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VP680 User Manual r1.6
UM004 www.abaco.com - 1 -
VP680 User Manual
Abaco Systems, USA
Support Portal
This document is the property of Abaco Systems and may not be copied nor communicated to a third party without the written permission of Abaco Systems.
© Abaco Systems 2016
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Revision History
Document
Revision
Changes Author Peer Review
Quality Approval
Date
0.1 Draft N/A N/A N/A 2011-03-23
0.2 Added FPGA pin out tables. Textual changes. Internally reviewed.
N/A N/A N/A 2011-05-11
0.3 Added direction information on peripheral pins. Added FLASH and configuration info. Added BLAST VIO matrix.
N/A N/A N/A 2011-05-12
1.0 Release N/A N/A N/A 2011-05-12
1.1 Added product photo. Update errata appendix.
N/A N/A N/A 2011-05-13
1.2 Correction of commercial temperature range.
N/A N/A N/A 2011-08-01
1.3 Added OpenVPX profile specification.
Added weight specification.
N/A N/A N/A 2011-09-09
1.4 Added description to section 3.1.2 about a mechanical exception made to the VITA 48.2 standard with regards to the clamshell. Added conduction-cooled clamshell drawing.
N/A N/A N/A 2014-08-21
1.5 Added detail to power supply section, replaced references to Virtex5 with Virtex6
N/A N/A N/A 2015-06-22
1.6 -Added front panel options to section 3.1.1.
-Added VITA 48.1 compliance to section 3.1.1.
RZA IVK IVK 2016-06-23
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Table of Contents
1 Acronyms and related documents ............................................................................. 5
1.1 Acronyms ................................................................................................................ 5
1.2 Related Documents ................................................................................................. 6
2 General description ..................................................................................................... 7
2.1 OpenVPX ................................................................................................................ 7
3 Hardware Specifications ............................................................................................. 8
3.1 Phycisal specifications............................................................................................. 8
3.1.1 Air-cooled ......................................................................................................... 8
3.1.2 Conduction cooled ............................................................................................ 8
3.1.3 Backplane keying ............................................................................................. 9
3.1.4 Front panel layout............................................................................................. 9
3.2 VPX P0 Connector ................................................................................................ 10
3.2.1 Power supply .................................................................................................. 10
3.2.2 Utility plane..................................................................................................... 11
3.2.3 System reset (SYSRESET*) ........................................................................... 11
3.2.4 Bussed GPIO (GDiscrete1) ............................................................................ 11
3.2.5 Battery supply (P1-VBAT) .............................................................................. 12
3.3 VPX P1 Connector ................................................................................................ 12
3.4 VPX P2 Connector ................................................................................................ 14
3.5 Virtex-6 FPGA device ............................................................................................ 16
3.6 Front panel I/O ...................................................................................................... 16
3.6.1 UART over USB ............................................................................................. 16
3.6.2 Status LEDs (CPLD) ...................................................................................... 17
3.6.3 Debug LEDs (FPGA) ...................................................................................... 17
3.7 FPGA Mezzanine Card (FMC) ............................................................................... 18
3.7.1 Bank A (LA, HA) connections ......................................................................... 18
3.7.2 Bank B (HB) connections ............................................................................... 21
3.7.3 Gigabit transceiver connections ...................................................................... 23
3.7.4 Miscellaneous FMC connections .................................................................... 23
3.7.1 I/O Standard Support ..................................................................................... 24
3.7.2 VADJ Programming ........................................................................................ 24
3.8 BLAST sites .......................................................................................................... 25
3.9 Clock Tree ............................................................................................................. 25
3.9.1 AUX_CLK+/- Reference Clock ....................................................................... 26
3.9.2 REF_CLK+/- Reference Clock ........................................................................ 26
3.9.3 On-board MGT Reference Clock .................................................................... 27
3.9.4 FMC MGT Reference Clock ........................................................................... 27
3.9.1 FMC Clock connections.................................................................................. 28
3.9.2 Miscellaneous clock connections .................................................................... 28
3.10 Local I2C bus ..................................................................................................... 28
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3.10.1 Clock Synthesizer (CDCE925) ....................................................................... 29
3.10.2 On-board Voltage and Temperature Monitoring (ADT7411) ........................... 29
3.11 Serial FLASH ..................................................................................................... 30
FPGA Configuration......................................................................................................... 31
3.11.1 JTAG chain .................................................................................................... 31
3.11.2 FLASH storage ............................................................................................... 32
3.11.3 Configuration Controller (CPLD) ..................................................................... 32
3.11.4 User image programming ............................................................................... 33
3.11.5 Safety Configuration Jumper .......................................................................... 33
4 Environment Specifications ...................................................................................... 34
4.1 Temperature .......................................................................................................... 34
4.2 Convection cooling ................................................................................................ 34
4.3 Conduction cooling ................................................................................................ 34
5 Safety .......................................................................................................................... 34
6 EMC ............................................................................................................................ 34
7 Warranty ..................................................................................................................... 35
Appendix A: FPGA Bank Mapping ................................................................................... 36
Appendix B: Errata ............................................................................................................ 38
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1 Acronyms and related documents
1.1 Acronyms
A/D Analog to Digital Converter
BLAST Board Level Advanced Scalable Technology
CPLD Complex Programmable Logic Device
D/A Digital to Analog Converter
DCI Digitally Controlled Impedance
DDR Double Data Rate
DSP Digital Signal Processing
FBGA Fineline Ball Grid Array
FFT Fast Fourier Transformation
FMC FPGA Mezzanine Card
FPDP Front Panel Data Port
FPGA Field Programmable Gate Array
GPIO General Purpose Input/Output
GUI Graphical User Interface
HPC High pin count
IP Intellectual Property
JTAG Join Test Action Group
LED Light Emitting Diode
LSB Least Significant Bit(s)
LVDS Low Voltage Differential Signaling
LVTTL Low Voltage Transistor Logic level
MGT Multi-Gigabit Transceiver
MSB Most Significant Bit(s)
PCB Printed Circuit Board
PCI Peripheral Component Interconnect
PCIe PCI Express
PLL Phase Locked Loop
pps Pulse Per Second
QDR Quadruple Data rate
SDRAM Synchronous Dynamic Random Access memory
sFPDP Serial FPDP
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SPI Serial Peripheral Interconnect
SRAM Synchronous Random Access memory
SRIO Serial Input/Output
SSC Spread Spectrum Clocking
TTL Transistor Logic level
UART Universal Asynchronous Receiver/Transmitter
USB Universal Serial Bus
Table 1: Glossary
1.2 Related Documents
• ANSI/VITA 46.0-2007 Rev1.2, April 2008
• ANSI/VITA 65-2010 Rev1.0, June 2010
• ANSI/VITA 48.2-2010 Rev1.0, July 2010
• ANSI/VITA 57.1-2010 Rev1.1, February 2010
• IEEE 1101.2-1992 IEEE Standard for Mechanical Core Specifications for Conduction-Cooled Eurocards
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2 General description
The VP680 is a high performance ANSI/VITA 46.0 VPX standard compliant card with advanced digital signal processing capabilities. The design has been targeted for customer programmable implementations of complex FPGA algorithms for Digital Signal Processing (DSP) applications. The VP680 product is in the 3U VPX form factor, offering various direct on-board interface options that are closely coupled to large - fast on-board memory resources of the Xilinx Virtex™-6 FPGA. The VP680 is an excellent choice for high performance applications that require the use of accelerated frequency-domain algorithms such as with FFTs. Abaco Systems offers many off-the-shelf Intellectual Property (IP) cores for applications that require the highest level of performance.
