TLV431x-Q1 Low-Voltage Adjustable Precision …TL1431 shunt-regulator references. When used with an optocoupler, the TLV431 device is an ideal voltage reference in isolated feedback

VREF

Input V

I

O

K

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,intellectual property matters and other important disclaimers. PRODUCTION DATA.

TLV431A-Q1, TLV431B-Q1SLVS905A –DECEMBER 2008–REVISED OCTOBER 2017

TLV431x-Q1 Low-Voltage Adjustable Precision Shunt Regulator

1

1 Features1• Qualified for Automotive Applications• AEC-Q100 Qualified With the Following Results:

– Device Temperature Grade 1: -40°C to 125°CAmbient Operating Temperature Range

• Low-Voltage Operation, VREF = 1.24 V• Adjustable Output Voltage, VO = VREF to 6 V• Reference Voltage Tolerances at 25°C

– 0.5% for TLV431B– 1% for TLV431A

• Typical Temperature Drift– 11 mV (–40°C to 125°C)

• Low Operational Cathode Current, 80 µA Typ• 0.25-Ω Typical Output Impedance• See TLVH431 and TLVH432 for:

– Wider VKA (1.24 V to 18 V) and IK (80 mA)– Multiple Pinouts for SOT-23-3 and SOT-89

Packages

2 Applications• Adjustable Voltage and Current Referencing• Secondary Side Regulation in Flyback SMPSs• Zener Replacement• Voltage Monitoring• Comparator with Integrated Reference

3 DescriptionThe TLV431 device is a low-voltage 3-terminaladjustable voltage reference with specified thermalstability over applicable industrial and commercialtemperature ranges. Output voltage can be set to1.24V on stand alone mode or any value betweenVREF (1.24 V) and 6 V with two external resistors (seeFigure 23). These devices operate from a lowervoltage (1.24 V) than the widely used TL431 andTL1431 shunt-regulator references.

When used with an optocoupler, the TLV431 deviceis an ideal voltage reference in isolated feedbackcircuits for 3-V to 3.3-V switching-mode powersupplies. These devices have a typical outputimpedance of 0.25 Ω. Active output circuitry providesa very sharp turn-on characteristic, making themexcellent replacements for low-voltage Zener diodesin many applications, including on-board regulationand adjustable power supplies.

Device Information(1)

PART NUMBER PACKAGE (PIN) BODY SIZE (NOM)

TLV431x-Q1SOT-23 (3) 2.90 mm x 1.30 mmSOT-23 (5) 2.90 mm x 1.60 mm

(1) For all available packages, see the orderable addendum atthe end of the data sheet.

Simplified Schematic

http://www.ti.com/product/tlv431a-q1?qgpn=tlv431a-q1

http://www.ti.com/product/tlv431b-q1?qgpn=tlv431b-q1

http://www.ti.com/lit/pdf/SLVS555

http://www.ti.com/lit/pdf/SLVS555

2

TLV431A-Q1, TLV431B-Q1SLVS905A –DECEMBER 2008–REVISED OCTOBER 2017 www.ti.com

Product Folder Links: TLV431A-Q1 TLV431B-Q1

Submit Documentation Feedback Copyright © 2008–2017, Texas Instruments Incorporated

Table of Contents1 Features .................................................................. 12 Applications ........................................................... 13 Description ............................................................. 14 Revision History..................................................... 25 Pin Configuration and Functions ......................... 36 Specifications......................................................... 4

6.1 Absolute Maximum Ratings ...................................... 46.2 ESD Ratings ............................................................ 46.3 Thermal Information .................................................. 46.4 Recommended Operating Conditions....................... 46.5 Electrical Characteristics for TLV431A-Q1 ............... 56.6 Electrical Characteristics for TLV431B-Q1 ............... 66.7 Typical Characteristics .............................................. 7

7 Parameter Measurement Information ................ 158 Detailed Description ............................................ 16

8.1 Overview ................................................................. 168.2 Functional Block Diagram ....................................... 16

8.3 Feature Description................................................. 168.4 Device Functional Modes........................................ 17

9 Applications and Implementation ...................... 189.1 Application Information............................................ 189.2 Typical Applications ................................................ 19

10 Power Supply Recommendations ..................... 2311 Layout................................................................... 23

11.1 Layout Guidelines ................................................. 2311.2 Layout Example .................................................... 23

12 Device and Documentation Support ................. 2412.1 Related Links ........................................................ 2412.2 Receiving Notification of Documentation Updates 2412.3 Community Resources.......................................... 2412.4 Trademarks ........................................................... 2412.5 Electrostatic Discharge Caution............................ 2412.6 Glossary ................................................................ 24

13 Mechanical, Packaging, and OrderableInformation ........................................................... 24

4 Revision History

Changes from Original (December 2008) to Revision A Page

• Added Automotive AEC-Q100 feature ................................................................................................................................... 1• Added New typical curves ................................................................................................................................................... 15



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http://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLVS905A&partnum=TLV431A-Q1

NCíNo internal connectionw For TLV431A: NC íNo internal connectionw For TLV431B: Pin 2 is attached to Substrate and

must be connected to ANODE or left open.

