Unlicensed Epd II

8/3/2019 Unlicensed Epd II

http://slidepdf.com/reader/full/unlicensed-epd-ii 1/113

Dimensions of Electronic Product Design

•

Size-miniature-functional elements• Weight

• Power Supply

• Inter-intra module connections/communications

• Environmental limits-dust proof, controlled tempconditions

• Packaging-transport, storage, anti static bag, specialpacking

•

Special cables & connectors, electro-mechanicalcomponents

• Thermal Design-component level, board level &system level-heat sinks-forced cooling

•

EMC/EMI concerns MEC



Dimensions of Electronic Product Design

• Industrial Design-look-safety-user friendly

• Reliability

•

Quality• Maintenance free operations

• Multi-functionality

• Product Variety

MEC



Industrial Design

• Industrial Design is known as the art and

science of increasing the beauty and value of

mass produced products

• The professional service of creating and

developing concepts and specifications that

optimize the function, value, and appearance

of products and systems for mutual benefit of both the user and manufacturer

MEC



Critical Goals of ID

•Utility-The products human interfaces should besafe, easy to use & easy to understand the function

• Appearance-Form/shape/line/proportion/color areused to make the product attractive & pleasing

• Ease of maintenance-The product shouldcommunicate how the maintenance/repair processshould be addressed

• Cost-Cost of product to be kept low

• Communication-Product design should communicatethe corporate design philosophy and mission throughthe visual qualities of the product

MEC



Importance of ID

• ID determines the commercial success of anyproduct

• All products that are used, operated or seen

by customer depend on ID for product success• ID determines the aesthetic appeal and the

quality of the user interfaces of a product

MEC



Need for ID

Ergonomics-Related to humaninterfaces

Aesthetics- Deals with form & finishof the product

MEC



ERGONOMICS NEEDS• Ergonomics or human factorsengineering is the science of fitting tasksto man. Ergonomic Needs:-

• Ease of Use-for frequently/infrequentlyused products

• Ease of Maintenance

MEC



ERGONOMICS cont.

• Number of user interactions for theproduct to function(More interactionmeans more dependency on ID)

• Novelty of the user interactions eg.Improvement in mouse.

• Safety Issues-Safety considerations are

very important-Human anatomy andpsychology issues need to be considered.

MEC



Aesthetic Needs•

Aesthetic needs deals with form & finishof products.-They are:-

• (a) Product Differentiation-Visual

• (b) Pride of ownership --

image/fashion

MEC



Aesthetic Needs cont.

• (c) Motivation of the team-A product

that is aesthetically appealing can

generate a sense of team pride amongthe design and manufacturing staff. Team

pride helps to motive and unify every

one associated with the project

MEC





INDUSTRIAL DESIGN PROCESS cont

• Conceptualization- Product’s form and user interface

designed, simple sketches (Thumbnail sketches)

made, concepts are matched & combined with

technical solutions.

MEC





INDUSTRIAL DESIGN PROCESS cont.

• Further refinement and final concept selection

-- Hard models (using wood, plastic etc) and

information-intensive sketches(rendering) are made.

MEC



INDUSTRIAL DESIGN PROCESS cont.

• Control drawings – It documents functionality,

features, size, color, dimensions, surface finish etc

Coordination withy engineering, manufacturing and

vendorsMEC



Benefits of Using ID

•

Increased Product Appeal• Better Features

• Greater customer satisfaction

• Strong Brand Identity• Product Differentiations

• Price Premium and or

• Increased market share

MEC



Disadvantage of ID-Because of multiplere-works on account of ergonomics &aesthetics may result in delay in theproducts introduction in the marketwhich will likely to have an economiccost

MEC



DFXDesign for …

MEC



DFx methodologies in Product Design

• There will be always a conflict between needs& specifications to a specific issue. To resolve

such issues many teams practice “Design for X

”(DFX) methodologies, where X maycorrespond to one of dozens of quality criteria

such as:-Reliability-Robustness-serviceability-

Environmental impact-manufacturability

(DFM)

MEC



Methodologies for achieving Xs in DFX

• Carry out detail design decisions-canhave substantial impact on product

quality & cost

• Need to address multiple &conflicting

goals by development teams

MEC



Methodologies for achieving Xs in DFX

• Have metrics to compare alternative

designs

• Generate detail creative efforts earlyin the process

•

A well defined method assists thedecision-making process

MEC



DFM

Design for

Manufacturing

MEC



DFM• Economically successful design

implies-high product quality whileminimizing manufacturing cost.

