XMC1400 Boot Kit - Infineon Technologies

User Manual Revision 1.0

www.infineon.com 2016-01-21

UG_201512_PL30_005

XMC1400 Boot Kit

For XMC1000 Family

About this document

Scope and purpose

This document provides the schematic and hardware description of XMC1400 Boot Kit, so that user is able to

make use of this board for their application code development on XMC1404-Q064X0200 device.

Intended audience

For people who are interested to explore the functionality of XMC1404 device.

Table of Contents

About this document....................................................................................................................... 1

Table of Contents ........................................................................................................................... 1

1 Overview ...................................................................................................................... 2

1.1 Key Features ............................................................................................................................................2

1.2 Block Diagram .........................................................................................................................................2

2 Hardware Description .................................................................................................... 3

2.1 Power Supply...........................................................................................................................................4

2.2 Reset ........................................................................................................................................................5

2.3 Clock Generation.....................................................................................................................................5

2.3.1 External Crystal and external Real time Clock crystal ......................................................................5

2.4 Boot Option .............................................................................................................................................7

2.5 CAN bus connector..................................................................................................................................7

2.6 Debug Interface and virtual com port ....................................................................................................8

2.7 LED ...........................................................................................................................................................9

2.8 Potentiometer .........................................................................................................................................9

2.9 Application Card connector .................................................................................................................. 10

3 Production Data ...........................................................................................................11

3.1 Schematics ............................................................................................................................................ 11

3.2 Layout and Geometry............................................................................................................................ 14

3.3 CR number of XMC1400 Boot Kit........................................................................................................... 15

3.4 Bill of Material........................................................................................................................................ 16

Revision History ............................................................................................................................18

User Manual 2 Revision 1.0

2016-01-21

XMC1400 Boot KitFor XMC1000 Family

Overview

1 Overview

This document describes the features and hardware details of the XMC1400 Boot Kit. This board is mounted

with ARM® Cortex®-M0 based XMC1400 Microcontroller from Infineon Technologies AG. This board is part ofInfineon’s XMC1000 Application Kits.

The XMC1400 Boot Kit (CPU-14A-V1) houses the XMC1400 Microcontroller and a 2x30 pin edge for application

expansion. The board along with application cards (e.g. Colour LED Card, White LED Card) demonstrates the

capabilities of XMC1400. The main use case for this board is to demonstrate the generic features of XMC1400

device, including tool chain. The focus is safe operation under evaluation conditions. The board is neither costnor size optimized and does not serve as a reference design.

1.1 Key Features

The XMC1400 Boot Kit is equipped with the following features

• XMC1400 (ARM®Cortex®-M0 based) Microcontroller, VQFN64

• Connection to application cards via card edge connector

• Detachable J-Link debugger and UART virtual COM port, with micro USB connector

• Four user LEDs

• Potentiometer, connected to analog input P2.5

• Power supply via Micro-USB connector

• Usage of 20MHz external crystal for CAN communication

• Usage of 32.768 kHz external crystal as standby clock

1.2 Block Diagram

Figure 1 shows the functional block diagram of the XMC1400 Boot Kit.

Features include:

• On board Debugger for downloading and debugging of application code

• Virtual COM port for UART communication with terminal program e.g. Hyperterminal

• 2x30 card edge connector for extension to application card e.g. Colour LED Card and White LED Card

• 4 User LEDs connected to GPIO P4.0, P4.1, P4.2, P4.3

• Variable resistor R110 connected to analog input P2.5

• All the pins of XMC1400 are accessible via the connector JP101, JP103, JP104 and JP105

• CAN interface with CAN transceiver mounted

• External crystal 20 MHz and 32.768 kHz mounted


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Hardware Description

Figure 1 Block Diagram of XMC1400 Boot Kit

2 Hardware Description

The following sections give a detailed description of the hardware and how it can be used.


2016-01-21



Figure 2 XMC1400 Boot Kit

2.1 Power Supply

XMC1400 Boot Kit is powered from the micro USB connector (+5V); however, there is a current limit that can be

drawn from the host PC through USB. If the CPU-14A-V1 board is used to drive other application board (e.g.

Colour LED Card, White LED Card) and the total current required exceeds 500mA, then the board needs to be

powered by external power supply connected to VDD and GND connection on board.

The XMC1404 device can operate by power supply of 1.8V till 5.5Vdc. On this board 5Vdc is used to power the

XMC1404 device. However, if the user wants to power the XMC1404 device with 3.3Vdc, then set jumper atJP201 to 3.3V side.


2016-01-21



Figure 3 Power Supply circuit

2.2 Reset

Since XMC1404 does not have a reset pin, the user can unplug and replug the USB cable to achieve power-on

master reset.

