ZXONE 8000 Product Description - Liberty Port - IT and …€¦ · · 2017-01-132.1 Large Transmission Capacity ... 6.13 Automatic Performance Optimization ... ZXONE 8000 Product

ZXONE 8000

Product Description

ZXONE 8000 Product Description

ZTE Confidential Proprietary 1

ZXONE 8000

Product Description

Version Date Author Reviewer Notes

V1.00 2010-11-08 Zhao Shuai Wei Xiaoqiang Not open to the Third Party

V2.00 2011-12-28 Liu Junjuan Xia Yan,Tu Yong, Liu Zhe Not open to the Third Party

V2.10 2012-05-28 Liu Junjuan Xia Yan, Tu Yong, Liu Zhe Not open to the Third Party

V2.20 2013-01-30 Sun Shengli Xia Yan, Liu Zhe Not open to the Third Party

V2.30 2013-05-31 Liu Junjuan Xia Yan, Liu Zhe Not open to the Third Party



V2.60 2014-02-14 Liu Junjuan Xia Yan, Cao Hengxin

Liu Zhe Not open to the Third Party

V2.70 2014-06-06 Liu Junjuan Xia Yan, Xu Kun, Liu Zhe Not open to the Third Party



© 2014 ZTE Corporation. All rights reserved.

ZTE CONFIDENTIAL: This document contains proprietary information of ZTE and is not to be disclosed or used

without the prior written permission of ZTE.

Due to update and improvement of ZTE products and technologies, information in this document is subjected to

change without notice.


2 ZTE Confidential Proprietary

TABLE OF CONTENTS

1 Overview .......................................................................................................... 14

2 Highlights ......................................................................................................... 16

2.1 Large Transmission Capacity ............................................................................. 16

2.2 100Gbit/s system as huge capacity .................................................................... 16

2.3 Single 40Gbit/s system ...................................................................................... 17

2.4 Super Long Distance Transmission ................................................................... 18

2.5 ROADM Optical Scheduling ............................................................................... 18

2.6 Large-capacity ODUk Electrical Switching ......................................................... 18

2.7 Powerful Service Access Capability ................................................................... 19

2.8 Complete Support for ODU0 .............................................................................. 20

2.9 Complete Reliability Mechanism ........................................................................ 20

2.10 GMPLS-based Intelligence ................................................................................ 21

2.11 Energy-saving Green Network ........................................................................... 21

3 System Architecture ........................................................................................ 22

3.1 Overall System Architecture ............................................................................... 22

3.2 Network Element Configuration .......................................................................... 24

3.2.1 Optical Termination Multiplexer (OTM) ............................................................... 24

3.2.2 Fixed Optical Add/Drop Multiplexer (FOADM) .................................................... 24

3.2.3 Reconfigurable Optical Add/Drop Multiplexer (ROADM) .................................... 25

3.2.4 Optical Line Amplifier (OLA) ............................................................................... 26

4 Hardware Architecture .................................................................................... 27

4.1 Rack .................................................................................................................. 27

4.2 Sub-rack ............................................................................................................ 29

4.2.1 Transmission Sub-rack ...................................................................................... 30

4.2.2 Distributed cross-connect Sub-rack of ZXONE 8000 .......................................... 33

4.2.3 Switching Sub-rack ............................................................................................ 35

4.3 Boards ............................................................................................................... 46

4.3.1 Optical Transponder .......................................................................................... 46

4.3.2 Client-side Board ............................................................................................... 50

4.3.3 Line-side Board .................................................................................................. 52

4.3.4 Switching Board ................................................................................................. 54

4.3.5 Optical Multiplexing and Demultiplexing Board .................................................. 54

4.3.6 Fixed OADM Board ............................................................................................ 56

4.3.7 Dynamic OADM Board ....................................................................................... 56

4.3.8 OA (Optical Amplifier) Board .............................................................................. 57

4.3.9 System control, supervision and communication board ...................................... 59



4.3.10 OSC board ......................................................................................................... 60

4.3.11 Clock board ........................................................................................................ 60

4.3.12 Protection board ................................................................................................ 61

4.3.13 Performance supervision board ......................................................................... 61

5 Software structure ........................................................................................... 63

5.1 Board software ................................................................................................... 64

5.2 SNP software ..................................................................................................... 64

5.3 NM software ....................................................................................................... 66

5.4 Communication protocol and interface ............................................................... 67

6 Product characteristics ................................................................................... 68

6.1 Transmission function ........................................................................................ 68

6.1.1 Transport capacity ............................................................................................. 68

6.1.2 Transport distance ............................................................................................. 68

6.1.3 Working wavelength ........................................................................................... 73

6.2 Optical-layer Dispatching ................................................................................... 77

6.2.1 Two-degree (in the ring) wavelength dispatching ............................................... 78

6.2.2 Multi-degree dispatching .................................................................................... 79

6.3 Electrical-layer dispatching ................................................................................ 81

6.4 L2 switching ....................................................................................................... 81

6.5 Optical Power Amplification ............................................................................... 84

6.5.1 Erbium-Doped Fiber Amplifier ............................................................................ 84

6.5.2 Raman Amplification Technology ....................................................................... 84

6.6 Forward Error Correction ................................................................................... 85

6.7 Tunable Wavelength .......................................................................................... 85

6.8 Optical Layer Protection Service ........................................................................ 85

6.8.1 Channel 1+1 Protection (O-SNCP) .................................................................... 86

6.8.2 MS 1+1 Protection ............................................................................................. 86

6.9 Electrical Layer Protection ................................................................................. 87

6.9.1 ODUk Channel 1+1 Protection (ODUk-SNCP) ................................................... 87

6.10 Dispersion Management .................................................................................... 88

6.11 Automatic Power Shutdown/Reduction .............................................................. 89

6.12 Optical Power Management ............................................................................... 90

6.12.1 LAC Service ....................................................................................................... 90

6.12.2 AGC Service ...................................................................................................... 90

6.13 Automatic Performance Optimization (APO) ...................................................... 90

6.14 OMS Layer Power Management ........................................................................ 91

6.14.1 OMS Layer Power Management ........................................................................ 91

6.14.2 OCH Layer Power Management ........................................................................ 92

6.15 Performance Inspection ..................................................................................... 92

6.16 Integrated Wavelength Monitoring ..................................................................... 93



6.17 Communication and Monitoring .......................................................................... 95

6.17.1 Optical Monitoring Channel ................................................................................ 95

6.17.2 Electrical Supervisory Channel .......................................................................... 96

6.18 Time/Clock Synchronization Service .................................................................. 96

6.18.1 Clock Synchronization ....................................................................................... 97

6.18.2 Time Synchronization ........................................................................................ 98

6.19 Alarm Inspection Service ................................................................................... 98

6.19.1 Input and Output External Alarm ........................................................................ 98

6.19.2 Internal Alarm Inspection Service ....................................................................... 99

6.19.3 PRBS Function ................................................................................................ 100

7 WASON........................................................................................................... 101

7.1 Overview .......................................................................................................... 101

7.2 WASON Functionality ...................................................................................... 102

7.2.1 Resource and Topology Automatic Discovery .................................................. 102

7.2.2 End-to-End Service Configuration .................................................................... 102

7.2.3 Protection and Restoration in Mesh Networking ............................................... 103

7.2.4 SLA .................................................................................................................. 103

7.2.5 Network Traffic Balancing ................................................................................ 105

7.2.6 Multi-Level LSP Control ................................................................................... 105

8 Technical Specifications ............................................................................... 106

8.1 Optical Transponder Specifications .................................................................. 106

8.1.1 SOTU2.5G Specifications ................................................................................ 106

8.1.2 SRM42 Specifications ...................................................................................... 108

8.1.3 SDSA Specifications ........................................................................................ 110

8.1.4 DSA Specifications .......................................................................................... 111

8.1.5 SOTU10G/EOTU10G/EOTU10GB Specifications ............................................ 112

8.1.6 SRM41 Specifications ...................................................................................... 115

8.1.7 FCA Specifications ........................................................................................... 117

8.1.8 MOM2 Specifications ....................................................................................... 118

8.1.9 ASMA/ASMB Specifications ............................................................................. 120

8.1.10 TST3 specifications .......................................................................................... 121

8.1.11 MQT3 Specifications ........................................................................................ 124

8.1.12 TS4 Specification ............................................................................................. 127

8.1.13 MX2 Specifications .......................................................................................... 129

8.1.14 TD2C Specifications ........................................................................................ 132

8.1.15 MQA1 Specifications ........................................................................................ 134

8.1.16 MQA2 Specifications ........................................................................................ 135

8.1.17 MJA Specifications ........................................................................................... 137

8.2 Client-side Board Specifications ....................................................................... 138

8.2.1 CH1/CO1 Specifications .................................................................................. 138



8.2.2 CX2/CO2/CQ2/CD2B Specifications ................................................................ 139

8.2.3 EHG1 Specifications ........................................................................................ 141

8.2.4 EQG2 Specifications ........................................................................................ 141

8.2.5 ESG4 Specifications ........................................................................................ 142

8.2.6 CS3 Specifications ........................................................................................... 142

8.2.7 CD3 Specifications ........................................................................................... 143

8.2.8 CS4 Specifications ........................................................................................... 146

8.3 Line-side Board Specifications ......................................................................... 147

8.3.1 LO2/LQ2 Specifications ................................................................................... 147

8.3.2 LD2B Specifications ......................................................................................... 148

8.3.3 LO2B Specifications ......................................................................................... 149

8.3.4 LS3 Specifications ........................................................................................... 150

8.3.5 LS4 Specifications ........................................................................................... 152

8.4 Mux/DeMux Board Specifications .................................................................... 153

8.4.1 OMU Specifications ......................................................................................... 153

8.4.2 VMUX Specifications ....................................................................................... 154

8.4.3 VMUXB Specifications ..................................................................................... 155

8.4.4 ODU Specifications .......................................................................................... 155

8.4.5 ODUB Specifications ....................................................................................... 157

8.4.6 OCI Specifications ........................................................................................... 158

8.4.7 OBM Specifications .......................................................................................... 159

8.4.8 SOGMD Specifications .................................................................................... 159

8.4.9 SOGMDB Specifications .................................................................................. 160

8.5 Optical Add/Drop Multiplexing Board Specifications ......................................... 161

8.6 ROADM Board Specifications .......................................................................... 162

8.6.1 PDU Specifications .......................................................................................... 162

8.6.2 WSU Specifications ......................................................................................... 162

8.6.3 WSUB Specification ......................................................................................... 164

8.6.4 WSUBT20D Specification ................................................................................ 166

8.7 Optical Power Amplification Board Specifications ............................................ 167

8.7.1 SEOBA Specifications ..................................................................................... 167

8.7.2 EOBAH (Enhanced Optical Booster Amplifier) Specifications .......................... 169

8.10.1 EONA (Enhanced Optical Node Amplifier) and M2EONA Specifications .......... 170

8.10.2 HNA Specifications .......................................................................................... 176

8.10.3 SEOPA Specifications ..................................................................................... 179

8.10.4 RAMAN Specifications ..................................................................................... 180

8.10.5 RPOA Specifications ........................................................................................ 182

8.10.6 LAC Specifications ........................................................................................... 182

8.10.7 SFP VOA Specifications .................................................................................. 183

8.11 Protection Board Specifications ....................................................................... 185

8.11.1 SOP Specifications .......................................................................................... 185

8.12 Optical Supervisory Channel Board Specifications ........................................... 186



8.13 Optical Layer Management Subsystem Specifications ..................................... 186

8.13.1 EOPM Board Specifications ............................................................................. 186

8.13.2 EOPM Board (type C) Specifications ............................................................... 187

8.13.3 EOWM Board Specifications ............................................................................ 188

8.13.4 OFM Board Specifications ............................................................................... 188

8.13.5 OFMF Board Specifications ............................................................................. 189

8.14 DCM Specifications .......................................................................................... 189

8.15 Physical Specification and Environmental Requirements ................................. 190

8.15.1 Structure Indices .............................................................................................. 190

8.15.2 Power Supply Indices ...................................................................................... 197

8.15.3 Heat Dissipation ............................................................................................... 202

8.16 Grounding Requirements ................................................................................. 203

8.16.1 Internal grounding requirements of the equipment ........................................... 203

8.16.2 Grounding requirements of equipment room .................................................... 203

8.17 Temperature and Humidity Requirements ........................................................ 203

8.18 Requirements for Cleanness ............................................................................ 204

8.19 Dust-Proof and Corrosion-Proof Requirements ................................................ 205

9 Compliant Standards .................................................................................... 206

10 Abbreviations ................................................................................................ 211



FIGURES

Figure 1-1 Architecture of ZXONE 8000 equipment ...........................................................14

Figure 3-1 Functional diagram of ZXONE 8000 .................................................................22

Figure 3-2 Functional diagram of OTM...............................................................................24

Figure 3-3 Functional diagram of FOADM ..........................................................................25

Figure 3-4 Functional diagram of ROADM .........................................................................26

Figure 3-5 Functional diagram of OLA ...............................................................................26

Figure 4-1 Appearance of ZXONE 8000 rack .....................................................................28

Figure 4-2 Structure of transmission sub-rack (NX4-21 inch) .............................................31

Figure 4-3 Structure of transmission sub-rack (NX4-19 inch) .............................................31

Figure 4-4 Structure of transmission sub-rack (NX41-21 inch) ...........................................32

Figure 4-5 Structure of transmission sub-rack (NX41-19 inch) ...........................................32

Figure 4-6 Structure of distributed cross-connect sub-rack (DX41-21 inch) ........................34

Figure 4-7 Structure of distributed cross-connect sub-rack (DX41-19 inch) ........................34

Figure 4-8 Structure of CX20 switching sub-rack ...............................................................35

Figure 4-9 Structure of CX30 switching sub-rack ...............................................................36

Figure 4-10 Structure of CX50 switching sub-rack .............................................................38

Figure 4-11 Structure of CX22 (PIC) sub-rack....................................................................39





Figure 4-16 OFM4/8 internal structure ...............................................................................62

Figure 4-17 OFMF internal structure ..................................................................................63

Figure 5-1 ZXONE 8000 software structure .......................................................................63

Figure 5-2 NM software structure .......................................................................................66

Figure 6-1 WSUD-based two-degree ROADM sites ...........................................................78

Figure 6-2 Multi-degree ROADM structure (colorless and directionless) ............................79

Figure 6-3 Multi-degree ROAD structure (colorless and directionless) ...............................80



Figure 6-4 Working principle of ZXONE 8000 L2 switching ................................................82

Figure 6-5 Channel 1+1 Protection ....................................................................................86

Figure 6-6 MS 1+1 Protection (EDFA in redundant mode) .................................................87

Figure 6-7 MS 1+1 Protection (EDFA in shared mode) ......................................................87

Figure 6-8 ODUk Channel 1+1 Protection ..........................................................................88

Figure 6-9 Configuration of Dispersion Compensation .......................................................89

Figure 6-10 Wavelength Monitoring Subsystem .................................................................94

Figure 6-11 PRBS Test Principle ..................................................................................... 100

Figure 7-1 Positioning of the Control Platform in Optical Transmission Network .............. 101



TABLES

Table 2-1 ZXONE 8000 switching capability ......................................................................19

Table 2-2 Service access capability of ZXONE 8000 equipment ........................................19

Table 2-3 Protection mechanism of ZXONE 8000 equipment ............................................20

Table 4-1 Configuration of ZXONE 8000 equipment ..........................................................29

Table 4-2 Slots description of CX20 switching sub-rack .....................................................35







Table 4-9 Main functions of optical transponder board .......................................................46

Table 4-10 Functions of branch boards ..............................................................................50

Table 4-11 Functions of line board .....................................................................................52

Table 4-12 ZXONE 8000 multiplexing OMU board .............................................................55

Table 4-13 ZXONE 8000 multiplexing ODU board .............................................................55

Table 4-14 OA types ..........................................................................................................58

Table 5-1 ZXONE 8000 software system interface ............................................................67

Table 6-1 Transmission Codes Supported by 40 2.5Gbit/s System (G.652&G.655) .........68

Table 6-2 Transmission Codes Supported by 16/40 2.5Gbit/s System (G.653) ................69

Table 6-3 Transmission Codes Supported by 40 /48 10Gbit/s System (G.652&G.655) ....69

Table 6-4 Transmission Codes Supported by 80/96 10Gbit/s System (G.652&G.655) ....70

Table 6-5 Transmission Codes Supported by 192 10Gbit/s System (G.652&G.655) .......70

Table 6-6 Transmission Codes Supported by 16/40 10Gbit/s System (G.653) .................70



Table 6-9 Transmission Codes Supported by 16/40 40Gbit/s System (G.653) .................71

Table 6-10 Transmission Codes Supported by 80 100Gbit/s System (G.652 with DCM).72



Table 6-11 Transmission Codes Supported by 80 100Gbit/s System (G.652 without DCM) .............................................................................................................................................72

Table 6-12 Transmission Codes Supported by 80 100Gbit/s System (G.655 with DCM).72

Table 6-13 Transmission Codes Supported by 80 100Gbit/s System (G.655 without DCM) .............................................................................................................................................72

Table 6-14 Transmission Codes Supported by 16/40 100Gbit/s System (G.653) .............73

Table 6-15 Wavelength distribution of 80-wavelength system (50GHz spacing) at band C 73

Table 6-16 Wavelength distribution of 96-wavelength system (50GHz spacing) at extended band C .................................................................................................................................75

Table 6-17 ZXONE 8000 L2 function .................................................................................83

Table 6-18 Clock Transmission Manner .............................................................................97

Table 6-19 List of Alarm Inspected by ZXONE 8000 ..........................................................99

Table 7-1 Multi-Level Service SLA ................................................................................... 103

Table 8-1 Technical specifications of 2.5Gbit/s board at Client-side ................................. 106

Table 8-2 Technical specifications of 2.5Gbit/s board at Line-side ................................... 107

Table 8-3 Technical specifications of SRM42 board......................................................... 108

Table 8-4 Technical specifications of SDSA board ........................................................... 110

Table 8-5 Technical specifications of DSA board ............................................................. 111

Table 8-6 Technical specifications of 10Gbit/s board at Client-side .................................. 113

Table 8-7 Technical specifications of 10Gbit/s board at Line-side .................................... 114

Table 8-8 Technical specifications of SRM41 board......................................................... 115

Table 8-9 Technical specifications of FCA board ............................................................. 117

Table 8-10 Technical specifications of MOM2 board ........................................................ 118

Table 8-11 Technical specifications of ASMA/ASMB board ............................................. 120

Table 8-12 Technical specifications of TST3 board at Client-side .................................... 122

Table 8-13 Technical specifications of TST3 board at Line-side ...................................... 123

Table 8-14 Technical specifications of MQT3 board at Client-Side .................................. 124

Table 8-15 Technical specifications of MQT3 board at Line-side ..................................... 126

Table 8-16 Technical specifications of TS4 board at Client-side ...................................... 127

Table 8-17 Technical specifications of TS4 board at Line-side ......................................... 128

Table 8-18 Technical specifications of MX2 board at Client-Side ..................................... 129



Table 8-19 Technical specifications of MX2 board at Line-side ........................................ 131

Table 8-20 Technical specifications of TD2C board ......................................................... 132

Table 8-21 Technical specifications of MQA1 board ........................................................ 134

Table 8-22 Technical specifications of MQA2 board ........................................................ 135

Table 8-23 Technical specifications of MJA board ........................................................... 137

Table 8-24 Technical specifications of CH1/CO1 board ................................................... 138

Table 8-25 Technical specifications of CX2/CO2/CQ2/CD2B board ................................. 139

Table 8-26 Technical specifications of EHG1 board ......................................................... 141

Table 8-27 Technical specifications of EQG2 board......................................................... 141

Table 8-28 Technical specifications of ESG4 board ......................................................... 142

Table 8-29 Technical specifications of CS3 board ........................................................... 142

Table 8-30 Technical specifications of CD3 board for 40GBASE-LR4 ................................ 143

Table 8-31 Technical specifications of CD3 board for 40G POS ...................................... 145

Table 8-32 Technical specifications of CS4 board ........................................................... 146

Table 8-33 Technical specifications of LO2/LQ2 board .................................................... 147

Table 8-34 Technical specifications of LD2B board ......................................................... 148

Table 8-35 Technical specifications of LO2B board ......................................................... 149

Table 8-36 Technical specifications of LS3 board ............................................................ 150

Table 8-37 Technical specifications of LS4 board ............................................................ 152

Table 8-38 Technical specifications of OMU board .......................................................... 153

Table 8-39 Technical specifications of VMUX board ........................................................ 154

Table 8-40 Technical specifications of VMUXB board ...................................................... 155

Table 8-41 Technical specifications of ODU board .......................................................... 155

Table 8-42 Technical specifications of the ODUB board .................................................. 157

Table 8-43 Technical specifications of the OCI board (100GHz-50GHz) .......................... 158

Table 8-44 Technical specifications of the OCI board (50GHz-25GHz) ............................ 158

Table 8-45 Technical specifications of the OBM board .................................................... 159

Table 8-46 Technical specifications of SOGMD board ........................................................ 159

Table 8-47 Technical specifications of SOGMDB board ................................................... 160

Table 8-48 Technical specifications of SOAD board ........................................................ 161



Table 8-49 Technical specifications of PDU-5-4 board ..................................................... 162

Table 8-50 Technical specifications of PDU-9-2 board ..................................................... 162

Table 8-51 Technical specifications of WSUD board ........................................................ 162

Table 8-52 Technical specifications of WSUA board ........................................................ 163

Table 8-53 Technical specifications of WSUBD9D board ................................................. 164

Table 8-54 Technical specifications of WSUBA9D board ................................................. 165

Table 8-55 Technical specifications of WSUBA9P9D board ............................................. 165

Table 8-56 Technical specifications of WSUBD8-1D board.............................................. 166

Table 8-57 Technical specifications of WSUBT20D board ............................................... 166

Table 8-58 Technical specifications of 40/80-channel SEOBA Board (C- Band) .............. 167

Table 8-59 Technical specifications of 40/80-channel EOBAH Board (C-band) ............... 169

Table 8-60 Technical specifications of 40/80-channel EONA with DCM ........................... 170

Table 8-61 Technical specifications of 40/80-channel M2EONA without DCM ................. 171

Table 8-62 Technical specifications of 40/80-channel M2EONA with DCM ...................... 173

Table 8-63 Technical specifications of 48/96-channel EONA Board (C-band) .................. 175

Table 8-64 Technical Specifications of the HNA2020-WO Board ....................................... 176

Table 8-65 Technical Specifications of the HNA2620-W Board .......................................... 177

Table 8-66 Technical Specifications of the HNA2620-WO Board ....................................... 178

Table 8-67 Technical specifications of 40/80-channel SEOPA Board (C-band) ................ 179

Table 8-68 Technical specifications of RAMAN_P amplifier ............................................. 181

Table 8-69 Technical specifications of RAMAN_B amplifier ............................................. 181

Table 8-70 Technical specifications of RPOA amplifier ....................................................... 182

Table 8-71 Technical specifications of LAC board ........................................................... 182

Table 8-72 Technical specifications of SFP VOA modules ............................................... 183

Table 8-73 Technical specifications of SOP board ........................................................... 185

Table 8-74 Technical specifications of OSC board ........................................................... 186

Table 8-75 Technical Specifications of the EOPM Board (50 GHz) .................................... 186

Table 8-76 Technical Specifications of the EOPM Board (100 GHz) .................................. 187

Table 8-77 Technical Specifications of the EOPM (type C) Board ...................................... 187

Table 8-78 Technical Specifications of the EOWM Board ................................................ 188



Table 8-79 Technical Specifications of the OFM Board .................................................... 188

Table 8-80 Technical Specifications of the OFMF Board ................................................. 189

Table 8-81 Technical specifications of DCM module (G.652 fiber) ................................... 189

Table 8-82 Technical specifications of DCM module (G.655 LEAF fiber) ......................... 190

Table 8-83 Dimensions and Weight of ZXONE 8000 ....................................................... 190

Table 8-84 ZXONE 8000 Board Weight ........................................................................... 192

Table 8-85 The power supply of ZXONE 8000 ................................................................. 197

Table 8-86 board power consumption of ZXONE 8000 equipment ................................... 198

Table 8-87 Temperature and humidity requirements of ZXONE 8000 Equipment ............ 203

Table 8-88 Requirements for concentrations of mechanical active substances ................ 204

Table 8-89 Requirements for concentrations of chemical active substances .................... 204



1 Overview

ZXONE 8000 equipment is large-capacity WDM&OTN switching equipment, orienting to

future and responding IP service bearing needs. It can realize dynamic optical layer

connection and flexible electrical layer switching with the features of high integration,

high reliability and integrated GMPLS control plane.

ZXONE 8000 equipment is mainly applied in backbone core layer and metro area

backbone network. It can also be applied in metro area aggregation layer to meet

operators’ transmission of large-granularity data service, flexible scheduling and service

management monitoring needs.

The architecture of ZXONE 8000 equipment is shown as Figure 1-1

Figure 1-1 Architecture of ZXONE 8000 equipment

Drop Unit ADD Unit

OCH Switch

Client-side Unit

Line-side Unit

ODUk Switch

L2 Switch

O

TU

an

d M

ux

po

nd

er

WA

SO

N/N

MS

Optical layer

Electrical layer

ZXONE 8000 equipment has service grooming function in both optical and electrical

layers:

Optical layer provides FOADM (Fixed Optical Add/Drop Multiplexer) and ROADM



(Reconfigurable Optical Add/Drop Multiplexer) based on the support for ROADM

optical layer wavelength service grooming.

Electrical layer covers ODUk electrical switching, switching granularity

ODU0/1/2/2e/3/4/flex and L2 switching.



2 Highlights

2.1 Large Transmission Capacity

ZXONE 8000 system supports 80/9610G/40G and 80100G large capacity

transmission. 96-wavelength system adopts extended C band of 50GHz channel spacing

(191.3THz196.05THz), supporting smooth upgrade from 40 to 80 or 48 to 96

wavelengths. Modular upgrade can effectively reduce the initial network building cost

and protect customers’ investment.

2.2 100Gbit/s system as huge capacity

ZXONE 8000 can support single 100Gbit/s system, and has following features:

Support 80 wavelengths

Support 80100GE transmission and the capacity of at most 8T.

Support 4 types of ODUk cross connection subrack, and the maximum capacity is

1.4T, 2.8T, 3.2T and 9.4T accordingly.

PM-QPSK Coherent Rx modulation for ULH transmission

PM-QPSK Coherent Rx coding with SD-FEC has good OSNR tolerance and can

restrain the non-linear effect well. It can reach over 3500KM without REG with

50GHZ spacing.

Embedded high-speed DSP technology realizes the compensation of dispersion

and PMD, so that the additional boards of PMD and CD compensation are reduced.

PM-QPSK coding can restrain the non-linear effect well. With DSP technology, the

PMD tolerance can support 30ps/60ps(with 2dB OSNR penalty) and CD tolerance

can support +/-70000ps/nm.



2.3 Single 40Gbit/s system

ZXONE 8000 can support single 40Gbit/s system, and has following features:

Support 96 wavelengths

Support 80/9640G transmission and the capacity of at most 3.84T.

P-DPSK, RZ-DQPSK and PM-QPSK modulation for ULH transmission

Improved DPSK has good OSNR tolerance and can restrain the non-linear effect

well. It can reach 1500KM without the REG with 50GHZ spacing.

RZ-DQPSK has good PMD tolerance and can restrain the non-linear effect well. It

can reach 2000KM without the REG with 50GHZ spacing.

PM-QPSK with coherent detection has 60ps PMD tolerance and +/- 50000 ps/nm

CD tolerance. It can reach 2000KM without the REG with 50GHZ spacing.

Embedded TODC and EDFA and the same dispersion tolerance & power budget as

10G system.

OTU board is embedded with TODC and EDFA, the system allows the biggest

dispersion tolerance of -1000ps/nm ~+1000ps/nm, and the dispersion tolerance &

power budget are the same as 10G system.

Ultra high integration

40G board only needs 2 slots, with high integration and low power consumption.

Single rack supports 21×40G wavelengths.

For the OTN electrical cross-connection subsystem, this supports 2*40G in a single

slot for client side and 1*40G in a single slot for line side.

Smooth network upgrade

The 40G board can plug and play in the legacy equipment because the system is

developed on the existing WDM platform. It supports smooth upgrade from 10G to 40G

without any service interruption.



2.4 Super Long Distance Transmission

ZXONE 8000 equipment adopts Forward Error Correction (FEC), Advanced Forward

Error Correction (AFEC), Soft Decision FEC (SD-FEC), Electrical Return-to-Zero (ERZ)

and adaptive receiver etc. It extends transmission distance of linear system by RAMAN

amplifier, hybrid Node amplifier, high-power EDFA, and remote pump RPOA.

2.5 ROADM Optical Scheduling

ZXONE 8000 adopts flexible wave filter design to realize flexible add/drop of 1 to 80 or 1

to 96 wavelength. It provides complete ROADM solution based on Wavelength Blocker

(WB), Planar Lightwave Circuit (PLC), and Wavelength Selective Switch (WSS). It has

wavelength add/drop, pass-through and broadcast, and optical channel power balancing.

Among these WB and PLC are applied in 2-degree ROADM nodes with the feature of

flexible service configuration and low cost. WSS-based ROADM node supports up to 20

directions. It can be flexibly configured as different combination of colored, directional,

colorless, and directionless based on customers’ needs. At the same time modular

design of ROADM supports smooth upgrade of wavelength and dimension, which

reduces initial network building cost and protects customers’ investment.

2.6 Large-capacity ODUk Electrical Switching

ZXONE 8000 equipment can provides 8 different types of electrical switching

sub-racks(CX20,CX21,CX30,CX31,CX50,CX51,CX71,CX22), which can implements

ODU0/1/2/2e/3/4/flex based centralized non-blocking switching and realize flexible

service scheduling in electrical layer. At the same time, client-side and line-side are

separated. They share the line bandwidth and effectively improve network bandwidth

utilization.

