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US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 1
US CMS Silicon Electronics TestingUS CMS Silicon Electronics Testing
US CMS Lehman Review
BNL5/21/03
A. Affolder
University of California
Santa Barbara
(on behalf of the US TOB testing group)
US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 2
Electronics Testing GroupElectronics Testing Group– Fermilab (FNAL)
• S. Tkaczyk +2 technicians
– University of California, Riverside (UCR)• Gail Hanson, Patrick Gartung
– University of California, Santa Barbara (UCSB)• A. Affolder, S. Burke, C. Campagnari, D. Hale, J.Incandela, S. Levy,
S. Stromberg +2 Undergraduate Students
– University of Illinois, Chicago (UIC)• E. Chabalina, C. Gerber + 1 Graduate Student
– University of Kansas (KU)• A. Bean, L. Christofek, D. Coppage
– University of Rochester (UR)• R. Eusebi, A. Hocker, P. Tipton + 1 Graduate Student
US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 3
OutlineOutline
• Introduction Clean rooms and infrastructure Test stands
• Testing model Plans for production First “300 modules”
• Status of each testing stage Hybrid testing Module testing Module burnin Rod assembly Rod burn-in with interlocks
• Summary
US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 4
OverviewOverviewSS6 TOB5,6 1,800 6 122 - 4,147,200
SS4 TOB3,4 1,450 4 183 - 2,227,200
DS - rphi TOB1,2 1,150 4 183 - 1,766,400
DS - stereo TOB1,2 1,150 4 183 183 1,766,400
5,550 9,907,200
•FNAL and UCSB will have equal production capabilities and capacities
•UCSB will wire bond APV-pitch adaptors and thermal cycle hybrids for US sites FNAL test stands
– 2 of 4 DAQ and 2 of 4 ARCS UCSB test stands
– 1 of 3 DAQ and 3 of 5 ARCS UCR module diagnostics and repair
– 0 of 1 DAQ and 0 of 1 ARC
TOB Module Summary Table
US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 5
FNAL Testing Clean Room FNAL Testing Clean Room
ARCS in place near gantry for quick testing
Space allocated for rods burn-in area, additional ARCS and DAQ (burn-in/repair) stands
US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 6
UCSB Testing Clean RoomsUCSB Testing Clean Rooms•Clean room adjacent to production area 29 m2
Room layout finished Currently in high bay with intentionally
same layout– Missing only hybrid thermal cycling test
Beginning to move into completed area as we speak
•>100 m2 clean room dedicated solely to TOB rod assembly/testing
Currently removing gantry, wirebonder, OGP from space and into new clean room
– Simplifies transportation/storage of rods
US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 7
Other Recent Infrastructure ProjectsOther Recent Infrastructure Projects
•Hybrid holding plates Matches hybrid thermal cycling
test stand Can bond and test with low
noise in same holder
•Hybrid thermal cycler Just beginning design
•Burn-in low voltage distribution crate
LED indicators and fuse protection
•Crowbar HV protection circuit
•Hybrid clamshell•Module clamshell
US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 8
ARCS Based Test Stands ARCS Based Test Stands
•Hybrid testing Hybrid clamshells
•Hybrid thermal-cycler Under construction
•Module testing Module clamshell LED systems DEPP HV supply
Hybrid Clamshell
Module Clamshell
DEPP
LED Controller
ARC Controller
ARC crate
ARCS - APV Readout Controller Software
Purpose - Fast testing of hybrids and modules
Missing hybrid-to-utri adapters
to fully use capacity
US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 9
DAQ Based Test StandsDAQ Based Test Stands
DAQ system – a prototype of the real CMS tracker readout chainPurpose – fast and burn-in testing of modules and rods (detail)
Single Module Test Stand
Module Burn-in
Rod Assembly And Burn-in
Missing necessary testing components for module burn-in and any rod testing
US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 10
The TOB Testing CycleThe TOB Testing Cycle
Quick test hybrids on ARC Gantry constructs modules.
Modules test on ARC
Assemble rods from modules Rod burn-in Rods shipped to CERN
Thermal cycled module
Wir
e
bon
d
Final pinhole test on ARC
Wire bond
Thermal cycle hybrids
US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 11
Production Ramp Production Ramp•Hybrids
Initially hybrids will have pitch adaptors bonded and will be thermally cycled and tested at CERN
Acceptance testing will occur at FNAL and later at UCSB
•Modules production will follow the flow presented earlier
All will be thermally cycled and run overnight with Vienna boxes to look for infant mortality and measure time constant for pinhole creation if applicable.