2.3 Clock Generation

XMC1404 has two internal oscillators: DCO1 and DCO2. DCO1 has a clock output of 96 MHz. DCO2 is used to

generate the standby clock running at 32.768 kHz which used for Real Time Clock too. The main clock, MCLK

and fast peripherial clock, PCLK, are generated from the output of DCO1.

2.3.1 External Crystal and external Real time Clock crystal

The XMC1400 device allows its main clock MCLK to be generated from external crystal to achieve higher

accuracy. It also allows its real time clock to be run from external RTC crystal. On the XMC1400 Boot Kit, a 20

MHz external crystal circuit and a 32.768 kHz RTC external crystal circuit are implement on board to allows user

to run its application using external crystals. The 20 MHz crystal Q102 is connected to the XMC1404 device via

R111 and R114. If user does not want to use the external 20MHz crystal Q102 but wish to use P0.10 and P0.11 asgeneral purpose pins, then R111 and R114 need to be desoldered while R113 and R115 soldered.

The 32.768 kHz crystal Q101 is not connected to the XMC1404 device. If user wants to use the external 32.768

kHz crystal, the two 0 ohm resistors R109 and R112 need to be soldered while R108 and R110 need todesoldered. Please refer to Figure 6 for locations of these 0 ohm resistors.


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Figure 4 The external 20 MHz crystal

Figure 5 The external 32.768 kHz RTC crystal


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Figure 6 The positions of 0 ohm resistors for connection of external crystals to XMC1400 device

2.4 Boot Option

After power-on reset with master reset, XMC1404 device enters different boot modes depending on the BMI

(Boot Mode Index) value stored in flash configuration sector 0 (CS0). The BMI value pre-programmed in the

XMC1404 on Boot Kit is User mode with debug enabled, hence, the XMC1404 device will start to run the

application code in its embedded flash after power on reset.

2.5 CAN bus connector

A CAN bus header connector is provided for CAN communication with the XMC1404 device using CAN node 1

RXD pin P4.8 and TXD pin P4.9.

If the user wants to test the CAN BSL mode of XMC1404 device using this CAN transceiver circuit, then R104 and

R106 need to be removed, then RXD and TXD pins of IFX1051LE need to be connected to P0.14 and P0.15 ofXMC1404 device respectively. Furthermore, dip-switches SWD/SPD and SWCLK need to set to position ‘off’.

IFX1051LE requires 5V power supply. If the input voltage to XMC1404 is set to 3.3V, then remove R101 and solder

R102. Next, supply an external power supply of 5V to pin4 (+) of JP102. By making these changes, the user canuse this CAN transceiver for CAN BSL handshaking.


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Figure 7 CAN transceiver circuitry

Figure 8 CAN header JP102, H refers to CANH, L refers to CANL, + refers to VCC, 0 refers to GND

2.6 Debug Interface and virtual com port

XMC1400 Boot Kit has on-board debugger which supports Serial Wire Debug (SWD) and Single Pin Debug (SPD)

as debug interface. SPD is a proprietary debugging protocol from Infineon Technologies and it requires only 1

pin for debug communication. The debugger also provides a virtual COM port which support UART

communication via P1.3 (rx-in) and P1.2 (tx-out) of XMC1400. There is a 2x5 pins Header Debug connector X201.

Table 1 Debug connector X201

Pin Signal Name XMC1400 Signal Description

1 SWCLK P0.15 SWD clock signal

2 SWD(SPD) P0.14 SWD / SPD signal

3 VDDP VDDP +5V

4 GND VSSP Ground

5 GND VSSP Ground

6 VDDP VDDP +5V

7 PC_TXD P1.3 UART data received

8 PC_RXD P1.2 UART data transmit


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2.7 LED

The port pins P4.0, P4.1, P4.2 and P4.3 are connected to LED101, LED102, LED103 and LED104 respectively. The

LEDs turns on by output ‘Low’ at the respective port pins.

Figure 9 LEDs circuit

Table 2 LEDs Pinout

LED XMC1400 Port Pin Description

LED101 P4.0 Output ‘Low’ to on LED




2.8 Potentiometer

XMC1400 Boot Kit provides a potentiometer R110 for ease of use and testing of the on-chip analog to digital

converter. The potentiometer is connected to the analog input P2.5. The analog output range of thepotentiometer is the same the VDDP voltage supplied to the XMC1404 device.

Figure 10 Potentiometer Circuit


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2.9 Application Card connector

XMC1400 Boot Kit has a 2x30 pins card edge connector. The mating connector is SAMTEC HSEC8-130-01-L-RA-

XX.