Client-side board or line-side board can be flexibly added or deleted based on

practical needs to protect operators’ investment.

Client-side and line-side boards can be combined flexibly. Network spare parts

types can be reduced from M×N to M+N (M is client-side board and N is line-side



board, M, N>2) to reduce CapEx.

Client-side and line-side boards are separated, which can improve flexible

scheduling and reduce OAM pressure.

Table 2-1 ZXONE 8000 switching capability

Model Switching

Capacity

Switching Granularity

CX20 Switching Sub-rack

800Gbit/s ODU0/1/2/2e/3/flex


1.6Tbit/s ODU0/1/2/2e/3/flex


3.2Tbit/s ODU0/1/2/2e/3/flex


800Gbit/s ODU0/1/2/2e/3/flex


1.4Tbit/s ODU0/1/2/2e/3/4/flex







2.7 Powerful Service Access Capability

ZXONE 8000 equipment adopts an open design to access service signals with different

rates and formats.

Table 2-2 Service access capability of ZXONE 8000 equipment

Service Service type

SDH/POS/ATM STM-1, STM-4, STM-16, STM-64, STM-256

SONET OC-3, OC-12, OC-48, OC-182, OC-768



Service Service type

Ethernet FE, GE, 10GE WAN, 10GE LAN,40GE,100GE

SAN storage FC100, FC200, FC400, FC800, FC1200

ESCON

FICON, FICON Express

OTN OTU1, OTU2, OTU2e, OTU3, OTU4

Video and other services DVB-ASI, SDI, FDDI

ZXONE 8000 system can implement multiplexing/demultiplexing between low rate

customer signals and high rate system signals so as to realize highly-efficient

transmission of sub-ate services.

2.8 Complete Support for ODU0

ZXONE 8000 equipment provide complete support for ODU0 including ODU0 switching

and ODU0 overhead.

GE low rate service is encapsulated to ODU0. Compared with the traditional

method of ODU1 encapsulation, it improves bandwidth utilization and makes

switching scheduling more flexible.

GE service is encapsulated to ODU0 to realize service-level automatic resource

discovery and fast launching.

The complete support for ODU0 overheads, especially PM overhead and TCMi

overhead will help to provide more perfect end-to-end monitoring.

2.9 Complete Reliability Mechanism

ZXONE 8000 equipment provides complete network-level protection and

equipment-level protection.

Table 2-3 Protection mechanism of ZXONE 8000 equipment

Network-level Optical layer protection Optical channel 1+1 protection,



protection multiplexing 1+1 protection

Electrical layer protection

Sub-wavelength channel 1+1 protection

L2 protection Ethernet Smart Ring (ESR)

GMPLS control plane-based protection and restoration

Equipment-level

protection

control board 1+1 protection, power supply 1+1 protection, clock 1+1 protection, switching board 1+1 protection/cubic protection, and sub-rack connection 1+1 protection

2.10 GMPLS-based Intelligence

ZXONE 8000 supports loading of WASON based on GMPLS. It realizes optical and

electrical dual intelligent plane. It implements automatic discovery of network resource

and topology, service grooming, and traffic control etc. to cut service deployment time.

It provides various protection/restoration solutions based on SLA (Service Level

Agreement) to defend against multi-point failure and enhance network reliability and

improve network resource utilization.

2.11 Energy-saving Green Network

ZXONE 8000 equipment adopts many measures to reduce equipment power

consumption and space, so as to help the operators to build a green network.

Average power consumption for 10Gbit/s bandwidth is 18W

High integration: up to 10×10Gbit/s for a single slot and 16×2.5Gbit/s for a single

slot

System core chips are 45nm/40nm/28nm which reduces consumption to the best.

Low consumption optical XFP model is adopted.



3 System Architecture

3.1 Overall System Architecture

The functional diagram of ZXONE 8000 is shown in Figure 3-1

Figure 3-1 Functional diagram of ZXONE 8000

ZXONE 8000 has hardware system and network management software system, which

cooperate with each other but work independently. ZXONE 8000 hardware system

includes optical forwarding platform, service aggregation platform, add/drop wavelength

division multiplexing platform, optical amplifying platform, protection platform and

monitoring platform.

Optical transfer platform

It adopts optical/electrical/optical conversion to implement conversion between service

signal and line signal wavelength. Line-side signals meet G.692 and G.709 requirements

after signal wavelength conversion.

Service aggregation platform

It aggregates multiple low-rate signals to one wavelength, or disaggregates a high-rate

signal on a wavelength into multiple low-rate signals.



Add/drop multiplexing/demultiplexing platform

Add/drop multiplexing platform implements add/drop and multiplexing of line optical

signal wavelength. The equipment can be divided into Fixed Optical Add/Drop

Multiplexer (FOADM) and Reconfigurable Optical Add/Drop Multiplexer (ROADM) based

on the fact whether the add/drop wavelength is fixed.

Multiplexing/demultiplexing platform completes multiplexing and demultiplexing of line

optical signals.

Multiplexing: coupling multiple optical signals with different wavelength from

optical forwarding platform and service aggregation platform into one fiber

for output.

Demultiplexing: separate line optical signals from optical amplifying platform

based on different wavelength channels and send them into different optical

forwarding platforms and service aggregation platforms respectively.

Optical Amplifying Platform

It takes consumption compensation for long-distance transmitted optical signal by optical

amplifying. It usually locates behind demultiplexing platform, before multiplexing platform,

and at the intermediate position of line transmission.

Protection Platform

It provides system with network-level and equipment-level protection.

Monitoring Platform

Collect process and report the configuration, alarm and performance

information of each platform to the network management system.

Receive the commands issued by network management system and

forward them to the destination board.

Transmit network management message via designated monitoring optical

channel, which supports a rate of 100Mbit/s with a wavelength of 1510 nm.



3.2 Network Element Configuration

Based on the location, ZXONE 8000 can be configured as OTM (Optical Termination

Multiplexer), FOADM (Fixed Optical Add/Drop Multiplexer), ROADM (Reconfigurable

Optical Add/Drop Multiplexer), and OLA (Optical Line Amplifier).

3.2.1 Optical Termination Multiplexer (OTM)

OTM implements the function of line terminal nodes with all services. When ZXONE

8000 works as Figure 3-2

Figure 3-2 Functional diagram of OTM

3.2.2 Fixed Optical Add/Drop Multiplexer (FOADM)

Fixed Optical Add/Drop Multiplexer (FOADM) can add/drop services with designated

wavelength and has direct connection to other services. When local add/drop services

exceed 16 wavelengths, OTM back-to-back is adopted. When it works as FOADM, the

relationship between the platforms is shown in Figure 3-3.



Figure 3-3 Functional diagram of FOADM

Service aggregation

platform Service aggregation

platform

Optical transfer

platform

Client signal

Client signal

Pass-through

Add/drop

platform

Optical

line

(West）

Optical

amplifying

platform

Optical

amplifying

platform

Monitoring

platform

Monitoring

platform

Optical

line (East)

3.2.3 Reconfigurable Optical Add/Drop Multiplexer (ROADM)

Reconfigurable Optical Add/Drop Multiplexer (ROADM) has dynamic and flexible

wavelength add/drop path. It can take dynamic control of wavelength add/drop and direct

connection at local and from remote. It supports wavelength reconfiguration in many

directions (that is to say, wavelength in any direction can be switched to any other

direction). It also supports power adjustment of direct connection wavelength and local

add/drop. When it works as FOADM, the relationship between the platforms is shown in

Figure 3-4



Figure 3-4 Functional diagram of ROADM

3.2.4 Optical Line Amplifier (OLA)

Optical Line Amplifier (OLA) works to make power compensation for long-distance

transmitted optical signal. When it works as OLA, the relationship between the platforms

is shown in Figure 3-5.

Figure 3-5 Functional diagram of OLA

Monitoring

platform

Optical amplifying

platform

Optical amplifying

platform

Optical line

(West）

In

Out

Out

In

Optical line

(East）



4 Hardware Architecture

ZXONE 8000 equipment hardware architecture includes rack, sub-rack, DCM chassis

and boards.

4.1 Rack

ZXONE 8000 equipment adopts ZTE transmission equipment rack which conforms to

ETSI standards. The rack uses front and back pillar with single swinging door.

ZXONE 8000 equipment can provides series transmission sub-racks. They are

transmission sub-rack NX4/NX41, Distributed cross-connect sub-rack DX41 and 8

different types of electrical switching sub-racks (CX20, CX30, CX50, CX21, CX22, CX31,

CX51 and CX71). The appearance of ZXONE 8000 rack is shown in Figure 4-1.



Figure 4-1 Appearance of ZXONE 8000 rack



The typical configuration of ZXONE 8000 equipment is 2.2-meter high ETSI 300mm rack,

with the following configured:

Table 4-1 Configuration of ZXONE 8000 equipment

CX20

Switching

Sub-rack+

Transmissi

on

Sub-rack

CX30

Switching

Sub-rack +

Transmissi

on

Sub-rack

CX50

Switching

Sub-rack +

Transmission

Sub-rack

CX21/CX22

Switching

Sub-rack+

Transmissi

on

Sub-rack

CX31

Switching

Sub-rack +

Transmissi

on

Sub-rack

CX51

Switching

Sub-rack +

Transmission

Sub-rack

CX71

Switching

Sub-rack +

Transmission

Sub-rack(600

mm depth for

CX71)

4×CX20 2×CX30 1×CX50+

1×(DX or NX) 4×CX21/CX22

2×CX31 1×CX51+

1×(DX or NX) 1×CX71

3×CX20+

1×(DX or NX)

1×CX30+

2×(DX or NX)

4×(DX or NX)

3×CX21/CX22+

1×(DX or NX)

1×CX31+

2×(DX or NX)

4×(DX or NX)

2×CX20 +

2 ×(DX or NX)

4 ×(DX or NX)

2×CX21/CX22 +

2 ×(DX or NX)

4 ×(DX or NX)

1×CX20 +

3 ×(DX or NX)

;

1×CX21/CX22 +

3 ×(DX or NX)

4 ×(DX or NX)

4 ×(DX or NX)

4.2 Sub-rack

ZXONE 8000 equipment takes sub-rack as its basic unit which adopts independent

power supply.

There are four types of sub-rack in ZXONE 8000 system: Transmission sub-rack,

distributed cross-connect sub-rack, PIC sub-rack and cross connection sub-rack,

which are named NX, DX and CX. NX refers to sub-rack without switching backplane,



DX refers to sub-rack with distributed switching backplane. CX refers to sub-rack with

centralized switching backplane or PIC platform, One node may comprise of DX(NX)

sub-rack(s) or CX+DX(NX) sub-racks:

CX20: single-layer sub-rack with centralized switching backplane;

CX30: dual-layer sub-rack with centralized switching backplane;

CX50: triple-layer sub-rack with centralized switching backplane;

CX21: single-layer sub-rack with centralized switching backplane (for 100G system);

CX31: dual-layer sub-rack with centralized switching backplane (for 100G system);

CX51: triple-layer sub-rack with centralized switching backplane (for 100G system);

CX71: triple-layer sub-rack with centralized switching backplane (for 100G system and

600mm-depth sub-rack);

CX22: single-layer sub-rack with PIC function

DX: Sub-rack with distributed switching backplane;

NX: Sub-rack without switching backplane

4.2.1 Transmission Sub-rack

There are two types transmission sub-racks, they are NX4 and NX41. The NX4 is a 9.5U

sub-rack, and the NX41 is a 10U sub-rack, which are shown in Figure 4-2, Figure 4-3,

Figure 4-4 and Figure 4-5.



Figure 4-2 Structure of transmission sub-rack (NX4-21 inch)

Dust Proof Net

SE

IA

Fiber Cable Area

SFANASFANASFANASFANA

SP

WA

SP

WA

Wirin

g

Are

a

24 6 8 10 12 14 16 18 20 22 24 26

1 3 5 7 9 11 13 15 17 19 21 23 251

2


Dust Proof Net

SE

IA

Fiber Cable Area

SFANA

SP

WA

SP

WA

Wirin

g

Are

a

24 6 8 10 12 14 16 18 20 22

1 3 5 7 9 11 13 15 17 19 211

2

SFANA SFANA SFANA




Fiber Cable Area

FCC

PW

EP

WE

30 32

CC

PC

CP

1210 161442 86 28262018 2422

29 31119 151331 75 27251917 2321


30 321210 1614 28262018 2422

Fiber Cable Area

FCC

PW

EP

WE

26

CC

PC

CP

1210 16144

SO

SC

SN

P/S

CC

2

SN

P/S

CC

86

SO

SC

282018 2422

25 27119 151331 75 1917 2321

The transmission sub-rack of NX4 has totally 26 semi-height slots (13 full-height slots)

for 21-inch sub-rack, and 22 semi-height slots (11 full-height slots) for 19-inch sub-rack,

2 power supply slots, 4 fan boards, and 1 interface area. The description of sub-rack

board slot is as follows:



Slot 1 and 2: fixed on master sub-rack for SNP, for SCC on slave sub-rack. If SCC

is not configured, slot 1 and 2 can be plugged with service board.

Slot 3 and 5: for SOSC board (main/standby) for master sub-rack.

Slot 27 and 28(or slot 23 and 24 for 19 inch sub-rack): fixed for SPWA power supply

board.

Slot 29(or slot 25 for 19 inch sub-rack): fixed for SEIA board.

Slot 1-26(Slot 1-22 for 19 inch sub-rack): for any service board except the above

fixed slots on the master sub-rack, for service board all slots on the slave sub-rack.

The transmission sub-rack of NX41 has totally 28 semi-height slots (24 semi-height slots

for 19 inch sub-rack), 2 power supply slots, and 2 interface boards. The description of

sub-rack board slot is as follows:

Slot 1 and 2: fixed on master sub-rack for SNP.

Slot 3 and 5: for SOSC board (main/standby) for master sub-rack. If SOSC is not

configured, slot 3 can be plugged with service board.

Slot 30 and 32(slot 26 and 28 for 19 inch sub-rack): fixed for PWE board.

Slot 29 and 31(slot 25 and 27 for 19 inch sub-rack): fixed for CCP board.

4.2.2 Distributed cross-connect Sub-rack of ZXONE 8000

The distributed sub-rack of ZXONE 8000 equipment is a 10U sub-rack, which meets the

installation requirements of ETSI rack as shown in Figure 4-6 and Figure 4-7.



Figure 4-6 Structure of distributed cross-connect sub-rack (DX41-21 inch)

Fiber Cable Area

FCC

PW

EP

WE

30 32

CC

PC

CP

1210 161442 86 28262018 2422

29 31119 151331 75 27251917 2321

Figure 4-7 Structure of distributed cross-connect sub-rack (DX41-19 inch)

30 321210 1614 28262018 2422

Fiber Cable Area

FCC

PW

EP

WE

26

CC

PC

CP

1210 16144

SO

SC

SN

P/S

CC

2

SN

P/S

CC

86

SO

SC

282018 2422

25 27119 151331 75 1917 2321

The distributed cross-connect sub-rack of ZXONE 8000 equipment has totally 28

semi-height slots (24 semi-height slots for 19 inch sub-rack), 2 power supply slots, and 2

interface boards. The description of sub-rack board slot is as follows:

Slot 1 and 2: fixed on master sub-rack for SNP.



Slot 3 and 5: for SOSC board (main/standby) for master sub-rack. If SOSC is not

configured, slot 3 can be plugged with service board.

Slot 30 and 32 (slot 26 and 28 for 19-inch sub-rack): fixed for PWE board.

Slot 29 and 31(slot 25 and 27 for 19-inch sub-rack): fixed for CCP board.

4.2.3 Switching Sub-rack

The switching sub-rack of ZXONE 8000 is divided into single-layer and multi-layer

switching racks based on their different switching capacity.

4.2.3.1 CX20 Switching Sub-rack

CX20 switching sub-rack of ZXONE 8000 equipment is a 10U single-layer sub-rack

meeting ETSI rack installation requirements. The sub-rack structure is shown in Figure

4-8

Figure 4-8 Structure of CX20 switching sub-rack

Fiber Cable Area

FCC

XC

AX

CA

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

PW

DP

WD

18 19

CC

PC

CP

22 23

16 17

20 21

Table 4-2 Slots description of CX20 switching sub-rack

Board Designated

slot Description



Board Designated

slot Description

FCC (fan board) Sub-rack top

PWD (power supply board)

18, 19 Two PWD board should be configured for single CX20 switching sub-rack

CCP (sub-rack management)

22, 23 Two CCP board should be configured for single CX20 switching sub-rack

XCA (switching board)

9, 10 Two XCA board should be configured for single CX20 switching sub-rack

service slot 1-8;11-17 Service board can be configured in these slots. The backplane bandwidth has two types: 40G and 80G.


CX30 switching sub-rack of ZXONE 8000 equipment is a 20U dual-layer sub-rack


4-9:


PW

DP

WD

PW

DP

WD

Fiber Cable Area

FCC

Fiber Cable Area

24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42

CL

KC

LK

XC

AX

CA

XC

AX

CA

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 18 19

CC

PC

CP

FCC

22 23

16 17

20 21

45 4643 44




Board Designated

slot Description

FCC (fan board) Sub-rack top and bottom


18, 19, 41, 42 4 PWD boards should be configured for single CX30 switching sub-rack


22, 23 2 CCP boards should be configured for single CX30 switching sub-rack


8, 9, 10, 11 4 XCA boards should be configured for single CX30 switching sub-rack

CLK (clock board)

45, 46 2 CLK boards should be configured for single CX30 switching sub-rack

service slot 1-7;12-17;24-40 Service board can be configured in these slots. The backplane bandwidth has two types: 40G and 80G


CX50 switching sub-rack of ZXONE 8000 equipment is a 30U triple-layer sub-rack


4-10:




Fiber Cable Area

Fiber Cable Area

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

FCC

PW

DP

WD

XC

A

XC

A

XC

A

XC

A

XC

A

XC

A

24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42

CL

KC

LK

PW

DP

WD

Fiber Cable Area

FCC

62 63 64 65

CC

PC

CP

PW

DP

WD

18 19

CC

PC

CP

22 23

16 17

20 21

39 40

43 44 45 46

66 67 68 69

47 48 49 50 51 52 53 54 55 56 57 58 59 60 61


Board Designated slot Description

FCC (fan board)

Sub-rack top and bottom


18, 19, 41, 42, 64, 65 6 PWD boards should be configured for single CX50 switching sub-rack


22, 23, 68, 69 4 CCP boards should be configured for single CX50 switching sub-rack


30 ~ 35 6 XCA boards should be configured for single CX50 switching sub-rack




CLK (clock board)


service slot 1-17;24-29;36-40;47-63 Service board can be configured in these slots. The backplane bandwidth is 80G

4.2.3.4 CX22 (PIC) Sub-rack

The CX22(PIC) sub-rack of ZXONE 8000 equipment is a 10U sub-rack, which meets the

installation requirements of ETSI rack as shown in Figure 4-11

Figure 4-11 Structure of CX22 (PIC) sub-rack

SO

GM

DB

EIC

10

0G

slo

t

Fiber Cable Area

FCC

10

0G

slo

t

10

0G

slo

t

10

0G

slo

t

XC

AX

CA

10

0G

slo

t

15 16 17 18 19 20

10

0G

slo

t

10

0G

slo

t

21 22

PW

EP

WE

26 28

CC

PC

CP

10

0G

slo

t

23 24

SN

PS

NP

SO

SC

BT

IS

1 3 5 7 25 27

2 4 6 8 12 14

9

10

11 13

The CX22 sub-rack of ZXONE 8000 equipment has totally 24 slots, 2 power supply slots,

and 2 CCP boards. The description of sub-rack board slot is as follows:

Slot 1 and 2: fixed on main sub-rack for SNP.

Slot 3 for SOSCB board (main/standby) for main sub-rack.

Slot19 and 20: fixed for XCA board

Slot 25 and 27: fixed for PWE board.



Slot 26 and 28: fixed for CCP board.


CX21 switching sub-rack of ZXONE 8000 equipment is a 10U single-layer sub-rack


4-12:


Fiber Cable Area

FCC

100G

Slo

t

100G

Slo

t

XC

A

100G

Slo

t

100G

Slo

t

XC

AX

CA

100G

Slo

t

100G

Slo

t

100G

Slo

t

100G

Slo

t

100G

Slo

t

100G

Slo

t

100G

Slo

t

100G

Slo

t

PW

DP

WD

CC

PC

CP

100G

Slo

t

ET

IE

TI

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 18 1916 17

22 2321



FCC (fan board) Sub-rack top


18, 19 Two PWD board should be configured for single CX21 switching sub-rack


22, 23 Two CCP board should be configured for single CX21 switching sub-rack


7,8,9 Three XCA board should be configured for single CX21 switching sub-rack

service slot 1-6;10-17 Service board can be configured in these slots. The backplane bandwidth is 100G




CX31 switching sub-rack of ZXONE 8000 equipment is a 20U double-layer sub-rack


4-13.


ET

IE

TI

100G

Slo

t

Fiber Cable Area

FCC

Fiber Cable Area

100G

Slo

t

100G

Slo

t

100G

Slo

t

100G

Slo

t

100G

Slo

t

100G

Slo

t

100G

Slo

t

100G

Slo

t

100G

Slo

t

100G

Slo

t

100G

Slo

t

100G

Slo

t

100G

Slo

t

100G

Slo

t

100G

Slo

t

100G

Slo

t

XC

AX

CA

XC

A

XC

A

100G

Slo

t

XC

AX

CA

100G

Slo

t

100G

Slo

t

100G

Slo

t

100G

Slo

t

100G

Slo

t

100G

Slo

t

100G

Slo

t

100G

Slo

t

FCC

100G

Slo

t

PW

DC

CP

PW

DC

CP

PW

DC

LK

PW

DC

LK

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 18 1916 17

22 2321

24 25 26 27 28 29 30 31 32 33 34 37 3835 36 41 4239 40

45 46



FCC (fan board) Sub-rack top and bottom


18, 19, 41, 42 4 PWD boards should be configured for single CX31 switching sub-rack

CCP (sub-rack 22, 23 2 CCP boards should be configured for




management) single CX31 switching sub-rack


7, 8, 9, 10, 11,12 6 XCA boards should be configured for single CX31 switching sub-rack

CLK (clock board)


service slot 1-6;13-17;24-40 Service board can be configured in these slots. The backplane bandwidth is 100G.




4-14.




10

0G

slo

t1

00

G s

lot

10

0G

slo

t

PW

DP

WD

Fiber Cable Area

Fiber Cable Area

10

0G

slo

t

10

0G

slo

t

10

0G

slo

t

10

0G

slo

t

10

0G

slo

t

10

0G

slo

t

10

0G

slo

t

10

0G

slo

t

10

0G

slo

t

10

0G

slo

t

10

0G

slo

t

10

0G

slo

t

10

0G

slo

t

1 2 3 4 5 6 7 8 9 10 11 12 13

10

0G

slo

t

10

0G

slo

t

14 15 16 17 18 19

CC

PC

CP

FCC

PW

DP

WD

XC

AX

CA

XC

A

XC

A

10

0G

slo

t

XC

AX

CA

10

0G

slo

t

10

0G

slo

t

10

0G

slo

t

10

0G

slo

t

24 25 26 27 28 29 30 31 32 33 34 35 36

10

0G

slo

t

37 38 39 40 41 42

CL

KC

LK

PW

DP

WD

Fiber Cable Area

FCC

10

0G

slo

t

10

0G

slo

t

10

0G

slo

t

10

0G

slo

t

10

0G

slo

t

10

0G

slo

t

10

0G

slo

t

47 48 49 50 51 52 53 54 55 56 57 58 59

10

0G

slo

t

60 61 62 63 64 65

CC

PC

CP

68 69

45 46

22 23

63

40

17



FCC (fan board)

Sub-rack top and bottom


18, 19, 41, 42, 64, 65 6 PWD boards should be configured for single CX51




switching sub-rack


22, 23, 68, 69 4 CCP boards should be configured for single CX51 switching sub-rack


30 ~ 35 6 XCA boards should be configured for single CX51 switching sub-rack

CLK (clock board)


service slot 1-17;24-29;36-39;47-62 Service board can be configured in these slots. The backplane bandwidth is 100G




4-15.




Intake portX

CC

XC

C

XC

C

10

0G

Slo

t

10

0G

Slo

t

10

0G

Slo

t

10

0G

Slo

t

10

0G

Slo

t

10

0G

Slo

t

10

0G

Slo

t

10

0G

Slo

t

10

0G

Slo

t

10

0G

Slo

t

10

0G

Slo

t

10

0G

Slo

t

10

0G

Slo

t

10

0G

Slo

t

10

0G

Slo

t

10

0G

Slo

t

10

0G

Slo

t

10

0G

Slo

t

10

0G

Slo

t

Fiber Cable Area

10

0G

Slo

t

10

0G

Slo

t

10

0G

Slo

t

10

0G

Slo

t

10

0G

Slo

t

10

0G

Slo

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10

0G

Slo

t

10

0G

Slo

t

10

0G

Slo

t

10

0G

Slo

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10

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Slo

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Slo

t

10

0G

Slo

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10

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Slo

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10

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Slo

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Slo

t

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0G

Slo

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0G

Slo

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10

0G

Slo

t

10

0G

Slo

t

CL

KC

10

0G

Slo

t

10

0G

Slo

t

PW

F

10

0G

Slo

t

10

0G

Slo

t

10

0G

Slo

t

10

0G

Slo

t

10

0G

Slo

t

PW

F

Fiber Cable Area

Fiber Cable Area

Fiber Cable Area

FCE

Fiber Cable Area

Intake port

ET

IE

TI

Front

10

0G

Slo

t

10

0G

Slo

t

10

0G

Slo

t

10

0G

Slo

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10

0G

Slo

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10

0G

Slo

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10

0G

Slo

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0G

Slo

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Slo

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10

0G

Slo

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10

0G

Slo

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0G

Slo

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10

0G

Slo

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0G

Slo

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Slo

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0G

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Fiber Cable Area

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Slo

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Slo

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Slo

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Slo

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0G

Slo

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0G

Slo

t

10

0G

Slo

t

Fiber Cable Area

Fiber Cable Area

FCC

Back

CL

KC

PW

F

10

0G

Slo

t

10

0G

Slo

t

PW

F

10

0G

Slo

t

10

0G

Slo

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Fiber Cable Area

10

0G

Slo

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Slo

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0G

Slo

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Slo

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10

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Slo

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Slo

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Fiber Cable Area

XC

C

XC

C

XC

C

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 18 1916 17

36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 53 5451 52

20 21 22 23 24 25

30 31 32 33 34 35

26 27 28 29

55

56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 73 7471 72

91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 108106 107



Fan Unit Sub-rack top and bottom

PWF (power supply board)

25,35,75,85, 4 PWF boards should be configured for single CX71 switching sub-rack

XCC(switching board)

26~ 28,82~84 6 XCC boards should be configured for single CX71 switching sub-rack

CLKC (clock 28,81 2 CLKC boards should be




and control board)

configured for single CX71 switching sub-rack

service slot 1-24;30-34;36-53;56-74;76-80;86-108

Service board can be configured in these slots. The backplane bandwidth is 100G

4.3 Boards

ZXONE 8000 equipment provide multi-functional boards including optical wavelength

conversion board, branch board, line board, optical multiplexing and demulitiplexing

board, optical add/drop multiplexing board (fixed and reconfigurable), optical power

amplifying board, optical protection board, system control, monitoring, and

communication board.

4.3.1 Optical Transponder

The main function of optical transponder is to aggregation or converts the accessed one

or multiple client-side signals and put out DWDM standard wavelength as ITU-T G.694.1

suggested, so that the multiplexing unit can take wavelength multiplexing of optical

signals of different wavelengths. All wavelength transponder units of ZXONE 8000

equipment are transceivers which can implement the reverse process of the above.

Main functions of optical transponder board are shown in Table 4-9:

Table 4-9 Main functions of optical transponder board

Board

Maximum

client-side

interface

Client-side optical

signal type

Line side

optical

signal type

Description

SOTU2.5G 1 STM-16

OTU1 OTU1

Single-port STM service wavelength transponder

OTUF 1 STM-16

OTU1

STM-16+FEC

Single-port STM service wavelength transponder



Board

Maximum

client-side

interface

Client-side optical

signal type

Line side

optical

signal type

Description

SOTU10G 1

STM-64

10GE-LAN

10GE-WAN

10G POS

OTU2

FC1200

OTU2

OTU2e 10Gbit/s service wavelength transponder

EOTU10G 1

STM-64

10GE-LAN

10GE-WAN

10G POS

OTU2

OTU2


EOTU10GB

1

STM-64

10GE-LAN

10GE-WAN

10G POS

OTU2

OTU2


TST3 1

STM-256

40G POS

OTU3

OTU3 40Gbit/s service wavelength transponder

TS4 1 100GE

OTU4 OTU4

100Gbit/s service wavelength transponder

SRM42 4 STM-1

STM-4 STM16

4-port STM service aggregation wavelength transponder

SDSA 2 GE

FC100 OTU1

2-port GE or FC100 service aggregation wavelength transponder

DSAF 2 GE OTU1 2-port GE service aggregation wavelength transponder

DSA 8

GE

FC100

FC200

STM-16 Dual-transmitting selective-receiving 8-port data service aggregation



Board

Maximum

client-side

interface

Client-side optical

signal type

Line side

optical

signal type

Description

ESCON

FICON

DVB-ASI

wavelength transponder

SRM41 4 STM-16 OTU2 4-port STM-16 service aggregation wavelength transponder

FCA 8

GE

FC100

FC200

FC400

OTU2

8-port GE or 8-port FC 100/4-port FC 200/2-port FC 400 service aggregation wavelength transponder

ASMA 26 GE

10GE OTU2

24-port GE and 1-port 10GE aggregation 2*OTU2 wavelength transponder

ASMB 10 GE

10GE OTU2

Multiplexes/demultiplexes 8 channels of GE signals or two channel of 10 GE

signal into/from two channels of OTU2 signals

MOM2 8

GE

FC100

FC200

2.5G

OTU2

Multiplexes/demultiplexes 8 channels of GE signals or two channel of 10 GE

signal into/from two channels of OTU2 signals

MQT3 4

STM-64

10GE-LAN

10GE-WAN

10G POS

OTU2

OTU3

Realizes 4* STM64, 10GE LAN, OTU2, complaint with G.709 recommendation, and conducts FEC/AFEC coding/decoding on the signal

MX2 10

STM-64

10GE-LAN

10GE-WAN

OTU4 10-port 10Gbit/s service aggregation wavelength transponder



Board

Maximum

client-side

interface

Client-side optical

signal type

Line side

optical

signal type

Description

10G POS

OTU2

FC800

FC1200

MQA1 4

From 100Mbps to 2.67Gbps.

