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© 2012
RF Filters, PAs, Antenna
Switches & Tunability for
Cellular Handsets
System Plus Consulting Taiyo Yuden Wispry Triquint
Sony TDK-EPC
SAMPLE
© 2012 • 2
RF filters, PAs, antenna switches and tunability for cellular
handsets Table of contents
• Introduction and Definitions 3
• Executive Summary 19
1. RF Filter / Duplexer Market 33
– Overview of RF filters / duplexers
– SAW market forecasts and market share
– Technology trends for SAW filters and duplexers
– BAW market forecasts and market share
– Technology trends for FBAR / BAW filters and
duplexers
2. Power Amplifier Market 84
– Technology trends for power amplifiers
– PA pricing, market forecasts and market share
3. Antenna Switching Market 117
– Technology trends for antenna switching
– GaAs switches
– HR-SOI switches
– SOS switches
– Bulk CMOS switches
– MEMS for antenna switching
– Antenna switching pricing, market forecasts and
market share
4. Tunability 151
– Drivers for tunable architectures
– Application description: antenna tuning, tunable PA,
tunable filters/duplexers
– Tuning technology platforms
– Profile of key players
– Tunability pricing, market forecasts and market share
5. FEM Architecture Evolution 214
– Key drivers for radio front end modules
– Trends for GSM FEM
– Drivers and curent architectures for 3G and 4G phones
– FEM market forecasts
6. Background on the RF Industry and Technology Principles
274
– RF ecosystem, supply chain and global drivers
– Architecture of RF filters / duplexers
– Principles of SAW filters and duplexers
– Principles of FBAR / BAW filters and duplexers
• Conclusion and Perspectives 311
© 2012 • 3
Objectives of the Report
– To provide a synthetic view on the market data for the most important RF components used in cellphone FEM: key market
metrics & dynamics:
• Unit shipments and revenues by type of sensor
• Average selling price analysis and expected evolution
• Market shares with detailed breakdown for each player and major OEM contracts
– To provide an analysis on the potential for each technology for each type of device and the impact at the global
architecture level:
• Specificities and competitive situation for current technologies and new developments
• Penetration of technologies in 2011 and expected evolution through 2016
• Impact of new packaging technologies (flip-chip, WLP…)
• How technology changes at the component level will impact the global architectures, and vice versa
– To provide a deep analysis on the challenges and opportunities for tunability in handsets:
• Description of the different types of tuners and level of integration
• Which driver for tunability, why did it start, how market adoption will be like?
• Key tuner providers
• Different levels of processing and strategies for integration in the system (MCU…)
• Insight about architecture changes linked to the emergence of antenna tuners and other tuners…
– To provide a clear understanding of RF FEM value chain, infrastructure & players for the cellular handset business:
• List of major players for each device under consideration
• Analysis on the potential new entrants with disruptive technologies
• Description of the RF ecosystem: link between component providers, module makers, platform companies, OEMs
• Description of the value chain with major players from design to packaging
© 2012 • 4
Who should buy?
• Filter, PA, Switch, Tuner suppliers
– Evaluate market potential of future technologies and
products
– Understand the differentiated value of your products and
technologies in this market
– Build roadmap for modules: which type of modules?
When?
– Identify new business opportunities such as tuners,
envelope tracking…
– Identify potential strategic partners or technology
providers: for more integration…
– Monitor and benchmark your competitor’s advancements
• GaAs, SOI, CMOS, MEMS foundries, wafer suppliers,
packaging houses
– Understand what are the applications that will drive the
volumes in 2016
– Identify new business opportunities and prospects
• Specialists of baseband/ transceiver, of application
processor…
– Spot new opportunities and define diversification
strategies
• Mobile phone OEMs, Platform makers
– Evaluate market potential of future technologies and
products to comply with new standards
– Evaluate the benefits of using these new technologies
in your end system, design architectures for the next
generation of systems
– Screen potential new suppliers able to provide new
functionalities, or cost and size savings
• R&D centers
– Understand how the new front-end and packaging
technologies will impact the future business
– Evaluate market potential of future technologies and
products for new applicative markets
– Identify the best candidates for technology transfer
• Financial & strategic investors
– Understand the structure and value chain of the cellular
handset RF industry
– Estimate the potential of new devices such as antenna
tuners…
– Get the list of the main key players and emerging start-
ups of this industry worldwide
© 2012 • 5
Introduction
• Market for key components of the RF part to reach $4.7B in 2016
– The radio-front end is a key part in every cell phone, from low cost GSM handset to multi-mode multi-band LTE smartphones.
This market is very fragmented in terms of architectures, however there are a few types of components that are key. Filters or
duplexers, power amplifiers and antenna switches are at the heart of every cell phone radio. Those components represent a
$3.6B market in 2011 already, growing at a 5.6% rate annually until 2016. This report highlights that as this market becomes
increasingly attractive, major technical evolutions and changes are observed in the competitive landscape for those categories
of devices.