•

DFM is one method for achievingthis goal

• Effective DFM practice leads to low

manufacturing costs with outsacrificing product quality

MEC



DFM cont.

• DFM utilizes information of several

types such as:-sketches, drawings,

product specifications, design

alternatives, detailed understandingof production & assembly process,

estimates of manufacturing cost,

production volumes and ramp-uptiming

MEC



DFM cont.

• DFM requires contributions from

all members of development

team as well as out side experts

• DFM is performed through out

development Process

MEC



DFM Process

• Estimate the manufacturing cost

• Reduce the cost of components

• Reduce the costs of assembly

• Reduce the cost of supportingproduction

•

Consider the impact of DFMdecisions on other factors

MEC





DFM Method cont.

Manufacturing Costs Defined

• Sum of all the expenditures for the

inputs of the system (i.e. purchased

components, energy, raw materials,etc.) and for disposal of the wastes

produced by the system

MEC





Elements of the Manufacturing Cost of a

product

Manufacturing Cost

Components Assembly Overhead

Standard Custom LaborEquipment and

ToolingSupport

Indirect

Allocation

Raw

MaterialProcessing Tooling

The unit manufacturing cost of a product consists of Component Cost, ,Assembly Cost and

Overhead Cost (Standard cost-motors ,switches, electronic chips and screws) Custom parts are made as

per manufactures design from raw materials such as sheet steel ,plastics pellets or aluminum bars

Elements of manufacturing cost of production

MEC



Different Cost Heads

• Component Cost-This is the cost of standard parts & custom parts

• Assembly Costs-Cost of goods

assembled from parts, labor cost &may incur costs for equipment andtooling

• Over head cost- for all other costs.

MEC



Different Cost Heads cont.

There are two types of OH costs:-

1) Support Cost:-material handling, QA,Purchasing, Shipping etc.,

2) Indirect Allocations-cost of manufacturing that can not be directlylinked to a particular product but which

must be paid for to be in business (salary,bldg maintenance etc.,

MEC



DFM M th d t



DFM Method cont.Reduce the Cost of Components

• Understand the Process Constraintsand Cost Drivers

• Redesign Components to EliminateProcessing Steps

• Choose the Appropriate Economic

Scale for the Part Process (Higher thevolume of production lower the cost

MEC

DFM M h d



DFM Method cont.Reduce the Cost of Components

Standardize Components and Processes

Redesign costly parts with the sameperformance while avoiding high

manufacturing costs.

Work closely with design engineers—raise awareness of difficult operations

and high costs.

MEC

h d



DFM Method cont.

Reduce the Cost of Components• Eliminate unnecessary steps.

• Use substitution steps, where

applicable.

• Analysis Tool – Process Flow

Chart and Value Stream Mapping

MEC



Bill of Material (BOM)• The BOM is a list of each individual component in the

product. BOM is created using an indent format inwhich the cost of components & sub assemblies areconsidered along with different cost heads i.e.,fixed/variable costs.

• The cost of standard components are estimated bycomparing similar part to what the firm is alreadyproducing/from vendors.