Typical types of services:

STM-1/4/16(OC-3/12/48),

OTU1, FE/GE, 1G/2GFC, DVB_ASI/ESCON/FICON/HDTV, PDH.

OTU1 Muxponder of 4 ports any rate to OTU1

MJA 6

Upgrade smoothly from 4 to 10 any rate service access on client side by collaborating with MQA1;

Upgrade smoothly from 4 to 22 any rate service access on client side by collaborating with MQA2.

MJA supports any rate service from 100Mbps to 2.5Gbps.

- Muxponder of 6 ports any rate to main board

TD2C 2

STM-64

10GE-LAN

10GE-WAN

OTU2

OTU2e

10Gbit/s service wavelength transponder



Board

Maximum

client-side

interface

Client-side optical

signal type

Line side

optical

signal type

Description

10G POS

OTU2

FC 800

FC1200

4.3.2 Client-side Board

Functions of client-side board are shown in Table 4-10:

Table 4-10 Functions of branch boards

Board Maximum

client-side

interface

Client-side

optical

signal type

Description

CS4 1 100GE

OTU4

To implement conversion between 1-port 100Gbit/s optical signal and 1-port ODU4 electrical signal.

CS3 1 STM-256

40G POS

40GE


CD3 2 STM-256

40G POS

40GE


CX2 10 STM-64

10GE-LAN

10GE-WAN

10G POS

OTU2

FC800

FC1200


CO2 8 STM-64

10GE-LAN

10GE-WAN




Board Maximum

client-side

interface

Client-side

optical

signal type

Description

10G POS

OTU2

FC800

FC1200

CQ2 4 STM-64

10GE-LAN

10GE-WAN

10G POS

OTU2

FC800

FC1200


CD2B 2 STM-64

10GE-LAN

10GE-WAN

10G POS

OTU2

FC800

FC1200


CH1 16 FE

GE

STM-16

FC100

FC200

FC400

ESCON

DVB-ASI

OTU1

To implement conversion between 16-port optical signal at any rate and 16-port ODU0 or 16-port ODU1 electrical signals.

CO1 8 FE

GE

STM-16

FC100

FC200

FC400

To implement conversion between 8-port optical signal at any rate and 8-port ODU0 or 8-port ODU1 electrical signals.



Board Maximum

client-side

interface

Client-side

optical

signal type

Description

ESCON

DVB-ASI

OTU1

EHG1 16 GE Multiplexes/demultiplexes 16 channels of GE signals into/from 16 channels of ODUflex(ODU0/1/2) signals, the bandwidth of each ODUflex is 1.25G, the whole bandwidth of backboard is 40G.

EQG2 4 10GE Multiplexes/demultiplexes 4 channels of 10GE-LAN/WAN signals into/from 16 channels of ODUflex(ODU0/1/2) signals, the bandwidth of each ODUflex is 1.25G, the whole bandwidth of backboard is 40G.

4.3.3 Line-side Board

Functions of line-side board are shown in Table 4-11:

Table 4-11 Functions of line board

Board Maximum

of line-side

interface

line-side

optical

signal type

Description

LS4 1 OTU4 It has mapping of 80-port ODU0 or 40-port ODU1, 10-port ODU2, or 2-port ODU3+2-port ODU2 signal sent by switching board o OTU3, and converts it to DWDM standard wavelength conforming to ITU-T G.694.1. At the same time the reverse process of the above can be implemented. it supports hybrid transmission of ODU0/1/2/3.

LS3 1 OTU3 It has mapping of 32-port ODU0 or 16-port ODU1, 4-port ODU2, or 1-port ODU3 signal



Board Maximum

of line-side

interface

line-side

optical

signal type

Description

sent by switching board o OTU3, and converts it to DWDM standard wavelength conforming to ITU-T G.694.1. At the same time the reverse process of the above can be implemented. it supports hybrid transmission of ODU0/1/2.

LD2B 2 OTU2 It has mapping of 16-port ODU0 or 8-port ODU1, 2-port ODU2 signal sent by switching board to OTU2, and converts it to DWDM standard wavelength conforming to ITU-T G.694.1. At the same time the reverse process of the above can be implemented. it supports hybrid transmission of ODU0/1.

LQ2 4 OTU2 It has mapping of 32-port ODU0 or 16-port ODU1, 4-port ODU2, signal sent by switching board to OTU2, and converts it to DWDM standard wavelength conforming to ITU-T G.694.1. At the same time the reverse process of the above can be implemented. it supports hybrid transmission of ODU0/1.

LO2 8 OTU2 It has mapping of 64-port ODU0 or 32-port ODU1, 8-port ODU2 signal sent by switching board to OTU2, and converts it to DWDM standard wavelength conforming to ITU-T G.694.1. At the same time the reverse process of the above can be implemented. it supports hybrid transmission of ODU0/1.

LO2B 8 OTU2 It has mapping of 64-port ODU0 or 32-port ODU1, 8-port ODU2 signal sent by switching board to OTU2, and converts it to DWDM standard wavelength conforming to ITU-T G.694.1. At the same time the reverse process of the above can be implemented. it supports hybrid



Board Maximum

of line-side

interface

line-side

optical

signal type

Description

transmission of ODU0/1.

LO2C 8 OTU2 It has mapping of 64-port ODU0 or 32-port ODU1, 8-port ODU2 signal sent by switching board to OTU2, and converts it to DWDM standard wavelength conforming to ITU-T G.694.1. At the same time the reverse process of the above can be implemented. It supports hybrid transmission of ODU0/1.

4.3.4 Switching Board

OTN electrical switching for ZXONE 8000 equipment is implemented by XCA/XCC board,

which supports service integrated scheduling of ODUk signals in electrical layer. It

supports up to 9.4Tbit/s switching scheduling of ODUk signals.

4.3.5 Optical Multiplexing and Demultiplexing Board

The main function of optical multiplexing and demultiplexing units is to multiplex or

demultiplex the optical signals of different wavelengths, and to provide online monitoring

of multiplexed wavelength. The multiplexing/demultiplexing units of ZXONE 8000

equipment cover the following boards:

OMU: multiplexing board

ODU: demultiplexing board

VMUX: pre-equalization multiplexing board with multiplexed wave number as 40 or

48 for C wave band, and 40 for L wave band. With AWG/+VOA (adjustable optical

attenuator) it can adjust attenuation of each channel before multiplexing.

OCI: optical channel interleaving board. It implements channel interleaving of C

band L band by Interleaver.

It implements interleaving multiplexing and demultiplexing of C100_1 and



C100_2 sub-wave band channel with a 100GHz interval, and C50_1

sub-wave band channel with a 50 GHz interval.

C100_1 sub-wave band: 191.3 THz~196.0 THz (totally 48 waves)

C100_2 sub-wave band: 191.35 THz~196.05 THz (totally 48 waves)

It implements interleaving multiplexing and demultiplexing of L100_1 and

L100_2 sub-wave band channel with a 100GHz interval, and L50_1

sub-wave band channel with a 50 GHz interval.

L100_1 sub-wave band: 187.0 THz~190.9 THz (totally 40 waves)

L100_2 sub-wave band: 186.95 THz~190.85 THz (totally 40 waves)

Table 4-12 ZXONE 8000 multiplexing OMU board

Board type OMU8 OMU16 OMU

32 OMU40 OMU48 OMU80

Multiplexing number

8 16 32 40 48 80

Multiplexer type

coupler

coupler coupler

coupler

AWG

coupler

AWG

coupler

AWG

Working wavelength

C band

C band C band

C band

C/C+ band

C band

C/C+ band

C band

C/C+ band

Note: The coupler OMU is only for ROADM configuration.

Table 4-13 ZXONE 8000 multiplexing ODU board

Board type ODU40 ODU48 ODU80

Multiplexing number

40 48 80

Multiplexer type

AWG AWG AWG

Working wavelength

C/C+ band C/C+ band C/C+ band



4.3.6 Fixed OADM Board

It drops fixed-wavelength signals out of multiple-wavelength signals (as required by the

user), while adding local signals into multiple-wavelength signals.

It includes:

SOAD4: Add/drop 4 channel of wavelength signals, or at most 8 channels through

concatenation.

4.3.7 Dynamic OADM Board

It drops any single-wavelength signals out of multiple-wavelength signals and sends

them into wavelength conversion unit, while adding single-wavelength signals of the unit

into multiple-wavelength signals.

It includes:

WBM: Wavelength Blocking Multiplexing

WSUA: 4/9-port wavelength selection switching-type multiplexing unit

WSUD (MD8A1): Wavelength selection switching-type demultiplexing unit

WSUD (E9): Wavelength selection switching-type multiplexing unit

WSUBD9D: Wavelength Selective Switch Unit (Type B) with 9 drop port

WSUBA9D: Wavelength Selective Switch Unit (Type B) with 9 add port

WSUBD9P9D: Wavelength Selective Switch Unit (Type B) with 9 add port & 9

power splitter port

WSUBD8-1D: Wavelength Selective Switch Unit (Type B) with 8 drop port & 1 add

port

WSUBT20D: Wavelength Selective Switch Unit (Type B) with twin port 20 &

loopback port

PDU: 5/9-port power distribution unit



They have the following functions:

WBM: Dynamically add/drop, pass through and block 40 wavelengths to provide

two-degree dynamical dispatching of service wavelength.

WSUA: Select and multiplex wavelength of different ports.

WSUD (MD8A1): Dynamically demultiplex any configurable wavelength at any port,

and work with OMU for wavelength adding to provide two-degree dynamical

dispatching of service wavelength.

WSUD/E9: Dynamically demultiplex any configurable wavelength at any port, and

work with PDU and WSUA to provide multi-degree dynamical dispatching of service

wavelength.

PDU: Broadcast service signals in 5/9 directions, and work with WSUA and WSUD

to dynamically configure any wavelength in any direction and at any port.

4.3.8 OA (Optical Amplifier) Board

It amplifies optical signals to extend their transport distance.

It includes:

SEOBA: Enhanced OBA board

SEOPA: Enhanced OPA board

EONA: Enhanced ONA board

EOBAH: High-power OBA

EONAH: High-power ONA

DRA: Distributed Raman Amplifier

HNA: Hybrid Node Amplifier

VOA SFP: Variable optical Attenuation SFP



VOA SFP working wavelength is at band C or L; fixed insertion loss is <1.5dB;

the is adjusted between 1dB~21.5dB; adjustment step is 0.1dB.

LACT/LACG: Line Attenuation Compensation board

Adjust EVOA of LAC through NM according to line optical power to make

sure the power points of the spans and receiving power and OSNR of the

receiver remain normal in the operation.

LAC working wavelength is at band C or L; fixed insertion loss is <1dB;

EVOA is adjusted between 1dB~21dB; adjustment step is 0.2dB.

LAC consists of LACG and LACT.

LACG: Configured with 2×EVOA and applied to OLA, OADM and

back-to-back OTM sites.

LACT: Configured with 1×EVOA and applied to single-end OTM sites.

Check input/output optical power.

Configured with GFF, LAC is able to compensate DWDM optical spectrum

slope caused by SRS to improve transport performance.

Table 4-14 OA types

Board Location Functionality

SEOBA Behind optical transmitting source of OTM or relay equipment

Improve transmitting power and extend transport distance.

SEOPA At the end of OMS or in front of optical receiving equipment

Pre-amplify weak signals after line attenuation to improve the input optical signal power of the receiver, meeting the requirements for the receiving sensitivity of the receiver.

EONA In the middle of or at the end of OMS, or in front of optical receiving equipment

Insert EDFA directly into transport link to amplify signals. The gain can be adjusted in a large range to suit different relay distances. DCM can be inserted in



Board Location Functionality

the middle to compensate the dispersion for EONA-W type.

EOBAH Behind optical transmitting source of OTM or relay equipment

Improve transmitting power, extend transport distance, and provide higher output power.

EONAH In the middle of OMS

Insert EDFA directly into transport link to amplify signals. The gain can be adjusted in a large range to suit different relay distances. DCM can be inserted in the middle to compensate the dispersion.

Provide higher output power.

DRA At the start, in the middle of or at the end of OMS

Work along with EDFA to amplify long-distance, wide-bandwidth, low-noise and distributed online signals.

HNA In the middle of or at the end of OMS, or in front of optical receiving equipment

Insert EDFA directly into transport link to amplify signals. The gain can be adjusted in a large range to suit different relay distances. DCM can be inserted in the middle to compensate the dispersion for HNA-W type.

4.3.9 System control, supervision and communication board

It coordinates with NMS to manage device boards and facilitate the communications

between the devices. System control and communication unit is the control center.

System control and communication unit includes:

SNP: The compact main control board is in charge of control, communication and

protocol processing, and makes possible the communications among all boards in

local NE.

SCC: The compact communication control board manages NE sub-rack boards,

and routes and forwards control messages.

SEIA: The compact extension interface board leads external interfaces and

cascade interfaces of the sub-rack to the panel for connection.



CCP: The sub-rack control board is located in switching sub-rack to forward the

information between SNP boards.

4.3.10 OSC board

It monitors the transferring and switching of ECC data, orderwire and transparent user

channel data, and APS information between NEs in the system.

It includes SOSC and SOSCB board.

SOSB board can provide time synchronization function following 1588V2 protocol.

4.3.11 Clock board

It provides system clock to transfer clock information and synchronize NE clock.

It includes:

CLK: System clock board

It has the following functions:

Process different clocks, offer all-network synchronous clock for SDH

services, and import/export external BITS clock.

The clock exported from clock processing unit meet G.813 requirements for

clock performance, including clock accuracy, jitter, noise, MTIE and TDEV.

TIS: Time interface supply board


Work with SOSCB board to provide time synchronization function following

1588V2 protocol

Provide input/output of 2M Hz/bit clock.



4.3.12 Protection board

It provides optical-layer network protection.

It includes:

SOP: Compact optical channel protection board

OMCP: Optical multi-channel protection board

They have the following functions:

SOP: It consists of single-channel and multi-channel channel protection boards

respectively for OMS line 1+1 protection and OCH 1+1 protection.

It carries out protection switching or restoration in light of receiving power and manual

switching/restoration command or external APS command (following G.841) from NM.

OMCP:

Optical switching module in the board carries out the adding/dropping and protection

switching of services via the optical switching.

Each OMCP supports 1:8 bidirectional channel protection, and two OMCP boards

cascaded 1:16.

4.3.13 Performance supervision board

It includes:

OPM: It monitors the performance of optical channels, measures their parameters

such as optical power, central wavelength and OSNR, reports relative data to NMS,

and displays optical spectrum diagrams in NM.

Each OPM checks the performance of 4 channels of optical signals.

OWM: It monitors the central frequency drift of optical channel after multiplexing,

and sends frequency adjustment information to SNP.

Each OWM controls the wavelengths of bidirectional 80/96-wavelength system.



OFM and OFMF

OFM and OFMF work together to provide OTDR function in WDM system.

OFM integrates OTDR functional module and n×1 optical switch. It has two types:

OFM4 and OFM8. OFM4 monitors the fiber in 4 directions and OFM8 monitors the

fiber in 8 directions. OFM principle diagram is as below:

Figure 4-16 OFM4/8 internal structure

Control and communication module

Power module-48V

Backplane

communication

interface

OTDR module

1×n optical switch

PORT1

PORTn

……

……

OFMF integrates four 3-port filters to connect OFM, tested fiber and WDM node

equipment. Its internal structure is as below:



Figure 4-17 OFMF internal structure

Control and communication module

Power module

-48V

Backplane

communication

interface

Monitor (MON1)

MUX/DEMUX

Monitor (MON2)

Monitor (MON3)

Monitor (MON4)

Fiber Line (LINE1)

Fiber Line (LINE2)

Fiber Line (LINE3)

Fiber Line (LINE4)

Signal(S1)

Signal(S2)

Signal(S3)

Signal(S4)

5 Software structure

ZXONE 8000 software consists of board software, Agent and NetNumen U31 which run

respectively in boards, SNP and NM computer to manage and control boards, NE and

the entire network. ZXONE 8000 software adopts the layered design principle, and each

layer has special functionality and serves the upper layer. Its structure is shown in Figure

5-1:

Figure 5-1 ZXONE 8000 software structure

NM Server

SNP (control

software)

Card Software Card Software Card Software



5.1 Board software

Board software runs in boards to manage, monitor and control their working status. It

receives the NM command from NCPF Agent, processes and makes response to the

command, and reports alarm and performance event to NM. Board software has such

functions as alarm performance event processing, configuration management,

communication management, board software online download and functional circuit

drive.

5.2 SNP software

SNP software runs in SNP to manage, monitor and control the operation status of NE

boards, and works as the communication service unit between NMS and boards to help

NMS to control and manage NE.


Configure the boards in NE power-on initialization.

Monitor NE alarm and performance in normal operation, receive NM monitoring and

configuration command from gateway NE via ECC interface, and report command

processing result, NE alarm and performance. Gateway NE is connected to NM via

Qx interface.

Control APS, APR and WASON.

It consists of the following modules based function module:

1. Embedded OS platform

Manage public resources and provide hardware-independent application

environment.

2. Communication & control module

The interface module between SNP software and board software exchanges

information between SNP software and other board software to maintain the



equipment. It sends board maintenance and operation command of SNP software

to the boards, collects board status, alarm and performance event, and reports

them to SNP software.

3. Equipment management module

It is the core for SNP software to manage NE equipment. SNP software sends

network management and operation command and receives an event via the

module.

4. Communication module

Exchange management information between NMS and NE device and between NE

devices.

5. Database management module

Manage and access alarm, performance, equipment and network status information

collected by SNP software.

6. Active/standby switching module

Synchronize and switch data between active and standby SNP boards for 1+1 hot

backup.

7. APS module

Control the boards to carry out the protection switching in light of protection mode

and equipment status.

8. APSD/APR module

Carry out APSD and APR functions according to equipment status.

9. WASON module

Control the boards to carry out WASON functions in light of network and equipment

status.



5.3 NM software

ZXONE 8000 uses NM software to manage and monitor different NEs. The software has

such functions as fault management, performance management, safety management,

configuration management, maintenance management and system management.

NM software structure is shown in Figure 5-2:

Figure 5-2 NM software structure

GUI

ManagerCard

Software

Control

Software

NM software, board software, SNP software

Manager

It is also known as Server. Manager is equivalent to Server for GUI. Manager sends

management command to SNP software via Qx interface, receives the notifications

from SNP software, save all network management data into the database, including

such basic data as system management, configuration management and alarm

maintenance. Manage saves only network management data of local domain.

GUI

It is also known as Client. The user carries out such operations as configuration

management, fault management, performance management, safety management,

maintenance management and system management via GUI. GUI basically does not

save dynamic NM data which is extracted from the database by the user via Manager.

Database



It is in charge of information query and configuration of GUI and management functional

modules, the storage of such information as alarm and the processing of data

consistency.

5.4 Communication protocol and interface

ZXONE 8000 software system interfaces and relative communication protocols and

interfaces are shown as Table 5-1:

Table 5-1 ZXONE 8000 software system interface

Name Description

S interface It is the interface between SNP software and MCU, in other words, the communication interface between SNP software and other boards. It follows private protocol.

Qx interface It is the interface between SNP software and Manager, in other words, the communication interface connecting SNP to NM server computer. It is located in the interface board of ZXONE 8000, and follows TCP/IP, ITU-TQ.811 and ITU-T Q.812 recommendations.

ECC interface

It is the communication interface between NEs, and supports OSC communication and TCP/IP.

CTI interface It is the control interface in NE, and implements APS, APR and WASON functions.



6 Product characteristics

6.1 Transmission function

6.1.1 Transport capacity

ZXONE 8000 consists of 32/40/48/80/96-wavelegnth system.

The working wavelength number of 10Gbit/s system may be 32/40/48/80/96. 40

wavelengths system can be upgraded smoothly to 80/96 wavelengths system.

The working wavelength number of 40Gbit/s system may be 40/48/80/96. 40

wavelengths system can be upgraded smoothly to 80/96 wavelengths system.

The working wavelength number of 100Gbit/s system may be 40/80. 40 wavelengths

system can be upgraded smoothly to 80 wavelengths system.

6.1.2 Transport distance

By adopting the ultra-long-haul distance optical source and optical amplifying

technologies, the transmission codes supported by ZXONE 8000 are listed in the

following tables.

Table 6-1 Transmission Codes Supported by 40 2.5Gbit/s System (G.652&G.655)

Category Specifications Target Distance (km)

Without FEC

(OSNR > 20 dB)

1 36 dB 1 144 km

2 33 dB 2 132 km

3 31dB 3 124 km

10 23 dB 10 92 km

FEC without RAMAN

(OSNR>15dB)

1 41 dB 1×164km

2 38 dB 2×152km

3 36dB 3×144km

20 25dB 20×100km



Category Specifications Target Distance (km)

FEC+ RAMAN

(OSNR >15 dB)

1 45dB 1×180km

2 42dB 2×168km

3 40dB 3×160km

20 28 dB 20×112km

Table 6-2 Transmission Codes Supported by 16/40 2.5Gbit/s System (G.653)

Category Specifications Target Distance (km) remark

FEC

1×48 dB 1×192 km 16*2.5Gbit/s

3×34 dB 3×136 km (408 km) 16*2.5Gbit/s

6×26 dB 6×104 km (624 km) 16*2.5Gbit/s

8×22 dB 8×88 km (704 km) 16*2.5Gbit/s

FEC+DRA 1×35dB 1×140 km 40*2.5Gbit/s

3×26 dB 3×104 km (312 km) 40*2.5Gbit/s

Table 6-3 Transmission Codes Supported by 40 /48 10Gbit/s System (G.652&G.655)


AFEC NRZ

1 61 dB 1 244km RPOA,40 10Gbit/s

1 49 dB 1 196km DRA, 40 10Gbit/s

1 57 dB 1228km RPOA,48 10Gbit/s

1 48 dB 1 192 km DRA, 4810Gbit/s

30 22 dB 30 88 km -

12 30 dB 12 120 km -

AFEC RZ

1 64 dB 1 256km RPOA,40 10Gbit/s

1 52 dB 1 208km DRA, 40 10Gbit/s

1 60 dB 1240km RPOA,48 10Gbit/s

1 51 dB 1 204 km DRA, 48 10Gbit/s

50 22 dB 50 88 km -

18 30 dB 18 120 km -



Table 6-4 Transmission Codes Supported by 80/96 10Gbit/s System (G.652&G.655)


AFEC NRZ

1 45 dB 1 180km DRA, 80 10Gbit/s

1 44 dB 1 176km DRA, 9610Gbit/s

20 22 dB 20 88 km -

8 30 dB 8 120 km -

AFEC RZ

1 48 dB 1 192km DRA, 80 10Gbit/s

1 47 dB 1 188km DRA, 96 10Gbit/s

30 22 dB 30 88 km -

12 30 dB 12 120 km -

Table 6-5 Transmission Codes Supported by 192 10Gbit/s System (G.652&G.655)


AFEC NRZ

1 41 dB 1 164km DRA

10 22 dB 10 88km -

3 30 dB 3 120 km -

Table 6-6 Transmission Codes Supported by 16/40 10Gbit/s System (G.653)


FEC+ RZ+DRA

1×48 dB 1×192 km 16*10Gbit/s

3×34 dB 3×136 km (408 km) 16*10Gbit/s

6×26 dB 6×104 km (624 km) 16*10Gbit/s

8×22 dB 8×88 km (704 km) 16*10Gbit/s

FEC+RZ+DRA

1×35dB 1×140 km 40*10Gbit/s

3×26 dB 3×104 km (312 km) 40*10Gbit/s

6×26 dB 6×104 km (624 km) 40*10Gbit/s



AFEC+DPSK 1 47 dB 1 188km DRA, 40 40Gbit/s

1 46 dB 1 184km DRA, 4840Gbit/s




22 22 dB 22 88 km -

5 30 dB 5 120 km -

12 30 dB 12 120 km DRA

AFEC+DQPSK

1 48 dB 1 192km DRA, 40 40Gbit/s

1 47 dB 1 188km DRA, 48 40Gbit/s

25 22dB 25 88 km

6 30dB 6 120 km

13 30 dB 13 120 km DRA



AFEC+DPSK

1 44 dB 1 176km DRA, 80 40Gbit/s

1 43 dB 1 172km DRA, 9640Gbit/s

16 22 dB 16 88 km -

3 30 dB 3 120 km -

6 30 dB 6 120 km DRA

AFEC+DQPSK

1 45dB 1 180km DRA, 80 40Gbit/s

1 44 dB 1 176km DRA, 96 40Gbit/s

18 22 dB 18 88 km

4 30 dB 4 120km

7 30 dB 7 120 km DRA



DPSK or DQPSK

1×46 dB 1×192 km DRA 16*40Gbit/s

8×30 dB 8×120 km (960 km) DRA 16*40Gbit/s

8×22 dB 8×88 km (704 km) 16*40Gbit/s

1×41dB 1×164 km DRA 40*40Gbit/s

4×30 dB 4×120 km (360 km) DRA 40*40Gbit/s

6×22 dB 6×88 km (352 km) 40*40Gbit/s



Table 6-10 Transmission Codes Supported by 80 100Gbit/s System (G.652 with DCM)

Category Specifications Target Distance

(km) remark

SD+FEC+PM-QPSK

1x45dB 1x180km DRA, 80x100Gbit/s 16x22 dB 16x88 km 28 x22dB 28 x88km DRA 4x30 dB 4x120km 7x30 dB 7x120 km DRA

Table 6-11 Transmission Codes Supported by 80 100Gbit/s System (G.652 without DCM)


(km) remark

SD+FEC+PM-QPSK


Table 6-12 Transmission Codes Supported by 80 100Gbit/s System (G.655 with DCM)


(km) remark

SD-FEC+PM-QPSK


Table 6-13 Transmission Codes Supported by 80 100Gbit/s System (G.655 without DCM)


(km) remark




(km) remark

SD-FEC+PM-QPSK




SD-FEC+PM-QPSK

1×46 dB 1×192 km DRA 16*100Gbit/s

6×30 dB 6×120 km (720 km) DRA 16*2.5Gbit/s

8×22 dB 8×88 km (704 km) 16*100Gbit/s

1×33dB 1×132 km DRA 40*100Gbit/s

3×29 dB 3×104 km (312 km) DRA 40*100Gbit/s

Note: SD-FEC is soft decision FEC coding and decoding, and means that the channel difference should be

included. Target Distance is calculated at 0.25dB/km.

6.1.3 Working wavelength

ZXONE 8000 working wavelength is in strict compliance with ITU-T G.692 to use specific

central wavelength and central frequency value for multi-channel system. G.652/G.655

fiber supports 40/48/80/96-wavelength transport at band C, and G.653 fiber supports

40-wavelength transport in 196.05-192.1THz wavelength range.

