1
DPR for KS-3-- Development
Wistron Corporation
Jeffrey FL Wang
08/07 2006
2
DPR for KS-3 – Development Eng. Status
1. Development Schedule2. Spec. Overview3. WW Agency Approval Plan 4. RoHS Compliant Plan5. New FRU/ CRU plan6. Supplier selection plan 7. EC Release Plan8. Quality Development Process
3
1. Development Schedule
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Development Schedule
DV1 Activity 09/19- 10/20/2006
DV1 Exit 11/06/2006
FVT Activity 10/31- 12/01/2006
FVT Exit 12/04/2006
DV2 Activity 11/28- 12/29/2006
DV2 Exit 1/22/2007
SW DV2 Activity 12/05- 1/05/2007
SW DV2 Exit 1/15/2007
SIT Activity 1/23- 3/02/2007
SIT Exit 3/19/2007
SVT Activity 4/02- 4/23/2007
SVT Exit 4/27/2007
SOVP 5/09/2007
Ship Support 5/21/2007
ANN 5/22/2007
GA 5/22/2007
Notes: DV1/DV2/SIT/SVT planar assembly and box build at WKS. SOVP date depends on Merom for Santa Rosa processor launch date.
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2. Specification Overview
6
Kabuki / Sumo 3.0 Offering Definition
June 26, 2006
Time: SOVP: 4/09/07
Announce & GA: 4/24/07Ship Support: 4/23/07
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Sumo 3.0 – X61 Offering Definition (Concept Exit)System is...
Form Factor 12.1" XGA TFT (150 nit) – Standard (275g) only 3.15lbs; 10.5” x 8.3” x .96-1.36” 2.5” System SATA HDDs; Customer upgradeable 1 Spindle HDD ThinkLight (white ) 4 cell cylindrical or 8 cell cylindrical LiIon Battery NV, 2.5” HF, Standard Display Battery Life: 4.4 Hr (4cell cyl); 8.8 hr (8 cell cyl) 2nd LiIon Battery support (external battery pack on system or one bay battery option for UltraBase Dock)
ISO Standard full size keyboard (18.5mm pitch) Trackpoint IV push-to-select ; In-line scroll/mag 1 ThinkPad key + 3 audio keys; Mono Speaker in system (0.5 watt) Integrated Microphone Integrated dual band+ wireless antenna Kensington lock Fingerprint Reader (select models) Integrated WWAN and WWAN-ready (select models) 802.11 n(abg) MIMO wireless with 2x2(entry), 2x3 capability Optional K/S Ultrabase (Slice) (for optional 2nd spindle) 65w AC Adapter
Planar Intel Crestline GM / ICH8M & ICH8M Enhanced core chipset with Integrated Graphics
GEN4fx(DX10) graphics with up to 256MB memory Intel Merom with EMT64T processors (dual core 800 MHz FSB) DDR2-667 PC2 5300 memory 2 x SO-DIMM /4 GB max 2 x Mini-PCIe Slot (WLAN,WAN ) 1 x Cardbus/ ExpressCard Universal slot (with support for ExpressCard 34mm via USB interface adapter card)
Gigabit Ethernet LOM (all models) 3 x USB 2.0 IEEE 1394 1 x SD slot Serial ATA Soft audio / Microphone TCG Compliant Secure Chip Crypto-3 (all models) Wireless Upgradeable (all models) V92 designed Modem Bluetooth in display bezel (select models) Accelerometer / Shock Mounted Hard Drive
Open Bay Odyssey Building Blocks(Tested thru SIT)
HDD: 40, 60, 80, 100, 120, 160 GB/ 5400 rpm 60, 100 GB/7200 rpm Memory: 512MB, 1GB, 2GBMiniPCIe: ThinkPad Gwinett 802.11 a/b/g, ThinkPad 802.11n, Intel Kedron n(abg)
and Kedron abg (with b/g sku’s for select countries only) Battery: 4 cell (cyl), 8 cell(cyl) Operating Systems: XP Pro, Vista
IBM Confidential
System is not...
