USA OFFICE KOREA OFFICE - МТ Systemmt-system.ru/sites/default/files/docs/Inpaq/inpaq... · 2018. 9. 27. · 2012 3216 0405 0805 1206 5-6 Multilayer Type (For Ultra High Speed) HCM

USA OFFICE21 Echo Brook Road, Rochester, NH 03839, U.S.A. TEL: +1-603-332-6222FAX: +1-603-509-2900

KOREA OFFICE221 Raemian Seocho Univill, 1445-4, Seocho-Dong, Seocho_Gu, Seoul 130-070, KoreaTEL: +82-2-584-8959FAX: +82-2-584-8951

Common Mode Filter 3

Thin Film Type TNF 06050806

0250203025 4

Thin Film Type (For RFI) TRF 0605 02502 4

Multilayer Type (For High Speed) MCM101220123216

040508051206

5-6

Multilayer Type (For Ultra High Speed) HCM 10122012

04050805 7

Thin Film ESD Type TNFE 0806 03025

8-9

Multilayer ESD Type HCE 1012 0405

Multilayer Array Type MCA 20123216

08051206 10

Wire wound Type WCM 2012 0805 11

Common Mode Filter (AEC-Q200)

Multilayer Type (For High Speed) MCM-W 10122012

04050805 12

Chip Ferrite Bead 13

Signal Lines Type (For GHz band) MGB-G 1005 0402 14

Signal Lines Type (For Standard) MCB-S/B

06031005160820123216322545164532

02010402060308051206121018061812

15-16

Signal Lines Type (For High Speed) MCB-H 100516082012

040206030805

17-18

Power Lines Type MHC-S

1005160820123216322545164532

0402060308051206121018061812

19-20

Power Lines Type (Ultra low DCR) MHC-P 10051608

04020603 21-22

CONTENTS

Product ID Line up Series Size (EIAJ) Size (EIA) Page

www.inpaq.com.tw ; www.inpaqgp.com

Chip Ferrite Bead (AEC-Q200)

Signal Lines Type (For Standard) MCB-W

1005160820123216

0402060308051206

23-24

Signal Lines Type (For High Speed) MCB-W-H 100516082012

040206030805

25-26

Power Lines Type MHC-W

10051608201232164516

04020603080512061806

27-28

Chip Ferrite Inductor

Low Frequency Circuits (For General Use) MFI160820123216

060308051206

29-31

High Frequency Chip Ceramic Inductor

RF Inductor Standard Q Type MCI-HQ 06031005

02010402 32-34

RF Inductor High Q Type MCI-TG 0603 0201 35

High Frequency Chip Ceramic Inductor (AEC-Q200)

RF Inductor Standard Q Type MCI-HW 06031005

02010402 36-38

RF Inductor High Q Type MCI-GW 0603 0201 39-40

Appdendix

Reliability and Test Condition For General Products 41

Reliability and Test Condition (AEC-Q200) For Automotive Product (Passive Component) 42

Recommended Soldering Conditions 43

Cross Reference 44-45

Product ID Line up Series Size (EIAJ) Size (EIA) Page

2EMI/EMC SOLUTION

INPAQ TECHNOLOGY CO., LTD.

Thin film Type

TNF0605U

TNF0806U

Multilayer Type

HCM1012GD/GS

HCM2012GD

Wire wound Type

WCM2012HT/ST

Thin film Type

TRF0605G

Plus ESD Function

Multilayer Type

HCE1012GD

Thin film Type

TNF0605R

TNF0806R

Multilayer Type

MCM1012B

MCM2012B

MCM3216B

Wire wound Type

WCM2012BT

Array Type

MCA2012B

MCA3216B

Plus ESD Function

Thin film Type

TNFE0806R

Multilayer Type

HCE1012GH

High Speed Differential Signal Line

HIGH SPEED SIGNAL LINE USB2.0/LVDS/IEEE1394/mipi...etc.

Circuit Type

ULTRA HIGH SPEED SIGNAL LINEUSB3.0/HDMI/DVI/DP...etc. USB3.1 Gen1/Gen2…etc.

3EMI/EMC SOLUTION

Common mode filter


TNF 0806 R 900 02 –

1 2 3 4 5 6

4

TNF/TRF Series

COMMON MODE FILTER

• TNF series is a thin film common mode filter designed to suppress common mode noise for high speed differential data lines, such as USB 2.0, USB3.0, IEEE 1394, LVDS, DVI, HDMI, MIPI, MHL and S-ATA.

• TRF series is high cut-off Frequency (over 10GHz)and high Common mode Attenuation, Characteristic Impedance match with 100ohm.Suppress common mode noise for high speed differential data lines, such as USB3.1Gen1/Gen2 [email protected]&5GHz.

FEATURES

• TNF/TRF Series can be used in personal computers, note books, LCD monitors, LCD/PDP/ DLP TVs, Blue-ray/DVD players, personal handheld equipments, etc.

APPLICATIONS

PART NUMBER

(1) Product Type TNF= Thin Film Common Mode Filter TRF= Thin Film Common Mode Filter (For RFI)

(2) Dimension Code

(3) Speed Identification Code R= For General use U= For High cut-off frequency G=For Ultra High cut-off frequency

(4) TNF Series= Impedance (The unit is in ohm(Ω) at 100MHz) ex.: 90Ω → 900; 120Ω → 121 TRF Series= Common mode attenuation, ex: 242=2.4GHz; 372=3.7GHz

(5) Line Code 02= 2 lines

(6) Control code

Size (EIA)TNF TNF/TRF

0806 (03025) 0605 (02502)A 0.85±0.05 0.67±0.05

B 0.65±0.05 0.52±0.05

C 0.40±0.05 0.32±0.05

D 0.27±0.15 0.20±0.05

E 0.50±0.10 0.45±0.05

F 0.20±0.10 0.15±0.10

EQUIVALENT CIRRUIT & DIMENSIONS Unit: mm

Part Number Rated Voltage

RatedCurrent

Common Mode Impedance(at 100 MHz)

Cut-off Frequency

DCResistance

InsulationResistance

Symbol VDC IDC Typ. Typ. Max. Min.Units V mA Ω GHz Ω MΩTNF 0806 U 120 02 5 100 12 10 2.0 10TNF 0806 U 350 02 5 100 35 6 2.0 10TNF 0806 R 650 02 5 100 65 4 3.5 10TNF 0806 R 900 02 5 100 90 4 3.5 10TNF 0605 U 120 02 5 100 12 10 2.0 10TNF 0605 R 900 02 5 100 90 3 6.0 10

Part Number Rated

VoltageRated

CurrentCommon Mode

attenuationCut-off

FrequencyDC

ResistanceInsulationResistance

Symbol VDC IDC Typ. Typ. Max. Min.Units V mA GHz GHz Ω MΩTRF 0605 G 242 02 5 100 2.4 10 2.0 10TRF 0605 G 372 02 5 100 3.7 10 2.0 10TRF 0605 G 542 02 5 100 5.4 10 2.0 10

SPECIFICATIONS

STANDARD PACKING

Size (EIA) 0605 (02502) 0806 (03025)

Quantity (pcs/reel) 10,000 10,000

TNF0806 series

1

4

2

3

F

A

B

E

D

C

F

A

B

E

D

1

4

2

3

1

4

2

3

A

B

EF

I

GND GND

1

4

2

3

CC

0.35

1.05

0.025

0.67

0.121

0.136

0.097

0.27 0.13

0.2

0.23 0.25

0.30.2 0.8

0.71

0.20.255

0.33

0.18

0.71

0.84

1

4

2

3

F

A

B

E

D

C

F

A

B

E

D

1

4

2

3

1

4

2

3

A

B

EF

I

GND GND

1

4

2

3

CC

0.35

1.05

0.025

0.67

0.121

0.136

0.097

0.27 0.13

0.2

0.23 0.25

0.30.2 0.8

0.71

0.20.255

0.33

0.18

0.71

0.84

1

4

2

3

F

A

B

E

D

C

F

A

B

E

D

1

4

2

3

1

4

2

3

A

B

EF

I

GND GND

1

4

2

3

CC

0.35

1.05

0.025

0.67

0.121

0.136

0.097

0.27 0.13

0.2

0.23 0.25

0.30.2 0.8

0.71

0.20.255

0.33

0.18

0.71

0.84

TNF/TRF0605 series

1

4

2

3

F

A

B

E

D

C

F

A

B

E

D

1

4

2

3

1

4

2

3

A

B

EF

I

GND GND

1

4

2

3

CC

0.35

1.05

0.025

0.67

0.121

0.136

0.097

0.27 0.13

0.2

0.23 0.25

0.30.2 0.8

0.71

0.20.255

0.33

0.18

0.71

0.84

1

4

2

3

F

A

B

E

D

C

F

A

B

E

D

1

4

2

3

1

4

2

3

A

B

EF

I

GND GND

1

4

2

3

CC

0.35

1.05

0.025

0.67

0.121

0.136

0.097

0.27 0.13

0.2

0.23 0.25

0.30.2 0.8

0.71

0.20.255

0.33

0.18

0.71

0.84

1

4

2

3

F

A

B

E

D

C

F

A

B

E

D

1

4

2

3

1

4

2

3

A

B

EF

I

GND GND

1

4

2

3

CC

0.35

1.05

0.025

0.67

0.121

0.136

0.097

0.27 0.13

0.2

0.23 0.25

0.30.2 0.8

0.71

0.20.255

0.33

0.18

0.71

0.84


5

MCM Series

COMMON MODE FILTER

• Powerful components with composite co-fired materials to solve EMI problem for high speed differential signal transmission line as USB, LVDS, HDMI, MIPI, MHL, and Ethernet without distortion to high speed signal transmission.

FEATURES

• USB, HDMI,MIPI, MHL serial interface in mobile device.; Ethernet interface in 3C device.

APPLICATIONS

MCM 1012 B 900 F 06 B P

1 2 3 4 5 6 7 8

PART NUMBER

(1) Product Type MCM= Multilayer Common mode filter HCM= Multilayer High speed Common mode filter

(2) Dimension Code

(3) Speed Identification Code: B= For General use

(4) Impedance (The unit is in ohm(Ω) at 100MHz) ex.: 90Ω → 900; 120Ω → 121

(5) Internal code E=200mA, Y=250mA, F=300mA, G=400mA, H=500mA, I=600mA, J=700mA, K=800mA

(6) Thickness Dimension ex.: 0.5mm → 05; 0.6mm → 06

(7) Soldering A— Soldering Lead-Free B— Lead-Free for whole chip

(8) Packaging P=7" Reel Paper taping E=7" Reel Embossed taping


STANDARD PACKING

Size (EIA) 1012 (0405) 2012 (0805) 3216 (1206)

Quantity (pcs/reel) 4,000 3,000 3,000

Size (EIA) 1012 (0405) 2012 (0805) 3216 (1206)

A 1.25±0.10 2.00±0.20 3.20±0.20

B 1.00±0.10 1.25±0.20 1.60±0.20

C 0.60±0.10 1.00±0.10 1.00±0.10

D 0.30±0.10 0.40±0.20 0.70±0.20

E 0.50±0.10 1.60±0.20 2.10±0.20

F 0.20±0.15 0.30±0.20 0.30±0.20

MCM 1012 series

1 2

4 3

A

EB

D

F

1 2

4 3

C

0.55

0.7

0.5

0.3

D

C

F

A

B

1 2

4 34

1 2

3

E

0.50.5

0.4

0.75 1.1 0.75

D

C

B

E1 2

34

1 2

34

F 1.00.6

1.0

0.7 1.4 0.7

DC

F

A

B

1 2

4 34

1 2

3

E

0.50.5

0.4

0.75 0.751.1

A

1 2

4 3

A

EB

D

F

1 2

4 3

C

0.75

0.5

0.55

0.3

( Top / Bottom )

( Top / Bottom )

( Top / Bottom )

( Top / Bottom ) ( Top / Bottom )

1 2

4 3

A

EB

D

F

1 2

4 3

C

0.55

0.7

0.5

0.3

D

C

F

A

B

1 2

4 34

1 2

3

E

0.50.5

0.4

0.75 1.1 0.75

D

C

B

E1 2

34

1 2

34

F 1.00.6

1.0

0.7 1.4 0.7

D

C

F

A

B

1 2

4 34

1 2

3

E

0.50.5

0.4

0.75 0.751.1

A

1 2

4 3

A

EB

D

F

1 2

4 3

C

0.75

0.5

0.55

0.3

( Top / Bottom )

( Top / Bottom )

( Top / Bottom )


MCM 2012 series

MCM 3216 series

1 2

4 3

A

EB

D

F

1 2

4 3

C

0.55

0.7

0.5

0.3

D

C

F

A

B

1 2

4 34

1 2

3

E

0.50.5

0.4

0.75 1.1 0.75

D

C

B

E1 2

34

1 2

34

F 1.00.6

1.0

0.7 1.4 0.7

D

C

FA

B

1 2

4 34

1 2

3

E

0.50.5

0.4

0.75 0.751.1

A

1 2

4 3

A

EB

D

F

1 2

4 3

C

0.75

0.5

0.55

0.3

( Top / Bottom )

( Top / Bottom )

( Top / Bottom )


1 2

4 3

A

EB

D

F

1 2

4 3

C

0.55

0.7

0.5

0.3

D

C

F

A

B

1 2

4 34

1 2

3

E

0.50.5

0.4

0.75 1.1 0.75

D

C

B

E1 2

34

1 2

34

F 1.00.6

1.0

0.7 1.4 0.7

DC

FA

B

1 2

4 34

1 2

3

E

0.50.5

0.4

0.75 0.751.1

A

1 2

4 3

A

EB

D

F

1 2

4 3

C

0.75

0.5

0.55

0.3

( Top / Bottom )

( Top / Bottom )

( Top / Bottom )


