TROI SPI SeriesTROI SPI Series

Key Features Overview

Key FeaturesKey Features

Enhanced Color 3D Display

Simultaneous 2D & 3D for

Shadow FreeGolden Finger

Reliable

Ease of Use

Fast & Accurate Strong Sales & Support NetworkAdvanced Features

Fast & AccurateFast & Accurate

In spite of the importance of the color image in the apparatus for measurement of the surface profile, the color camera has defects of being high in price and being low in capture speed rather than the black and white camera.

TROI systems are equipped with 4MP Black & White camera due to;1.Faster Inspection Speed2.Higher Accuracy compare to Color Camera3.Competitive price for end users

Pemtron Company “C” Company “C” Company “K”

12 ㎛ : 19.5 ㎠/sec 18 ㎛ : 43.9 ㎠/sec 20 ㎛ : 67.3 ㎠/sec

20 ㎛ : 16 ㎠/sec 40 ㎛ : 29 ㎠/sec

12 ㎛ : 19.27 ㎠/sec 20 ㎛ : 19.7 ㎠/sec (High Speed Mode)15.7 ㎠/sec (GR&R Mode)

Inspection Speed Comparison

Enhanced Color 3D DisplayEnhanced Color 3D Display

Previous 3D systems displayed height by a RGB color map.Combination of ordinary a RGB Color Map and state of the art Color Image Processing generates Enhanced Color 3D Display.

Past models used methods which could only recognize solder higher than silk print, making it impossible for measurements below silk print height level. Pemtron has solved this problem by using an Enhanced 3D Color Algorithm that can defines solder printed from a 0 reference point.

Pemtron

PemtronPemtron

Pemtron

Pemtron & Others

Others

OthersPads adjacent to holes

Others

Simultaneous 2D&3D / Shadow FreeSimultaneous 2D&3D / Shadow Free

PCB

(Solder)

2DLighting

Combination of 2D & 3D inspection eliminates common Shadow problem with SPI systems.

Camera grabs shapes of solder from simultaneous 2D and 3D LED light source.

MoireMoire TechnologyTechnologySPI system is able to find out X-Value which is for solder height calculation.

Inspection LogicInspection Logic -- 2D & 3D Phase Shifting 2D & 3D Phase Shifting TechnologyTechnology

2D camera detects “Zero reference point” and inspects solder shape like smearing simultaneously.

Solder lands are higher or lower than PCB surface. Pemtron Phase Shifting technologies measure the height and volume deposition from the surface of the lands. Also SPI inspects the solder deposition shape.

2D inspection

3D inspection

Golden Finger Inspection (2D)Golden Finger Inspection (2D)

The system can detect solder splash on the golden finger. The minimum size of splash detection (18um resolution) is 50um in diameter. About 3 particle of solders are about 50um. 12um resolution system can detect as small as 40um of splash size.

<OK> <NG>

-Splash DefectParameter : 50umResult : 426um

-ContaminationParameter : 50umResult : 465um

Reliable Reliable –– 1/31/3

Purpose of this test is to show accuracy of our TROI system by checkingheight of 3D Jig which certified from KTL. We programmed to check heights from 4 corners of FOV 50 times with loading and unloading option. There are total of 2 blocks on 3D Jig and each certified heights are 148.5um and 300.5um.TROI’s height accuracy is +/- 2um.

Result1st Block – Height 148.5um

a. Average – 148.35umb. Min – 148.10umc. Max – 148.85um

2nd Block – Height 300.5uma. Average – 300.24umb. Min – 299.36umc. Max – 301.17um

1

23

4

Camera Field of View

Reliable Reliable –– 2/32/3

Target Height 148.5um

a. Average – 148.35umb. Min – 148.10umc. Max – 148.85um

Reliable Reliable –– 3/33/3

Target Height 300.5um

a. Average – 300.24umb. Min – 299.36umc. Max – 301.17um

Ease of UseEase of Use

Main GUI Operator’s NG Viewer

SPC Module Pad Control View

TROI Software runs based on EmbededWindows XP operating system.

User Friendly GUI allows to take only 30 minutes of training to begin operation.

Easy recognition of production status.

Our powerful SPC module enables each user to keep track of result record with user friendly GUI.

PAD Control View module imports Gerber data and or CAD data to complete program in 5 to 15 minutes.

Explanation of Main GUIExplanation of Main GUI

Main GUI PCB Image

JOB Data file name

Average Result

Colored Live Image of FOV

PCB position on conveyor

Operation menu

Result in histogramCurrent partner with Aegis in the programming of a Pemtron Module.

ROI Analysis ViewROI Analysis View

Color DistributionColor Distribution

Height of solder deposition is higher on left side of array

User changed pressure on printer todistribute solder evenly

Color Map View is capable to show the solder deposition data by Height, Volume & Area. It is easier to see the deposition condition and helps engineers tocheck screen printing ability.

Sample Rotation TestSample Rotation Test

Item Data Image

QFP 0.5 Pitch

BGA 0.5 Pitch

Array-Chip

1608(mm)1005(inch)

Average

Rotation Board id BGA QFP Chip Total Pad

0'

1 78.14 86.86 90.14 81.682 78.16 86.95 90.17 81.73 78.16 86.87 90.18 81.694 78.17 86.99 90.2 81.75 78.18 86.88 90.21 81.7

90'

6 78.09 86.43 89.05 81.127 78.2 86.34 89.32 81.148 78.16 86.4 89.26 81.149 78.09 86.39 89.29 81.1310 78.17 86.39 89.25 81.15

180'

11 79.27 87.83 89.75 82.0812 79.29 87.95 89.78 82.1113 79.27 87.9 89.77 82.1114 79.29 87.91 89.82 82.0815 79.25 87.92 89.8 82.12

270'

16 78.06 87.17 91.32 81.7617 78.11 87.14 91.24 81.7718 78.07 87.14 91.2 81.7519 78.09 87.06 91.42 81.76

20 78.04 87.14 91.46 81.76

Glue InspectionGlue Inspection

Combination of various LED enables to inspect glue (adhesive) on PCB.

Barcode Reading (Top Side)Barcode Reading (Top Side)

Data Matrix1.9 x 1.9mm

1. Single – Single snap shot mode2. Dual – Dual snap shot mode

Manual Add or Edit Pad Info.Manual Add or Edit Pad Info.

TROI Series is capable to add or remove pad information manually. When there is a minor changes on each revision, user may edit any shape of pad information.

Drag outline of PAD and press right click to open menu for createa new pad.

ROI Analysis view after add a new pad manually.