Figure 11 Pinout of the 2x30 pin edge connector


2016-01-21


Production Data

3 Production Data

3.1 Schematics

This chapter contains the schematics for the XMC1400 Boot Kit:

• Figure 12: CPU, Pin Headers, external crystals, CAN transceiver circuitry, Potentiometer, LEDs and 60pinEdge connector

• Figure 13: On-board Debugger, Power Supply


2016-01-21


Production Data

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2016-01-21


Production Data

Figure 13 Schematic 2 of 2 XMC1400 Boot Kit

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2016-01-21


Production Data

3.2 Layout and Geometry

Figure 14 XMC1400 Boot Kit layout and geometry


2016-01-21


Production Data

3.3 CR number of XMC1400 Boot Kit

Figure 15 CR number of XMC1400 Boot Kit

1:

+3V

3

2:

TC

K

3:

TM

S

4:

#D

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PR

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5:

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1 2 3 4

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1

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1

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J_302

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C101

C101

C102C102

C103C103

C104C104

C105

C105

C106C106C107C107

C108

C108

C109C109

C110C110

C111

C111

C112

C112

C201

C201

C202

C202

C203

C203

C204

C204

C205

C205

C206

C206

C207

C207

C208

C208

C209

C209C

210

C210

C211

C211

C212

C212

C213C213

C214

C214

C215

C215

IC101

IC101

IC102

IC102

IC201

IC201

IC202IC202IC203IC203

IC204IC204

IC205IC205IC206IC206

JP101

JP101

JP102

JP102

JP103

JP103

JP104

JP104

JP105

JP105

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US

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JP202JP202

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D101

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D102

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D103

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LE

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-

Q101Q101

Q102

Q102

Q201

Q201

R101

R101

R102R102

R103R103

R104R104

R105

R105

R106R106

R107

R107

R108

R108

R109

R109

R110

R110

R111

R111

R112

R112

R113

R113

R114R114R115R115

R116R116

R117

R117

R118

R118

R119

R119

R120

R120

R121

R121

R122

R122

R123

R123

R201

R201

R202

R202

R203

R203

R204

R204

R205

R205

R206

R206

R207

R207

R208

R208

R209

R209

R210

R210

R211

R211

R212

R212

R213

R213

R214

R214

R215

R215

R216

R216R

217

R217

R218

R218

S201

S201

U201

U201

V201

V201

V202

V202 V

203

V203

V204

V204

X101

X101

X102X102

X201

X201 X202

X202

X203

X203


2016-01-21


Production Data

3.4 Bill of Material

Table 3 XMC1400 Boot Kit

No. Value Device Qty ReferenceDesignator

1 JMPER_VSEL 1x3 pin header 1 JP201

2 CAN pins 2x2 pin header 1 JP102

3 Debug 2x4 pin header 2 X102 X201

4 100nF 10V 10% 0402 Capacitor X7R 9 C110 C204 C207 C208 C209 C211

C212 C213 C215

5 100nF 10V 10% 0603 Capacitor X7R 4 C101 C102 C103 C203

6 10uF 10V 10% 0805 Capacitor X7R 1 C202

7 15pF 10V 1% 0402 Capacitor NPO 4 C104 C105 C205 C206

8 220nF 10V 10% 0402 Capacitor X7R 4 C108 C109 C111 C112

9 22uF 10V 10% 0805 Capacitor X7R 1 C201

10 4.7uF 10V 10% 0805 Capacitor X7R 1 C210

11 8pF 10V 2% 0402 Capacitor NPO 2 C106 C107

12 12 MHz S 3.2X2.5 Crystal 12 MHz SMD 8pF

NX3225GB-12.000M-STD-CRA-2

1 Q201

13 20 MHz S 3.2X2.5 Crystal 20 MHz SMD 8pF

NX3225GB-20.000M-STD-CRA-2

1 Q102

13a1) 20 MHz S 3.2X2.5 Crystal 20 MHz SMD 8pF HONG

KONG X’TALS LIMITED

3225M2000IB01

1 Q102

14 ESD8V0L2B-03L Diode, Infineon 1 V204

15 SN74LVC2T45DCT Dual-bit Dual supply bus

transceiver

2 IC202 IC205

16 BLM18PG600 Ferrite Bead 1 L201

17 LED-GN D 0603 LED, green 1 V201

18 jumper (red) Jumper 1 JP201A

19 ZX62-AB-5PA Connector Micro-USB AB SMD

ZX62-AB-5PA Hirose1 X202

20 LED-RED D 0603 LED, red 1 V202

21 LED-RED D 0603 LED, red 4 LED101 LED102 LED103 LED104

22 0R 10% 0201 Resistor 3 R108 R110 R111

23 0R 10% 0603 Resistor 8 R101 R104 R105 R106 R107 R117

R123 R203