DBV (SOT-23-5) PACKAGE (TOP VIEW)

NCw

ANODE

DBZ (SOT-23-3) PACKAGE (TOP VIEW)

REF1

2

3

5

4CATHODE REF CATHODEANODE

1

2

3

3

TLV431A-Q1, TLV431B-Q1www.ti.com SLVS905A –DECEMBER 2008–REVISED OCTOBER 2017


Submit Documentation FeedbackCopyright © 2008–2017, Texas Instruments Incorporated

5 Pin Configuration and Functions

Pin FunctionsPIN

TYPE DESCRIPTIONNAME DBZ DBV

CATHODE 2 3 I/O Shunt Current/Voltage input

REF 1 4 I Threshold relative to common anode

ANODE 3 5 O Common pin, normally connected to ground

NC — 1 I No Internal Connection

* — 2 I Substrate Connection



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4




(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under Recommended OperatingConditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) Voltage values are with respect to the anode terminal, unless otherwise noted.

6 Specifications

6.1 Absolute Maximum Ratingsover operating free-air temperature range (unless otherwise noted) (1)

MIN MAX UNITVKA Cathode voltage (2) 7 VIK Continuous cathode current range –20 20 mAIref Reference current range –0.05 3 mA

Operating virtual junction temperature 150 °CTstg Storage temperature range –65 150 °C

(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.2 ESD RatingsVALUE UNIT

V(ESD) Electrostatic dischargeHuman-body model (HBM), per AEC Q100-002 (1) ±2000

VCharged-device model (CDM), per AEC Q100-011 ±1000

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics applicationreport.

6.3 Thermal Information

THERMAL METRIC (1)TLV431x

UNITDBV DBZ5 PINS 3 PINS

RθJA Junction-to-ambient thermal resistance 206 206°C/W

RθJC(top) Junction-to-case (top) thermal resistance 131 76

6.4 Recommended Operating Conditionsover operating free-air temperature range (unless otherwise noted)

MIN MAX UNITVKA Cathode voltage VREF 6 VIK Cathode current 0.1 15 mATA Operating free-air temperature range TLV431x-Q1 –40 125 °C



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http://www.ti.com/lit/pdf/spra953

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(1) Full temperature range is –40°C to 125°C for TLV431x-Q1.(2) The deviation parameters VREF(dev) and Iref(dev) are defined as the differences between the maximum and minimum values obtained over

the rated temperature range. The average full-range temperature coefficient of the reference input voltage, αVREF, is defined as:

where ΔTA is the rated operating free-air temperature range of the device.αVREF can be positive or negative, depending on whether minimum VREF or maximum VREF, respectively, occurs at the lowertemperature.

(3) The dynamic impedance is defined asspacerWhen the device is operating with two external resistors (see Figure 23), the total dynamic impedance of the circuit is defined as:

6.5 Electrical Characteristics for TLV431A-Q1at 25°C free-air temperature (unless otherwise noted)

PARAMETER TEST CONDITIONSTLV431AQ

UNITMIN TYP MAX

VREF Reference voltage VKA = VREF,IK = 10 mA

TA = 25°C 1.228 1.24 1.252VTA = full range (1)

(see Figure 22) 1.209 1.271

VREF(dev)VREF deviation over fulltemperature range (2)

VKA = VREF, IK = 10 mA (1)

(see Figure 22) 11 31 mV

Ratio of VREF change in cathodevoltage change

VKA = VREF to 6 V, IK = 10 mA(see Figure 23) –1.5 –2.7 mV/V

Iref Reference terminal currentIK = 10 mA, R1 = 10 kΩ,R2 = open(see Figure 23)

0.15 0.5 µA

Iref(dev)Iref deviation over full temperaturerange (2)

IK = 10 mA, R1 = 10 kΩ,R2 = open (1) (see Figure 23) 0.15 0.5 µA

IK(min)Minimum cathode current forregulation VKA = VREF (see Figure 22) 55 100 µA

IK(off) Off-state cathode current VREF = 0, VKA = 6 V (see Figure 24) 0.001 0.1 µA

|zKA| Dynamic impedance (3) VKA = VREF, f ≤ 1 kHz, IK = 0.1 mA to 15 mA(see Figure 22) 0.25 0.4 Ω



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(1) Full temperature range is –40°C to 125°C for TLV431x-Q1.(2) The deviation parameters VREF(dev) and Iref(dev) are defined as the differences between the maximum and minimum values obtained over

the rated temperature range. The average full-range temperature coefficient of the reference input voltage, αVREF, is defined as:

where ΔTA is the rated operating free-air temperature range of the device.αVREF can be positive or negative, depending on whether minimum VREF or maximum VREF, respectively, occurs at the lowertemperature.