Separately some will be run longer to try to determine if any failures have longer time constants
•Rod Production Initially we will use whatever
single-rod test software is available
We will likely build single rods and run long-term tests on single rods until adequate multi-rod test software is available
– Interlocking for safety can be done in parallel with a separate pc
US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 12
ARC Hybrid Test Results ARC Hybrid Test Results
•4 (11) hybrids have had APV bonded to pitch adapters at UCSB (FNAL)
2 opens developed in 7680 channels
– Final pitch adaptors will be more uniform even better bonding performance
•Hybrid clamshells enable testing without large pickup effects at chip edges
Same requirements can be made for hybrids with or w/o PA bonded
US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 13
Hybrid Thermal CyclerHybrid Thermal Cycler
•Hybrid pitch adaptor pulsing/thermal cycling test
Acts as short-term burn-in (20 minutes)
– Hybrids (and components) tested for several minutes prior to arrival
•Very custom set-up Sam Burke (UCSB) has begun design
work for electrical system– Baseline provided by CERN
Dave Hale (UCSB) has begun mechanical design
Software for data acquisition and interlocks provided by CERN
•System should be operational in time for need (late summer)
Test/bonding performed by CERN for M800 hybrids
CERN Thermal Cycler
If failure rate determined to be low after first 200-300 hybrids, will
only sample test hybrids
US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 14
ARCS Module TestingARCS Module Testing
• Group’s experience in previous silicon experiments have been used extensively to modify testing procedure
More stableMore descriptive
• Suggestions have been adopted by CMS silicon testing groups
US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 15
ARC Module Testing (2)ARC Module Testing (2)
• Chip “feature” makes low common mode noise extremely important UCSB clamshell decreases
common-mode noise to the point where location of opens become detectable by their noise levels
– PA-sensor– Sensor-sensor
Pinholes act as if saturated High current channels can
have higher noise (Bad IStrip Slight noise increase on chip
edges
Pinholes
PA-sensor opens
Sensor-sensor opens
Bad CAC Bad Istrip
Sensor flaw
PEAK ON
Noisy Strips
US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 16
ARC Module Testing (3)ARC Module Testing (3)
•Gain test (UCSB) Test added to determine
location of opens without optical inspection/LED test
– Necessary for finding opens created during rod assembly/burn-in
Opens clear by higher gain Pinhole clear by lack of gain
Pinholes
Sensor-sensor open
PA-sensor open
Short
US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 17
ARC Module Testing (4)ARC Module Testing (4)
•Analysis macro under development which correlates testing results to determine type of channel defects
Ultimately will output list of bad channels with suggested repairs/rework necessary for module
Additional generates all plots necessary for module QA
•Work will be used to define testing criteria for cross calibration of all CMS strip silicon detectors
US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 18
Module Testing ResultsModule Testing Results
• 18 prototype modules constructed at FNAL Used in rod prototypes and beam tests All of extremely good quality
• 8 production modules have been constructed and tested at FNAL
All of extremely good quality– 0.4% bad channel creation during early production
• 8 production module have been constructed and tested at UCSB All of extremely good quality
– 0.5% bad channel creation during early production• Last 4 modules had no bad channels introduced
– 3 damaged due to wire bonding mistake in the HV bias return line which will not be repeated
• Leads to high bias current (50-800 A)
• Will be used in cross calibration of all test stands
US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 19
Module Burn-in StatusModule Burn-in Status
• Both Vienna boxes used for module burn-in arrived at UCSB
LV distribution + HV controllers ready
Demonstrated basic functionalitySoftware currently does not have
capability for multi-module tests– Patrick Gartung (UCR) and UIC
grad student (as of June) are actively working to improve software
• Once failure rates (if any) established, may be able to sample test
US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 20
Rod Assembly Testing Rod Assembly Testing
• Actively working to finalize rod assembly hardwareVersions of rod assembly rotation table, rod handling tool
and all other tools should be shipped to UCSB soon
• Assembling single rod testing hardwareCommitment from CERN delivery of LV PS and DAQ
componentsCAEN HV PC controllers ordered
• Arrival times of assembly hardware and single rod testing hardware (2-3 months) match production schedule
US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 21
Rod Burn-in Test Facility (UR Group)Rod Burn-in Test Facility (UR Group)
• Peak production at FNAL/UCSB will be at most 10 rods per week per site.
Each site will have capacity to burn-in 8 rods at one time.– 50% contigency
Currently plan 72 hour burn-in cycle– Should be able to reduce to 48 hours, if necessary
Each system to include…– Cold box
– Chiller
– PC/DAQ system for chiller and flow control
– 2nd PC for CMS DAQ system
– LV Power supplies provided by CERN
– HV Power supplies loaned from ‘CERN Prep’
US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 22
Rod Burn-in Stand Status Rod Burn-in Stand Status
• Purchased a chest freezer and low temp chiller
Time from 20C to –25C is ~1.5 hours.