1 2

4 3

A

EB

D

F

1 2

4 3

C

0.55

0.7

0.5

0.3

D

C

F

A

B

1 2

4 34

1 2

3

E

0.50.5

0.4

0.75 1.1 0.75

D

C

B

E1 2

34

1 2

34

F 1.00.6

1.0

0.7 1.4 0.7

D

C

FA

B

1 2

4 34

1 2

3

E

0.50.5

0.4

0.75 0.751.1

A

1 2

4 3

A

EB

D

F

1 2

4 3

C

0.75

0.5

0.55

0.3

( Top / Bottom )

( Top / Bottom )

( Top / Bottom )



6

MCM Series

COMMON MODE FILTER

Part Number Impedance (Ω)±25% @100MHz

DCR Max. (Ω)

Rated CurrentMax (mA)

Rated Voltage (V)

Insulation Resistance Min. (MΩ)

1012 (EIA 0405) Low profile

MCM1012B670F06BP 67 0.50 300 10 200

MCM1012B900F06BP 90 0.60 300 10 200

MCM1012B121F06BP 120 0.60 300 10 200

2012 (EIA 0805)

MCM2012B670GBE 67 0.40 400 10 200

MCM2012B900GBE 90 0.40 400 10 200

MCM2012B121GBE 120 0.40 400 10 200

MCM2012B161GBE 160 0.50 400 10 200

MCM2012B181GBE 180 0.50 400 10 200

MCM2012B221FBE 220 0.50 300 10 200

3216 (EIA 1206)

MCM3216B900HBE 90 0.50 500 10 200

MCM3216B121HBE 120 0.50 500 10 200

SPECIFICATIONS


7

Size (EIA) 1012 (0405) 2012 (0805)A 1.25±0.10 2.00±0.20

B 1.00±0.10 1.20±0.20

C 0.50±0.10 1.00±0.10

D 0.30±0.10 0.40±0.20

E 0.50±0.10 1.60±0.20

F 0.20±0.15 0.30±0.20

HCM Series

COMMON MODE FILTER

• Ultra High Speed Chip Common Mode Filter, HCM series adopts internally unique multilayer ceramic/ferrite co-firing technologies and higher cut-off frequency design for miniaturized size of EMI filter product development. for higher speed I/O of tablet PC/NB & MB.

FEATURES

• USB, HDMI,MIPI, MHL serial interface in mobile device.; Ethernet interface in 3C device.

APPLICATIONS

HCM 1012 GD 900 B 05 P

1 2 3 4 5 6 7

PART NUMBER

(1) Product Type MCM= Multilayer Common mode filter HCM= Multilayer High speed Common mode filter

(2) Dimension Code

(3) Speed Identification Code: GD= For High cut-off frequency GS= For Ultra High cut-off frequency


(5) Internal code

(6) Thickness Dimension ex.: 0.5mm → 05; 0.6mm → 06


HCM 2012 series

1 2

4 3

A

EB

D

F

1 2

4 3

C

0.55

0.7

0.5

0.3

D

C

F

A

B

1 2

4 34

1 2

3

E

0.50.5

0.4

0.75 1.1 0.75

D

C

B

E1 2

34

1 2

34

F 1.00.6

1.0

0.7 1.4 0.7

D

C

F

A

B

1 2

4 34

1 2

3

E

0.50.5

0.4

0.75 0.751.1

A

1 2

4 3

A

EB

D

F

1 2

4 3

C

0.75

0.5

0.55

0.3

( Top / Bottom )

( Top / Bottom )

( Top / Bottom )


HCM 1012 series

1 2

4 3

A

EB

D

F

1 2

4 3

C

0.55

0.7

0.5

0.3

D

C

F

A

B

1 2

4 34

1 2

3

E

0.50.5

0.4

0.75 1.1 0.75

D

C

B

E1 2

34

1 2

34

F 1.00.6

1.0

0.7 1.4 0.7

D

C

F

A

B

1 2

4 34

1 2

3

E

0.50.5

0.4

0.75 0.751.1

A

1 2

4 3

A

EB

D

F

1 2

4 3

C

0.75

0.5

0.55

0.3

( Top / Bottom )

( Top / Bottom )

( Top / Bottom )



STANDARD PACKING

Size (EIA) 1012 (0405) 2012 (0805)



DCR Max. (Ω)


Rated Voltage (V)


1012 (EIA 0405)

HCM1012GD500A05P 50 1.50 100 10 100

HCM1012GD670A05P 67 1.50 100 10 100

HCM1012GD900B05P 90 3.00 100 10 100

HCM1012GS150A05P 15 0.80 100 10 100

2012 (EIA 0805)

HCM2012GD500AE 50 1.00 100 10 100

HCM2012GD900AE 90 1.00 200 10 100

HCM2012GD121AE 120 1.20 100 10 100

SPECIFICATIONS


8

• TNFE series is a thin film common mode filter PLUS ESD. The ESD protection of IEC61000-4-2 Level 4 in high speed differential data lines is provided.

• HCE series is Powerful components with composite co-fired materials to solve EMI problem for high speed differential signal transmission line as USB and Ethernet without distortion to high speed signal transmission. The ESD Meet IEC61000-4-2 level 4: Contact Discharge 8KV、Air Discharge 15KV.

FEATURES

• TNF/TNFE Series can be used in personal computers, note books, LCD monitors, LCD/PDP/ DLP TVs, Blue-ray/DVD players, personal handheld equipments, etc.

APPLICATIONS

HCE 1012 GH 900 B P

1 2 3 4 5 6

PART NUMBER

(1) Product Type HCE= Multilayer High speed Common mode filter Plus ESD TNFE=Thin film Common mode filter Plus ESD

(2) Dimension Code

(3) Speed Identification Code: GH/R=For High speed GD=For High cut-off frequency


(5) Internal code

(6) Packaging P=7" Reel Paper taping A=7" Reel Paper taping E=7" Reel Embossed taping

TNFE/HCE Series

COMMON MODE FILTER


Size (EIA)HCE

1012 (0405)

A 1.25±0.10

B 1.00±0.10

C 0.60±0.10

D 0.30±0.10

E 0.50±0.10

F 0.20±0.15

G 0.30±0.15

H 0.20±0.15

( Top / Bottom )

A

EB

F

1 2

4 3

C

5

6

D

0.48

0.3

0.5

0.75

0.5

0.3

0.5

G

H

1 2

4 3

5

6A

B

EF

I GND GND

1

4

2

3

C

0.35

1.05

0.025

0.67

0.1210.136

0.097

0.27 0.13

0.2

TNFE0806 series

Size (EIA)TNFE

0806 (03025)A 0.85±0.05

B 0.65±0.05

C 0.40±0.05

D 0.27±0.15

E 0.40±0.05

F 0.15±0.10

HCE 1012 series

( Top / Bottom )

A

EB

F

1 2

4 3

C

5

6

D

0.48

0.3

0.5

0.75

0.5

0.3

0.5

G

H

1 2

4 3

5

6A

B

EF

I GND GND

1

4

2

3

C

0.35

1.05

0.025

0.67

0.1210.136

0.097

0.27 0.13

0.2


9

TNFE/HCE Series

COMMON MODE FILTER

Part Number Impedance (Ω) ±25% @100MHz

DCR Max. (Ω)


Rated Voltage (V)

Insulation ResistanceMin. (MΩ)

Capacitance @0.5V 1MHz

Max (pF)

Leakage Current @5V

Max (μA)

HCE Series

1012 (EIA 0405)

HCE1012GH900BP 90 2.0 100 10 100 1.3 1.0

HCE1012GD670BP 67 2.0 100 10 100 1.3 1.0

HCE1012GD900BP 90 2.0 100 10 100 1.3 1.0


DCR Max. (Ω)


Rated Voltage (V)

Insulation ResistanceMin. (MΩ)

Capacitance @0.5V 1MHz

Max (pF)

Leakage Current @5V

Max (μA)

TNFE Series

0806 (EIA 03025)

TNFE0806R90002A 90 3.5 100 5 10 0.2 0.05

SPECIFICATIONS

STANDARD PACKING

Size (EIA) 0806 (03025) 1012 (0405)



MCA 2012 B 900 G B E

1 2 3 4 5 6 7

10

MCA Series

COMMON MODE FILTER

• Powerful components with composite co-fired materials to solve EMI problem for high speed differential signal transmission line as USB and Ethernet without distortion to high speed signal transmission.

FEATURES

• USB, LVDS serial interface in mobile device.; Ethernet interface in 3C device.

APPLICATIONS

PART NUMBER

(1) Product Type MCA= Multilayer Array type Common mode filter

(2) Dimension Code

(3) Speed Identification Code: B= For General use


(5) Rated Current Code E=200mA, F=300mA, G=400mA, H=500mA, I=600mA, J=700mA, K=800mA



Size (EIA) 2012 (0805) Array 3216 (1206) ArrayA 2.00±0.20 3.20±0.20

B 1.25±0.20 1.60±0.20C 1.00±0.10 1.00±0.10D 0.25±0.20 0.45±0.15

E 0.50±0.20 0.80±0.10

F 0.25±0.20 0.30±0.20

MCA 2012 series

C

D

A

B

F

E421 3 1 432

56785678

0.50.5

0.75

0.25 0.25

D

F

A

CB

E1 2 3 4 1 2 3 4

8 7 6 58 7 6 5

1.0

0.6

1.0

0.4 0.4

( Top / Bottom )

( Top / Bottom )

( Top / Bottom )

A

EB

F

1 2

4 3

C

5

6

D

0.48

0.3

0.5

0.75

0.5

0.3

0.5

G

H

1 2

4 3

5

6

MCA 3216 series

C

D

A

B

F

E421 3 1 432

56785678

0.50.5

0.75

0.25 0.25

D

F

A

CB

E1 2 3 4 1 2 3 4

8 7 6 58 7 6 5

1.0

0.6

1.0

0.4 0.4

( Top / Bottom )

( Top / Bottom )

( Top / Bottom )

A

EB

F

1 2

4 3

C

5

6

D

0.48

0.3

0.5

0.75

0.5

0.3

0.5

G

H

1 2

4 3

5

6

STANDARD PACKING

Size (EIA) 2012 (0805) 3216 (1206)



SPECIFICATIONS


DCR Max. (Ω)


Rated Voltage (V)


MCA Series2012 (EIA 0805)MCA2012B900GBE 90 0.60 400 10 200

MCA2012B121FBE 120 0.60 300 10 200

3216 (EIA 1206)MCA3216B900GBE 90 0.40 400 10 200

MCA3216B121FBE 120 0.40 300 10 200

MCA3216B181FBE 180 0.50 300 10 200


WCM 2012 BT 900 C E

1 2 3 4 5 6

11

WCM Series

COMMON MODE FILTER

• Powerful components with high common mode impedance at high frequency perform outstanding noise suppression, also realize miniature size and low profile.

• 100% Lead(Pb) & Halogen-Free and RoHS compliant.

• Apply for USB2.0,USB3.0,HDMI,Display Port,SATA interface in laptop,and LVDS, without distortion to high speed signal transmission. MIPI, MHL serial interface in mobile device.

APPLICATIONS

FEATURES

PART NUMBER

(1) Product Type WCM= Wire wound Common mode filter

(2) Dimension Code

(3) Speed Identification Code: BT= For High speed HT= For High cut-off frequency ST= For Ultra High cut-off frequency


(5) Iinternal code

(6) Packaging E=7" Reel Embossed taping

Size (EIA) A B C D1 D2 E

2012 2.00±0.20 1.20±0.20 1.20±0.20 0.55±0.10 0.46±0.10 0.15±0.10


DCR Max.(Ω)


Rated Voltage(V)

WithstandVolt. (Vdc)

Insulation ResistanceMin. (Ω)

WCM2012BT670CE 67 0.25 400 50 125 10M

WCM2012BT900CE 90 0.3 400 50 125 10M

WCM2012BT121CE 120 0.3 400 50 125 10M

WCM2012BT181CE 180 0.35 350 50 125 10M

WCM2012BT261CE 260 0.4 300 50 125 10M

WCM2012BT361CE 360 0.5 300 50 125 10M

WCM2012HT670CE 67 0.3 400 50 125 10M

WCM2012HT900CE 90 0.3 400 50 125 10M

WCM2012ST500CE 50 0.25 400 50 125 10M

WCM2012ST670CE 67 0.3 400 50 125 10M

WCM2012ST900CE 90 0.3 400 50 125 10M

SPECIFICATIONS

A

E

B

D1 D1

C

D2

D2

LG1

HG2

➀ ➁

➃ ➂

2

4 3

1

A

E

B

D1 D1

C

D2

D2

LG1

HG2

➀ ➁

➃ ➂

2

4 3

1STANDARD PACKING

Size (EIA) 2012 (0805)

Quantity (pcs/reel) 3,000


SOLDER LAND INFORMATION Unit: mm

TYPE HT/ST BTL 2.6 2.6

H 1.2 1.25

G1 1.2 1.1

G2 0.5 0.5

A

E

B

D1 D1

C

D2

D2

LG1

HG2

➀ ➁

➃ ➂

2

4 3

1


12

• Powerful components with composite co-fired materials to solve EMI problem for high speed differential signal transmission line as USB, LVDS, HDMI, MIPI, MHL, and Ethernet without distortion to high speed signal transmission.

• Compliant with AEC Q200.

FEATURES

• USB, HDMI,MIPI, MHL, Ethernet serial interface in automotive device.