• Cost of custom components are determined bymanufacturer or by supplier

• Raw material cost could be estimated by computingthe mass of the part, allowing for some scrap

MEC



Indented Bill of Material

Component Purchasedmaterial

Processing(

Machine+la

bor

Assembly(labour)

Total

unit

variabl

e cost

Tooling

and

other

cost

Total

unitfixed

cost

Total cost

Manifold

casting12.83 5.23 18.06 1960 0.50 18.56

pipe 1.30 0.15 1.451.45

valve 1.35 0.14 1.49 1.49

gasket 0.05 0.13 0.18 0.18

Total Direct Cost 15.53 5.23 0.42 21.18 31.680.50

Overhead charges 2.60 9.42 1.710.75 14.48

Total cost 46.16MEC





Reduce the Costs of Assembly

• Design for Assembly (DFA) index

• Integrated Parts (Advantages and

Disadvantages)

• Maximize Ease of Assembly

• Consider Customer Assembly

MEC

DFM cont



DFM cont.

Reduce the costs of Assembly (DFA)

• Yardsticks used for DFA decisions:-

Assembly Efficiency-it is measured as an indexwhich is the ratio of the theoretical minimumassembly time to an estimate of the actual assemblytime for the product, this gives a idea of what drivesthe cost of assembly. The expression for the DFAindex is

DFA index =

(Theoretical minimum number of parts) x (3 seconds)

Estimated total assembly time

MEC



DFM cont. (DFA)

How to Find out the Theoretical MinimumNumber?.

• Does the part need to move relative to therest of the assembly?.

• Must the part be made of a different materialfrom the rest the assembly for fundamentalphysical reasons?.

• Does the part have to be separated fromassembly for assembly access, replacement orrepair

MEC



DFM cont. (DFA)

Integrate Parts-if a part does notqualify as one of those theoreticallynecessary then it can be physicallyintegrated with one or more otherparts. It means that it need not beassembled & less expensive tofabricate than separate part they

replace. It also allow fixing withcritical geometric features to becontrolled fabrication

MEC



DFM cont. (DFA)

Maximize Ease of Assembly-Twoproducts with an identical number of parts may differ in required assembly

time by a factor of two or three

• Consider Customer Assembly-Butcheck quality

MEC

Ideal characteristics of a part for



Ideal characteristics of a part for

Assembling(to reduce cost of assembly)

DFM cont. (DFA)• Part is capable of inserted from the top of the

assembly

• Part is self aligning

• Part does not need to be oriented• Part requires only one hand for assembly

• Part requires no tools

•Part is assembled in a single, linear motion

• Part is secured immediately up on insertion

MEC



Consider Customer Assembly

• Customers will tolerate some

assembly

• Design product so that customerscan easily and assemble correctly

• Customers will likely ignore

directions

MEC

d h f d



Reducing the costs of Supporting production

• A reduction in the number of parts reducesinventory cost

• A reduction in assembly content reduces thenumber of workers required and hence theexpenditure on supervision/HR cost

•

Standardized component reduce the demandson engineering support & quality control

MEC

Reducing the costs of Supporting



Reducing the costs of Supporting

production cont.• Reduce the actual production support

(inventory mgmt, workers etc.,) even if overhead cost estimates do not change.

•

In addition:-Minimize SystemicComplexity by smart design decisions &Error Proofing. Error proofing is thestrategy of anticipating the possible

failure modes of the production systemand take appropriate corrective actionearly in the developing process

MEC



Consider the Impact of DFM Decisions on

Other Factors

• Development Time

• Development Cost

• Product Quality

• External Factors

–Component reuse –Life cycle costs

MEC

C id th i t f DFM D i i



Consider the impact of DFM Decisions

on other Factors

• The impact of DFM on DevelopmentTime-

DFM decision must be evaluated fortheir impact on development time as wellas for their impact on manufacturing cost.

MEC



Consider the impact of DFM

Decisions on other Factors cont.• The impact of DFM on DevelopmentCost-

By applying good projectmanagement practice and theapplication of sound DFM methods

one can develop products with intime and with in budget

MEC



Impact of DFM Decisions

• Impact of DFM on Product Quality-

• ideal conditions -action to decreasemanufacturing cost would improvequality. However,

reliability/robustness needs toconsidered.

MEC



Impact of DFM Decisions cont.

