-1Objectives ......................................................................................................................... 4-1
System Build .................................................................................................................... 4-2
Environmental Limits ...................................................................................................... 4-3
Component Sizes and Weights ........................................................................................ 4-4Free Space ........................................................................................................................ 4-6
Mount a Processor Base Unit ........................................................................................... 4-7
Mount the I/O Base Units ................................................................................................ 4-8Mount Termination Assemblies ..................................................................................... 4-10
Mount I/O Expansion Cables ......................................................................................... 4-12
Module Power ................................................................................................................ 4-14Module Power Supply Requirements.......................................................................... 4-15
Module Power Connections ........................................................................................ 4-16
Grounding ...................................................................................................................... 4-18
Security Dongle .............................................................................................................. 4-19
Processor Fault Alarm Contacts ..................................................................................... 4-20Serial Connections ......................................................................................................... 4-22
Field Power .................................................................................................................... 4-23Wire the Field Connections ............................................................................................ 4-24
Digital Inputs ............................................................................................................... 4-25
Analog Inputs .............................................................................................................. 4-27Digital Outputs ............................................................................................................ 4-30
Cable Management ........................................................................................................ 4-32
Module Polarization ....................................................................................................... 4-34Installing Modules and Blanks ....................................................................................... 4-36
Heat Dissipation ............................................................................................................. 4-38Parts List ........................................................................................................................ 4-40
Test Your Knowledge .................................................................................................... 4-42
Chapter 5: Workbench Overview and ProgrammingPurpose ............................................................................................................................. 5-1
Objectives ......................................................................................................................... 5-1Workbench ....................................................................................................................... 5-2
Workbench Overview ...................................................................................................... 5-4
Dictionary ......................................................................................................................... 5-6Data Types .................................................................................................................... 5-8
Import / Export Variables ........................................................................................... 5-19
Equipment Editor ........................................................................................................... 5-23Inserting an I/O Module .............................................................................................. 5-30
Creating Programs .......................................................................................................... 5-36
Saving a Project ............................................................................................................. 5-46
Test Your Knowledge .................................................................................................... 5-47
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Chapter 10: Bindings Between ResourcesPurpose ........................................................................................................................... 10-1Objectives ....................................................................................................................... 10-1
Variable Bindings........................................................................................................... 10-2
Plan Your Project ........................................................................................................... 10-3
Prepare Your Project ...................................................................................................... 10-4Linking Resources .......................................................................................................... 10-7
Simulate and Test Your Bindings ................................................................................ 10-10
Test Your Knowledge .................................................................................................. 10-12
Chapter 11: Version Source ControlPurpose ........................................................................................................................... 11-1Objectives ....................................................................................................................... 11-1
Version Source Control .................................................................................................. 11-2
Repository ..................................................................................................................... 11-2
Check In and Check Out ................................................................................................ 11-4
Version Status Icons ....................................................................................................... 11-5Comparing Version ........................................................................................................ 11-6
Retrieving Earlier Versions ............................................................................................ 11-8Test Your Knowledge .................................................................................................... 11-9
Chapter 12: Miscellaneous Workbench FeaturesPurpose ........................................................................................................................... 12-1
Objectives ....................................................................................................................... 12-1Cross Reference Browser ............................................................................................... 12-2
Printing ........................................................................................................................... 12-4Passwords ....................................................................................................................... 12-7
POU Access Control ..................................................................................................... 12-8
Resource Access Control .............................................................................................. 12-9
Configuration (Controller) Access Control ................................................................ 12-10Project Access Control ............................................................................................... 12-11
Export / Import Workbench Elements ......................................................................... 12-12
Export ........................................................................................................................ 12-12Import ........................................................................................................................ 12-13
Archive / Restore Projects ............................................................................................ 12-16
Archive ...................................................................................................................... 12-16Restore ...................................................................................................................... 12-18
Test Your Knowledge .................................................................................................. 12-22
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Chapter 13: OPCPurpose ........................................................................................................................... 13-1Objectives ....................................................................................................................... 13-1
OPC Server .................................................................................................................... 13-2
Data Access vs. Alarm & Event ................................................................................... 13-3
Configuring the OPC Server .......................................................................................... 13-4Configuring OPC Clients ............................................................................................... 13-7
Test Your Knowledge .................................................................................................. 13-10
Chapter 14: TroubleshootingPurpose ........................................................................................................................... 14-1Objectives ....................................................................................................................... 14-1
Self Test Cycle Times .................................................................................................... 14-2
Latching and Unlatching Faults ..................................................................................... 14-3
Fault Types ..................................................................................................................... 14-4
Viewing Variables Live ................................................................................................ 14-6I/O State and LED Indications ...................................................................................... 14-7
Processor Event Log ...................................................................................................... 14-9Test Your Knowledge .................................................................................................. 14-13
Chapter 15: Replacing ModulesPurpose ........................................................................................................................... 15-1
Objectives ....................................................................................................................... 15-1Removing Modules ........................................................................................................ 15-2
Installing Modules .......................................................................................................... 15-3Test Your Knowledge .................................................................................................... 15-5
Appendix 1: AADvance Discover Util ityPurpose .......................................................................................................................... A1-1
Objectives ...................................................................................................................... A1-1
Processor Base Unit Configuration ............................................................................... A1-2
Appendix 2: GlossaryPurpose .......................................................................................................................... A2-1
Objectives ...................................................................................................................... A2-1
Glossary ........................................................................................................................ A2-2
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Appendix 3: Puzzles and ExercisePurpose .......................................................................................................................... A3-1Objectives ...................................................................................................................... A3-1
Hardware Puzzle ........................................................................................................... A3-2
Software Puzzle ............................................................................................................. A3-3
Programming Exercise .................................................................................................. A3-4
Appendix 4: Safety Manual ConsiderationsPurpose .......................................................................................................................... A4-1
Objectives ...................................................................................................................... A4-1
Please Read the Safety Manual! .................................................................................... A4-2Rules vs. Recommendations ...................................................................................... A4-2
High Demand, SIL 3 and Energize to Action Applications ....................................... A4-3
Utilizing I/O Module Diagnostics .............................................................................. A4-3
Degraded Run Time Restrictions ............................................................................... A4-7
I/O Forcing ................................................................................................................. A4-8Safety Manual Checklists ......................................................................................... A4-10
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Introduction 1-1
Introduction
Course Goals
To teach users of the AADvance system:
How the AADvance system operates as a non-redundantand fault tolerant programmable logic controller.