APPLICATIONS

MCM-W Series

COMMON MODE FILTER (AEC-Q200)

MCM 1012 W 900 F 06 B P

1 2 3 4 5 6 7 8

PART NUMBER

(1) Product Type MCM= Multilayer Common mode filter

(2) Dimension Code

(3) Speed Identification Code: W= For Automotive standard type



(6) Thickness Dimension ex.: 0.6mm → 06



Size (EIA) 1012 (0405) 2012 (0805)A 1.25±0.10 2.00±0.20

B 1.00±0.10 1.25±0.20

C 0.60±0.10 1.00±0.10

D 0.30±0.10 0.40±0.20

E 0.50±0.10 2.10±0.20

F 0.20±0.15 0.30±0.20

MCM 1012 W series MCM 2012 W series

SPECIFICATIONS


DCR Max. (Ω)


Rated Voltage (V)

Withstand Voltage (V)

Insulation Resistance Min.(MΩ)

1012 (EIA 0405)

MCM1012W670F06BP 67 0.50 300 10 25 200

MCM1012W900F06BP 90 0.60 300 10 25 200

2012 (EIA 0805)

MCM2012W670GBE 67 0.40 400 10 25 200

MCM2012W900GBE 90 0.40 400 10 25 200

MCM2012W121GBE 120 0.40 400 10 25 200

MCM2012W161GBE 160 0.50 400 10 25 200

MCM2012W181GBE 180 0.50 400 10 25 200

MCM2012W221FBE 220 0.50 300 10 25 200

1 2

4 3

A

EB

D

F

1 2

4 3

C

0.55

0.7

0.5

0.3

D

C

F

A

B

1 2

4 34

1 2

3

E

0.50.5

0.4

0.75 1.1 0.75

D

C

B

E1 2

34

1 2

34

F 1.00.6

1.0

0.7 1.4 0.7

D

C

FA

B

1 2

4 34

1 2

3

E

0.50.5

0.4

0.75 0.751.1

A

1 2

4 3

A

EB

D

F

1 2

4 3

C

0.75

0.5

0.55

0.3

( Top / Bottom )

( Top / Bottom )

( Top / Bottom )


STANDARD PACKING

Size (EIA) 1012 (0405) 2012 (0805)



1 2

4 3

A

EB

D

F

1 2

4 3

C

0.55

0.7

0.5

0.3

D

C

F

A

B

1 2

4 34

1 2

3

E

0.50.5

0.4

0.75 1.1 0.75

D

C

B

E1 2

34

1 2

34

F 1.00.6

1.0

0.7 1.4 0.7

D

C

FA

B

1 2

4 34

1 2

3

E

0.50.5

0.4

0.75 0.751.1

A

1 2

4 3

A

EB

D

F

1 2

4 3

C

0.75

0.5

0.55

0.3

( Top / Bottom )

( Top / Bottom )

( Top / Bottom )



No

ise frequ

ency:

Gig

a Ban

dN

oise freq

uen

cy: un

der 1G

Hz

MHC1005S

MHC1608S

MHC2012S

MHC3216S

MHC3225S

MHC4516S

MHC4532S

Ultra Low DCR TypeMHC1005P

MHC1608P

MCB0603S/B

MCB1005S/B

MCB1608S

MCB2012S

MCB3216S

MCB3225S

MCB4516S

MCB4532S

MCB0603H

MCB1005H

MCB1608H

MCB2012H

MGB1005G

Multilayer Chip Bead Series use multilayer ferrite design/process for EMI and noise filtering for

general use, high-speed signal lines, power supplies, power supplies with low DC resistance type.

Multilayer Chip Bead

Circuit Type

13EMI/EMC SOLUTION

Chip Ferrite Bead

0

200

400

600

800

1,000

1,200

1 10 100 1,000 10,000

Impe

danc

e [Ω

]

Frequency [MHz]

Impedance vs Frequency

0

200

400

600

800

1,000

1,200

1,400

0 10 100 1,000 10,000

Impe

danc

e (o

hm)

Frequency (MHz)

MCB1608S601MCB1608H601

EMInoise

at MHz

at GHz

Using the impedance(Z) of bead to suppress the EMI noise

Ratedcurrent

Select a suitable circuits (signal-line or power-line)

less than 1A

equal or more than 1A

MGB_G seriesMGB1005G

MCB standard• S/B for general• H for high speed

MHC high current

• Large current up to 6A

HighImpedance at

GHz band

Difference between MCB S type and H typeS type: For general application, suppresses noise in a wide frequency range.H type: For high speed circuit, with less damage to signal waveforms.

0

200

400

600

800

1,000

1,200

1 10 100 1,000 10,000

Impe

danc

e [Ω

]

Frequency [MHz]

Impedance vs Frequency

0

200

400

600

800

1,000

1,200

1,400

0 10 100 1,000 10,000

Impe

danc

e (o

hm)

Frequency (MHz)

MCB1608S601MCB1608H601

EMInoise

at MHz

at GHz

Using the impedance(Z) of bead to suppress the EMI noise

Ratedcurrent

Select a suitable circuits (signal-line or power-line)

less than 1A

equal or more than 1A

MGB_G seriesMGB1005G

MCB standard• S/B for general• H for high speed

MHC high current

• Large current up to 6A

HighImpedance at

GHz band

Difference between MCB S type and H typeS type: For general application, suppresses noise in a wide frequency range.H type: For high speed circuit, with less damage to signal waveforms.

DC POWER LINE

MHC Series

GENERAL SIGNAL LINE Under 10MHz

MCB S/B-Series

HIGH SPEED SIGNAL LINEOver 10MHz

MCB H-Seies


• Effectively ferrite capability over a wide range of frequency (Several MHz to GHz).

• Monolithic inorganic material construction.

• Closed magnetic circuit avoids crosstalk.

• Excellent solderability and heat resistance.

• High reliability.

14

MGB-G Series

CHIP FERRITE BEAD

• RF and wireless communication, information technology equipment which includes computer, laptop, telecommunications, radar detectors, automotive electronics, cellular phones, pagers, audio equipment, PDAs, keyless remote system and Navigator systems.

APPLICATIONS

FEATURES

Size (EIA) L W T E

1005 (0402) 1.00±0.10 0.50±0.10 0.50±0.10 0.25±0.10


Impedance (Ω)±40% @1GHz

DCR Max.(Ω)


1005 (EIA 0402)

MGB1005G601FBP 600 1400 0.85 300

MGB1005G102YBP 1000 2000 1.25 250

SPECIFICATIONS

E

W

T

L

C2C1

P

W

TL

STANDARD PACKING

Size (EIA) 1005 (0402)

Quantity (pcs/reel) 10,000



TYPE A B C1005 (0402) 0.4 1.2~1.4 0.5

BA

C

MGB 1005 G 601 F B P

1 2 3 4 5 6 7

PART NUMBER

(1) Product Type MGB= GHz band chip bead

(2) Dimension Code

(3) Material Code


(5) Rated Current Code E=200mA, Y=250mA, F=300mA, G=400mA, H=500mA, I=600mA, J=700mA, K=800mA


(7) Packaging P=7" Reel Paper taping


15

MCB-S/B Series

CHIP FERRITE BEAD

• Monolithic ferrite material construction

• Closed magnetic circuit avoids crosstalk

• SMD Type & suitable for reflow and wave soldering

• Available in various sizes

• Excellent solderability and heat resistance

• High reliability

• Effectively filtering capability over a wide range of frequency

• Filtering between analog and digital circuitry, clock generation circuitry, I/O interconnects, isolation between RF noisy circuits and logic devices susceptible to functional degradation, power supply filtering to prevent conducted RF energy from corrupting the power generation circuitry, high frequency EMI prevention of computer, printers, VCRs, TVs and portable telephones.

APPLICATIONS

FEATURES

MCB 1005 S 601 F B P

1 2 3 4 5 6 7

PART NUMBER

(1) Product Type MCB= For General chip bead

(2) Dimension Code

(3) Material Code S= Standard Type B= Low DCR Type





E

W

T

L

C2C1

P

W

TL

STANDARD PACKING

Size (EIA) 0603 (0201) 1005 (0402) 1608 (0603) 2012 (0805) 3216 (1206) 3225 (1210) 4516 (1806) 4532 (1812)

Quantity (pcs/reel) 15,000 10,000 4,000 4,000 3,000 2,000 2,000 1,000

Size (EIA) 0603 (0201) 1005 (0402) 1608 (0603) 2012 (0805) 3216 (1206) 3225 (1210) 4516 (1806) 4532 (1812)

L 0.60±0.03 1.00±0.10 1.60±0.15 2.00±0.20 3.20±0.20 3.20±0.20 4.50±0.25 4.50±0.25

W 0.30±0.03 0.50±0.10 0.80±0.15 1.25±0.20 1.60±0.20 2.50±0.20 1.60±0.20 3.20±0.25

T 0.30±0.03 0.50±0.10 0.80±0.15 0.90±0.20 1.10±0.20 1.30±0.20 1.60±0.20 1.50±0.25

E 0.15±0.05 0.25±0.10 0.30±0.20 0.50±0.30 0.50.±0.30 0.50.±0.30 0.60±0.40 0.60±0.40


Size (EIA) 0603 (0201) 1005 (0402) 1608 (0603) 2012 (0805) 3216 (1206) 3225 (1210) 4516 (1806) 4532 (1812)

A 0.2~0.3 0.4 0.7 1.2 2.0 2.0 3.0 3.0

B 0.75~1.05 1.2~1.4 1.8~2.0 3.0~4.0 4.2~5.2 4.2~5.2 5.5~6.5 5.5~6.5

C 0.3 0.5 0.7 1.0 1.2 3.4 1.2 4.22


BA

C


16

MCB-S/B Series

CHIP FERRITE BEAD

Part Number Impedance±25% (Ω)

Test Freq (MHz)

DCR Max.(Ω)

Rated Current (mA)

0603 (EIA 0201)

MCB0603S220HBP 22 100 0.065 500

MCB0603S330HBP 33 100 0.07 500

MCB0603S800EBP 80 100 0.4 200

MCB0603S121EBP 120 100 0.5 200

MCB0603S241EBP 240 100 0.8 200

MCB0603S601CBP 600 100 1.5 100

MCB0603S102CBP 1000 100 2.5 100

MCB0603B600EBP 60 100 0.25 200

MCB0603B121EBP 120 100 0.4 200

MCB0603B241EBP 240 100 0.8 200

MCB0603B471CBP 470 100 1.05 100

MCB0603B601CBP 600 100 1.2 100

1005 (EIA 0402)

MCB1005S100FBP 10 100 0.10 300

MCB1005S200FBP 20 100 0.20 300

MCB1005S300FBP 30 100 0.25 300

MCB1005S400FBP 40 100 0.30 300

MCB1005S600FBP 60 100 0.35 300

MCB1005S700FBP 70 100 0.35 300

MCB1005S121FBP 120 100 0.40 300

MCB1005S241EBP 240 100 0.70 200

MCB1005S301EBP 300 100 0.80 200

MCB1005S471EBP 470 100 1.00 200

MCB1005S601FBP 600 100 1.00 300

MCB1005S102EBP 1000 100 1.50 200

MCB1005B601FBP 600 100 0.60 300

MCB1005B102EBP 1000 100 1.00 200

MCB1005B152DBP 1500 100 1.50 150

MCB1005B182DBP 1800 100 1.50 150

1608 (EIA 0603)

MCB1608S100IBP 10 100 0.05 600

MCB1608S300IBP 30 100 0.08 600

MCB1608S600IBP 60 100 0.10 600

MCB1608S800IBP 80 100 0.10 600

MCB1608S121IBP 120 100 0.15 600

MCB1608S181FBP 180 100 0.30 300

MCB1608S221FBP 220 100 0.30 300

MCB1608S301FBP 300 100 0.35 300

MCB1608S471FBP 470 100 0.40 300

MCB1608S601EBP 600 100 0.45 200

MCB1608S102CBP 1000 100 0.60 100

MCB1608S182CBP 1800 100 0.70 100

MCB1608S252CBP 2500 100 0.70 100

Part Number Impedance±25% (Ω)

Test Freq (MHz)

DCR Max.(Ω)

Rated Current (mA)

2012 (EIA 0805)

MCB2012S300KBP 30 100 0.05 800

MCB2012S400KBP 40 100 0.05 800

MCB2012S600KBP 60 100 0.15 800

MCB2012S800KBP 80 100 0.15 800

MCB2012S121KBP 120 100 0.15 800

MCB2012S221HBP 220 100 0.20 500

MCB2012S301HBP 300 100 0.20 500

MCB2012S601HBP 600 100 0.30 500

MCB2012S102FBP 1000 100 0.35 300

MCB2012S202EBP 2000 100 0.50 200

3216 (EIA 1206)

MCB3216S310KBE 31 100 0.05 800

MCB3216S500KBE 50 100 0.08 800

MCB3216S700KBE 70 100 0.10 800

MCB3216S121IBE 120 100 0.15 600

MCB3216S601HBE 600 100 0.30 500

MCB3216S102HBE 1000 100 0.40 500

MCB3216S122HBE 1200 100 0.40 500

MCB3216S152EBE 1500 50 0.50 200

MCB3216S202EBE 2000 30 0.50 200

3225 (EIA 1210)

MCB3225S600KBE 60 100 0.30 800

MCB3225S900KBE 90 100 0.30 800

4516 (EIA 1806)

MCB4516S800KBE 80 100 0.10 800

MCB4516S151KBE 150 100 0.30 800

4532 (EIA 1812)

MCB4532S700KBE 70 100 0.40 800

MCB4532S800KBE 80 100 0.40 800

MCB4532S121KBE 120 100 0.40 800

SPECIFICATIONS


• Filtering between analog and digital circuitry, clock generation circuitry, I/O interconnects, isolation between RF noisy circuits and logic devices susceptible to functional degradation, power supply filtering to prevent conducted RF energy from corrupting the power generation circuitry.

• Sharp impedance characteristics can effectively minimize attenuation, high frequency EMI prevention of LCD monitor, PDA, Computers, Computer Peripherals, Cellular Equipment, Digital TV, Digital Cameras, Audio/Visual Equipment, DVD, Wireless Communication Devices, MP3/MP4/MP5.

