Toyo Ink Group TOYOCHEM EMI shield film for FPC€¦ · This Electromagnetic Wave Shield Film for FPC has excellent flexibility /excellent electrical conductivity / excellent humidity

Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.

Toyo Ink Group

TOYOCHEMEMI shield film for FPC

CONFIDENTIAL

TOYOCHEM CO.,LTD.

Converting material Div.

2012.3


TOYO Core-Technologies

CONFIDENTIAL

TOYO Core-Technologies

Polymer Technology

Dispersion Technology

Converting Technology

ISSUE of peculiar FPC

Flexibility, Solder resistance, Chemical resistance …Many confrontation issues.

We can provide the solutions for many confrontation issues,

by POLYMER synthesis, DISPERSION filler , SHEETING techniques.


TOYO FPC materials / TOYO urethane resin

CONFIDENTIAL

Aspects of TOYO Urethane resin

TOYO’s Urethane resin

(contains functional moiety)

*Containing urethane binding

Specialty thermo curing resin＋

Reaction between inside framework of Urethane resin as functional moiety and reaction of specialty thermo curing resin（Heat curing reaction） form solid cross-bridging structure

⇒

Hard segment

Functional moiety

Resistance to heat and humidity

Specialty urethane series resin contain functional moiety has good Flexibility

Heat curing reaction between specialty thermo curing resin express good resistance to heat and humidity

（Image）


2007 2008 2009 2010 2011

TSS product details

CONFIDENTIAL

EMI Shield filmTSS100-18TSS100-22

Ag type, 18um,22um

EMI Shield filmTSS100-12

Ag type, 12umThinner type

Conductive adhesive sheet

TSC110For SUS stiffener

Ag type

Conductive adhesive sheet

TSC200

EMI Shield filmTSS200

TSS Market Shear

New product


Impedance matching

Eye pattern

Now developing / High frequency EMI shield

CONFIDENTIAL

High Speed DataPower Source Low VoltageLow Electric ConsumptionEMI Regulation Change

High Frequency EMI Shield Required

Controlled TransmissionShielding FPC is a Key


EMI Shield filmTSS200

CONFIDENTIAL

TOYOCHEM CO.,LTD.

Converting material Div.

2012.3


EMI Shield film TSS200

CONFIDENTIAL

This Electromagnetic Wave Shield Film for FPC has excellent flexibility / excellent

electrical conductivity / excellent humidity resistance

Ideal for Mobile Phone Hinge, which requires less noise / Camera Module

Reinforced filmInsulation layer

Conductive adhesive layerProtection film


CONFIDENTIAL

Properties

Product name TSS200White release film 50μm PETShield layer Urethane resin basedRelease film 75μm PET

Thickness of Shield layer 22μm (after press)

Shielding Effect More than 40dB （1GHz)Surface resistance Less than 300mΩ/□Peel Strength （PI） More than 3N/cmTg (DMA) 40℃CTE 200 ppm/℃

UL VTM-0 *TSS/kapton50H/TSS


Features

CONFIDENTIAL

1.Excellent Flexibility

2.Excellent Electrical conductive reliability

3.Non-halogene and UL type

4.Excellent Chemical resistance


Structure

Structure material / feature Thickness

Reinforced film White PET one side non-silicone resin coated 50μm

Insulation layer Urethane based14 ±2μm

(16um;Before press)

Conductive adhesive layerUrethane based containing conductive

filler(Isotropic conductive)

8 ±2μm(13um;Before press）

Total Thickness (Insulation layer + Conductive adhesive layer)22 ±4μm

(29um;Before press)

Protection film PET one side silicone resin coated 75μm

Reinforced FilmHeat Durable Fire proofingInsulation Layer

Conductive Adhesive Layer Protection film

CONFIDENTIAL

2 layer structure

Toyo original Urethane based


Temperature

120℃ 140℃ 150℃ 160℃ 180℃

Pressure

1MPa 21μm 22μm 22μm 22μm

2MPa 22μm 22μm 21μm

3MPa 22μm 21μm 21μm

6MPa 21μm

Shield film : TSS200Substrate : 2CCL(ESPANEX MC18-25-00FRM(43μm)・・・Nippon Steel Chemical)Press time : 30min

TOYOCHEM recommend conditions

TSS200

PI

Cu2CCL

*Press time is 30min.

Thickness after Hot press

CONFIDENTIAL


Conductivity test circuit

TSS Insulation layer

TSS Conductive layer

Cover-lay land diameter

Cover-lay PI;25um

Cover-lay adhesive ; 35um

CCL Cu;18um (Ni-Gold plated)

CCL PI;25um

Cross-section

15mm

CuCu

TSS

CONFIDENTIAL


CONFIDENTIAL

Ground connected resistance

Initial 23℃50%RH

Cu:18um

Surface: Ni/Gold Plate

Cover-lay : PI25um,Adhesive 35um

Distance of pole : 4mm

Width of EMI : 15mm

Press conditions

TSS:150℃-2MPa-30min.