(3) The dynamic impedance is defined asspacerWhen the device is operating with two external resistors (see Figure 23), the total dynamic impedance of the circuit is defined as:

6.6 Electrical Characteristics for TLV431B-Q1at 25°C free-air temperature (unless otherwise noted)

PARAMETER TEST CONDITIONSTLV431BQ

UNITMIN TYP MAX

VREF Reference voltage VKA = VREF,IK = 10 mA

TA = 25°C 1.234 1.24 1.246VTA = full range (1)

(see Figure 22) 1.221 1.265

VREF(dev)VREF deviation over full temperaturerange (2)

VKA = VREF , IK = 10 mA (1)

(see Figure 22) 11 31 mV

Ratio of VREF change in cathodevoltage change

VKA = VREF to 6 V, IK = 10 mA(see Figure 23) –1.5 –2.7 mV/V

Iref Reference terminal currentIK = 10 mA, R1 = 10 kΩ,R2 = open(see Figure 23)

0.1 0.5 µA

Iref(dev)Iref deviation over full temperaturerange (2)

IK = 10 mA, R1 = 10 kΩ,R2 = open(see Figure 23)

0.15 0.5 µA

IK(min)Minimum cathode current forregulation VKA = VREF (see Figure 22) 55 100 µA

IK(off) Off-state cathode current VREF = 0, VKA = 6 V (see Figure 24) 0.001 0.1 µA

|zKA| Dynamic impedance (3) VKA = VREF, f ≤ 1 kHz, IK = 0.1 mA to 15 mA(see Figure 22) 0.25 0.4 Ω



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t−

250

200

150

100

50

0

−200

−250

−1 −0.5 0 0.5 1 1.5

I KA

µ

VKA − Cathode Voltage − V

−50

−100

−150

VKA = VREF

TA = 25°C

Temperature (qC)

Ik(m

in)

-40 -20 0 20 40 60 80 100 120 14055

60

65

70

75

80

85

90

95

100

105

110

115

120

50

70

90

110

130

150

170

190

210

230

250

−50 −25 0 25 50 75 100 125 150

IK = 10 mA

R1 = 10 kΩ

R2 = Open

−R

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−15−1 −0.5 0 0.5 1 1.5

I K

VKA = VREF

TA = 25°C

VKA − Cathode Voltage − V

1.246

1.242

1.240

1.238

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1.252

1.254

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1.244

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−50 −25 0 25 50 75 100 125 150

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R1 = 10 kΩ

R2 = Open

7




6.7 Typical CharacteristicsOperation of the device at these or any other conditions beyond those indicated in the Recommended Operating Conditionstable are not implied.

Figure 1. Reference Voltage vsJunction Temperature

Figure 2. Reference Current vsFree- air Temperature (TLV431A)

Figure 3. Reference Input Current vsJunction Temperature (for TLV431B)

Figure 4. Cathode Current vsCathode Voltage

Figure 5. Minimum Cathode Current (µA) vs TemperatureFigure 6. Cathode Current vs

Cathode Voltage



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−0.025

−0.075

−0.1

−0.125

Perc

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tag

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han

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ref

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0.025

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0 10 20 30 40 50 60

IK = 1 mA

Vre

f

Operating Life at 55°C − kh‡

% Change (3δ

% Change (−3δ)

% Change (avg)

)

−1.0

−0.9

−0.8

−0.7

−0.6

−0.5

−0.4

−0.3

−0.2

−0.1

0.0

−50 −25 0 25 50 75 100 125 150

IK = 10 mA

∆VKA = VREF to 6 V

−1

0


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0

500

1000

1500

2000

2500

3000

−50 −25 0 25 50 75 100 125 150

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VREF = 0


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Typical Characteristics (continued)Operation of the device at these or any other conditions beyond those indicated in the Recommended Operating Conditionstable are not implied.

Figure 7. Off-State Cathode Current vsJunction Temperature for TLV431A

Figure 8. Off-State Cathode Current vsJunction Temperature for TLV431B

Figure 9. Ratio of Delta Reference Voltage toDelta Cathode Voltage vs

Junction Temperature for TLV431A

Figure 10. Ratio of Delta Reference Voltage toDelta Cathode Voltage vs

Junction Temperature (for TLV431B)

‡ Extrapolated from life-test data taken at 125°C; the activation energy assumed is 0.7 eV.