• Impact of DFM on external Factors-

• Component reuse-using resources to

create a low cost component will alsohelp other teams designing similarproducts

• Life cycle costs-Disposal of toxic

materials/service & warranty costs. Theymay not appear in the manufacturing costanalysis they need to be considered onDFM decisions

MEC

Quality By Design



Quality By Design• Quality is defined as ‘the totality of features

and characteristics of a product or servicethat bears on its ability to satisfy stated orimplied needs’

• Quality features can be classified into two

major categories:-• 1.The conformance of the features

designed in the product to the specifications

(process dependent)• 2.The designed features it self (design

dependent)

MEC



Quality By Design cont.

• Product Rating for Quality of ID1) Quality of user Interface

2) Emotional Appeal

3) Ability to Maintain and Repair the Product

4) Appropriate use of Resources

MEC




5) Product Differentiation-This differentiation

arises predominantly from appearance-will a

customer can single out the product in the

store from its appearance? ,will a customercan recollect the product from an ad?. Will it

be recognized when seen on the street?. Does

the product fit with or enhance the corporateidentity

MEC






1) Iso-9001-

ensures conformance to requirements

during design and development, production,

installation and servicing. Therefore,

engineering and manufacturing firms who

design, develop, produce, install and service

their products are covered under thisstandard

MEC




2) ISO-9002-specifies a model for QA when only

production and installation conformance is required

3) ISO-9003-specifies a model for QA in final inspection

and testing.4) ISO-9004-contains guidance on technical,

administrative and human factors affecting the

quality of the products and services

MEC

Sketches & Engineering Drawing of Electronic



S etc es & g ee g a g o ect o c

Products

• Sketches are usually line drawings showing the product inperspective with annotations of key features

• Where as engineering drawing is the principal medium used bymanufacturing as criteria for producing the product

• These drawings are reflections of design engineering drawings butformatted and organized to enhance producibility and protectedfrom mass or blanket change

• The drawings are generated using a sequential process of checking& approval

• The drawings are tested during pre production build phase and theproto type build phase

• Parts and materials are purchased based on the drawings

• On receipt of parts and materials, the same is checked andcompared with the drawings

• The manufacturing drawings reflect the product exactly

MEC





Inputs, Control & Display interface

• Interface-the means by which we canconnect/interact with the functionality of a device &user

• Interface Design Theory-Human & cmptr

• a. Design to make easier instruction for human/comptr interactions

• b. Design to discover the most efficient way for

understandable electronic messages• c. Proper diagram of menus, icons, forms as well

as data display and entry norms

MEC

Rules for Interface Design




•Strive for consistency e.g., Dialogue box for samei.e., in CAD or in other applications

• a. same sequence of actions should berequired in similar situations

• b. identical terminology should be used inprompts, menus and help screens

MEC




• c. consistent color, layout, fonts etc should beemployed throughout

•

Enable frequent users to use shortcuts-toincrease the pace of interaction useabbreviation, special keys, hidden commandetc.,

•

Offers information feed back-for every useraction the s/w should respond in the sameway e.g., do you want save the file?.

MEC

Rules For Interface design



Rules For Interface design

•Permit easy reversal of action-back, undo

• Reduce short term memory load-by designing

screens where options are clearly visible e.g.,

maximum, minimum, close all clearly visible• Design user friendly sw actions & avoid

tedious sequences of data entry

MEC

Sketches & Engineering Drawing of Electronic



g g g

Products

•

Sketches are usually line drawings showing theproduct in perspective with annotations of keyfeatures

• Where as engineering drawing is the principal

medium used by manufacturing as criteria forproducing the product

• These drawings are reflections of designengineering drawings but formatted and

organized to enhance producibility and protectedfrom mass or blanket change

• The drawings are generated using a sequentialprocess of checking & approval

MEC

Sketches & Engineering Drawing



Sketches & Engineering Drawing

of Electronic Products• The drawings are tested during pre production

build phase and the proto type build phase

• Parts and materials are purchased based onthe drawings

• On receipt of parts and materials, the same ischecked and compared with the drawings

