1

1240 1 2 4 0 - 0 1 / 1 2 4 0 - 0 2 / 1 2 4 0 - 0 3

1 2 4 1 - 0 1 / 1 2 4 1 - 0 2 / 1 2 4 1 - 0 3

Reduced running costs (no test fi xture required)

Support for prototype boards (immediate support for design changes)

Improved reliability (reduced reliance on visual inspections)

Improved work effi ciency (standard support for automatic testing)

X-Y IN CIRCUIT HiTESTER

HIOKI. Certifying reliability.

2

Increasing detection rates by combiningstatic and dynamic testing and adding an image test.

The 1240 takes high-precision measurements of the contact resistance between IC leads and the circuit pattern using the 4-terminal resistance measurement method and makes a judgment based on a comparison with known-good data. The use of an electrical detection method enables highly reliable detection.

Although the influence and characteristics of circuit networks make it impossible to test all pattern-mounted components with an in-circuit tester, the incorporation of simple function testing and image testing functionality into the in-circuit process can help increase overall detection rates.

Higher process detection rates

Detection of inadequate IC lead contact

Sense side

Precision probe for 4-terminal measurement

Support for 0.5 mm pitch and 0.3 mm line width Four-terminal probes that are not subject to the influence of contact resistance and wiring resistance are used to perform IC lead tests. These probes can also be used in component testing.

Good lead

The resistance value between these two points is measured.

The board alignment CCD camera, which is standard equipment on the 1240, can be used to test components that cannot be tested using electrical testing, dramatically reducing the need to rely on visual inspections. Visual mode supports chip component detection and polarity testing, while alignment mode augments component detection and polarity testing with misalignment testing. A component alignment camera (optional) can be added to enable testing of components other than chips such as ICs.

In addit ion to automatic alignment and visual testing, the 1240 offers other features that take advantage of the CCD camera.

Presence detection

Reduced reliance on visual inspections

Simple visual function

Source side

Insulating material

Lead float Inadequate contact

Polarity Misalignment

2

3

Extensive selection of measurement modes

Active test (optional)

The active test option enables MOS-FET, J-FET, relay on resistance, 3-terminal basic function, as well as many other measurements.

FET operation test

Judge components based on their operational states. FET operation is judged by measuring the voltage and current between the drain and source while the on voltage and off voltage are applied to a MOS-FET or J-FET gate (both Nch and Pch are supported).

Relay operation test

Measure relay contact resistance. The secondary side’s resistance value is measured while applying a voltage to the relay’s primary side. This functionality allows checking of the resistance value when a user-specified voltage (5 V, 12 V, or 24 V) is applied as well as in an open state when 0 V is applied.

Three-terminal regulator voltage measurement

Measure generated voltage. The voltage generated on the output side of the circuit under test is measured while a user-specified voltage (max. 25 V/200 mA) is applied to the circuit’s input side. This functionality can also be used as a simple function test.

Simple, programming-free operation

Boundary scan test support

Boundary scan (“BS”) is a method for testing populated circuit boards based on the IEEE 1149.1 standard whereby switches inside the IC called boundary scan cells are used to check the mount status of individual components.Boundary scan testing makes use of boundary scan cells that are preinstalled in a digital IC’s I/O pins. These cells comprise a digital switch and function similarly to a conventional in-circuit test probe. Boundary scan test featuresAlmost all digital ICs on a populated circuit board can be tested using a small number of probes (minimum of about 8).

Operation is judged based on the off current and the on resistance value.

Operation is judged based on the off current and measured current (IDSS).

Detection rate

■ The 1240 provides a variety of test modes to help raise detection rates.

Use in combination with an external instrument.

Function feature voltage measurement (optional)

Testing is performed after connecting the HiTESTER to an external instrument with analog output. In CONV mode, the voltage between the H and L potentials is measured and converted using a conversion equation set with that voltage value (the user specifies a and b values for a linear function). A judgment is then made based on the converted value.