Figure 11. Percentage Change in VREF vsOperating Life at 55°C



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200

15010 100 1k

−E

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Inp

ut

No

ise

Vo

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f − Frequency − Hz

10k 100k

300

250

Vn

nV

/H

z

VKA = VREF

IK = 1 mA

TA = 25°C

_

+

820 Ω

+2200 µF

750 Ω

1 kΩ

470 µF

3 V

TLV431

or

TLV431A

or

TLV431B

TP

160 kΩ

160 Ω

TLE2027

TEST CIRCUIT FOR EQUIVALENT INPUT NOISE VOLTAGE

+

9





Figure 12. Equivalent Input Noise Voltage



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0 2 4 6

t − Time − s

EQUIVALENT INPUT NOISE VOLTAGE

OVER A 10-s PERIOD

8 10

10

8

6

4

2

0

−2

−4

−6

−8

−10

f = 0.1 Hz to 10 Hz

IK = 1 mA

TA = 25°C

−E

qu

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Inp

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No

ise

Vo

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Vn

Vµ

_

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1 µF

750 Ω

1 kΩ

470 µF

3 V

TLV431

or

TLV431A

or

TLV431B

33 kΩ

TLE2027

TEST CIRCUIT FOR 0.1-Hz TO 10-Hz EQUIVALENT NOISE VOLTAGE

+

33 kΩ

10 kΩ

_

+

16 Ω0.1 µF

160 kΩ820 Ω

+

2200 µFTP

2.2 µF

CRO 1 MΩ

TLE2027

0.47 µF

10 kΩ

+

10





Figure 13. Equivalent Noise Voltageover a 10s Period



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100 Ω

100 Ω

GND

Output

IK

0.1

1k 10k 100k 1M 10M

−R

efe

ren

ce Im

ped

an

ce

−

1


REFERENCE IMPEDANCE

vs

FREQUENCY

10

100

ka

|z|

Ω

IK = 0.1 mA to 15 mA

TA = 25°C

TEST CIRCUIT FOR REFERENCE IMPEDANCE

0.01

−

+

SMALL-SIGNAL VOLTAGE GAIN/PHASE MARGIN

vs

FREQUENCY

10

Fµ

GND

Output

180 Ω

IK6.8 kΩ

1k 10k 100k 1M100

−S

mall-S

ign

alV

olt

ag

eG

ain

/Ph

ase

Marg

in−

dB


AV

TEST CIRCUIT FOR VOLTAGE GAIN

AND PHASE MARGIN

80

70

60

50

40

30

20

10

0

−10

0°

36°

72°

108°

144°

180°

Ph

ase

Sh

ift

4.3 kΩ

5 V

IK = 10 mA

TA = 25°C

−20

11





Figure 14. Voltage Gain and Phase Margin

Figure 15. Reference Impedance vs Frequency



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Inp

ut

an

dO

utp

ut

Vo

ltag

e−

V

Output

R = 1.8 kΩ

TA = 25°C

1.8 kΩ

50 Ω

GND

Output

Pulse

Generator

f = 100 kHz

TEST CIRCUIT FOR PULSE RESPONSE 2

0 1 2 3 4

PULSE RESPONSE 2

5 6 7 8

3.5

3

2.5

2

1.5

1

0.5

0

−0.5

t − Time − µs

Input

IK

Inp

ut

an

dO

utp

ut

Vo

ltag

e−

V

Output

R = 18 kΩ

TA = 25°C

18 kΩ

50 Ω

GND

Output

Pulse

Generator

f = 100 kHz

TEST CIRCUIT FOR PULSE RESPONSE 1

0 1 2 3 4

PULSE RESPONSE 1

5 6 7 8

3.5

3

2.5

2

1.5

1

0.5

0

−0.5

t − Time − µs

Input

Ik

12





Figure 16. Pulse Response 1

Figure 17. Pulse Response 2



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IK

íC

ath

od

e C

urr

ent í

mA

12

STABILITYBOUNDARYCONDITION Á

(for TLV431A-Q1)

3

IK

CL íLoad Capacitance í µF

Stable

VKA =V REF

VKA = 2 VStable

VKA = 3 V

TA = 25°C

150

CL Vbat

IK

TEST CIRCUIT FOR VKA =VREF150

CL Vbat

IKR1 = 10 k

TEST CIRCUIT FOR V KA = 2 V, 3 V

í

+IK

í

+

= 15 mA Max

R2

13





‡ The areas under the curves represent conditions that may cause the device to oscillate. For VKA = 2-V and 3-V curves, R2 and Vbat wereadjusted to establish the initial VKA and IK conditions with CL = 0. Vbat and CL then were adjusted to determine the ranges of stability.

Figure 18. Stability Boundary Conditions

Figure 19. Phase Margin vs Capacitive Load VKA = VREF (1.25 V), TA= 25°C (For TLV431B-Q1)



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IK

IK

14





Figure 20. Phase Margin vs Capacitive Load VKA = 2.50 V, TA= 25°C (For TLV431B-Q1)

Figure 21. Phase Margin vs Capacitive Load VKA = 5.00 V, TA= 25°C (For TLV431B-Q1)



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IK(off)

VOInput

Iref

IK

VOInput

VREF

R1

R2

VREF

Input V

I

O

K

15




7 Parameter Measurement Information

Figure 22. Test Circuit for VKA = VREF, VO = VKA = VREFxxxxxxxxx

Figure 23. Test Circuit for VKA > VREF, VO = VKA = VREF × (1 + R1/R2) + Iref × R1xxxxxxxxx

Figure 24. Test Circuit for IK(off)



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CATHODE

REF

ANODE

+

_

Vref

16




8 Detailed Description

8.1 OverviewTLV431 is a low power counterpart to TL431, having lower reference voltage (1.24 V vs 2.5 V) for lower voltageadjustability and lower minimum cathode current (Ik(min)=100 µA vs 1 mA). Like TL431, the TLV431 is used inconjunction with it's key components to behave as a single voltage reference, error amplifier, voltage clamp orcomparator with integrated reference.

TLV431 can be operated and adjusted to cathode voltages from 1.24V to 6V, making this part optimum for awide range of end equipments in industrial, auto, telecom & computing. In order for this device to behave as ashunt regulator or error amplifier, > 100 µA (Imin(max)) must be supplied in to the cathode pin. Under thiscondition, feedback can be applied from the Cathode and Ref pins to create a replica of the internal referencevoltage.