APPLICATIONS

MCB-H Series

CHIP FERRITE BEAD

Size (EIA) 0603 (0201) 1005 (0402) 1608 (0603) 2012 (0805)L 0.60±0.03 1.00±0.10 1.60±0.15 2.00±0.20

W 0.30±0.03 0.50±0.10 0.80±0.15 1.25±0.20

T 0.30±0.03 0.50±0.10 0.80±0.15 0.90±0.20

E 0.15±0.05 0.25±0.10 0.30±0.20 0.50±0.30

Size (EIA) 0603 (0201) 1005 (0402) 1608 (0603) 2012 (0805)A 0.2~0.3 0.4 0.7 1.2

B 0.75~1.05 1.2~1.4 1.8~2.0 3.0~4.0

C 0.3 0.5 0.7 1.0

E

W

T

L

C2C1

P

W

TL

17

• Monolithic ferrite material construction.

• Closed magnetic circuit avoids crosstalk.

• SMD Type & suitable for reflow and wave soldering.

• Available in various sizes.


• With a sharp and high frequency impedance characteristics which can effectively filter high frequency noise without attenuating high frequency signal.

FEATURES

MCB 1005 H 601 F B P

1 2 3 4 5 6 7

PART NUMBER


(2) Dimension Code

(3) Material Code H= For high speed





STANDARD PACKING

Size (EIA) 1005 (0402) 1608 (0603) 2012 (0805)




BA

C


Part Number Impedance (Ω) +/-25%

Test Freq.(MHz)

DCR Max.(Ω)

Rated Current (mA)

0603 (EIA 0201)

MCB0603H100EBP 10 100 0.25 200

MCB0603H220EBP 22 100 0.45 200

MCB0603H330DBP 33 100 0.55 150

MCB0603H470DBP 47 100 0.7 150

MCB0603H560CBP 56 100 1 100

MCB0603H800CBP 80 100 1.3 100

MCB0603H121CBP 120 100 1.5 100

1005 (EIA 0402)

MCB1005H220FBP 22 100 0.35 300

MCB1005H750FBP 75 100 0.40 300

MCB1005H121FBP 120 100 0.55 300

1608 (EIA 0603)

MCB1608H200HBP 20 100 0.25 500

MCB1608H750EBP 75 100 0.35 200

MCB1608H800HBP 80 100 0.35 500

MCB1608H121EBP 120 100 0.45 200

MCB1608H301EBP 300 100 0.45 200

MCB1608H601EBP 600 100 0.50 200

MCB1608H102EBP 1000 100 0.60 200

2012 (EIA 0805)

MCB2012H121EBP 120 100 0.25 200

MCB2012H221EBP 220 100 0.25 200

MCB2012H301EBP 300 100 0.25 200

MCB2012H601EBP 600 100 0.35 200

SPECIFICATIONS

MCB-H Series

CHIP FERRITE BEAD18


MHC-S Series

CHIP FERRITE BEAD

• High current DC power lines

• Circuits where a stable ground in unavailable

APPLICATIONS

19

• Combination of high frequency noise suppression with capability of handing high current The current rating up to 6 Amps with low DCR

FEATURES

MHC 1608 S 102 Z B P A80

1 2 3 4 5 6 7 8

PART NUMBER

(1) Product Type MHC= High currtnt chip bead

(2) Dimension Code

(3) Material Code S= Standard Type


(5) Rated Current Code L=1000mA, M=1500mA, N=2000mA, P=2500mA, Q=3000mA, R=4000mA, U=5000mA, W=6000mA, Z=other (refer to code 8)



(8) Specialized Specification Code ex.: 1A2=1.2A; A80=0.8A

STANDARD PACKING

Size (EIA) 1005 (0402) 1608 (0603) 2012 (0805) 3216 (1206) 3225 (1210) 4516 (1806) 4532 (1812)

Quantity (pcs/reel) 10,000 4,000 4,000 3,000 2,000 2,000 1,000

Size (EIA) 1005 (0402) 1608 (0603) 2012 (0805) 3216 (1206) 3225 (1210) 4516 (1806) 4532 (1812)

L 1.00±0.10 1.60±0.15 2.00±0.20 3.20±0.20 3.20±0.20 4.50±0.25 4.50±0.25

W 0.50±0.10 0.80±0.15 1.25±0.20 1.60±0.20 2.50±0.20 1.60±0.20 3.20±0.25

T 0.50±0.10 0.80±0.15 0.90±0.20 1.10±0.20 1.30±0.20 1.60±0.20 1.50±0.25

E 0.25±0.10 0.30±0.20 0.50±0.30 0.50.±0.30 0.50.±0.30 0.60±0.40 0.60±0.40

E

W

T

L

C2C1

P

W

TL


Size (EIA) 1005 (0402) 1608 (0603) 2012 (0805) 3216 (1206) 3225 (1210) 4516 (1806) 4532 (1812)

A 0.4 0.7 1.2 2.0 2.0 3.0 3.0

B 1.2~1.4 1.8~2.0 3.0~4.0 4.2~5.2 4.2~5.2 5.5~6.5 5.5~6.5

C 0.5 0.7 1.0 1.2 3.4 1.2 4.22


BA

C


MHC-S Series

CHIP FERRITE BEAD


Test Freq.(MHz)

DCR Max.(Ω)

Rated Current (mA)

1005 (EIA 0402)

MHC1005S100NBP 10 100 0.090 2000

MHC1005S300NBP 30 100 0.090 2000

MHC1005S600LBP 60 100 0.200 1000

MHC1005S121MBP 120 100 0.150 1500

1608 (EIA 0603)

MHC1608S300QBP 30 100 0.040 3000

MHC1608S600QBP 60 100 0.040 3000

MHC1608S800QBP 80 100 0.040 3000

MHC1608S121PBP 120 100 0.070 2500

MHC1608S221NBP 220 100 0.090 2000

MHC1608S301NBP 300 100 0.090 2000

MHC1608S471LBP 470 100 0.200 1000

MHC1608S601LBP 600 100 0.200 1000

MHC1608S102ZBPA80 1000 100 0.250 800

2012 (EIA 0805)

MHC2012S310WBP 31 100 0.015 6000

MHC2012S400RBP 40 100 0.030 4000

MHC2012S600QBP 60 100 0.040 3000

MHC2012S800UBP 80 100 0.020 5000

MHC2012S121QBP 120 100 0.040 3000

MHC2012S121UBP 120 100 0.020 5000

MHC2012S221NBP 220 100 0.090 2000

MHC2012S221QBP 220 100 0.040 3000

MHC2012S301NBP 300 100 0.090 2000

MHC2012S331NBP 330 100 0.090 2000

MHC2012S601NBP 600 100 0.090 2000

MHC2012S102LBP 1000 100 0.200 1000

3216 (EIA 1206)

MHC3216S300WBE 30 100 0.015 6000

MHC3216S500WBE 50 100 0.015 6000

MHC3216S800RBE 80 100 0.030 4000

MHC3216S121WBE 120 100 0.015 6000

MHC3216S601PBE 600 100 0.070 2500

MHC3216S122LBE 1200 100 0.200 1000

3225 (EIA 1210)

MHC3225S600MBE 60 100 0.150 1500

MHC3225S102NBE 1000 50 0.090 2000

4516 (EIA 1806)

MHC4516S600WBE 60 100 0.015 6000

MHC4516S851MBE 850 100 0.150 1500

4532 (EIA 1812)

MHC4532S800ZBE9A0 80 100 0.001 9000

MHC4532S121WBE 120 100 0.015 6000

MHC4532S601QBE 600 50 0.040 3000

MHC4532S132QBE 1300 60 0.040 3000

SPECIFICATIONS

20


21

MHC-P Series

CHIP FERRITE BEAD

• High current DC power lines.

• Circuits where a stable ground in unavailable.

APPLICATIONS

• Combination of high frequency noise suppression with capability of handing high current The current rating up to 6 Amps with ultra low DCR.

FEATURES

MHC 1608 P 260 Z 06 B P 6A0

1 2 3 4 5 6 7 8

PART NUMBER


(2) Dimension Code

(3) Material Code P= Low DCR



(6) Thickness Dimension ex.: 0.6mm → 06




Size (EIA) 1005 (0402) 1608 (0603)

L 1.00±0.10 1.60±0.15

W 0.50±0.10 0.80±0.15

T 0.50±0.10 0.80±0.15

E 0.25±0.10 0.30±0.20

Size (EIA) 1005 (0402) 1608 (0603)

A 0.4 0.7

B 1.2~1.4 1.8~2.0

C 0.5 0.7

E

W

T

L

C2C1

P

W

TL

STANDARD PACKING

Size (EIA) 1005 (0402) 1608 (0603)




BA

C


22

MHC-P Series

CHIP FERRITE BEAD


Test Freq.(MHz)

DCR Max.(Ω)

Rated Current (mA)

1005 (EIA 0402)

MHC1005P330ZBP3A0 33 100 0.022 3000

MHC1005P600ZBP2A5 60 100 0.032 2500

MHC1005P800ZBP2A3 80 100 0.038 2300

MHC1005P121ZBP2A0 120 100 0.055 2000

MHC1005P181ZBP1A5 180 100 0.090 1500

MHC1005P221ZBP1A4 220 100 0.100 1400

MHC1005P331ZBP1A2 330 100 0.150 1200

MHC1005P471ZBP1A0 470 100 0.200 1000

MHC1005P601ZBPA90 600 100 0.230 900

1608 (EIA 0603)

MHC1608P260Z06BP6A0 26 100 0.007 6000

MHC1608P300Z06BP5A0 30 100 0.010 5000

MHC1608P700Z06BP3A5 70 100 0.022 3500

MHC1608P101Z06BP3A0 100 100 0.030 3000

MHC1608P121Z06BP3A0 120 100 0.030 3000

MHC1608P221ZBP2A2 220 100 0.050 2200

MHC1608P331ZBP1A7 330 100 0.080 1700

MHC1608P471ZBP1A5 470 100 0.130 1500

MHC1608P601ZBP1A3 600 100 0.150 1300

SPECIFICATIONS


23

• Filtering between analog and digital circuitry, clock generation circuitry, I/O interconnects, isolation between RF noisy circuits and logic devices susceptible to functional degradation, power supply filtering to prevent conducted RF energy from corrupting the power generation circuitry, high frequency EMI prevention of automotive device.

APPLICATIONS

• Monolithic inorganic material construction.• Closed magnetic circuit avoids crosstalk.• SMD Type & suitable for reflow and wave soldering.• Available in various sizes.• Excellent solderability and heat resistance.• High reliability.• Effectively filtering capability over a wide range of frequency.• Compliant with AEC Q200.

FEATURES

MCB-W Series

CHIP FERRITE BEAD (AEC-Q200)

MCB 1005 W 601 F B P B

1 2 3 4 5 6 7 8

PART NUMBER


(2) Dimension Code

(3) Material Code W=For Automotive Standard Type


(5) Rated Current Code A=50mA, E=200mA, F=300mA, G=400mA, H=500mA, I=600mA, J=700mA, K=800mA



(8) Material Code

E

W

T

L

C2C1

P

W

TL

Size (EIA) 1005 (0402) 1608 (0603) 2012 (0805) 3216 (1206)L 1.00±0.10 1.60±0.15 2.00±0.20 3.20±0.20

W 0.50±0.10 0.80±0.15 1.25±0.20 1.60±0.20

T 0.50±0.10 0.80±0.15 0.90±0.20 1.10±0.20

E 0.25±0.10 0.30±0.20 0.50±0.30 0.50±0.30

Size (EIA) 1005 (0402) 1608 (0603) 2012 (0805) 3216 (1206)A 0.4 0.7 1.2 2.0

B 1.2~1.4 1.8~2.0 3.0~4.0 4.2~5.2

C 0.5 0.7 1.0 1.2

STANDARD PACKING

Size (EIA) 1005 (0402) 1608 (0603) 2012 (0805) 3216 (1206)

Quantity (pcs/reel) 10,000 4,000 4,000 3,000



BA

C


24


Test Freq.(MHz)

DCR Max.(Ω)

Rated Current (mA)

1005 (EIA 0402)

MCB1005W700IBP 70 100 0.15 600

MCB1005W121HBP 120 100 0.25 500

MCB1005W241FBP 240 100 0.35 300

MCB1005W601EBPB 600 100 0.65 200

MCB1005W102EBP 1000 100 1.00 200

MCB1005W102EBPB 1000 100 0.90 200

MCB1005W182EBPB 1800 100 1.40 200

1608 (EIA 0603)

MCB1608W121HBP 120 100 0.18 500

MCB1608W221HBP 220 100 0.25 500

MCB1608W471HBP 470 100 0.35 500

MCB1608W601HBP 600 100 0.38 500

MCB1608W102GBP 1000 100 0.50 400

MCB1608W182ABP 1800 100 1.50 50

MCB1608W222ABP 2200 100 1.50 50

MCB1608W252ABP 2500 100 1.50 50

2012 (EIA 0805)

MCB2012W121EBP 120 100 0.15 200

MCB2012W151EBP 150 100 0.15 200

MCB2012W221EBP 220 100 0.20 200

MCB2012W601EBP 600 100 0.30 200

MCB2012W102EBP 1000 100 0.45 200

3216 (EIA 1206)

MCB3216W601EBE 600 100 0.90 200

SPECIFICATIONS

MCB-W Series



25

• Monolithic inorganic material construction.• Closed magnetic circuit avoids crosstalk.• SMD Type & suitable for reflow and wave soldering.• Available in various sizes.• Excellent solderability and heat resistance.• High reliability.• Effectively filtering capability over a wide range of frequency.• With a sharp and high frequency impedance characteristics which can effectively filter high

frequency noise without attenuating high frequency signal.• Compliant with AEC Q200.

FEATURES

MCB-W H Series


APPLICATIONS

• Filtering between analog and digital circuitry, clock generation circuitry, I/O interconnects, isolation between RF noisy circuits and logic devices susceptible to functional degradation, power supply filtering to prevent conducted RF energy from corrupting the power generation circuitry Sharp impedance characteristics can effectively minimize attenuation, high frequency EMI prevention of in automotive device.