What modules and components are used in the
AADvance system.
How to put an AADvance system together.
How to use the workbench to create, modify, test,download and update projects and programs to the
system.
How to create user defined functions and functionblocks.
How to pass safety critical data between controllers.
How to communicate with the system using OPC.
How to utilize the version control features.
How to troubleshoot a system and replace modules.
Chapter 1
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Who This Course Is Intended For
Personnel responsible for designing, configuring andprogramming an AADvance system.
Personnel responsible for installation, troubleshooting
and maintenance of an AADvance system.
Personnel designing a control system that needs tocommunicate with an AADvance system.
Recommended Prerequisites
A general knowledge of programmable logic controllers
(PLCs).
A background in industrial electronic control principles
and practices.
A level of competence using Microsoft Windows
operating systems and programs.
Course Length
4 days
The majority of the course is hands-on. Students implement
working solutions using actual hardware and software.
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System Overview 2-1
System Overview
Purpose
To provide an overview of the AADvance system and itscomponents.
Objectives
To understand the different system components andconfigurations.
To understand what module configurations meet whatSafety Integrity Levels (SIL).
To understand the types and names of modules used inthe AADvance system.
To understand the configuration limits of the system.
Chapter 2
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AADvance System Overview
AADvance is an industrial controller that can be configured fornon-redundant and fault tolerant control and safety applications.It is a scalable system consisting of different modules and
interconnecting base units. AADvance can be used for a widevariety of applications such as:
Critical process control
Emergency shutdown
Fire and gas detection/protection
Rotating machinery control
Burner management
Boiler and furnace control
Distributed monitoring and control
The system is designed for both high and low demandapplications.
Features
The main features of AADvance are:
Flexible modular construction using individual modulesto build a system.
Operates as a stand alone system or part of a largerdistributed network.
Easily transforms from a non-redundant to a faulttolerant system.
I/O module expansion/additions without systeminterruption.
IEC 61508 certified system; reviewed and approved byTV.
Handles the full range of IEC 61131 programminglanguages.
Supports industry standard protocols such as HART,Ethernet, Modbus RTU, Open Modbus TCP, CIP andOPC.
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System Overview 2-3
General System Layout
The AADvance system consists of:
A processor base unit (that can hold up to three
processor modules) I/O base units (that can hold up to three I/O modules)
I/O termination assemblies (that are inserted into the I/O
base units)
Processor and I/O modules (that are inserted into the
base units)
Figure 2-1: System Components
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A processor base unit can support up to 8 I/O base units (up to
24 I/O modules) on its right side (Bus 1), and up to the same
number on its left side (Bus 2), for a total of 48 modules.
Module positions within the I/O base units are numbered from
01 to 24, the left most position being slot 01. Any individualmodule position within the system is uniquely identified by the
combination of its bus and slot number, for example 1-01.
Expansion cables may be used to connect base units, as shown
in Figure 2-2.
Figure 2-2: Example System Layout
I/O base units do
not plug directly
into the left
connector of theprocessor base unit.
Use an extension
cable.
48 simplex
modules, 24 dual,
or 16 triplicated.
There can be a mixwithin a system.
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System Overview 2-5
Internal Bus Structure
Internal communications between the processor and I/Omodules are supported by command and response buses that arerouted through the processor and I/O base units.
The processor modules send commands to the I/O modules andprocess their returned responses. Each I/O module has adedicated response line back to the processors. An inter-processor link (IPL) provides the communication links betweendual or triple processor modules.
Figure 2-3: Internal Bus Structure
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Flexible Configurations
The AADvance system is flexible and scalable. Configurationsrange from non-redundant fail safe to triplicated fault tolerant.
Individual modules are designed as fail safe. Redundantmodules are implemented for fault tolerance.
Processor Modules
A single processor module meets SIL 2 requirements.Redundant processor modules (two or more) meet SIL 3requirements. High demand applications also require the use ofredundant processor modules.
Input Modules
Individual input modules meet SIL 3 requirements. Redundantmodules are implemented for fault tolerance.
Output Modules
Individual output modules meet SIL 2 requirements in a
normally de-energized application and SIL 3 requirements in anormally energized application. Redundant (dual) modules meetSIL 3 requirements in a normally de-energized application andprovide fault tolerance in a normally energized application.
Output modules incorporate dual redundant circuitry internally.A dual module configuration provides a quad redundant outputcircuit arrangement.
Typical system configurations are covered in the following
pages.
Triplicated output
modules are not
necessary and are
not supported.
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System Overview 2-7
Non-Redundant, Fail Safe Architecture
Non-redundant modules will fail safe on the first detected fault
and the process under control will shut down.
This configuration meets SIL2 requirements (due to the single
processor) and is suitable for low demand mode applications
with either de-energise or energise to trip outputs.
This configuration is also known as 1oo1D.
Figure 2-4: 1oo1D Configuration
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Dual Processors, Non-Redundant I/O
Non-redundant I/O modules will fail safe on the first detected
fault and the process under control will shut down.
The processor modules will degrade to 1oo1D on the first fault
and must be replaced within the MTTR (Mean Time To Repair)
assumed in the PFD (Probability of Failure on Demand)
calculations in order to maintain the SIL 3 rating.
This configuration is suitable for high as well as low demand
mode applications and meets SIL3 requirements (SIL 2 for
energize to trip outputs).
Figure 2-5: 1oo2D Processors, 1oo1D I/O Configuration
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System Overview 2-9
Dual Architecture
Redundant I/O modules provide fault tolerance. Duplicated
output modules also meet SIL3 requirements for energise to trip
outputs.
