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WORLD LEADERin Package Assembly
Formed in 1978, SST International has long been recognized by the microelectronics
industry as a world leader in package assembly.
The quality of that leadership is apparent.
It shows in the expertise with which we design and build vacuum/pressure furnaces
for the solder reflow assembly of high reliability microelectronic components. And
in the fact that more than 1,000 of these state-of-the-art furnaces have been installed
at over 400 customer sites around the world.
It shows in our understanding of the systems and processes that create void-free solder
joints in flux-free environments. And in the skills we bring to the design, machining
and application of precision tooling for resistive heating and accurate
component alignment.
It shows in how we stand behind our products. And how ready
we are to support our customers with a worldwide network of
experienced technicians and applications professionals.
And,not least, it is reflected in the quality of our customers. We take pride in the fact
that so many of the high-tech manufacturers who choose to partner with SST
International are innovators and world leaders, as well.
SST INTERNATIONALWorld Leader in Package Assembly
At SST International, our goal is always to ensure that our customers reach their
goals. To that end, we partner with our customers to develop or customize the
most ideal turnkey solutions for their microelectronic package assembly needs.
Usually, these solutions are designed for high-reliability electronic
packages. Delivering a reliable and affordable solution in a timely manner,
however, may mean a unique problem must be overcome. Or perhaps
it will call for a rare depth of experience with materials,processes and
system integration.
We welcome these challenges.
In the hands of our engineers and technologists, customers' unique needs present
themselves as fresh opportunities for innovation. Our team brings years of industry
expertise to bear on all aspects of any project. And that includes the selection of
materials, metalizations and mechanical designs to create more reliable microelec-
tronic packages.
Again, our goal is always to ensure that our customers reach their goals. Our long
track record of success attests to the fact that we consistently achieve that outcome.
REACHINGThe Customer’s Goal
These are some of the high-tech industries in which SST International’s customers
play leadership roles:
• Telecommunications • Defense/Military
• Semiconductor • Aerospace
• Photonics • Optoelectronics
• Electronics • Medical Devices
• Automotive • Research and Development
WHO OURSystems Serve
WHAT OURSystems Do
These are the processes that are typically performed in SST International systems:
• Eutectic Die Bonding • Wafer Bonding
• Solder Reflow • Brazing
• Component Assembly • Precision Thermal Profiling
• Getter Activation • Solder Ball Bumping
• Glass Sealing • Annealing
We design and build vacuum/pressure furnaces with temperature ranges up to
1000°C,vacuum levels to 10¯6 torr,and inert gas pressures up to 5 ATM. They are used
in critical applications that require precise thermal profiling in vacuum or positive gas
pressures.
To ensure easy network connectivity for our clients, our systems are controlled
through Microsoft Windows® and user-friendly LCD touch-screen displays. All critical
operating parameters are recorded for statistical process control.
These are just a few of the many products that customers manufacture using SST
International systems:
• Fiber Optic Devices • MMIC's
• Power Hybrids • SAW Devices
• Automotive Diodes • Hermetic Feed-Thrus
• Glass Diodes • Laser Pump Diodes
• MEMS Devices • Infrared Sensors
• Reed Switches • Glass-to-Metal Seals
• Miniature Fuses • Precision Capacitors
• Thermistors • Pressure Sensors
• Oscillators • Crystals
• Gated Light Arrays • Automotive Sensors
• BGA Packages • Flip Chips
• Medical Implant Devices • Surge Suppressors
• Miniature Lamps • Microwave Packages
• Accelerometers • RF Amplifiers
• Pacemakers • Resistor Networks
WHAT OURSystems Produce
SUCCESS THROUGHPartnership
Customers with whom we partner are fully justified in their confidence that we will
help them succeed. No matter how challenging the project, we dedicate ourselves
to delivering a reliable turnkey solution within the customer's budget and timeframe.
Here are a few of the significant factors about SST International that have
contributed to our own success, and that have proven to be of special value to the
high-tech companies with whom we partner:
• Our process development expertise • Our void-free soldering experience
• Our fluxless soldering capabilities • Our precision tooling and fixturing
• Our low system-ownership costs • Our high yields on critical components
• Our long-term worldwide support • Our team of experienced professionals
We would welcome the opportunity to ensure that you reach your own goals. To
discuss how we might serve your microelectronic package assembly needs, or for
further information about our services, please call SST International
at (562) 803-3361 or visit us at www.sstinternational.com.
SST International
9801 Everest Street Downey, CA 90242 Tel: (562) 803-3361 Fax: (562) 803-4043E-mail: [email protected] Website: www.sstinternational.com