• The manufacturing drawings reflect the

product exactly

MEC



Drawing Release

• A key action in introducing a product intomanufacturing is the official drawing release phase

• From an engineering design point of view, there is noturning back. Official drawing release may be

considered the moment when design is frozen. TheBOM is prepared based on this. Therefore, changesin any of this documentation after the officialdrawing release will require processing through the

established change notice procedure

MEC



Documents

• Market Research -- Ref for design team

• Design Documents -- Ref for Engg team

• Engg Design Document-Ref for

purchase/production• Testing & Maint document-useful for design

team while designing new version of the

product

MEC



Design Documents of Electronic Products

• Block Diagram

• Structure Diagram

• Product Sketches

• Circuit Diagram

• PCB routing guide lines

MEC

Engineering Documents of Electronic



Engineering Documents of Electronic

Products

• BOM-Bill of material-up dated every week

• PCB Lay out

• PCB/CAD file for manufacturing

• Mechanical drawings of enclosures and any

other mechanical parts involved

• Assembly instructions

• Test Plan documents

MEC



Test Documents

• Useful for engineering team to finalize thedesign before production

• Checks confirm the production process

• Helps design engineers to change any designto meet production requirement

• Helps in validating the design specifications

•

Test documents-Environmental Testing &EMI/EMC Compliance testing

MEC



Environmental/EMI-EMC Testing

• Temperature Cycling

• Humidity Test

• Vibration Test

• Bump test

• Conducted EMI Test

•

Radiated EMI test

MEC

Electronic Packaging



Electronic Packaging

• Electronic Packaging is the means by which

system components are interconnected and

integrated to create a product with a desired

functionality. Electronic packaging must

provide for electrical connections betweencomponents, physical support of each

component, thermal management for the heat

dissipated by each component, andconnection of the system to the out side world

MEC



Components of Electronic Packaging

• The most common form of electronic

packaging is the printed circuit assembly

(PCA). The PCA consists of the Printed Circuit

Board (PCB) and the various electroniccomponents that are attached to it, including

integrated circuits (ICs), discrete components,

connectors and modules.

MEC

Common Definitions



• Foot Print-It is the substrate area occupied by the

package components.• Pitch-Is the periodic dimension that characterizes the

spacing between repeating elements of a peripheralor array patterns

• Substrate-The substrate of an electronic assembly isthe system element to which electronic componentsare attached and their respective I/O are connectedtogether (It therefore consists of the bulk substrate

material and one or more layers of conductiverouting for the distribution of electric signals orpower)

MEC





Cont..

• PCB-Printed Circuit Board provides electrical

interconnections as thin metal tracks on

dielectric substrate, which also supports the

components• Discrete Components-It consists of resistors,

capacitors, inductors,

diodes,transistors,oscillators,and switches

MEC

Levels of Electronic Packaging



chipchip

Substrate

for chip

Second level card

assembly

First level package

connector

Back panel or

Mother Board

Third Level Assembly

module

MEC

F ti f P k i



Functions of Packaging

• To provide electrical connections betweenvarious devices

• To provide mechanical support to the product

• To facilitate assembly operations• To distribute power to all component and chip

circuits

•

To protect the circuit from environmental &mechanical damage

MEC

Cont..



Cont..

• Shielding from external electro-magnetic

radiation and interference

• Preventing harmful radiation going out of box

• To remove heat generated from ICs and other

components

• To allow removal and replacement of failed

components

• To facilitate electrical and functional testing of

the circuit

MEC

Levels of packaging



e e s o pac ag g

MEC

L l f P k i



Levels of Packaging

• Level 0 Packaging:

• Interconnections within semiconductor IC

•

Interconnections on a monolithic silicon die

MEC

Chip (IC) Level Packaging (Level 1)



Chip (IC) Level Packaging (Level 1)

• Chip level Packaging is first level packaging. The

chip is connected to its carrier in many differentways:-

• a. Leaded Package(single, dual,quad etc inline)

•

b. TAB/TCP Package (Tape-automated• bonding/Tape carrier package)

• c. COB( chip-on-board)

• d. Flip-chip

• e. BGA (Ball grid Array)

• f. CSP (chip scale packages)

MEC

Flip-Chip Packaging



• Flip-Chip packaging provides the highest interconnection

density for a given area and a very high level of miniaturization.