Various reference voltage options can be purchased with initial tolerances (at 25°C) of 0.5%, and 1%. Thesereference options are denoted by B (0.5%) and A (1.0%) after the TLV431x-Q1.

The TLV431x-Q1 devices are characterized for operation from –40°C to 125°C.

8.2 Functional Block Diagram

8.3 Feature DescriptionTLV431 consists of an internal reference and amplifier that outputs a sink current base on the difference betweenthe reference pin and the virtual internal pin. The sink current is produced by an internal darlington pair.

When operated with enough voltage headroom (≥ 1.24 V) and cathode current (Ika), TLV431 forces thereference pin to 1.24 V. However, the reference pin can not be left floating, as it needs Iref ≥ 0.5 µA (please seethe Functional Block Diagram). This is because the reference pin is driven into an npn, which needs base currentin order operate properly.

When feedback is applied from the Cathode and Reference pins, TLV431 behaves as a Zener diode, regulatingto a constant voltage dependent on current being supplied into the cathode. This is due to the internal amplifierand reference entering the proper operating regions. The same amount of current needed in the above feedbacksituation must be applied to this device in open loop, servo or error amplifying implementations in order for it tobe in the proper linear region giving TLV431 enough gain.

Unlike many linear regulators, TLV431 is internally compensated to be stable without an output capacitorbetween the cathode and anode. However, if it is desired to use an output capacitor Figure 18 can be used as aguide to assist in choosing the correct capacitor to maintain stability.



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17




8.4 Device Functional Modes

8.4.1 Open Loop (Comparator)When the cathode/output voltage or current of TLV431 is not being fed back to the reference/input pin in anyform, this device is operating in open loop. With proper cathode current (Ika) applied to this device, TLV431 willhave the characteristics shown in Figure 6. With such high gain in this configuration, TLV431 is typically used asa comparator. With the reference integrated makes TLV431 the preferred choice when users are trying tomonitor a certain level of a single signal.

8.4.2 Closed LoopWhen the cathode/output voltage or current of TLV431 is being fed back to the reference/input pin in any form,this device is operating in closed loop. The majority of applications involving TLV431 use it in this manner toregulate a fixed voltage or current. The feedback enables this device to behave as an error amplifier, computinga portion of the output voltage and adjusting it to maintain the desired regulation. This is done by relating theoutput voltage back to the reference pin in a manner to make it equal to the internal reference voltage, which canbe accomplished via resistive or direct feedback.



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~

~

P

− +

P

P

VCC

VFB

Current

Sense

Gate Drive

GND

Controller

P

P P P

TLV431

or

TLV431A

or

TLV431B

VO

3.3 V

VI

120 V

18




9 Applications and Implementation

NOTEInformation in the following applications sections is not part of the TI componentspecification, and TI does not warrant its accuracy or completeness. TI’s customers areresponsible for determining suitability of components for their purposes. Customers shouldvalidate and test their design implementation to confirm system functionality.

9.1 Application InformationFigure 25 shows the TLV431A, or TLV431B used in a 3.3-V isolated flyback supply. Output voltage VO can be aslow as reference voltage VREF (1.24 V ± 1%). The output of the regulator, plus the forward voltage drop of theoptocoupler LED (1.24 + 1.4 = 2.64 V), determine the minimum voltage that can be regulated in an isolatedsupply configuration. Regulated voltage as low as 2.7 Vdc is possible in the topology shown in Figure 25.

The 431 family of devices are prevalent in these applications, being designers go to choice for secondary sideregulation. Due to this prevalence, this section will further go on to explain operation and design in both states ofTLV431 that this application will see, open loop (Comparator + Vref) & closed loop (Shunt Regulator).

Further information about system stability and using a TLV431 device for compensation can be found in theapplication note Compensation Design With TL431 for UCC28600, SLUA671.

Figure 25. Flyback With Isolation Using TLV431, TLV431A, or TLV431Bas Voltage Reference and Error Amplifier



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http://www.ti.com/lit/pdf/SLUA671

+

1.24 V

CATHODE

ANODE

REFVIN

Vout

Vsup

Rsup

R1

R2

VL

RIN

19




9.2 Typical Applications

9.2.1 Comparator with Integrated Reference (Open Loop)

Figure 26. Comparator Application Schematic

9.2.1.1 Design RequirementsFor this design example, use the parameters listed in Table 1 as the input parameters.

Table 1. Design ParametersDESIGN PARAMETER EXAMPLE VALUE

Input Voltage Range 0 V to 5 VInput Resistance 10 kΩSupply Voltage 5 V

Cathode Current (Ik) 500 µAOutput Voltage Level ~1 V - Vsup

Logic Input Thresholds VIH/VIL VL

9.2.1.2 Detailed Design ProcedureWhen using TLV431 as a comparator with reference, determine the following:• Input voltage range• Reference voltage accuracy• Output logic input high and low level thresholds• Current source resistance

9.2.1.2.1 Basic Operation

In the configuration shown in Figure 26 TLV431 will behave as a comparator, comparing the Vref pin voltage tothe internal virtual reference voltage. When provided a proper cathode current (Ik), TLV431 will have enoughopen loop gain to provide a quick response. With the TLV431's min Operating Current maximum (Imin) being 55uA to 100 uA over temperature, operation below that could result in low gain, leading to a slow response.