Input modules will degrade to 1oo1D (fail safe configuration)
on the first detected fail danger fault with no time limit to
repair.
Processor modules will degrade to 1oo1D on a module fault and
must be replaced within the MTTR (Mean Time To Repair)
assumed in the PFD (Probability of Failure on Demand)
calculations in order to maintain the SIL 3 rating.
A failed output module used for a SIL3 energise to trip must be
replaced within the MTTR assumed in the PFD calculations.There is no time limit in normally energized applications.
This configuration is also known as 1oo2D.
Figure 2-6: Dual Configuration
Termination
assemblies can
span across I/O
base units.
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TMR Input and Processor, Fault Tolerant
Output
Redundant I/O modules provide fault tolerance. Duplicated
output modules also meet SIL3 requirements for energise to trip
outputs.
Input modules will degrade to 1oo2D on a first fault. They will
degrade to 1oo1D on a second fault with no time limit to repair.
Processor modules will degrade to 1oo2D on a first fault. They
will degrade to 1oo1D on second module fault and a processor
must be replaced within the (Mean Time To Repair) assumed in
the PFD (Probability of Failure on Demand) calculations in
order to maintain the SIL 3 rating.
Output modules will degrade to 1oo1D on the first fault and
must be replaced within the MTTR assumed in the PFD
calculations (only for energize to trip outputs). There is no time
limit for normally energized applications.
Figure 2-7: TMR (2oo3D) Inputs & Processors, Fault TolerantOutput Configuration
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System Overview 2-11
Mixed Architecture
There can be a mixture of architectures and SILs within one
system. Figure 2-7 shows non-redundant and dual I/O
configurations with dual processors. Triplicated inputs and/or
processors may also be included.
Figure 2-8: Mixed Architecture
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Distributed Architecture
It is possible to locate I/O modules in separate systems and link
the data using a network connection certified for safety
applications. The systems share variables using bindings, as
covered in Chapter 10.
Figure 2-9: Distributed Architecture
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System Overview 2-13
Test Your Knowledge
1.
How many of each I/O module are required to meet SIL3 in a normally energized application?
2.
How many processor modules are required to meet SIL3?
3. What is the minimum number of modules required forfault tolerance?
4. What is the total number of I/O modules that a processorcan support?
5.
Are triplicated output modules supported?
6. How many response buses does a processor have?
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System Components 3-1
System Components
Purpose
To provide an overview of the AADvance system and its
components.
Objectives
To understand the types and names of modules andcomponents used in the AAdvance system.
To understand module and component features.
Chapter 3
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System Components
Hardware
The current release of AADvance consists of a 9110 processormodule, 9401 & 9402 24V isolated digital input modules (8 &16 channel), 9431 & 9432 4 20mA isolated analog input
modules (8 & 16 channel), 9451 24V digital output module and
9481 & 9482 isolated analog output modules (3 & 8 channel).Other components required to complete the systems are a 9100
processor base unit, 9300 I/O base units for connecting the I/O
modules to the processor, 9310 bus extension cable and
termination assemblies for connecting the I/O modules to fielddevices.
The hardware is modular. A processor base unit supports up tothree processor modules. I/O base units support up to three I/O
modules. I/O base units mate directly with the processor base
unit and other I/O base units. I/O base units provide the inter-module communications buses and route power from the
processor base unit to the I/O modules. The system becomes
one interconnected mechanical and electrical assembly once
assembled.
Figure 3-1: AADvance System
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System Components 3-3
1 9110
2 C C
3 9401 24
4 9451 24
5 9852 24 8 C. A
6 9802 16 C.
A
7 9100 B
8 C
9
Table 3-1: AADvance Components
Hardware may be mounted on a DIN rail or flat panel. The
system does not require forced air cooling fans.
Software
AADvance can be a distributed system where each node
(referred to as a configuration) has at least a single processor
module and its associated I/O. Each node is a stand alone
system configured using IEC 61131-3 languages. Data mayeasily be transferred between nodes using bindings. Programs
may be simulated offline for testing. AADvance runs a certified
for safety operating system.
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Processor Module
The 9110 processor module communicates with the network,
handles I/O scanning and solves application logic. Itincorporates the following features:
Rated for applications up to SIL2 (non-redundant) and SIL 3(dual & triple)
IEC 61508 certified
Handles full range of IEC61131-3 languages
Application processor,
communications co-processor
and math co-processor Two Ethernet and two serial
ports (RS485) per processor
MODBUS, CIP and AADvancesafety network protocols
Built in diagnostic testing andindependent watchdog
Removal and replacementwithout system interruption in
dual or triple configurations System self-discovery at start-
up
Figure 3-2: AADvance
Processor Module
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System Components 3-5
Battery
A replaceable battery is used to retain
the following during a power loss:
1) system diagnostic logs
2) keep the real time clock running
3) variables flagged as retained
Resources and programs are stored inflash memory that does not need a
battery.
The battery is a coin type BR2032 and is secured in a holderunder the front cover of the module. The holder is provided
with a ribbon to facilitate removal of the battery, as shown in
Figure 3-3.
You gain access to the battery by unscrewing the protective
cover on the lower portion of the front panel.
Fault Reset Button
There is a fault reset button on the front of each processor
module. It is used to clear any fault indications and allow
replaced I/O modules to come online. However, if a fault is stillpresent, the diagnostic system will report a fault again so
quickly there will be no visible change in the status indications.
Module Locking Mechanism
Each module (processor and I/O) has a locking mechanism that
secures the module onto its base unit. The locking mechanism is
a screw visible on the front panel of the module. It is engaged
by a clockwise quarter turn of a flat blade screwdriver. Themodule incorporates an interlock which detects when a module
is locked or unlocked.
Figure 3-3:Processor Battery
Pressing the fault
reset button does
not impact scan
time or the
handling of I/O.
The battery will last
for approximately
ten years under
normal conditions(powered) and six
months unpowered.
Modules will only
run when the screw
is in the locked
position.