Form Factor Two spindle 1.8” HDD’s Integrated touchpad Slice dock to Port Replicator or Docking
Planar 10/100 Ethernet Mini PCI slot DVI on System/Slice Discrete Graphics 128MB memory TV Out (S-Video) LV/ULV processors Infrared No TAA Offering
OS Support•See SW Support OD
PortsPS/2 Port (System)FDD port connector SPDIF (AC3 audio)Ultrabay2000NEST
CommunicationsCalexico bCalexico 2 b/g, a/b/gClymer b/gBartlett a/b/gMDC I, IIBMDC II, IIIUWB
Ports on System/ Slice 7 x USB 2.0 ports (3 system, 4 slice) 1 x T2 PCMCIA CardBus/ USB Based ExpressCard (System) IEEE 1394 (system) RJ11, RJ45 Parallel, Serial (Slice) VGA (Both) Headphone-out, Mic-in (Both) Slice connector (System) Warm/Hot swap bay (Slice) Keylock/cable lock slot (Slice) PATA bay support (Slice) ComplianceTCG Compliant Secure Chip Crypto-3 (Intel compliance)EnergyStar RoHS
Red – Work ItemsBlue – New
System Building Blocks (Tested thru SIT)
CPU: Intel Merom T7300, T7000, and T5500P NV CPU’s Panel: 12.1” XGA TFT Standard (275g) HDD: 40, 60, 80, 100, 120, 160 GB/ 5400 rpm 60, 100 GB /7200 rpmMemory: 256MB, 512MB, 1GB, 2GBMiniPCIe: ThinkPad Gwinett 802.11 a/b/g, ThinkPad 802.11n(abg), Intel Kedron
n(abg) and Kedron abg (with b/g sku’s for select countries only), Golan abg, MiniPCIe: Verizon(EV-DOrevA), Vodafone(HSDPA 3.6), Cingular, T-Mobile, TelusCDC: Modem, BluetoothBattery: 4 cell(c), 8 cell (c)Operating Systems: XP Pro, Vista (Basic 32, Business 32/64, Ultimate 64)
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Kabuki 3.0 – X61s Offering Definition (Concept Exit)System is...
Form Factor 12.1" XGA TFT (150 nit) – Standard (275g) & TMD (205g) select models, or LED backlit display (185 g)
2.6lbs; 10.5” x 8.3” x .083 - 1.1” 2.5” SATA HDDs; (SATA are Customer upgradeable) 1 Spindle (HDD) ThinkLight (white ) 4 cell prismatic, 4 cell cylindrical, 8 cell cylindrical LiIon Battery. Battery life with ULV CPU, TMD or LED Display: 3.3 Hr (4cell pris); 4.4 hr (4cell cyl); 8.8 hr (8 cell cylindrical) 2nd LiIon Battery support (external battery pack on system or one bay battery option for UltraBase Dock)
ISO Standard full size keyboard (18.5mm pitch) Trackpoint IV push-to-select ; In-line scroll/mag 1 ThinkPad key + 3 audio keys; Mono Speaker in system (0.5watt) Integrated Microphone Integrated dual band+ wireless antenna Kensington lock Fingerprint Reader (select models) 802.11 n(abg) MIMO wireless with 2x2, 2x3 capability Integrated wireless WAN and WAN-ready (select models) Optional K/S Ultrabase (Slice) (for optional 2nd spindle) 65w AC Adapter
Planar Intel Crestline GM / ICH8M & ICH8M Enhanced core chipset with Integrated Graphics for LV
Intel Calistoga GM/ ICH7 core chipset with Integrated Graphics f/ULV GEN4fx(DX10) graphics Intel Merom with EMT64T processors (dual core LV(800\ MHz FSB, 15W) and single core ULV (533 MHz FSB )
DDR2-667 PC2 5300 2 x SO-DIMM /4 GB max 2 x Mini-PCIe Slot (WLAN,WAN)1 x Cardbus/ ExpressCard Universal slot (with support for ExpressCard 34mm via USB interface adapter card)
Gigabit Ethernet LOM (all models) 3 x USB 2.0 IEEE 1394 1 x SD slot Soft audio / Microphone TCG Compliant Secure Chip Crypto-3 (all models) Wireless Upgradeable (all models) V92 designed Modem Bluetooth in display bezel (select models) Accelerometer / Shock Mounted Hard Drive
System Building Blocks (Tested thru SIT)
CPU: Intel Merom L7500 and L7300, Yonah U1400 ULV Panel: 12.1” XGA TFT – Standard & TMDHDD: 40, 60, 80, 100, 120, 160 GB/ 5400 rpm (2.5” SATA) 60, 100 GB 7200 (2.5” SATA) WWMemory: 256MB, 512MB, 1GB, 2GBMiniPCIe: ThinkPad Gwinett 802.11 a/b/g, ThinkPad 802.11n(abg), Intel
Kedron n(abg) and Kedron abg (with b/g sku’s for select countries only) , Golan abg
MiniPCIe: Verizon(EV-DO revA), Vodafone(HSDPA 3.6), Cingular, T-Mobile, Telus
CDC: Modem, BluetoothBattery: 4 cell(prismatic), 4 cell (cyl),8 cell (cyl)Operating Systems: XP Pro, Vista (Basic 32, Business 32/64, Ultimate
64)
Open Bay Odyssey Building Blocks(Tested thru SIT)
HDD: 40, 60, 80, 100, 120, 160 GB/ 5400 rpm (2.5” SATA)Memory: 512MB, 1GB, 2GBMiniPCIe:ThinkPad Gwinett 802.11 a/b/g, ThinkPad 802.11n(abg), Intel
Kedron n(abg) and Kedron abg (with b/g sku’s for select countries only), Golan abg
Battery: 4 cell(pris), 4 cell (cyl),8 cell (cyl)Operating Systems: XP Pro, VistaDock/Slice: X6 UltraBase (slice)
System is not...
