Wireless Solutions

One-Stop Solution Provider

2

Noise suppression components Inductors Ceramic capacitors

Modules SAW/FBAR/RF modules Antennas/Filters

Recording media Energy devices (Super capacitors)

High value

MLCC

(0402-3225)

(01005-1210)

Medium-

high

Voltage

type

For high-

frequency

applications

Low ESL

Array type

(2&4 circuits)

Super low

distortion type

Multilayer inductors

SMD

Wire-wound inductors

Ferrite chip beads

Chip varistors Common Mode Choke Coils

Chip filters Chip antennas SAW/FBAR devices RF modules Wireless modules Embedded components

substrate EOMINTM

Lithium ion capacitors Polyacene capacitors

Low-profile

type

Axial leaded

type

DVD-R／DVD+R CD-R BD-R

Why Taiyo Yuden?

Wide Selection of Affordable Compact Wireless Modules:

• Wi-Fi Modules

• Bluetooth Modules

• GPS Modules

Key Features:

• FCC/IC certified modules with on-board antenna

• Single-band and Dual-band Wi-Fi

• Legacy Bluetooth and Bluetooth Low Energy

• GPS and GLONASS support

Ceramic Chip Antenna Manufacturer

• Wi-Fi, Bluetooth, GPS and UWB antennas

Why Taiyo Yuden?

Expert Engineering Support

• Software Support (e.g. driver porting support)

• Hardware Support (e.g. schematic/layout reviews)

• Antenna layout assistance

• Antenna performance analysis & optimization

• FCC pre-scans of our evaluation boards are available

to help reassure customer module can pass FCC

Partnership with World-class Silicon Providers:

• Marvell Semiconductor, Inc.

• Nordic Semiconductor, Inc.

• Mediatek

Wi-Fi Modules Marvell 88W8787

Part No. Wi-Fi Bluetooth

FCC IC

Japan Host I/F FM X-tal Ant. Dimensions (mm)

Temp (°C) Eval Board

WYSAAVDX7 11bgn No Yes SDIO No Yes Yes

35.0 x 15.0 x 2.9

-20 to 80 (Shield Temp)

WBSAAVDX7

WYSBCVGX7 11bgn No No SDIO No Yes No 9.0 x 8.8 x 1.35

-10 to 70 WBSBCVGXA-1

WYSBCVGXA 11bgn 3.0,

2.1+EDR No SDIO No Yes No

9.0 x 8.8 x 1.35 -10 to 70 WBSBCVGXA-1

WYSBMVGX4

11abgn No No SDIO No No No 13.1 x 6.1 x 1.35

-20 to 70 WBSBMVGXB-1

WYSBMVGX4-I

11abgn No No SDIO No No No 13.1 x 6.1 x 1.35

-30 to 85 WBSBMVGXB-1

WYSBMVGXB

11abgn 3.0,

2.1+EDR No SDIO No No No

13.1 x 6.1 x 1.35

-20 to 70 WBSBMVGXB-1

Wi-Fi Solutions

OS

Wi-Fi Module Software Stack

Application

Bluetooth Stack

SDIO Driver

Module

TCP/IP Stack

Bluetooth Driver WLAN Driver

OS

Firmware

• Bluetooth stack is not provided.

However, Marvell releases are

tested with BlueZ (www.bluez.org),

an open source project.

• TCP/IP Stack is also not provided.

This typically comes with the BSP.

• Bluetooth and WLAN source code

drivers for Linux are provided and

will have to be ported to the

customer platform.

• Firmware is provided in binary

format. It cannot be modified by the

customer.

• Firmware is downloaded into the

module at run time.

• Support for Micro Access Pont, Wi-Fi

Direct and Client included

• NDA and SLA required before Driver

source code can be provided to

customers.