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Time (ms)

Vol

tage

(V

)

-0.4 -0.2 0 0.2 0.4 0.6 0.8-2-10123456789

101112

D001

Vin~1.24V (+/-5%)Vo(Vin=1.18V)Vo(Vin=1.24V)Vo(Vin=1.30V)

Time (ms)

Vol

tage

(V

)

-0.4 -0.2 0 0.2 0.4 0.6 0.8-2

-1

0

1

2

3

4

5

6

7

8

9

10

D001

Vo(Vin=5.0V)Vin=5.0V

20




9.2.1.2.2 Overdrive

Slow or inaccurate responses can also occur when the reference pin is not provided enough overdrive voltage.This is the amount of voltage that is higher than the internal virtual reference. The internal virtual referencevoltage will be within the range of 1.24V ±(0.5% or 1.0% ) depending on which version is being used.

The more overdrive voltage provided, the faster the TLV431 will respond. This can be seen in figures Figure 27and Figure 28, where it displays the output responses to various input voltages.

For applications where TLV431 is being used as a comparator, it is best to set the trip point to greater than thepositive expected error (i.e. +1.0% for the A version). For fast response, setting the trip point to > 10% of theinternal Vref should suffice.

For minimal voltage drop or difference from Vin to the ref pin, it is recommended to use an input resistor < 10 kΩto provide Iref.

9.2.1.2.3 Output Voltage and Logic Input Level

In order for TLV431 to properly be used as a comparator, the logic output must be readable by the recievinglogic device. This is accomplished by knowing the input high and low level threshold voltage levels, typicallydenoted by VIH & VIL.

As seen in Figure 27, TLV431's output low level voltage in open-loop/comparator mode is ~1 V, which issufficient for some 3.3V supplied logic. However, would not work for 2.5 V and 1.8 V supplied logic. In order toaccommodate this a resistive divider can be tied to the output to attenuate the output voltage to a voltage legibleto the receiving low voltage logic device.

TLV431's output high voltage is approximately Vsup due to TLV431 being open-collector. If Vsup is much higherthan the receiving logic's maximum input voltage tolerance, the output must be attenuated to accommodate theoutgoing logic's reliability.

When using a resistive divider on the output, be sure to make the sum of the resistive divider (R1 & R2 inFigure 26) is much greater than Rsup in order to not interfere with TLV431's ability to pull close to Vsup whenturning off.

9.2.1.2.3.1 Input Resistance

TLV431 requires an input resistance in this application in order to source the reference current (Iref) needed fromthis device to be in the proper operating regions while turning on. The actual voltage seen at the ref pin will beVref=Vin-Iref*Rin. Since Iref can be as high as 0.5 µA it is recommended to use a resistance small enough that willmitigate the error that Iref creates from Vin.

9.2.1.3 Application Curves

Figure 27. Output Response with Small Overdrive Voltages Figure 28. Output Response with Large Overdrive Voltage



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REF

CATHODE

ANODE

R2

VSUP

RSUP

R1

VO (R1

Vref

0.1%

R2

0.1%

TL431

= 1 + Vref)

CL

21




9.2.2 Shunt Regulator/Reference

Figure 29. Shunt Regulator Schematic

9.2.2.1 Design RequirementsFor this design example, use the parameters listed in Table 2 as the input parameters.

Table 2. Design ParametersDESIGN PARAMETER EXAMPLE VALUE

Reference Initial Accuracy 1.0%Supply Voltage 6 V

Cathode Current (Ik) 1 mAOutput Voltage Level 1.24 V - 6 V

Load Capacitance 100 nFFeedback Resistor Values and Accuracy (R1 & R2) 10 kΩ

9.2.2.2 Detailed Design ProcedureWhen using TLV431 as a Shunt Regulator, determine the following:• Input voltage range• Temperature range• Total accuracy• Cathode current• Reference initial accuracy• Output capacitance

9.2.2.2.1 Programming Output/Cathode Voltage

In order to program the cathode voltage to a regulated voltage a resistive bridge must be shunted between thecathode and anode pins with the mid point tied to the reference pin. This can be seen in Figure 29, with R1 & R2being the resistive bridge. The cathode/output voltage in the shunt regulator configuration can be approximatedby the equation shown in Figure 29. The cathode voltage can be more accuratel determined by taking in toaccount the cathode current:

VO=(1+R1/R2)*Vref–Iref*R1

In order for this equation to be valid, TLV431 must be fully biased so that it has enough open loop gain tomitigate any gain error. This can be done by meeting the Imin spec denoted in Recommended OperatingConditions table.