• The bare die is mounted directly to the substrate,

eliminating the need for an intermediate IC package

• Flip-chip can be cost-effective in very high volume

applications.

• The electrical characteristics of a flip-chip connection are

generally better than a wire-bonded device, due to theelimination of performance-sapping conductance and

capacitance in leads and wire bonds

MEC

Fli Chi P k i



Flip-Chip Packaging

• Flip-chips is difficult to test & high mechanical stress

due to thermal mismatch. Thermal stress issues are

handled by under-filling the assembly with an epoxy• Flip-Chips is used where a high manufacturing yield is

required & extreme miniaturization is of utmost

importance

• Assembly thickness of less than0.5 mm can be

achieved with flip-flop

MEC

B i Fli hi t ti



Basic Flip-chip construction

SUBSTRATE

Metal BumpUnder-fill

IC Die

Solder or conductive

adhesive bond

Cross-section

MEC

Ball Grid Array (BGA)



y ( )

SUBSTRATE

SOLDER BALLS

IC DIE

Flip-Chip IC

Encapsulation

BGA packages utilize a small printed circuit carrier as an interposer between IC and the

printed circuit substrate. The IC is wire-bonded or flip-chipped to the printed circuit carrier

and is encapsulated in a manner similar to a leaded package. The printed circuit carrier routes

the peripheral wire-bonds to an array pattern on the underside of the carrier. The array

pattern is populated with solder balls that function as leads for surface mount attachment to

the printed circuit substrate’

MEC

CSP Package



CSP Package

• CSP Package is similar to BGA package butwith smaller foot-prints than BGA

• Provide the miniaturization and performance

as that of a flip-chip package• Have better testability & reduced mechanical

stress

•

The interposer layer in a CSP can be used totransform the I/O pattern of the device fromperipheral to array

MEC

Discrete Components



Discrete Components• All discrete components are designed to be soldered

on to a PCB substrate (surface mount variety)• Discrete components form a large part of any

portable electronic equipment.

• Functionality, performance, and cost are determined

by the selection of discrete components.

• Discrete components normally have a high tolerancelevels.

•

However, in certain systems high tolerance levels areavoided by having a adjustable discrete components

MEC

l l 2 k i



level 2 packaging

MEC

PCB Assembly (Level 3)



• PCB assembly with single-chip packages,

multi-chip modules and discrete componentsforms the basis of carrier level packagingalternatively known as third level packaging.The other components are connectors,

sockets, power devices, mini transformers,cables etc.

MEC

Cont..



• The major parts of third level package are:-

• 1.Printed circuit carrier( rigid and flexible)

• 2.Connectors (signal, power, sockets)

• 3.Single Chip and multi chip packages

• 4.Discrete components

• 5.Power devices such as transformers &batteries

• 6.Special components such as crystalOscillators, reset switches, speakers

MEC

C t



Connectors

MEC

Connectors



Connectors

• Connectors are an essential part of electronicspacking. A connector serves two purposes:-

• a. Mechanical connection to hold the twocircuits together

• b. Electrical connection to provide signaland power transmission from one circuit toother

MEC

Connectors



Connectors

• Some examples of many uses of connectors are:-• 1.Insertion of adapter cards on a mother board

using a card edge connector

• 2.Memory installation in SIMM sockets

• 3.Connecting power supply to various I/O device• 4.HDD,FDD and CD_ROM connections to the

mother board using cable connectors and pinheaders

•5.Key board and mouse connection to PC

• 6.Board-to Board connection using flat cableconnector

MEC



MEC



MEC

Connector Contacts



Connector Contacts

• Gold-plated contacts are used for high reliabilityapplications such as military, tele communications,

medical & high end computers

•

Palladium is a low cost alternative to the gold• Non-noble metals such as tin-lead plating is used for

low end computers, automobile applications &

consumer products because of its low cost

MEC

Connectors



• The high speed circuits require signal propagation

paths that are free of crosstalk and resultingelectrical noise.