Form FactorTwo spindle 1.8” HDD’sIntegrated touchpad Slice dock to Port Replicator or Docking
Planar 10/100 Ethernet Mini PCI slot DVI on System/Slice Discrete Graphics 128MB memory TV Out (S-Video) NV processors Infrared No TAA offering
OS Support•See SW Support OD
PortsPS/2 Port (System)FDD port connector SPDIF (AC3 audio)Ultrabay2000NEST
CommunicationsCalexico bCalexico-2 b/g, a/b/gClymer b/gBartlett a/b/gMDC I, IIBMDC II, IIIUWB
Ports on System/ Slice 7 x USB 2.0 ports (3 system, 4 slice) 1 x T2 PCMCIA CardBus/USB based ExpressCard (System) IEEE 1394 (system/) RJ11, RJ45 Parallel, Serial (Slice) VGA (Both) Headphone, Mic (Both) Slice connector (System) Warm/Hot swap bay (Slice) Keylock/cable lock slot (Slice) PATA bay support (Slice) ComplianceTCG Compliant Secure Chip Crypto-3 (all models)EnergyStar RoHS
Red – Work Items
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Miscellaneous Options
+
Mandatory Select
Additional Features
Options (Easy Access Elements)
+
Expansion Memory(256, 512, 1024 or 2048MB
Base Memory)Plus(1 x SODIMM socket)
0 256 MB512 MB1024 MB2048 MB
4 GB Max Memory
System HDD (2.5”)40 GB/540060 GB/540080 GB/5400100 GB/5400120 GB/5400160 GB/5400100 GB/7200 60 GB/7200
OS + Drivers + UtilitiesWin XP Pro (SP2)Vista
Standard Feature Elements
12.1” XGA TFTGB EthernetUtraConnect Wireless
AntennaSecure Digital Slot3 x USB 2.0AC Adapter (65W)APS 1394
See options plan
BatteryLi-ion 4 cell CylindricalLi-Ion 8 cell Cylindrical
Customer Feature Choice(CFC’s)
Ethernet (GB)
Wireless•Wireless LAN Ready (Yes)•Wireless WAN (Yes/No)•Bluetooth (Yes/No)
SecurityESS Secure Chip (Yes)Fingerprint Reader (Yes/No)
CFC Memory Choices
Lenovo Confidential
Accelerometer on every systemModem on every systemSecure Chip on every system
SW Applications•See Software Plan
Sumo-3 X61 – MTs 7673/7674 -Easy Access Elements (At Announce)
+
Planar, Processor, 1394, SDMerom T5500P NV DC ($195)Merom T7000 NV ($225)Merom T7300 NV ($275)
Mandatory Select Filter Item
All with 12.1” TFTTBD see initial Shell Plan
Derived Shells
=
Optional Select
Mini PCIeWireless Upgradeable802.11 abg (Golan)802.11 a/b/g (Kedron)802.11 a/b/g (ThinkPad)Intel Kedron n (abg)ThinkPad n (abg)
Warranty / Service Offerings3 year depot (GAV/EZA)3 year on-site (GAV/EZA)4 year depot (MTM only)4 year on-site (MTM only)1yr Express (GAV only)3yr Express (GAV only)
Red – Work Items
Docking•X6 UltraBase •UB6 with DVD•UB6 with Combo•UB6 with Multi-Burner