Table 6-15 Wavelength distribution of 80-wavelength system (50GHz spacing) at band C

Wavelength

S/N

Nominal

central

frequency

(THz)

Nominal

central

wavelength

(nm)

Wavelength

S/N

Nominal

central

frequency

(THz)

Nominal

central

wavelength

(nm)

1 196.05 1529.16 41 194.05 1544.92

2 196.00 1529.55 42 194.00 1545.32

3 195.95 1529.94 43 193.95 1545.72

4 195.90 1530.33 44 193.90 1546.12



Wavelength

S/N

Nominal

central

frequency

(THz)

Nominal

central

wavelength

(nm)

Wavelength

S/N

Nominal

central

frequency

(THz)

Nominal

central

wavelength

(nm)

5 195.85 1530.72 45 193.85 1546.52

6 195.80 1531.12 46 193.80 1546.92

7 195.75 1531.51 47 193.75 1547.32

8 195.70 1531.90 48 193.70 1547.72

9 195.65 1532.29 49 193.65 1548.11

10 195.60 1532.68 50 193.60 1548.51

11 195.55 1533.07 51 193.55 1548.91

12 195.50 1533.47 52 193.50 1549.32

13 195.45 1533.86 53 193.45 1549.72

14 195.40 1534.25 54 193.40 1550.12

15 195.35 1534.64 55 193.35 1550.52

16 195.30 1535.04 56 193.30 1550.92

17 195.25 1535.43 57 193.25 1551.32

18 195.20 1535.82 58 193.20 1551.72

19 195.15 1536.22 59 193.15 1552.12

20 195.10 1536.61 60 193.10 1552.52

21 195.05 1537.00 61 193.05 1552.93

22 195.00 1537.40 62 193.00 1553.33

23 194.95 1537.79 63 192.95 1553.73

24 194.90 1538.19 64 192.90 1554.13

25 194.85 1538.58 65 192.85 1554.54

26 194.80 1538.98 66 192.80 1554.94

27 194.75 1539.37 67 192.75 1555.34

28 194.70 1539.77 68 192.70 1555.75

29 194.65 1540.16 69 192.65 1556.15

30 194.60 1540.56 70 192.60 1556.55

31 194.55 1540.95 71 192.55 1556.96

32 194.50 1541.35 72 192.50 1557.36

33 194.45 1541.75 73 192.45 1557.77



Wavelength

S/N

Nominal

central

frequency

(THz)

Nominal

central

wavelength

(nm)

Wavelength

S/N

Nominal

central

frequency

(THz)

Nominal

central

wavelength

(nm)

34 194.40 1542.14 74 192.40 1558.17

35 194.35 1542.54 75 192.35 1558.58

36 194.30 1542.94 76 192.30 1558.98

37 194.25 1543.33 77 192.25 1559.39

38 194.20 1543.73 78 192.20 1559.79

39 194.15 1544.13 79 192.15 1560.20

40 194.10 1544.53 80 192.10 1560.61

Table 6-16 Wavelength distribution of 96-wavelength system (50GHz spacing) at extended band C

Wavelength

S/N

Nominal

central

frequency

(THz)

Nominal

central

wavelength

(nm)

Wavelength

S/N

Nominal

central

frequency

(THz)

Nominal

central

wavelength

(nm)

1 196.05 1529.16 49 193.65 1548.11

2 196.00 1529.55 50 193.60 1548.51

3 195.95 1529.94 51 193.55 1548.91

4 195.90 1530.33 52 193.50 1549.32

5 195.85 1530.72 53 193.45 1549.72

6 195.80 1531.12 54 193.40 1550.12

7 195.75 1531.51 55 193.35 1550.52

8 195.70 1531.90 56 193.30 1550.92

9 195.65 1532.29 57 193.25 1551.32

10 195.60 1532.68 58 193.20 1551.72

11 195.55 1533.07 59 193.15 1552.12

12 195.50 1533.47 60 193.10 1552.52

13 195.45 1533.86 61 193.05 1552.93

14 195.40 1534.25 62 193.00 1553.33

15 195.35 1534.64 63 192.95 1553.73



Wavelength

S/N

Nominal

central

frequency

(THz)

Nominal

central

wavelength

(nm)

Wavelength

S/N

Nominal

central

frequency

(THz)

Nominal

central

wavelength

(nm)

16 195.30 1535.04 64 192.90 1554.13

17 195.25 1535.43 65 192.85 1554.54

18 195.20 1535.82 66 192.80 1554.94

19 195.15 1536.22 67 192.75 1555.34

20 195.10 1536.61 68 192.70 1555.75

21 195.05 1537.00 69 192.65 1556.15

22 195.00 1537.40 70 192.60 1556.55

23 194.95 1537.79 71 192.55 1556.96

24 194.90 1538.19 72 192.50 1557.36

25 194.85 1538.58 73 192.45 1557.77

26 194.80 1538.98 74 192.40 1558.17

27 194.75 1539.37 75 192.35 1558.58

28 194.70 1539.77 76 192.30 1558.98

29 194.65 1540.16 77 192.25 1559.39

30 194.60 1540.56 78 192.20 1559.79

31 194.55 1540.95 79 192.15 1560.20

32 194.50 1541.35 80 192.10 1560.61

33 194.45 1541.75 81 192.05 1561.02

34 194.40 1542.14 82 192.00 1561.42

35 194.35 1542.54 83 191.95 1561.83

36 194.30 1542.94 84 191.90 1562.24

37 194.25 1543.33 85 191.85 1562.64

38 194.20 1543.73 86 191.80 1563.05

39 194.15 1544.13 87 191.75 1563.46

40 194.10 1544.53 88 191.70 1563.87

41 194.05 1544.92 89 191.65 1564.27

42 194.00 1545.32 90 191.60 1564.68

43 193.95 1545.72 91 191.55 1565.09

44 193.90 1546.12 92 191.50 1565.5



Wavelength

S/N

Nominal

central

frequency

(THz)

Nominal

central

wavelength

(nm)

Wavelength

S/N

Nominal

central

frequency

(THz)

Nominal

central

wavelength

(nm)

45 193.85 1546.52 93 191.45 1565.91

46 193.80 1546.92 94 191.40 1566.32

47 193.75 1547.32 95 191.35 1566.73

48 193.70 1547.72 96 191.30 1567.14

6.2 Optical-layer Dispatching

ZXONE 8000 uses ROADM for dynamic optical-layer dispatching.

ROADM is divided into two-degree ROADM (also called linear ROADM) and

multi-degree ROADM (also called HUB ROADM) according to network direction number.

Two-degree ROADM supports two network directions and is mainly applied to chain and

ring networks. Multi-degree ROADM supports more than two network directions and is

mainly applied to such complex topologies as tangent ring, intersectant ring and MESH

network.

ZXONE 8000 offers two linear ROADM solutions: One is PLC-based ROADM subsystem

taking WBM as the core, the other is WSS-based ROADM subsystem taking WSU as the

core.

WSS-based ROADM solution has two types: One is WSUD (MD8A1)-based two-degree

ROADM system which can be configured with OMU (Coupler) + tunable OTU for

colorless port, and the other is PDU + WSUA/E-based 2~9-degree or WSUB (2~20

degree) ROADM system which can be configured with different local dropping units for

colored/directional and colorless/directionless ports. The latter is applied to ring and

mesh networks. It has powerful flexibility and wavelength dispatching function to support

core network.

PLC-based ROADM solution has low cost and only supports two degree. It is applied to

ring and chain networks to replace previous OADM sites. It does not support

directionless and colorless ports.



Directionless: It means that any local port can add/drop the service of any direction.

Colorless: It means that any local port can add/drop any wavelength.

6.2.1 Two-degree (in the ring) wavelength dispatching

Two-degree dispatching is to dispatch wavelengths in two directions. ZXONE 8000 uses

WSUD for two-degree (in the ring) dynamic wavelength dispatching, in other words,

dynamically add/drop, pass through and block services wavelengths, and equalize and

inspect channel optical power.

6.2.1.1 WSUD-based two-degree wavelength dispatching

Figure 6-1 WSUD-based two-degree ROADM sites

OPA

OTU

WSS

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

Coupler1

Add port1

WSUD/E WSUD/E………

OBA

………

OPA

WSS

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

OTU

WSUD/EWSUD/E ………

OBA

Coupler1

Add port1

………

OTU

OTU

OTU

OTU :

40:1

OTU

OTU

OTU

OTU

:

40:1

WSUD

OTU

OTU

WSUD

Eastward and westward service wavelengths directly use NM software to make dynamic

adding/dropping, pass-through, blocking, channel optical power equalization and

inspection, dynamically adjusting wavelength status in a remote way.

Adding unit employs coupler multiplexer and tunable-wavelength service board for

colorless and directionless port, and dropping unit employs WSUD/E or cascade

WSUDE for such a function.



6.2.2 Multi-degree dispatching

6.2.2.1 WSUA/AWG-based multi-degree wavelength dispatching

Figure 6-2 Multi-degree ROADM structure (colorless and directionless)

A/B/C/D-direction service wavelengths directly use NM software to make dynamic



Adding/dropping units employ wavelength-sensitive AWG and fixed-wavelength OTU.

The multi-degree ROADM solution provides color/direction-relevant port.

ODU40

OTU1

OTU40

OTU1

OTU40

OTU1

OTU40

OTU1

OTU40

OTU1

OTU40

OTU1

OTU40

OTU1

OTU40

OTU1

OTU40

EOBA

WSUA

A drop

EOBA

EOBA

EOBA

ODU40 ODU40 ODU40 OMU40 OMU40 OMU40 OMU40

EOPA

A

EOPA

B

EOPA

C

EOPA

D

WSUA

WSUA

WSUA

B drop C drop D drop A add B add C add D add

A

B

C

D

1×

5 C

ou

pler

1×

5 C

ou

pler

1×

5 C

ou

pler

1×

5 C

ou

pler



6.2.2.2 PDU/WSUA/WSUD-based multi-degree wavelength dispatching

Figure 6-3 Multi-degree ROAD structure (colorless and directionless)

EASTPDU

OMU

(coupler)

WSUA/E

WSUD/E

,

,

EAST

OTU

NORTH

NORTH

WEST

WEST

SOUTH

SOUTH

OTU

Group 1

CLIENT SERVICE

OTU

E

O

B

A

WSU

A/E

WSU

A/EPDU

E

O

P

A

E

O

P

A

PDUWSU

A/E

WSU

A/EPDU

E

O

P

A

E

O

B

A

E

O

P

A

E

O

B

A

E

O

B

A

PDU

EOBA EOBA

WSUD/E

...

4-direction service wavelengths directly use NM software to make dynamic



Line side employs PDU and WSUA/E to dynamically dispatch the wavelengths in

different directions, and adding/dropping units employ WSUD/E and tunable service

board for colorless and directionless port.



6.3 Electrical-layer dispatching

ZXONE 8000 can dispatch ODU0/1/2/2e/3/4/flex signals via switching board. It supports

at most 9.4Tbit/s switching & dispatching capacity.

Electrical-layer dispatching supports three typical application scenarios:

Pass through client-side service at local site: Input the service via a client-side port

of electrical switching matrix and output it via another client-side port at local site, in

other words, the service is not transported via the fiber.

Add/drop client-side service: Transmit the service of other sites to line side of

electrical switching matrix of local site via the fiber, and then output it via electrical

switching matrix at client side; or input client service at client side of electrical

switching matrix of local site, and then send it to other sites via the fiber.

Pass through line-side service at local site: Wavelength service from other sites is

not added or dropped at local site, but is dispatched to other directions via electrical

switching matrix, or is relayed or switched to other wavelengths.

6.4 L2 switching

ZXONE 8000 provides the board-level L2 switching to multiplex and demultiplex

24-channel GE signals (or 8-channel GE signals) or 1-channel 10G (or 2-channel 10G) to

2-channel OTU2 signals. The working principle is shown as Figure 6-4:



Figure 6-4 Working principle of ZXONE 8000 L2 switching

Tributary side

Access 24-channel GE optical signals or 1-channel 10GE optical signals for

ASMA in compliance with IEEE802.3.

Access 8-channel GE optical signals or 2-channel 10GE optical signals for

ASMB in compliance with IEEE802.3.

10GE optical interface can also work as inter-board cascade interface.

Support GFP-related performance inspection.

Line side

Support 2-channel OTU2 optical signals in compliance with G.694.1 and

G.709.

Support G.709-defined OTU2 interface and relative performance inspection.

FEC can be set to standard FEC or ultra-strong FEC (AFEC).

Support GFP-T packet encapsulation and comply with G.7041.

In addition, relative L2 functions are shown as Table 6-17:



Table 6-17 ZXONE 8000 L2 function

Function Description

VLAN & Stacking VLAN (QinQ) Support Stacking VLAN.

Support flexible Q-in-Q.

Support VLAN conversion.

QoS Support 8 hardware-based classes of service according to port.

QoS mapping based on IEEE 802.1p priority IP TOS/DSCP

Color-sensitive traffic monitoring, traffic shaping and WRED congestion management

Advanced queue dispatching: WRR and strict priority

Traffic monitoring and shaping based on VLAN.

Class of service (CoS):

CAC-based guaranteed bandwidth

DiffServ-based Ethernet CoS (CIR,PIR)

Ethernet OAM Support Ethernet OAM in compliance with IEEE 802.3ah

Support service-layer OAM in compliance with IEEE 802.1ag (connection fault management)

Support ITU-T Y.1731.

LAG

Support manual and static link aggregation

Support load balancing and non-load balancing S

Support IEEE802.3ad

L2 function Support IEEE802.1D, IEEE802.1Q and IEEE 802.1ad.

Support MAC address learning and aging

Support 32K MAC address

Support IGMP Snooping

Support MSTP(IEEE802.1s)

Traffic control Support Ethernet traffic control protocol



Function Description

and traffic control termination in compliance with IEEE802.3X.

MTU Support at most 16000 bytes.

EPL Provide point-to-point EPL.

EVPL Provide point-to-point EVPL and support VLAN-based switching.

6.5 Optical Power Amplification

6.5.1 Erbium-Doped Fiber Amplifier

ZXONE 8000 system uses mature EDFA (Erbium-Doped Fiber Amplifier) technology to

realize long/medium-distance transmission. EDFA makes the signal gain per channel

independent from the total count of the channels in the fiber by using gain locking

technology and transient control technology. At the same time, when some channels are

added or lost suddenly, it can avoid the interferences to the existing channel.

At the same time, the coupling between EDFA and fiber is very good. The characteristic

of EDFA is good for its high gain, less noise, large bandwidth, high output power, high

power efficiency, low insertion loss and insensitivity to polarization.

ZXONE 8000 system provides multiple sorts of EDFA and EDFA with high output power.

It supports the amplification of 100GHz/50GHz spacing signals on C band which are

proposed in ITU-T G.694.1.

6.5.2 Raman Amplification Technology

In long-distance DWDM system, radiation caused by EDFA will restricts entire system

performance. By using distributed RAMAN amplifier (DRA), ZXONE 8000 effectively

reduces system noise and nonlinear effect via EDFA+DRA technology (i.e. use EOA

board and DRA board together). This method effectively improves optical amplifying

performance of the long-distance DWDM system.

ZXONE 8000 also provides HNA(hybrid node amplifier) for long-distance span, as using



on board integrates both the DRA and EDFA function, it really improves the system

integration and transmission performance.

6.6 Forward Error Correction

ZXONE 8000 provides optical wavelength transponder unit and branch unit with FEC

(Forward Error Correction), AFEC (Advanced Forward Error Correction) and SD-FEC

(Soft Decision FEC) services. This configuration on one hand reduces the requirements

for optical signal to noise ratio (OSNR) of receiver; on the other hand it extends the

transport distance between all optical amplification section and regeneration. At the

same time, it decreases the error rate caused b transmission and enhances the transport

quality of DWDM transport network.

By using AFEC algorithm, it effectively improves OSNR 7 dB~9 dB.

By using SD-FEC algorithm, the NCG is 11.1dB.

6.7 Tunable Wavelength

ZXONE 8000 equipment is designed with 100Gbit/s, 40Gbit/s and 10Gbit/s wavelength

conversion units to change wavelength. The maximum value of 100Gbit/s optical

wavelength conversion unit is C waveband 50GHz interval 80wave. The maximum value

of 40Gbit/s or 10Gbit/s optical wavelength conversion unit is C waveband 50GHz interval

96 wave. The maximum value of 2.5Gbit/s optical wavelength conversion unit is C

waveband 100Hz interval 16 wave. The optical wavelength conversion unit with variable

wavelength can either be service module directly or spare components used to replace

the optical wavelength conversion unit of different wavelengths to reduce the number of

optical wavelength conversion unit and decrease the component costs.

6.8 Optical Layer Protection Service

ZXONE 8000 is capable of the following manners of optical layer protection: 1+1

protection (O-SNCP), multiplex section 1+1 protection



6.8.1 Channel 1+1 Protection (O-SNCP)

Optical channel 1+1 protection is implemented by SOP board on the basis of concurrent

delivery and primary reception theory. At the sending end, the protected services are split

into two parts via the coupler on SOP board and goes into two OTUs (OTU redundant

mode) for different sending path. At the receiving end, signals with better quality will be

received by using primary circuit on SOP board. Take the protection of a group of service

as an example. As Figure 6-5 shows:

Figure 6-5 Channel 1+1 Protection

S

O

P

Clie

nt

S

O

P

Clie

nt

OTU

OTU

OTU

OTU

O

M

D

O

M

D

O

M

D

O

M

D

O

B

A

O

P

A

O

P

A

O

B

A

O

B

A

O

P

A

O

P

A

O

B

A

Channel 1+1 protection not only realizes routing protection but also implements

equipment protection (OTU is in redundant mode)

6.8.2 MS 1+1 Protection

Optical MS 1+1 protection keeps section-by-section 1+1 protection mode. According to

different locations of EOA board, MS 1+1 protection consists of EDFA shared

configuration mode and EDFA redundant configuration mode. As Figure 6-6 and Figure

6-7 show (take the protection of a group of service as an example):



Figure 6-6 MS 1+1 Protection (EDFA in redundant mode)

Figure 6-7 MS 1+1 Protection (EDFA in shared mode)

O

M

U

S

O

P

DCMO

B

A

O

P

ADCM

O

D

U

Active Line

Standby Line

Active Line

Standby Line

O

P

A

O

B

A

O

M

U

S

O

P

DCM

DCM

O

D

U

It is only suitable for the same dispersion compensation of active and standby fibers. SOP loss counts

into line loss which influences system SNR

6.9 Electrical Layer Protection

6.9.1 ODUk Channel 1+1 Protection (ODUk-SNCP)

ODUK-channel 1+1 protection uses double-emission and double receiving service to

protect line board and fiber. It protects signals whose granularities are ODU0, ODU1,

ODU2, ODU3 and ODU4. The working philosophy of ODUk channel 1+1 protection is as

shown in Figure 6-8:

OMU

SOP

OBA

OPA

DCM

OBA

DCM

DCM

OPA

DCM

ODU

Working route

Protection route

Working route

Protection route

OPA

OBA

OPA

OBA

DCM

DCM

DCM

DCM

OMU

SOP

ODU

OBA

OBA



Figure 6-8 ODUk Channel 1+1 Protection

ODUk switching

unit

Line-side

card 1

Demultiplexer

1

Multiplexer

1

Client-side

card

Line-side

card 1

Multiplexer

2

Demultiplexer

2

6.10 Dispersion Management

For ZXONE 8000, the maximum dispersion tolerance of 2.5Gbit/s, 10Gbit/s, 40Gbit/s

and 100Gbit/s systems is 12800ps(around 640km), 800ps/1600ps(about40/80km),

+/-1000ps/+/-800ps and +/-70000ps respectively. When system transmission is longer,

restriction to dispersion must be considered for 10Gbit/s system, 40Gbit/s system

specially.

According to specific requirements, ZXONE 8000 configures related dispersion

compensation module to make up bandwidth dispersion.

For 40Gbit/s system, the adjustable dispersion compensation module inbuilt in the

receiving unit can automatically control dispersion compensation. So the 40Gbit/s

system can be compatible with 10Gbit/s system.

For 100Gbit/s system, using the high speed DSP technology, the dispersion



compensation capability can support +/-70000ps (around 3500km), so which doesn’t

need the additional compensation usually.

The dispersion compensation module in the s10G/40G system can be configured in the

way shown in Figure 6-9.

Figure 6-9 Configuration of Dispersion Compensation

6.11 Automatic Power Shutdown/Reduction

Assisted by network management software, ZXONE 8000 supports Automatic Power

Shutdown (APSD) and Automatic Power Reduction (APR). When the inspection board

with optical performance inspection service (e.g. OPM board) finds lightless line, the

inspection board will automatically send notification to SNP. When SNP receives the

information, it will make the executive board (EOA board) to reduce power or shut down

power. This mechanism prevents people’s eyes from being hurt by laser. When the

failure is recovered, the system can come to normal operation automatically (or

manually).

APR is used on one optical transmission section (OTS). When any OTS breaks down,

other OTS and downstream alarm won’t be affected. In the course of APR processing,

Clamp output of EOA amplifier of each receiving end is guaranteed. The EOA amplifier

of the sending end is shut down.

OTU module and branch module of ZXONE 8000 can also provide APSD service. When

one client optical interface of the peer-end OTU module receives does not have input

signal, the corresponding client sending optical port of local OTU module will shut down

the laser automatically.



When WDM optical receiving port of OTU module does not have signals, all client

sending optical ports will shut down the laser automatically.

6.12 Optical Power Management

Optical power management service consists of line attenuation control service (LAC) and

automatic gain control service (AGC).

6.12.1 LAC Service

As per line optical power inspection situation, the network management adjusts EVOA of

LAC to guarantee all cross-section power points, receiving power of the receiving end

and OSNR to keep normal values.

6.12.2 AGC Service

EDFA of ZXONE 8000 uses gain lock amplifying mode. The value of the gain lock can

changed flexibly to satisfy the requirements of relays with different distances. Within all

input and all working temperature, the resolution of the gain adjustment is 0.1dB.

Despite the wavelength of fiber, AGC can implement gain lock of single channel. Any

wave increase or drop, or fluctuation of optical signal of one or multiple wavelength will

not influence signal gain of other channels.

6.13 Automatic Performance Optimization (APO)

ZXONE 8000 provides MS and channel-based APO service.

MS-based power management: build and keep the optimized status of MS group

line power.

Channel-based power management: build and keep the power balance in the

channel.



6.14 OMS Layer Power Management

If transmission distance is long and many amplifier sites in the middle, the problems of

optical power become more apparent. For example, optical power difference of every

channel becomes larger. In this case, the Automatic Power Optimization (APO) is

necessary to WDM system.

ZXONE 8000 provides MS and channel-based APO service.

MS-based power management: build and keep the optimized status of Multiplexed

Section (MS) power.

Channel-based power management: build and keep the power balance in the

channel.

6.14.1 OMS Layer Power Management

OMS layer power management is implemented based upon power management domain.

The power management domain refers to one MS, i.e. OMS between two OTMs or

FOADMs (ROADM). It requires independent performance in each power management

domain, e.g. power consumption and SNR.

The MS power management service guarantees a constant difference between all gains

and line loss of every channel.

In real optical line, when the difference of gain loss satisfies the condition of initiating MS

power management, power optimization will start. When the difference of gain loss

meets the requirement of MS power management, the optimization is over.

MS power management can be implemented by using module and network management

software together.

Module

Module implements power monitoring and adjustment, including LAC, EOA and DRA.

Network Management Software



Set all parameters of power management; query existing power status; send power

management command to module; support automatic and manual adjustment.

6.14.2 OCH Layer Power Management

OCH layer power management focuses on the power in OCh. OCh is the section

between line ports of optical transponder unit which implementing end-to-end connection

of all signals (PDH, SDH and ATM)

Channel layer power management consists of fixed power compensation and dynamic

channel power management. Fixed power compensation uses intelligent optical amplifier

to ensure the gain flatness of the amplifier. Dynamic channel power management uses

power pre-optimization technology and dynamic gain optimization technology to adjust

the optical power of all signal channels. In this way, the optical power of all signal

channels at the system optical receiving end can be balanced.

Fixed power compensation

Fixed equalization filter in EDFA guarantee even gain spectrum.

Dynamic channel power management

By using VMUX, WBU, WSU, WBM, gain spectrum slope efficiency adjustment

technology, dynamic gain optimization technology and optical performance monitoring

technology, these methods optimize power of all channels caused by nonlinear effect

and multi-stage amplifier gain un-flatness in large-capacity or long-distance system.

This mechanism can realize channel layer power management of OTM, FOADM and

ROADM. The network composed by these devices can be in end-to-end mode, link

mode and ring mode.

6.15 Performance Inspection

ZXONE 8000 has optical performance inspection unit. It is responsible for measuring

parameters of each optical path, e.g. optical power, central wavelength and OSNR. Also

relative data can be sent to the network management system. The network management



system supports two view manners, i.e. spectrum and data.

An optical forwarding part is capable of complete performance monitoring and consume

processing service. By inspecting different access signals hierarchically, it can

accurately locate the failure and determine fault type.

OTN signal: LOF, BIP-8, consume TTI, correctable error, uncorrectable frame,

OTUk-AIS, ODUk-AIS, ODUk-OCI, ODUk-LCK, PM-BIP8 and ODUk-PT

performance and alarm.

SDH signal: Monitor B1, B2 and J0 bytes.

GE signal: Monitor error packet number and error packet ratio, GFP performance

test.

All modules of active channel for ZXONE 8000 use large-scale and highly precise power

collection and monitoring technology. With less than 1dB error, it truly shows the system

performance.

6.16 Integrated Wavelength Monitoring

ZXONE 8000 provides two ways to keep stable wavelength. They are suitable for

different channel space systems.

100 GHz channel space

Automatic power control, temperature and inbuilt wavelength feedback mode are used.

This function is implied in OTU board.

50 GHz channel space

Inbuilt and additional wavelength feedback mode is used to enhance the stability and

precise of the wavelength.

Inbuilt wavelength feedback

Implemented by OTU, this service is same as 100GHz channel space service.



Additional wavelength feedback

The additional wavelength feedback of ZXONE 8000, i.e. wavelength monitoring

subsystem, uses integrated inspection and order adjustment mode to realize the control

of wavelength feedback.

This system is implemented by OWM, Multiplexer, OTU, SNP and network software

together. The service is as shown in Figure 6-10.

Figure 6-10 Wavelength Monitoring Subsystem

OWM board receives multiplexed optical signals from MON interface of amplifier. Inspect

wavelength deviation of all path wavelengths in multiplexed signals. If the deviation

exceeds restriction, SNP will be informed to send wavelength adjustment command to

related OTU board until the deviation disappears.

NM software implements parameter setting, initiation/forbidden services in the course of

wavelength adjustment. The command is sent to OWM board.



6.17 Communication and Monitoring

6.17.1 Optical Monitoring Channel

The monitoring and management information around different sites of ZXONE8000

system can be delivered and communicated via OSC. The wavelength of OSC is

1510nm, and the transmission speed is 100Mbit/s.

The delivery and communication of ECC data between NEs, business and transparent

user channel data and APS information are implemented via SOSC module and borne

on OSC. One piece of SOSC module can monitor four optical directions of information.

The major services are:

Encapsulate ECC data, APS data, transparent user channel data and public voice

data among network elements in 100M monitoring subsystem, then delivery them in

Ethernet data frame. Compared with fixed overhead byte, IP encapsulation gives

convenience to the extension of signaling message.

With 3 10/100BASE-T Ethernet electrical interfaces (actually physical interface is

provided by SEI board), it is capable of automatic switching service. SNP board and

NM accessed to100M monitoring subsystem delivers monitoring information in NE

via SOSC board and standby route.

On the front panel, there are 4 100BASE-FX Ethernet optical interfaces accessing

1510nm monitoring path to implement monitoring information delivery between NEs.

100BASE-FX is 100 Mbit/s optical interface.

Hardware-based L3 forwarding monitoring information capability is provided. L3

routing protocol is used to make network DCN-based interconnection easier. This

mechanism makes the signaling more adaptive to complicated networking

scenarios.

OSPF protocol and dynamic routing are used. With plug-and-play fiber, there’s no

need for manual configuration. Automatic route switchover can be implemented in

the course of network capacity extension, fiber and node breakdown.



SNP board reports NE and its subnet alarm and performance to NM. At the same time, it

receives the commands and configuration from NM to local NE and its subnet.

6.17.2 Electrical Supervisory Channel

The supervisory and management information of all ZXONE 8000 sites can be delivered

and communicated via ESC. ESC uses GCC overhead of G.709 to supervise path and

implement multiplexing and demultiplexing services. It is competent to sending NM,

public, protection and APR information.

6.18 Time/Clock Synchronization Service

ZXONE 8000 supports clock and time synchronization. It meets the requirements of the

3G base station for precise time synchronization.

Clock synchronization: It refers to the frequency synchronization. The frequencies

or phases of signals are closely related. Normally, the frequencies are the same

and the phase difference is constant for stable equipment operation.

Time synchronization: The frequencies and the phases of signals are the same.

Normally the time synchronization includes clock synchronization. The IEEE

1588V2 protocol is a widely-used time synchronization protocol.

The ZXONE 8000 clock synchronization function supports transmitting clock

synchronization signals among subracks and networks. It has the following features:

Supports the clock synchronization and the time synchronization to meet the

requirements for time synchronization accuracy.

The physical-layer synchronization mechanism extracts clock from the serial bit

stream in physical channel of transmission link to implement the frequency

synchronization.

The time synchronization complies with the IEEE 1588 V2 protocol. The ZXONE

8000 system provides an out-of-band time synchronization interface between

1pps+TOD and FE to implement the out-of-band time transmission.



Uses the Best Master Clock (BMC) algorithm to select a clock. The BMC algorithm

compares the descriptions of two or more clocks, and selects the better one. The

Ordinary Clock (OC), Boundary Clock (BC), and Transparent Clock (TC) are

supported.

Supports processing the Synchronization Status Message (SSM) and the delay

compensation.

Supports the protection switch of active/standby clock sources.

6.18.1 Clock Synchronization

Three clocks that are transmitted in the OTN network are as follows: 2M BITS clock, SDH

service clock, and synchronous Ethernet clock. The OTN equipment supports two clock

transmission manners.

In-band clock transmission: The clock signals are transmitted through the service

channels.

Out-band clock transmission: The clock signals are transmitted through the OSC

optical supervision channel.

For a description of two clock transmission manners, refer to Table 6-18.

Table 6-18 Clock Transmission Manner

Clock

Transmission

Manner

Implementation Solution

In-band clock transmission

Solution one: The CLK board and service board are used to extract, manage, and transmit the clock signals, normally, the 2M BITS clock or SDH clock signals.

If this solution is used, the clock configuration should be performed for the CLK board and service board on the NMS.



Solution two: The service board that supports the mapping of transparent frequency transmission or synchronous mapping is used to transmit GE and 10GE synchronous Ethernet clock signals. For example, the SOUT10G board supports 10GE-ODU2e synchronous mapping.

The clock information can be transmitted through the 10GE-ODU2e synchronous mapping. If this solution is used, there is no need to configure the clock on the NMS but a service channel should be established between service boards. The service mapping should support transparent frequency mapping or be the synchronous mapping.

Out-band clock transmission

The out-band clock transmission is implemented through the SOSCB board +TIS board configured on the OTN equipment.

If this solution is used, the clock configuration should be performed for the SOSCB board and the TIS board.

6.18.2 Time Synchronization

The OTN equipment supports transmitting IEEE 1588V2 time information through the

OSC optical supervision channel, that is, out-band time transmission.

The out-band time transmission is implemented through the SOSCB board and the TIS

board configured on the OTN equipment. For the NE that requires the input or output of

time information, you should configure the SOSCB board and the TIS board. For other

NEs, configure the SOSCB board.

6.19 Alarm Inspection Service

6.19.1 Input and Output External Alarm

ZXONE 8000 supports to input and output external alarms.

Input external alarm

Via the external alarm input/ external alarm output/alarm specification interface and ring

stream input interface on SEIA1 board, the device uses optical coupler to isolate signals

to access the alarm input by external monitoring device. And the alarm s can be directly



displayed on NM. The system at most can access 10-line external alarm. The alarm type

can be set by network management system, and used for inspect alarm of fan, door and

temperature.