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LEDs
There are 10 LEDs on the front of the module. The meaning of
each LED is described in Table 3-2.
/ ; ;
/
()
A
()
.
.
A ,
;
.
.
()
A ()
/ .
.
/
A A /,
A
A
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System Components 3-7
A
()
A
Table 3-2: Processor LED Status
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Processor Base Unit
Figure 3-4: AADvance Processor Base Unit
The 9100 processor base unit accepts up to three processormodules and incorporates the following features:
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System Components 3-9
Provides redundant connections for the system power
Provides the connection for ground
Provides the connections for the external redundant control
network via two Ethernet connectors per processor
Provides the connections for two serial ports per processor
Provides the connection for a security dongle
Figure 3-5: AADvance Processor Base Unit Detail
11, 12 1 2 A
21, 22 1 2 B
31,33 1 2 C
11, 12 1 2 A
21, 22 1 2 B
31, 32 1 2 C
1, 2 +24 & 0 1 2
A C ( )
C
Table 3-3: Processor Base Unit Connection Information
Module power is
connected to the
processor base unit
and connects
through the I/O
base units to powerall I/O modules.
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Digital Input Modules
The 9401 (8 channel) and 9402 (16 channel) are 24Vdc digital
input modules. They accept galvanically isolated inputs andperform signal conditioning and conversion.
The modules incorporate extensivediagnostics. Individual modules are
non-redundant, fail-safe, and
certified for use in SIL 3
applications.
Redundancy and fault tolerance is
achieved by grouping two or threemodules together with common
field connections.
Modules can be removed and
replaced online without system
interruption when used in
redundant (dual or triple)configurations.
Sequence of events (SOE)resolution is 10 msec.
The modules measure analog
voltage in order to perform linemonitoring and field fault detection
(e.g., open / short circuits).
Switching levels for each input
channel are configurable in the
workbench. The default parametersare:
Off: 0 to 5V dc
On: 15 to 30V dc
There are 11 LEDs on the front of
the module. The meaning of eachLED is described in Table 3-4.
Figure 3-6: AADvanceDigital Input Module
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System Components 3-11
()
A (.., )
C ( )/
C ( )
A ( )
C
Table 3-4: Digital Input Module LED Status Indications
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Analog Input Modules
The 9431 (8 channel) and 9432 (16 channel) are 24Vdc analog
input modules. They accept galvanically isolated 4 20mAinputs and perform signal conditioning and conversion.
The modules incorporate extensivediagnostics. Individual modules are
non-redundant, fail-safe, and
certified for use in SIL 3
applications.
Redundancy and fault tolerance is
achieved by grouping two or threemodules together with common
field connections.
Modules can be removed and
replaced online without system
interruption when used in
redundant (dual or triple)configurations.
Monitoring levels for each analogchannel are configurable in the
workbench. The default parameters
are:
Fault: 0 to 3.8mA
Normal: 3.8 to 22.0mA
Fault: >22.0mA
The modules support HART
(Highway Addressable Remote
Transducer) communications.
There are 11 LEDs on the front of
the module. The meaning of each
LED is described in Table 3-5.Figure 3-7: AADvanceAnalog Input Module
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System Components 3-13
()
A (.., )
C
A ( , , )
C
Table 3-5: Analog Input Module LED Status Indications
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Digital Output Module
The 9451 isolated digital output module connects to eight
isolated circuits and incorporates the following features:
Dual series output switchesper channel (1oo2)
Built in overload protectionper channel
1A continuous rating for eachcircuit
Voltage and currentmonitoring (feedback) per
channel
Short circuit and open circuitline fault detection for on andoff channels
Dual redundant field powerwithout the need for external
diodes
Output channel reversecurrent protection
The modules incorporate
extensive diagnostics. Individualmodules are fail-safe and certifiedfor use in SIL 2 normally de-
energized and SIL 3 normally
energized applications.
Redundancy and fault tolerance is
achieved by grouping twomodules together with common
field connections. Two modules
provide a quad output circuit
arrangement and full faulttolerance.
Modules can be removed andreplaced online without system
interruption when used in
redundant (dual) configurations.
Figure 3-8: AADvance
Digital Output Module
Triplicated output
modules are not
necessary and are
not supported.
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System Components 3-15
There are 11 LEDs on the front of the module. The meaning of
each LED is described in Table 3-6.
()
A (.., )
C /
C /
A
C
Table 3-6: Digital Output Module LED Status Indications
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I/O Module Base Unit
Figure 3-9: AADvance I/O Module Base Unit
The 9300 I/O module base unit connects the processor to I/Omodules. You can install up to three modules on a base unit.
The base unit will also allow you to fit the same number of
termination assemblies in different combinations. For, example,you can fit three simplex termination assemblies; or one dual
and one simplex together, or one triple termination assembly.The combination will depend entirely on your required
configuration.
Termination
assemblies can
span across base
units.
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System Components 3-17
The I/O base unit incorporates the following features:
Provides connection for one, two or three input/outputmodules depending on the redundancy requirements
Provides connections with termination assemblies that
connect to the field input/outputs
Routes power to the I/O modules from the processor baseunit
Routes common processor commands to the I/O modules
Routes responses between the I/O modules and processors
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Field I/O Termination Assemblies
Field wiring is connected to termination assemblies (TAs).
Digital Input Termination Assemblies
A 9801 digital input termination assembly is a non-redundnatunit that provides connections for 16 non-isolated digital input
channels and mates with a single 9401 or 9402 24Vdc digital
input module.
Figure 3-10: AADvance DI Non-Redundant Termination Assembly
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System Components 3-19
Figure 3-11 & 12: AADvance DI Non-Redundant
Termination Assembly and Fuses
Fuse (shown in the figures above) will blow when an extreme
over voltage is applied. Fuses can be replaced without removing
a module using needle-nose pliers.
The assembly incorporates the following features:
16 input channels for a simplex configuration
Industry standard field device connections at the terminalblocks
Fail safe design with individually fused channels and overvoltage protection
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The 9802 termination assembly is the dual version and mates
with two 9401 or 9402 modules, as shown in Figure 3-13.