BLAST
BLAST
BLAST
XC6VLX130T
XC6VLX195T
XC6VLX240T
XC6VLX365T
XC6VSX315T
XC6VSX475TJTAG
FPGA LED x4 2
FMCVITA 57.1
4x MGT
3.125Gbps
P0
CPLD
Virtex-6
512 Mbit
parallel FLASH
Mini USB 1
(UART)
128 Mbit
SPI FLASH 2
SR
IO/P
CIe
x8
16
0 s
ing
le e
nd
ed
80
LV
DS
pa
irs
P1
P2
SR
IO/P
CIe
x8
LV
DS
x2
4
I2C
optionaloptional
CPLD LED x4
Figure 1: VP680 block diagram
1 UART over USB is not available on conduction cooled VP680 2 Refer to the Appendix for Errata.
2.1 OpenVPX
The VP680 is configurable due to the FPGA and can therefore support quite a few profiles. The reference design support x4 PCIe Gen1 and therefore matches with the following profiles:
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- MOD3-PAY-1D-16.2.6-1 (only using lane 0-1)
- MOD3-PAY-2F-16.2.7-1 (only using DP01)
- MOD3-PAY-1F4U-16.2.8-1 (only using DP01)
Other profiles may be supported but requires a modification in the FPGA firmware.
3 Hardware Specifications
3.1 Phycisal specifications
The VP680 is a 3U (100x160mm) module that can be ordered as air-cooled module or conduction cooled module.
3.1.1 Air-cooled
The air-cooled VP680 complies with the physical dimensions given in ANSI/VITA 46.0 and VITA 48.1 with the exception that the typical PCB thickness is 2.1mm instead of 1.6mm. Normally this should not be an issue for board sliders in an air-cooled system enclosure, but in special cases Abaco Systems can provide a PCB thickness of 1.6mm. Please contact Abaco Systems. The weight of an air cooled VP680, including front panel and BLASTs, excluding FMC is 192 grams.
3.1.2 Conduction cooled
The conduction cooled VP680 is a 1.0” pitch module that complies with ANSI/VITA 48.2 with the exception that the clamshell is 4.96mm longer than specified in the VITA 48.2 standard. The clamshell thermal solution is designed to accommodate an FMC bezel which requires extra length. If this is an issue, please contact Abaco Systems. The clamshell allows system integrators to use their own FMC modules and FMC bezel designs. The clamshell provides additional VPX connector protection for 2-Level Maintenance requirements. Please contact Abaco Systems for full 2-Level Maintenance support.
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The dimensions of the conduction-cooled clamshell are depicted in the following figure.
Figure 2: Conduction-cooled clamshell dimensions (mm)
3.1.3 Backplane keying
Both alignment keys 1 and 2 are placed by default with the un-keyed version (1-1469492-9). Contact Abaco Systems if specific keying is required.
3.1.4 Front panel layout
There are two air cooled front options; with and without FMC bezel cut-out. The front side of the conduction cooled module has an FMC bezel cut-out as well as some small holes for LED viewing. The following front panel options are available:
Air Cooled
• 0.8 inch (IEEE 1101.10 and VITA 46 compliant)
• 1 inch (IEEE 1101.10 – VITA 46)
• 1 inch – VITA 48.1 (as per VITA 65)
Conduction cooled
• 1 inch – VITA 48.2 (as per VITA 65) (Only for convection cooled option)
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FPGA LED 1
FPGA LED 2
FPGA LED 3
CPLD LED 1
CPLD LED 2
CPLD LED 3
CPLD LED 0
FPGA LED 0
Figure 3: Air cooled front (left) and conduction cooled front (right)
3.2 VPX P0 Connector
P0 connector is loaded with three power wafers, three single ended wafers, and two differential wafers. The following table shows the OpenVPX definition for the P0 connector contacts.
Row G Row F Row E Row D Row C Row B Row A
1 Vs1 Vs1 Vs1 N.C. Vs2 Vs2 Vs2
2 Vs1 Vs1 Vs1 N.C. Vs2 Vs2 Vs2
3 Vs3 Vs3 Vs3 N.C. Vs3 Vs3 Vs3
4 SM2 SM3 GND -12V_Aux GND SYSRESET* NVMRO
5 GAP* GA4* GND 3.3V_Aux GND SM0 SM1
6 GA3* GA2* GND +12V_Aux GND GA1* GA0*
7 TCK GND TDO TDI GND TMS TRST*
8 GND REF_CLK- REF_CLK+ GND AUX_CLK- AUX_CLK+ GND
Table 2: VPX P0 connector pin assignment
3.2.1 Power supply
Power is supplied to the VP680 on VPX P0 connector trough three power supply voltages; Vs1, Vs2, and Vs3. The voltage levels are respectively 12V, 3.3V, and 5V. Several on-board DC-DC converters generate the appropriate voltage rails for the different devices and interfaces present on board. The maximum power drawn from the backplane is as follows:
• Vs1 (12V) : Max. 12 Watt
• Vs2 (3.3V) : Max. 30 Watt
• Vs3 (5V) : Max. 30 Watt
These numbers include the maximum power that can be consumed by an AV57.1 compliant FMC.
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The auxiliary power supplies -12V_Aux and +12V_Aux are not connected. The auxiliary power supply 3.3V_Aux is only used to pull up signals Gdiscrete1 and MaskableReset#.
3.2.2 Utility plane
Table 3 shows the utility plane connections to the FPGA. The connections to REF_CLK+/- and AUX_CLK+/- reference clocks are described in section 3.9. Signals SM2 and SM3 are not connected.
FPGA Pin Net Name FPGA Bank
DIR P0, P1
Connector Pin Number Pin Name
AG12 GA0# 33 I P0 A6 GA0*
AL13 GA1# 33 I P0 B6 GA1*
AK13 GA2# 33 I P0 F6 GA2*
AH14 GA3# 33 I P0 G6 GA3*
AH13 GA4# 33 I P0 F5 GA4*
AN14 GAP# 33 I P0 G5 GAP*
AP14 NVMRO 33 I P0 A4 NVMRO
L29 I2C_SCL_VPX 15 I/O P0 B5 SM0
R27 I2C_SDA_VPX 15 I/O P0 A5 SM1
AC12 SYSRESET_I# 33 I P0 B4 SYSRESET*
J24 SYSRESET_O# 24 O
H23 GDISCRETE1_I 24 I P1 G1 GDiscrete1
M22 GDISCRETE1_O 24 O
AE22 MASKABLERESET# 24 I P1 G15 MaskableReset*
G23 SYS_CON# 24 I P1 G5 SYS_CON*
Table 3: Utility plane connections
The I/O standard to be assigned depends on BLAST configuration. Refer to Table 32: BLAST VIO Matrix in the Appendix. The VP680 implements level translation.
3.2.3 System reset (SYSRESET*)
The system reset signal is implemented as input to the FPGA (SYSRESET_I#) and as output from the FPGA and CPLD (SYSRESET_O#). The VP680 will actively drive SYSRESET* low until FPGA configuration is finished, after which SYSRESET* is released (Hi-Z).
3.2.4 Bussed GPIO (GDiscrete1)
The general purpose I/O signal is implemented as input (GDISCRETE1_I) and as output (GDISCRETE1_O). When GDISCRETE1_O is driven low, the VP680 will actively drive GDiscrete1 low. When GDISCRETE1_O is driven high, GDiscrete1 is placed in a high impedance state.
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3.2.5 Battery supply (P1-VBAT)
VBATT connection on the FPGA is used for data stream encryption and needs a continuous power source. The battery supply from the VPX backplane is used to provide FPGA VBATT. A maximum of 15µA is drawn from the VPX backplane.
3.3 VPX P1 Connector
The P1 connector has all positions loaded with differential wafers. A total of 32 differential pairs are available configured as 16 transceiver pairs. The VP680 connects all of those signals to MGT blocks on the FPGA. Possible applications are for instance two times 8 lanes PCI Express or other high-speed differential protocols like Aurora or sFPDP. The single ended signals are part of the utility plane described in section 3.2.2.