Output external alarm

The device send alarm signals to heads rack, alarm specification board or other

monitoring units except the rack via the external alarm input/ external alarm output/alarm

specification interface and ring stream input interface on SEIA1 board. Equipment alarm

output, alarm specification board drive and ring stream input signal use optical coupler to

isolate signals or level drive signals.

6.19.2 Internal Alarm Inspection Service

ZXONE 8000 module supports alarm inspection based upon communication, device and

outside environment. The inspected alarms are as shown in Table 6-19:

Table 6-19 List of Alarm Inspected by ZXONE 8000

Alarm Type Inspected Alarm

Communication alarm

Exceeding optical power warming, SDH service alarm, OTN service alarm, unlock alarm, service error alarm, trace mismatch alarm, exceeding reflection optical power alarm, exceeding reflection efficiency alarm

Device alarm

Temperature alarm

Laser and module temperature alarm

Current alarm

Overflow of laser/cooler alarm, offset current of laser alarm, pump laser offset current/cooling current overflow alarm

Module alarm

Laser/pump lifetime alarm, laser invalid alarm, M-Z modem offset exceeding voltage alarm, invalid module or module fault alarm, DSP operation alarm, pump reflection exceeding optical power alarm, exceeding pump reflection efficiency alarm, invalid laser alarm, board not in place alarm, flashboard alarm, fan fault alarm

External environment

Fire, temperature and equipment room alarm



Alarm Type Inspected Alarm

alarm

6.19.3 PRBS Function

Boards on client sides have Pseudo Random Bit Sequence (PRBS) functions. The board

supporting the PRBS function works as a simple self-sending-and -self-receiving test

meter. Tests without meters can be implements, which is easy for fault location and

maintenance.

During commissioning debugs or fault location processes, you can replace service

signals of the clients with PRBS signals and determine whether the equipment or

transmission lines are normal by analyzing the PRBS signals looped back from the

remote end.

The principle of the PRBS test function is shown in Figure 6-11

Figure 6-11 PRBS Test Principle

The Tx port of the service board sends PRBS signals, which are transmitted to the

remote end through the DWDM network. The signals are looped at the client side and

tested through the Rx port.



7 WASON

7.1 Overview

ZTE unified control platform (ZXUCP) a self-researched intelligent optical network

control platform can be implemented on ZXONE 8000 intelligent WDM series products

providing intelligent features based on GMPLS control platform. ZXUCP A200 is a

control platform software system based upon WASON (Wavelength Automatically

Switched Optical Network) of WDM platform. Based upon WDM/OTN technology, this

platform can realize automatic routing, resource and network topology automatic

discovery, service grooming, traffic engineering and multi-level service level agreement.

It can fully satisfy user’s networking, network control and management. It can be used in

building edge layer of large MAN (aggregation and access), metro backbone layer,

national and local backbone network.

Figure 7-1 Positioning of the Control Platform in Optical Transmission Network

NMI

NMI

W

A

S

O

N

M

a

n

a

g

e

m

e

n

t

P

l

a

n

e

N MI: Network Management Interface

Switch Switch Switch Client e.g. IP, ATM, TDM

Client e.g. IP, ATM, TDM

OCC OCC OCC

CCI

NNI

UNI

OCC: Optical Connection Controller UNI: User Network Interface CCI: Connection Control Interface

N NI: WASON Control Node-Node Interface IrDI:Interdomain Interface

User Signaling

E_NN I

IrDI

OCC WASON Control Plane

WASON Transmission Plane

Switch器



7.2 WASON Functionality

Based upon distributed design and inbuilt software system, ZXUCP A200 system is

operated on the control unit of network element. The system uses overlap operating

model.

7.2.1 Resource and Topology Automatic Discovery

WASON network can realize automatic discovery of link resource, network topology and

fibers between sites. The wavelength and sub-wavelength service status including used

and idle resources in the network can be achieved in real time. So that the existing

network situation can be get easily.

ZXUCP A200 system uses standard OSPF-TE routing protocol to flood and collect

network control channel information and generate network control routing information

automatically. Through flooding and collecting network service link information, network

resource topology information can be discovered automatically.

ZXUCP A200 system uses standard LMP protocol to realize automatic discovery and

management of network control channel and network link resource. It can also realize

the management of consistency verification.

Link resources which can be discovered and managed automatically include:

Fiber (multiplexing section) resource;

Wavelength resource

Sub-wavelength (ODU0/ODU1/ODU2/ODU3/ODU4) resource

7.2.2 End-to-End Service Configuration

WASON network supports rapid end-to-end service configuration. The service

configuration can either be in the manner of SPC (soft permanent connection) mode

issued by the management platform, or SC (switch connection) mode issued by the

client.



Services are generated as per the following procedures:

Choose source and destination nodes

Choose bandwidth granularity and service level as per service type

According to restrictions, calculated proper service path

Enable all sites to build end-to-end service connection via RSVP-TE

signaling protocol

7.2.3 Protection and Restoration in Mesh Networking

As optical control plane, ZXUCP A200 is mainly used in mesh network to enhance

network resilience and service reliability

Mesh networking features in flexibility and extendibility. Compared with traditional WDM

network, there can be more service paths to make the network safer. This networking

mode makes maximum use of entire network resource.

In Mesh network, besides traditional ring/link protection solution like channel 1+1

protection and channel shared protection, reroute mechanism can also be used to

resume services in time.

7.2.4 SLA

Based upon SLA (Service Level Agreement), WASON network can provide different

levels of service as per different customers’ demands.

Table 7-1 Multi-Level Service SLA

Level of

Protection/

Restoration

Description of Protection/Restoration

Mode

Time for

Protection/

Restoration

Diamond

Dedicated protection with mesh restoration against multiple network failure (permanent 1＋1 protection)

<50ms



Level of

Protection/

Restoration

Description of Protection/Restoration

Mode

Time for

Protection/

Restoration

Gold One-time service protection with mesh restoration against multiple network failure

<50ms

Silver only protection without mesh protection <50ms

Copper Only mesh restoration without protection

Several hundreds of milliseconds to several seconds

Iron Neither protection nor mesh restoration N/A

Diamond: permanent 1＋1 protection

Initializing working and protection path

Failure of working path triggers protection switching within 50ms. Then

rerouting builds new protection path.

Failure of protection path triggers rerouting to build new protection path.

Failure of working path triggers protection switch again and rerouting builds

new protection path.

Gold: one-time service protection with mesh restoration

Initializing working and protection path.

Failure of working path triggers protection switching. However, rerouting

won’t be triggered until the protection path fails too.

Silver: only protection, but no mesh restoration

Copper: only mesh restoration.

Iron: Without protection and mesh restoration.



7.2.5 Network Traffic Balancing

After introducing intelligent feature, WASON network uses traffic engineering algorithm.

So that, it can adjusts network resource automatically. Entire network resources can be

distributed in balance automatically, which on one hand avoids congestion, on the other

hand enhances network security and operatability. At the same time, with multiple

constrains in path selection, it makes rational use of network resources.

WASON network can keep traffic of all routes in the network in balance, so that traffic

can be distributed evenly in the network. When there are many LSP between two nodes,

multiple LSPs may pass the same route. Network traffic balancing will try its best to avoid

this situation.

7.2.6 Multi-Level LSP Control

LSP referring to label switch path indicates the path that passed by intelligent services. In

WASON network, creating intelligent service equals to create LSP.

In traditional WDM network, wavelength is often considered as the granularity in path

selection. ZXUCP A200 can provide switching capability based upon ODUK granularity,

wavelength granularity, waveband granularity and fiber granularity. So that it can realize

multi-granularity hierarchical route. Multi-granularity link protection and restoration can

also be realized.



8 Technical Specifications

8.1 Optical Transponder Specifications

8.1.1 SOTU2.5G Specifications

Technical specifications of 2.5Gbit/s board at Client-Side and Line-Side are listed in

Table 8-1 and Table 8-2

Table 8-1 Technical specifications of 2.5Gbit/s board at Client-side

Item Unit Parameter

Parameters of optical receive port at client side (S point)

Type of Receiver --- PIN,APD

Receiving sensitivity (BER10-12) dBm

-18(S16.1,I16.1)

-27(L16.1)

-28(L16.2)

Max. reflection of Receiver dB <-27

Overload power dBm

-3(I16.1)

0 (S16.1)

-9(L16.1,L16.2)

Input signals wavelength range nm 1280~1625

Parameters of optical transmit port at client side (R point)

Mean launched power (near-end optical port)

Maximum

dBm

-3(S16.1)

0 (I16.1)

+3(L16.1,L16.2)

Minimum

-10(I16.1)

-5 (S16.1)

-2 (L16.1,L16.2)

Minimum extinction ratio dB 8.2

Eye diagram - Compliance with ITU-T G.957



Table 8-2 Technical specifications of 2.5Gbit/s board at Line-side

Item Unit Parameter

Parameters of optical transmit port at line side (Sn point)

Type of nominal light source --- DFB-LD

Spectral characteristics

Max. -20dB spectral width

nm 0.2(EA)/0.5(DM)/1(DM,SFP)

Min. side mode suppression ratio

dB 35

Central frequency

Nominal central frequency

THz 192.1-196.0

Central frequency deviation

GHz 12.5 (100 GHz spacing)

Mean transmission power

Max. dBm 6

Min. dBm 0

Min. extinction ratio dB +10(EA)

8.2 (DM)/DM SFP

Dispersion holding value ps/nm

12800(EA)

6400 (direct modulation)

3600（DM SFP）

Eye pattern mask --- In compliance with ITU-T G.959.1

Parameters of optical receive port at line side (Rn point)

Receiving sensitivity

(BER10-12) dBm

-21 (EOL),-23(BOL) PIN

-28 (EOL),-30(EOL) APD


Overload power dBm 0 PIN

-9 APD

Input signals wavelength range nm 1280~1625



Note 1: Mean transmitting power includes two types: long-haul optical interface and intra office interface.

8.1.2 SRM42 Specifications

Table 8-3 Technical specifications of SRM42 board

Item Unit Specification

Parameters of optical receiving port at line side (Rn point)

Receiving sensitivity dBm -21 (EOL), -23(BOL) PIN

-28 (EOL), -30(BOL) APD

Receiver reflection dB <-27

Overload power dBm 0 (PIN)

-9 (APD)

Wavelength area of input signals nm 1280-1625

Parameters of optical transmitting port at line side (Sn point)


Maximum –20 dB bandwidth

nm 0.2(EA) /0.5(DM)/1(DM SFP)

Minimum side mode suppression ratio (SMSR)

dB 35

Central frequency

Nominal central frequency THz 192.10~196.0(C-band)

Central frequency offset(EOL)

GHz ≤ 12.5 (spacing: 100 GHz)


Max. dBm 6

Min. dBm 0

Minimum extinction ratio dB 10 (EA)

8.2 (DM)/(DM SFP)

Dispersion tolerance ps/nm

12800(EA)


3600（DM SFP）


Parameters of optical receiving port at client side (S point)

Receiving sensitivity dBm -23 (I-4)

-18 (S-4)




-28 (L-4)

-23 (I-1)

-28 (S-1)

-34 (L-1)

Receiver reflection dB

<-27 (S-4.2)

<-14 (L-4.1)

<-27 (L-4.2)

<-14 (L-4.3)

<-25 (L-1.2)

NA (others)

Overload power dBm

-8 (I-4)

-8 (S-4)

-8 (L-4)

-8 (I-1)

-8 (S-1)

-10 (L-1)


Parameters of optical transmitting port at client side (R point)

Mean launched power dBm

-15 to -8 (I-4)

-15 to -8 (S-4)

-3 to +2 (L-4)

-15 to -8 (I-1)

-15 to -8 (S-1)

-5 to 0 (L-1)

Minimum extinction ratio dB

8.2 (I-4)

8.2 (S-4)

10 (L-4)

8.2 (I-1)

8.2 (S-1)

10 (L-1)




8.1.3 SDSA Specifications

Table 8-4 Technical specifications of SDSA board



Receiving sensitivity dBm -21 (EOL),-23(BOL) PIN

-28( EOL),-30(BOL) APD



-9 (APD)



Spectral characteristic


nm 0.2(EA)/0.5(DM)/1(DM SFP)


dB 35

Central frequency


THz 192.1-196.0

Central frequency offset

GHz ≤ 12.5 (100 GHz spacing)

Mean launched power dBm 0 to 6


8.2 (DM)/(DM SFP)


12800(EA)


3600（DM SFP）

Eye diagram - In compliance with ITU-T G.959.1


Receiving sensitivity dBm

-17 (1000BASE-SX)

-19 (1000BASE-LX)

-20 (1000BASE-LH1)

-22 (1000BASE-ZX)




Overload power dBm

0 (1000BASE-SX)

-3 (1000BASE-LX)

-3 (1000BASE-LH1)

-3 (1000BASE-ZX)



-9.5 to -3 (1000BASE-SX)

-11 to -3 (1000BASE-LX)

-4 to 0 (1000BASE-LH1)

-2 to +3 (1000BASE-ZX)

8.1.4 DSA Specifications

Table 8-5 Technical specifications of DSA board



Receiving sensitivity dBm -21 (EOL),-23(BOL) PIN

-28( EOL),-30(BOL) APD



-9 (APD)





nm 0.2(EA)/0.5(DM)


dB 35

Central frequency


THz 192.10~196.0

Central frequency offset GHz ≤ 12.5 (spacing: 100 GHz)

Mean launched power dBm 0 to 6


8.2 (DM)




Dispersion tolerance ps/nm 12800(EA)





-17 (1000BASE-SX)

-19 (1000BASE-LX)

-20 (1000BASE-LH1)

-22 (1000BASE-ZX)

-25 (100-SM-LL-L)

-20 (100-SM-LL-I)

-13 (100-M5-SL-I)

Overload power dBm

0 (1000BASE-SX)

-3 (1000BASE-LX)

-3 (1000BASE-LH1)

-3 (1000BASE-ZX)

-3 (100-SM-LL-L)

-3 (100-SM-LL-I)

-1.3 (100-M5-SL-I)



-9.5 to -3 (1000BASE-SX)

-11 to -3 (1000BASE-LX)

-4 to 0 (1000BASE-LH1)

-2 to +3 (1000BASE-ZX)

-9 to -3 (100-SM-LL-L)

-12 to -3 (100-SM-LL-I)

-7.3 to +1.3 (100-M5-SL-I)

8.1.5 SOTU10G/EOTU10G/EOTU10GB Specifications

Technical specifications of 10Gbit/s Board at Client-side and Line-side are listed in Table

8-6 and Table 8-7



Table 8-6 Technical specifications of 10Gbit/s board at Client-side

Item Unit Parameter


Type of Receiver --- PIN/APD


-11 (I-64.1)

-11.1 (10GBASE-SR/10GBASE-SW)

-12.6 (10GBASE-LX/10GBASE-LR/10GBASE-LW)

-14 (S-64.2b)

-14.1 (10GBASE-ER/10GBASE-EW)

-26 (10GBASE-ZR/ L-64.2)


Overload power dBm

0.5 (10GBASE-LX/10GBASE-LR/10GBASE-LW)

-1 (I-64.1/S-64.2b/10GBASE-SR/10GBASE-SW/10GBASE-ER/10GBASE-EW)

-7 (10GBASE-ZR)

-9 (L-64.2)

Input signals wavelength range nm 1280 ~ 1625


Type of nominal light source --- MQW-DFB

Mean launched power (I64.1)

Maximum dBm -1

Minimum dBm -6

Mean launched power (S64.2b)

Maximum dBm +2

Minimum dBm -1

Mean launched

power (L64.2)

Maximum dBm -1

Minimum dBm +2

Mean launched Maximum dBm -7.3



Item Unit Parameter

power (10GBASE-SR/10GBASE-SW)

Minimum dBm -1

Mean launched

power (10GBASE-LX/10GBASE-LR/10GBASE-LW)

Maximum dBm +0.5

Minimum dBm -8.2

Mean launched

power (10GBASE-ER/10GBASE-EW)

Maximum dBm +4

Minimum dBm -4.5

Mean launched

power (10GBASE-ZR)

Maximum dBm +4

Minimum dBm +1

Min. extinction ratio dB 10/8.2

Eye pattern mask --- In compliance with ITU-T Recommendation G.691

Table 8-7 Technical specifications of 10Gbit/s board at Line-side

Item Unit Parameter




Max. -20dB spectral width

nm 0.3(NRZ)

0.4( RZ)

Min. side mode suppression ratio

dB 30

Central frequency


THz In compliance with ITU-T G.694.1

Central frequency deviation(EOL)

GHz

≤ 12.5 (spacing: 100 GHz)

≤ 5 (spacing: 50 GHz)



Item Unit Parameter

Central frequency deviation(BOL)

GHz




Max. dBm -2(RZ)/+1(NRZ)

Min. dBm -5(RZ)/-3(NRZ)

Chirp modulus --- 0.3 ~ 0.7

Min. extinction ratio dB 8.2

Dispersion holding value ps/nm -300～+800 (NRZ)/

-400～+400 (RZ)

Eye pattern mask --- In compliance with ITU-T G.959.1



(BER10-12) dBm

PIN -14 (EOL)

-17 (BOL)

APD -21(EOL)

-24(BOL)

Max. reflection of Receiver dB <–27


-9 (APD)


8.1.6 SRM41 Specifications

Table 8-8 Technical specifications of SRM41 board


Parameters of optical receiving port at line side (Rn point)

Receiving sensitivity dBm -14 (EOL),-17(BOL)(PIN)

-21( EOL),-24(BOL)(APD)






-9 (APD)


Parameters of optical transmitting port at line side (Sn point)



nm 0.3(NRZ)

0.4( RZ)

Minimum side mode suppression ratio (SMCR)

dB 30

Central frequency




GHz




GHz



Mean launched power dBm -5~-2 (RZ)/-3~+1(NRZ)


Dispersion tolerance ps/nm -300～+800 (NRZ)/

-400～+400 (RZ)

Eye diagram - Compliance with ITU-T G.959.1

Parameters of optical receiving port at client side (S point)


-18 (I-16.1)

-18 (S-16.1,S-16.2)

-27 (L-16.1)

-28 (L-16.2)


Overload power dBm -3 (I-16.1)




0 (S-16.1,S-16.2)

-9 (L-16.1,L-16.2)


Parameters of optical transmitting port at client side (R point)


-10 to -3 (I-16.1)

-5 to 0 (S-16.1,S-16.2)

-2 to +3 (L-16.1,L-16.2)


Eye diagram - Compliant with ITU-T G.957

8.1.7 FCA Specifications

Table 8-9 Technical specifications of FCA board


Parameters of optical receive port at line side (Rn)

Receiving sensitivity dBm -14(EOL),-17(BOL) (PIN)

-21(EOL),-24(BOL) (APD)



-9 (APD)





nm 0.3(NRZ)

0.4( RZ)


dB 30

Central frequency




GHz







GHz



Mean launched power dBm -5~-2(RZ)/-3~+1(NRZ)



-400～+400 (RZ)




FC dBm -18

2GFC dBm -18

4GFC dBm -18

Overload power

FC dBm 0

2GFC dBm 0

4GFC dBm 0


Output power

FC dBm -4.5

2GFC dBm -4.5

4GFC dBm -4.5

8.1.8 MOM2 Specifications

Table 8-10 Technical specifications of MOM2 board



Receiving sensitivity dBm -14(EOL),-17(BOL) (PIN)

-21 (EOL),-24(BOL) (APD)






-9 (APD)





nm 0.3(NRZ)

0.4( RZ)


dB 30

Central frequency




GHz




GHz



Mean launched power dBm -5~-2(RZ)/-3~+1(NRZ)



-400～+400 (RZ)




FC

dBm

-18

2GFC -18

1000BASE-SX -17

1000BASE-LX -19

1000BASE-LH1 -20




1000BASE-ZX -22

Overload power

FC

dBm

0

2GFC 0

1000BASE-SX 0

1000BASE-LX -3

1000BASE-LH1 -3

1000BASE-ZX -3


Output power

FC

dBm

-4.5

2GFC -4.5

1000BASE-SX -9.5 to -3 (1000BASE-SX)

1000BASE-LX -11 to -3 (1000BASE-LX)

1000BASE-LH1 -4 to 0 (1000BASE-LH1)

1000BASE-ZX -2 to +3 (1000BASE-ZX)

8.1.9 ASMA/ASMB Specifications

Table 8-11 Technical specifications of ASMA/ASMB board


Parameters of WDM-side optical receive port (Rn point)

Receiver sensitivity dBm <-14(EOL),-17(BOL) (PIN)

<-21(EOL),-24(BOL) (APD)

Receiver reflection dB <–27

Overload power dBm >0 (PIN)

>-9 (APD)

Wavelength range of input signal nm 1280~1625

Parameters of WDM-side optical transmit port (Sn point)

Maximum -20 dB bandwidth nm 0.3(NRZ)

Minimum side mode suppression ratio

dB 30

Nominal central frequency THz In compliance with ITU-T G.694.1




Central frequency deviation(EOL) GHz



Central frequency deviation(BOL) GHz



Mean launched power dBm -3~+1(NRZ)


Dispersion tolerance ps/nm -300～+800 (NRZ)


Parameters of client-side optical receive port (S point)

Receiver sensitivity dBm

<-17 (1000BASE-SX)

<-19 (1000BASE-LX)

<-14 (10GBASE-LR)

<-15 (10GBASE-ER

Overload power dBm

>0 (1000BASE-SX)

>-3 (1000BASE-LX)

>0.5 (10GBASE-LR)

>-1 (10GBASE-ER)

Parameters of client-side optical transmit port (R point)


-9.5 to -3 (1000BASE-SX)

-11 to -3 (1000BASE-LX)

-8.2 to 0.5 (10GBASE-LR)

-4.7 to 4.0 (10GBASE-ER)

8.1.10 TST3 specifications

Client-side: Transmitting part of receiving end and receiving part of transmitting end.

Line-side: Receiving part of receiving end, transmitting part of transmitting end and



transmitting/receiving part of regenerator.

Technical specifications of 40Gbit/s Board at Client-side and Line-side are listed in Table

8-12 and Table 8-13

Table 8-12 Technical specifications of TST3 board at Client-side


Bit rate (optical modulation mode)

Gbps

39.813 (NRZ),

43.018

39.813 (NRZ),

43.018

39.813 (NRZ),

43.018

Optical interface category --- VSR2000-3R2

P1I13D1 and

1I13D1F

40GBASE-LR4

Goal distance km 2 10 10


Frequency range nm 1280-1625 1280-1625

1264.5 to 1277.5

1284.5 to 1297.5

1304.5 to 1317.5

1324.5 to 1337.5

Sensitivity (BER=10–12) dBm -5 -7 -13.7(each lane)

Overload power(BER=10–12)

dBm +3 +4 +2.3

Receiver reflectance dB <-27 <-27 <-27


Frequency range --- 1280-1625 1307–1317 1264.5 – 1337.5

Mean launched power

Maximum

dBm

+3 +4 +2.3

Minimum

0 0 -7

Minimum side mode compression ratio(SMCR)

dB 35 35 35

Minimum extinction ratio dB 8.2 8.2 8.2

Jitter transfer characteristics

--- Complies with GR-253,

Complies with GR-253, Issue 4

Complies with GR-253, Issue 4



Issue 4

Eye diagram ---

Complies with G.959.1 NRZ 40G



Table 8-13 Technical specifications of TST3 board at Line-side


Optical signal modulation mode

- P-DPSK RZ-DQPSK PM-QPSK

Bit rate Gbps 43.018 43.018 43.018


Frequency range THz

192.10~196.05(C band)

191.30~196.075 ( CE band)

192.10~196.05(C band)

191.30~196.075 ( CE band)

192.10~196.05(C band)

191.30~196.075 ( CE band)

Sensitivity (BER=1×10–12) dBm -18(BOL),-15(EOL) 18(BOL),-15(EOL) -20

Minimum overload power (BER=1×10–12)

dBm 1 1 1


Dispersion tolerance (including TDC)

ps/nm -1000~+1000 -1000~+1000 +/- 50000

PMD tolerance ps 2.5 7 60

Jitter transfer characteristics

- Complies with G.8251

Complies with G.8251


FEC gain dB >8(AFEC) >8(AFEC) >8(AFEC)


Nominal central frequency THz Complies with ITU-T G.694.1

Complies with ITU-T G.694.1



GHz








GHz ≤ 3 (spacing: 100 GHz)









Mean launched power

Maximum

dBm

+5 +3 +5

Minimum

-5 -9 -5

Launched power offset dB ±1 ±1 ±1



GHz 0.7 0.6 0.5


dB 35 35 35

8.1.11 MQT3 Specifications

Table 8-14 Technical specifications of MQT3 board at Client-Side

Item Unit Parameter




-11 (I-64.1)



-14 (S-64.2b)


-26 (10GBASE-ZR/ L-64.2)


Overload power dBm 0.5 (10GBASE-LX/10GBASE-LR/10GBASE-LW)



Item Unit Parameter


-7 (10GBASE-ZR)

-9 (L-64.2)





Maximum dBm -1

Minimum dBm -6


Maximum dBm +2

Minimum dBm -1

Mean launched

power (L64.2)

Maximum dBm -1

Minimum dBm +2

Mean launched


Maximum dBm -7.3

Minimum dBm -1

Mean launched


Maximum dBm +0.5

Minimum dBm -8.2

Mean launched


Maximum dBm +4

Minimum dBm -4.5

Mean launched

power (10GBASE-ZR)

Maximum dBm +4

Minimum dBm +1





Table 8-15 Technical specifications of MQT3 board at Line-side




Bit rate Gbps 43.018 43.018 43.018

Parameters of line-side optical transmit port (Sn point)

Frequency range THz

192.10–196.05 (C

band)

191.30–196.075

(CE band)

92.10–196.05 (C

band)

191.30–196.075

(CE band)

192.10~196.05(C band)

191.30~196.075 ( CE band)

Sensitivity (BER=1×10–12) dBm -18(BOL),-15(EOL) 18(BOL),-15(EOL)

-20

Minimum overload (BER=1×10–12)

dBm 1 1 1

Max. reflectance dB <-27 <-27 <-27


ps/nm -1000~+1000 -1000~+1000 +/- 50000


Jitter Transfer Characteristics

- Complies with ITU-T G.8251

Complies with ITU-T G.8251


FEC code gain dB >8 (AFEC) >8 (AFEC) >8(AFEC)

Parameters of line-side optical receive port (Rn point)





GHz








GHz







Mean launched Maxim dBm +5 +3 +5




power um

Minimum

-5 -9 -5




GHz 0.7 0.6 0.5


dB 35 35 35

8.1.12 TS4 Specification

Client-side: Transmitting part of receiving end and receiving part of transmitting end.

Line-side: Receiving part of receiving end, transmitting part of transmitting end and

transmitting/receiving part of regenerator.