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Miscellaneous Options
+
Mandatory Select
Additional Features
Options (Easy Access Elements)
+
OS + Drivers + UtilitiesWin XP Pro (SP2)Vista
Warranty / Service Offerings1702 - 3 yr depot (GAV/EZA)1703 - 3 yr on-site (GAV/EZA4 year depot (MTM only)4 year on-site (MTM only)1yr Express (GAV only)3yr Express (GAV only)
Standard Feature Elements
12.1” XGA TFTGB EthernetUtraConnect Wireless
Antenna (x3)Secure Digital Slot3 x USB 2.0AC Adapter (65W)APS1394
See options plan
Customer Feature Choice(CFC’s)
Ethernet (GB)
Wireless•Wireless LAN Ready (Yes)•Wireless WAN (Yes/No))•Bluetooth (Yes/No)
SecurityESS Secure Chip (Yes)Fingerprint Reader(Yes/No))
CFC Memory Choices
Lenovo Confidential
Accelerometer on every systemModem on every systemSecure Chip on every system
SW Applications•See Software Plan
Kabuki-3 X61s -MTs 7666/7667 - Easy Access Elements (At Announce)
+
Planar, Processor, 1394, SDYonah U1400 ULV SC ($225)Merom L7300 ,DC, GB ($265)Merom L7500 DC, GB ($295)
Mandatory Select Filter Item
All with 12.1” TFTTBD see initial Shell Plan
Derived Shells
=
Optional Select
Docking•X6 UltraBase •UB6 with DVD•UB6 with Combo•UB6 with Multi-Burner
System HDD (1.8” PATA) (Japan only Now removed)
30 GB/420040 GB/420060 GB/4200
System HDD (2.5” SATA)40 GB/540060 GB/540080 GB/5400100 GB/5400120 GB/5400160 GB/5400100 GB/7200 60 GB/7200
BatteryLi-Ion 4 cell PrismaticLi-ion 4 cell CylindricalLi-Ion 8 cell Cylindrical
Mini PCIeWireless Upgradeable802.11 a/b/g (Kedron)802.11 a/b/g (ThinkPad)Intel Kedron nThinkPad n
Expansion Memory(256, 512, 1024 or 2048MB
Base Memory)Plus(1 x SODIMM socket)
0 256 MB512 MB1024 MB2048 MB
4 GB Max Memory
Red – Work Items
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SPEC Overview ( CPU/ Intel chipset comparison)
Seqment
ProcessorNumber
ProcessorGeneration
ClockSpeed(GHz)
FrontSideBus(MHz)
L2Cache
IntelChipset(NB)
IntelChipset(SB)
T7700 2.4 800 4MT7500 2.2 800 4MT7300 (*) 2 800 4MT7000 (*) 1.8 800 2MT5500P (*) 1.66 667 2ML7500 (*) 1.6 800 4ML7300 (*) 1.4 800 4MT7600 2.33 667 4MT7400 2.16 667 4MT7200 (*) 2 667 4MT5600 (*) 1.83 667 2MT5500 1.66 667 2ML7400 1.5 667 4ML7200 1.33 667 4M
Ultra LowVpltage
U7500 1.06 533 2M
ICH8MMerom 65nm(Santa Rosa)
Merom 65nm(Napa Refresh)
StandardVoltage
LowVoltage
ICH7M
StandardVoltage
LowVoltage
KS2
KS3
CalistogaIntel945PM/GM
CrestlineIntel
•Remark which “ ” is defined in KS2/ KS3 notes.
•KS2 support Yonah & Merom Processor.