Row G Row F Row E Row D Row C Row B Row A
1 Gdiscrete1 GND P1-TX0- P1-TX0+ GND P1-RX0- P1-RX0+
2 GND P1-TX1- P1-TX1+ GND P1-RX1- P1-RX1+ GND
3 P1-VBAT GND P1-TX2- P1-TX2+ GND P1-RX2- P1-RX2+
4 GND P1-TX3- P1-TX3+ GND P1-RX3- P1-RX3+ GND
5 SYS_CON* GND P1-TX4- P1-TX4+ GND P1-RX4- P1-RX4+
6 GND P1-TX5- P1-TX5+ GND P1-RX5- P1-RX5+ GND
7 N.C. GND P1-TX6- P1-TX6+ GND P1-RX6- P1-RX6+
8 GND P1-TX7- P1-TX7+ GND P1-RX7- P1-RX7+ GND
9 N.C. GND P1-TX8- P1-TX8+ GND P1-RX8- P1-RX8+
10 GND P1-TX9- P1-TX9+ GND P1-RX9- P1-RX9+ GND
11 N.C. GND P1-TX10- P1-TX10+ GND P1-RX10- P1-RX10+
12 GND P1-TX11- P1-TX11+ GND P1-RX11- P1-RX11+ GND
13 N.C. GND P1-TX12- P1-TX12+ GND P1-RX12- P1-RX12+
14 GND P1-TX13- P1-TX13+ GND P1-RX13- P1-RX13+ GND
15 MaskableReset* GND P1-TX14- P1-TX14+ GND P1-RX14- P1-RX14+
16 GND P1-TX15- P1-TX15+ GND P1-RX15- P1-RX15+ GND
Table 4: VPX P1 connector pin assignment
FPGA Pin Net Name MGT Block P1
Pin Number Pin Name
N4 P1_RXn00
115
B1 P1_RX0-
N3 P1_RXp00 A1 P1_RX0+
M2 P1_TXn00 E1 P1_TX0-
M1 P1_TXp00 D1 P1_TX0+
L4 P1_RXn01
115
C2 P1_RX1-
L3 P1_RXp01 B2 P1_RX1+
K2 P1_TXn01 F2 P1_TX1-
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K1 P1_TXp01 E2 P1_TX1+
K6 P1_RXn02
115
B3 P1_RX2-
K5 P1_RXp02 A3 P1_RX2+
H2 P1_TXn02 E3 P1_TX2-
H1 P1_TXp02 D3 P1_TX2+
J4 P1_RXn03
115
C4 P1_RX3-
J3 P1_RXp03 B4 P1_RX3+
F2 P1_TXn03 F4 P1_TX3-
F1 P1_TXp03 E4 P1_TX3+
AA4 P1_RXn04
114
B5 P1_RX4-
AA3 P1_RXp04 A5 P1_RX4+
Y2 P1_TXn04 E5 P1_TX4-
Y1 P1_TXp04 D5 P1_TX4+
W4 P1_RXn05
114
C6 P1_RX5-
W3 P1_RXp05 B6 P1_RX5+
V2 P1_TXn05 F6 P1_TX5-
V1 P1_TXp05 E6 P1_TX5+
U4 P1_RXn06
114
B7 P1_RX6-
U3 P1_RXp06 A7 P1_RX6+
T2 P1_TXn06 E7 P1_TX6-
T1 P1_TXp06 D7 P1_TX6+
R4 P1_RXn07
114
C8 P1_RX7-
R3 P1_RXp07 B8 P1_RX7+
P2 P1_TXn07 F8 P1_TX7-
P1 P1_TXp07 E8 P1_TX7+
AG4 P1_RXn08
113
B9 P1_RX8-
AG3 P1_RXp08 A9 P1_RX8+
AH2 P1_TXn08 E9 P1_TX8-
AH1 P1_TXp08 D9 P1_TX8+
AF6 P1_RXn09
113
C10 P1_RX9-
AF5 P1_RXp09 B10 P1_RX9+
AF2 P1_TXn09 F10 P1_TX9-
AF1 P1_TXp09 E10 P1_TX9+
AE4 P1_RXn10
113
B11 P1_RX10-
AE3 P1_RXp10 A11 P1_RX10+
AD2 P1_TXn10 E11 P1_TX10-
AD1 P1_TXp10 D11 P1_TX10+
AC4 P1_RXn11 113
C12 P1_RX11-
AC3 P1_RXp11 B12 P1_RX11+
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AB2 P1_TXn11 F12 P1_TX11-
AB1 P1_TXp11 E12 P1_TX11+
AP6 P1_RXn12
112
B13 P1_RX12-
AP5 P1_RXp12 A13 P1_RX12+
AP2 P1_TXn12 E13 P1_TX12-
AP1 P1_TXp12 D13 P1_TX12+
AM6 P1_RXn13
112
C14 P1_RX13-
AM5 P1_RXp13 B14 P1_RX13+
AN4 P1_TXn13 F14 P1_TX13-
AN3 P1_TXp13 E14 P1_TX13+
AL4 P1_RXn14
112
B15 P1_RX14-
AL3 P1_RXp14 A15 P1_RX14+
AM2 P1_TXn14 E15 P1_TX14-
AM1 P1_TXp14 D15 P1_TX14+
AJ4 P1_RXn15
112
C16 P1_RX15-
AJ3 P1_RXp15 B16 P1_RX15+
AK2 P1_TXn15 F16 P1_TX15-
AK1 P1_TXp15 E16 P1_TX15+
Table 5: VPX P1 connections
3.4 VPX P2 Connector
P2 connector has all positions loaded with differential wafers. A total of 32 differential pairs are available. The VP680 connects 24 differential pairs to LVDS capable I/O on the FPGA. The FPGA can use each differential pair as either input or output. The remaining differential pairs and the single ended signals are not connected.
Row G Row F Row E Row D Row C Row B Row A
1 N.C. GND P2-DP1- P2-DP1+ GND P2-DP0- P2-DP0+
2 GND P2-DP3- P2-DP3+ GND P2-DP2- P2-DP2+ GND
3 N.C. GND P2-DP5- P2-DP5+ GND P2-DP4- P2-DP4+
4 GND P2-DP7- P2-DP7+ GND P2-DP6- P2-DP6+ GND
5 N.C. GND P2-DP9- P2-DP9+ GND P2-DP8- P2-DP8+
6 GND P2-DP11- P2-DP11+ GND P2-DP1- P2-DP10+ GND
7 N.C. GND P2-DP13- P2-DP13+ GND P2-DP12- P2-DP12+
8 GND P2-DP15- P2-DP15+ GND P2-DP14- P2-DP14+ GND
9 N.C. GND P2-DP17- P2-DP17+ GND P2-DP16- P2-DP16+
10 GND P2-DP19- P2-DP19+ GND P2-DP18- P2-DP18+ GND
11 N.C. GND P2-DP21- P2-DP21+ GND P2-DP20- P2-DP20+
12 GND P2-DP23- P2-DP23+ GND P2-DP22- P2-DP22+ GND
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13 N.C. GND N.C. N.C. GND N.C. N.C.