MCB 1005 W 121 E B P H

1 2 3 4 5 6 7 8

PART NUMBER


(2) Dimension Code

(3) Material Code W= For Automotive Standard Type


(5) Rated Current Code E=200mA, Y=250mA, F=300mA, G=400mA, H=500mA, I=600mA, J=700mA, K=800mA



(8) Material Code H: For High speed

STANDARD PACKING

Size (EIA) 1005 (0402) 1608 (0603) 2012 (0805)


E

W

T

L

C2C1

P

W

TL

Size (EIA) 1005 (0402) 1608 (0603) 2012 (0805)

L 1.00±0.10 1.60±0.15 2.00±0.20

W 0.50±0.10 0.80±0.15 1.25±0.20

T 0.50±0.10 0.80±0.15 0.90±0.20

E 0.25±0.10 0.30±0.20 0.50±0.30


Size (EIA) 1005 (0402) 1608 (0603) 2012 (0805)

A 0.7 1.2 2.0

B 1.8~2.0 3.0~4.0 4.2~5.2

C 0.7 1.0 1.2


BA

C


26


Test Freq.(MHz)

DCR Max.(Ω)

Rated Current (mA)

1005 (EIA 0402)

MCB1005W750FBPH 75 100 0.40 300

1608 (EIA 0603)

MCB1608W750HBPH 75 100 0.30 500

MCB1608W121EBPH 120 100 0.40 200

MCB1608W241EBPH 240 100 0.45 200

MCB1608W601EBPH 600 100 0.65 200

MCB1608W102CBPH 1000 100 0.85 100

2012 (EIA 0805)

MCB2012W121EBPH 120 100 0.25 200

MCB2012W151EBPH 150 100 0.25 200

MCB2012W221EBPH 220 100 0.25 200

MCB2012W601EBPH 600 100 0.35 200

MCB2012W222EBPH 2200 100 0.60 200

SPECIFICATIONS

MCB-W H Series



27

MHC-W Series


• High current DC power lines in automotive device.

• Circuits where a stable ground in unavailable.

APPLICATIONS

• Combination of high frequency noise suppression with capability of handing high current The current rating up to 6 Amps with ultra low DCR.

• Compliant with AEC Q200.

FEATURES

MHC 1608 W 601 L B P _

1 2 3 4 5 6 7 8

PART NUMBER


(2) Dimension Code

(3) Material Code W= For Automotive Standard Type





(8) Specialized Specification Code ex.: 1A2=1.2A;；A80=0.8A

E

W

T

L

C2C1

P

W

TL

Size (EIA) 1005 (0402) 1608 (0603) 2012 (0805) 3216 (1206) 4516 (1806)L 1.00±0.10 1.60±0.15 2.00±0.20 3.20±0.20 4.50±0.25

W 0.50±0.10 0.80±0.15 1.25±0.20 1.60±0.20 1.60±0.20

T 0.50±0.10 0.80±0.15 0.90±0.20 1.10±0.20 1.60±0.20

E 0.25±0.10 0.30±0.20 0.50±0.30 0.50±0.30 0.60±0.40

Size (EIA) 1005 (0402) 1608 (0603) 2012 (0805) 3216 (1206) 4516 (1806)A 0.4 0.7 1.2 2.0 3.0

B 1.2~1.4 1.8~2.0 3.0~4.0 4.2~5.2 5.5~6.5

C 0.5 0.7 1.0 1.2 1.2

STANDARD PACKING

Size (EIA) 1005 (0402) 1608 (0603) 2012 (0805) 3216 (1206) 3216 (1206)

Quantity (pcs/reel) 10,000 4,000 4,000 3,000 3,000



BA

C


28

MHC-W Series



Test Freq.(MHz)

DCR Max.(Ω)

Rated Current (mA)

1005 (EIA 0402)

MHC1005W100LBP 10 100 0.050 1000

MHC1005W121MBP 120 100 0.090 1500

1608 (EIA 0603)

MHC1608W300LBP 30 100 0.050 1000

MHC1608W600LBP 60 100 0.100 1000

MHC1608W121NBP 120 100 0.050 2000

MHC1608W181MBP 180 100 0.090 1500

MHC1608W221MBP 220 100 0.100 1500

MHC1608W301MBP 300 100 0.150 1500

MHC1608W471LBP 470 100 0.200 1000

MHC1608W601LBP 600 100 0.200 1000

2012 (EIA 0805)

MHC2012W310QBP 31 100 0.015 3000

MHC2012W600QBP 60 100 0.026 3000

MHC2012W221NBP 220 100 0.050 2000

MHC2012W331MBP 330 100 0.090 1500

3216 (EIA 1206)

MHC3216W500QBE 50 100 0.025 3000

MHC3216W121QBE 120 100 0.025 3000

MHC3216W601MBE 600 100 0.090 1500

4516 (EIA 1806)

MHC4516W600WBE 60 100 0.010 6000

MHC4516W102MBE 1000 100 0.150 1500

SPECIFICATIONS


• RF and wireless communication, information technology equipment which includes computer, telecommunications, radar detectors, automotive electronics, cellular phones, pagers, audio equipment, PDAs, keyless remote system and low-voltage power supply modules.

APPLICATIONS

29

MFI Series

CHIP FERRITE INDUCTOR

• The monolithic construction performs high reliability and ensures a closed magnetic flux in a component avoids magnetic leakage and interference.

• Allow for higher mounting density

FEATURES

MFI 1608 _ 2R2 K B P _

1 2 3 4 5 6 7 8

PART NUMBER

(1) Product Type MFI= Multilayer Chip inductor

(2) Dimension Code

(3) Material Code NA= Standard Type P= Low DCR

(4) Impedance Inductance (R=Decimal Point) Unit: uH

(5) Tolerance J= ±5%, K= ±10%, M = ±20%




E

W

T

L

C2C1

P

W

TL

Size (EIA) 1608 (0603) 2012_09 (0805) 2012_12 (0805) 3216 (1206) L 1.60±0.15 2.00±0.20 2.00±0.20 3.20±0.20

W 0.80±0.15 1.25±0.20 1.25±0.20 1.60±0.20

T 0.80±0.15 0.90±0.20 1.25±0.20 1.10±0.20

E 0.30±0.20 0.50±0.30 0.50±0.30 0.50±0.30

* The thickness of 2012 specification under 4.7µH is 0.90±0.20mm

Size (EIA) 1608 (0603) 2012 (0805) 3216 (1206)A 0.7 1.2 2.0

B 1.8~2.0 3.0~4.0 4.2~5.2

C 0.7 1.0 1.2

STANDARD PACKING

Size (EIA) 1005 (0402) 1608 (0603) 2012 (0805) 3216 (1206)

Quantity (pcs/reel) 10,000 4,000 4,000 3,000



BA

C


30

MFI Series


Part Number Inductance & Tolerance (μH)

Q Min.

Test Freq (MHz)

SRF (MHz) Min.

DCR Max.(Ω)


1608 (EIA 0603)

MFI1608R10KBP 0.10±10% 15 25 240 0.50 50

MFI1608R12KBP 0.12±10% 15 25 235 0.50 50

MFI1608R15KBP 0.15±10% 15 25 205 0.60 50

MFI1608R18KBP 0.18±10% 15 25 190 0.60 50

MFI1608R22KBP 0.22±10% 15 25 170 0.80 50

MFI1608R27KBP 0.27±10% 15 25 155 0.80 50

MFI1608R33KBP 0.33±10% 15 25 140 0.80 35

MFI1608R39KBP 0.39±10% 15 25 125 1.00 35

MFI1608R47KBP 0.47±10% 15 25 120 1.00 35

MFI1608R56KBP 0.56±10% 15 25 110 1.55 35

MFI1608R68KBP 0.68±10% 15 25 100 1.70 35

MFI1608R82KBP 0.82±10% 15 25 95 2.10 35

MFI16081R0KBP 1.0±10% 35 10 85 0.60 25

MFI16081R2KBP 1.2±10% 35 10 70 0.80 25

MFI16081R5KBP 1.5±10% 35 10 65 0.80 25

MFI16081R8KBP 1.8±10% 35 10 60 0.80 25

MFI16082R2KBP 2.2±10% 35 10 55 1.00 15

MFI16082R7KBP 2.7±10% 35 10 50 1.20 15

MFI16083R3KBP 3.3±10% 35 10 45 1.40 15

MFI16083R9KBP 3.9±10% 40 10 42 1.60 15

MFI16084R7KBP 4.7±10% 40 10 40 1.80 15

MFI160810RKBP 10±10% 30 2 17 1.85 3

2012 (EIA 0805)

MFI2012R10KBP 0.10±10% 20 25 255 0.30 250

MFI2012R12KBP 0.12±10% 20 25 250 0.30 250

MFI2012R15KBP 0.15±10% 20 25 230 0.40 250

MFI2012R18KBP 0.18±10% 20 25 210 0.40 250

MFI2012R22KBP 0.22±10% 20 25 195 0.50 250

MFI2012R27KBP 0.27±10% 20 25 170 0.50 250

MFI2012R33KBP 0.33±10% 20 25 165 0.50 250

MFI2012R39KBP 0.39±10% 25 25 155 0.60 200

MFI2012R47KBP 0.47±10% 25 25 140 0.60 200

MFI2012R56KBP 0.56±10% 25 25 130 0.70 150

MFI2012R68KBP 0.68±10% 25 25 120 0.80 150

MFI2012R82KBP 0.82±10% 25 25 115 1.00 150

MFI20121R0KBP 1.0±10% 45 10 85 0.40 50

MFI20121R2KBP 1.2±10% 45 10 75 0.50 50

MFI20121R5KBP 1.5±10% 45 10 65 0.50 50

MFI20121R8KBP 1.8±10% 45 10 60 0.60 50

MFI20122R2KBP 2.2±10% 45 10 55 0.60 30

MFI20122R7KBP 2.7 ±10% 45 10 50 0.70 30

MFI20123R3KBP 3.3±10% 45 10 45 0.80 30

MFI20123R9KBP 3.9±10% 45 10 44 0.90 30

MFI20124R7KBP 4.7±10% 45 10 41 1.00 30

MFI20125R6KBE 5.6±10% 50 4 37 0.90 15

MFI20126R8KBE 6.8±10% 50 4 34 1.00 15

MFI20128R2KBE 8.2±10% 50 4 30 1.10 15

MFI201210RKBE 10±10% 50 2 28 1.00 15

MFI201212RKBE 12±10% 50 2 26 1.10 15

MFI201215RKBE 15±10% 35 1 22 0.80 5

MFI201218RKBE 18±10% 35 1 21 0.90 5

SPECIFICATIONS


31

Part Number Inductance & Tolerance (μH)

Q Min.

Test Freq (MHz)

SRF (MHz) Min.

DCR Max.(Ω)


3216 (EIA 1206)

MFI3216R10KBE 0.10±10% 20 25 270 0.25 250

MFI3216R12KBE 0.12±10% 20 25 250 0.30 250

MFI3216R15KBE 0.15±10% 20 25 200 0.30 250

MFI3216R18KBE 0.18±10% 20 25 185 0.40 250

MFI3216R22KBE 0.22±10% 20 25 170 0.40 250

MFI3216R27KBE 0.27±10% 20 25 150 0.50 250

MFI3216R33KBE 0.33±10% 20 25 145 0.50 250

MFI3216R39KBE 0.39±10% 25 25 135 0.50 200

MFI3216R47KBE 0.47±10% 25 25 125 0.60 200

MFI3216R56KBE 0.56±10% 25 25 115 0.70 150

MFI3216R68KBE 0.68±10% 25 25 105 0.80 150

MFI3216R82KBE 0.82±10% 25 25 100 0.90 150

MFI32161R0KBE 1.0±10% 45 10 87 0.40 100

MFI32161R2KBE 1.2±10% 45 10 75 0.50 100

MFI32161R5KBE 1.5±10% 45 10 69 0.50 50

MFI32161R8KBE 1.8±10% 45 10 64 0.50 50

MFI32162R2KBE 2.2±10% 45 10 58 0.60 50

MFI32162R7KBE 2.7±10% 45 10 52 0.60 50

MFI32163R3KBE 3.3±10% 45 10 48 0.70 50

MFI32163R9KBE 3.9±10% 45 10 44 0.80 50

MFI32164R7KBE 4.7±10% 45 10 41 0.90 50

MFI32165R6KBE 5.6±10% 50 4 32 0.80 25

MFI32166R8KBE 6.8±10% 50 4 29 0.90 25

MFI32168R2KBE 8.2±10% 50 4 26 1.00 25

MFI321610RKBE 10±10% 50 2 26 0.60 25

MFI321612RKBE 12±10% 50 2 26 0.60 15

MFI321615RKBE 15±10% 50 1 22 0.70 5

MFI321618RKBE 18±10% 50 1 21 0.70 5

SPECIFICATIONS

MFI Series



32HIGH FREQUENCY CHIP CERAMIC INDUCTOR

E

W

T

L


• High frequency modules (PAs, VCOs, FEMs , etc.), Bluetooth, W-LAN, UWB, and Impedance matching at RF circuits

APPLICATIONS

• Particular ceramic material and coil structure provide high frequency application range up to 10GHz

• Small size and low profile

• Available in various sizes

• Excellent solderability and heat resistance

• Monolithic structure for high reliability

• Good property of Q and high SRF

FEATURES

MCI-HQ/TG Series

Size (EIA) 0603 (0201) 1005 (0402)L 0.60±0.03 1.00±0.10

W 0.30±0.03 0.50±0.10

T 0.30±0.03 0.50±0.10

E 0.10~0.20 0.10~0.30

Size (EIA) 0603 (0201) 1005 (0402)A 0.2~0.3 0.4

B 0.8~0.9 1.4~1.5

C 0.2~0.3 0.5~0.6

STANDARD PACKING

Size (EIA) 0603 (0201) 1005 (0402)




BA

C

MCI 1005 HQ 10N J H B P

1 2 3 4 5 6 7 8

PART NUMBER

(1) Product Type MCI= Multilayer Ceramic inductor

(2) Dimension Code

(3) Material Code HQ=Standard Q TG=High Q

(4) Impedance Inductance (N= Decimal point) Unit: uH ex 4.7nH → 4N7, 39nH → 39N

(5) Tolerance B= ±0.1nH, C = ±0.2nH, S = ±0.3nH, G=±2%, H = ±3%, J = ±5%

(6) Mark H= 1/8 Mark, M= 1/4 Mark, N= No Mark

(7) Soldering B— Lead-Free for whole chip




Part Number Inductance(nH)

InductanceTolerance

Q Min.