SF-PC:170℃-2MPa-30min.

Cu

Cu

Cover-lay(60um)

TSS

Ground connected resistance-1


Ground connected resistance-2 / 40℃90%RH

CONFIDENTIAL

40℃90％RH

Cu:18um



Land diameter : 1.2mmφ


Width of EMI : 15mm

Press conditions




0

200

400

600

800

1000

1200

1400

0 10 20 30 40 50times

Res

ista

nce

[mΩ

]Bending test-1

CONFIDENTIAL

Cu:18um



Cover-lay Land diameter : 1.2mmφ


Width of EMI : 15mm

Press conditions



Cu

Cu

Cover-lay(60um)TSS

Bending test at 360°

SF-PC5500

TSS200

SF-PC6000

Cleave bend


Bending test-2 / Appearance

CONFIDENTIAL

TSS200 SF-PC6000

Shield film

Cover-lay

CCLTest piece structure (Cross-section)

Bending test at 360°

Cleave bend

after 10 times bended


Sliding test

CONFIDENTIAL

Conditions : 23℃,50%RHRadios : R=1.0mmSpeed : 30 cpmStroke : 35mmPattern : L/S=0.75mm/0.75mm , 40line

R=1.0[Structure]EMI shield filmCover-lay (PI:12um,Adhesive:15um,Arisawa)2CCL(Cu:12um,PI base:20um,Arisawa)EMI shield film


Embedment / Appearance

CONFIDENTIAL

Gap scale TSS200 SF-PC5500 SF-PC6000

250um

○ × ○

300um

○ × ○

350um

○ × ×

Gap ; 250um,300um,350umPress conditions


SF-PC:170℃-2MPa-30min.Test piece cross-section image


No air gap

Embedment / Cross-section image

CONFIDENTIAL

60um embedment

200um embedment

Small air gap

air gap

TSS200 SF-PC5500

60um or 200umEMI Shield film

CCL(60um) or FR-4 (200um)

PI(125um)

Large air gap

Press conditions



60um embedment

200um embedment


Embedment / Conductivity

CONFIDENTIAL

200μm

Cu

PI

20mm 15mm

10mm10mm

ＥＭＩＳｈｉｅｌｄｆｉｌｍ

ＥＭＩＳｈｉｅｌｄｆｉｌｍ20mm15mm

200μm

Cu

PI

20mm 15mm

10mm10mm



200μm

Cu

PI

20mm 15mm

10mm10mm



200μm

Cu

PI

200~300um

Cu

PI

20mm 15mm

10mm10mm



Press conditions




Shielding performance-1 / Advantest method

CONFIDENTIAL

Electromagnetic wave

Test piece

Support board (plastic)

Grounding

0

10

20

30

40

50

60

0 500 1000 1500 2000

Frequency [MHz]

SE [d

B]

SFPC5500SFPC6000TSS200


Shield film

PI base film (25μm)

Cu Ni/Au plated (18μm)Cover layer (37.5μm)

Shied film

*Laminate condition : 150℃-2MPa-30min

Ground

Test Piece

CONFIDENTIAL

0

20

40

60

80

100

3 5 7 9 11 13 15

Frequency　[GHz]

SE　

[dB

]

Competitor TS200

*Competitor ; SF-PC5500

0

20

40

60

80

100

0.1 1 10 100 1000

Frequency　[MHz]

SE　

[dB

]

Competitor TSS200

Shielding performance-2 / KEC method


Shielding performance-3 / ASTM method

CONFIDENTIAL

Frequency：500MHz～18GHzASTM D4935Network-analyzer E8361ACondition:28℃60％RH

Eｌectromagnetic waveTest piece


Adhesive test

Kapton200ENShield film

ADHkapton200EN

90°peel

[Material and Test conditions]Shield film : TSS100-22,TSS200, PC5500，PC6000(TATSUTA)Substrate1 : Kapton200EN *Laminate conditions of Shield film and Kapton200EN : (TSS)150℃-2MPa-30min (TATSUTA)170℃-2MPa-30min.Substrate2 : Kapton200EN *Laminate conditions of ADH and Stiffener : press160℃-2MPa-1hPeel Test : 90°peel, 50mm/min

[Pb free reflow profile]


Adhesive test-1

CONFIDENTIAL

TSS200 SF-PC5500 SF-PC6000Ref.