14 GND N.C. N.C. GND N.C. N.C. GND
15 N.C. GND N.C. N.C. GND N.C. N.C.
16 GND N.C. N.C. GND N.C. N.C. GND
Table 6: VPX P2 connector pin assignments
FPGA Pin Net Name P2
Pin Number Pin Name
AP9 P2_DPn00 B1 P2_DP0-
AN9 P2_DPp00 A1 P2_DP0+
AL9 P2_DPn01 E1 P2_DP1-
AK9 P2_DPp01 D1 P2_DP1+
AL8 P2_DPn02 C2 P2_DP2-
AK8 P2_DPp02 B2 P2_DP2+
AJ9 P2_DPn03 F2 P2_DP3-
AH9 P2_DPp03 E2 P2_DP3+
AH8 P2_DPn04 B3 P2_DP4-
AG8 P2_DPp04 A3 P2_DP4+
AF10 P2_DPn05 E3 P2_DP5-
AF9 P2_DPp05 D3 P2_DP5+
AE9 P2_DPn06 C4 P2_DP6-
AD9 P2_DPp06 B4 P2_DP6+
AC9 P2_DPn07 F4 P2_DP7-
AD10 P2_DPp07 E4 P2_DP7+
AB10 P2_DPn08 B5 P2_DP8-
AC10 P2_DPp08 A5 P2_DP8+
AC24 P2_DPn09 E5 P2_DP9-
AC23 P2_DPp09 D5 P2_DP9+
AB23 P2_DPn10 C6 P2_DP10-
AA23 P2_DPp10 B6 P2_DP10+
AA24 P2_DPn11 F6 P2_DP11-
Y24 P2_DPp11 E6 P2_DP11+
V23 P2_DPn12 B7 P2_DP12-
U23 P2_DPp12 A7 P2_DP12+
T23 P2_DPn13 E7 P2_DP13-
T24 P2_DPp13 D7 P2_DP13+
N24 P2_DPn14 C8 P2_DP14-
N23 P2_DPp14 B8 P2_DP14+
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L24 P2_DPn15 F8 P2_DP15-
M23 P2_DPp15 E8 P2_DP15+
M10 P2_DPn16 B9 P2_DP16-
L10 P2_DPp16 A9 P2_DP16+
K9 P2_DPn17 E9 P2_DP17-
L9 P2_DPp17 D9 P2_DP17+
F10 P2_DPn18 C10 P2_DP18-
F9 P2_DPp18 B10 P2_DP18+
E9 P2_DPn19 F10 P2_DP19-
E8 P2_DPp19 E10 P2_DP19+
D9 P2_DPn20 B11 P2_DP20-
C9 P2_DPp20 A11 P2_DP20+
D10 P2_DPn21 E11 P2_DP21-
C10 P2_DPp21 D11 P2_DP21+
C8 P2_DPn22 C12 P2_DP22-
B8 P2_DPp22 B12 P2_DP22+
A8 P2_DPn23 F12 P2_DP23-
A9 P2_DPp23 E12 P2_DP23+
Table 7: VPX P2 connections
3.5 Virtex-6 FPGA device
The Virtex-6 FPGA device is the DSP processing node of the VP680. Any Virtex-6 FPGA device from the Virtex-6 SXT and LXT family in an 1156 balls fine line ball grid array package can be ordered:
• XC6VLX130T
• XC6VLX195T
• XC6VLX240T
• XC6VLX365T
• XC6VSX315T
• XC6VSX475T
3.6 Front panel I/O
The VP680 reserves the front panel I/O area for the FMC site. On the air-cooled VP680 there is a UART over USB option for debugging purposes. In addition there are some status and debug LEDs available.
3.6.1 UART over USB
One UART connection is optionally available on the front panel via a mini USB connector (location depicted in Figure 7). The serial interface is made using a USB to UART Bridge (CP2102). The UART side connects to the FPGA.
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FPGA Pin Net Name FPGA
Bank DIR
CP2102
Pin Number Pin Name
D11 UART_TXD 35 O 25 RXD
H15 UART_RXD 36 I 26 TXD
Table 8: UART connections
The I/O standard to be assigned depends on BLAST configuration. Refer to Table 32: BLAST VIO Matrix in the Appendix. The VP680 implements level translation.
3.6.2 Status LEDs (CPLD)
Four LEDs are connected to the CPLD for board status purposes. There is a pre-defined function for these LEDs. One LED (CPLD LED 0) is located on the component side of the VP680. The other LEDs are located on the solder side of the VP680 (see Figure 3).
OFF ON FLASHING
LED 0
(red)
Power OK Power not OK
(ex. VADJ)
VADJ not OK
LED 1
(red)
FPGA configured FPGA not configured Loading to FLASH
LED 2
(red)
FLASH idle FLASH busy Safety configuration loaded into FPGA, or attempted to load.
LED 3
(red)
FPGA expects 100 MHz on VPX REF_CLK+/-.
FPGA expects 25 MHz on VPX REF_CLK+/-.
CRC error during FPGA configuration.
Table 9: CPLD LED board status
3.6.3 Debug LEDs (FPGA)
Four red LEDs are connected to the FPGA for debugging purposes. There is no pre-defined function for these LEDs. One LED (FPGA_LED0) is located on the component side of the VP680. The other LEDs are located on the solder side of the VP680 (see Figure 3).
To turn on a LED drive the signal low. To turn a LED off, make the signal Hi-Z.
FPGA Pin Net Name FPGA Bank
DIR
F31 FPGA_LED0 16 O
G32 FPGA_LED1 16 O
L26 FPGA_LED2 16 O
L25 FPGA_LED3 16 O
Table 10: LED connections
The I/O standard to be assigned depends on BLAST configuration. Refer to Table 32: BLAST VIO Matrix in the Appendix. The VP680 implements proper level translation.
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3.7 FPGA Mezzanine Card (FMC)
The FPGA interfaces to an FPGA Mezzanine Card (FMC) via a high pin count (HPC) VITA 57.1 site. All banks (LA, HA, HB) are connected to the FPGA. The FMC site provides flexibility for adding analog and/or digital I/O via customer developed, third party or Abaco Systems FMC boards. Abaco Systems offers a wide variety of FMC cards that can be used on the VP680. Among others:
- FMC103: 4-ch A/D 210 Msps @ 12-bits
- FMC104: 4-ch A/D 250 Msps @ 14-bits
- FMC107: 8-ch A/D 65 Msps @ 12-bits
- FMC108: 8-ch A/D 250 Msps @ 14-bits
- FMC204: 4-ch DA 1 Gsps @ 16-bits
- FMC150: Dual A/D. Dual D/A Channel
▪ 2-ch A/D 250 Msps @ 14-bits
▪ 2-ch D/A 800 Msps @ 16-bits
- FMC110: Dual A/D. Dual D/A Channel
▪ 2-ch A/D 1 Gsps @ 12-bits
▪ 2-ch D/A 1 Gsps @ 16-bits
- FMC122: Single-Dual Channel A/D
▪ 1-ch A/D 2.50 Gsps @ 8-bits, or
▪ 2-ch A/D 1.25 Gsps @ 8-bits
- FMC125: Quad-Dual-Single Channel A/D
▪ 1-ch A/D 5.00 Gsps @ 8-bits, or
▪ 2-ch A/D 2.50 Gsps @ 8-bits, or
▪ 4-ch A/D 1.25 Gsps @ 8-bits
- FMC126: Quad-Dual-Single Channel A/D
▪ 1-ch A/D 5.00 Gsps @ 10-bits, or
▪ 2-ch A/D 2.50 Gsps @ 10-bits, or
▪ 4-ch A/D 1.25 Gsps @ 10-bits
3.7.1 Bank A (LA, HA) connections
Differential routing is applied with matched delay on all pair within bank A (LA, HA).