Freq.(MHz)

DCR Max. (Ω)

SRF (MHz)Min.

Rated CurrentMax. (mA)

MCI 0603HQ Series

MCI0603HQ0N3_HBP 0.3 B 4 100 0.07 10,000 850

MCI0603HQ0N4_HBP 0.4 B 4 100 0.07 10,000 850

MCI0603HQ0N5_HBP 0.5 B 4 100 0.08 10,000 800

MCI0603HQ0N6_HBP 0.6 B 4 100 0.08 10,000 800

MCI0603HQ0N7_HBP 0.7 B 4 100 0.09 10,000 750

MCI0603HQ0N8_HBP 0.8 B 4 100 0.10 10,000 750

MCI0603HQ0N9_HBP 0.9 B 4 100 0.10 10,000 750

MCI0603HQ1N0_HBP 1.0 B , C , S 4 100 0.14 10,000 600

MCI0603HQ1N1_HBP 1.1 B , C , S 4 100 0.14 10,000 600

MCI0603HQ1N2_HBP 1.2 B , C , S 4 100 0.14 10,000 600

MCI0603HQ1N3_HBP 1.3 B , C , S 4 100 0.14 10,000 600

MCI0603HQ1N5_HBP 1.5 B , C , S 4 100 0.18 10,000 550

MCI0603HQ1N6_HBP 1.6 B , C , S 4 100 0.18 10,000 500

MCI0603HQ1N8_HBP 1.8 B , C , S 4 100 0.19 10,000 500

MCI0603HQ1N9_HBP 1.9 B , C , S 4 100 0.20 10,000 450

MCI0603HQ2N0_HBP 2.0 B , C , S 4 100 0.20 10,000 450

MCI0603HQ2N1_HBP 2.1 B , C , S 4 100 0.20 10,000 450

MCI0603HQ2N2_HBP 2.2 B , C , S 4 100 0.22 10,000 450

MCI0603HQ2N3_HBP 2.3 B , C , S 4 100 0.22 10,000 450

MCI0603HQ2N4_HBP 2.4 B , C , S 4 100 0.24 10,000 450

MCI0603HQ2N7_HBP 2.7 B , C , S 5 100 0.25 10,000 450

MCI0603HQ2N9_HBP 2.9 B , C , S 5 100 0.28 9,500 450

MCI0603HQ3N0_HBP 3.0 B , C , S 5 100 0.28 9,500 450

MCI0603HQ3N2_HBP 3.2 B , C , S 5 100 0.30 9,500 450

MCI0603HQ3N3_HBP 3.3 B , C , S 5 100 0.30 9,500 450

MCI0603HQ3N4_HBP 3.4 B , C , S 5 100 0.30 8,000 400

MCI0603HQ3N6_HBP 3.6 B , C , S 5 100 0.30 8,000 400

MCI0603HQ3N9_HBP 3.9 B , C , S 5 100 0.30 6,500 400

MCI0603HQ4N3_HBP 4.3 B , C , S 5 100 0.40 6,500 350

MCI0603HQ4N7_HBP 4.7 B , C , S 5 100 0.40 6,500 350

MCI0603HQ5N1_HBP 5.1 B , C , S 5 100 0.40 6,500 350

MCI0603HQ5N6_HBP 5.6 B , C , S 5 100 0.40 6,000 350

MCI0603HQ6N2_HBP 6.2 B , C , S 5 100 0.44 6,000 300

MCI0603HQ6N8_HBP 6.8 H , J 5 100 0.50 5,400 300

MCI0603HQ7N5_HBP 7.5 H , J 5 100 0.53 4,800 300

MCI0603HQ8N2_HBP 8.2 H , J 5 100 0.55 4,800 250

MCI0603HQ9N1_HBP 9.1 H , J 5 100 0.62 4,500 250

MCI0603HQ10N_HBP 10 H , J 5 100 0.65 4,500 250

MCI0603HQ12N_HBP 12 H , J 5 100 0.70 3,700 250

MCI0603HQ15N_HBP 15 H , J 5 100 0.80 2,200 250

MCI0603HQ18N_HBP 18 H , J 5 100 0.90 2,200 200

MCI0603HQ22N_HBP 22 H , J 5 100 1.20 2,000 150

MCI0603HQ27N_HBP 27 H , J 4 100 1.80 1,800 140

MCI0603HQ33N_HBP 33 J 4 100 2.10 1,700 120

MCI0603HQ39N_HBP 39 J 4 100 2.40 1,500 120

MCI0603HQ47N_HBP 47 J 4 100 2.80 1,300 100

MCI0603HQ56N_HBP 56 J 4 100 3.00 1,100 80

MCI0603HQ68N_HBP 68 J 4 100 2.66 1,100 80

MCI0603HQ82N_HBP 82 J 4 100 3.37 1,000 70

MCI0603HQR10_HBP 100 J 4 100 3.74 900 60

SPECIFICATIONS

MCI-HQ Series



MCI-HQ Series

SPECIFICATIONS


InductanceTolerance

Q Min.

Freq.(MHz)

DCR Max. (Ω)

SRF (MHz)Min.


MCI 1005HQ Series

MCI1005HQ0N3_HBP 0.3 B 8 100 0.08 10,000 1000

MCI1005HQ0N4_HBP 0.4 B 8 100 0.08 10,000 1000

MCI1005HQ0N5_HBP 0.5 B 8 100 0.08 10,000 1000

MCI1005HQ0N6_HBP 0.6 B 8 100 0.08 10,000 1000

MCI1005HQ0N8_HBP 0.8 B 8 100 0.08 10,000 1000

MCI1005HQ1N0_HBP 1.0 B , C , S 8 100 0.08 10,000 1000

MCI1005HQ1N1_HBP 1.1 B , C , S 8 100 0.08 10,000 1000

MCI1005HQ1N2_HBP 1.2 B , C , S 8 100 0.09 10,000 1000

MCI1005HQ1N3_HBP 1.3 B , C , S 8 100 0.09 10,000 1000

MCI1005HQ1N5_HBP 1.5 B , C , S 8 100 0.10 10,000 1000

MCI1005HQ1N6_HBP 1.6 B , C , S 8 100 0.10 10,000 1000

MCI1005HQ1N8_HBP 1.8 B , C , S 8 100 0.12 10,000 900

MCI1005HQ2N0_HBP 2.0 B , C , S 8 100 0.12 10,000 900

MCI1005HQ2N2_HBP 2.2 B , C , S 8 100 0.13 10,000 900

MCI1005HQ2N4_HBP 2.4 B , C , S 8 100 0.13 10,000 800

MCI1005HQ2N7_HBP 2.7 B , C , S 8 100 0.16 6,000 800

MCI1005HQ3N0_HBP 3.0 B , C , S 8 100 0.16 6,000 800

MCI1005HQ3N3_HBP 3.3 B , C , S 8 100 0.16 6,000 800

MCI1005HQ3N6_HBP 3.6 B , C , S 8 100 0.20 6,000 700

MCI1005HQ3N9_HBP 3.9 B , C , S 8 100 0.20 6,000 700

MCI1005HQ4N3_HBP 4.3 B , C , S 8 100 0.20 6,000 700

MCI1005HQ4N7_HBP 4.7 B , C , S 8 100 0.20 6,000 700

MCI1005HQ5N1_HBP 5.1 B , C , S 8 100 0.23 5,300 600

MCI1005HQ5N6_HBP 5.6 B , C , S 8 100 0.23 4,500 600

MCI1005HQ6N2_HBP 6.2 B , C , S 8 100 0.25 4,500 600

MCI1005HQ6N8_HBP 6.8 G , H , J 8 100 0.25 4,500 600

MCI1005HQ7N5_HBP 7.5 G , H , J 8 100 0.28 4,200 500

MCI1005HQ8N2_HBP 8.2 G , H , J 8 100 0.28 3,700 500

MCI1005HQ9N1_HBP 9.1 G , H , J 8 100 0.30 3,400 500

MCI1005HQ10N_HBP 10 G , H , J 8 100 0.30 3,400 500

MCI1005HQ12N_HBP 12 G , H , J 8 100 0.45 3,000 400

MCI1005HQ13N_HBP 13 G , H , J 8 100 0.50 3,000 400

MCI1005HQ15N_HBP 15 G , H , J 8 100 0.55 2,500 400

MCI1005HQ18N_HBP 18 G , H , J 8 100 0.65 2,200 300

MCI1005HQ22N_HBP 22 G , H , J 8 100 0.70 1,900 300

MCI1005HQ24N_HBP 24 G , H , J 8 100 0.70 1,700 300

MCI1005HQ27N_HBP 27 G , H , J 8 100 0.80 1,700 300

MCI1005HQ33N_HBP 33 G , H , J 8 100 0.90 1,600 200

MCI1005HQ39N_HBP 39 G , H , J 8 100 1.00 1,200 200

MCI1005HQ47N_HBP 47 G , H , J 8 100 1.10 1,100 200

MCI1005HQ56N_HBP 56 G , H , J 8 100 1.10 1,000 200

MCI1005HQ68N_HBP 68 G , H , J 8 100 1.20 800 200

MCI1005HQ82N_HBP 82 H , J 8 100 1.30 600 200

MCI1005HQR10_HBP 100 J 8 100 1.60 600 200

MCI1005HQR12_HBP 120 J 8 100 1.60 600 150

MCI1005HQR15_HBP 150 J 8 100 3.20 550 140



MCI-TG Series

SPECIFICATIONS


InductanceTolerance

Q Min.

Freq.(MHz)

DCR Max. (Ω)

SRF (MHz)Min.


MCI 0603TG Series

MCI0603TG0N3_HBP 0.3 B , C 11 500 0.07 18,000 850

MCI0603TG0N4_HBP 0.4 B , C 11 500 0.07 18,000 850

MCI0603TG0N5_HBP 0.5 B , C 11 500 0.08 18,000 850

MCI0603TG0N6_HBP 0.6 B , C 11 500 0.08 18,000 850

MCI0603TG0N7_HBP 0.7 B , C 12 500 0.09 18,000 750

MCI0603TG0N8_HBP 0.8 B , C 12 500 0.10 18,000 750

MCI0603TG0N9_HBP 0.9 B , C 12 500 0.12 18,000 700

MCI0603TG1N0_HBP 1.0 B , C 12 500 0.14 17,000 600

MCI0603TG1N1_HBP 1.1 B , C 12 500 0.14 17,000 600

MCI0603TG1N2_HBP 1.2 B , C 12 500 0.14 15,000 600

MCI0603TG1N3_HBP 1.3 B , C 12 500 0.15 15,000 600

MCI0603TG1N4_HBP 1.4 B , C 12 500 0.15 14,000 600

MCI0603TG1N5_HBP 1.5 B , C 12 500 0.15 13,500 600

MCI0603TG1N6_HBP 1.6 B , C 12 500 0.15 13,000 600

MCI0603TG1N7_HBP 1.7 B , C 12 500 0.19 12,500 500

MCI0603TG1N8_HBP 1.8 B , C 12 500 0.20 12,500 500

MCI0603TG1N9_HBP 1.9 B , C 12 500 0.20 12,500 450

MCI0603TG2N0_HBP 2.0 B , C 12 500 0.20 12,500 450

MCI0603TG2N1_HBP 2.1 B , C 12 500 0.22 12,000 450

MCI0603TG2N2_HBP 2.2 B , C 12 500 0.22 12,000 450

MCI0603TG2N3_HBP 2.3 B , C 12 500 0.24 11,500 450

MCI0603TG2N4_HBP 2.4 B , C 12 500 0.25 11,000 450

MCI0603TG2N5_HBP 2.5 B , C 12 500 0.25 11,000 450

MCI0603TG2N6_HBP 2.6 B , C 12 500 0.25 11,000 450

MCI0603TG2N7_HBP 2.7 B , C 12 500 0.25 11,000 450

MCI0603TG2N8_HBP 2.8 B , C 12 500 0.25 9,500 450

MCI0603TG2N9_HBP 2.9 B , C 12 500 0.25 9,500 450

MCI0603TG3N0_HBP 3.0 B , C 12 500 0.25 9,500 450

MCI0603TG3N1_HBP 3.1 B , C 12 500 0.30 9,500 450

MCI0603TG3N2_HBP 3.2 B , C 12 500 0.30 9,500 450

MCI0603TG3N3_HBP 3.3 B , C 12 500 0.30 9,500 400

MCI0603TG3N4_HBP 3.4 B , C 12 500 0.30 8,000 400

MCI0603TG3N5_HBP 3.5 B , C 12 500 0.30 8,000 400

MCI0603TG3N6_HBP 3.6 B , C 12 500 0.30 8,000 400

MCI0603TG3N7_HBP 3.7 B , C 12 500 0.30 7,000 400

MCI0603TG3N8_HBP 3.8 B , C 12 500 0.35 7,000 350

MCI0603TG3N9_HBP 3.9 B , C 12 500 0.35 6,500 350

MCI0603TG4N3_HBP 4.3 H , J 12 500 0.40 6,500 350

MCI0603TG4N7_HBP 4.7 H , J 12 500 0.40 6,500 350

MCI0603TG5N1_HBP 5.1 H , J 12 500 0.40 6,500 350

MCI0603TG5N6_HBP 5.6 H , J 12 500 0.44 6,000 300

MCI0603TG6N2_HBP 6.2 H , J 12 500 0.50 6,000 300

MCI0603TG6N8_HBP 6.8 H , J 12 500 0.53 5,400 300

MCI0603TG7N5_HBP 7.5 H , J 12 500 0.55 4,800 250

MCI0603TG8N2_HBP 8.2 H , J 12 500 0.62 4,800 250

MCI0603TG9N1_HBP 9.1 H , J 12 500 0.65 4,500 250

MCI0603TG10N_HBP 10 H , J 11 500 0.70 4,000 250

MCI0603TG12N_HBP 12 H , J 11 500 0.75 3,700 250

MCI0603TG15N_HBP 15 H , J 11 500 0.85 3,100 250

MCI0603TG18N_HBP 18 H , J 11 500 1.00 2,800 200

MCI0603TG22N_HBP 22 H , J 9 500 1.20 2,500 150

MCI0603TG27N_HBP 27 H , J 9 500 1.80 1800 140

MCI0603TG33N_HBP 33 H , J 9 300 2.10 1700 120

MCI0603TG39N_HBP 39 H , J 9 300 2.40 1500 120


36HIGH FREQUENCY CHIP CERAMIC INDUCTOR (AEC-Q200)

MCI-HW/GW Series


APPLICATIONS

• Particular ceramic material and coil structure provide high frequency application range up to 10GHz.