Kapton200EN

Bonding Sheet

TSU0041SI-35DL(TOYOCHEM)

11 N/cmInsulation layer of Shield film

11 N/cmBetween Shield and ADH


43 N/cmCohesion failure of ADH

D3450(SONYCHEMICAL)


9 N/cmConductive layer of Shield film



LF0200(Dupont)





Conductive Bonding Sheet

TSC200(TOYOCHEM)





CBF300(TATSUTA)




16 N/cmBetween ADH and PI


ADHkapton200EN

90°peel


Adhesive test-2 40℃90%RH48hr + Pb free reflow

CONFIDENTIAL

TSS200 SF-PC5500 SF-PC6000Ref.

Kapton200EN

Bonding Sheet

TSU0041SI-35DL(TOYOCHEM)





D3450(SONYCHEMICAL)

Delaminate at Reflow




LF0200(Dupont)





Conductive Bonding Sheet

TSC200(TOYOCHEM)





CBF300(TATSUTA)

5N/cmInsulation layer of Shield film




CONFIDENTIAL


ADHkapton200EN

90°peel


Polyimide:kapton200H(50um）・・・Toray-DupontADH：TSU0041SI-35DL(35um) ・・・ToyoChem

[Press condition]TSS200;150℃ 2Mpa 30min , PC6000;170℃2MPa 30minTSU0041SI-35DL;150℃ 2MPa 30min

Polyimide90°peel

Shield film

Ni-Gold plated CCL

ADH

[Test condition]Sample width：10mmPeel speed：50mm/minPeel angle：90°

Adhesive test-3 Ni-Gold plate / peel test

CONFIDENTIAL

2CCL (F30VC125RC1 1/2 Nikkan Kogyo)PI 25um / Cu 18uｍ

Nickel Plate 1uｍ Made by electroplating Gold Plate 0.03μm Made by electroplating


TSS200 SF-PC6000

Peel Strength

11 N/cmInsulation layer

6 N/cmBetween Conductive layer and Au plate

Picture after peel

test

Adhesive test-3 Ni-Gold plate / peel test

90°peel

CONFIDENTIAL


1mm×1mm, Total 100

10mm

10mm

2CCL:ESPANEX MC18-25-00FRM(43um);Nippon Steel Chemical[Press condition]TSS200;150℃ 2Mpa 30min , SF-PC6000;170℃ 2MPa 30min

Shield film

Ni-Gold plated CCL

[Test method]

1)Laminate shield film for Au plated CCL

2)Cross cutting Shield film

3)Laminate and peel off tape for shield film

4)Counte the number of shield film

Adhesive test-4 Ni-Gold plate / Cross cut test

Cut


Adhesive test-4 Ni-Gold plate / Cross cut test

CONFIDENTIAL

Before tape test After tape test

TSS200

100/100 OK

SF-PC6000

68/100 OK


Polyimide

90°peel

Shield film

CCL

ADH

Resist

Polyimide:kapton200H(50μm）・・・Toray DupontADH：TSU35DL(35μm) ・・・Toyo ChemResist:CF-30G K-20/Hardener B K-1(24μm)・・・Taiyo ink2CCL:ESPANEX MC18-25-00FRM(43μm)・・・Nippon Steel Chemical

Adhesive test-5 Resist ink/ peel test

CONFIDENTIAL

[Press condition]TSS200;150℃ 2Mpa 30min , PC6000;170℃2MPa 30minTSU0041SI-35DL;150℃ 2MPa 30min

[Test condition]Sample width：10mmPeel speed：50mm/minPeel angle：90°

2CCL (F30VC125RC1 1/2 Nikkan Kogyo)PI 25um / Cu 18uｍ

Resist (CF-300GK-20/Hardner BK-1 Taiyo ink) 20um


Adhesive test-5 Resist ink / peel test

CONFIDENTIAL

TSS200 SF-PC6000

Peel Strength

10 N/cmInsulation layer

10 N/cmBetween Insulation layer and adhesive

Picture after peel

test

90°peel


1mm×1mm, Total 100

10mm

10mm

2CCL:ESPANEX MC18-25-00FRM(43um);Nippon Steel Chemical[Press condition]TSS200;150℃ 2Mpa 30min , SF-PC6000;170℃ 2MPa 30min

Shield film

Resist/ CCL

[Test method]

1)Laminate shield film for resist on CCL




Adhesive test-6 Resist ink / Cross cut test

Cut

CONFIDENTIAL


Adhesive test-6 Resist ink / Cross cut test

Before tape test After tape test

TSS200

100/100 OK

SF-PC6000

100/100 OK


UL compliant

CONFIDENTIAL

TSS200 has excellent flame resistance (UL94 VTM-0).