Simple image inspection

Circuit under test

Inadequate contact measurement

Active test

Boundary scan test

Component test

Application of constant voltage

OutputInput

Measured voltage

Circuit under test

Circuit under test

Circuit under test

Measurementtarget

Means of connectingtarget to probes

(1939 Measurement Switch Board, etc.)

H potential

L potential

Externalinstrument

Measurement pins Analog voltage output pins

Measured value conversion

and unit display.

y = ax + b

Measured voltage

BS cell A BS cell BLead A Lead B

Dig

ital I

/O

Dig

ital I

/O

Probe 1

:Boundary scan cell

Probe 3

Probe 2

Probe 4

Logiccore

TDI: BS data input

TMS: BS mode select

TDO: BS data outputTCK: BS clock

Logiccore

BS deviceregister

BS instructionregister

BS TAPcontroller

BS deviceregister

BS instructionregister

BS TAPcontroller

MultiplexerMultiplexerTDI: BS

data input

TDO: BS data output

4

Easier. More effi cient.

Data creation and testing workfl ow

The 1240 provides a single workfl ow, from data creation to automatic testing.

Thanks to their ability to position probes and take measurements based solely on test data, X-Y in-circuit testers are capable of running tests from the initial lot stage and of accommodating design changes with remarkable fl exibility. Although the creation of test data requires the entry of component coordinates and a reasonable level of electrical knowledge, the process has been simplifi ed by powerful tools such as the ATG function.

In recent years, the ability to control and reduce running costs has come to be seen as an important component of tester performance. Along with the issues of fi xture costs and associated storage space, customers are demanding testing solutions that can immediately accommodate prototype boards. The 1240 X-Y IN-CIRCUIT HiTESTER meets these needs.

X-Y IN-CIRCUIT HiTESTERs are measuring instruments for testing the state of populated circuit boards.

■ Data creation workfl ow

Circuit diagrams, component charts, bare boards, populated boards (multiple samples are desirable), component layouts, net lists Documentation required for automatic data creation Mounter data and CAD data

Enter the necessary data.

Step

1

Step

2

Step

3

Step

4

Step

5

Step

6

Register alignment marks.

Enter measurement coordinates.

Debug (adjust) the data.Adjust judgment criteria to allow the detection of problematic components.

Optimize the test order.Adjust the measurement order to achieve the shortest possible testing time.

Prepare documentation required for data creation.

4

5

Software-assisted data creation method

Utilize CAD data.Basic data creation method

Utilize mount data.

● Conversion from mounter data (requires conversion software option)Data is created based on the component information, component coordinates, and component mount orientation stored in mounter data.

● Conversion from CAD data (requires HIOKI Expert)Data is created based on CAD data and component lists.

Automatically adjust measurement data.

ATG function

If the data includes information about connections between components (net information), the data can be used to automatically select test conditions, dramatically reducing the amount of time required for debugging in consultation with circuit diagrams.

● CAD data includes net information.This net information can be reflected in the created data, enabling use of the ATG function.

Component name Value

X coordinate

Y coordinate

Mount orientation

Mount method Chip code

Measurement conditions

MK1_1 ----- 500 500 0 F MARK MARK ↓MK1_2 ----- 17500 11300 0 F MARK MARK ↓IC101 ----- 4318 2667 90 FB SOP20 XC547 ↓R104 10K 3810 762 0 F CHIP2025 CN2A4T ↓VC101 2P 2921 3302 270 FB CHIP1608 CPTU ↓C101 47P 3429 3239 90 FB CHIP2025 HS15 ↓C102 680P 3175 2318 270 FB CHIP2025 D22CG ↓C104 0.1U 8255 3810 180 F CHIP3620 ECUV ↓D101 0.7 937 6350 90 FB D3PA 1S1588 ↓

Step

2Step

4Step

2Step

4Step

5Simplify steps 2 and 4.

Faster testing

Test order Z optimization function

The Z-axis height during X-Y probe movement can be specifi ed by area, allowing a margin of clearance for tall components to be incorporated when optimizing the test order.

Simplify steps 2, 4, and 5.