FPGA Pin Net Name FMC HPC
Pin Number Pin Name
AF33 LA_N0_CC G7 LA00_N_CC
AE33 LA_P0_CC G6 LA00_P_CC
AC30 LA_N1_CC D9 LA01_N_CC
AD30 LA_P1_CC D8 LA01_P_CC
AC29 LA_N2 H8 LA02_N
AD29 LA_P2 H7 LA02_P
AF34 LA_N3 G10 LA03_N
AE34 LA_P3 G9 LA03_P
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AC28 LA_N4 H11 LA04_N
AB28 LA_P4 H10 LA04_P
AE32 LA_N5 D12 LA05_N
AD32 LA_P5 D11 LA05_P
AC27 LA_N6 C11 LA06_N
AB27 LA_P6 C10 LA06_P
AG32 LA_N7 H14 LA07_N
AG33 LA_P7 H13 LA07_P
AB26 LA_N8 G13 LA08_N
AA26 LA_P8 G12 LA08_P
AF31 LA_N9 D15 LA09_N
AG31 LA_P9 D14 LA09_P
AC25 LA_N10 C15 LA10_N
AB25 LA_P10 C14 LA10_P
AB33 LA_N11 H17 LA11_N
AC33 LA_P11 H16 LA11_P
AD31 LA_N12 G16 LA12_N
AE31 LA_P12 G15 LA12_P
Y26 LA_N13 D18 LA13_N
AA25 LA_P13 D17 LA13_P
V29 LA_N14 C19 LA14_N
U28 LA_P14 C18 LA14_P
U30 LA_N15 H20 LA15_N
U31 LA_P15 H19 LA15_P
T25 LA_N16 G19 LA16_N
U25 LA_P16 G18 LA16_P
W34 LA_N17_CC D21 LA17_N_CC
V34 LA_P17_CC D20 LA17_P_CC
W30 LA_N18_CC C23 LA18_N_CC
V30 LA_P18_CC C22 LA18_P_CC
V27 LA_N19 H23 LA19_N
V28 LA_P19 H22 LA19_P
V33 LA_N20 G22 LA20_N
V32 LA_P20 G21 LA20_P
Y31 LA_N21 H26 LA21_N
Y32 LA_P21 H25 LA21_P
Y34 LA_N22 G25 LA22_N
Y33 LA_P22 G24 LA22_P
Y29 LA_N23 D24 LA23_N
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W29 LA_P23 D23 LA23_P
W32 LA_N24 H29 LA24_N
W31 LA_P24 H28 LA24_P
Y27 LA_N25 G28 LA25_N
Y28 LA_P25 G27 LA25_P
V25 LA_N26 D27 LA26_N
W25 LA_P26 D26 LA26_P
W26 LA_N27 C27 LA27_N
W27 LA_P27 C26 LA27_P
T29 LA_N28 H32 LA28_N
T28 LA_P28 H31 LA28_P
R34 LA_N29 G31 LA29_N
R33 LA_P29 G30 LA29_P
T31 LA_N30 H35 LA30_N
T30 LA_P30 H34 LA30_P
T34 LA_N31 G34 LA31_N
T33 LA_P31 G33 LA31_P
U27 LA_N32 H38 LA32_N
U26 LA_P32 H37 LA32_P
U32 LA_N33 G37 LA33_N
U33 LA_P33 G36 LA33_P
Table 11: FMC LA connections
FPGA Pin Net Name FMC HPC
Pin Number Pin Name
AG30 HA_N0_CC F5 HA00_N_CC
AF30 HA_P0_CC F4 HA00_P_CC
AE26 HA_N1_CC E3 HA01_N_CC
AF26 HA_P1_CC E2 HA01_P_CC
AD26 HA_N2 K8 HA02_N
AD25 HA_P2 K7 HA02_P
AJ32 HA_N3 J7 HA03_N
AJ31 HA_P3 J6 HA03_P
AJ30 HA_N4 F8 HA04_N
AJ29 HA_P4 F7 HA04_P
AK32 HA_N5 E7 HA05_N
AK33 HA_P5 E6 HA05_P
AK31 HA_N6 K11 HA06_N
AL31 HA_P6 K10 HA06_P
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AL33 HA_N7 J10 HA07_N
AM33 HA_P7 J9 HA07_P
AM32 HA_N8 F11 HA08_N
AN32 HA_P8 F10 HA08_P
AP33 HA_N9 E10 HA09_N
AP32 HA_P9 E9 HA09_P
AM31 HA_N10 K14 HA10_N
AL30 HA_P10 K13 HA10_P
AD27 HA_N11 J13 HA11_N
AE27 HA_P11 J12 HA11_P
AH32 HA_N12 F14 HA12_N
AH33 HA_P12 F13 HA12_P
AE29 HA_N13 E13 HA13_N
AE28 HA_P13 E12 HA13_P
AH34 HA_N14 J16 HA14_N
AJ34 HA_P14 J15 HA14_P
AF29 HA_N15 F17 HA15_N
AF28 HA_P15 F16 HA15_P
AK34 HA_N16 E16 HA16_N
AL34 HA_P16 E15 HA16_P
AG28 HA_N17_CC K17 HA17_N_CC
AG27 HA_P17_CC K16 HA17_P_CC
AN34 HA_N18_CC J19 HA18_N
AN33 HA_P18_CC J18 HA18_P
AH30 HA_N19 F20 HA19_N
AH29 HA_P19 F19 HA19_P
AA33 HA_N20 E19 HA20_N
AA34 HA_P20 E18 HA20_P
AA31 HA_N21 K20 HA21_N
AA30 HA_P21 K19 HA21_P
AC34 HA_N22 J22 HA22_N
AD34 HA_P22 J21 HA22_P
AB31 HA_N23 K23 HA23_N
AB30 HA_P23 K22 HA23_P
Table 12: FMC HA connections
3.7.2 Bank B (HB) connections
Differential routing is applied with matched delay on all pair within bank B (HB).
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FPGA Pin Net Name FMC HPC
Pin Number Pin Name
AJ27 HB_N0_CC K26 HB00_N_CC
AK27 HB_P0_CC K25 HB00_P_CC
AH28 HB_N1 J25 HB01_N
AH27 HB_P1 J24 HB01_P
AM30 HB_N2 F23 HB02_N
AN30 HB_P2 F22 HB02_P
AG26 HB_N3 E22 HB03_N
AG25 HB_P3 E21 HB03_P
AP31 HB_N4 F26 HB04_N
AP30 HB_P4 F25 HB04_P
AK29 HB_N5 E25 HB05_N
AL29 HB_P5 E24 HB05_P
AH24 HB_N6_CC K29 HB06_N_CC
AH23 HB_P6_CC K28 HB06_P_CC
AP29 HB_N7 J28 HB07_N
AN29 HB_P7 J27 HB07_P
AK28 HB_N8 F29 HB08_N
AL28 HB_P8 F28 HB08_P
AM28 HB_N9 E28 HB09_N
AN28 HB_P9 E27 HB09_P
AJ25 HB_N10 K32 HB10_N
AH25 HB_P10 K31 HB10_P
AP24 HB_N11 J31 HB11_N
AP25 HB_P11 J30 HB11_P
AM26 HB_N12 F32 HB12_N
AL26 HB_P12 F31 HB12_P
AK24 HB_N13 E31 HB13_N
AJ24 HB_P13 E30 HB13_P
AP26 HB_N14 K35 HB14_N
AP27 HB_P14 K34 HB14_P
AL25 HB_N15 J34 HB15_N
AM25 HB_P15 J33 HB15_P
AN24 HB_N16 F35 HB16_N
AN25 HB_P16 F34 HB16_P
AM27 HB_N17_CC K38 HB17_N_CC
AN27 HB_P17_CC K37 HB17_P_CC
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AL24 HB_N18 J37 HB18_N
AK23 HB_P18 J36 HB18_P
AJ26 HB_N19 E34 HB19_N
AK26 HB_P19 E33 HB19_P
AA29 HB_N20 F38 HB20_N
AA28 HB_P20 F37 HB20_P
AC32 HB_N21 E37 HB21_N
AB32 HB_P21 E36 HB21_P
Table 13: FMC HB connections
3.7.3 Gigabit transceiver connections
The VP680 connects the lowest four gigabit transceivers to MGT blocks on the FPGA, the other transceivers are left unconnected. The reference clocks are described in section 3.9.4.
