Xin Jiang

47/5 Stenhouse GardensEdinburghEH11 3LS

Mob: 07429963192shewa77777@gmail.com

SummaryA competent micro-electronics/manufacturing researcher with a comprehensive knowledge of material surface treatment, microfluidics, optical-MEMS fabrication, CMOS, packaging, development, modelling, diagnostic, analysis and project coordination. Looking for a position in the development and application of micro-fabrication, R&D engineer, optical MEMS sensor and manufacturing.

Key Technical Skills

Microfluidics design and manufacturing, polymer (PMMA, COC, LCP) treatment, semiconductor design and

packaging, plastic welding, optical-MEMS sensor design and packaging, microelectronics, laser processing.

FEA modelling, COMSOL in thermal transfer, LabView and data acquisition systems, Code writing in C,

experience in image processing in Matlab, PCB layout in Protel 99E, Circuit Design, experience in VHDL.

Research Experience

Sep 2010 – Jan 2015: Heriot-Watt University, Edinburgh: Ph.D in Electronic Engineering and physics

Studying within the Microsystems Engineering Centre (MISEC) group at Heriot-Watt University, Developing a new laser bonding method for development and applications in microfluidic devices and MEMS sensors. Developing the simulation of heat transfer during laser joining based on COMSOL. Skills attained include:

Understanding of computer science on both software and hardware principles. Understanding of microelectronic engineering, diagnostic skills and optoelectronic design. Understanding of development in polymer, glass, silicon manufacturing. Surface processing method of polymer material (PMMA, COC, LCP) for 3 years research experience. UV-LIGA process and microsystem fabrication processes for 4 years research experience. Microfluidic device welding and optical-MEMS, CMOS packaging method based on laser processing

for 4 years research experience. Laser micro-machining and micro-welding for 4 years research experience Several characterisation approaches: Microscopy, SEM, AFM, 3D form and roughness measurement. Quality testing methods: tensile test, shear test, helium leak test, gross leak test.

Projects: Developed a novel laser assembly method for micro-fabrication of polymer based microfluidic devices.

Successful demonstration of the new approach in leak-free encapsulation of a microfluidic channel, and characterization of bond interface and determination of tensile bond strength showed a strong bond. (published in Optics and Laser in Engineering)

Developed a new laser welding method for cavity based packaging of sensors and optical-MEMS devices. A number of samples were tested and achieved excellent results. Also, a large challenge of temperature monitoring during the bonding process was successfully overcome. ( is being processed in IEEE Transactions on Components, Packaging and manufacturing Technology)

Simulated the temperature variation and heat transfer of polymer welding and MEMS package bonding based on COMSOL. Compared with the practical experiment, this model can effectively achieve the bonding parameters and generate the bonding temperature distribution throughout entire model.

Education

2009 - 2010: Heriot-Watt University, Edinburgh: MSc IT (Mobile Communications) (Top 1% of college)

Covered a wide variety of disciplines such as Digital Signal Processing, Networks and Communications, Principles of Mobile Communications, Software Engineering (C++) and Image Processing. Awarded scholarship for the MSc study.

Research Projects: Stepper motor control system: Based on Windows platform, achieved excellent data communication

between PC and stepper motor drive circuit. The results proved that the control system is a friendly man-machine interface and easy for operating. Also, this system is being used in our research lab as a main motion control experimental device.

2004 - 2008: Guilin University of Electronic Technology, China: Electronic Engineering with average grade of 80 (Top 1% of college).

Topics covered: Advanced Digital Electronics, Signal processing, Software Engineering, Communications Engineering, Microcontrollers, and Embedded Systems, Circuit Design, Analogical Electronics, High-frequency Circuit, Digital Circuit.

Project of distinction award is “Development of Infrared Remote Control Based on Single-chip”.

Achieved four scholarships during the BA study period and worked in a charity organization for nearly two and half years at spare time.

Research Projects: Traffic Lights Design: Individually designed, built, and tested a new system of traffic lights based on the

usual Chinese model. The device was designed with a synchronous digital circuit and a Moore machine which operated the traffic light at four types of road crossing.

Intelligent Smart Car Design: Designed a simple smart car to achieve various functions such as automatic tracking, using the photoelectric sensor to detect the obstacle and realize multi-level speed control.

Intelligent Infrared Remote Control System Design: Designed and implemented a system that received and displayed the data via a typical infrared remote control. This device was based on single chip microcomputer system and can be used on various multimedia applications.

Other Work Experience

09/2008 - 05/2009 XUNMEI Information company, Chengdu, China. ASSISTANT ENGINEER.

Specifying the PCB layout requirements and working with the layout engineers to get the board designed in a developing group (8 engineers) of a famous company (over 1000 employees). Besides, identifying and working with assembly houses/contract manufacturers to get the prototypes built. Also, specifying PCB fabrication requirements, specifying assembly constraints and verification procedures.

06/2006 - 09/2006 Nanjing Xinlian Telecommunication Instruments Company, Nanjing, China. TECHNICAL ASSISTANT.

Assemble, test, and maintain circuitry and electronic components according to engineering instructions and technical manual.