Step

6 Perform high-speed optimization for Step 6. Step

5 Automate Step 5.

Areas wi th ta l l components are specified, and the Z-axis height is increased for those areas during testing. This selective approach prevents decreases in the overall testing speed.

Use a CAD input processor (support for more than 45 formats).

Two methods

Create custom conversion software for individual mounter data formats. Step

1

6

Software Measurement System List of Options

•Active test support•Recovery CD•Line history management system support•Addition of software with support for QLAN and visual inspection link•Addition of software for simplifi ed compilation of measured value statistics for steps

•Addition of baffl e mechanism (Z-axis mechanism)•Four-terminal probes with support for 0.4 mm pitch•Addition of automatic arm offset verifi cation function•Installation of clamp jig for atypically shaped boards•Support for lower probe installation•Support for C reverse probe installation•Support for 4.0 mm board thickness•Frequency measurement of crystal oscillators

•Transport height modifi cation (900 mm or greater)•Addition of anti-vibration rubber (Dersbond)•Specifi cation of HiTESTER color•Rail side opening cover•Addition of dust collector (fi lter)•Installation of output relay for signal lamp use•Simultaneous transport specifi cations•Support for double-sided testing•Support for SMEMA standard•Special pre-/post-process interface support•Addition of LAN port•Addition of COM port•Barcode reader installation•QR reader installation•Addition of QR look-ahead function•QR code scanning with alignment cameras•Addition of ground terminal for connecting a wristband ground strap•Addition of control panel cover•Addition of operational preparation circuit•Large-format board support (560 × 500)

For 1240-01/02 For 1240-03

•Alignment camera, MR arm 1940-51 1940-52•Component alignment camera, MR arm 1940-61 1940-62•Stamp unit, R arm 1941-61 1941-63•Stamp unit, L arm 1941-62 1941-64•Feed rails 1942-01 1942-01•Automatic width adjustment function 1942-11 1942-12•Board warp correction unit 1943-11 1943-12•Measurement switching board 1939-01•Expansion I/O board 1944-01•DC measurement board unit (active test) 1935-24•Data creation software 1395-06•Measurement unit calibration unit 1330•Maintenance tool set 1356•Monitor camera 1946-08 1946-09•Recovery CD (1240-01, -03) 1139-06 1139-06•Recovery CD (1240-02) 1139-07

■Alignment cameras

An alignment camera can be mounted on each arm to provide high-precision probing. Component alignment corrects for misalignment of individual components after mounting and is used when making direct contact with component leads. (Options 1940-51 and 1940-61 cannot be installed at the same time.)

■Stamp units, R and L arms

Tested boards can be marked w i t h s t a m p s . M o d u l e -specific, group-specific, and overall test data stamp settings are supported and provide an effective means of preventing defective and untested boards from getting mixed in with PASS boards.

■Board warp correction unit

Reliable correction of board warp in the upward direction is provided by holding boards down at two points, one on each side.

■Feed rails

One untested board can be placed on the feed rails. The rails can be used to assist the operator during standalone 1240 automatic operation (no pre- or post-process device) when feeding or ejecting boards.

■Measurement switching board 1939

A n e x t e r n a l f r e q u e n c y counter or other instrument can be connected to enable measurement of frequency and other data. *The externally connected i n s t rumen t ( coun t e r ) i s operated using GP-IB control.

■Automatic width adjustment function

By including the board width in the test data, it is possible to automatically adjust the tester to the board width when reading the test data. This feature can be combined with board count setup editing, a standard feature, to allow automatic setup for different boards.