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SPEC Overview 1 (Basic function) KS2 KS3
Processor Yonah-2M NV/LV/ULV
Merom NV/LV, 4MB / 2MB cache
667/533 MHz FSB
Merom for Santa Rosa
SV/LV, 4MB / 2MB cache
800 / 667 MHz FSB
Chipset Calistoga- GM/ ICH7M Crestline/ ICH8M
Memory 2 DIMM Slot (Max: 4GB currently validated at 533MHz only ))
PC2-5300 (DDR2-677)
2 DIMM Slot (Max: 4GB)
PC2-5300 (DDR2-677)
GRAPHIC Calistoga Integrated Graphics Crestline Integrated Graphics
Audio AD1981HD AD1984
On Board Ethernet Intel 82573L Intel 82566 MM/MC
IR One Port No
USB USB2.0x 3ports,4portsin Slice
PC Card Controller Ricoh R5C843 Ricoh R5C847 or better
PC Card Slot T2 x1 with PCI Express Card USB signal capability
Express Card Slot USB/ PCI, Slim (34) Express Card x1 w/ adapter
TCPA Atmel AT97SC3203 (TPM 1.2)
Standard on planar
Accelerometer G-Sensor ADI
Finger Print Reader YES, by Model (UPEK)
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SPEC Overview 2 (Subsystems) KS2 KS3
LCD 12.1”XGA 12.1”XGA/ SXGA+
Integrated Dual-Band Antenna Customized
Bluetooth Antenna YES by Model on BDC card in LCD Asm
WAN Antenna YES by Model
FDD USB FDD support (option)
HDD SATA I/F:2.5” SATA & 1.8”PATA
5400rpm: 40GB/ 60GB/ 80GB/ 100GB/120GB
7200rpm: 80GB/ 100GB
SATA I/F:2.5” SATA
5400rpm: 40GB/ 60GB/ 80GB/ 100GB/120GB/160GB
7200rpm: 80GB/ 100GB
Bay ODD PATA I/F:
8x DVD-ROM (de-functioned Combo drive)
24x24x24x8x DVD/CD-RW Combo
Rambo 4 DVD-RW/CDRW Combo
WLAN Intel 802.11 a /b/g (Golan)
Foxconn 802.11 a/b/g (Gwinett)
Foxconn 802.11 a/b/g/draft n (Nelson)
Support 2X3 MIMO, exclusive WWAN.
Intel 802.11 a/b/g (Golan)
Intel 802.11 a/b/g (Kedron)
Intel 802.11 a/b/g/ draft n (Kedron)
Foxconn 802.11 a/b/g (Gwinett)
Foxconn 802.11 a/b/g/draft n (Nelson)
WWAN Verizon / Vodaphone / Cingular
Modem/ Bluetooth 2 slots
MDC1.5 MDC (Adonis) for all models
BDC (Callisto) in LCD Asm w/ Bluetooth Antenna by Model
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SPEC Overview 2 (Subsystems)
KS2 KS3Keyboard NMB/ Chicony
Touchpad No
Think Light Yes (White)
Battery Li- lon Battery 4C, 4P, 8C
2nd Battery (Bay Battery) Yes
Long Life Battery (Extend) Yes
Docking No Docking Support. Slice support
AC Brick 65w
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SPEC Overview (X6 Slice)
Battery Support Bay BatteryUltrabay Ultrabay SlimModem Port YesLan Port YesParallel, Serial, VGA,RJ11, RJ45
Yes
DV1 NoPS/2 NoSecurity Keylock and Cable lock slotAudio Mic in / Headphone outCard slots NoPCIe card slot No
Kabuki-Sumo Slice
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3. WW Agency Approval plan
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WW Agencies Plan (KS-3)
Notes: 1. CB report and Simplified Chinese Manual are requested for CCC submission 2. Traditional Chinese Manual is requested for BSMI submission
Responsibility NotesPlan Actual Plan Actual
FCC part 15 USA 3/02/2007 3/19/2007 Wistron EMI Self DocVCCI Class-B Japan 3/02/2007 3/19/2007 Wistron EMIMPR-II Sweden 3/02/2007 3/19/2007 Wistron EMICE Mark EMEA 3/02/2007 Lenovo/ IBM Self DocUL-60950-1 USA/ Canada 2/12/2007 3/12/2007 Wistron SafetySMA AS/NZS 3548 Australia Lenovo/ IBMAS/NZS 60950 Australia 3/12/2007 3/26/2006 Wistron SafetyCB Report EMEA 2/12/2007 3/12/2007 Wistron SafetyNOM Mexico Lenovo/ IBMMIC Korea Lenovo/ IBMCCC China 3/12/2007 4/23/2007 Wistron SafetyBSMI Taiwan 3/12/2007 4/23/2007 Wistron EMI/ SafetySASO Saudi Arabia 3/19/2007 4/16/2007 Wistron EMI/ SafetySingapore Doc Singapore Lenovo/ IBMCER Eastern Europe Lenovo/ IBMEnergy Star USA Lenovo/ IBMJapan Energy Star Japan Lenovo/ IBM
Agency CountrySubmit Certificate
SIT Exit: 3/19/2007
SVT Exit: 4/27/2007
SOVP: 5/09/2007
Ann/ GA: 5/22/2007
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4. RoHS Compliant Plan
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RoHS Compliant plan
Planar Subsystems ME parts
DV1 RoHS Compliant RoHS Compliant RoHS Compliant
DV2 RoHS Compliant RoHS Compliant RoHS Compliant
SIT RoHS Compliant RoHS Compliant RoHS Compliant
SVT RoHS Compliant RoHS Compliant RoHS Compliant
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5. New FRU/ CRU Plan
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FRU/ CRU Plan
Common parts similar with KS2, FRU is able to follow.Such as:LCD, HDD, KB, Adapter, P/C, MDC,B/T, WLAN,WWAN, Memory module, ODD, Battery.