• Small size and low profile.

• Available in various sizes.


FEATURES

MCI 0603 HW 1N0 _ H B P

1 2 3 4 5 6 7 8

PART NUMBER

(1) Product Type MCI= Multilayer Ceramic inductor

(2) Dimension Code

(3) HW: For Automotive Standard Q Type GW: For Automotive High Q Type

(4) Inductance(nH) N means Decimal point , ex: 1.0 nH = 1N0

(5) Tolerance B = ±0.1nH, C = ±0.2nH, S=±0.3nH , G=±2%, H = ±3%, J = ±5%

(6) Mark H = 1/8 Mark, M = 1/4 Mark, N = No Mark

(7) Soldering Green Parts, B= Lead-Free for whole chip


E

W

T

LSize (EIA) 0603 (0201) 1005 (0402)L 0.60±0.03 1.00±0.10

W 0.30±0.03 0.50±0.10

T 0.30±0.03 0.50±0.10

E 0.10~0.20 0.10~0.30

Size (EIA) 0603 (0201) 1005 (0402)A 0.2~0.3 0.4

B 0.8~0.9 1.4~1.5

C 0.2~0.3 0.5~0.6

STANDARD PACKING

Size (EIA) 0603 (0201) 1005 (0402)




BA

C



MCI-HW Series

SPECIFICATIONS


InductanceTolerance

Q Min.

Freq.(MHz)

DCR Max. (Ω)

SRF (MHz)Min.


MCI 0603HW Series

MCI0603HW0N3_HBP 0.3 B 4 100 0.07 10,000 850

MCI0603HW0N4_HBP 0.4 B 4 100 0.07 10,000 850

MCI0603HW0N5_HBP 0.5 B 4 100 0.08 10,000 800

MCI0603HW0N6_HBP 0.6 B 4 100 0.08 10,000 800

MCI0603HW0N7_HBP 0.7 B 4 100 0.09 10,000 750

MCI0603HW0N8_HBP 0.8 B 4 100 0.10 10,000 750

MCI0603HW0N9_HBP 0.9 B 4 100 0.10 10,000 750

MCI0603HW1N0_HBP 1.0 B , C , S 4 100 0.14 10,000 600

MCI0603HW1N1_HBP 1.1 B , C , S 4 100 0.14 10,000 600

MCI0603HW1N2_HBP 1.2 B , C , S 4 100 0.14 10,000 600

MCI0603HW1N3_HBP 1.3 B , C , S 4 100 0.14 10,000 600

MCI0603HW1N5_HBP 1.5 B , C , S 4 100 0.18 10,000 550

MCI0603HW1N6_HBP 1.6 B , C , S 4 100 0.18 10,000 500

MCI0603HW1N8_HBP 1.8 B , C , S 4 100 0.19 10,000 500

MCI0603HW1N9_HBP 1.9 B , C , S 4 100 0.20 10,000 450

MCI0603HW2N0_HBP 2.0 B , C , S 4 100 0.20 10,000 450

MCI0603HW2N1_HBP 2.1 B , C , S 4 100 0.20 10,000 450

MCI0603HW2N2_HBP 2.2 B , C , S 4 100 0.22 10,000 450

MCI0603HW2N3_HBP 2.3 B , C , S 4 100 0.22 10,000 450

MCI0603HW2N4_HBP 2.4 B , C , S 4 100 0.24 10,000 450

MCI0603HW2N7_HBP 2.7 B , C , S 5 100 0.25 10,000 450

MCI0603HW2N9_HBP 2.9 B , C , S 5 100 0.28 9,500 450

MCI0603HW3N0_HBP 3.0 B , C , S 5 100 0.28 9,500 450

MCI0603HW3N2_HBP 3.2 B , C , S 5 100 0.30 9,500 450

MCI0603HW3N3_HBP 3.3 B , C , S 5 100 0.30 9,500 450

MCI0603HW3N4_HBP 3.4 B , C , S 5 100 0.30 8,000 400

MCI0603HW3N6_HBP 3.6 B , C , S 5 100 0.30 8,000 400

MCI0603HW3N9_HBP 3.9 B , C , S 5 100 0.30 6,500 400

MCI0603HW4N3_HBP 4.3 B , C , S 5 100 0.40 6,500 350

MCI0603HW4N7_HBP 4.7 B , C , S 5 100 0.40 6,500 350

MCI0603HW5N1_HBP 5.1 B , C , S 5 100 0.40 6,500 350

MCI0603HW5N6_HBP 5.6 B , C , S 5 100 0.40 6,000 350

MCI0603HW6N2_HBP 6.2 B , C , S 5 100 0.44 6,000 300

MCI0603HW6N8_HBP 6.8 H , J 5 100 0.50 5,400 300

MCI0603HW7N5_HBP 7.5 H , J 5 100 0.53 4,800 300

MCI0603HW8N2_HBP 8.2 H , J 5 100 0.55 4,800 250

MCI0603HW9N1_HBP 9.1 H , J 5 100 0.62 4,500 250

MCI0603HW10N_HBP 10 H , J 5 100 0.65 4,500 250

MCI0603HW12N_HBP 12 H , J 5 100 0.70 3,700 250

MCI0603HW15N_HBP 15 H , J 5 100 0.80 2,200 250

MCI0603HW18N_HBP 18 H , J 5 100 0.90 2,200 200



MCI-HW Series

SPECIFICATIONS


InductanceTolerance

Q Min.

Freq.(MHz)

DCR Max. (Ω)

SRF (MHz)Min.


MCI 1005HW Series

MCI1005HW0N3_HBP 0.3 B 8 100 0.08 10,000 1000

MCI1005HW0N4_HBP 0.4 B 8 100 0.08 10,000 1000

MCI1005HW0N5_HBP 0.5 B 8 100 0.08 10,000 1000

MCI1005HW0N6_HBP 0.6 B 8 100 0.08 10,000 1000

MCI1005HW0N8_HBP 0.8 B 8 100 0.08 10,000 1000

MCI1005HW1N0_HBP 1.0 B , C , S 8 100 0.08 10,000 1000

MCI1005WW1N1_HBP 1.1 B , C , S 8 100 0.08 10,000 1000

MCI1005HW1N2_HBP 1.2 B , C , S 8 100 0.09 10,000 1000

MCI1005HW1N3_HBP 1.3 B , C , S 8 100 0.09 10,000 1000

MCI1005HW1N5_HBP 1.5 B , C , S 8 100 0.10 10,000 1000

MCI1005HW1N6_HBP 1.6 B , C , S 8 100 0.10 10,000 1000

MCI1005HW1N8_HBP 1.8 B , C , S 8 100 0.12 10,000 900

MCI1005HW2N0_HBP 2.0 B , C , S 8 100 0.12 10,000 900

MCI1005HW2N2_HBP 2.2 B , C , S 8 100 0.13 10,000 900

MCI1005HW2N4_HBP 2.4 B , C , S 8 100 0.13 10,000 800

MCI1005HW2N7_HBP 2.7 B , C , S 8 100 0.16 6,000 800

MCI1005HW3N0_HBP 3.0 B , C , S 8 100 0.16 6,000 800

MCI1005HW3N3_HBP 3.3 B , C , S 8 100 0.16 6,000 800

MCI1005HW3N6_HBP 3.6 B , C , S 8 100 0.20 6,000 700

MCI1005HW3N9_HBP 3.9 B , C , S 8 100 0.20 6,000 700

MCI1005HW4N3_HBP 4.3 B , C , S 8 100 0.20 6,000 700

MCI1005HW4N7_HBP 4.7 B , C , S 8 100 0.20 6,000 700

MCI1005HW5N1_HBP 5.1 B , C , S 8 100 0.23 5,300 600

MCI1005HW5N6_HBP 5.6 B , C , S 8 100 0.23 4,500 600

MCI1005HW6N2_HBP 6.2 B , C , S 8 100 0.25 4,500 600

MCI1005HW6N8_HBP 6.8 G , H , J 8 100 0.25 4,500 600

MCI1005HW7N5_HBP 7.5 G , H , J 8 100 0.28 4,200 500

MCI1005HW8N2_HBP 8.2 G , H , J 8 100 0.28 3,700 500

MCI1005HW9N1_HBP 9.1 G , H , J 8 100 0.30 3,400 500

MCI1005HW10N_HBP 10 G , H , J 8 100 0.30 3,400 500

MCI1005HW12N_HBP 12 G , H , J 8 100 0.45 3,000 400

MCI1005HW13N_HBP 13 G , H , J 8 100 0.50 3,000 400

MCI1005HW15N_HBP 15 G , H , J 8 100 0.55 2,500 400

MCI1005HW18N_HBP 18 G , H , J 8 100 0.65 2,200 300

MCI1005HW22N_HBP 22 G , H , J 8 100 0.70 1,900 300

MCI1005HW24N_HBP 24 G , H , J 8 100 0.70 1,700 300

MCI1005HW27N_HBP 27 G , H , J 8 100 0.80 1,700 300

MCI1005HW33N_HBP 33 G , H , J 8 100 0.90 1,600 200

MCI1005HW39N_HBP 39 G , H , J 8 100 1.00 1,200 200

MCI1005HW47N_HBP 47 G , H , J 8 100 1.10 1,100 200

MCI1005HW56N_HBP 56 G , H , J 8 100 1.10 1,000 200

MCI1005HW68N_HBP 68 G , H , J 8 100 1.20 800 200

MCI1005HW82N_HBP 82 H , J 8 100 1.30 600 200

MCI1005HWR10_HBP 100 J 8 100 1.60 600 200



MCI-GW Series

SPECIFICATIONS


InductanceTolerance

Q Min.

Freq.(MHz)

DCR Max. (Ω)

SRF (MHz)Min.


MCI 0603GW Series

MCI0603GW0N3_HBP 0.3 B , C 11 500 0.07 18,000 850

MCI0603GW0N4_HBP 0.4 B , C 11 500 0.07 18,000 850

MCI0603GW0N5_HBP 0.5 B , C 11 500 0.08 18,000 850

MCI0603GW0N6_HBP 0.6 B , C 11 500 0.08 18,000 850

MCI0603GW0N7_HBP 0.7 B , C 12 500 0.09 18,000 750

MCI0603GW0N8_HBP 0.8 B , C 12 500 0.10 18,000 750

MCI0603GW0N9_HBP 0.9 B , C 12 500 0.12 18,000 700

MCI0603GW1N0_HBP 1.0 B , C 12 500 0.14 17,000 600

MCI0603GW1N1_HBP 1.1 B , C 12 500 0.14 17,000 600

MCI0603GW1N2_HBP 1.2 B , C 12 500 0.14 15,000 600

MCI0603GW1N3_HBP 1.3 B , C 12 500 0.15 15,000 600

MCI0603GW1N4_HBP 1.4 B , C 12 500 0.15 14,000 600

MCI0603GW1N5_HBP 1.5 B , C 12 500 0.15 13,500 600

MCI0603GW1N6_HBP 1.6 B , C 12 500 0.15 13,000 600

MCI0603GW1N7_HBP 1.7 B , C 12 500 0.19 12,500 500

MCI0603GW1N8_HBP 1.8 B , C 12 500 0.20 12,500 500

MCI0603GW1N9_HBP 1.9 B , C 12 500 0.20 12,500 450

MCI0603GW2N0_HBP 2.0 B , C 12 500 0.20 12,500 450

MCI0603GW2N1_HBP 2.1 B , C 12 500 0.22 12,000 450

MCI0603GW2N2_HBP 2.2 B , C 12 500 0.22 12,000 450

MCI0603GW2N3_HBP 2.3 B , C 12 500 0.24 11,500 450

MCI0603GW2N4_HBP 2.4 B , C 12 500 0.25 11,000 450

MCI0603GW2N5_HBP 2.5 B , C 12 500 0.25 11,000 450

MCI0603GW2N6_HBP 2.6 B , C 12 500 0.25 11,000 450

MCI0603GW2N7_HBP 2.7 B , C 12 500 0.25 11,000 450

MCI0603GW2N8_HBP 2.8 B , C 12 500 0.25 9,500 450

MCI0603GW2N9_HBP 2.9 B , C 12 500 0.25 9,500 450

MCI0603GW3N0_HBP 3.0 B , C 12 500 0.25 9,500 450

MCI0603GW3N1_HBP 3.1 B , C 12 500 0.30 9,500 450

MCI0603GW3N2_HBP 3.2 B , C 12 500 0.30 9,500 450

MCI0603GW3N3_HBP 3.3 B , C 12 500 0.30 9,500 400

MCI0603GW3N4_HBP 3.4 B , C 12 500 0.30 8,000 400

MCI0603GW3N5_HBP 3.5 B , C 12 500 0.30 8,000 400

MCI0603GW3N6_HBP 3.6 B , C 12 500 0.30 8,000 400

MCI0603GW3N7_HBP 3.7 B , C 12 500 0.30 7,000 400

MCI0603GW3N8_HBP 3.8 B , C 12 500 0.35 7,000 350

MCI0603GW3N9_HBP 3.9 B , C 12 500 0.35 6,500 350



MCI-GW Series

SPECIFICATIONS


InductanceTolerance

Q Min.