1240-01/02Support for large-format boards

1240-03Support for M rack boards

Options and Special-order Features

510 (W) × 460 (D) mm1240-01: Super-high-speed testing of up to 40 steps/second (200% faster than previous models)1240-02: Optimized for testing for inadequate IC contact; 150% faster than previous models

400 (W) × 330 (D) mmCompact, high-speed tester for use on production lines (super-high-speed testing of up to 40 steps/second)

For 1240-01/02 For 1240-03

Contact probe (for L, ML, MR arms) 1172-12 1172-18Contact probe (for R arm) 1172-17 Same as aboveFour-terminal probe (for L, ML, MR arms) 1172-43 1172-45Four-terminal probe (for R arm) 1172-44 Same as aboveCarbide contact probe

Probes

Additional Accessory OptionsFor 1240-01/02 For 1240-03

•One-way clutch 1164-02 Unnecessary•Support pins 1164-52•Printer paper 1196•Arm offset board 1350•Probe impact sheets (176 sheets) 1134-02

*Other special features are available on a special-order basis. Please contact a HIOKI sales offi ce near you for more information.

*Probe pressure: 1.35 NContact probe (single needle) (when using 2 mm stroke)Four-terminal probe (when using 1.5 mm stroke)

7

1266 1323

1787

1236

916

1133

No.of arms 4 (L, R, ML, MR)

No. of test steps 40,000 (max.)

Coordinate specification method Step XY / pattern XY

Measurement ranges

Resistor : 400 μΩ to 40 MΩCapacitor : 1 pF to 400 mFInductance : 1 μH to 100 HDiode VZ measurement : 0 to 25 VZener diode VZ measurement : 0 to 25 V / 25 to 80 V (optional)Digital transistor : 0 to 25 VPhotocoupler : 0 to 25 VShort : 0.4 Ω to 400 kΩOpen : 4 Ω to 40 MΩDC voltage measurement : 0 to 25 VFunction feature voltage measurement : 0 to 25 VRelay on resistance measurement : 40 m to 40ΩEFT on resistance measurement : 400 m to 400ΩSimple function measurement : 0 to 20 V

Test signalsDC constant voltage : 100 mV / 400 mV (2 ranges)DC constant current : 200 nA to 200 mA (13 ranges)AC constant voltage : 0.1 V rms (1 range)

Measurement unitDC voltmeter : 800 μV to 25 V f.s. (8 ranges)DC ammeter : 100 nA to 25 mA f.s. (7 ranges)AC ammeter : 10 μA to 10 mA rms (4 ranges)

Judgment range -99.9% to +999.9%, or absolute value

Guarding 2 points/step and lower probe channel guard specification

Probing precision Within ±100 μm per arm (X/Y direction)

Positioning repeatability Within ±50 μm (probing position)

Max. positioning resolution

X-Y: 1.00 μm/pulseZ: 6.00 μm/pulse

Probe work area 510 (W) × 460 (D) mm (1240-01/02)400 (W) × 330 (D) mm (1240-03)

Test board weight 2.0 kgf or less

Component mount range

Lower surface: Max. 100 mm (based on following conditions) 30.0 mm from reference rail: 90.0 mm 125.0 mm from movable rail: 85.0 mmNo components within 3 mm of both sides of board (transport margin)

Display 17” LCD display

Safety features

Emergency stop switch, safety covers (constructed of antistatic resin), arm and probe interference prevention software, moving part interference prevention limit switches, insulated transformer

Warning features Signal tower (3-light), buzzer

Power supplyAC 200 V ±10% (single-phase), 50/60 HzPower consumption: 3 kVA

Air supplyPressure (primary) : 0.5 to 0.99 MPa (dry air)Set pressure (secondary) : 0.5 ±0.1 MPa

Air consumption Max. 0.3 Nl/min

Environmental conditions

Temperature : 23°C ±10°CHumidity : 75% rh or lower (non-condensing)Air: Avoid use in the presence of excessive dust, vibration, or corrosive gases. Floor strength : At least 500 kg/m2

Standard accessories

1240-01/02

Contact probes: 1172-12 (for L and M arms) × 3, 1172-17 (for R arm) × 1; 4-terminal

probes: 1172-43 (for L and M arms) × 3, 1172-44 (for R arm) × 1; one-way clutch,

hexagonal wrench

1240-03

Contact probes: 1172-18 × 4; 4-terminal probes: 1172-45 (used for all arms) × 4; probe

relay board (for L and R arms) × 2; probe relay board (for ML and MR arms) × 2

1240-01/02 and 1240-03

Thermal miniprinter, printer cable, ball point screwdriver, grease, grease gun, keyboard,

mouse, computer accessories, setup disc, 4 leveling jacks, color display (17”), 1350 arm

offset board, UPS, 1134-02 probe impact sheets, power cable (terminating in bare wires),

spare fuse, probe impact sheets

Conveyor belts Double-sided flat belts (antistatic material)