FPGA Pin Net Name MGT Block FMC HPC
Pin Number Pin Name
D2 DP_C2M_n0
116
C3 DP0_C2M_N
D1 DP_C2M_p0 C2 DP0_C2M_P
G4 DP_M2C_n0 C7 DP0_M2C_N
G3 DP_M2C_p0 C6 DP0_M2C_P
C4 DP_C2M_n1
116
A23 DP1_C2M_N
C3 DP_C2M_p1 A22 DP1_C2M_P
E4 DP_M2C_n1 A3 DP1_M2C_N
E3 DP_M2C_p1 A2 DP1_M2C_P
B2 DP_C2M_n2
116
A27 DP2_C2M_N
B1 DP_C2M_p2 A26 DP2_C2M_P
D6 DP_M2C_n2 A7 DP2_M2C_N
D5 DP_M2C_p2 A6 DP2_M2C_P
A4 DP_C2M_n3
116
A31 DP3_C2M_N
A3 DP_C2M_p3 A30 DP3_C2M_P
B6 DP_M2C_n3 A11 DP3_M2C_N
B5 DP_M2C_p3 A10 DP3_M2C_P
Table 14: FMC MGT connections
3.7.4 Miscellaneous FMC connections
The differential clock connections are described in section 3.9.1. The global address pins (GA0 and GA1) on the FMC site are tied to ground. PG_C2M is driven by glue logic in the CPLD which monitors the voltages VADJ, 3P3V, and 12P0V applied to the FMC. Power pin 3P3VAUX is connected to 3P3V on the VP680.
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FPGA Pin Net Name FPGA Bank
DIR FMC HPC
Pin Number Pin Name
F23 I2C_SCL_FMC 24 IO C30 SCL
F24 I2C_SDA_FMC 24 IO C31 SDA
D15 PG_M2C 36 I F1 PG_M2C
C15 PRSNT_M2C_L 36 I H2 PRSNT_M2C_L
Table 15: Miscellaneous FMC connections
The I/O standard to be assigned depends on BLAST configuration. Refer to Table 32: BLAST VIO Matrix in the Appendix. The VP680 implements proper level translation.
3.7.1 I/O Standard Support
The VP680 is optimized for differential signalling, but any single ended I/O standard supported by the FPGA can be used as well. FMC bank A (LA, HA) connects to FPGA banks powered by VADJ. FMC bank B connects an FPGA bank powered by VIO_B_M2C, except:
• HB_20p/n, which connect to a VADJ powered FPGA bank
• HB_21p/n, which connect to a VADJ powered FPGA bank
Reference voltages from the FMC (VREF_A_M2C, VREF_B_M2C) are not connected. I/O standards that require a reference voltage should use the internal Vref features of the FPGA. The following reference voltages are supported:
• 0.6V
• 0.75V
• 0.90V
• 1.1V
• 1.25V
For I/O standards that require Digitally Controlled Impedance (DCI) please contact Abaco Systems.
3.7.2 VADJ Programming
After power up VADJ is in power down state until the FPGA is configured. After FPGA configuration VADJ is set to one of the voltage from Table 16. Glue logic is implemented by two signals driven by the FPGA; FP_CP_0 and FP_CP_1 (see also Table 30). Please contact Abaco Systems for 1.25V and 0.8V VADJ voltage options.
FP_CP_0 FP_CP_1 VADJ
0 0 2.5V (default)
1 0 1.8V
0 1 1.5V
1 1 1.2V
Table 16: VADJ voltage options
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3.8 BLAST sites
Thanks to the availability of three BLAST sites a wide variety of memory and processing modules can be connected to the FPGA. For each BLAST site it is possible to choose from the list of available BLAST modules.
For more information about the available BLASTs on the VP680 please consult the following page: BLAST modules http://www.Abaco Systems.com/BLAST.htm
Due to its small form factor and ease of design, the BLAST modules enable a rapid solution for custom memory or processing requirements.
BLAST Form Factor BLAST 0 BLAST 1 BLAST 2
Single BLAST YES YES YES
Single Extended BLAST YES YES YES
Double BLAST Contact Abaco Systems NO
Double Extended BLAST Contact Abaco Systems NO
Table 17: BLAST Configuration options
BLAST Type BLAST 0 BLAST 1 BLAST 2
DDR3 YES YES YES
DDR2 YES YES YES
QDR YES YES YES
ADV212 JPEG2000 YES YES YES
32GB NAND FLASH YES YES YES
Table 18: BLAST Memory/Processing options
Power is applied depending on the BLAST type. Each BLAST site has three voltage rails:
- Vcore : 3.3V, 2.5V, 1.8V, 1.5V
- Vio : 2.5V, 1.8V, 1.5V
- Vref : 0.9V
BLAST1 does not have a separate Vio plane, but uses BLAST0 Vio.
3.9 Clock Tree
The VP680 clock architecture offers an efficient distribution of low jitter clocks to facilitate efficient implementation of fast off chip communication with other peripherals. The VPX backplane offers two reference clock signals (AUX_CLK and REF_CLK) that can be used by plug-in modules for synchronisation between different plug-in modules in a VPX system.
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P0
AUX_CLK
REF_CLKM-LVDS
RECEIVER
100 MHz
oscillator16 MHz
crystal
MGTREFCLK0P/N_112
CLOCK
SYNTHESIZER
CDCE925
CPLD
IO_L17P_VRN_24
IO_L0P_GC_34
IO_L1P/N_GC_24
IO_L11N_SRCC_24
FPGA
VITA 57.1
FMC
GBTCLK0_M2C
50 MHz
oscilator
200 MHz
oscilator
IO_L1P/N_GC_34
IO_L0P/N_GC_34
MGTREFCLK1P/N_112
MGTREFCLK0P/N_113
MGTREFCLK1P/N_113
MGTREFCLK0P/N_114
MGTREFCLK1P/N_114
MGTREFCLK0P/N_115
MGTREFCLK1P/N_115
PCIe JITTER
ATTENUATOR
PCIe JITTER
ATTENUATOR
PCIe x4 CLOCK
MULTIPLIER
CLOCK
FANOUT
BUFFER
25 MHz REF_CLK path
100 MHz REF_CLK path
M-LVDS
RECEIVER
MGTREFCLK0P/N_116
MGTREFCLK1P/N_116 GBTCLK1_M2C
CLK0_M2C
CLK1_M2C
CLK2_BIDIR
CLK3_BIDIR
IO_L19P/N_24
IO_L15P/N_24
25 MHz
IO_L9P_MRCC_24
Figure 4: Clock architecture
3.9.1 AUX_CLK+/- Reference Clock
AUX_CLK is a 1pps timing reference, which is defined with relatively tight accuracy and stability specifications and is driven differentially on the backplane. This signal is typically used in OpenVPX applications to provide a high-precision hardware timing delimiter for time-based processing tasks. The VP680 buffers and translates into a single ended signal before connecting to the FPGA.
FPGA Pin Net Name FPGA
Bank DIR
P0
Connector Pin Number Pin Name
J25 AUX_CLK 24 I P0 C8 AUX_CLK-
P0 B8 AUX_CLK+
Table 19: AUX_CLK connection
3.9.2 REF_CLK+/- Reference Clock
REF_CLK is a reference clock with tight accuracy and stability specifications and is driven differentially on the backplane. One of the uses of this signal is for all plug-in modules to synchronize to a common clock to enable the implementation of Spread Spectrum Clocking (SSC) to reduce EMI in a system (PCI Express for example defines the use of this mechanism for SSC). It is anticipated that a plug-in module will receive the reference clock and phase lock it up to the desired operational frequency.
Initial revisions of the OpenVPX specifications recommend a 25 MHz clock for this signal, but recently a suggestion was made by the OpenVPX work group to implement a 100 MHz clock which can be used directly as reference for PCI Express Generation 2 applications.
The VP680 implements a clock architecture that works for both cases, see Figure 4. Either the 25MHz clock path or the 100MHz clock path should be used. Each clock path has two
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100MHz reference clocks connected to the FPGA in such a way that all MGT block can be reached.