UL File No; E316830

[Test piece structure]

TSS200/12.5μmPI(Kapton50H)/TSS200


Surface abrasion-1 / Rub films each other

CONFIDENTIAL

SF-PC5500TSS200

Appearance After Friction Test 30,000 times

【Test Methods】Using left side pictured Friction Equipment

Load below weight and rub film surfaces each other・Friction :Rub films each other・Load : 200gf・Abrasive Times : 30,000times


Surface abrasion-2 / Scratch by Tweezers

CONFIDENTIAL

TSS200 SF-PC6000

Scratched insulation layer by TWEEZERS

Striking a mark and refuses

No striking a mark

And no refuses


Chemical resistance / Cross-cut test

CONFIDENTIAL

[Press condition]TSS200;150℃ 2Mpa 30minSF-PC;170℃ 2MPa 30min.

[Test method]

1)Laminate shield film for Polyimide film (Kapton300H)


3)Soaked sheet into Solution (Acid / Base)



Cut

1mm×1mm, Total 100

10mm

10mm

Shield film

Polyimide

Shield film

Ni-Gold plated CCL


10wt% HCl solution / to PI

CONFIDENTIAL

TSS200 SF-PC5500 SF-PC6000

Initial

10wt% HCl solution 20min.

+Tape test

OK NG OK


10wt% HCl solution / to Ni-Gold plate

CONFIDENTIAL


Initial

10wt% HCl solution 20min.

+Tape test

OK NG NG


10wt% NaOH solution / to PI

CONFIDENTIAL


Initial

10wt% NaOH solution 20min.

+Tape test

OK NG OK


10wt% NaOH solution / to Ni-Gold plate

CONFIDENTIAL


Initial


+Tape test

OK OK NG


OSP / to PI

CONFIDENTIAL


Initial

OSP 40℃,3min.

+Tape test

OK OK OK


OSP / to Ni-Gold plate

CONFIDENTIAL


Initial


+Tape test

OK OK NG


CONFIDENTIAL

Reinforced film peel strength


Before Hot press 20 gf/50mm N/A N/A

After Hot press 20 gf/50mm 250 gf/50mm 200 gf/50mm

[Peel test]

Peel angle;180°

Peel speed;300mm/min.

[Press condition]

TSS ; 150℃,2MPa,30min.

SF-PC;170℃,2MPa,30min.


Comparison

CONFIDENTIAL

Properties TSS200 SF-PC5500 SF-PC6000

Shield property (Advantest method (1GHz) ○ ○ ○

Ground connected resistance ◎ △ ○

Embedment of the gap ◎ × ○

Heat resistance (solder re-flow at 260℃） ○ ○ ○

Peel Strength (PI) ○ ○ ○

Peel Strength (Ni-Au Plate) ○ △ ×

UL-94 VTM-0 ○ ○ ○

Chemical Resistance (Acid / Base) ○ × ×

Sliding test ◎ × ×

Abrasion Durability ○ × ×

Peel Strength of Reinforced film ◎ × ×


How to use

CONFIDENTIAL

Flow chart

① Remove the clear protection film.

②Laminate onFPC

③Heat press under vacuumed condition.

Then, post cure.⑤ Post cure

*Lamination using heated rollers at 40℃~80℃ is recommended.

④Remove the reinforced film

Reinforced film (White)

* If pressing time is over 30min,post cure is unnecessary.


How to use

CONFIDENTIAL

Press condition

● Recommended Lamination Conditions

Press Condition Post Cure

Temperature Pressure Time Temperature Time

Quick Press & Post Cure

150±10℃ 1~3MPa Over 3min 160±10℃ Over 60min

Press Only 150±10℃ 1~3MPa Over 30min - -

★To avoid remains of air, pressing under vacuumed conditions is recommended.

★TSS200 can be heat-cured using the same equipments under the same processes as for the current reinforcement adhesive sheets.

※The conditions may vary depending on the conditions of the press machine and/ cushioning material. Please check your preferred conditions before starting mass production.


Storage

CONFIDENTIAL

■TSS200 should be stored under 10℃ / 70%RH

*Storage at room temperature may cause the adhesive layer to stiffen, thusleading to the loss of conductivity.

Please restore TSS200 back to room temperature before usage.

Recommended restoration time is 7 hours.

If there is significant time between the cut-process and the heat-press process, storage under refrigerated conditions is recommended.

【Shelf Life after the Cut-Process】a) under Refrigerated condition（under 10℃）： less than 30daysb) under Room Temperature （23℃）： less than 14days

Documents

Toyo Ink Group TOYOCHEM EMI shield film for FPC€¦ · This Electromagnetic Wave Shield Film for FPC has excellent flexibility /excellent electrical conductivity / excellent humidity