• Increased interconnect density means more crosstalk.

•Hence need for proper selection of connectors

• The contact material for connectors depends onmany factors such as:-

• 1.connection density

• 2.component profile• 3.operating environment & reliability

MEC

Design Requirement of Connectors



• Contact force

• Contact resistance• Temperature rise

• Current Density

• Stress relaxation under temperature

• Ease of use

• Performance- High performance connectors forachieving necessary signal fidelity

• Design based on expected mate/demate cycles

• Connector intended only to facilitate the originalsystem assembly need to be rated only for a smallnumber of insertions

MEC

Connectors/wires used in Portable



Electronics

• SMT Type -they are surface mounted to thePCB (board-to Board connection). Known as

LIF/ZIF connector using polyimide/polyester

flex• Heat Seal connectors-Used to achieve very

fine pitch (polyimide flex) or very low cost

(polyester flex) used for connecting systemPCB to LCD

MEC

Connectors/wires used in PortableElectronics



Electronics

• Socket Connectors-used for microprocessor and multi-chip modulesto interface into a system-sockets are costly and used where thesystem is subject to revision/upgrade/postponement (fitting theexpensive component just before shipping)

• Wire cables/flex circuits are often employed for electrical connectionwhen board-to board connection is not possible

• Flex circuits enable a very high density of electrical connections to be

routed in a compact volume, they allow “ distributed” electronics forspace-constrained applications, allow controlled electricalcharacteristics and physical geometry

MEC

assignment



assignment

• FIND NAMES OF ANY 10 TYPES OFCONNECTORS & ITS APPLICATION

• SHORT NOTE ON CABLES (COAXIAL,

UTP,STP,RIBBON, OFC etc.

MEC



Electronic Packaging Metrics



Electronic Packaging Metrics

• Number of connections-total number of interconnect introduced on account of solder joints,adhesive inner-connect or counter terminalinterfaces

• Opportunity count-total number of parts plus totalnumber of connections; the same indicate that eachof these elements represent an opportunity forfailure. A high count means complex & riskier

electronic assembly• Average Pin count (APC)-

MEC

Cont



Cont..

• Average Pin Count-ratio of total number of componentterminals to total number of parts, at system level. Gives aidea of integration level and/or ‘digital-ness’ of the overallproduct. Low APCs reflect a high number of discretes or otherlow-pin count devices often characteristics of analog circuits.

High APCs means a digital circuit-high pin counts

• Connection density-this metric is a ratio of total number of connections to total printed circuit board assembly area in

units of connections per cm

MEC

Cont



Cont..

•Part Density-This metric is a ratio of the total number of partsto total printed circuit board assembly area, in units of components per cm. High part density reflect challenges insurface mount assembly in terms of precision of placement,number of placement and engineering of part clearances.

• Routing Density=3x(average pin count) x (part density)1/2

• part density formula is particularly useful for designer todetermine the required wiring resources needed in a

substrate based on the average pin count and required pindensity of the product 1

MEC

Displays



Displays

• In a portable electronic design the user interface ismost affected by the selection of displays

• Pixel resolution determines the level of graphic detailthat can be displayed in a single image frame

•

Resolutions varies from low-resolution,monochrome, segmented, character-only display tohigh resolution, color displays capable of displayingmillions of pixels

• The color range of display determines the number of

variations of color that can be displayed

MEC

Displays



•

Brightness indicates how much light is emitted fromthe surface of the display-

• Reflective displays have no brightness and rely onreflected ambient light to reveal the contrast andcolor created on the display surface

• Emissive displays generate light at each pixel. Thislight creates the color and contrasts to form theintended image.

