Wafer Probe Technology & Application Overview

Ira Feldman650‐472‐1192iradave@gmail.com

1Silicon Valley Test Conference 2010© 2010 Ira Feldman

Agenda

• Introduction

• Application Examples

• Contact Technologies / Probe Types

• Top Vendors

• Hot Topics

• Summary

• Resources

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Devices & Packages –Have Evolved!

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UV EPROM circa 1974http://www.cpushack.com/EPROM.html

Peripheral Pads ‐ Logic

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http://www.chipworks.com/uploadedImages/Blog/blogimagessq310/AKM8975_6210_cal_branded.JPG

SWTW 2009: MEMS Technology – Enabling Design Flexibility for Fine Pitch ProbingBahadir Tunaboylu, SV Probe

Fine Pitch Logic

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Kulicke & Soffa: http://www.imaps.org/imaps2005/keynote.pdf

SWTW 2009: MEMS Technology – Enabling Design Flexibility for Fine Pitch ProbingBahadir Tunaboylu, SV Probe

Area Array – Logic, µP, etc.

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Marketing Version of a CPU…

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Intel Core i7-980X Extreme 6-Core Processor (32nm Q1 ’10)http://hothardware.com/News/Intel-Core-i7980X-Extreme-6Core-

Processor-Review/

…What Probe Really Sees

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Intel Technology Journal (6/2008):45 nm process ~50 µm tall Cu bumps

No One Solution Fits All

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150 100 6080 2040Approximate Pitch (µm)

15

1050

100

App

roxi

mat

e P

robe

Cou

nt (K

)

TSV

Microprocessor&

Logic(Area Array)

DRAM&

NOR FLASHMemory

SOC&

Logic LCD /Display

NAND FLASH Memory

Many Other Parameters

• “Pad” type – bond pad, BGA, column, bump

• Pad Configuration – peripheral, LOC, DLOC, array

• Die Size

• Pad Size ‐ passivation opening & keep away

• Pad Metal – Al, Cu, Au, solder, etc.

• Force Requirements

• Scrub Depth

• Frequency / Bandwidth

• Pad Density (probes / mm2)

• Active Area (size of probe array)

• TemperatureSilicon Valley Test Conference 2010 10

Contact Technologies / Probe Types

• Cantilever

• Blade

• Vertical 

• MEMS– Vertical

– Micro Cantilever

– Torsional

• Spring

• Membrane

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Cantilever

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Technoprobe

K&S: http://www.imaps.org/imaps2005/keynote.pdf

Blade

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Vertical‐ Buckling Beam

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Mann: SWTW Tutorial 2004

SV Probe “Trio”

FormFactor: “MEMS for ProbeCard Applications” Chong Chan Pin – Semicon Singapore 2010

JEM “VC”

Vertical‐ Buckling Beam

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MicroProbe: Apollo Vertical

JEM: VC

SV Probe: Trio

MEMS ‐ Vertical

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Microfabrica MicroProbe

MicroProbe (Vx-MP)

FormFactor (T1)

MEMS ‐Micro Cantilever

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Microfabrica

http://www.mjc.co.jp/eng/ir/pdf/MJC070226-s.pdf

MJC (U Probe)

FormFactor (T3)

JEM

MEMS ‐ Torsional

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Touchdown Technologies (ACCU-TORQ)

SWTW 2010: “Low-Force MEMS Probe Solution for Full Wafer Single Touch Test” Matt Losey

Spring Pins

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http://www.nhkspg.co.jp/eng/mc/products/wlt.html

http://www.ksdk.co.jp/eng/spring-probes.htmlJEM VS

Membrane

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Cascade Microtech Pyramid Probe

Top Vendors ‐ Technology

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Revenue per VLSI Research press releasehttps://vlsiwebserver.vlsiresearch.com/public/cms_pdf_upload/458310.pdf

Based upon website and company responses to marketing inquires.

Top Vendors ‐ Applications

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Based upon website and company responses to marketing inquires.

Hot Topics (1)

• Bump / ball damage

• Cu probing

• High current

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Most Inspirational

Most Inspirational

Hot Topics (2)

• High Frequency / high bandwidth– Advanced space transformers

– Modeling

– Direct Dock

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Hot Topics (3)

• Operational – lower cost, quicker cycle time

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Summary

• Device product requirements drive both packaging and test complexity– Essential to partner with suppliers from day one

• Careful selection of probe card vendors– Know strengths & weaknesses for your devices

– Technology may limit performance & impact cost

– No one solution fits all

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Resources

• IEEE Semiconductor Wafer Test Workshopwww.swtest.org

• International Test Conferencewww.itctestweek.org

• My blogswww.hightechbizdev.com

www.ateforum.com/tothepoint

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Credits

Thank you to the vendors who provided photos!

• FormFactor

• Technoprobe

• MicroProbe

• JEM

• SV Probe

• Cascade Microtech

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