Technical specifications of 100Gbit/s Board at Client-side and Line-side are listed in

Table 8-16 and Table 8-17

Table 8-16 Technical specifications of TS4 board at Client-side


Bit rate (optical modulation mode) Gbps 100GE 4x25.78

OTU4 4x27.95

100GE 10x10.312

OTU4 10x11.18

Optical interface category --- 100GBASE_LR4

4I1-9D1F LR10

Target distance km 10 10


Frequency range nm

1294.53–1296.59

1299.02–1301.09

1303.54–1305.63

1308.09–1310.19

1520–1526

1528–1534

1536–1542

1544–1550

1552-1558




1560-1566

1568-1574

1576-1582

1584-1590

1592-1598

Sensitivity (BER=10–12) dBm

-8.6(OMA)PIN

-10.3(PIN)

(single channel)

-8.8(PIN)

(single channel)

Overload power(BER=10–12) dBm

+4.5

+2.9

(single channel)

+3.5

(single channel)

Receiver reflectance dB <-27 <-27


Mean output power

Maximum

dBm

single channel

+4.5

+2.9

Total:

+10.5

+8.9

+3.5

(single channel)

Minimum

single channel

-4.3

-2.5

-5.8

(single channel)

Minimum extinction ratio dB 4 2.5

Table 8-17 Technical specifications of TS4 board at Line-side


Optical signal modulation format - PM-QPSK

Bit rate Gbps 120

Frequency range THz 192.10~196.05(C band)

191.30~196.05 ( CE band)

Channel spacing GHz 50


Power sensitivity (BER=1×10–12) dBm -15(EOL),-17(BOL)




dBm 0

OSNR sensitivity(B2B) dB 13

FEC Gain dB 11.1

Dispersion tolerance ps/nm +/-70000

PMD tolerance ps 30/60(with 2dB OSNR penalty)

Receiver reflectance dB <-27

Jitter transfer characteristics - TBD


Maximum central frequency offset(EOL)

GHz ±2.5

Minimum central frequency offset(BOL)

GHz ±1.5

Transmitter output power

Maximum dBm

0

Minimum -5

Launched power offset dB ±1

Maximum optical spectral Bandwidth

-3 dB GHz

20

-15dB 60


dB 35

Transmitter reflectance dB <-27

8.1.13 MX2 Specifications

Table 8-18 Technical specifications of MX2 board at Client-Side

Item Unit Parameter




-11 (I-64.1)


-12.6 (10GBASE-LX/10GBASE-LR/1



Item Unit Parameter

0GBASE-LW)

-14 (S-64.2b)


-26 (10GBASE-ZR/ L-64.2)


Overload power dBm



-7 (10GBASE-ZR)

-9 (L-64.2)





Maximum dBm -1

Minimum dBm -6


Maximum dBm +2

Minimum dBm -1

Mean launched

power (L64.2)

Maximum dBm -1

Minimum dBm +2

Mean launched


Maximum dBm -7.3

Minimum dBm -1

Mean launched


Maximum dBm +0.5

Minimum dBm -8.2



Item Unit Parameter

Mean launched


Maximum dBm +4

Minimum dBm -4.5

Mean launched

power (10GBASE-ZR)

Maximum dBm +4

Minimum dBm +1



Table 8-19 Technical specifications of MX2 board at Line-side



Bit rate Gbps 120


191.30~196.05 ( CE band)





dBm 0


FEC Gain dB 11.1







GHz ±2.5


GHz ±1.5




Maximum dBm

0

Minimum -5



-3 dB GHz

20

-15dB 60


dB 35


8.1.14 TD2C Specifications

Table 8-20 Technical specifications of TD2C board


Parameters of input port (S point)


-14 (I64.1)

-16 (S64.2b)

-12.6 (10GBASE-LR/LW)

-14.1 (10GBASE-ER/EW)

-14 (1200-SM-LL-L)

Overload power dBm

0 (I64.1)

-1 (S64.2b)

0 (10GBASE-LR/LW)

-1 (10GBASE-ER/EW)

0 (1200-SM-LL-L)

Wavelength of input signals nm 1280 to 1565

Parameters of output port (Sn point)

Maximum bandwidth @ -20 dB nm 0.3(NRZ)


dB 30











Mean launched power dBm -3 to +1(NRZ)




Parameters of input port (Rn point)

Receiving sensitivity (BER10-12) dBm -14(EOL), -17(BOL) (PIN)

-21 (EOL),-24(BOL) (APD)



-9 (APD)

Wavelength area of input signals nm 1280 to 1565

Parameters of output port (R point)


-6 ~ -1 (I64.1)

-1 ~ 2 (S64.2b)

-8.2 ~ 0.5 (10GBASE-LR/LW)

-4.7 ~ 4 (10GBASE-ER/EW)

-6 ~ -1 (1200-SM-LL-L)

Minimum extinction ratio dB

6 (I64.1)

8.2 (S64.2b)

6 (10GBASE-LR/LW)

8.2 (10GBASE-ER/EW)




6 (1200-SM-LL-L)


8.1.15 MQA1 Specifications

Table 8-21 Technical specifications of MQA1 board




-17 (1000BASE-SX)

-19 (1000BASE-LX)

-20 (1000BASE-LH1)

-22 (1000BASE-ZX)

-19 (100-SM-LL-I)

-20 (200-SM-LL-I)

Overload power dBm

0 (1000BASE-SX)

-3 (1000BASE-LX)

-3 (1000BASE-LH1)

-3 (1000BASE-ZX)

-3 (100-SM-LL-I)

0 (200-SM-LL-I)


Light source type

Maximum bandwidth @ -20 dB nm 0.4


dB 30

Nominal central frequency THz 192.1 to 196.0

(spacing: 100 GHz)

Central frequency offset GHz ≤±12.5 (spacing: 100 GHz)

Mean launched power dBm 0~5





Dispersion tolerance ps/nm 3600



Receiving sensitivity (BER10-12) dBm -18 (PIN)

-25 (APD)



-9 (APD)

Wavelength area of input signals nm 1280 to 1565



-9.5 to -3 (1000BASE-SX)

-11 to -3 (1000BASE-LX)

-4 to 0 (1000BASE-LH1)

-2 to +3 (1000BASE-ZX)

-11 to -3 (100-SM-LL-I)

-12 to -3 (200-SM-LL-I)

8.1.16 MQA2 Specifications

Table 8-22 Technical specifications of MQA2 board




FC

dBm

-18

2G FC -18

4G FC -18

GE -19

I-16 -18

S-16 -18

L-16.1 -27

L-16.2 -28




Overload power

1G FC

dBm

0

2G FC 0

4G FC 0

GE -3

I-16 -3

S-16 0

L-16.1 -9

L-16.2 -9


Maximum bandwidth @ -20 dB nm 0.3(NRZ)


dB 30








Mean launched power dBm -3 to +1(NRZ)



-300～+800 (NRZ)



Receiving sensitivity dBm -14(EOL), -17(BOL) (PIN)

-21(EOL), -24(BOL) (APD)






-9 (APD)

Wavelength of input signals nm 1280 to 1565


Mean launched power

1G FC

dBm

-4.5

2G FC -4.5

4G FC -4.5

GE -11~0

8.1.17 MJA Specifications

Table 8-23 Technical specifications of MJA board




-17 (1000BASE-SX)

-19 (1000BASE-LX)

-20 (1000BASE-LH1)

-22 (1000BASE-ZX)

-19 (100-SM-LL-I)

-20 (200-SM-LL-I)

Overload power dBm

0 (1000BASE-SX)

-3 (1000BASE-LX)

-3 (1000BASE-LH1)

-3 (1000BASE-ZX)

-3 (100-SM-LL-I)

0 (200-SM-LL-I)



-9.5 to -3 (1000BASE-SX)

-11 to -3 (1000BASE-LX)

-4 to 0 (1000BASE-LH1)

-2 to +3 (1000BASE-ZX)

-11 to -3 (100-SM-LL-I)




-12 to -3 (200-SM-LL-I)

8.2 Client-side Board Specifications

8.2.1 CH1/CO1 Specifications

Table 8-24 Technical specifications of CH1/CO1 board


Parameters of optical receiving port (S point) at client side


-17 (1000BASE-SX)

-19 (1000BASE-LX)

-20 (1000BASE-LH1)

-22 (1000BASE-ZX)

-25 (100-SM-LL-L)

-20 (100-SM-LL-I)

-13 (100-M5-SL-I)

-18 (I-16)

-18 (S-16.1)

-18 (S-16.2)

-27 (L-16.1/L-16.2/L-16.3)

-27 (L-16.1/L-16.2/L-16.3)

Overload power dBm

0 (1000BASE-SX)

-3 (1000BASE-LX)

-3 (1000BASE-LH1)

-3 (1000BASE-ZX)

-3 (100-SM-LL-L)

-3 (100-SM-LL-I)

-1.3 (100-M5-SL-I)

-3 (I-16)

0 (S-16.1)




0 (S-16.2)

-9 (L-16.1/L-16.2/L-16.3)

-9 (L-16.1/L-16.2/L-16.3)

Parameters of optical transmit port (R point) at client side

Average optical transmit power dBm

-9.5 ~ -3 (1000BASE-SX)

-11 ~ -3 (1000BASE-LX)

-4 ~ 0 (1000BASE-LH1)

-2 ~ 3 (1000BASE-ZX)

-9 ~ -3 (100-SM-LL-L)

-12 ~ -3 (100-SM-LL-I)

-7.3 ~ 1.3 (100-M5-SL-I)

-10 ~ -3 (I-16)

-5 ~ 0 (S-16.1)

-5 ~ 0 (S-16.2)

-2 ~ 3 (L-16.1/L-16.2/L-16.3)

-2 ~ 3 (L-16.1/L-16.2/L-16.3)

8.2.2 CX2/CO2/CQ2/CD2B Specifications

Table 8-25 Technical specifications of CX2/CO2/CQ2/CD2B board

Item Unit Parameter




-11 (I-64.1)



-14 (S-64.2b)



Item Unit Parameter


-26 (10GBASE-ZR/ L-64.2)


Overload power dBm



-7 (10GBASE-ZR)

-9 (L-64.2)





Maximum dBm -1

Minimum dBm -6


Maximum dBm +2

Minimum dBm -1

Mean launched

power (L64.2)

Maximum dBm -1

Minimum dBm +2

Mean launched


Maximum dBm -7.3

Minimum dBm -1

Mean launched


Maximum dBm +0.5

Minimum dBm -8.2

Mean launched

power (10GBASE-ER/

Maximum dBm +4

Minimum dBm -4.5



Item Unit Parameter

10GBASE-EW)

Mean launched

power (10GBASE-ZR)

Maximum dBm +4

Minimum dBm +1



8.2.3 EHG1 Specifications

Table 8-26 Technical specifications of EHG1 board



Receiver sensitivity dBm <-17 (1000BASE-SX)

<-19 (1000BASE-LX)

Overload power dBm >0 (1000BASE-SX)

>-3 (1000BASE-LX)


Mean launched power dBm -9.5 to -3 (1000BASE-SX)

-11 to -3 (1000BASE-LX)

8.2.4 EQG2 Specifications

Table 8-27 Technical specifications of EQG2 board



Receiver sensitivity db <-14 (10GBASE-LR)

<-15 (10GBASE-ER

Overload power db >0.5 (10GBASE-LR)

>-1 (10GBASE-ER)





Mean launched power db -8.2 to 0.5 (10GBASE-LR)

-4.7 to 4.0 (10GBASE-ER)

8.2.5 ESG4 Specifications

Table 8-28 Technical specifications of ESG4 board




Target distance km 10


Frequency range nm

1294.53–1296.59

1299.02–1301.09

1303.54–1305.63

1308.09–1310.19

Sensitivity (BER=10–12) dBm single channel:-8.6(OMA) PIN

Overload power(BER=10–12) dBm single channel:+4.5



Mean output power

Maximum dBm

single channel:+4.5

Total:+10.5

Minimum single channel: -4.3

Minimum extinction ratio dB 4

8.2.6 CS3 Specifications

Table 8-29 Technical specifications of CS3 board



Frequency range nm 1280 ~1625

Sensitivity (BER 1×10–12) dBm -6

Overload power dBm 3




Maximum reflectance dB 27

Chromatic Dispersion tolerance Ps/nm

-10 ~ 60

Mean DGD tolerance ps 2.5


Mean output power dBm 0 ~ 3

Frequency range

ITU-T G.693 VSR2000-3R2/3/5 compliant (STM-256)

G.959.1 P1S1 3C2/3/5 compliant (OTU3)

Minimum SMSR dB 35

jitter performance Conform to G.8251

Eye Mask Conform to G.959.1 NRZ 40G

8.2.7 CD3 Specifications

Table 8-30 Technical specifications of CD3 board for 40GBASE-LR4



Signaling rate, each lane (range) GBd 10.3125 ± 100 ppm

Lane wavelengths (range) nm

1264.5 to 1277.5

1284.5 to 1297.5

1304.5 to 1317.5

1324.5 to 1337.5

Damage threshold a (min) dBm 3.3

Average receive power, each lane (max)

dBm 2.3

Average receive power, each lane b (min) dBm -13.7

Receive power, each lane (OMA) (max) dBm 3.5

Difference in receive power between any two lanes (OMA) (max)

dB 7.5




Receiver reflectance (max) dB -26

Receiver sensitivity (OMA), each lane c (max)

dBm -11.5

Receiver 3 dB electrical upper cutoff frequency, each lane (max)

GHz 12.3

Stressed receiver sensitivity (OMA), each lane d (max)

dBm -9.6

Conditions of stressed receiver sensitivity test:

Vertical eye closure penalty, e each lane dB 1.9

Stressed eye J2 Jitter, e each lane UI 0.3

Stressed eye J9 Jitter, e each lane UI 0.47


Signaling rate, each lane (range) dB 10.3125 ± 100 ppm

Lane wavelengths (range) dBm

1264.5 to 1277.5

1284.5 to 1297.5

1304.5 to 1317.5

1324.5 to 1337.5

Side-mode suppression ratio (SMSR), (min)

dBm 30

Total average launch power (max) dBm 8.3

Average launch power, each lane (max) dBm 2.3

Average launch power, each lane a (min) dBm -7

Optical Modulation Amplitude (OMA), each lane (max)

dBm 3.5

Optical Modulation Amplitude (OMA), each lane (min)b

dBm -4

Difference in launch power between any two lanes (OMA) (max)

dB 6.5

Launch power in OMA minus TDP, each lane (min)

dBm -4.8

Transmitter and dispersion penalty (TDP), each lane (max)

dB 2.6

Average launch power of OFF transmitter, each lane (max)

dBm -30




Extinction ratio (min) dB 3.5

RIN20OMA (max) dB/Hz -128

Optical return loss tolerance (max) dB 20

Transmitter reflectance c (max) dB -12

Transmitter eye mask definition {X1, X2, X3, Y1, Y2, Y3}

{0.25, 0.4, 0.45, 0.25, 0.28, 0.4}

Receiver side note:

a The receiver shall be able to tolerate, without damage, continuous exposure to an optical input

signal having this average power level b Average receive power, each lane (min) is informative and not the principal indicator of signal

strength. A received power below this value cannot be compliant; however, a value above this does

not ensure compliance. c Receiver sensitivity (OMA), each lane (max) is informative. d Measured with conformance test signal at TP3 (see 87.8.11) for BER = 10–12. e Vertical eye closure penalty, stressed eye J2 Jitter, and stressed eye J9 Jitter are test conditions

for measuring stressed receiver sensitivity. They are not characteristics of the receiver.

Transmit side note:

a Average launch power, each lane (min) is informative and not the principal indicator of signal

strength. A transmitter with launch power below this value cannot be compliant; however, a value

above this does not ensure compliance. b Even if the TDP < 0.8dB, the OMA (min) must exceed this value. c Transmitter reflectance is defined looking into the transmitter.

Table 8-31 Technical specifications of CD3 board for 40G POS



Frequency range nm 1280 ~1625

Sensitivity (BER 1×10–12) dBm -6

Overload power dBm 3

Maximum reflectance dB 27

Chromatic Dispersion tolerance Ps/nm

-10 ~ 60

Mean DGD tolerance ps 2.5





Mean output power dBm 0 ~ 3

Frequency range

ITU-T G.693 VSR2000-3R2/3/5 compliant (STM-256)

G.959.1 P1S1 3C2/3/5 compliant (OTU3)

Minimum SMSR dB 35

jitter performance Conform to G.8251

Eye Mask Conform to G.959.1 NRZ 40G

8.2.8 CS4 Specifications

Table 8-32 Technical specifications of CS4 board



OTU4 4x27.95

100GE 10x10.312

OTU4 10x11.18


4I1-9D1F LR10

Target distance km 10 10


Frequency range nm

1294.53–1296.59

1299.02–1301.09

1303.54–1305.63

1308.09–1310.19

1520–1526

1528–1534

1536–1542

1544–1550

1552-1558

1560-1566

1568-1574

1576-1582

1584-1590

1592-1598

Sensitivity (BER=10–12) dBm

-8.6(OMA)PIN

-10.3(PIN)

(single channel)

-8.8(PIN)

(single channel)

Overload power(BER=10–12) dBm +4.5 +3.5




+2.9

(single channel)

(single channel)

Receiver reflectance dB <-27 <-27


Mean output power

Maximum

dBm

single channel

+4.5

+2.9

Total:

+10.5

+8.9

+3.5

(single channel)

Minimum

single channel

-4.3

-2.5

-5.8

(single channel)

Minimum extinction ratio dB 4 2.5

8.3 Line-side Board Specifications

8.3.1 LO2/LQ2 Specifications

Table 8-33 Technical specifications of LO2/LQ2 board


Parameters of optical receiving port (Rn point) at line side

Receiving sensitivity (BER10-12) dBm -14(EOL),-17(BOL) (PIN)

-21(EOL),-24(BOL) (APD)

Maximum reflectance dB -27


-9 (APD)

Wavelength range of input signals nm 1280 ~ 1565

Parameter of transmitter at line side Sn point

Spectrum characteristics

Maximum -20 dB spectrum width

nm 0.3(NRZ)




Minimum side mode compression ratio (SMCR)

dB 30

Central frequency

Central frequency THz In compliance with ITU-T G.694.1


GHz




GHz



Average optical transmit power dBm -3 ~ +1(NRZ)



Eye diagram template - In compliance with ITU-T G.959.1


8.3.2 LD2B Specifications

Table 8-34 Technical specifications of LD2B board



Receiving sensitivity (BER10-12) dBm -14(EOL),-17(BOL) (PIN)

-21(EOL),-24(BOL) (APD)



-9 (APD)








nm 0.3(NRZ)

0.4( RZ)


dB 30




GHz




GHz



Average optical transmit power dBm -2~-5(ERZ)

+1 ~-3(NRZ)



-400～+400 (RZ)


8.3.3 LO2B Specifications

Table 8-35 Technical specifications of LO2B board



Receiving sensitivity (BER10-12) dBm -13 (PIN)

-18 (APD)






-5 (APD)





nm 0.3


dB 30

Central frequency



GHz




GHz



Average optical transmit power dBm -8~-5



-300~+800(NRZ)

8.3.4 LS3 Specifications

Table 8-36 Technical specifications of LS3 board




Bit rate Gbps 43.018 43.018 43.018





Frequency range THz

192.10~196.05(C band)

191.30~196.075 ( CE band)

192.10~196.05(C band)

191.30~196.075 ( CE band)

192.10~196.05(C band)

191.30~196.075 ( CE band)

Sensitivity (BER=1×10–12) dBm -18(BOL),-15(EOL)

18(BOL),-15(EOL) -18(BOL),-15(EOL)


dBm 1 1 0



ps/nm -800~+800 -800~+800 +/- 50000


Jitter transfer characteristics - Complies with G.8251



FEC gain dB >8(AFEC) >8(AFEC) >8(AFEC)






GHz








GHz







Mean launched power

Maximum dBm

+5 +3 +5

Minimum -5 -9 -5




nm 0.7 0.6 0.7


dB 35 35 35



8.3.5 LS4 Specifications

Table 8-37 Technical specifications of LS4 board



Bit rate Gbps 120


191.30~196.05 ( CE band)





dBm 0


FEC Gain dB 11.1







GHz ±2.5


GHz ±1.5


Maximum dBm

0

Minimum -5



-3 dB GHz

20

-15dB 60


dB 35




8.4 Mux/DeMux Board Specifications

8.4.1 OMU Specifications

Table 8-38 Technical specifications of OMU board

Item Unit

Specifications (32

Channels)

Specifications (40

Channels)

Specifi

cations

(48

Chann

els)

Specifications

(80 Channels)

Coupler AWG TFF Coupl

er AWG TFF AWG Coupler AWG

Insertion loss

dB <17 <10 <10 <19 <10 <10 <10 <23 <10

Max. difference of insertion losses of channels

dB <3 <3 <3 <3 <3 <3 <3 <3.5 <3

Channel spacing

GHz - 100 100 - 100 100 100 - 50

Optical

return

loss

dB >40 >40 >40 >40 >40 >40 >40 >40 >40

Working wavelength range

nm 1529-1561

1529- 1561

/1570-1605

1529- 1561

/1570-1605

1529-1561

1529- 1561

/1570-1605

1529- 1561

/1570-1605

1529-1568

/1570-1605

1529-1561

1529- 1561

/1570-1605

Polarization-rela

dB <0.5 <0.5 <0.5 <0.6 <0.5 <0.5 <0.5 <0.7 <0.5



Item Unit

Specifications (32

Channels)

Specifications (40

Channels)

Specifi

cations

(48

Chann

els)

Specifications

(80 Channels)

Coupler AWG TFF Coupl

er AWG TFF AWG Coupler AWG

ted loss

Polarization-mode dispersion

ps <0.5 <0.5 <0.5 <0.5 <0.5 <0.5 <0.5 <0.5 <0.5

Temperature characteristics

nm/C --- <0.005 --- --- <0.005 --- --- --- ---

Note: 1529 nm ~ 1561 nm corresponds to the C band OMU, while 1570nm ~ 1605 nm corresponds to the L band

OMU.

8.4.2 VMUX Specifications

Table 8-39 Technical specifications of VMUX board



nm 1529 ~1561/1529-1568

Bandwidth@-1dB nm > 0.2


Number of channels --- 40/48

Insertion loss (VOA = 0dB)

dB <8

Reflectance dB >40

Channel adjustment range

dB 0~10

VOA adjustment precision dB < 0.5

Polarization-related loss dB 0.8





ps <0.5

8.4.3 VMUXB Specifications

Configured at OTM site, VMUX can independently adjust optical power of each channel

to pre-weight channel power. Technical specifications are listed in Table 8-40.

Table 8-40 Technical specifications of VMUXB board


Number of channels --- 40


Working wavelength range nm 40-channel: 1529-1561/1570-1605

-1dB bandwidth nm > 0.2

Insertion loss (@0dB VOA) dB < 8

Polarization-mode dispersion ps 0.5

Polarization-related loss dB 0.8

Optical return loss dB > 40

Channel adjustment range dB 0~10

VOA adjustment accuracy dB < 0.5

8.4.4 ODU Specifications

Table 8-41 Technical specifications of ODU board

Item Uni

t

Specifications (32

Channels)

Specifications (40

Channels)

Specific

ations

(48

Channel

s)

Specif

ication

s (80

Chann

els)

AWG TFF AWG TFF AWG AWG

Insertion loss

dB < 10 < 10 < 10 < 10 < 10 < 10



Item Uni

t

Specifications (32

Channels)

Specifications (40

Channels)

Specific

ations

(48

Channel

s)

Specif

ication

s (80

Chann

els)


Max. difference of insertion losses of channels

dB < 3 < 3 < 3 < 3 < 3 < 3

Channel spacing

GHz

100 100 100 100 100 50

Optical return

loss

dB > 40 > 40 > 40 > 40 > 40 > 40


nm

1529-1561

/ 1570-1605

1529-1561

/ 1570-1605

1529-1561

/ 1570-1605

1529-1561

/1570-1605

1529-1568

/ 1570-1605

1529-1561

/ 1570-1605

Separation of adjacent channels

dB > 25 > 25 > 25 > 25 > 25 > 25

Separation of non-adjacent channels

dB > 30 > 30 > 30 > 30 > 30 > 30

Polarization-related loss

dB < 0.5 < 0.5 < 0.5 < 0.5 < 0.5 < 0.5


ps < 0.5 < 0.5 < 0.5 < 0.5 < 0.5 < 0.5

Temperat nm/ < 0.005 --- < 0.005 --- < 0.005 <



Item Uni

t

Specifications (32

Channels)

Specifications (40

Channels)

Specific

ations

(48

Channel

s)

Specif

ication

s (80

Chann

els)


ure characteristics

C 0.005

-1dB bandwidth

nm > 0.3 > 0.3 > 0.3 > 0.3 > 0.3 > 0.3

Note: 1529 nm ~ 1561 nm corresponds to the C band ODU, while 1570 nm ~ 1605 nm corresponds to the L band

ODU.

8.4.5 ODUB Specifications

Technical specifications of the ODUB board are listed in Table 8-42

Table 8-42 Technical specifications of the ODUB board

Item Unit Specification(40-Channel)

Insertion loss dB <10

Maximum insertion loss difference between channels

dB <2



Operating wavelength range nm 1529 - 1561 / 1570 - 1605

Isolation of adjacent channel dB >25

Isolation of non-adjacent channel dB >30

Polarization dependent loss (PDL) dB <0.5

Polarization mode dispersion (PMD) Ps <0.5

Temperature characteristics nm/℃ -

-1 dB bandwidth nm >0.2



8.4.6 OCI Specifications

Technical specifications of the OCI board are illustrated in Table 8-43 and Table 8-44.

Table 8-43 Technical specifications of the OCI board (100GHz-50GHz)


C band wavelength range nm 1529 -1568

CE band wavelength range nm 1529-1568

L band wavelength range nm 1570 - 1605

Input optical power range dBm < +23

Input wavelength spacing GHz 100

Output wavelength spacing GHz 50

Insertion loss dB < 3

Max. difference of insertion losses of channels dB < 1


Separation of adjacent channels dB > 25

Separation of non-adjacent channels dB > 25

Polarization-related loss dB < 0.5

Polarization-mode dispersion ps < 0.5

-1dB bandwidth nm > 0.1

Table 8-44 Technical specifications of the OCI board (50GHz-25GHz)


CE band wavelength range THz 1529-1568

Input optical power range dBm < +23

Input wavelength spacing GHz 50

Output wavelength spacing GHz 25

Insertion loss dB < 3

Max. difference of insertion losses of channels dB < 2


Isolation of de-multiplexing procedure dB > 21

Isolation of multiplexing procedure dB > 16




Polarization dependent loss (PDL) dB < 0.5

Polarization mode dispersion (PMD) ps < 0.2

-1dB bandwidth nm > 20

8.4.7 OBM Specifications

Technical Specifications of the OBM Board are listed in Table 8-45.

Table 8-45 Technical specifications of the OBM board


C band wavelength range nm 1529 -1561

CE band wavelength range nm 1529-1568

L band wavelength range nm 1570 -1605

C band insertion loss dB < 1.5

CE band insertion loss dB < 1.5

L band insertion loss dB < 1.5

Isolation dB 15


Polarization-related loss dB < 0.5

Polarization-mode dispersion ps < 0.5

8.4.8 SOGMD Specifications

Technical specifications of SOGMD board are illustrated in Table 8-46.

Table 8-46 Technical specifications of SOGMD board


Operating wavelength range nm 1529～1561(C band)

Insertion loss

IN→RRO dB <2.5

IN→RBO dB <2.5

IN→BRO dB <2.5

IN→BBO dB <2.5



RRI→OUT dB <2.5

RBI→OUT dB <2.5

BRI→OUT dB <2.5

BBI→OUT dB <2.5

Isolation dB >12

Reflectance dB <–40

PDL dB <0.4

PMD ps <0.15

Maximum optical power mW <500

8.4.9 SOGMDB Specifications

Table 8-47 Technical specifications of SOGMDB board


Operating wavelength range nm 1529～1561(C band)

Insertion loss

IN→RRO dB <6

IN→RBO dB <6

IN→BRO dB <6

IN→BBO dB <6

RRI→OUT dB <6

RBI→OUT dB <6

BRI→OUT dB <6

BBI→OUT dB <6

Isolation dB >15

Reflectance dB <-40

PDL dB <0.4

PMD ps <0.15

Maximum optical power mW <300



8.5 Optical Add/Drop Multiplexing Board Specifications

Table 8-48 Technical specifications of SOAD board


Working wavelength range nm 1529 ~ 1560

[email protected] nm > 0.2

Bandwidth@20dB nm <1.2


Number of add/drop channels

4

8

Isolation

Between drop channel and adjacent channel

dB

> 25

Between drop channel and non-adjacent channel

>35

Between drop channel and pass-through channel

>14

Between input/output channel and drop channel

> 28

Reflectance dB >45

Insertion loss

In-drop

dB

2.5 ~ 4.0

Add-out 2.5 ~ 4.0

In-out <6.0

Relative working humidity %RH 5~ 95

Max. working power mW 500



8.6 ROADM Board Specifications

8.6.1 PDU Specifications

Table 8-49 Technical specifications of PDU-5-4 board


Working wavelength range nm 1529~1561

Insertion loss

INx→Ox-1/2/3/4 dB <12.0

INx→Dx <4.0

Polarization-related loss dB <0.4

Return loss dB >40

Table 8-50 Technical specifications of PDU-9-2 board



Insertion loss

INx→Ox-1/2/3/4/5/6/7/8 dB <15.0

INx→Dx dB <4.0


Return loss dB >40

8.6.2 WSU Specifications

There are two types of WSU boards: WSUD board and WSUA board, For the technical

specifications of the WSUD board, refer to Table 8-51.