Freq.(MHz)

DCR Max. (Ω)

SRF (MHz)Min.


MCI 0603GW Series

MCI0603GW4N3_HBP 4.3 H , J 12 500 0.40 6,500 350

MCI0603GW4N7_HBP 4.7 H , J 12 500 0.40 6,500 350

MCI0603GW5N1_HBP 5.1 H , J 12 500 0.40 6,500 350

MCI0603GW5N6_HBP 5.6 H , J 12 500 0.44 6,000 300

MCI0603GW6N2_HBP 6.2 H , J 12 500 0.50 6,000 300

MCI0603GW6N8_HBP 6.8 H , J 12 500 0.53 5,400 300

MCI0603GW7N5_HBP 7.5 H , J 12 500 0.55 4,800 250

MCI0603GW8N2_HBP 8.2 H , J 12 500 0.62 4,800 250

MCI0603GW9N1_HBP 9.1 H , J 12 500 0.65 4,500 250

MCI0603GW10N_HBP 10 H , J 11 500 0.70 4,000 250

MCI0603GW12N_HBP 12 H , J 11 500 0.75 3,700 250

MCI0603GW15N_HBP 15 H , J 11 500 0.85 3,100 250

MCI0603GW18N_HBP 18 H , J 11 500 1.00 2,800 200


Test item Test condition Criteria Reference

Temperature Cycle

1. Temperature : -40 ~ +85°C

(For MCI Series : -55 ~ +125°C)

2. Cycle : 100 cycles

3. Dwell time : 30minutes

Measurement : at ambient temperature 24 hrs

after test completion

1. No mechanical damage

2. Impedance value should be within ± 20%

of the initial value

3. Inductance value should be within ± 10%


JESD22 A-106B

Operational Life

1. Temperature : 85°C ± 5°C

(For MCB/MGB/MHC S/MFI Series 125°C ± 5°C)

2. Test time : 1000 hrs

3. Apply current : full rated current








MIL-STD-202G

Method 108

Biased Humidity

1. Temperature : 40 ± 2°C

2. Humidity : 90 ~ 95% RH

3. Test time : 1000 hrs

4. Apply current : full rated current








MIL-STD-202G

Method 103

Resistance to Solder Heat

1. Solder temperature : 260 ± 5°C

2. Flux : Rosin

3. DIP time : 10 ± 1 sec

1. More than 95 % of terminal electrode

should be covered with new solder






MIL-STD-202G

Method 210

Solderability Test

1. Solder temperature : 235 ± 5°C

2. Flux : Rosin

3. DIP time : 5 ± 1 sec

More than 95% of terminal electrode should be

covered with new solderJ-STD-002C

For General Products

41APPDENDIX

Reliability and Test Condition


For Automotive Product (Passive Component)

Test item Test condition Criteria Reference

High Temperature Exposure

1. Temperature : 125°C ± 5°C2. Test time : 1000 hrs Measurement: at ambient temperature 24 hrs after test completion

1. No mechanical damage 2. Impedance value should be within ± 30% of the initial value (For MCM Serie within ± 20% of the initial value)3. Inductance value should be within ± 10% of the initial value

MIL-STD-202 Method 108

Temperature Cycling

1. Temperature : -55 ~ +125°C2. Cycle : 1000 cycles3. Dwell time : 30minutes Measurement : at ambient temperature 24 hrs after test completion


JESD22 Method JA-104

Biased Humidity

1. Temperature : 85°C ± 2°C 2. Humidity : 85 % RH3. Test time : 1000 hrs4. Apply current : full rated current Measurement: At ambient temperature 24 hrs after test completion


MIL-STD-202 method 103

Operational Life

1. Temperature : 125°C ± 5°C2. Test time : 1000 hrs3. Apply current : full rated current Measurement: At ambient temperature 24 hrs after test completion



Mechanical Shock Condition F:1500g’s/0.5ms/Half sine No mechanical damage MIL-STD-202 Method 213

Vibration Test

5g's for 20 minutes,12cycles each of 3 orientationsTest from 10-2000Hz.,12cycles each of 3 orientations

No mechanical damage MIL-STD-202 Method 204

Resistance to Solder Heat

1. Solder temperature : 260 ± 5°C2. Flux : Rosin3. DIP time : 10 ± 1 sec

1. More than 95 % of terminal electrode should be covered with new solder2. No mechanical damage3. Impedance value should be within ± 30% of the initial value (For MCM Serie within ± 20% of the initial value)4. Inductance value should be within ± 10% of the initial value


ESD Classification Levels 1C1000 V (DC) to < 2000 V (DC)


AEC-Q200-002

Solderability Test

1. Solder temperature : 235 ± 5°C2. Flux : Rosin3. DIP time : 5 ± 1 sec

More than 95% of terminal electrode should be covered with new solder J-STD-002

Board Flex

60 sec minimum holding time

No mechanical damage AEC-Q200-005

Terminal Strength No mechanical damage INPAQ Specification

DIMENSIONS Apply Force (F) Test Time

0603 2N 5 sec.1005/1012 5N 10 sec.

1608 10N 10 sec.≥ 2012 17.7N 60 sec.

42

Reliability and Test Condition (AEC-Q200)

APPDENDIX


Profile Feature Pb-Free Assembly

Average Ramp-Up Rate(Tsmax to Tp)

3°C /second max.

Preheat

– Temperature Min (Tsmin) 150°C

– Temperature Max (Tsmax) 200°C

– Time (tsmin to tsmax) 60-180 seconds

Time maintained above:

– Temperature (TL) 217°C

– Time (tL) 60-150 seconds

Peak/Classification Temperature (Tp) 260°C

Time within 5°C of actual Peak

Temperature (tp) 20-40 seconds

Ramp-Down Rate 6°C/second max.

Time 25°C to Peak Temperature 8 minutes max.

Recommended soldering profile for lead-free soldering based on JEDEC J-STD-020

43APPDENDIX

Recommended Soldering Conditions


Product ID Product Name INPAQ MuRata TDK Taiyo Yuden Panasonic

Thin Film Common Mode Filter

TNFTNF

06050806

DLPDLP

0Q0N

TCMTCM

06050806

MCFMCF

06050806

EXCEXC

X4CE14CE

Thin Film Common Mode plus ESD

TNFE 0806 TCE 0806

Multilayer Common Mode Filter

MCMMCMMCM

101220123216

DLMDLWDLP

112131

MCZACM

12102012

MCFMCF

12102012

EXCEXC

24CE34CE

Multilayer Common Mode Filter

HCMHCM

10122012

DLPDLW

1121

MCZACM

12102012

MCFMCF

12102012

EXCEXC

24CG34CG

Multilayer Common Mode plus ESD

HCE 1012 LXES 11 EXC 24CS

Chip Common Mode Filter Array

MCAMCA

20123216

DLPDLP

2AD31D

MCZ 2010

Wire Wound Common Mode Filter

WCM 2012 DLW 21 ACM 2012

44APPDENDIX

Cross Reference

Common Mode Filter



Chip Ferrite Bead for GHz Band

MGB 1005G BLM 15HD MMZ 1005D BK 1005LL

Chip Ferrite Bead Standard

MCB MCB MCB MCB MCB MCB MCB MCB

0603S1005S1608S2012S3216S3225S4516S4532S

BLMBLMBLMBLM

03AG15AG18AG21AG

MMZMMZMMZMMZ

0603S1005S1608S2012S

BKBKBKBK

0603HS1005HS1608HS2125HS

Chip Ferrite Bead Low DCR

MCB MCB

0603B1005B

BLMBLM

03AG15AG

MMZMMZ

0603R1005R

BKBK

0603HS1005HS

Chip Ferrite Bead High Speed

MCBMCBMCBMCB

0603H1005H1608H2012H

BLMBLMBLMBLM

03BD15BD18BD21BD

MMZMMZMMZMMZ

0603Y1005Y1608Y2012Y

BKBKBKBK

0603HM1005HM1608HM2012HM

High Current Chip Ferrite Bead

MHCMHCMHCMHCMHCMHCMHC

1005S1608S2012S3216S3225S4516S4532S

BLMBLMBLMBLM

BLM

15PD18PG21PG31PG

41PG

MPZMPZMPZ

1005S1608S2012S

FBMJFBMJFBMJ

FBMJ

1608HS2125HS3216HS

4516HS

High Current Chip Ferrite BeadLow DCR

MHCMHC

1005P1608P

BLMBLM

15PX18KG

MPZMPZ

1005S1608S


Chip Ceramic Inductor

MCI MCI

0603HQ1005HQ LQG 15HS

MLGMLG

0603S1005S

HKHK

06031005

Chip Ceramic Inductor

MCI 0603TG LQP 03TG MLG 0603S

45APPDENDIX

Cross Reference

Chip Ferrite Bead

High Frequency Chip Ceramic Inductor

封底裡空白

業務據點 / SALES SITE

I N PA Q T E C H N O L O G Y C O . , LT D .

佳邦科技股份有限公司

E-M a i l : i n f o@i n p a q.c o m. t w h t t p : / / w w w. i n p a q. c o m . t w h t t p : / / w w w. i n p a q g p. c o m

HEADQUARTERSMIAOLI PLANT35059 苗栗縣竹南鎮公義里 11 鄰科義街 11 號 No.11, Ke-Yi St., Chunan, Miaoli 35059, Taiwan (R.O.C) TEL: +886-37-585-555FAX: +886-37-585-511

SHENZHEN OFFICE518057 廣東省深圳市南山區科技園中區科苑路15 號科興科學園 A 棟 2 單元 802 室RM 802, Unit 2, Bld A, KEXING SCIENCE PARK, No.15, Keyuan Avenue, Central Zone, High-tech Zone, Nanshan District, Shenzhen City, 518057 Guangdong Province, China TEL: +86-755-8279-4585 FAX: +86-755-8279-4565

SHANGHAI OFFICE200235 上海市徐匯區中山西路 1800 號兆豐環球大廈 14 樓 J2 座J2, 14th Floor, Zhao Feng Universe Building Block, No. 1800 Zhongshan West Road, Xuhui District, Shanghai City 200235, China TEL: +86-21-6440-3187 FAX: +86-21-6440-0138

Xian OFFICE710065 中國陝西省西安市高新區丈八一路綠地 SOHO同盟 B 座 608 室710065 Room No.608, Plaza B, GreenLand SOHO Association Zhangbayi Road, Gaoxin Area, Xian CityZone, Shaanxi, ChinaTEL: +86-029-6569-1168FAX: + 86-029-6569-1158

USA OFFICE21 Echo Brook Road, Rochester, NH 03839, U.S.A. TEL: +1-603-332-6222FAX: +1-603-509-2900

TaiwanINPAQ TECHNOLOGY (TAICHUNG) CO., LTD.42881 台中市大雅區秀山村科雅路27號4樓(中科第一期標準廠房四樓)4F, No.27, Keya Road, Daya Dist., Taichung City 42881, Taiwan (R.O.C.)TEL: +886-4-2560-6555 FAX: +886-4-2560-5151

ChinaINPAQ TECHNOLOGY (China) CO., LTD.214105 江蘇省無錫市錫山經濟開發區安鎮安泰一路81號Antai No 1 road 81, AnZheng town, XishanEconomic Development Zone, Wuxi City, 214105JiangSu Province, ChinaTEL: +86-510-8878-5968FAX: +86-510-8878-9918

ChinaINPAQ TECHNOLOGY (SUZHOU) CO., LTD.21543 江蘇省蘇州相城區黃埭鎮潘陽工業園春秋路5號No.5, Chunqiu Road, Panyang Industrial Park,Huangdai Town, Xiangcheng Zone, Suzhou City, 215143 Jiangsu Province, ChinaTEL: +86-512-6571-9988FAX: +86-512-6571-6988

工廠據點 / PLANT SITE

KOREA OFFICE221 Raemian Seocho Univill, 1445-4, Seocho-Dong, Seocho_Gu, Seoul 130-070, KoreaTEL: +82-2-584-8959FAX: +82-2-584-8951

TAIPEI OFFICE11261 台北市北投區立功街 106 號 1 樓1F, No.106, Ligong Street, Beitou District, Taipei City, 11261, Taiwan (R.O.C.) TEL: +886-2-7729-4296FAX: +886-2-2858-5654

AUTHORIZED AGENTRussia: Petersburg, Moscow USA: Seattle, Minnesota, AtlantaGermany: NagoldIndia: BangaloreJapan: Tokyo, Osaka

Sales Site Plant Site Agent

Miaoli (Headquarters)

TaipeiShenzhen

Suzhou

Wuxi

Seoul

Xian

New Hampshire

Taichung

Moscow

Petersburg

Nagold

Atlanta

Bangalore

Shanghai

Minnesota

Seattle

Tokyo

Osaka

Documents

USA OFFICE KOREA OFFICE - МТ Systemmt-system.ru/sites/default/files/docs/Inpaq/inpaq... · 2018. 9. 27. · 2012 3216 0405 0805 1206 5-6 Multilayer Type (For Ultra High Speed) HCM