Below Mechanical parts needs assign new FRU,- Planar- Rear Cover - LCD Bezel- Keyboard Cover- Base Cover)- LCD FPC- FPR Board- WWAN Antenna
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6. Supplier Selection Process
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Supplier Selection Process
Lenovo:
• Buy/ Sell parts following Lenovo rule.
Wistron determinable:
• Sourcer refer to Wistron QVL list
• Judge suppliers developing capability and production capacity to select candidates
• Release spec. requirement & RFQ to candidate suppliers
• Compare cost, experience and service
• Decide award suppliers
• Depends on demand to judge if need 2nd or 3rd source
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Supplier Selection Process
Part Remark1 2
Rear Cover Catcher FoxconnBase Cover Catcher FoxconnLCD Bezel HPI Multi toolingKeyboard Bezel HPI Multi toolingLCD FPC Flexium IIDAThermal Fan Toshiba (LV) Furukawa (LV)Hinge SZS JARLLY
Inverter FoxconnSingle source,patent and partperformance concern
2nd Fan ToshibaSingle source,patent and partperformance concern
Antenna(WLAN/WWAN/MIMO)
WNCSingle source,patent and partperformance concern
Mechnicals source
Supplier
Current mechanical parts vendor candidates :
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7. EC Release Plan
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EC Release Plan
Based on KS-3 Schedule as of Jul. 14, 2006
Plan Exit 08/18/2006Pre-DV 08/28/2006 - 09/11/2006DV1 09/12/2006 - 10/30/2006DV2 10/31/2006 - 12/18/2006SIT 12/26/2006 - 02/26/2007SVT 03/05/2007 - 03/30/2007SOVP 04/09/2007SS 04/23/2007ANN/GA 04/24/2007
EC No. EC Name Work Item・ Rel Date (Plan) Rel Date(Outlook/ Act) Remarks
Last Call PCR TPM T.Gitchell 11/ 18/ 06 11/ 18/ 06 (SIT-4wk)Template-1 & POR Chart TPM Y.Hirano 11/ 27/ 06 11/ 27/ 06 For Supply/ Demand (SOVP-19wk)MFG Sourcing Plan MFG P.McLamb 11/ 27/ 06 11/ 27/ 06 For Supply/ Demand (SOVP-19wk)Define L2 P/ N for Supply/ Demand (Major commodities) DevMgr S.Uno 12/ 11/ 06 12/ 11/ 06 For Supply/ Demand (SOVP-17wk)
TBD SBB/ CTO TPM M.Fujikado 12/ 18/ 06 12/ 18/ 06 For Supply/ Demand (SOVP-16wk)TBD MTM TPM M.Fujikado 12/ 18/ 06 12/ 18/ 06 For Supply/ Demand (SOVP-16wk)TBD L2 P/ N & FRU P/ N (Major commodities) GCM R.Sannohmaru 12/ 18/ 06 12/ 18/ 06 For Supply/ Demand (SOVP-16wk)
FRU Sourcing Plan MFG P.McLamb 12/ 18/ 06 12/ 18/ 06 For FRU (SS -18wk)Loadsheet TPM Y.Hirano 12/ 25/ 06 12/ 25/ 06 For Supply/ Demand (SOVP-15wk)
TBD Pickup L2 P/ N under L1 P/ N (Major commodities) Mech E.Shinohara 12/ 25/ 06 12/ 25/ 06 For Supply/ Demand (SOVP-15wk)Transmittal Mech E.Shinohara 12/ 25/ 06 12/ 25/ 06 For FRU (SS -17wk)Endorse L2 P/ N for SVT Entry (Major commodities) DevMgr S.Uno 01/ 09/ 07 01/ 09/ 07 For SVT Entry (SVT - 8wk)
TBD L2 P/ N (Major commodities if necessary) GCM R.Sannohmaru 01/ 15/ 07 01/ 15/ 07 For SVT Entry (SVT - 7wk)TBD Pickup L2 P/ N under L1 P/ N Mech E.Shinohara 01/ 22/ 07 01/ 22/ 07 For SVT Entry (SVT - 6wk)
Endorse L2 P/ N for SOVP (Major commodities) DevMgr S.Uno 02/ 12/ 07 02/ 12/ 07 For SOVP (SOVP- 8wk)TBD L2 P/ N (Major commodities if necessary) GCM R.Sannohmaru 02/ 19/ 07 02/ 19/ 07 For SOVP (SOVP- 7wk)TBD FRU P/ N (Major commodities if necessary) GCM R.Sannohmaru 02/ 19/ 07 02/ 19/ 07 For FRU (SS - 9wk)TBD FRU P/ N (Except major commodities) Mech E.Shinohara 02/ 19/ 07 02/ 19/ 07 For FRU (SS - 9wk)TBD Pickup L2 P/ N under L1 P/ N Mech E.Shinohara 02/ 26/ 07 02/ 26/ 07 For SOVP (SOVP- 6wk)
Transmittal (Completed) Mech E.Shinohara 02/ 26/ 07 02/ 26/ 07 For FRU (SS - 8wk)
Resp. Eng.