Table 8-51 Technical specifications of WSUD board


Working wavelength range nm 1529 to 1561 (C band)

1529 to 1568 (CE band)


50




Channel quantity GHz 40/48 (channel spacing: 100 GHz)

80/96 (channel spacing: 50 GHz)

Insertion loss

WSUD/MA1 A1-OUT

dB

<2

IN-D1-D8 <8

EXIN-OUT <9

IN-EXOUT <8

WSUD/E <8

Attenuation adjustment range dB 0 ~ 15

Attenuation adjustment precision dB

< (0.5 or ±10% of the configured value,

select the greater one between them)

Extinction ratio dB >35

Reflection loss dB >45

Max. input power dBm ≤25

Max. input power of single channel dBm ≤16

For the technical specifications of the WSUA board, refer to Table 8-52

Table 8-52 Technical specifications of WSUA board


Working wavelength range nm 1529 to 1561 (C band)

1529 to 1568 (CE band)


50

Channel quantity GHz 40/48 (channel spacing: 100 GHz)

80/96 (channel spacing: 50 GHz)

Insertion loss

WSUA/MD1 IN-D1

dB

<2

A1-A8-OUT <8

EXIN-OUT <8

IN-EXOUT <9

WSUA/E <8




Attenuation adjustment range dB 0 ~ 15

Attenuation adjustment precision dB

< (0.5 or ±10% of the configured value,

select the greater one between them)



Max. input power dBm ≤25

Max. input power of single channel dBm ≤16

8.6.3 WSUB Specification

There are four types of WSUB boards: WSUBD9D board, WSUBA9D board,

WSUBA9P9D board and WSUBD8-1D board. The technical specifications of the WSUD

board refer to

Table 8-53 Technical specifications of WSUBD9D board


Working wavelength range nm 1529~1561 1529~1561 1529~1568

Channel spacing GHz 100 50 50

Channel quantity - 40 80 96

Insertion loss dB <8.0 <8.0 <8.0

Attenuation adjustment range

dB 0~15 0~15 0~15

Attenuation adjustment precision

dB <1.0(0~10dB)

<1.0(0~10dB) <1.0(0~10dB)

dB <1.5(>10dB) <1.5(>10dB) <1.5(>10dB)

Extinction ratio dB >35 >35 >35

Isolation dB >25 >25 >25

Reflection loss dB >30 >30 >30

Max. input power dBm <25 <25 <25

Max. input power of single channel

dBm <13 <13 <13



Table 8-54 Technical specifications of WSUBA9D board





Insertion loss dB <8.0 <8.0 <8.0


dB 0~15 0~15 0~15


dB <1.0(0~10dB)

<1.0(0~10dB) <1.0(0~10dB)

dB <1.5(>10dB) <1.5(>10dB) <1.5(>10dB)






dBm <13 <13 <13

Table 8-55 Technical specifications of WSUBA9P9D board





Insertion loss

IN-D dB <4.0 <4.0 <4.0

IN-O1/O2/O3/O4/O5/O6/O7/O8

dB <15.0 <15.0 <15.0

A1/A2/A3/A4/A5/A6/A7/A8/A9-OUT

dB <8.0 <8.0 <8.0


dB 0~15 0~15 0~15


dB <1.0(0~10dB) <1.0(0~10dB) <1.0(0~10dB)

dB <1.5(>10dB) <1.5(>10dB) <1.5(>10dB)









dBm <13 <13 <13

Table 8-56 Technical specifications of WSUBD8-1D board





Insertion loss

IN-EXOUT dB <8.0 <8.0 <8.0

IN-D1/D2/D3/D4/D5/D6/D7/D8

dB <8.0 <8.0 <8.0

EXIN-OUT dB <8.5 <8.5 <8.5

A1-OUT dB <2.0 <2.0 <2.0


dB 0~15 0~15 0~15


dB <1.0(0~10dB) <1.0(0~10dB) <1.0(0~10dB)

dB <1.5(>10dB) <1.5(>10dB) <1.5(>10dB)






dBm <13 <13 <13

8.6.4 WSUBT20D Specification

Table 8-57 Technical specifications of WSUBT20D board






Channel spacing GHz FLEX

Insertion loss

IN-D1/D2/D3/D4/D5/D6/D7/D8/D9/D10/D11/D12/D13/D14/D15/D16/D17/D18/D19/D20

dB <9.5

A1/A2/A3/A4/A5/A6/A7/A8/A9/A10/A11/A12/A13/A14/A15/A16/A17/A18/A19/A20-OUT

dB <9.5

INL-D1/D2/D3/D4/D5/D6/D7/D8/D9/D10/D11/D12/D13/D14/D15/D16/D17/D18/D19/D20

dB <11.5

A1/A2/A3/A4/A5/A6/A7/A8/A9/A10/A11/A12/A13/A14/A15/A16/A17/A18/A19/A20-OUTL

dB <11.5

Attenuation adjustment range dB 0~15

Attenuation adjustment precision dB <1.0(0~10dB)

dB <1.5(>10dB)


Isolation dB >22


Max. input power dBm <24

Max. input power of single channel dBm <13

8.7 Optical Power Amplification Board Specifications

8.7.1 SEOBA Specifications

Table 8-58 Technical specifications of 40/80-channel SEOBA Board (C- Band)

Item Unit

Indices (40-channel

system)

Indices (80-channel

system)

SEOBA17/17 SEOBA22/20 SEOBA17/17 SEOBA22/20


nm 1529~1561

(C band)

1529~1561

(C band) 1529~1561 (C band)

1529~1561 (C band)



Item Unit

Indices (40-channel

system)

Indices (80-channel

system)


Total input power range

dBm -19 ~ 0 -21 ~-2 -19 ~ 0 -21 ~ -2

Input power range of the channel

dBm -32 ~-16 -32~ -18 -32 ~ -19 -32 ~ -21

Output power range of the channel

dBm -15~1 -10~4 -15~-2 -10~1

Total output power range

dBm -2~17 1~20 -5~17 -2~20

Max. total output power

dBm 17 20 17 20

Noise figure dB <6 <6 <6 <6


dB <0.5 <0.5 <0.5 <0.5

Pump leak at input

dBm <-30 <-30 <-30 <-30

Pump leak at output

dBm <-30 <-30 <-30 <-30

Input return loss

dB >40 >40 >40 >40

Output return loss

dB >40 >40 >40 >40

Channel gain dB 17 22 17 22

Max. bearable reflectance at input

dB <-30 <-30 <-30 <-30

Max. bearable reflectance at output

dB <-30 <-30 <-30 <-30

Gain flatness dB 2 2 2 2



Item Unit

Indices (40-channel

system)

Indices (80-channel

system)


Gain response time when channels are added or reduced (stable state)

ms <10 <10 <10 <10


ps <0.5 <0.5 <0.5 <0.5

8.7.2 EOBAH (Enhanced Optical Booster Amplifier) Specifications

Table 8-59 Technical specifications of 40/80-channel EOBAH Board (C-band)

Item Unit Indices (40/80-channel system)

EOBAH27/26 EOBAH24/24 EOBAH24/23


nm 1529~1561(C band) 1529~1561(C band) 1529~1561 (C band)


dBm -20 ~-1 -19~0 -20 ~-1


dBm -32~-17 (40 channel)

-32~-20 (80 channel)

-32~-16(40 channel)

-32~-19(80 channel)

-32~-17(40 channel)

-32~-20(80 channel)


dBm -5~10(40 channel)

-5~7(80 channel)

-8~8(40 channel)

-8~5(80 channel)

-8~7(40 channel)

-8~4(80 channel)


dBm 7~26(40 channel)

4~26(80 channel)

5~24(40 channel)

2~24(80 channel)

4~23(40 channel)

1~23(80 channel)


dBm 26 24 23

Noise figure dB <6 <6 <6


dB <0.5 <0.5 <0.5

Pump leak at input dBm <-30 <-30 <-30




EOBAH27/26 EOBAH24/24 EOBAH24/23

Pump leak at output dBm <-30 <-30 <-30

Input return loss dB >40 >40 >40

Output return loss dB >40 >40 >40

Channel gain dB 27 24 24


dB <-30 <-30 <-30


dB <-30 <-30 <-30

Gain flatness dB 8.8 2 8.9 2 8.10 2


ms <10 <10 <10


ps <0.5 <0.5 <0.5

8.10.1 EONA (Enhanced Optical Node Amplifier) and M2EONA

Specifications

Table 8-60 Technical specifications of 40/80-channel EONA with DCM


EONA25/20 EONA33/20 EONAH27/24


nm 1529~1561

(C-band)

1529~1561

(C-band)

1529~1561

(C-band)


dBm -29 ~ 0 -37 ~ -8 -27 ~ 2


dBm -35 ~ -16(40 channel)

-35 ~ -19(80 channel)

-37 ~ -24(40 channel)

-37 ~ -27(80 channel)

-35 ~ -14(40 channel)

-35 ~ -17(80 channel)


dBm -15 ~ 4(40 channel)

-15 ~1(80 channel)

-13 ~ 4(40 channel)

-13 ~ 1(80 channel)

-13 ~ 8(40 channel)

-13 ~ 5(80 channel)

Total output power dBm 1 ~ 20(40 channel) 1 ~ 20(40 channel) 5 ~ 24(40 channel)




EONA25/20 EONA33/20 EONAH27/24

range -2 ~ 20(80 channel) -2 ~ 20(80 channel) 2 ~ 24(80 channel)


dBm 20 20 24

Noise coefficient dB

Gain=20: ≤8.0

Gain=25: ≤6.5

Gain=30: ≤6.0

Gain=28: ≤6.5

Gain=33: ≤6.0

Gain=38: ≤6.0

Gain=22: ≤8.5

Gain=27: ≤7.5

Gain=32: ≤6.5


dB <0.5 <0.5 <0.5





Channel gain dB 20~30 24~38 22~32


dB <-30 <-30 <-30


dB <-30 <-30 <-30

Gain flatness dB 2 2 2


ms <10 <10 <10


ps <0.5 <0.5 <0.5

Table 8-61 Technical specifications of 40/80-channel M2EONA without DCM

Item Unit

Indices (40/80-channel system)

M2EONA18

/20

M2EONA25

/20

M2EONA31

/20

M2EONAH27

/24

M2EONAH27

/23


nm 1529~1561

(C-band)

1529~1561

(C-band)

1529~1561

(C-band)

1529~1561

(C-band)

1529~1561

(C-band)

Total input dBm -22~7 -29 ~ 0 -37 ~ -4 -27 ~ 2 -28~1



Item Unit


M2EONA18

/20

M2EONA25

/20

M2EONA31

/20

M2EONAH27

/24

M2EONAH27

/23

power range


dBm

-35 ~ -9(40

channel)

-35 ~ -12(80

channel)

-35 ~ -16(40

channel)

-35 ~ -19(80

channel)

-37 ~ -20(40

channel)

-37 ~ -23(80

channel)

-35 ~ -14(40

channel)

-35 ~ -17(80

channel)

-35~-15

(40 channel)

-35~-18

(80 channel)


dBm

-22 ~ 4(40

channel)

-22 ~1(80

channel)

-15 ~ 4(40

channel)

-15 ~1(80

channel)

-13 ~ 4(40

channel)

-13 ~ 1(80

channel)

-13 ~ 8(40

channel)

-13 ~ 5(80

channel)

-13 ~ 7(40

channel)

-13 ~ 4(80

channel)


dBm

1 ~ 20

(40 channel)

-2 ~ 20

(80 channel)

1 ~ 20

(40 channel)

-2 ~ 20

(80 channel)

1 ~ 20

(40 channel)

-2 ~ 20

(80 channel)

5 ~ 24

(40 channel)

2 ~ 24

(80 channel)

4 ~ 23

(40 channel)

1 ~ 23

(80 channel)


dBm 20 20 20 24 23

Noise coefficient

dB

Gain=13: ≤8.5

Gain=18: ≤6.5

Gain=23: ≤ 6.0

Gain=20: ≤6.0

Gain=25: ≤5.5

Gain=30: ≤5.5

Gain=24: ≤6.5

Gain=31: ≤5.5

Gain=38: ≤5.5

Gain=22: ≤7.0

Gain=27: ≤6.0

Gain=32: ≤5.5

Gain=22: ≤7.0

Gain=27: ≤6.0

Gain=32: ≤5.5


dB <0.5 <0.5 <0.5 <0.5 <0.5

Pump leak at input

dBm <-30 <-30 <-30 <-30 <-30

Pump leak at output

dBm <-30 <-30 <-30 <-30 <-30

Input return loss

dB >40 >40 >40 >40 >40

Output return loss

dB >40 >40 >40 >40 >40

Channel gain

dB 13~23 20~30 24~38 22~32 22~32

Max. bearable reflectance

dB <-30 <-30 <-30 <-30 <-30



Item Unit


M2EONA18

/20

M2EONA25

/20

M2EONA31

/20

M2EONAH27

/24

M2EONAH27

/23

at input


dB <-30 <-30 <-30 <-30 <-30

Gain flatness dB 2 2 2 2 2


ms <10 <10 <10 <10 <10


ps <0.5 <0.5 <0.5 <0.5 <0.5

Table 8-62 Technical specifications of 40/80-channel M2EONA with DCM

Item Unit


M2EONA1820 M2EONA25/

20

M2EONA31/

20

M2EONAH2

7/24

M2EONAH2

7/23


nm 1529~1561

(C-band)

1529~1561

(C-band)

1529~1561

(C-band)

1529~1561

(C-band)

1529~1561

(C-band)


dBm -22~7

-29 ~ 0 -37 ~ -4 -27 ~ 2 -28~1


dBm

-35 ~ -9(40 channel)

-35 ~ -12(80 channel)

-35 ~ -16(40 channel)

-35 ~ -19(80 channel)

-37 ~ -20(40 channel)

-37 ~ -23(80 channel)

-35 ~ -14(40 channel)

-35 ~ -17(80 channel)

-35~-15

(40 channel)

-35~-18

(80 channel)



-22 ~1(80

-15 ~ 4(40 channel)

-15 ~1(80

-13 ~ 4(40 channel)

-13 ~ 1(80

-13 ~ 8(40 channel)

-13 ~ 5(80

-13 ~ 7(40 channel)

-13 ~ 4(80



Item Unit



20

M2EONA31/

20

M2EONAH2

7/24

M2EONAH2

7/23

channel) channel) channel) channel) channel)


dBm

1 ~ 20(40 channel)

-2 ~ 20(80 channel)

1 ~ 20(40 channel)

-2 ~ 20(80 channel)

1 ~ 20(40 channel)

-2 ~ 20(80 channel)

5 ~ 24(40 channel)

2 ~ 24(80 channel)

4 ~ 23

(40 channel)

1 ~ 23

(80 channel)


dBm 20 20 20 24 23

Noise coefficient dB

Gain=13: ≤10.0

Gain=18: ≤8.0

Gain=23: ≤6.5

Gain=20: ≤8.0

Gain=25: ≤6.5

Gain=30: ≤6.0

Gain=24: ≤7.5

Gain=31: ≤6.0

Gain=38: ≤6.0

Gain=22: ≤8.5

Gain=27: ≤7.5

Gain=32: ≤6.5

Gain=22: ≤8.5

Gain=27: ≤7.5

Gain=32: ≤6.5


dB <0.5 <0.5 <0.5 <0.5 <0.5

Pump leak at input

dBm <-30 <-30 <-30 <-30 <-30

Pump leak at output

dBm <-30 <-30 <-30 <-30 <-30

Input return loss dB >40 >40 >40 >40 >40

Output return loss

dB >40 >40 >40 >40 >40

Channel gain dB 13~23 20~30 24~38 22~32 22~32


dB <-30 <-30 <-30 <-30 <-30


dB <-30 <-30 <-30 <-30 <-30

Gain flatness dB 2 2 2 2 2


ms <10 <10 <10 <10 <10



Item Unit



20

M2EONA31/

20

M2EONAH2

7/24

M2EONAH2

7/23


ps <0.5 <0.5 <0.5 <0.5 <0.5

Table 8-63 Technical specifications of 48/96-channel EONA Board (C-band)


EONA25/21 EONA33/21 EONA29/24

Operating wavelength range

nm 1529-1568 (extended C-band)

1529-1568 (extended C-band)

1529-1568 (extended C-band)

Total input power range dBm -29 ~ 1 -37~ -7 -30 ~ 0

Channel input power range

dBm

-35~-16(48 channel)

-35~-19(96 channel)

-37~-24(48 channel)

-37~-27(96 channel)

-35~-17(48 channel)

-35~-20(96 channel)

Channel output power range


-15~ 1(96 channel)

-9 ~4(48 channel)

-9 ~ 1(96 channel)

-11 ~ 7(48 channel)

-11 ~ 4(96 channel)

Total output power range dBm 1 ~ 21(48 channel)

-2 ~ 21(96 channel)

1 ~ 21(48 channel)

-2 ~ 21(96 channel)

4 ~ 24(48 channel)

1 ~ 24(96 channel)

Maximum total output power

dBm 21 21 24

Noise figure dB

Gain=20: ≤8.5

Gain=25: ≤6.5

Gain=30: ≤6.5

Gain=28: 6.5

Gain=38: 6.0

Gain=24: 7.0

Gain=34: 6.5

Polarization dependent loss

dB <0.5 <0.5 <0.5

Pump leakage at input dBm <-30 <-30 <-30

Pump leakage at output dBm <-30 <-30 <-30



Channel gain dB 20~30 28~38 24~34

Allowed maximum input reflectance

dB <-30 <-30 <-30




EONA25/21 EONA33/21 EONA29/24

Allowed maximum output reflectance

dB <-30 <-30 <-30


Gain response time while adding/reducing channels (stable status)

ms <10 <10 <10

Polarization mode dispersion

ps <0.5 <0.5 <0.5

8.10.2 HNA Specifications

Table 8-64 Technical Specifications of the HNA2020-WO Board


Hybrid amplifier

specifications

Operating wavelength

range nm 1529~1561

Typical gain range dB 15 to 25

Equivalent noise factor

dB

≤6 (15 dB Gain)

≤4.5 (17 dB Gain)

≤3.5 (20 dB Gain)

Gain flatness dB 2

Input power range of

the LINE port dBm –24 to 5

Maximum output power

of the OUT port dBm 20

Pump wavelength of the LINE port

nm 1420 to 1460

Pump optical power of the LINE port

mW ≤500

Polarization dependent

gain dB ≤0.5

Polarization mode

dispersion ps ≤0.5



RAMAN


range nm 1529 to 1561

Gain range dB

G.652: 5 to 6

LEAF: 5 to 8

LINE reflection factor dBm <-45

Pump wavelength nm 1420 to 1460

Maximum pump power mW ≤500

EDFA



Output power range of

the OUT port dBm

1~20(40 channel)

-2~20(80 channel)

Channel gain dB 9 to 19

Output reflection factor dB <-45

Table 8-65 Technical Specifications of the HNA2620-W Board


Hybrid amplifier

specifications


range nm 1529~1561



dB

≤6 (19 dB gain)

≤2 (26 dB gain)

≤1 (33 dB gain)

Gain flatness dB 2






nm 1420 to 1460


mW ≤750




gain dB ≤0.5

Polarization mode


RAMAN



Gain range dB

G.652: 8 to 11

LEAF: 8 to 13




EDFA




the OUT port dBm

1~20(40 channel)

-2~20(80 channel)



Table 8-66 Technical Specifications of the HNA2620-WO Board


Hybrid amplifier

specifications


range nm 1529~1561



dB

≤5 (19 dB gain)

≤3 (22 dB gain)

≤1 (33 dB gain)

Gain flatness dB 2






nm 1420 to 1460




mW ≤750


gain dB ≤0.5

Polarization mode


RAMAN



Gain range dB

G.652: 8 to 11

LEAF: 8 to 13




EDFA




the OUT port dBm

1~20(40 channel)

-2~20(80 channel)



8.10.3 SEOPA Specifications

Table 8-67 Technical specifications of 40/80-channel SEOPA Board (C-band)


SEOPA17/17 SEOPA22/17 SEOPA27/17

Channels allocation nm 1529~1561 1529~1561 1529~1561


dBm -19~0 -23~-4 -29~-10


dBm

-35 ~ -16

(40 channel)

-35 ~ -19

(80 channel)

-35 ~ -20

(40 channel)

-35 ~ -23

(80 channel)

-35 ~ -26

(40 channel)

-35 ~ -29

(80 channel)




SEOPA17/17 SEOPA22/17 SEOPA27/17


dBm

-18~ 1(40 channel)

-18~ -2 (80

channel)

-13~1(40 channel)

-13~ -2 (80

channel)

-8~1(40 channel)

-8~-2(80 channel)


dBm -2~17(40 channel)

-5~17(80 channel)

-2~17(40 channel)

-5~17(80 channel)

-2~17(40 channel)

-5~17(80 channel)


dBm 17 17 17

Noise coefficient dB <5.5 <5.5 <5.5


dB <0.5 <0.5 <0.5





Channel gain dB 17 22 27


dB <-30 <-30 <-30


dB <-30 <-30 <-30



ms <10 <10 <10


ps <0.5 <0.5 <0.5

8.10.4 RAMAN Specifications

The DRA_P board applies RAMAN amplifier to amplify the optical signals, and its

specifications are listed in Table 8-68.



Table 8-68 Technical specifications of RAMAN_P amplifier

Item Unit Parameters

Type counter propagating distributed pump

Channels allocation nm 1529~1561

Pump power mW ≤750

Type of output connector LC/UPC, E2000/APC

gain (G652) dB 10/10/10

gain (LEAF) dB 12/12/12

gain (TW RS) dB 13/13/13

equivalent noise figure (G652) dB 0/0/0

equivalent noise figure (LEAF) dB -1/-1/-1

equivalent noise figure (TW RS) dB -1.5/-1.5/-1.5

Associated polarization loss dB <0.5

Note: C band amplifier module pump wavelength: 1421.5/1455.0nm and 1425/1440/1456nm; L band amplifier module

pump wavelength: 1439.0/1495.0nm.

The DRA_B board applies RAMAN amplifier to amplify the optical signals, and its

specifications are listed inn Table 8-69.

Table 8-69 Technical specifications of RAMAN_B amplifier


Type Co-propagating distributed pump

Pump wavelength nm 1420~1470

Pump power mW 850

Band gain(G.652) dB 1-6

Noise figure dB <1

Polarization dependent loss dB <0.2

Input return loss dB >45

Output return loss dB >45

Gain flatness dB <4

Polarization mode dispersion ps <0.5




Insertion loss dB <1.5

8.10.5 RPOA Specifications

RPOA amplifier technical specifications are listed in Table 8-70.

Table 8-70 Technical specifications of RPOA amplifier

Item RPOA with GFF sub-system RPOA without GFF sub-system


1529~1561nm 1546~1561nm

Noise coefficient

<7dB <6dB

Gain >17dB >19.5dB

Gain flatness

<4dB <4dB


-44～-18dBm -44～-18dBm

Working temperature range

-40～65°C （RGU），

-10～60°C（RPU）

-40～65°C (RGU)

-10～60°C(RPU)

Storage temperature range

-40～85°C -40～85°C

Notes: RPOA subsystems without Gain Flatness Filter (GFF) meet the requirements of systems with capacity below 16

wavelengths, while RPOA subsystems with GFF meet the requirements of systems with capacity of 40 wavelengths.

8.10.6 LAC Specifications

Technical specifications of LAC board are listed in Table 8-71

Table 8-71 Technical specifications of LAC board





Application wavelength range nm

1529~1561(C band)

1529~1568(CE band)

1570~1605(L band)

Input power detection range dBm -39 to +20

Output power detection range dBm -40 to +18

Optical power detection Precision dB ≤±0.5

Attenuation adjustment precision dB ≤±0.5

Attenuation adjustment step length dB ≤±0.2

Attenuation adjustment range dB ≥20

Attenuation adjustment rate dB ≤10

8.10.7 SFP VOA Specifications

Table 8-72 Technical specifications of SFP VOA modules

Parameter Min Max Unit

Operating Optical Input Power

without PD -35 +26 dBm

with input PD -35 5 dBm

with output PD -10 26 dBm

Insertion Loss(without tap monitor)

Insertion Loss(with tap monitor)

1.5

2.5

dB

dB

Wavelength range （Note1） 1528 1562 nm

Wavelength Dependence Loss Pk-Pk over 1528-1562 nm wavelength range)

@ IL dB attenuation 0.4 dB

@ 5dB attenuation 0.4






Guaranteed Attenuation Dynamic Range 20 dB

Attenuation Step Resolution 0.1 dB

Attenuation Accuracy @1528-1562 nm wavelength range

Without PD @ 0 dB≤ Att. ≤10dB -0.7 0.7 dB

Without PD @ 10 dB< Att. ≦20dB -1.5 1.5

With PD @ 0 dB≤ Att. ≤10dB -0.8 0.8

With PD @ 10 dB< Att. ≦20dB -1.6 1.6

Input Power Monitor Accuracy

-35dBm≤ P ≤-15dBm -1 1 dB

-15dBm＜ P ≤5dBm -0.5 0.5

Output Power Monitor Accuracy

-10dBm≤ P ≤ 10dBm -1 1

10dBm＜ P ≤26dBm -0.5 0.5

Polarization Dependence Loss

0 dB≤ Att. ≤10dB 0.5 dB

10 dB＜ Att. ≦20dB 0.8 dB

Chromatic Dispersion -0.05 0.05 ps/nm

Polarization Mode Dispersion 0.1 ps

Return Loss 40 dB

Block Attenuation Loss 35 dB



Note: There are three types VOA-SFP modules, they are SFP-VOA-B-N(Power off state: Bright No Power Detector ),

SFP-VOA-B-IPD(Power off state: Bright With Input Power Detector Tap coupling：5%) and SFP-VOA-B-OPD(Power off

state: Bright With Output Power Detector Tap coupling：1%.)

8.11 Protection Board Specifications

8.11.1 SOP Specifications

Table 8-73 Technical specifications of SOP board


Working wavelength nm 1280 ~ 1625

Insertion loss

T1_I→T1_O1 dB <4.4 (1510 nm ~1625 nm)

<5.0 (1280 nm ~1510 nm)

T2_I→T2_O1 <4.4 (1510 nm ~1625 nm)

<5.0 (1280 nm ~1510 nm)

T1_I→T1_O2 <4.4 (1510 nm ~1625 nm)

<5.0 (1280 nm ~1510 nm)

T2_I→T2_O2 <4.4 (1510 nm ~1625 nm)

<5.0 (1280 nm ~1510 nm)

R1_I1→ R1_O <2.1 (1510 nm ~1625 nm)

<2.7 (1280 nm ~1510 nm)

R2_I1→ R2_O <2.1 (1510 nm ~1625 nm)

<2.7 (1280 nm ~1510 nm)

R1_I2→ R1_O <2.1 (1510 nm ~1625 nm)

<2.7 (1280 nm ~1510 nm)

R2_I2→ R2_O <2.1 (1510 nm ~1625 nm)

<2.7 (1280 nm ~1510 nm)

Reflectance dB >40


Input optical power mW <200

Switching time ms <50



8.12 Optical Supervisory Channel Board Specifications

Table 8-74 Technical specifications of OSC board


Optical signal format 100BASE-FX

Working wavelength nm 1510±10

Signal coding 4B/5B

Supervision rate 100

Signal transmission power dBm -3 to +2 +2 to +7 +3 to +10

Minimum receiving sensitivity dBm -37 -37 -43

Note: The specification of the table is the EOL data

8.13 Optical Layer Management Subsystem

Specifications

8.13.1 EOPM Board Specifications

For the technical specifications of the EOPM board with channel spacing of 50 GHz, refer

to Table 8-75. For the technical specifications of the EOPM board with channel spacing

of 100 GHz, refer to Table 8-76.

Table 8-75 Technical Specifications of the EOPM Board (50 GHz)

Item Specification

Wavelength range (nm) 1529 to 1561 (C band)

1570 to 1605 (L band)

1529 to 1568 (CE band)

Wavelength detection range (nm) ±0.05

Input power range (dBm) –45 to –15

Power detection precision (dBm) ±1.5

OSNR range (dB) ≤ 25

OSNR detection precision (dB) ±1.5



Item Specification

Input return loss (dB) 30

Signal detection time (s) ≤ 1

Table 8-76 Technical Specifications of the EOPM Board (100 GHz)

Item Specification


1570 to 1605 (L band)

1529 to 1568 (CE band)





OSNR detection precision (dB) ±1.5



8.13.2 EOPM Board (type C) Specifications

For the technical specifications of the EOPM (type C) board refer to Table 8-77.

Table 8-77 Technical Specifications of the EOPM (type C) Board

Item Specification






OSNR detection precision (dB) ±1.5 @ OSNR ＜ 20dB

±2 @ 20dB ≤OSNR ＜ 25dB





8.13.3 EOWM Board Specifications

For the technical specifications of the EOWM board, refer to Table 8-78.

Table 8-78 Technical Specifications of the EOWM Board

Item Specification


1570 to 1605 (L band)

1529 to 1568 (CE band)


Wavelength offset capture range

(GHz)

–5 to +5

Wavelength offset alarm range (GHz) > ±5

8.13.4 OFM Board Specifications

Table 8-79 Technical Specifications of the OFM Board


Working band nm 1625

Dynamic range @25℃ dB 37

@-10~55℃ dB 35

Event dead zone m 5(maximum)

Attenuation dead zone m 20(maximum)

Distance measurement accuracy m ± (1+ 10-5 × measurement distance + sampling resolution)

Linearity dB/dB ±0.05

Sampling resolution m 0.05

Loss threshold dB 0.01

Loss accuracy dB 0.01



8.13.5 OFMF Board Specifications

Table 8-80 Technical Specifications of the OFMF Board


Transmission band nm 1480–1563

Reflection band nm 1600–1650

Insertion Loss of reflection dB ≤1.2

Insertion Loss of transmission dB ≤1.0

Isolation of transmission to reflection

dB ≥40

Isolation of reflection to transmission

dB ≥40

Optical Return Loss dB ≥45

Directivity dB ≥60

IL ripple dB ≤0.3

PMD ps ≤0.1

PDL dB ≤0.1

Optical power mW ≤500

Operation Temperature ℃ -15~+75

Relative Humidity %RH 5~95

Storage Temperature ℃ -40~+85

8.14 DCM Specifications

Table 8-81 Technical specifications of DCM module (G.652 fiber)

Item Compensation

distance (km)

Max. insertion loss

(dB) DGD (ps)

DCM20 20km dB 2.5 <0.6

DCM40 40km dB 4 <0.8

DCM60 60km dB 6 <1.0



Item Compensation

distance (km)

Max. insertion loss

(dB) DGD (ps)

DCM80 80km dB 7 <1.1

DCM100 100km dB 8 <1.2

DCM120 120km dB 10 <1.2

Table 8-82 Technical specifications of DCM module (G.655 LEAF fiber)

Item Compensation

distance (km)

Max. insertion loss

(dB) DGD (ps)

DCM20 20km dB 2 <0.45

DCM40 40km dB 4 <0.60

DCM60 60km dB 5 <0.75

DCM80 80km dB 6 <0.80

DCM100 100km dB 7 <0.90

DCM120 120km dB 8 <1.0

8.15 Physical Specification and Environmental

Requirements

8.15.1 Structure Indices

The dimensions and weight of ZXONE 8000 system are shown in Table 8-83.

Table 8-83 Dimensions and Weight of ZXONE 8000

Components Dimensions Weigh

t (kg)

Unified cabinets of ZTE transmission equipment

2,000 mm (H) × 600 mm (W) × 300 mm (D) 58.50

2,200 mm (H) × 600 mm (W) × 300 mm (D) 64.50

2,600 mm (H) × 600 mm (W) × 300 mm (D) 76.00

Cabinet for CX71 2,200 mm (H) × 600 mm (W) × 600 mm (D) 100



Components Dimensions Weigh

t (kg)

2,600 mm (H) × 600 mm (W) × 600 mm (D) 110

CX20 447 mm (H) x 535 mm (W) x 275 mm (D) 16

CX30 897 mm (H) x 535 mm (W) x 275 mm (D) 26

CX50 1347 mm (H) x 535 mm (W) x 275 mm (D) 35

CX22 447 mm (H) x 535 mm (W) x 275 mm (D) 16

CX21 447 mm (H) x 535 mm (W) x 275 mm (D) 16

CX31 897 mm (H) x 535 mm (W) x 275 mm (D) 26

CX51 1347 mm (H) x 535 mm (W) x 275 mm (D) 35

CX71 1797 mm (H) x 533 mm (W) x 547 mm(D) 88

Transmission sub-rack(NX4) 422 mm (H) × 533mm (W) × 286 mm (D) 12.50

Transmission Sub-rack(NX41)

447 mm (H) × 535mm (W) × 275 mm (D) 16

Distributed sub-rack(DX41) 447 mm (H) × 535mm (W) × 275 mm (D) 16

Power supply distribution box 88.1 (H) × 535 (W) ×258 (D) 3.8

ODF sub-rack 88 mm (H) × 482.6 mm (W) × 269.5 mm (D) 6.50

DCM chassis 47 mm (H) × 533 mm (W) × 286.5 mm (D) 5.60

Conversion bracket 29.6mm (H) × 345.6mm (W) 0.30

Fan unit 30 mm (H) × 122.9 mm(W) × 276.8mm(D) 0.68

43.6mm (H) ×490.5mm (W) ×256 mm(D) 3.7

Full-height board

PCB:320 mm (W) × 210 mm (D)

Front panel: 345.6 mm (H) × 29.8 mm (W)

For the weight of each board, refer to following table.