– Filters and duplexers are the most dynamic market. Driven by duplexers which are growing at a 10.5% rate annually, this market
will reach $1.7B in 2016. Indeed smartphones are widely using WCDMA bands and LTE is a new strong driver. Depending on
each band, SAW or BAW developments are candidate to further growth. While Epcos and Murata dominate the SAW area, we
observe a fierce competition between Avago and TriQuint in the BAW segment.
0
2000
2010 2011 2012 2013 2014 2015 2016
Market for RF filters and duplexers in mobile phones RF part ($M)
Discretes SAW and BAW filters SAW and BAW duplexers
Yole développement © March 2012
Epcos 42.2%
Murata 38.9%
Others (detailed
in the report) 18.9%
SAW 2011 market share ($M)
Yole développement © March 2012
Avago 65.0%
Triquint 26.4%
Others (detailed
in the report)
8.5%
BAW 2011 market share ($M)
Yole développement © March 2012
© 2012 • 6
Introduction
– Power amplifier is another strategic component in the RF part. This market matures but we still see many new technologies
which impact the market. One current trend is that converged PAs and more broadband PAs are increasingly accepted in the
market. GaAs is still dominating the PA market by far but is poised to loose market shares as CMOS PAs are growing, starting at
the low end side of the market, and as SOI technology could be used for PAs in the near future. There is thus still room for many
changes in the competitive landscape dominated by Skyworks, with RFMD, TriQuint, Avago and Murata / Renesas as
challengers.
– Antenna switches also becomes more mature however we observe evolutions towards 2 directions. First we see an evolution
towards more performance for the new LTE bands and increasing number of throws. This is where Peregrine Semiconductor has
a leading position. Second we see massive adoption of SOI technology since 2010. All big players are now involved with this
technology which offers a good price/performance ratio. GaAs switches are thus decreasing, although some players still release
products with exceptional performances, such as Sony. At the same time new technologies are getting closer to production, this
is what is observed with MEMS.
• Tunability and changes in achitectures
– This report provides a detailed analysis on tunability, which is a new hot topic for radio front end modules. Indeed after years of
development, antenna tuners have been accepted in 2011. Not only GaAs switches but also ferroelectric capacitors and MEMS
variable capacitors have been successfully integrated into flagship products such as some Samsung Galaxy S2 smartphones.
While there is no consensus yet on this topic, antenna tuners are now really providing a significant value proposition, we thus
expect it to be the next very hot market in this space. New types of tuners and massive deployment of LTE within 2014 will be
additional drivers for tunability. Leading the MEMS field, Wispry will be a key player to watch, while Sony and Peregrine also
offer promising approaches based on alternative technologies. The acquisition of Paratek by RIM in March 2012 is also a sign
that antenna tuners will be a strategic technology to be integrated in many cellphone platforms in the near future.
© 2012 • 7
Introduction
Wispry RF MEMS antenna tuner in Samsung Focus Flash and die SEM view (source System Plus Consulting)
– All those changes at the component level (PA, ASM, filters...) and the rise of tunability are having a dramatic impact in the global
RF part architecture evolutions. Both technical and competitive challenges and opportunities are shaping the future front end
modules. Similarly the trend for integration in various types of modules is driving changes at the individual component level.
New packaging technologies now enable compact multi-chip packages: Rx modules, PA modules, multi-duplexers… All
together, the front-end modules are already a $2.0B market in 2011 and grow at a 12.0% yearly rate, this will represent more than
3 times the value of the standalone PAs, filters/duplexers, tuners in 2016.
• Rapid evolution of technology and competitive landscape
– While we start to see some level of consolidation, the competitive landscape in this RF market is changing quickly. Some
companies are getting mire vertically integrated, such as Murata after the acquisition of Renesas PA business, which may
translate in a change in the business model of the company. As highlighted in the report, there are today a limited number of
companies which dominate this RF space, but generally those players are involved in very specific market space, this means
that significant evolutions can be expected in the near future. For instance Skyworks is leading the PA market and is big in
switches but has no activity in filters, while Avago is a large PA vendor and dominates the BAW filter market, but is neither
involved in SAW filters nor in antenna switches.
© 2012 • 8
Introduction
– The evolution of architecture towards modules is one driver that pushes each company to be able to handle all types of
components or to set up specific partnerships. Another driver for competitive change is the technical evolution which is very
quick in this area: at the antenna switch level, players with early involvement in SOI switches (Skyworks, RFMD) are getting more
market shares against players involved in GaAs (TriQuint…). This type of change should be observed with PA technology as
well.