Figure 3-13: AADvance DI Dual Termination Assembly
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System Components 3-21
The 9803 termination assembly is the triplicated version and
mates with three 9401 or 9402 modules, as shown inFigure 3-14.
Figure 3-14: AADvance DI Triplicated Termination Assembly
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Analog Input Termination Assemblies
A 9831 termination assembly is a non-redundant assembly that
provides connections for 16 non-isolated analog input channelsand mates with a single 9431 or 9432 analog input module.
Figure 3-15: AADvance AI Non-Redundant Termination Assembly
Each channel has a 50mA fuse to prevent component damage inover-current situations. Fuses can be replaced without removing
a module using needle-nose pliers
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Figure 3-16: AADvance AI Simplex Termination Assembly
The assembly incorporates the following features:
16 input channels for a simplex configuration
Industry standard field device connections at the terminalblocks
Fail safe design with individually fused channels
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The 9832 termination assembly is the dual version and mates
with two 9431 or 9432 modules.
Figure 3-17: AADvance AI Dual Termination Assembly
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The 9833 termination assembly is the triplicated version and
mates with three 9431 or 9432 modules.
Figure 3-18: AADvance AI Triplicated Termination Assembly
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Digital Output Termination Assemblies
Figure 3-19: AADvance DO Non-Redundant Termination Assembly
A 9851 termination assembly is a non-redundant assembly that
provides termination for 8 digital outputs and mates with asingle 9451 24Vdc digital output module.
The termination assembly routes the module output channelsvia the mating connector to the field connection terminal
blocks.
The 24Vdc field voltages VFIELD 1 and VFIELD 2, used bythe output module for the output field voltages, are connected at
the terminal blocks and routed via two replaceable 10A fuses F1
and F2. These fuses, shown in Figures 3-19 through 21, giveprotection for the output module against field faults.
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Figure 3-20 & 21: AADvance DO Termination Assemblyand Field Power Fuses
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Figure 3-22: AADvance DO Dual Termination Assembly
A 9852 termination assembly is a dual assembly that provides
termination for 8 digital outputs and mates with two 945124Vdc digital output modules.
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Analog Output Termination Assemblies
Figure 3-19: AADvance AO Non-Redundant Termination Assembly
A 9881 termination assembly is a non-redundant assembly that
provides termination for 8 analog outputs and mates with asingle 9481 or 9482 analog output module.
The termination assembly routes the module output channels
via the mating connector to the field connection terminal
blocks.
Although it has a fuse cover, there are no fuses. The visible
components are capacitors for EMC suppression.
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Figure 3-22: AADvance DO Dual Termination Assembly
A 9882 termination assembly is a dual assembly that provides
termination for 8 analog outputs and mates with two 9481 or9482 analog output modules.
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System Build 4-1
System Build
Purpose
To summarize how to assemble an AADvance system.
Objectives
To understand the environmental limits of the system.
To understand module power requirements, heatdissipation and weight.
To be able to install base plates, termination assemblies,cables and modules.
To be able to wire field devices to the system.
Chapter 4
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System Build
Note: This chapter is a condensed version of the AADvanceSystem Build Manual, which system integrators are
highly encouraged to read.
AADvance is a modular system. Base units snap together usingmating connectors and retaining clips.
The base units provide the interconnections for module power,processor and I/O data. Once connected, the base units form a
single mechanical assembly.
The insertion and removal of modules will not disturb the
electrical connections with field devices.
AADvance modules are suitable for wall mounting or forinstallation within an enclosure. The system is designed to meet
its electromagnetic compatibility criteria without further
protection from an enclosure.
AADvance can be panel or DIN rail mounted (using TS35
35mm x 7.5mm standard symmetric rails).
Use the following steps to assemble a system.
1)
Mount a processor base unit
2)
Mount the I/O base units
3)
Mount termination assemblies
4)
Mount I/O expansion cables (optional)
5)
Wire the field connections
6) Connect power and ground
7) Mount the processor and I/O modules
8) Ensure adequate power and heat dissipation
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System Build 4-3
Environmental Limits
The design of each installation must ensure that the operatingenvironment is within the tolerances of the equipment.
Consideration must be given to proper control of:
Temperature
Humidity
Vibration and shock
EMI / RFI
Temperature
Operating temperature: -20 to 70C (-4 to 158F)
Note: Processors limited to 60C (140F)
Storage & transport temperature: -40 to 70C (-40 to 158F)
Humidity
The system is designed to operate in the range of 10 to 95%
relative humidity, non-condensing. It is important to avoidchanges of humidity and temperature that could produce
condensation. Condensation on any type of electrical equipment
can result in equipment failures or improper operation.
Vibration and shock
The modules are designed to withstand a 15g peak shock andvibration to 0.5g sinusoidal sweep between 10Hz to 150Hz.
Care must be taken to isolate the system from any sources of
extreme mechanical shock or vibration.
EMI / RFI
The modules have been designed to meet the requirements of
EN500081/82 and EN55011/55022.
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Component Size and Weights
(
233 126 18
(9 5 )
166 42 118
(6 1 4 )
Table 4-1: AADvance Component Sizes
The total depth of a base unit and module is 136 mm (5-in).
Figure 4-1: Component Dimensions (in mm)
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System Build 4-5
Ensure that the mounting assembly can support the weight of
the AADvance components using the Table 4-2.
(
460 (16)
/ 133 (5) 430 (15)
(8 ) 280 (10)
(16 ) 340 (12)
(8 ) 280 (10)
(16 ) 340 (12)
340 (12)
(8 ) 290 (10.5)
133 (5)
260 (10)
360 (13)
40 (1)
/ 50 (2)
(2 ) 670 (24)
Table 4-2: AADvance Component Weights
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Free Space
The system requires a free space at least 140mm deep (fromfront to back) between the rear panel of an enclosure and the
inside of an enclosure door.
