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1 TI Analog Overview Joong-ho Kim Analog Sales Manager High-Performance Analog

TI Analog Overview

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Page 1: TI Analog Overview

1

TI Analog Overview

Joong-ho KimAnalog Sales Manager

High-Performance Analog

Page 2: TI Analog Overview

2

AGENDA

• What is Analog?• Analog Market• Analog Analogies• TI Analog Technology

Page 3: TI Analog Overview

3

What is Analog?

Page 4: TI Analog Overview

4

TI Analog & DSP Power Portable A/VRCA LYRA Audio/Video Jukebox

How many TI components are on the board?A. 6B. 11C. 16D. 21

Page 5: TI Analog Overview

5

TI Analog & DSP Power Portable A/VRCA LYRA Audio/Video Jukebox

Power

Digital Signal

Processor

Power

Power

Switch

Amplifier

Power

Power

Power

Switch

SwitchLogic

Audio Codec

Logic

Logic

Power

Power

Power

Top Bottom

Page 6: TI Analog Overview

6

Dell™ Axim™ X50v PDAHow many TI components are on the board?

A. 25B. 30C. 35D. 40

Page 7: TI Analog Overview

7

Dell™ Axim™ X50v PDA

Logic

WirelessLAN

Power

Video DAC

Touch Screen

Controller

Bluetooth

Power

Codec/Amplifier

Logic

Logic

Logic

Logic

Logic

Logic

Page 8: TI Analog Overview

8

Analog is Everywhere

Page 9: TI Analog Overview

9

What is Analog?Analog chips are an essential element of almost all applications in today’s digital world. They convert “real-world” signals such as voice, sound, pressure, temperature and electricity into the 1s and 0s of the digital world, where the digital signals can be processed very fast by digital signal processors (DSPs) and back into real world signals again. Here’s the role one type of analog chip – the data converter -- plays in a cell phone:

Page 10: TI Analog Overview

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Analog Market

Page 11: TI Analog Overview

11

Semiconductor Growth is Broad Based

Analog~40%

DSP~35%

Other~25%

2004 Revenue: $10.9B

+$800M+$1000M

+$700M

1

2

3

4

Analog DSP Other2003 2004 2003 2004 2003 2004

5

2004 Growth Rate 31%

$B

Page 12: TI Analog Overview

12

Vertical Applications

$19.5B

Vertical Applications

$19.5B

Standard$11.9B

Standard$11.9B

Analog Market: Dynamic OpportunityTotal Analog TAM 2004

$31.4 Billion

Mixed-Signal MarketHigh-Performance Analog Market

Long product lifeHighly profitableDiverse and large number of products and customersSignificant investment to enter

High-volume, end-equipment orientedFast production rampIntegration of analog + digital, powerSignificant investment to enter

Page 13: TI Analog Overview

13

Vertical Applications

$19.5B

Vertical Applications

$19.5B

Standard$11.9B

Standard$11.9B

High-Performance Analog Market

High-Performance Analog MarketAmps$2.5BAmps$2.5B

Data Converters$2.0B

Data Converters$2.0B

Power Mgmt$5.5B

Power Mgmt$5.5B

Interface$1.8B

Interface$1.8B

Source: WSTS 2004

TI’s HPA Business$1.5B+ revenue in 200440% growth over 200335,000+ customers15,000+ products

