Welcome to theAerospace Instrumentation and Controls Collaboration Forum

Ohio Aerospace Institute, 22800 Cedar Point Road, Cleveland, OH 44142For

The Building Blocks of Smart Sensors and other Technologies for Distributed High Temperature Intelligent Integrated Controls Networks

for Aerospace Applications 25 August, 2011

Smart Sensors for Distributed ControlsMr. Dewey Benson

Honeywell International

• DECWG plans

• Possible Areas of Collaboration

Topics – For This Section

• Develop requirements for:• Engine-level architecture Open, scalable

– Allow any engine manufacturer to design an engine-level distributed system

• Node-level Flexible, scalable node design– Allow anyone making high temperature electronic parts or

assemblies to be able to plug into the engine-level system• Develop high temperature electronics to enable distributed controls

• Scalable, flexible to accommodate several network configurations

• Demonstrate a complete system• In a Hardware-In-The-Loop environment• On an engine

• Develop industry base of suppliers and users of high temp electronics• Sustainable, supports decades long aero applications

What Does The DECWG Want To Do?

The Evolution of Engine Control Architecture

FEDERATED DISTRIBUTED

TEMPERATURE

COLD

HOT

MORE DISTRIBUTED

NETWORK

NETWORK

NETWORKANALOG

LOWER WEIGHT

LEGACY EFFECTO

RS

LEGACY EFFECTO

RSSMART

EFFECTORS

SMART EFFECTO

RS

SMART EFFECTO

RS

ANALOG

FADECCORE-MOUNTED

WITH ACTIVE COOLING

MORE EMBEDDED, MORE MODULAR

CONTROL LAW PROCESSOR

OFF ENGINE

DATA CONCENTRATOR

CORE-MOUNTED, UNCOOLEDNETWORK

NETWORK

FADEC BECOMES

CARD IN AVIONICS

What is Distributed Engine Control Architecture?

Requirements for Distributed Controls

• Thermal Environment• Generic Physical/Functional Interface• Rapid Reconfiguration / Upgradability• Certification• Integration Testing• Cost targets that allow commercial viability Focus on Near-Term Objectives • Leverage commercial applications with production volumes • Design for flexibility on multiple applications

Considerations for Certifying a Distributed Engine Control Architecture

• Different from the Norm– Failure Modes

• Loss of Power• Single Point/Multi Point Failures• Software

– Unintended Interactions• Latency• Data Integrity

– Increased Connections• Reliability

– Potential Harsher Environment• Smart nodes in hot section

– Communications Protocol(s)• Coordination of multiple protocols?

– EMI/HIRF/Lightning Susceptibility

– Software Validation (DO-178B)

– Dispatchable failures?Must Be As Good As Current Architecture

To be handled by FC power supply

Sensor or Actuator

Signal Cond.

MUXA-to-DD-to-A

GateArray

Power Supply

B A

LVDTTorque Motor

A

• Same set of SOI parts scaled from smart sensors to single loop module to complete core data concentrator

• Leverage commonality & quantity to drive down cost

Common Set of High Temp Parts Allows Scalable Hi-T Controls

DECWG Objective – Leverage a Common Set of Parts

To be handled by FC power supply

Data Concentrator Node

Signal Cond.

MUXA-to-DD-to-A

Processor

Power Supply

A B A

P3, T3DPN2

LVDTFuel TempFuel Press

Torque MotorOverspeed

Signal Cond.

Signal Cond.

Gate Array

• Sensor I/O needs• Electronic HW needs

• Wireless radio• Programmability needs

• Smart sensors

Collaboration Opportunities

DECWGPIWG

+ Other “wigs”• System/Node Specs

• Comm/Network Stds• Power Stds

• Electronic parts• Host for System Demo

Fan

HPC HPT LPTLPT

LPC

Fan

HPC HPT

Power Pre-cond A

CommHub A

Power Pre-cond B

CommHub B

AircraftComputingResource

AircraftComputingResource

Node-1A

Node-1B

Node-2A

Node-2B

Node-3A

Node-3B

Is there a preferred network architecture?Example: Redundant linear bus

• One transceiver per node• Supports

• Command and respond• TDMA round• Other

• Physical Layer• LVDS • RS-485• 1394• Plus others below

• Possible protocols• 429, Flexray• Simplified TTP• Simplified TT-Ethernet

Simplicity versus fault tolerance• No single point failure recovery

Fan

HPC HPT LPTLPT

LPC

Fan

HPC HPT

Power Pre-cond A

Power Pre-cond B

CommHub B

AircraftComputingResource

AircraftComputingResource

Node-1A

Do we need mixed network capability?Example: Braided Ring + Comm-Over-Power + Wireless

Node-3A

Can high temp digital electronics enable a 2-wire interface?Wireless interfaces?

Which architecture provides best availability?

Node-4BNode-4

A Node-3B

Node-2B

Node-2A

Node-1B

CommHub A

Sensor

Comm over Power for smart sensors2 wire comm + power network

Wireless SensorsAnd Hub

Comparison of Different Physical Layers

Example: RS-485 vs LVDS – Speed/Low Power vs Robustness

Comparison of Signal Levels

Can smart sensors be accommodated using ‘power over comm’?Allows two wire sensor solution.

Large DC offset already built into several

standards

QUESTIONS?