• Chiller DAQ system Flow, temperature control and dew point
interlocks have been specified and quoted.– Low noise equipment similar to CDF
• Rod DAQ systemCommitments for DAQ components made
– Scheduled to be delivered in time for use
Multi-rod software under-development – Group’s involvement in multi-module software should
speed finalization of software
US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 23
Current Estimated Testing Through-putCurrent Estimated Testing Through-put
•Hybrid Arrival Testing 24 hybrids per day at UCSB Matches peak production
(+ contingency) Requires dedicated tech
•Hybrid Thermal Cycling Most components missing Construction should finish in-time
for need (late summer) Test stand will be able to match
production rate
•Module Basic Test 2 ARC LED stands at both sites 12 modules per day Matches peak production
(+ contingency) Requires dedicated tech
•Module Burn-in (Vienna Box) Lack of hybrid-to-utri adapters
limits testing through-put to 1– Should receive more in next few
weeks Current software can only test 1
module at a time
•Rod Assembly Testing Most hardware not delivered yet
– Currently cannot test any rods– Will be able to match production
rate with full compliment of equipment
•Rod Burn-in will start in fall
US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 24
SummarySummary• Production ramp up at FNAL/UCSB has begun
Current hardware/software meet hybrid/module testing needs – Multi-module burn-in software needed in near future
• Group actively working on software We have developed testing protocols to decisively find/diagnose all problem
channels Extremely high quality modules have been made so far
– <0.5% bad channels introduced per module
• We will need more test equipment to achieve peak rate Commitments made to deliver equipment in time
• Rod assembly and test stands under development Equipment specified and ordered
• Rod burn-in infrastructure to be ready in early summer Rod DAQ electronics and software will be ready
• Group’s work on multi-module burn-in software will speed up software development
US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 26
Tracker/DAQ Readout SystemTracker/DAQ Readout System
PLL Delay
MUX 2:1
PLL
APVamplifierspipelines128:1 MUX
Detector Hybrid A-Opto Hybridprocessingbuffering
TTCRx
ADC
Rx Module
FED
DCU
TTC
DAQ
TTCRx
FEC
CCUCCU
CCU CCU
Control
processingbuffering
D-Opto Hybrid
Front End Drivers (FED) digitize the data
Front End Controller (FEC) distributes clock and trigger signals to the front end and sets and monitors all APV parameters
TSCTrigger Sequencer Controller (TSC) generates trigger signals corresponding to a L1 Trigger
Communications and Control Unit (CCU) provides slow control
Return
US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 27
Testing Model (1) (03/01/29)Testing Model (1) (03/01/29)
• Hybrids Shipped to UCSB
– Visual Inspection
– Simple functionality test
– Wire bond pitch adaptors
– Thermal cycle with continuous ARC test and pitch adaptor pulsing
Distributed among FNAL and UCSB for production
– FNAL to repeat simple functionality test for finding transport damage
•Modules Fast test with ARC/LED
– Simple repairs (e.g. pull wirebonds on any newly developed pinholes)
Overnight “burn-in” of modules with Vienna box (sample unless necessary to do all)
Final pinhole check with ARC/LED
Modules stored for later rod installation
US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 28
Testing Model (2) (03/01/29)Testing Model (2) (03/01/29)
• Rods at US SitesReceived and visually inspectedModules mounted on rod
– According to flavor (1 of 24)
– All modules mounted (e.g. 6 at a time for SS rod) and tested
Capacity: 2 SS rods/day per siteLT Test
– Up to 8 rods per site for up to 72 hours with 3 thermal cycles per day sampled data taking
– Recalibrate optohybrid vs temp
Final test at US site
US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 29
ARC Module Testing (3)ARC Module Testing (3)
•Chip “feature” results in loss of entire chip due to saturation effects if few pinholes bonded•LED pinhole test
Bonded multiple inherent pinholes on purpose
LED test always detects pinholes seen in sensor probing
PinholeSensor flaws
Pinholes are clearly identified
US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 30
Rod Assembly Testing (2) Rod Assembly Testing (2)
• PC boardsNow need 5 PCI slot + 1 ISA slot +ethernet + COM port +
LV DI/O card (if necessary)– Neither site has such a computer
1 TSC2 FED2 OEC
– Allows for SS4 rods only
2 DI/O cards
US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder 31
Rod Assembly Testing (3) Rod Assembly Testing (3)
• To get first site read-out rods need the following hardware
1 LV PS1 A1303 CAEN controller1 PC (5 PCI + 1 ISA + ethernet + 1 com + LV DI/O
(maybe))2 Electrometers1 DI/O card1 OEC
• LV PS, A1303, and electrometers all may be long lead time items (2-3 months)