Total Analog TAM 2004$31.4 Billion

Gregg LoweSenior Vice President

High-Performance Analog

Page 14: TI Analog Overview

14

The Analog Market is GrowingAnalog Market By RegionWorldwide Analog Market

25,000

35,000

45,000

55,000

2004 2005 2006 2007 2008 2009 2010

Source: DATABEANS Estimates

0

5,000

10,000

15,000

20,000

25,000

30,000

2004 2005 2006 2007 2008 2009 2010

AutomotiveComputerConsumerCommunicationsIndustrial

Worldwide Analog Forecast By Market

2004– 2010 CAGR = 12%2004– 2010 CAGR = 12%

Mill

ions

of D

olla

rsM

illio

ns o

f Dol

lars

4,000

9,000

14,000

19,000

24,000

29,000

34,000

39,000

2004 2005 2006 2007 2008 2009 2010

AmericasEuropeJapanAsia Pacific

Mill

ions

of D

olla

rs

0%

5%

10%

15%

TI STM Infineon Philips ADI National

2004 Worldwide Analog Market Share by Vendor

Mar

ket S

hare

Page 15: TI Analog Overview

15

Asia Analog MarketAsia Analog MarketAsia Analog Market

10,000

20,000

30,000

40,000

2004 2005 2006 2007 2008 2009 2010

Source: DATABEANS Estimates

0

5,000

10,000

15,000

20,000

25,000

30,000

2004 2005 2006 2007 2008 2009 2010

AutomotiveComputerConsumerCommunicationsIndustrial

Worldwide Analog Forecast By Market

2004– 2010 CAGR = 17%2004– 2010 CAGR = 17%

Mill

ions

of D

olla

rsM

illio

ns o

f Dol

lars

0

5,000

10,000

15,000

20,000

25,000

2004 2005 2006 2007 2008 2009 2010

China Taiwan

Korea Other

Mill

ions

of D

olla

rs

0%

5%

10%

15%

TI STM Infineon Philips ADI National

2004 Worldwide Analog Market Share by Vendor

Mar

ket S

hare

Page 16: TI Analog Overview

16

TI HPA Is Outgrowing the Competition

TI HPALLTCMXIMADI

2001 2002 2003 2004

Perc

ent C

umul

ativ

e Se

quen

tial G

row

th

60

40

20

0

-20

Source: Company Reports and TI High-Performance Analog revenue* ADI numbers based on analog revenue

Page 17: TI Analog Overview

17

Analog Analogies

Page 18: TI Analog Overview

18

Data ConvertersData converters are like translators: they convert one language (analog) to another (digital). You’ve probably heard this a million times already: Analog is the “real world”• light• sound• temperature• pressure• …Digital is “computers” or “processors”.Since we can do a lot of things with processors that we can’t doin the “real world”, or because we can do them cheaper, faster, smaller, …, we need to translate TO digital. But since our human brains can only understand analog (at least so far!) we have to translate back.

Page 19: TI Analog Overview

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AmplifiersFirst, think of amplifiers like cars… There are lots of different kinds: old, used, new; cheap, mid-range, expensive. They do lots of things: get you from point A to point B, carry things, give you pleasure, impress other people.

In a lot of situations one is as good as another, subject to individual preferences. Sometimes only one unique characteristic matters – maybe

distance to the pedals for a shorter driver, or cost for a starving student.

Sometimes their exactly the same,just a different color (“pin-for-pin”).

Page 20: TI Analog Overview

20

AmplifiersIn the most basic configuration, Amplifiers make small things (signals) bigger, like a magnifying glass or a megaphone…

…or weak things stronger so they can go farther – Buffers, LineDrivers – like handing the ball to someone who can throw harder/farther than you can, or a spent runner in a relay race passing the baton…

Page 21: TI Analog Overview

21

Interface, Data transmissionIn the digital domain processors have to communicate by sending data and other digital information to other processors, to memory or storage mediums, to other devices.

Data Transmission Circuits, also called Interface Circuits, are responsible for digital-to-digital communication.

Page 22: TI Analog Overview

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Interface, Data transmissionIf we didn’t have data transmission standards, systems couldn’t share data with each other. Different manufacturers couldn’t design products to talk to each other.

Some data transmission standards and standards-based products include:

• RS-232

• RS-485

• 1394

• PECL, LVPECL

• LVDS, LVDM

• Ethernet

• UART

• SerDes

• CAN

• USB

• SCSI

• Gbit Ethernet

Page 23: TI Analog Overview

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Operational AmplifiersOperational Amplifiers – “Op Amps” – are the “black magic” of analog. They can be configured to do just about anything, and are used everywhere:

• amplifying (duh!)• buffering• filtering• shaping• summing (combining signals) & differencing• comparing (comparators are just special op amps)• sampling• analog “arithmetic” operations: integrating, multiplying, etc…• and on and on and on…

They are the most analog” of the “analog” building blocks.

Page 24: TI Analog Overview

24

Audio Power AmplifiersAudio Power Amp – like getting your big brother (bigger and stronger) to beat up the bully…

Power Amplifiers, Buffers, Line Driversare like specialty vehicles designed to do certain things: pull a load like a tractor, carry a big load like a semi, go a long distance, etc.

Page 25: TI Analog Overview

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Power Mgmt – “Bricks”“Pre-fab” or “off the shelf” power supplies built to basic specifications (V, I, P).

Typically higher current, higher power; sometimes multiple outputs (V + I)

Complex “switched mode” topologies: power supply design expertise.

Used to be about the size of a brick, then “half-bricks”, “quarter bricks”, and so on as technologies improved. Now some lower power (less heat) versions look like ICs.

Page 26: TI Analog Overview

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Voltage RegulationVoltage Regulators are like a bridge between a bumpy rutted dirt country road and a smooth paved highway.

Electrical circuits have different levels of ‘robustness’ and ‘tolerance’ to supply voltage changes – their ‘shock absorbers’ are usually pretty weak.

Voltage regulators flatten out the “bumps” in the supply voltage so the circuitry that “rides”on it doesn’t get damaged.

Page 27: TI Analog Overview

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DC-DC ConvertersElectricity comes in two types: ac (“alternating current”) and dc (“direct current”). AC is what you get from the plug on the wall, what’s in the power lines you see. DC is what you get out of batteries, and what electronic circuits use.

So you have to convert what you get out of the wall to something like a battery…that’s ac-dc conversion, or “offline” conversion.