27
8. Quality Development Process
28
Quality Dev. Processes
Quality improvement activities are planned as follows:
Maximize the common design for support new function- Follow the KS-1/2 design as much as possible, such as
HDD/ Battery/ Slice support/ Keyboard e.t.c. - Minimize the modification for supporting new function
- Improvement WWAN performance.- > LCD rear cover is common except MIMO support.
- Support MIMO 3rd antenna with WWAN.- > One new opening on LCD rear cover on top side.
Other portion is same as KS-1.- Improvement palmrest thermal performance.
- > New 2nd FAN solution without any height change of Keyboard/ Bezzel/ Bottom case.
29
How to set design or quality criteria/targets
Followed by KS-3 design target
Thermal design of Palmrest during communication<1> KS-1: No criteria during development phase during file transfer.
Define the test procedure and criteria after SIT.-> Deviation.
<2> KS-2: Improve the thermal performance of Palmrest.<3> KS-3: Support 2.5W MIMO without deviation.
- 2nd FAN solution for palmrest.WWAN performance
- KS-1/2 WWAN performance is not so good. And carrier will not allow this performance on KS-3.
- KS-3 will use new WWAN antenna concept, Rod Antenna. It will be met the carrier’s required performance.
MIMO + WWAN support- KS-1 does not support MIMO.- KS-2 supports MIMO without WWAN.- KS-3 will support MIMO with WWAN.
- 3rd antenna for support MIMO.
KS Note-3 DPRPlanar Design/Layout w/Lesson Learned
Jacky Chang2006/08/02
31
Agenda
• System Block Diagram• Component Layout• Lesson Learned
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IntelCrestline(Int. GFX)
EmbeddedController
12.1"XGALCD
CRT
PSB 800/667MHz
Dual channel 667/533MHz
DMI X2/X4 SMBus
PCI Bus 33MHz
ATA/100
SATA
USB 2.0 x 10 Ports
LPC Bus 33MHz
CPU VR Intel
IMVP-VI
Azalia
USB Conn-1USB Conn-2
ATMELAT8356908
SMBus
TCPAChip
External Connector
Internal Connector
Li Battery
GbEIntel
RU82566MM
CRT I/F for Slice
Thermal Sensor
MAX6602
CB/USB SlotR5534V
SD Slot
Thermal SensorLM26
INVERTER
Clock Generator CK-
EX505(MLF64)
SMBus
IntelMerom NV/LV/ULV
Processor
uFCBGA
802.11a/b/g802.11n
Mini CardMDC
Bluetooth Antenna
802.11a/b/g Antenna
RJ11
RJ45Port
FAN
DDR-II SO-DIMM
OptionalSO DIMM (x1)
LPC BridgeWinbond WPCN385Super I/O
NSPC87392
Media Slice ConnectorUSB (x1), IDE, LPC, CRT, RJ11, RJ45, CD Audio In, Speaker Out,Mouse, Keyboard, 2nd Batt.
