V5000 High precision, high speed inline AOI

Series

MagicRay Technology

Your trusted AOI, especially for 01005/03015 and poor soldering.

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For pre-flow, post-flow and inline paste inspection

High resolution for 03015 component

Feature analysis algorithm logic functions for solder joint inspection

Powerful algorithm logic functions for odd shape component inspection

Position offset correction software for flexible PCB inspection

Stable telecentric optical Lens

High accuracy industrial camera&granite platform

Intelligent programmable control RGBW ring shape LED light source

Offline programming and real-time debugging

Complete algorithm for wave soldering dip component inspection

3 Point Check Solution

High Stability Granite Platform

■ Granite platform contribute greatly to improve reliability and

repeatability of machine to ensure detectability.

Product Features

Production Specification

V5000 Series

Equipment Model V5000 V5000D V5000S V5000SD

Image System

Camera 5M pixels Industrial Camera 12M pixels Industrial Camera

Resolution 15µ（38.4*28.8mm）/10µ（25.6*19.2mm） 9µ（36*27mm）/6µ（24*18mm）

Lens Tele-centric lens

Lighting 4 color ring shape LED（RGBW）

Movement Structure

X/Y Movement AC Servo

Platform Granite

Width Adjustment Automatic

Board Loading Direction L→R or R→L（Set before extra of factory）

Fixed Edge Front

HardwareConfiguration

Operating System WINDOWS 7

Communication Ethernet，SMEMA

Power Requirement Single phase 200-240V，50/60Hz，5A

Air Requirement 0.4-0.6Mpa

System Dimensions L940*D1360*H1520mm

Weight 900kg 950kg 900kg 950kg

PCB Size

Size 50*50-510*600mm50*50-510*W

（W₁+W₂＜650）mm50*50-510*600mm

50*50-510*W

（W₁+W₂＜650）mm

Thickness ≤6.0mm

PCB Weight 3kg

ClearanceTop/Bottom 25/45mm:

Top Clearance 25-60mm Adjustment Bottom Clearance 60mm Optional,

Clamping Edge 3.0mm

Inspection Categories

Paste Bridge Misalignment Insufficient/Extra solder Foreign material, , ,

Post Reflow

Component: Wrong component, Missing, Polarity, Misalignment, Billboard, Reversed, Tomb stone, Damaged,

IC lead bent, Foreign material

Solder joint: No solder, Insufficient/Extra solder, Bridge, False welding, Solder ball

Wave Soldering Insert pin No solder Insufficient/Extra solder Hole False welding Solder ball, , , , ,

Inspection Component Chip: 03015 and above LSI: 0.3mm pitch and above Others: Odd shape component

Inspection Speed 200-250ms/FOV 200-300ms/FOV

Disclaimer: MagicRay keeps on improving this product with continuous efforts in research, development and reengineering. Please contacr us for the latest version of this specification sheet.

agicRay Technology Co.,Ltd.:

Pingshan 1st Rd, Xili, Nanshan, Shenzhen, Guangdong, China

Tel: (+86) 755 8695 7197 Fax: (+86) 755 8631 7052

Email: marketing@magic-ray.com Web: www.magic-ray.com

MAdd 4th Floor, Block B of Building NO.5, Yungu 2nd Section,