Embed Size (px)
Citation preview
Page 1©Hesse Mechatronics 08/2013
Wedge Bonding Medical DevicesShaving Microns to Achieve your Thinness Goals
Joe Bubel, PresidentHesse Mechatronics Inc.
225 Hammond Ave,Fremont, CA 94539
P:484-665-0219, F:484-231-3232Email: [email protected]
Lee LevineDistinguished Member of the Technical Staff
Hesse Mechatronics Inc 8009 George Road,
New Tripoli, PA 18066P:610-248-2002, F:484-217-2001,
Email: [email protected]
Page 2©Hesse Mechatronics 08/2013
• Reliability• Size, miniaturization• Unusual materials• Loop shape• Inductance• Ribbon bonding• Cost• Only Wire Bonding is Flexible enough
to handle all of these requirements
Medical Device Requirements
Page 3©Hesse Mechatronics 08/2013
How much Au is in 1 wire bond?
• Assumptions– 150 mils (3.75mm) wire length– 1 mil (25µm) wire diameter– Gold Price $1400/tr-oz
• Answer– $0.00168
• Understand the issues before considering Copper
Page 4©Hesse Mechatronics 08/2013
• The Homologous Temperature is the % of the melting point (MP) in 0K
Ultrasonics allows “easier” deformation by unlocking dislocation movement mechanisms
Calculation660C + 273=933 K18C (RT)+273=291K291/933= 31%
MP[C] MP[K] Room Temp 1500CAl 660 933 31 45Au 1064 1337 22 32Cu 1084 1357 22 31
AuSn(Eutectic) 280 553 53 77PbSn(Eutectic) 183 456 64 93
% Homologous Temp
Wire Bonding is a Welding Process
Page 5©Hesse Mechatronics 08/2013
0
50
100
150
200
250
Def
orm
atio
n %
Std 60Khz Ball Bond
Latest 60Khz Wedge Bond
Std 60kHz Wedge Bond
Fine Pitch Ball Bond
Fine Pitch Wedge Bond
Deformation %= (Bond Width-WireDia)/ Wire Dia *100%
Finer Pitch with Larger Diameter Wire (Higher current carrying Capacity)
Page 6©Hesse Mechatronics 08/2013
35µm Pitch 38µm Pitch 40µm Pitch
20µm Wire
Page 7©Hesse Mechatronics 08/2013
Decreasing Wire Diameter
Wire Length [mm]
Copper Conductivity 25% > Au
0.00
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
0 1 2 3 4 5
DC Ope
ratin
g Cu
rren
t [A]
8µm13µm15µm20µm25µm
Wedge bonding enables use of larger wire than ball bonding for the same pitch
Page 8©Hesse Mechatronics 08/2013
• Lowest loop heights• Realtime bond quality measures• Deepest Access (18mm)• Placement Repeatability 1µm @ 3σ• Bondhead travel of 12”x16”• Stacked Die• Ribbon & round wire bonding on one
platform • Conductivity• Multiple wire materials (Al, Au, Cu, Pt)
WEDGE BOND FLEXIBILITY
Page 9©Hesse Mechatronics 08/2013
S-Shaped Bonding Allows Radial Fan-out
Page 10©Hesse Mechatronics 08/2013
Ribbon Bonds
• Gold and aluminum
• Deep access bondhead
• 6 x 35 µm to 25 x 250 µm
• Ribbon stitch bonds
Page 11©Hesse Mechatronics 08/2013
0
1
2
3
4
5
6
7
8
0 2 4 6 8 10
Equi
vale
nt R
ound
Wire
Dia
met
er [m
il]
Ribbon Width [mil]
Ribbon Thickness = .5 mil
Ribbon Thickness = 1mil
Diameter of Round Wire with Equivalent Skin Effect
Ribbon Conductivity
• At high frequency all conduction is through the wire “skin” (outer 0.5µm)
• GaAs MMIcs are ribbon bonded
Page 12©Hesse Mechatronics 08/2013
Process Integrated
Quality Control
Simply put, PiQC™ is the truest measure of bond quality available today.
Page 13©Hesse Mechatronics 08/2013
Sensor
• Current• Voltage• Frequency Monitoring all these
signals provides an exhaustive insight into the bond process.
The wedge tip oscillation has significant influence on bond quality and is influenced by the conditions of the wire & bond interface (frictionfeedback).
Digital Ultrasonic Generator
Actuator(patented)
• Wire Deformation
• Mechanical Oscillations• Friction
PiQC™-Signals
What is PiQC™?
Page 14©Hesse Mechatronics 08/2013
PiQC™ Production Views
• Deformation• Current• Radar Chart• Histogram• Q-Development
(200 values)• Individual user
interface possible
• Data storage and tracability
Page 15©Hesse Mechatronics 08/2013
Wire No.
Frequency [%]
Friction [%]
Ultrasonic [%]
Wedge [%]
Wire[%]
Quality Index[%]
1 100 100 100 100 100 100
PiQC exclusive Signals
PiQC: Optimized Source Bond
Page 16©Hesse Mechatronics 08/2013
BondOn pad
Frequency [%]
Friction [%]
Ultrasonic [%]
Wedge [%]
Wire[%]
QualityIndex [%]
75% 99 100 100 100 100 9950% 58 99 100 51 100 2925% 37 23 21 24 49 0
PiQC exclusive Signals
PiQC: Misplaced Bonds
Page 17©Hesse Mechatronics 08/2013
Bond on Pad
Frequency [%]
Friction [%]
Ultrasonic [%]
Wedge [%]
Wire[%]
QualityIndex [%]
100% 100 100 100 100 100 10075% 100 89 97 89 99 7650% 100 94 99 68 99 63
PiQC exclusive Signals
PiQC: Displaced Destination Bonds
Page 18©Hesse Mechatronics 08/2013
Wire No.
Frequency [%]
Friction [%]
Ultrasonic [%]
Wedge [%]
Wire[%]
QualityIndex [%]
1 15 38 14 4 66 0
PiQC exclusive Signals
PiQC: Particle on Bond Pad
Page 19©Hesse Mechatronics 08/2013
Wire No.
Frequency [%]
Friction [%]
Ultrasonic [%]
Wedge [%]
Wire[%]
QualityIndex [%]
1 62 100 100 95 100 592 39 92 72 78 96 19
PiQC exclusive Signals
PiQC: Scratch on Bond Pad
Page 20©Hesse Mechatronics 08/2013
Wire No.
Frequency [%]
Friction [%]
Ultrasonic [%]
Wedge [%]
Wire[%]
QualityIndex [%]
1 98 100 100 96 81 762 95 100 91 89 88 67
PiQC exclusive Signals
PiQC: Short Tail + Big Deformation
Page 21©Hesse Mechatronics 08/2013
For additional information please contact:
Joseph S. BubelPresident
Hesse Mechatronics, Inc.(484) 665-0219
Lee LevineDistinguished Memberof the Technical Staff
Wedge Bonding Expert(610) 248-2002
Register at WireBondDemo.com for wire bonding demonstration videos and updates.
AUTHORS