• Trans-missive displays use a backlight which is filtered

by the display surface to create color and contrast• Transflective displays reflect ambient light back

through the filtering display surface to create animage.

MEC



MEC

Display Technology



• Most portable electronic devices that have a display use a

flat panel display (FPD) and, in most cases the FPD is basedon LCD technology .Types of FPD:-

• Liquid Crystal Nematic

• Smectic

• Chiral

• Emissive Field Emission• Displays

• Electroluminescent

• Light Emitting polymers

• Microdisplays Liquid Crystal• MEMS

• Electroluminescent

MEC

assignment



• FIND OUT PCB FABRICATION

TECHNIQUES

Unlicensed Epd II

Text of Unlicensed Epd II

Unlicensed Digital Investment Schemes (UDIS) · 2020-03-10 · 8 • Unlicensed Digital Investment Schemes (UDIS) working group’s definition of an unlicensed, digital in-vestment

Lte Unlicensed Coexistence Whitepaper

Unlicensed Business Plan1 (2)

-Unlicensed-Attitude Formation

Unlicensed Presentation 1new.ppt (1)

Understanding LTE-Unlicensed

Unlicensed Spectrum

Unlicensed Spectrum Strategy

Unlicensed Tier4 TalentsScotApr11

Unlicensed WiMax

Dispensing Factsheet: Unlicensed Specials and · 2014-08-11 · Dispensing Factsheet: Unlicensed Specials and Imports The requirements for endorsing unlicensed specials and imports

HandoutMEDICATION ADMINISTRATION FOR UNLICENSED …

Unlicensed Rawls

In brief In an emergency Keep yourself informed: The ... · EPD aren’t forgotten. EPD EPD EPD EPR EPR EPR EPR EPD EPD EPD EPD Medication list With the EPR, all authori-sed persons

Lte unlicensed coexistence

Unlicensed Registered Ministry Standards

Fair Use and Innovation in Unlicensed Wireless Spectrum Use and... · Fair Use and Innovation in Unlicensed Wireless Spectrum LTE unlicensed and Wi-Fi in the 5 GHz unlicensed band

Unlicensed Spectrum PDF

The Road Safety Implications of Unlicensed Driving: A Survey of … · 2005-09-21 · 4.3.1 Length of time driving unlicensed 47 4.3.2 Frequency of unlicensed driving 48 4.3.3 Unlicensed

Active Sires · 2019-08-21 · epd acc #rec bw epd acc #rec ww epd acc #rec yw epd acc #rec milk epd acc #rec tm epd acc sc epd acc #rec fat epd acc #rec rea epd acc ... 0 20 27 11

Unlicensed Medicines & Unlicensed Uses - Westsuffolkccg · Prescribing unlicensed medicines You can prescribe unlicensed medicines but, if you decide to do so, you must: 1. Be satisfied

-Unlicensed-Foreign Exchange

LTE in the Unlicensed Spectrum - · PDF fileAgenda Page –The unlicensed spectrum opportunity –It’s happening in multiple ways: •WLAN inter-working •LTE in the Unlicensed

Unlicensed LTE/WiFi Coexistence

Unlicensed SRSD 22

Quality, Safety and Sourcing in Unlicensed Medicines€¦ · In partnership THE UNLICENSED EPERT with APTUK Quality, Safety and Sourcing in Unlicensed Medicines with Andrew Trouton

Unlicensed Integration with 5G Networks - Wireless Broadband … · 2019-06-24 · Unlicensed Integration with 5G Networks WBA 5G Workgroup. Report Title: Unlicensed Integration with

New TIR – EPD submission process. Contents New TIR-EPD Submission TIR-EPD status check TIR-EPD printable documents Using previously submitted

PES2011 Unlicensed Squad Lists

Nokia LTE for unlicensed spectrum - Cambridge Wireless · PDF fileNokia LTE for unlicensed spectrum White Paper ... LTE principle on unlicensed band LTE operation on the unlicensed