Semi-height board

PCB:152 mm (W) × 210 mm (D)

Front panel: 155.6 mm (H) × 25.1 mm (W)

Note: The cabinet weight refers to the empty cabinet.

The board weight of ZXONE 8000 is shown in Table 8-84



Table 8-84 ZXONE 8000 Board Weight

Board ID Board Description Weight

(kg)

Slot

occupat

ion

SNP Net control processor 0.60 1

SNPB Net control processor (type B) 1.48 1

SCC Semi-height Communication Control Board

0.47 1

CCP Subrack Management Board 0.7 1

TIS Time interface supply Board 0.5 1

ETI Extended Timing Interface Board 0.66 1

EIC EIC Extended Interface (type C) 0.5 1

EID EID Extended Interface (type D) 1.34 1

CLK Clock Board 0.7 0.5

CLKC Clock Board(type C) 3 1

FCC Fan Board (type C) 3.7 -

FCE Fan Board (type E) 2.2 -

XCA Switching Board(type A) 1.85 1

XCC Switching Board(type C) 8 1

SPWA Semi-height Power Supply Board (type A)

1.80 1

PWD Power Supply Board (type D) 1.05 1

PWE Power Supply Board (type E) 0.85 1

PWF Power Supply Board (type F) 2.4 -

SEIA Semi-height Extension Interface Board

0.45 -

SOSC Semi-height Optical Supervision

Channel Board 0.60

1

SOSCB Optical supervision channel board for Fast Ethernet

0.5 1

SOP Semi-height Optical Protection

Board 0.60

1

SOPMS Semi-height OpticalProtection

Board for Mux Section 0.60

1




(kg)

Slot

occupat

ion

OMCP Optical Multi-Channel Protection 1.25 2

OTU Optical Transparent Unit 1.55 2

SOTU2.5G Semi-height Optical Transponder

Unit for 2.5 Gbit/s 0.60

1

SOTU10G Semi-height OTU 10Gb/s Transceiver 0.70 1

OTU10G Optical Transponder Unit for 10Gb/s 1.65 2

EOTU10G Enhanced Optical Transponder Unit for 10 Gbit/s

1.65 2

EOTU10GB Type B Enhanced Optical Trans- ponder Unit for 10 Gbit/s

1.65 2

TST3 (using DPSK module)

Optical Transponder Unit for 40Gb/s 3.5 4

TST3 (using DQPSK module)


TST3 (using PM-QPSK module)


TS4 Single-channel 100Gb/s Optical Channel Transport Unit

5.5 4

TS4(Regeneration)

Single-channel 100Gb/s Optical Channel Transport Unit

5 4

MQT3 (using DPSK module)

Four 10G Sub Rate Mux Board 3.25 4

MQT3 (using DQPSK module)


MQT3 (using PM-QPSK module)


MX2 Ten 10G SubRate Mux Unit 3.5 6

SDSA Compact Data Service Aggregation Board 0.6 1

DSAF Data Service Aggregation with FEC 1.4 2




(kg)

Slot

occupat

ion

DSA Data Service Aggregation Board 1.6 2

FCA FC service Access unit 1.5 2

MOM2 Eight GE/FC Muxponder 1.5 2

SRM42 Four 622M/155M SubRate Mux Board 1.25 2

SRM41 Four 2.5G SubRate Mux Board 1.25 2

ASMA Aggregation Switch Muxponder (Type A) 0.6 4

ASMB Aggregation Switch Muxponder (Type B) 0.6 2

CS4 Client board with single port 2.2 2

CD3 Client board with 2 ports 1.4 1/2

CS3 Client board with single port 2.325 1

CX2 Client board with 10 ports 1.94 1

CO2 Client board with 8 ports 2.1 1

CQ2 Client board with 4 ports 1.78 1

CD2B Client board with 2 ports 1.7 1

CH1 Client board with 16 ports 1.9 1

CO1 Client board with 8 ports 1.66 1

EHG1 16*GE Aggregation Switch board(Client side)

1.725 1

EQG2 4*10GE Aggregation Switch board (Client side)

1.625 1

ESG4 1*10GE Aggregation Switch board (Client side)

2.6 1

LS4(2 slots) Line board with single port: OTU4 level 3.5 2

LS4(1 slots) Line board with single port: OTU4 level 3.5 1

LS3(2 slots) Line board with single port: OTU3 level ( 2 slots)

3.25 2

LS3(DPSK)(1 slot)

Line board with single port: OTU3 level (1slot)

2.225 1

LS3(DQPSK)(1 slot)

Line board with single port: OTU3 level (1slot)

2.32 1

LS3(PM-QPS Line board with single port:OTU3 level 2.32 1




(kg)

Slot

occupat

ion

K)

LO2 Line board with 8 ports: OTU2 level 2.1 1

LO2B Line board with 8 ports (Type B): OTU2 level

2.3 1

LO2C Line board with 8 ports (Type C): OTU2 level

3.05 2

LQ2 Line board with 4 ports: OTU2 level 1.8 1

LD2B Line board with 2 ports: OTU2 level 1.95 1

TD2C Transponder of 2 ports 10Gb/s 0.7 1

MQA2 Muxponder of 4 ports any rate to OTU2 0.6 1

MQA1 Muxponder of 4 ports any rate to OTU1 0.6 1

MJA Muxponder of 6 ports any rate to main board

0.5 1

SSDM Semi-height Supervisory Division Multiplexing Board

0.60 1

EONA Enhanced Optical Node Amplifier 2.00 4

M2EONA M2 Enhanced Optical Node Amplifier 1.30 2

HNA Hybrid node amplification board 2.00 4

SEOBA Enhanced Optical Booster Amplifier 0.60 1

SEOPA Enhanced Optical Pre-Amplifier 0.60 1

EOBAH Enhanced Optical Booster Amplifier 2.20 4

EONAH Enhanced Optical Node Amplifier 2.20 4

DRA_P Distributed Raman Amplifier 2.00 4

DRA_B 2.00 -

RPU Remote Pump Unit 2.00 4

RGU Remote Gain Unit 0.50 -

LAC Line Attenuation Compensator 1.10 2

SOGMD Semi-height Optical Group Mux/DeMux Board

0.60 1

SOGMDB Semi-height Optical Group Mux/DeMux Board(Type B)

0.50 1




(kg)

Slot

occupat

ion

SOAD1 Semi-height Optical Adding/Dropping Board of 1 Wavelength

0.60 1


0.60 1


0.60 1

OMU Optical Multiplexing Unit 1.60 4/8

ODU Optical De-Multiplexing Unit 1.60 4/8

ODUB Optical De-Multiplexing Unit(B Type) 1.60 4/8

OCI Optical Channel Interleaver 1.95 4

M2OCI Optical Channel Interleaver 1.95 1

VMUX Variable Insertion Loss Multiplexer 2.10 4

VMUXB Variable Insertion Loss Multiplexer(B Type) 2.10 4

PDU Power Distribution Unit 1.40 2

WBU Wavelength Blocking Unit 2.60 4

WSU Wavelength Selective Unit 2.60 4

WSUB Wavelength Selective Switch Unit (Type B) 3.00 4

WSUBT20D Wavelength Selective Switch Unit (Type B) with twin port 20 & loopback port

4.00 4

WBM Wavelength Blocking Multiplexer 2.10 4

OPM Optical Performance Monitor 1.15 4

EOPM Enhanced Optical Channel Performance Monitor

0.96 2

EOPM (C) Optical performance monitoring board(type C)

1.3 4

OFM Optical Fiber Monitor 1.48 4

OFMF Optical Fiber Monitor Filter 0.96 2

OWM Optical Wavelength Monitor 1.10 2

EOWM Enhanced Optical Wavelength Monitor Board

0.9 2

DCU Dispersion Compensation Board 0.55 -



8.15.2 Power Supply Indices

The Power supply of ZXONE 8000 system is shown in Table 8-85.

Table 8-85 The power supply of ZXONE 8000

Standard working

voltage -48V DC /-60V DC

Working voltage range -60V DC~-36V DC/-70V DC~-50V DC

Power consumption for full configuration

1644 W (CX20)

3278 W (CX30)

4462.8W (CX50)

14868 W (CX71)

4677W (CX51)

2997W (CX31)

1368 W (CX21)

998 (CX22)

871W (DX41)

871W (NX41)

751 W (NX4)

Rated current

50A (transmission sub-rack)

50A (distributed cross-connect sub-rack)

50A (ZXONE 8000 CX20 cross-connect sub-rack)

50A×2 (ZXONE 8000 CX30 cross-connect sub-rack)

50A×3 (ZXONE 8000 CX50 cross-connect sub-rack)

50A×8(ZXONE 8000 CX71 cross-connect sub-rack)

50A×3 (ZXONE 8000 CX51 cross-connect sub-rack) 50A×3 (ZXONE 8000 CX31 cross-connect sub-rack) 50A (ZXONE 8000 CX21 cross-connect sub-rack)

50A (ZXONE 8000 CX22 cross-connect sub-rack)

The board power consumption of ZXONE 8000 is shown in Table 8-86



Table 8-86 board power consumption of ZXONE 8000 equipment

Board

Unit Name Max. power

consumption

in normal

temperature

(25C) (W)

OTU 2.5G optical transfer unit 14

SOTU Semi-height Optical Transponder Unit for 2.5Gbit/s

14

OTUF 2.5G optical transfer unit with FEC 14

SOTU10G Semi 10G optical transfer unit with FEC/FEC 25

SOTU10G(regenerator)

Semi 10G optical transfer unit with FEC/FEC 20

EOTU10G Enhanced 10G optical transfer unit with FEC/FEC

28

EOTU10G(regenerator)

Enhanced 10G optical transfer unit with FEC/FEC

21

EOTU10GB Enhanced optical Transponder Unit 10G B Type

28

EOTU10GB(regenerator)

Enhanced optical Transponder Unit 10G B Type

21

TST3 40G optical transfer unit with FEC/AFEC 90

TST3 (regenerator) 40G optical transfer unit with FEC/AFEC 79

TST3(PM-QPSK) 40G optical transfer unit 110

TS4 Single-channel 100Gb/s Optical Channel Transport Board

179

MX2(no SFP++) Ten 10G Sub Rate Mux Board 160

MX2(with SFP++) Ten 10G Sub Rate Mux Board 175

MQT3 Four 10G SubRate Mux Board 120

MQT3(PM-QPSK) Four 10G SubRate Mux Board 140

SRM41 Four 2.5G SubRate Mux Board 33

SRM42 Four 622M/155M SubRate Mux Board 20

FCA FC service Access unit 40

MOM2 Eight GE/FC Muxponder 52



Board


consumption

in normal

temperature

(25C) (W)

ASMA Aggregation Switch Muxponder (Type A) 80

ASMB Aggregation Switch Muxponder (Type B) 80

SDSA Compact Data Service Aggregation Board 25

DSAF Data Service Aggregation

with FEC 22

DSA Data Service Aggregation

Board 25

TD2C Transponder of 2 ports 10Gb/s 25

MQA2 Muxponder of 4 ports any rate to OTU2 28

MQA1 Muxponder of 4 ports any rate to OTU1 28

MJA Muxponder of 6 ports any rate to main board 28

CS4 Client board with single port 100

CD3 Client board with 2 ports 101

CS3 Client board with single port 70

CX2 Client board with 10 ports 116

CO2 Client board with 8 ports 90

CQ2 Client board with 4 ports 50.9

CD2B Client board with 2 ports 42.2

CH1 Client board with 16 ports 48.5

CO1 Client board with 8 ports 32.48

EHG1 16*GE Aggregation Switch board(Client side) 107

EQG2 4*10GE Aggregation Switch board (Client side) 101.5

ESG4 4*10GE Aggregation Switch board (Client side) 130

LS4(2 slots) Line board with single port: OTU4 level 172

LS4(1 slots) Line board with single port: OTU4 level 165

LS3(2 slots) Line board with single port: OTU3 level( 2 slots)

84 (DPSK)

93 (DQPSK)

113(PM-QPSK)



Board


consumption

in normal

temperature

(25C) (W)

LS3(1 slot) Line board with single port: OTU3 level (1slot)

80(DPSK)

86(DQPSK)

106(PM-QPSK)

LO2 Line board with 8 ports:OTU2 level 101

LO2B Line board with 8 ports(Type B):OTU2 level 92.58

LO2C Line board with 8 ports(Type C):OTU2 level 178

LQ2 Line board with 4 ports: OTU2 level 50.9

LD2B Line board with 2 ports: OTU2 level 53

OMU OM board TFF/AWG 3(TFF)/13.2(AWG)

ODU OD board TFF/AWG 3(TFF)/13.2(AWG)

ODUB Optical De-Multiplexing Unit

(B Type) 38

VMUX Variable insertion loss Multiplexer 30

VMUXB Variable Insertion Loss Multiplexer (B Type) 30

OCI Optical Channel Interleaver 3

M2OCI Optical Channel Interleaver 3

OBM Optical broadband multiplexer 3

SOAD4 Compact Optical Add/ Drop Board of 4 Wave

length 5

SOGMDB Semi-height Optical Group Mux/DeMux Board (Type B)

5

WBU Wavelength Blocking Unit 15

WBM Wavelength Blocking Unit 35

WSU Wavelength Blocking Unit 15

WSUB Wavelength Selective Switch Unit (Type B) 28

WSUBT20D Wavelength Selective Switch Unit (Type B) with twin port 20 & loopback port

28



Board


consumption

in normal

temperature

(25C) (W)

PDU Power Distribution Unit 3

SSDM supervisory add/drop multiplexer board 4

SEOBA Enhanced Optical Booster Amplifier 14

EOBAH

Enhanced Optical power amplifier 30 (EOBAH24/24)

Enhanced Optical power amplifier 40 (EOBAH27/26)

SEOPA Enhanced Optical PreAmplifier 11

EONA Enhanced Optical node amplifier 25

M2 EONA M2 Enhanced Optical node amplifier 19.2

HNA Hybrid node amplification board 50

EONAH Enhanced Optical node amplifier 40

RPU Remote Pump Unit 45

RGU Remote Gain Unit 0

DRA Distributed Raman amplifier 35

LACT Line attenuation control board (terminal) 3

LACG Line attenuation control board (generator) 3

SOP Optical protection board 5

OMCP Optical Protect for Mux Section 5

OPM Optical performance monitoring board 5

EOPM Enhanced Optical Channel

Performance Monitor 10

EOPM (C) Optical performance monitoring board(type C) 15

OFM Optical Fiber Monitor 12

OFMF Optical Fiber Monitor Filter 6

OWM Optical Wavelength Monitor 3

EOWM Enhanced Optical Wavelength Monitor Board 10

SOSC Optical supervision channel board 12

SOSCB Optical supervision channel board for Fast 18



Board


consumption

in normal

temperature

(25C) (W)

Ethernet

SNP Net control processor 10

SNPB Net control processor (type B) 60

SCC Communication Control Board 10

CCP Subrack Management Board 18

TIS Time interface supply board 15

EIC EIC Extended Interface (type C) 15

EID EID extended interface(type D) 35

ETI Extended Timing Interface Board 11.5

CLK Clock board 13

CLKC Clock board(type C) 80

SEIA Extension Interface Board 5

SPWA Power Board (A-type) 28

PWD Power Supply Board (type D) 5.8

PWE Power Supply Board (type E) 10

PWF Power Supply Board (type F) 22.5

SFANA Compact Fan Board 10

FCC Fan Board(type C) 67

FCE Fan Board(type E) 264

XCA Switching Board(type A) 55

XCC Switching Board(type C) 450

8.15.3 Heat Dissipation

P=UI

Heat dissipation (W)= power consumption(W)*0.82

Heat dissipation (BTU/hour) =Power consumption (W)*0.82*3.413



8.16 Grounding Requirements

8.16.1 Internal grounding requirements of the equipment

The boards and shielding boards are reliably contacted with the equipment shell via

the panel; there is no electrical connection inside the boards.

The rack and sub-rack shell are connected with the protective ground.

8.16.2 Grounding requirements of equipment room

AC working ground resistance ≤4Ω

DC working ground resistance ≤4Ω

Safe protective ground resistance ≤4Ω

Lightening protection ground resistance ≤4Ω

Joint ground resistance ≤1Ω

If the equipment room provides working ground and protective ground separately,

the working ground and protective ground should be connected to corresponding

grounding copper bars; if the equipment only provides one grounding copper bar,

the working ground and protective ground can be grounded jointly. The ground

resistance should meet the above requirements.

8.17 Temperature and Humidity Requirements

Table 8-87 Temperature and humidity requirements of ZXONE 8000 Equipment

Item Specification

Ambient temperature

Long-term working specification

0℃~+45℃

Short-term working specification

-5℃~+50℃



Item Specification

Relative humidity (35℃)

Long-term working specification

10%~90%

Short-term working specification

5%~95%

Note: In a normal operating environment, the temperature and humidity should be measured on the point 1.5m above

the floor and 0.4m before the equipment. The short-term operating condition refers to the case in which non-stop

operations are no more than 96 hours, or 15 days in total annually.

8.18 Requirements for Cleanness

The equipment room should be free of explosive, conductive, magnetic conductive and

corrosive dusts.

The concentrations of mechanical active substances should comply with the

requirements in Table 8-88

Table 8-88 Requirements for concentrations of mechanical active substances

Mechanical active

substance Content

Dust particles ≤3×105 particles/m3

Floating dust ≤0.2 mg/m3

Settling dust ≤15mg/m2·h

Sand ≤100mg/m3

The concentrations of chemical active substances should comply with the requirements

in Table 8-89:

Table 8-89 Requirements for concentrations of chemical active substances

Chemical active

substance Content

SO2 ≤0.30 mg/m3

H2S ≤0.10 mg/m3

NO2 ≤0.50 mg/m3



Chemical active

substance Content

NH3 ≤3.00 mg/m3

Cl2 ≤0.10 mg/m3

HCl ≤0.10 mg/m3

HF ≤0.01 mg/m3

O3 ≤0.05 mg/m3

NOX ≤0.5 mg/m3

8.19 Dust-Proof and Corrosion-Proof Requirements

According to GB4798 and application scope of ZXONE 8000 products, the dust-proof

and corrosion-proof requirements are as follows:

Storage condition: 1K5/1Z1/1B2/1C2/1S3/1M3, the storage duration is 180 days.

Transportation condition: 2K4P/2B2/2C2/2S3/2M3, the transportation duration is 30

days.

Usage condition: 3K5/3Z2/3Z7/3B2/3C2/3S2/3M3, the usage duration is 20 years.



9 Compliant Standards

Standard/

Recommendation Title

ITU-T G.652 Characteristics of a single-mode optical fiber and optical cable

ITU-T G.653 Characteristics of Dispersion-Shifted Single-Mode Fiber

ITU-T G.655 Characteristics of Non-Zero Dispersion-Shifted Single-Mode Fibers

ITU-T G.661 Definition and test methods for the relevant generic parameters of optical amplifier devices and subsystems

ITU-T G.662 Generic characteristics of optical fiber amplifier devices and subsystems

ITU-T G.663 Application related aspects of optical amplifier devices and subsystems

ITU-T G.664 Optical safety procedures and requirements for optical transport systems

ITU-T G.665

Definitions and Test Methods for Generic Characteristics Amplifiers

and Raman Amplified Subsystems

ITU-T G.671 Transmission characteristics of passive optical components

ITU-T G.681 Functional characteristics of interoffice and long-haul line systems using optical amplifiers, including optical multiplexing

ITU-T G.691 Optical interfaces for single channel STM-64, STM-256 systems and other SDH systems with optical amplifiers

ITU-T G.692 Optical interface for multichannel systems with optical amplifiers

ITU-T G.693 Optical interfaces for intra-office systems

ITUT-T G.694.1 Spectral grids for WDM application: DWDM frequency grid

ITU-T G.696.1 Optical transport network physical layer interfaces

ITU-T G.697 Optical monitoring for DWDM systems

ITU-T G.707 Network Node Interface for the SDH equipment

ITU-T G.709 Interfaces for the Optical Transport Network

ITU-T G.709-2003 Optical Transport Network (OTN) Interfaces

ITU-T G.783 Characteristics of synchronous digital hierarchy (SDH) equipment



Standard/


functional blocks

ITU-T G.798 Characteristics of optical transport network hierarchy equipment functional blocks

ITU-T G.8201 Error performance parameters and objectives for multi-operator international paths within the Optical Transport Network (OTN)

ITU-T G.825 The control of jitter and wander within digital networks which are based on the synchronous digital hierarchy (SDH)

ITU-T G.8251 The control of jitter and wander within the optical transport network (OTN)

ITU-T G.826 Error performance parameters and indexes for international, constant bit rate digital paths at or above the primary group

ITU-T G.828 Optical input jitter and wander control based on the synchronous digital hierarchy (SDH)

ITU-T G.841 Types and characteristics of SDH network protection architectures

ITU-T G.872 Architecture of optical transport networks

ITU-T G.873.1 The APS protocol and protection switching operation for the linear protection schemes for the Optical Transport Network at the Optical Channel Data Unit (ODUk) level

ITU-T G.874 Management aspects of the Optical Transport Network Element containing transport functions of one or more of the layer networks of the optical transport network.

ITU-T G.957 Optical interfaces for SDH equipment and systems

ITU-T G.959.1 Optical transport networks physical layer interfaces

ITU-T G.975 Forward Error Correction for Submarine Systems

G.975.1 Forward error correction for high bit rate DWDM submarine systems

IEEE Std 802.3 Carrier sense multiple access with collision detection (CSMA/CD) access method and physical layer specification

IEEE 802.3-2002 Carrier wave interception multi-address access method with collision test and physical layer characteristics

EMC, Safety and Environmental Standard

EMC Standard: EMI Standard---CISPR22 (EN55022)



Standard/


EN50082-1: 1992 or EN55024: 1998 (Mandatory by 1 July 2001) (EN61000-4-2, 3, 4, 5, 6 series)

EN 55022 Information technology equipment-Radio disturbance characteristics-Limits and methods of measurement

ETSI EN 300 132-2 Equipment Engineering (EE): Power supply interface at the input to telecommunications equipment Part 2: Operated by direct current (dc)

ETSI EN 300 386 Electromagnetic compatibility and Radio spectrum Matters (ERM) Telecommunication network equipment; ElectroMagnetic Compatibility (EMC) requirements

ETSI ES 201 468

Electromagnetic compatibility and Radio spectrum Matters (ERM) Additional ElectroMagnetic Compatibility (EMC) telecommunications equipment for enhanced availability of service in specific applications

ETSI EN 300 253 Environmental Engineering (EE) Earthing and bonding configuration inside telecommunications centres

EN 61000-4-29 Electromagnetic compatibility (EMC)- Part4-29: Testing and measurement techniques-Voltage dips, shot interruptions and voltage variations on d.c. input power port immunity tests

CISPR22 Information technology equipment-Radio disturbance characteristics-Limits and methods of measurement

IEC 61000-4-29 Electromagnetic compatibility (EMC)- Part4-29: Testing and measurement techniques-Voltage dips, shot interruptions and voltage variations on d.c. input power port immunity tests

ITU-T K.27 Bonding Configurations and Earthing Inside a Telecommunication Building

GR-1089-CORE Electromagnetic Compatibility and Electrical Safety - Generic Criteria for Network Telecommunications Equipment

IEC 61000-4-5 Electromagnetic compatibility (EMC)- Part 4: Testing and measurement techniques - Section 5: Surge immunity test

ETSI EN 300 386 V1.2.1 (2000-03)

Electromagnetic compatibility and Radio spectrum Matters (ERM); Telecommunication network equipment; Electromagnetic Compatibility (EMC) requirements

Safety Standard IEC950(EN60950)

IEC 60825-1 Safety of laser products-Part 1: Equipment classification,



Standard/


requirements and user’s guide

IEC 60825-2 Safety of laser products-Part2: Safety of optical fiber communication systems(OFCS)

IEC/EN/UL 60950-1

Information technology equipment - Safety - Part 1: General requirements

73/23/EEC Low voltage directive

21 CFR 1040.10/1040.11

Performance standards for light-emitting products

Environmental standard

ETS 300 019 (T/TR02-12)

ETSI EN 300 019-1 Environmental Engineering (EE) Environmental conditions and environmental tests for telecommunications equipment Classification of environmental conditions

ETSI EN 300 019-2 Environmental Engineering (EE) Environmental conditions and environmental tests for telecommunications equipment Specification of environmental tests

ETSI EN 300 119-3 Environmental Engineering (EE) European telecommunication standard for equipment practice; Part 3: Engineering requirements for miscellaneous racks and cabinets

ETSI EN 300 119-4 Environmental Engineering (EE); European telecommunication standard for equipment practice; Part 4: Engineering requirements for sub-racks in miscellaneous racks and cabinets.

ETSI EN 300 753 Equipment Engineering (EE) Acoustic noise emitted by telecommunications equipment

IEC 60068-1 Environmental testing Part 1: General and guidance

IEC 60068-2 Basic environmental testing procedures Part 2: Tests

IEC 600721-1 Classification of environmental conditions. Part 1: Environmental parameters and their severities

IEC 600721-2 Classification of environmental conditions. Part 2: Environmental conditions appearing in nature

IEC 600529 Degrees of protection provided by enclosures (IP Code)

QM333 Specification for environmental testing of electronic equipments for transmission and switching use

GR-63 NEBS Requirements: Physical Protection



Standard/


GR-63-CORE NEBS™ Requirements: Physical Protection



10 Abbreviations Abbreviation Full name

ADM Add/Drop Multiplexer

AFEC Advanced FEC

AIS Alarm Indication Signal

APO Auto Power Optimization

APR Automatic Power Reduction

APS Automatic Protection Switching

APSD Automatic Power Shutdown

ASE Amplified Spontaneous Emission

ATM Asynchronous Transfer Mode

AWG Array Waveguide Grating

BEI Backward Error Indication

BER Bit Error Ratio

BIAE Backward Incoming Alignment Error

BDI Backward Defect Indication

BIP-X Bit Interleaved Parity of depth X

CMI Code Mark Inversion

CWDM Coarse Wavelength Division Multiplexing

DRA Distributed Raman Amplifier

DCM Dispersion Compensation Module

DFB-LD Distributed Feedback Laser Diode

DWDM Dense Wavelength Division Multiplexing

DVB Digital Video Broadcasting

EA Electrical Absorption

EDFA Erbium Doped Fiber Amplifier

EFEC Enhanced FEC

ESCON Enterprise System Connection

EXP Experimental

FAS Frame Alignment Signal

FC Fiber Channel

FEC Forward Error Correction



Abbreviation Full name

FICON Fiber Connection

FOADM Fixed Optical Add/Drop Multiplexer

FTFL Fault Type and Fault Location

FWM Four Wave Mixing

GCC General Communication Channel

GE Gigabit Ethernet

GUI Graphical User Interfaces

IAE Incoming Alignment Error

IP Internet Protocol

IWF Integrated Wavelength Feedback

LA Line Amplifier

LCK Locked

LD Laser Diode

LOF Loss of Frame

LOS Loss of Signal

MCU Micro Control Unit

MFAS MultiFrame Alignment Signal

MQW Multiple Quantum Well

MSP Multiplex Section Protection

M-Z Mach-Zehnder

NE Network Element

NRZ Non Return to Zero

OAC Optical Access

OADM Optical Add/Drop Multiplexer

OBA Optical Booster Amplifier

OCH Optical Channel

OCI Open Connection Indication

ODF Optical Distribution Frame

OD Optical Demultiplexer

ODU Optical Channel Data Unit

OLA Optical Line Amplifier




OM Optical Multiplexer

OMS Optical Multiplex Section

OPA Optical PreAmplifier

OPU Optical Channel Payload Unit

ORL Optical Return Loss

OSC Optical Supervision Channel

OSCF Optical Supervision Channel for Fast Ethernet

OSNR Optical Signal-Noise Ratio

OTM Optical Terminal Multiplexer

OTN Optical Transport Network

OTS Optical Transmission Section

OTU Optical Transponder Unit

OTU Optical Channel Transport Unit

PA PreAmplifier

PCC Protection Communication Channel

PDFA Praseodymium Doped Fiber Amplifier

PDL Polarization Dependent Loss

PM Path Monitoring

PMD Polarization Mode Dispersion

POS Packet Over SDH

PSI Payload Structure Identifier

PT Payload Type

RES Reserved for Future International Standardization

ROADM Reconfigurable Optical Add/Drop Multiplexer

RPOA Remotely Pumped Optical Amplifier

RZ Return to Zero

SBA Stimulated Brillouin Amplifier

SDH Synchronous Digital Hierarchy

SDM Supervisory Division Multiplexing Board

SFP Small Form Factor Pluggable

SM Section Monitoring




SONET Synchronous Optical Network

SRS Stimulated Raman Scattering

STM-N Synchronous Transport Module, level N (N=1, 4, 16, 64)

TCM Tandem Connection Monitoring

TCP Transmission Control Protocol

TFF Thin Film Filter

TM Terminal Multiplexer

TMN Telecommunications Management Network

TTI Trail Trace Identifier

VOA Variable Optical Attenuator

VoIP Voice over IP

WDM Wavelength Division Multiplexing

Documents

ZXONE 8000 Product Description - Liberty Port - IT and …€¦ · · 2017-01-132.1 Large Transmission Capacity ... 6.13 Automatic Performance Optimization ... ZXONE 8000 Product