Conveyor width reference side Front side

Transport height 900 ±15 mm

Conveyor speed Max. 40 m/min (no-load conditions)

Direction of transport Right to left or left to right (specify at time of order)

Specifications

External Dimensions

1410 1270

1760

Boa

rd c

lam

p he

ight

: 900

±15

1340

1240-031240-01,02

1240-01(g11241-01) 1240-02(g11241-02) 1240-03(g11241-03)Measurement speed Combination measurement: From 0.025 s/step Combination measurement: From 0.033 s/step Combination measurement: From 0.025 s/step

Probe installation angle (L, ML, MR, R) -11° /1.8°,0° / -6°,0° / 6°,+11° / -1.8° -10° / +5°,0° /0°,0° / 0°,+10° / -5° -11° /1.8°,0° / -6°,0° / 6°,+11° / -1.8°

Min. probing pitch0.2 mm (with 4-terminal probes: 0.5 mm) 0.2 mm (with 4-terminal probes: 0.5 mm)

(for both probe types, 7.5 mm between ML and MR arms)

0.2 mm (with 4-terminal probes: 0.5 mm)

Probe installation method One-way clutch & wire routing One-way clutch and wire routing One-way clutch and one-touch

Testable size Max. 510 (W) × 460 (D) mm Max. 510 (W) × 460 (D) mm Max. 400 (W) × 330 (D) mm

Max. component mounting range Upper: 38 mm (including board thickness) Upper: 38 mm (including board thickness) Upper: 25 mm (including board thickness)

External dimensions (W) × (D) × (H) 1,410 × 1,270 × 1,340 mm 1,410 × 1,270 × 1,340 mm 1,266 × 1,323 × 1,236 mmTester weight 1,300Kgs 1,300Kgs 1,050Kgs

1240-01, 1240-02, and 1240-03 Common Specifications 1240-01, 1240-02, and 1240-03 Common Specifications

1240-01, 1240-02, and 1240-03 Common Transport System Specifications

aø4ø2

ø1.06

14.1

59Model Tip shape "a" Length Tester Probe pressure

1172-12 1 needle 315mm 1240-01/02 (L and M arms) 1.35N (when using 2 mm stroke)1172-17 1 needle 195mm 1240-01/02 (R arm) 1.35N (when using 2 mm stroke)1172-18 1 needle 61mm 1240-03 (all arms) 1.35N (when using 2 mm stroke)1172-43 1 needle (4-terminal) 310mm 1240-01/02 (L and M arms) 1.35N (when using 1.5 mm stroke)1172-44 1 needle (4-terminal) 190mm 1240-01/02 (R arm) 1.35N (when using 1.5 mm stroke)1172-45 1 needle (4-terminal) 56mm 1240-03 (all arms) 1.35N (when using 1.5 mm stroke)

Note: g1) Model 1241 is the CE Marking compliant version of the model 1240 specifications.

Boa

rd c

lam

p he

ight

: 900

±15

8

Inquiries

HIOKI ONLINEWebsite http://www.hioki.com

Email info@hioki.co.jp

HIOKI is ISO 14001 certifi ed.All of HIOKI’s domestic and overseas facilities have been certifi ed compliant with ISO 14001, an international standard governing environmental management systems.

1240E6-84BCAUTION To ensure safe and proper operation, be sure to read this product’s Instruction Manual before attempting to use it.

All information correct as of Apr. 9, 2008. All specifications are subject to change without notice.

CYNCRONA

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HIOKI-trained distributors provide local technical support. HIOKI is proud to maintain a growing network of distributors and product support offi ces in four overseas regions (North America, China, Southeast Asia, and Europe).

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Le Champ