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Time (Ps)

Vol

tage

(V

)

-1 0 1 2 3 4 5 6 7 8 9-0.5

00.5

11.5

22.5

33.5

44.5

55.5

66.5

D001

VsupVka=VrefR1=10k: & R2=10k:

22




9.2.2.2.2 Total Accuracy

When programming the output above unity gain (Vka=Vref), TLV431 is susceptible to other errors that may effectthe overall accuracy beyond Vref. These errors include:

• R1 and R2 accuracies• VI(dev) - Change in reference voltage over temperature• ΔVref / ΔVKA - Change in reference voltage to the change in cathode voltage• |zKA| - Dynamic impedance, causing a change in cathode voltage with cathode current

Worst case cathode voltage can be determined taking all of the variables in to account. Application noteSLVA445 assists designers in setting the shunt voltage to achieve optimum accuracy for this device.

9.2.2.2.3 Stability

Though TLV431 is stable with no capacitive load, the device that receives the shunt regulator's output voltagecould present a capacitive load that is within the TLV431 region of stability, shown in Figure 18. Also, designersmay use capacitive loads to improve the transient response or for power supply decoupling.

9.2.2.3 Application Curves

Figure 30. TLV431 Start-Up Response



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http://www.ti.com/lit/pdf/SLVA445

DBZ

(TOP VIEW)

REF

1

CATHODE

2

3ANODE

Rsup

Rref

Vsup

CL

Vin

GND

GND

23




10 Power Supply RecommendationsWhen using TLV431 as a Linear Regulator to supply a load, designers will typically use a bypass capacitor onthe output/cathode pin. When doing this, be sure that the capacitance is within the stability criteria shown inFigure 18.

In order to not exceed the maximum cathode current, be sure that the supply voltage is current limited. Also, besure to limit the current being driven into the Ref pin, as not to exceed it's absolute maximum rating.

For applications shunting high currents, pay attention to the cathode and anode trace lengths, adjusting the widthof the traces to have the proper current density.

11 Layout

11.1 Layout GuidelinesPlace decoupling capacitors as close to the device as possible. Use appropriate widths for traces when shuntinghigh currents to avoid excessive voltage drops.

11.2 Layout Example

Figure 31. DBZ Layout Example



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24




12 Device and Documentation Support

12.1 Related LinksThe table below lists quick access links. Categories include technical documents, support and communityresources, tools and software, and quick access to order now.

Table 3. Related Links

PARTS PRODUCT FOLDER ORDER NOW TECHNICALDOCUMENTS

TOOLS &SOFTWARE

SUPPORT &COMMUNITY

TLV431A-Q1 Click here Click here Click here Click here Click hereTLV431B-Q1 Click here Click here Click here Click here Click here

12.2 Receiving Notification of Documentation UpdatesTo receive notification of documentation updates, navigate to the device product folder on ti.com. In the upperright corner, click on Alert me to register and receive a weekly digest of any product information that haschanged. For change details, review the revision history included in any revised document.

12.3 Community ResourcesThe following links connect to TI community resources. Linked contents are provided "AS IS" by the respectivecontributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms ofUse.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaborationamong engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and helpsolve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools andcontact information for technical support.

12.4 TrademarksE2E is a trademark of Texas Instruments.All other trademarks are the property of their respective owners.

12.5 Electrostatic Discharge CautionThis integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled withappropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be moresusceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.6 GlossarySLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable InformationThe following pages include mechanical packaging and orderable information. This information is the mostcurrent data available for the designated devices. This data is subject to change without notice and revision ofthis document. For browser based versions of this data sheet, refer to the left hand navigation.



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PACKAGE OPTION ADDENDUM

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Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status(1)

Package Type PackageDrawing

Pins PackageQty

Eco Plan(2)

Lead/Ball Finish(6)

MSL Peak Temp(3)

Op Temp (°C) Device Marking(4/5)

Samples

TLV431AQDBVRQ1 ACTIVE SOT-23 DBV 5 3000 Green (RoHS& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 125 VONQ

TLV431BQDBVRQ1 ACTIVE SOT-23 DBV 5 3000 Green (RoHS& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 125 VOMQ

TLV431BQDBZRQ1 ACTIVE SOT-23 DBZ 3 3000 Green (RoHS& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 125 VOQQ

(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substancedo not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI mayreference these types of products as "Pb-Free".RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide basedflame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finishvalue exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

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PACKAGE OPTION ADDENDUM


Addendum-Page 2

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF TLV431A-Q1, TLV431B-Q1 :

• Catalog: TLV431A, TLV431B

NOTE: Qualified Version Definitions:

• Catalog - TI's standard catalog product

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TAPE AND REEL INFORMATION

*All dimensions are nominal

Device PackageType

PackageDrawing

Pins SPQ ReelDiameter

(mm)

ReelWidth

W1 (mm)

A0(mm)

B0(mm)

K0(mm)

P1(mm)

W(mm)

Pin1Quadrant

TLV431AQDBVRQ1 SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

TLV431BQDBVRQ1 SOT-23 DBV 5 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

TLV431BQDBZRQ1 SOT-23 DBZ 3 3000 180.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3

PACKAGE MATERIALS INFORMATION


Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TLV431AQDBVRQ1 SOT-23 DBV 5 3000 203.0 203.0 35.0