Allow sufficient free space around the base units. Every
application needs space on at least three sides, as follows:
Space above, to manipulate and install field wiring
Space below, to enable modules to fit and to be able tograsp a module during removal
Space to the right, to maneuver an I/O base unit duringassembly or in the event of installing a new base unit.
If an expansion cable is to connect to the left-most base unit, thecontroller also needs space to the left, to fit the expansion cable
adaptor.
Figure 4-2 shows the minimum recommended clearances for
DIN rail mounting.
Figure 4-2: Required Free Space (in mm)
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System Build 4-7
Mount a Processor Base Unit
A processor base unit will support up to three processormodules.
Figure 4-3: Installing a Processor Base Unit
1) Place the processor base unit onto the DIN rail.
2) Secure the base unit by pushing the bottom retaininglever as far to the left as it will go until it latches in the
locked position.
Note: Base plates may also be mounted flush on a panel wallusing screws without a DIN rail.
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Mount the I/O Module Base Units
You can install up to three I/O modules on an I/O base unit.
Figure 4-4: Installing an I/O Base Unit
1)
Mount a 9300 I/O base unit onto the DIN rail and slide it
towards the 9100 processor base unit.
2)
Ensure the joining connectors are fully mated.
3) Secure the base unit by pushing the bottom retaining
lever as far to the left as it will go until it latches in thelocked position.
4)
Insert the plastic retaining clips into the top and the
bottom slots.
Note: Base plates mounted flush on a panel wall will need to
be connected before mounting.
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Mount Termination Assemblies
Termination assemblies connect to I/O base units. You can fitthree simplex assemblies, or one dual and one simplex, or a
single triplicated termination assembly. The combination used
will depend on your systems specific configurationrequirements.
1) Insert the termination assembly (TA) retaining clip (at
the rear of the TA) into the slot on the plastic base unit,as shown in Figure 4-5. Press down and slide the
assembly upwards as far as it will go.
2) Ensure the retaining tab clips over the circuit board to
secure the TA in position, as shown in Figure 4-6.
Figure 4-5: Installing a Termination Assembly
Termination
assemblies can
span across base
units.
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System Build 4-11
Figure 4-6: Installing a Termination Assembly
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System Build 4-13
Figure 4-8: I/O Expansion Cable Adapters
Standard expansion cable assemblies are two meters long.(Custom lengths can be supplied.) The maximum possible
length of an entire bus (the combination of I/O base units and
expansion cables) is 8 meters.
Terminators are notrequired at the end
of the bus (last base
unit).
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Module Power
Power supplies should be installed in a position where the 24Vdc supply wiring can be kept reasonably short. Figure 4-9
shows an arrangement with one power supply unit for a non-
redundant, fail safe controller.
Figure 4-9: Power Supply Mounting
It is recommended that the negative side of the field supply begrounded. This will avoid possible fail danger conditions that
can be caused by some earth fault monitors used with floating
power supplies.
The power supply protection of the system is within the
modules, not the base units. To protect the base units, the powerdistribution arrangement must provide a circuit breaker on the
input side of each power source. The system can withstand a
reverse polarity connection without permanent damage.
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System Build 4-15
Module Power Supply Requirements
AADvance requires 24Vdc power with a tolerance between
18Vdc and 32Vdc. The system has been designed to operatewith most commercially available industrial uninterruptable
power supplies (UPS). To select a suitable power supply,calculate the overall system load that must be powered (usingTable 4-3), include any additional devices and add a
contingency allowance between 25% and 50%.
9110 8
9401 3.3
9402 4.0
9431 3.3
9432 4.0 9451 3.0
9482 3.6
Table 4-3: AADvance Module Power Requirements
Field devicesrequire an
additional source of
power.
High Availability
I/O (1715) use the
same hardware but
ratings are different
these arecalculated as worst
case using different
methods.
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Module Power Connections
AADvance modules are designed to operate from twoindependent 24Vdc sources with a common return. Power is
connected to the two plugs PWR-1 and PWR-2 on the processor
base plate, as shown in Figures 4-10 and 4-11. The centerterminals are normally left unconnected.
Figure 4-10: Processor Base Unit Power Connection
Figure 4-11: Module Power Connection
Power is distributedto the I/O modules
through the base
units.
The terminal blocks
can be removed for
easy access.
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System Build 4-17
The processor base unit links the +24V dc connections to thecenter terminal of each connector, as shown in Figure 4-12.
This link may be used to connect the +24V dc supply to other
processor base units.
Figure 4-12: Processor Base Unit Power Connection Detail
,
2.5 2(12 )
,
2.5 2(12 )
7 (9/32 )
Table 4-4: Module Power Wiring Sizes
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Grounding
AADvance systems may have up to three separate groundsystems:
An AC safety ground(sometimes called the dirtyground) to protect people in the event of a fault. Theground stud on the processor base unit, shown in Figure
4-13, should be connected to the AC safety ground,
along with all exposed metalwork such as DIN rails.
An instrument ground(sometimes called the cleanground or 0 Vdc ground) to provide a good stable 0Vreference for the system. Every signal return should be
referenced to the instrument ground, which will be
isolated from the AC safety ground.
Some field wiring will need shielded (screened) cable.There may be a shield groundin addition to the ACsafety and instrument grounds to provide a common
point to terminate cable shields.
Figure 4-13: AADvance Processor Base Unit SafetyGround Connection Detail
Systems may also be supplied with an IS (intrinsic safety)
ground as required.
Copper bus bars are normally used for grounding.
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System Build 4-19
Security Dongle
The system uses a dongle to control security. The dongle mustbe connected in order to download programs, make online
changes, or perform locking (forcing). The dongle is supplied
with the processor base unit.
Figure 4-14: Security Dongle
Processor Fault Alarm Contacts
The terminal block marked 'FLT' is no longer used and does not
work from release 1.1.
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Serial Connections
Each processor has two serial RS485 connections. The systemsupports both 2 wire (half duplex) and 4 wire (full duplex)
configurations, with multi-drop supported in both
configurations.
The pin-outs for the six serial connections on the processor base
unit are shown in Figure 4-17 and Table 4-6.