88W8787 Throughput Measurements with Linux PC

• DUT: WYSBMGXB

• 8787 Driver/Firmware: SD-UAPSTA-UART-BT-8787-FC8-SYSKT-14.57.7.p1-M2614125_W1AX-GPL

• Host: IBMX40

• AP: CISCO (AIR-AP1252-AG-P-K9)

• Evaluation tool for throughput measurement IxChariot

Confidential

• i.MX51 800 MHz ARM Cortex-A8 CPU

• Security:WPA2-PSK/AES

• 2.4GHz (11bgn) 5GHz (11an)

• HT40 (BW 40MHz), HT20 (BW 20MHz)

Confidential

88W8787 Throughput Measurements with i.MX51

Bluetooth Modules Based on Nordic Semiconductor SoC

Part No. Version

FCC IC

Japan

Tx Pwr dBm CPU/Mem I/F Stack X-tal Ant

Dimensions (mm)

Temp (°C) Eval Board

EYSFCNZXX (nRF51822)

4.0 BLE Yes 4 Cortex M0

Flash 256KB RAM 16KB

UART SPI I2C

S110 32MHz 16KHz

Yes

9.6 x 12.9 x 2.0

-25 to 75 EKSFCNZXX EBSFCNZXX

EYSGCNZWY (nRF51822)

4.2 BLE Yes 4 Cortex M0

Flash 256KB RAM 32KB

UART SPI I2C

S120 32MHz 16KHz

Yes

9.6 x 12.9 x 2.0

-25 to 75 EKSGCNZWY EBSGCNZWY

EYSGJNZWY (nRF51822)

4.2 BLE Yes 4 Cortex M0

Flash 256KB RAM 32KB

UART SPI I2C

S120 32MHz Yes 5.1x11.3x1.3

-25 to 75 EKSGJNZWY EBSGJNZWY

EYAGJNZXX (nRF51422)

BLE+ANT 4.2 BLE Yes 4

Cortex M0 Flash 256KB RAM 32KB

UART SPI I2C

S310 32MHz Yes 5.1x11.3x1.3

-25 to 75 EKAGJNZXX EBAGJNZXX

Bluetooth Solutions

GPS Solutions

GPS Modules Based on Mediatek SoC

Part No. GNSS NMEA Host I/F

Baud Rate

(kbps)

TTFF Hot/Cold

(Sec) Accuracy

(m) Ant. Dimensions (mm) Temp (°C) Eval Board

GYSFFMAXB (MT3339)

GPS Yes UART 115.2 1/42 2 No

10 x 10.8 x 2.05

-30 to 85 GKSFFMAXB

GYSFFMAXC (MT3333)

GPS GLONASS

Yes UART 115.2 1/38 1.4 No

10 x 10.8 x 2.05

-30 to 85 GBSFFMAXC

Type Part Number Type Layout on PCB Case Size

(L x W x T , mm)

GPS AH 316M157501 RadiEdge Middle edge of PCB

3.2 x 1.6 x 0.5

2.4GHz

AH 212M245001 Monopole Corner

2.0 x 1.25 x 0.85

AF 216M245001 Monopole Corner

2.5 x 1.6 x 1.6

AH 316M245001 RadiEdge Middle edge of PCB

3.2 x 1.6 x 0.5

AH 083F245001 Inverted-F Corner 8.0 x 3.0 x 1.0

AH 104F2450S1 Inverted-F Corner 10.0 x 4.0 x 1.0

Dual Band 2.4GHz/5GHz

AH 104N2450D1 Monopole Corner

10.0 x 4.0 x 1.0

UWB AH 086M555003 Monopole Corner

8.0 x 6.0 x 1.0

Ceramic Chip Antennas for GPS, Wi-Fi, BT & UWB

Upcoming Modules

• Classic BT + BLE module

CSR based solution

• MW300 Module

Cortex M4F processor and Wi-Fi on one Chip

• 802.11ac

1x1 with Bluetooth 4.0 Smart Ready and NFC 88W8887

2x2 with Bluetooth 4.0 Smart Ready and NFC 88W8897

• GPS

Cost reduced version of GYSFFMAXB based on MT3337

Wireless Module Webpage

http://www.yuden.co.jp/ut/wireless/modules.html