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
2010 2011 2012 2013 2014 2015 2016
Antenna switches in handsets - Technology breakdown - In value -
GaAs SOS HR-SOI MEMS
Yole développement © March 2012
© 2012 • 9
EXTRACT OF ANTENNA
SWITCH PART
© 2012 • 10
Where are integrated RF switches? Popularity of technologies in 2012
Multiband Multimode FEM
Baseband (Multiband)
Multiband
transceive
r PA + Duplexer
Antenna
Switch
Module
(ASM)
Antenna
PA + Duplexer
Duplexer
4 PA
(GSM)
Filters
(GSM)
PA
T/R antenna switch 1. GaAs substrate
2. HR-SOI substrate
3. SOS substrate
4. CMOS (Infineon has been used then replaced)
Dual band
PA die SPxT switch
PA module
PA die
PA die
PA die
Band switching 1. HR-SOI substrate
2. GaAs substrate
PA receiver side / antenna
diversity (performance driven because of LTE)
1. SOS substrate
2. Separated GaAs die
3. HR-SOI
Only antenna switches
taken into account in this
report
Interstage switches are not
considered in the forecasts
© 2012 • 11
Overview of Cell Phone RF Switch Technologies (at the system level, not individual switch level)
GaAs FET /
pHEMT PIN Diodes SOS HR-SOI MEMS CMOS
Technical factors
Low insertion loss ++ ++ +++ +++ +++ +
Isolation and low
crosstalk +++ ++ ++ ++ +++ ++
Switching speed ++ ++ ++ +++ ++ +++
Frequency range :
Bandwidth +++
+ (limited in low
frequencies)
+++ ++
++ (capacitive switches
limited in low
frequencies)
-
Low power
consumption ++ - +++ +++ ++ +++
Small size + - ++ ++ + +++
Potential for
integration
- (needs external
capacitors + ESD and
digital controller on a
separate CMOS die)
- +
+++ (integration of power
management unit,
converge PA, tuner…)
++ +++
Business factors
Low cost +++ +++
-
(costly
substrate)
++ + +++
Low risk (Maturity,
experience, supply chain
optimization)
+++ +++ ++ + - -
Use Low & medium
performance
Not used
anymore
Very -high-perf:
SP9T…
Medium performance –
mainstream part of the
market + High-
performance
Not ready yet (size and
hot switching issues) –
Promising for high-
performance segments
Just starting in handset
(use for ISM 900MHz
band). But but loss is
generally too high to be
used as a antenna switch
© 2012 • 12
GaAs Switches Example: Sony J-PHEMT switch
• Sony has released a new switch technology
with excellent performances
– PN junction gate provides better performance than
standard MMIC processes
– Low insertion loss: typically 0.5dB for cellular bands
• Many products are using this technology
– Antenna switch modules
– Antenna tuner
– Other modules (PA modules…)
– For diversity switch: Sony uses CMOS SOI technology
SP10T – 2.6x3.4mm² Source: Sony
© 2012 • 13
New packaging approaches Taiyo Yuden - Embedded GaAs switch antenna in PCB
GaAs antenna switch is embedded in
the PCB:
• Allows size reduction (XY & Z) of
the module
• PCB substrate has an enhanced
rigidity thanks to a Cu core
• PCB has small hole size and
reduced Cu line thickness
• Component mounting requires high
accuracy
© 2012 • 14
Switch supply chain
Integrated players
RFMD, Skyworks, Triquint…
Front-end modules
Design Manufacturing
Antenna switch Platform makers /
Handset OEMs
Integrated players
Pure-play switch
manufacturers
Sony, Peregrine…
RFMD, Skyworks, Triquint…
FEM makers
Murata, Epcos, Kyocera, Hitachi,
Avago…
Platform makers
Handset OEMS
Samsung, Nokia, Apple…
Qualcomm, ST Ericsonn, Intel
Mobile Communication…
Commercialization of:
Either ASM
Or bare dies to be integrated in FEM with other components (filters…)
© 2012 • 15
Available MEMS Reports
Trends in MEMS
Manufacturing &
Packaging
IMU &High
Performance MEMS
MEMS & Sensors
for Smartphones
Uncooled IR Cameras &
Detectors for
Thermography & Night
Vision
CMOS Image
Sensors
MEMS Cosim+
MEMS Manufacturing
Cost Simulation Tool
Ferro-Electric
Thin Films MEMS Microphone
New!
Permanent Wafer
Bonding
New!
Motion Sensors for
Consumer & Mobile
applications
New!
Thin Wafer
Handling
New!
Sensor fusion of
acceleros, gyros &
magnetometers
New!
MEMS Players:
Analysis of Financial
Performance
Infrared Detector
Market, Applications
and Technology Trends
New! New!
MEMJET
New!
Technology Trends
for Inertials MEMS
New!
Emerging MEMS Technologies & Markets
© 2012 • 16
Yole activities in MEMS
Media business News feed / Magazines /
Webcasts
www.yole.fr
Market Research
Reports Market research,
Technology & Strategy
Consulting services