FPGA Pin Net name MGT REFCLK MGTs reached
AD5 VPX_100M_REFCLK0n MGTREFCLK0_113 112, 113, 114
AD6 VPX_100M_REFCLK0p
P5 VPX_100M_REFCLK1n MGTREFCLK0_115 114, 115, 116
P6 VPX_100M_REFCLK1p
AK5 VPX_25M_REFCLK0n MGTREFCLK0_112 112, 113
AK6 VPX_25M_REFCLK0p
V5 VPX_25M_REFCLK1n MGTREFCLK0_114 113, 114, 115
V6 VPX_25M_REFCLK1p
Table 20: REF_CLK connections
Only one clock path is enabled, the other clock path is power down. Glue logic to control the clock path is implemented in the CPLD. The FPGA controls clock path selection through signal FP_CP_7 (see also Table 30).
FP_CP_7 Clock path selection
0 Clock path for 25MHz REF_CLK is selected
1 Clock path for 100MHz REF_CLK is selected
Table 21: Clock path selection
3.9.3 On-board MGT Reference Clock
A 100 MHz clock from an on-board low jitter oscillator is distributed to the FPGA using a jitter attenuator. This clock can be used as the reference clock for the MGT blocks. The reference clocks are connected in such a way that all MGTs can use these reference clocks.
FPGA Pin Net name MGT REFCLK MGTs reached
AB5 LOCAL_REFCLK0n MGTREFCLK1_113 112, 113, 114
AB6 LOCAL_REFCLK0p
M5 LOCAL_REFCLK1n MGTREFCLK1_115 114, 115, 116
M6 LOCAL_REFCLK1p
Table 22: On-board MGT reference clock connections
3.9.4 FMC MGT Reference Clock
The FMC standard defines two high precision reference clocks that are driven from the FMC to the carrier. The VP680 connects these clocks directly to MGT reference clock inputs. The following table shows which MGTs can use these reference clocks.
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FPGA Pin Net name MGT REFCLK MGTs reached
H5 GBTCLK0_M2C_n MGTREFCLK0_116 115, 116
H6 GBTCLK0_M2C_p
F5 GBTCLK1_M2C_n MGTREFCLK1_116 115, 116
F6 GBTCLK1_M2C_p
Table 23: FMC MGT reference clock connections
3.9.1 FMC Clock connections
The FMC clocks are connected to LVDS capable I/O on the FPGA. CLK0 and CLK1 are connected to global clock inputs. CLK2 and CLK3 are connected to regular I/O.
FPGA Pin Net Name FMC HPC
Pin Number Pin Name
B10 CLK0_M2C_n H5 CLK0_M2C_N
A10 CLK0_M2C_p H4 CLK0_M2C_P
H9 CLK1_M2C_n G3 CLK1_M2C_N
J9 CLK1_M2C_p G2 CLK1_M2C_P
AD22 CLK2_BIDIR_n K5 CLK2_BIDIR_N
AC22 CLK2_BIDIR_p K4 CLK2_BIDIR_P
AG23 CLK3_BIDIR_n J3 CLK3_BIDIR_N
AF23 CLK3_BIDIR_p J2 CLK3_BIDIR_P
Table 24: FMC clock connections
3.9.2 Miscellaneous clock connections
A low jitter programmable clock device (CDCE925, section 3.10.1) able to generate frequencies from 62.5MHz to 255.5MHz in steps of 0.5MHz is available. Two outputs are connected to the FPGA. Further there is a fixed 200 MHz differential clock.
FPGA Pin Net Name FPGA Bank
DIR CDCE925, ECS-LVDS25
Device Pin Number Pin Name
L23 CLK_SYNTH_0 24 I CDCE925 13 Y1
AE23 CLK_SYNTH_1 24 I CDCE925 7 Y4
K23 CLK200_N 24 I
ECS-LVDS25 5 C-Output
K24 CLK200_P ECS-LVDS25 4 Output
Table 25: Miscellaneous clock connections
3.10 Local I2C bus
A local I2C bus connects to three on-board slave peripherals. The FPGA should implement I2C master logic to use these peripherals. One of the peripherals is a programmable clock device (CDCE925) which is also described in section 3.9.2. The other two peripherals are monitoring
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devices (ADT7411) used to measure the power on the different voltage rails as well as the temperature.
The monitoring devices can be configured in such a way that an interrupt output (MON_INT#) is asserted when one of the parameters is out of range.
FPGA Pin Net Name FPGA
Bank DIR
CDCE925, ADT7411
Device Pin Number Pin Name
J32 I2C_SCL_LOCAL 16 IO
CDCE925 14 S2/SCL
ADT7411 #1 13 SCL/SCLK
ADT7411 #2 13 SCL/SCLK
J31 I2C_SDA_LOCAL 16 IO
CDCE925 15 S1/SDA
ADT7411 #1 12 SDA/DIN
ADT7411 #2 12 SDA/DIN
E11 MON_INT# 35 I ADT7411 #1 10 INT/INT*
ADT7411 #2 10 INT/INT*
Table 26: Local I2C bus connections
The I/O standard to be assigned depends on BLAST configuration. Refer to Table 32: BLAST VIO Matrix in the Appendix. The VP680 implements proper level translation.
3.10.1 Clock Synthesizer (CDCE925)
The CDCE925 is a low jitter programmable clock device able to generate frequencies from 62.5MHz to 255.5MHz in steps of 0.5MHz. This clock management approach ensures maximum flexibility to efficiently implement multi-clock domains algorithms and use memory devices at different frequencies. The clock connections to the FPGA are described in section 3.9.2. Refer to the datasheet of the CDCE925 for detailed information.
3.10.2 On-board Voltage and Temperature Monitoring (ADT7411)
Refer to the datasheet of the ADT7411 for detailed information. The I2C slave address is set to b’1001000’ for the first device and to b’1001010’ for the second device.
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Parameter Connection Formula
On-chip temperature ADT7411 Die Temperature
On-chip AIN0 (VDD) +3.3V
External temperature FPGA Die Temperature
External AIN3 12V AIN3 * 5.7
External AIN4 1V0 AIN4
External AIN5 BLAST2 Vio AIN5 * 2.0
External AIN6 BLAST0 Vio AIN6 * 2.0
External AIN7 MGTAVTT AIN7
External AIN8 MGTAVCC AIN8
Table 27: Monitoring device #1 connections
Parameter Connection Formula
On-chip temperature ADT7411 Die Temperature
On-chip AIN0 (VDD) +3.3V
External AIN1 BLAST0 Vcore AIN1 * 2
External AIN2 BLAST1 Vcore AIN2 * 2
External AIN3 5V AIN3 * 14.7 / 4.7
External AIN4 0V9 AIN4
External AIN5 VADJ AIN5 * 2
External AIN6 1V8 AIN6
External AIN7 BLAST2 Vcore AIN7 * 2
External AIN8 2V5 AIN8 * 2
Table 28: Monitoring device #2 connections
3.11 Serial FLASH
A 128 Mbits serial FLASH device (S25FL128P) is available to the FPGA. This FLASH allows the storage of vital data like processor boot code and settings into a non-volatile memory.
The FLASH is operated using a standard SPI interface that can run up to 104 MHz, allowing for a page programming speed up to 208 KB/s. Reading data from the FLASH can be done at speeds up to 13 MB/s.
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FPGA Pin Net Name FPGA Bank
DIR S25FL128P
Pin Number Pin Name
K13 SF_SCK 35 O 16 SCK
M13 SF_SI 35 O 15 SI
L16 SF_SO 36 I 8 SO/PO7
Table 29: SPI FLASH connections
The I/O standard to be assigned depends on BLAST configuration. Refer to Table 32: BLAST VIO Matrix in the Appendix. The VP680 implements proper level translation.
FPGA Configuration
Figure 5 shows the configuration architecture on the VP680. The architecture allows FPGA configuration through the JTAG chain as well as parallel configuration from FLASH memory. The FPGA can be automatically loaded from FLASH after the VP680 powered up.
