10
W ORLD L EADER in Package Assembly

WORLD LEADER in Package AssemblyFormed in 1978,SST International has long been recognized by the microelectronics industry as a world leader in package assembly. The quality of that

  • Upload
    others

  • View
    4

  • Download
    0

Embed Size (px)

Citation preview

Page 1: WORLD LEADER in Package AssemblyFormed in 1978,SST International has long been recognized by the microelectronics industry as a world leader in package assembly. The quality of that

WORLD LEADERin Package Assembly

Page 2: WORLD LEADER in Package AssemblyFormed in 1978,SST International has long been recognized by the microelectronics industry as a world leader in package assembly. The quality of that

Formed in 1978, SST International has long been recognized by the microelectronics

industry as a world leader in package assembly.

The quality of that leadership is apparent.

It shows in the expertise with which we design and build vacuum/pressure furnaces

for the solder reflow assembly of high reliability microelectronic components. And

in the fact that more than 1,000 of these state-of-the-art furnaces have been installed

at over 400 customer sites around the world.

It shows in our understanding of the systems and processes that create void-free solder

joints in flux-free environments. And in the skills we bring to the design, machining

and application of precision tooling for resistive heating and accurate

component alignment.

It shows in how we stand behind our products. And how ready

we are to support our customers with a worldwide network of

experienced technicians and applications professionals.

And,not least, it is reflected in the quality of our customers. We take pride in the fact

that so many of the high-tech manufacturers who choose to partner with SST

International are innovators and world leaders, as well.

SST INTERNATIONALWorld Leader in Package Assembly

Page 3: WORLD LEADER in Package AssemblyFormed in 1978,SST International has long been recognized by the microelectronics industry as a world leader in package assembly. The quality of that

At SST International, our goal is always to ensure that our customers reach their

goals. To that end, we partner with our customers to develop or customize the

most ideal turnkey solutions for their microelectronic package assembly needs.

Usually, these solutions are designed for high-reliability electronic

packages. Delivering a reliable and affordable solution in a timely manner,

however, may mean a unique problem must be overcome. Or perhaps

it will call for a rare depth of experience with materials,processes and

system integration.

We welcome these challenges.

In the hands of our engineers and technologists, customers' unique needs present

themselves as fresh opportunities for innovation. Our team brings years of industry

expertise to bear on all aspects of any project. And that includes the selection of

materials, metalizations and mechanical designs to create more reliable microelec-

tronic packages.

Again, our goal is always to ensure that our customers reach their goals. Our long

track record of success attests to the fact that we consistently achieve that outcome.

REACHINGThe Customer’s Goal

Page 4: WORLD LEADER in Package AssemblyFormed in 1978,SST International has long been recognized by the microelectronics industry as a world leader in package assembly. The quality of that
Page 5: WORLD LEADER in Package AssemblyFormed in 1978,SST International has long been recognized by the microelectronics industry as a world leader in package assembly. The quality of that

These are some of the high-tech industries in which SST International’s customers

play leadership roles:

• Telecommunications • Defense/Military

• Semiconductor • Aerospace

• Photonics • Optoelectronics

• Electronics • Medical Devices

• Automotive • Research and Development

WHO OURSystems Serve

Page 6: WORLD LEADER in Package AssemblyFormed in 1978,SST International has long been recognized by the microelectronics industry as a world leader in package assembly. The quality of that

WHAT OURSystems Do

These are the processes that are typically performed in SST International systems:

• Eutectic Die Bonding • Wafer Bonding

• Solder Reflow • Brazing

• Component Assembly • Precision Thermal Profiling

• Getter Activation • Solder Ball Bumping

• Glass Sealing • Annealing

We design and build vacuum/pressure furnaces with temperature ranges up to

1000°C,vacuum levels to 10¯6 torr,and inert gas pressures up to 5 ATM. They are used

in critical applications that require precise thermal profiling in vacuum or positive gas

pressures.

To ensure easy network connectivity for our clients, our systems are controlled

through Microsoft Windows® and user-friendly LCD touch-screen displays. All critical

operating parameters are recorded for statistical process control.

Page 7: WORLD LEADER in Package AssemblyFormed in 1978,SST International has long been recognized by the microelectronics industry as a world leader in package assembly. The quality of that

These are just a few of the many products that customers manufacture using SST

International systems:

• Fiber Optic Devices • MMIC's

• Power Hybrids • SAW Devices

• Automotive Diodes • Hermetic Feed-Thrus

• Glass Diodes • Laser Pump Diodes

• MEMS Devices • Infrared Sensors

• Reed Switches • Glass-to-Metal Seals

• Miniature Fuses • Precision Capacitors

• Thermistors • Pressure Sensors

• Oscillators • Crystals

• Gated Light Arrays • Automotive Sensors

• BGA Packages • Flip Chips

• Medical Implant Devices • Surge Suppressors

• Miniature Lamps • Microwave Packages

• Accelerometers • RF Amplifiers

• Pacemakers • Resistor Networks

WHAT OURSystems Produce

Page 8: WORLD LEADER in Package AssemblyFormed in 1978,SST International has long been recognized by the microelectronics industry as a world leader in package assembly. The quality of that
Page 9: WORLD LEADER in Package AssemblyFormed in 1978,SST International has long been recognized by the microelectronics industry as a world leader in package assembly. The quality of that

SUCCESS THROUGHPartnership

Customers with whom we partner are fully justified in their confidence that we will

help them succeed. No matter how challenging the project, we dedicate ourselves

to delivering a reliable turnkey solution within the customer's budget and timeframe.

Here are a few of the significant factors about SST International that have

contributed to our own success, and that have proven to be of special value to the

high-tech companies with whom we partner:

• Our process development expertise • Our void-free soldering experience

• Our fluxless soldering capabilities • Our precision tooling and fixturing

• Our low system-ownership costs • Our high yields on critical components

• Our long-term worldwide support • Our team of experienced professionals

We would welcome the opportunity to ensure that you reach your own goals. To

discuss how we might serve your microelectronic package assembly needs, or for

further information about our services, please call SST International

at (562) 803-3361 or visit us at www.sstinternational.com.

Page 10: WORLD LEADER in Package AssemblyFormed in 1978,SST International has long been recognized by the microelectronics industry as a world leader in package assembly. The quality of that

SST International

9801 Everest Street Downey, CA 90242 Tel: (562) 803-3361 Fax: (562) 803-4043E-mail: [email protected] Website: www.sstinternational.com