CH-0
CH-1
CH-3
CH-4
CH-5
Media Slice USB-HUB
USB HubSMSC
USB2504
IR
KBD I/F
Mouse I/F
Keyboard Light
DC-DCConverter
(G/A)
MAINBATTERY
DC-IN
Media Slice
Ultra SlimBay
CS-2 X Media Slice
Stereo Speaker
SecondBatteryDC-IN
Power Button
Thermal SensorLM75
G/A
USB
USB
USB
CRT
Parallel
Serial
RJ11 RJ45
MonoSpeaker(0.5W)
Audio AMPMAX9789A
Headphone
Microphone
AzaliaCodec
AD1984
InternalMic
Analog RGB Switch
Finger Print
ATA100
USB CH6
APSsensor
Kabuki/Sumo3 System Block Diagram ver 0.2
CH-7
CH-6
MiniCardRicoh R5C843
PCI Express 6Ports
Second Battery
OptionalSO DIMM (x1)
Bluetooth
CH-2
Wireless WANMini Card
Wireless WAN Antenna
(x1)
USB Conn-3
RJ45 Switch
RJ45 for SLICE
USB CH2
1394
USB
MAX3243
Headphone
Microphone
USB CH3
Card BusRicoh
R5C847
SATAHDD HDD
Subcard
IntelICH8-M
GLCI/LCI
CH-8
CH-9
Reserved
Reserved
SPI
SPI
(x1)
RobsonMini Card
New Device
33
Component Layout
• Component Layout on TOP side• Component Layout on BOTTOM
side
34
Component Layout on TOP side
WLANWWAN
Robson
MDC
Finger print
PCMCIA / CardBus
USB Express Card
Speaker
LCD CONN
KB CONNTrack PointRTC BAT
SIO
KBC
Robson
On boardINT MIC
IrDA
CPU VR
Intel IMVP-VI
DCDC area
2nd FAN
35
Component Layout on BOTTOM side
CPU
Merom
North Bridge
Crestline
ICH-8M
DDR2 SO-DIMM Socket
Slice Conn
BAT Conn CPU VR
Intel IMVP-VI
GFX VR
DCDC area
GbER5C847
SIM conn
PMH7RINKAN
HDD Card Conn
CLKGEN
AD1984
MAX9789A
R5534V
USB
CRT
RJ45
SD SocketUSB
USB
Audio
Jacks
1394Wireless Disable SW
SPI
Flash
36
Lesson Learned from KS Note-1
• Name: 77328f_1• Abstract: W2K:USB Rambo can't be recognized when hot-undock on
slice
[Problem Description] Self-powered Sony Rambo Drive can not be recognized if this ODD
has been attached before Hot-Dock action.
[Root Cause]• Some leakage current may come from external USB device via USB
data signals (USB_D+/D-) if the external USB device is self-powered. In this case, the measured voltage on USB_D+ is 1.2V.
• If Media Slice in power-off state and some leakage current on USB data signals, the leakage current will go through SMSC USB2504 to the VDD power rail. In this case, the measured voltage on VDD power rail is 0.95V.
• In KS-1 Media Slice, RC circuit is used to generate a RESET# signal for USB2504. And RC circuit is tied to VDD at 0.95V level. But RESET# must be less than 0.8V for 1us.
• Therefore, “USB2504 is not reset well!!”
37
Root Cause
SMSCUSB2504
VCC3_USB_HUB
RESET# USBDevice
USB_D+/D-
1.2V
0.95V
0.95V
USB2504 is not reset well!!
38
Long-term solution
SMSCUSB2504
VCC3_USB_HUBPWR
RESET# USBDevice
USB_D+/D-
1.2V
0.95V
0V
VCC3_USB_HUB
39
Preventive Action
• Leakage current on USB port has not been checked before. Afterwards, external self-powered USB device will be checked while the system is at Power-off state by the following table. (Sony USB Rambo: DRX-810UL)
• Follow the essence of DQC E12-3: Planar Overall – Legacy 2.04A Power-on printer CRT and/or EXT power supply Attached to IO Ports at Power-off
With Media Slice Without Media Slice
S4/5 S3 S4/5 S3
USB_D+
USB_D-
VBUS
VDD (Host Controller)
40
Cut-in Schedule
The new Slice cut-in date
Items Date RemarkNew PCB Gerber Out 07月14日 DoneSMT for test samples (40pcs) 07月25日 DoneBox Build (40pcs) 07月26日 DoneRisk PO of new PCB 07月28日R&D testing (WHQ/ YMT) 7/31-8/04FOT (WKS) 7/27-8/05SMT of new PCB for Volume production 08月16日Box build for volume production 08月17日