TLV431BQDBVRQ1 SOT-23 DBV 5 3000 203.0 203.0 35.0

TLV431BQDBZRQ1 SOT-23 DBZ 3 3000 203.0 203.0 35.0

PACKAGE MATERIALS INFORMATION


Pack Materials-Page 2

4203227/C

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PACKAGE OUTLINE

C

TYP0.200.08

0.25

2.642.10

1.12 MAX

TYP0.100.01

3X 0.50.3

TYP0.60.2

1.9

0.95

TYP-80

A

3.042.80

B1.41.2

(0.95)

SOT-23 - 1.12 mm max heightDBZ0003ASMALL OUTLINE TRANSISTOR

4214838/C 04/2017

NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.2. This drawing is subject to change without notice.3. Reference JEDEC registration TO-236, except minimum foot length.

0.2 C A B

1

3

2

INDEX AREAPIN 1

GAGE PLANE

SEATING PLANE

0.1 C

SCALE 4.000

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EXAMPLE BOARD LAYOUT

0.07 MAXALL AROUND

0.07 MINALL AROUND

3X (1.3)

3X (0.6)

(2.1)

2X (0.95)

(R0.05) TYP

4214838/C 04/2017


NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

SYMM

LAND PATTERN EXAMPLESCALE:15X

PKG

1

3

2

SOLDER MASKOPENINGMETAL UNDER

SOLDER MASK

SOLDER MASKDEFINED

METALSOLDER MASKOPENING

NON SOLDER MASKDEFINED

(PREFERRED)

SOLDER MASK DETAILS

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EXAMPLE STENCIL DESIGN

(2.1)

2X(0.95)

3X (1.3)

3X (0.6)

(R0.05) TYP


4214838/C 04/2017

NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLEBASED ON 0.125 THICK STENCIL

SCALE:15X

SYMM

PKG

1

3

2

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PACKAGE OUTLINE

C

TYP0.220.08

0.25

3.02.6

2X 0.95

1.9

1.45 MAX

TYP0.150.00

5X 0.50.3

TYP0.60.3

TYP80

1.9

A

3.052.75

B1.751.45

(1.1)

SOT-23 - 1.45 mm max heightDBV0005ASMALL OUTLINE TRANSISTOR

4214839/C 04/2017

NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.2. This drawing is subject to change without notice.3. Refernce JEDEC MO-178.

0.2 C A B

1

34

5

2

INDEX AREAPIN 1

GAGE PLANE

SEATING PLANE

0.1 C

SCALE 4.000

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0.07 MAXARROUND

0.07 MINARROUND

5X (1.1)

5X (0.6)

(2.6)

(1.9)

2X (0.95)

(R0.05) TYP

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SYMM

LAND PATTERN EXAMPLEEXPOSED METAL SHOWN

SCALE:15X

PKG

1

3 4

5

2


SOLDER MASK

SOLDER MASKDEFINED

EXPOSED METAL



(PREFERRED)

SOLDER MASK DETAILS

EXPOSED METAL

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(2.6)

(1.9)

2X(0.95)

5X (1.1)

5X (0.6)

(R0.05) TYP


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SOLDER PASTE EXAMPLEBASED ON 0.125 mm THICK STENCIL

SCALE:15X

SYMM

PKG

1

3 4

5

2

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PACKAGE OUTLINE

C

TYP0.220.08

0.25

3.02.6

2X 0.95

1.9

1.45 MAX

TYP0.150.00

5X 0.50.3

TYP0.60.3

TYP80

1.9

A

3.052.75

B1.751.45

(1.1)


4214839/C 04/2017

NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.2. This drawing is subject to change without notice.3. Refernce JEDEC MO-178.

0.2 C A B

1

34

5

2

INDEX AREAPIN 1

GAGE PLANE

SEATING PLANE

0.1 C

SCALE 4.000

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0.07 MAXARROUND

0.07 MINARROUND

5X (1.1)

5X (0.6)

(2.6)

(1.9)

2X (0.95)

(R0.05) TYP

4214839/C 04/2017



SYMM

LAND PATTERN EXAMPLEEXPOSED METAL SHOWN

SCALE:15X

PKG

1

3 4

5

2


SOLDER MASK

SOLDER MASKDEFINED

EXPOSED METAL



(PREFERRED)

SOLDER MASK DETAILS

EXPOSED METAL

www.ti.com


(2.6)

(1.9)

2X(0.95)

5X (1.1)

5X (0.6)

(R0.05) TYP


4214839/C 04/2017


SOLDER PASTE EXAMPLEBASED ON 0.125 mm THICK STENCIL

SCALE:15X

SYMM

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3 4

5

2

IMPORTANT NOTICE

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TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OFPRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES INCONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEENADVISED OF THE POSSIBILITY OF SUCH DAMAGES.Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, suchproducts are intended to help enable customers to design and create their own applications that meet applicable functional safety standardsand requirements. Using products in an application does not by itself establish any safety features in the application. Designers mustensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products inlife-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., lifesupport, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, allmedical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applicationsand that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatoryrequirements in connection with such selection.Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-compliance with the terms and provisions of this Notice.

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