Figure 4-17: Serial Connections
Table 4-6: Serial Connections
( (
()
/
()
()
/
()
0
()
()
The terminal blocks
can be removed for
easy access.
'Receive' and
'transmit') are with
respect to the
processor base unit.
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System Build 4-21
Field Power
Field devices require an external source of power. This may bethe power source used for the controller or a separate power
source, depending on the application.
Each input circuit should be fused. Each output module group(e.g., a module pair) should also have the field power fused. For
a typical system, it is recommended that you provide a single
breaker on the output of the field power source, followed by oneor more fused terminals.
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Wire the Field Connections
Field wiring is connected direct to the terminal blocks of atermination assembly (TA).
,
1.5 2(16 )
,
1.5 2(16 )
6 ( )
Table 4-7: Field Connection Wiring Sizes
Non-redundant termination assemblies have commoned power.
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Digital Inputs
Figure 4-18: Simplex Digital Input Field Connections
Figure 4-19: Dual and Triplicated Digital Input Field Connections
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Figure 4-20: Standard Digital Input Field Loop Circuit
Figure 4-21: Line Monitored Digital Input Field Loop Circuit
Note: Please refer to the System Build manual for more detailson normally de-energized inputs, recommended resistor
values and input voltage threshold settings, etc.
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Analog Inputs
Figure 4-22: Simplex Analog Input Field Connections
Figure 4-23: Dual and Triplicated Analog Input Field Connections
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Figure 4-26: Four Wire Analog Input Loop Circuit
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Digital Outputs
Figure 4-27: Simplex & Dual Digital Output FieldTerminations
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Figure 4-28: Digital Output Field Loop Circuit
For inductive loads, connect a diode at the actuator to protectthe controller against back EMF.
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Cable Management
The field, power and other system wiring will be connected toterminals along the top of the base units. It is recommended a
length of trunking be located above each set of base units for
cable management.
Figure 4-29: Cable Management
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Module Polarization
Module polarization prevents the wrong module from beinginserted into the wrong base unit. Modules are supplied with
plugs already fitted, as shown in Figure 4-30.
The legend for the polarization pins is shown in the lower left ofthe processor base unit and on each I/O termination assembly,
as shown in Figure 4-31. The positions are numbered 1 through6. The three pins are lettered A, B and C with A being on thetop. Each pin, shown in Figure 4-32, is fitted in the base unit so
that the index recess is next to the relevant numbered position
shown in Table 4-8, as shown in Figures 4-32 and 33.
9110 1 1 1
9401 2 1 1
9402 2 1 1
9431 2 1 39432 2 1 3
9451 3 1 1
9481 3 1 2
9482 3 1 2
Table 4-8: Module Polarizing Pin Allocation
Figure 4-30: ModulePolarization
Figure 4-31: ModulePolarizing Pin Base
Unit Positions
Terminationassemblies are
supplied with the
pins already
inserted.
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Figure 4-32: Polarizing Pin
Figure 4-33 shows the pins inserted for a 9401 digital input
module and TAs.
T9801/2/3 TA T9401 TA
Figure 4-33: Inserted Polarizing Pins
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Installing Modules and Blanks
Installing Modules
Modules are installed by carefully pressing them onto the base
unit, as shown in Figure 4-34, using the following procedure.
1.
Inspect the connectors on the back of the module for
bent or damaged pins.
2. Make sure the slot on the head of the module clamp
screw is vertical.
3.
Place the new module on to the dowel pins on the base
unit.
4. Push the module home until the connectors are fully
mated.5. Turn the locking screw located on the front of the
module turn clockwise using a broad flat bladed
screwdriver.
Figure 4-34: Installing a Module
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Heat Dissipation
AADvance is designed to operate without forced air cooling.
Ensure that adequate ventilation is provided. Ambient
temperature within an enclosure should not exceed 60C
(140F), unless the enclosure does not contain the processors, inwhich case the limit is 70C (158F).
The system dissipates all the power it uses as heat. Module
power is connected to the processor base plate. Field power is
connected to I/O termination assemblies and some of that powerwill also be dissipated as heat. Use Table 4-9 to estimate the
maximum heat generated by the modules.
8
(8 ) 3.3
(16 ) 4.0
0.11
(8 ) 3.3
(16 ) 4.0
(25) 0.06
3.0
(1) 0.5
(8 ) 3.6
Table 4-9: AADvance Module Heat Dissipation
Base plates and
modules must be
mounted vertically
to allow proper air
circulation through
the modules.
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Parts ListNote:Parts may be added to this list in future releases. Please
consult Rockwell Automation for an updated list of availableparts.
Software Development Environment
9082 IEC61131 Workbench suite with single user, single
controller license9083 IEC61131 Workbench suite with single user,
unlimited controller license
9084 IEC61131 Workbench suite with five user, unlimited
controller license9085 Five additional user license (for use with item 9084)
9030 OPC portal server
Processor Equipment9100 Processor base unit9110 Processor module
9193 Blanking cover (short), for unused position on
processor base unit
Expansion Cable Assemblies
Expansion cable assembly, comprising expansion cable and two
adaptors (handed):9310-02 2 meter expansion cable (approximately 6 feet)
9310-xx Custom length expansion cable
I/O Equipment
9300 I/O base unit9401 Digital input module, 24V dc, 8 channel
9402 Digital input module, 24V dc, 16 channel
9431 Analog input module, 8 channel
9432 Analog input module, 16 channel9451 Digital output module, 24V dc, 8 channel
9481 Analog output module, 3 channel
9482 Analog output module, 8 channel9191 Blanking cover (tall), for unused position on I/O base
unit
The 9193 blanking cover may be used for positions on an I/Obase unit with a termination assembly fitted.