JTAG
Header
VPX P0 Connector
FMC
PRSNT_M2C_L
CoolRunner-II
CPLD
Virtex-6
FPGA
3V3 JTAG
1V8 JTAGOE
OE
512 Mbit
FLASH
CPLD LED x4 FPGA LED x4
8-bit parallel
configuration
Safety configuration
jumper
PGND
SY
SR
ES
ET
*
Figure 5: Configuration architecture
3.11.1 JTAG chain
The JTAG chain on the VP680 is available for configuration and debugging purposes. The JTAG chain is accessible from the VPX backplane and an on-board header (for a Xilinx Platform USB-II cable, see Figure 7). The JTAG chain dynamically changes in the following situations:
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1. Source selection
a. When no Xilinx Platform USB-II cable is connected to the JTAG header the pseudo ground signal (PGND) is pulled high by a resistor on the VP680 and the JTAG signals from the VPX backplane are connected to the local JTAG chain.
b. When a Xilinx Platform USB-II cable is connected to the JTAG header the pseudo ground signal (PGND) is pulled low by the cable and the JTAG signals from the VPX backplane are disconnected from the local JTAG chain.
2. FMC included
a. When no FMC card is present the PRSNT_M2C_L signal is pulled high by a resistor on the VP680 and the FMC’s TDO is connected to the FMC’s TDI. The JTAG chain is as follows: CPLD FPGA.
b. When an FMC card is present the PRSNT_M2C_L signal is pulled low by the FMC card and the FMC’s TDO is disconnected from the FMC’s TDI. The JTAG chain is as follows: FMC CPLD FPGA.
3.11.2 FLASH storage
Firmware images are stored on-board in a 512Mbit FLASH device and loaded to the FPGA after power-up. By default there is space reserved for two FPGA images; a safety image and a user image. In addition the FLASH keeps board specific information like serial number, FPGA type, and BLAST information.
Reserved
32 MB
Reserved
128 kB
Safety Image
16 MB
Reserved 64 kB
User Image
15.6 MB
0x0000000
0x2000000
0x2020000
0x3020000
0x3030000
0x3FE0000
Board Info
128 kB
0x3FFFFFF
Figure 6: FLASH arrangement
3.11.3 Configuration Controller (CPLD)
As shown in Figure 5, a CoolRunner-II CPLD is present to interface between the FLASH device and the FPGA device. The CPLD implements glue logic to program and read the FLASH memory.
After power-up the configuration controller loads the user image to the FPGA. If FPGA configuration fails (for example when no user image exist or when the user image is faulty)
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the configuration controller continues with loading the safety image. FPGA configuration is performed in SelectMap mode.
The bus between FPGA and CPLD consist of 9 dual purpose signals. During FPGA configuration (Function 1) the bus is transferring 8-bit configuration data from CPLD to FPGA. After FPGA configuration (Function 2) the signals are used for communication between FPGA and CPLD.
FPGA Pin Net Name FPGA
Bank DIR
XC2C256-FT256
Pin Number Function 1 Function 2
AF24 FP_CP_0 24 O C13 D0 See section 3.7.2
AF25 FP_CP_1 24 O A15 D1
W24 FP_CP_2 24 O C12 D2 COMMAND
V24 FP_CP_3 24 O B12 D3 COMMAND
H24 FP_CP_4 24 O D13 D4 COMMAND
H25 FP_CP_5 24 O A14 D5 COMMAND
P24 FP_CP_6 24 I E13 D6 DATA
R24 FP_CP_7 24 O A13 D7 See section 3.9.2
AE24 FP_CP_8 24 I C11 - CLOCK
Table 30: CPLD connections
3.11.4 User image programming
Programming the user image in FLASH should be done from a system host through the PCI Express interface using Abaco Systems’s VP680 reference firmware design and 4FM GUI Control Application. The firmware reference design is stored in the safety image space. In factory the firmware reference design will also be programmed in the user image space.
The user image may be overwritten with an image that does not implement the FLASH update features from Abaco Systems’s VP680 firmware reference design. In that case there are two ways to recover:
1) Configure the FPGA with Abaco Systems’s VP680 firmware reference design through the JTAG chain. Then use the 4FM GUI Control Application to program a new user image in FLASH.
2) Power down the board, place the safety configuration jumper (section 3.11.5) and power-up. Then use the 4FM GUI Control Application to program a new user image in FLASH
3.11.5 Safety Configuration Jumper
A press fit jumper footprint (SW1) is located next to the JTAG programming connector. If the jumper is closed the FPGA safety image is loaded from FLASH after power-up.
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JTAG SW1UART
Figure 7: Connector / Jumper locations
4 Environment Specifications
4.1 Temperature
Operating temperature
• 0°C to +70°C (Commercial)
• -40°C to +85°C (Industrial) Storage temperature:
• -40°C to +120°C
4.2 Convection cooling
The air flow provided by the chassis fans the VP680 is enclosed in will dissipate the heat generated by the on board components. A minimum airflow of 300 LFM is recommended.
Abaco Systems’s warranty does not cover boards on which the maximum allowed temperature has been exceeded.
4.3 Conduction cooling
The VP680 is designed for conduction cooling according to ANSI/VITA 48.2. The module has primary side retainers. Slot pitch is 1.00 inch.
5 Safety This module presents no hazard to the user.
6 EMC This module is designed to operate from within an enclosed host system, which is built to provide EMC shielding. Operation within the EU EMC guidelines is not guaranteed unless it is installed within an adequate host system. This module is protected from damage by fast voltage transients originating from outside the host system which may be introduced through the system.
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7 Warranty
Hardware Software/Firmware
Basic Warranty
(included)
1 Year from Date of Shipment 90 Days from Date of Shipment
Extended Warranty
(optional)
2 Years from Date of Shipment 1 Year from Date of Shipment
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Appendix A: FPGA Bank Mapping
BLAST 0 BLAST 1
BLAST 2 FMC
LVDS
LVDS
FMC GTP
VPX GTP
Group Bank VCCO VREF
FMC Bank A 12, 13, 14 VADJ -
FMC Bank B 23 VIO_B_M2C -
BLAST 0 26, 35, 36 BLAST0_VIO 0.9V
BLAST 1 15, 16, 25 BLAST0_VIO 0.9V
BLAST 2 22, 32, 33 BLAST2_VIO 0.9V
Miscellaneous 24, 34 2.5V -
Table 31: FPGA Bank Mapping
Configuration BLAST 0 BLAST 1 BLAST 2 BLAST0_VIO BLAST2_VIO
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NNN - - - 1.8V 1.8V
ANN DDR2 - - 1.8V 1.8V
AAN DDR2 DDR2 - 1.8V 1.8V
AAA DDR2 DDR2 DDR2 1.8V 1.8V
BNN DDR3 - - 1.5V 1.8V
BBN DDR3 DDR3 - 1.5V 1.8V
BBB DDR3 DDR3 DDR3 1.5V 1.5V
QNN QDR2 - - 1.8V 1.8V
QQN QDR2 QDR2 - 1.8V 1.8V
QQQ QDR2 QDR2 QDR2 1.8V 1.8V
AAQ DDR2 DDR2 QDR2 1.8V 1.8V
BBQ DDR3 DDR3 QDR2 1.5V 1.8V
QQA QDR2 QDR2 DDR2 1.8V 1.8V
QQB QDR2 QDR2 DDR3 1.8V 1.5V
AAC DDR2 DDR2 JPEG2000 1.8V 2.5V
BBC DDR3 DDR3 JPEG2000 1.5V 2.5V
AQC DDR2 QDR2 JPEG2000 1.8V 2.5V
Table 32: BLAST VIO Matrix
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Appendix B: Errata
PCB revision 1.0
• SPI FLASH not supported.
• FPGA LED 0 not supported in combination with DDR3 BLAST.
• FPGA LEDs don’t go off completely.