24 10k Resistor, Potentiometer 1 R122

25 10k 10% 0402 Resistor 7 R208 R211 R214 R215 R216 R217

R218

26 120R 10% 0805 Resistor 1 R103

27 1K 10% 0603 Resistor 1 R116

28 1M 10% 0402 Resistor 1 R209


2016-01-21


Production Data

No. Value Device Qty ReferenceDesignator

29 33R 10% 0402 Resistor 2 R204 R206

30 4k710% 0402 Resistor 1 R207

31 4K7 10% 0603 Resistor 4 R118 R119 R120 R121

32 510R 10% 0201 Resistor 1 R114

33 510R 10% 0603 Resistor 1 R205

34 5K10 10% 1% Resistor 2 R210 R212

35 680R 10% 0603 Resistor 2 R201 R202

36 32.768 kHz, FC-135 Crystal 32.768 kHz SMD 12.5pF

NDK NX3215SA-32.678K

1 Q101

36a1) 32.768 kHz, FC-135 Crystal 32.768 kHz SMD

HONG KONG X’TALS LIMITED

3215K3276IB01

1 Q101

37 SN74LVC1T45DCK Single bit Dual supply bus

transceiver

3 IC203 IC204 IC206

38 IFX1051LE CAN transceiver, Infineon 1 IC101

39 XMC1404-Q064X0200 Microcontroller, Infineon 1 IC102

40 IFX25001MEV33 Voltage regulator, 3V3, Infineon 1 IC201

41 XMC4200-Q48K256 Microcontroller, Infineon 1 U201

42 BAT60A Diode Infineon 1 V203

43 no ass. 10nF 10% 0402 Capacitor 1 C214

44 MCU pins 2x8 pin header 4 JP101 JP103 JP104 JP105

45 XMC_SWD 1x5 pin header 1 1X05

46 no ass. 0R 10% 0805 Resistor 1 R102




50 no ass. 0R10% 0201 Resistor 1 R115


Note: 1) Alternative part.


2016-01-21

Revision History


Revision History

Major changes since the last revision

Page or Reference Description of change

V1.0 Initial Version

Trademarks of Infineon Technologies AGAURIX™, C166™, CanPAK™, CIPOS™, CoolGaN™, CoolMOS™, CoolSET™, CoolSiC™, CORECONTROL™, CROSSAVE™, DAVE™, DI-POL™, DrBlade™, EasyPIM™,EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, Infineon™, ISOFACE™, IsoPACK™,i-Wafer™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OPTIGA™, OptiMOS™, ORIGA™, POWERCODE™, PRIMARION™, PrimePACK™,PrimeSTACK™, PROFET™, PRO-SIL™, RASIC™, REAL3™, ReverSave™, SatRIC™, SIEGET™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, SPOC™, TEMPFET™,thinQ!™, TRENCHSTOP™, TriCore™.

Trademarks updated August 2015

Other TrademarksAll referenced product or service names and trademarks are the property of their respective owners.

Edition 2016-01-21

UG_201512_PL30_005

Published by

Infineon Technologies AG

81726 Munich, Germany

© 2016 Infineon Technologies AG.

All Rights Reserved.

Do you have a question about thisdocument?

Email: [email protected]

Document reference

IMPORTANT NOTICEThe information contained in this application noteis given as a hint for the implementation of theproduct only and shall in no event be regarded as adescription or warranty of a certain functionality,condition or quality of the product. Beforeimplementation of the product, the recipient of thisapplication note must verify any function and othertechnical information given herein in the realapplication. Infineon Technologies herebydisclaims any and all warranties and liabilities ofany kind (including without limitation warranties ofnon-infringement of intellectual property rights ofany third party) with respect to any and allinformation given in this application note.

The data contained in this document is exclusivelyintended for technically trained staff. It is theresponsibility of customer’s technical departmentsto evaluate the suitability of the product for theintended application and the completeness of theproduct information given in this document withrespect to such application.

For further information on the product, technology,delivery terms and conditions and prices pleasecontact your nearest Infineon Technologies office(www.infineon.com).

WARNINGSDue to technical requirements products maycontain dangerous substances. For information onthe types in question please contact your nearestInfineon Technologies office.

Except as otherwise explicitly approved by InfineonTechnologies in a written document signed byauthorized representatives of InfineonTechnologies, Infineon Technologies’ products maynot be used in any applications where a failure ofthe product or any consequences of the use thereofcan reasonably be expected to result in personalinjury.

Documents

XMC1400 Boot Kit - Infineon Technologies