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Termination Assemblies
9801 Digital input TA, 16 channel, simplex, non-isolated
9802 Digital input TA, 16 channel, dual9803 Digital input TA, 16 channel, TMR
9831 Analog input TA, 16 channel, simplex, non-isolated
9832 Analog input TA, 16 channel, dual9833 Analog input TA, 16 channel, TMR9851 Digital output TA, 24V dc, 8 channel, simplex, non-
isolated
9852 Digital output TA, 24V dc, 8 channel, dual, non-isolated
9881 Analog output TA, 8 channel, simplex
9882 Analog output TA, 8 channel, dual
Consumable Spares
9901 Input fuse, 50mA (pack of 20)
9902 Output fuse, 10A (pack of 20)
9903 Coding peg / Polarizing Pins (pack of 20)9904 Backplane clip (pack of 20)
9905 Battery, lithium, 3V 255mAh, coin pattern BR2032 or
equivalent, for 9110 processor module (pack of 10)
9906 Replacement security dongle
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Test Your Knowledge
1.
What temperature range are the processors designed to
operate within?
2.
What are the two ways to mount base plates?
3. Where is I/O module field power connected?
4. How much power would a system with the followingmodules require? Assume all input modules are 16
channel.
dual processors
two sets of triplicated analog input modules
five simplex analog input modules
four simplex digital input modules
two sets of dual digital output modules
three simplex digital output modules
5.
How much would the system described in question 4
weigh?
6.
How many I/O module base units would be required for
the system described in question 4?
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Workbench Overview and Programming 5-1
Workbench Overview and
Programming
Purpose
To review the steps required to develop programs.
Objectives
To be able to create projects.
To be able to add variable names to the dictionary.
To be able to build an I/O configuration and assignvariable names.
To be able to configure the hardware: serial portsettings, input module thresholds, watchdog timers, etc.
To be able to create, edit and compile programs.
Chapter 5
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Workbench
The AADvance workbench is used to build control and safetyprograms. These programs can be distributed across several
hardware platforms referred to as configurations.
Configurations communicate with each other throughnetworks. Configurations run resourceswhich are groups ofprograms (up to 250) that are compiled and downloaded.
The workbench is IEC 61131-3 compliant, offering all fivelanguages (ladder, function block, structured text, instruction
list and sequential function chart). Programs can be simulated
and tested on the PC before downloading to actual hardware.
Starting the Workbench
Start the workbench: StartAll ProgramsAADvance
AADvance Workbench. The workbench will run in demo mode
for 30 days without a license. Full functionality requires alicense (e.g., USB dongle).
This manual
describes software
functionality
included in release
1.31 (Build
1.20.508).
Please refer to the
Configuration
Guide for more
information on the
licensing options
and the operation
of the License
Manager.
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Workbench Overview and Programming 5-3
Start a New Project
To start a new project, select File | New Project/Library, or use
the New button. The following dialog box will appear.
Figure 5-1: New Project Dialog Box
The name is used as the project folder name. Project file namesare always PRJLIBRARY.MDB.
The Workbench allows multiple people to work on a project atthe same time. This requires locating certain files in a location
that others can access (if you wish to utilize this capability). The
Destination Folderis the location on your PC where various
local files are stored. The Repository Pathis the location folderwhere other centralized version information is stored. The
default location for both folders is on the C drive of the PC that
has the software loaded, but the Repository folder can belocated on a central server.
The topics of the
repository, version
control and check-
in/out are covered
in Chapter 11.
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Workbench Overview
The link architecture view graphically displays the resources ofa project and any links between them. This is the default view
of the workbench providing a main entry point to all editors.
Figure 5-2: Link Architecture View
A configurationrepresents a hardware target (controller).
AADvance configurations run a single resource. A resourceconsists of the dictionary of tag names, I/O configuration and
POUs (Program Organization Units).
If you do not see the
Project Tree on the
left, click Window |
Show Project Tree.
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Dictionary
The typical first step is to define variable (tag) names in thedictionary. These names can then be connected to processor
variables, I/O modules, I/O channels and then used in programs.
However, it is not mandatory to define variables first. You cancreate programs first and enter variable names in the program
editor. When doing so, the workbench will request basic
information on the variable (i.e., type, scope, direction,attribute). While variables created this way will later appear in
the dictionary, you may need to define them in more detail in
the dictionary before compiling and running your program(s)(e.g., MODBUS address, SOE, initial value, retain, etc).
Open the dictionary using the Project | Variables menu selection
or the dictionary button. Expand the tree on the left to see thewindow displayed in Figure 5-4.
Figure 5-4: Workbench Dictionary View
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Workbench Overview and Programming 5-7
The various components are sorted in a tree-like hierarchy. The
tree name is displayed on the window title bar. The fourdictionary tree views, as shown in Figure 5-5, are: variables,
parameters, types and defined words.
Figure 5-5: Dictionary Views
In the All Variables workspace on the right, you can toggle
between Grid Mode and Row Mode by right clicking in theworkspace and making the appropriate selection in the pop-up
menu, as shown in Figure 5-6.
Figure 5-6: Switching Between Grid and Row Mode
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Data Types
Variables are unique identifiers of data which can be used in theprograms of a project. There are many different variables types,
such as:
BOOL: Boolean (true / false)
SINT: Signed short integer (8 bit) from -128 to +127.
USINT: Unsigned short integer (8 bit) from 0 to 255.
BYTE: Byte (8 bit) from 0 to 255.
INT: Signed single integer (16 bit) from -32,768 to32,767.
UINT: Unsigned single integer (16 bit) from 0 to
65,535. WORD: Word (16 bit) from 0 to 65,535.
DINT: Signed double integer (32 bit) from-2,147,483,648 to +2,147,483,647.
UDINT: Unsigned double integer (32 bit) from 0 to4,294,967,295.
DWORD: Double Word (32 bit) from 0 to4,294,967,295.
LINT: Signed long integer (64 bit) from
-9,223,372,036,854,775,808 to9,223,372,036,854,775,807.
ULINT: Unsigned Long Integer (64 bit) from 0 to18,446,744,073,709,551,615.
LWORD: Long Word (64 bit) from 0 to18,446,744,073,709,551,615.
REAL: Real (floating, single precision) (32 bit), 1 signbit + 23 mantissa bits + 8