Once you have dc of some x Volts, whether it comes from ac-dc conversion, or from a battery or other power supply, you may need to change it (remember SMPS):• higher voltage• lower voltage• negative voltage

This is dc-dc conversion.

Page 28: TI Analog Overview

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Supply Voltage SupervisorsSupply Voltage Supervisors (SVSs), also called Reset Circuits, are pretty simple to understand. Basically theyare like sentries who keep watch on your power supply voltage, and raise a flag ifit drops below a threshold.

SVSs are used with processors to make surethe system saves data and shuts down“nicely” when there is a power interruptionor when batteries discharge.

Some SVSs include extra bells and whistles:• back up power switching• “early fail” warning• others

Page 29: TI Analog Overview

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Power DistributionPower Distribution Switches are just like the switches around your house – you don’t leave all the lights on in every room (1) because your mother/father told you not to, and(2) because today you pay the electric bill!

Electronic systems, especiallybattery-powered systems, also need to conserve energy (power); one way to do this is to shut off parts of the systemwhenever possible.

A couple of examples: • the hard drive on your laptop• the screen on your laptop

Page 30: TI Analog Overview

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Battery ManagementThe advent of the portable computer and the cellular telephone, and the corresponding development of new battery technologies and the need to get as much ‘life’ out of a single battery cycle led to the development of sophisticated circuits to “manage” the battery:

• supervision: simple ‘low battery’ detection• safe charging and discharging• temperature control• monitoring and display of charge remaining

Page 31: TI Analog Overview

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Battery ManagementDifferent battery technologies – Li-Ion, NiCd, NiMH, Lead-Acid, etc. – have very different characteristics, and can be very volatile if charged or discharged incorrectly. Chargers are circuits used to do this safely.

Battery Monitors and “Gas Gauges” keep track of the amount of power left in a battery by tracking the charging and discharging. How often do any of us fully charge or discharge our cell phones and laptops? We use them as we need them, and charge them whenever and as long as is convenient. Monitors and “Gas Gauges”tell us ‘how much is left in the tank’ so we can‘fill ‘er up’ before we run out.

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TI Analog Technology

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High Performance Analog Technology Leadership

For Highest PrecisionLowest 1/f noise in industryBest thin-film resistor and capacitor in industryLow parasitics – aggressive metal pitchFully qualified, in production

HPA07

Industry’s only SiGe NPN and PNPLowest parasitics – oxide isolationPrecision thin-film resistor and capacitorFully qualified, in production

For Highest Speeds and Precision

BiCom3 LBC7

Leading-edge power DMOS devicesIndustry-leading copper technologyFull SOA characterizationFully qualified, in production

For Highest Integration and Power

For High Speed and IntegrationTI’s advanced CMOS roadmapTI’s advanced wafer fabsDense, low-power CMOSFully qualified, in production

C05

Page 34: TI Analog Overview

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Technology Features:0.3 µm Feature Size120 A (75 A) Gate OxTLM (triple level metal)SiCr TFRMIM CapacitorLow Noise hot digital and analog 3 / 5V CMOS17K Gates/mm2200mm Wafers

NSDNSDPSD

N-well

P Substrate

Poly

Gate Oxide

Field Oxide

DrainGate

SourceBackgate

18 / 30V DE HV CMOS

Process Goals:Lowest 1/f NoiseLowest Cap VCLowest Cpar’sHigh CMOS IdsatWorld’s Best Thin FilmIntegration Capability

NBL

NWELL

NSDVTP

Fox

POLY1

CTOP

NBL NWELL VTP POLY1 CTOPNSD CONT MET1

NBL

NWELL

NSDVTP

Fox

POLY1

CTOP

NBL NWELL VTP POLY1 CTOPNSD CONT MET1

NBL

NWELL

NSDVTP

Fox

POLY1

CTOP

NBL NWELL VTP POLY1 CTOPNSD CONT MET1

TiNTiSi2

Oxide

HPA07 Cap VC ∼ 3 ppm/V, 3 ppm/V2 vsConv P-P Cap VC ~ 20 ppm/V, 20 ppm/V2

IMD2

IMD1

W W

M2 M2

M1

M2

SiCrTiN

TFR: 16-Bit, 1 LSB, Untrimmed 3.3V FSR

W

TEOS

World ClassCMOS &

PassivesSiCr Thin Film Resistor

Metal Insulator Metal Capacitor

High Voltage Drain Extended CMOS

Highest Precision

HPA07 – High-Performance Analog

Page 35: TI Analog Overview

35

E-Trim ™The future of Precision CMOS

• DIGITAL TRIM during FINAL TEST• AFTER Packaging• Avoids Shift of laser-trimmed Vos during Packaging• Simplified Production Flow

Page 36: TI Analog Overview

36

Offset and Drift Trim!

Trims at High Temp• Trim Tail Current• Trim Vos

Trims at Room Temp• Trim Offset Drift

TI is the only Company trimming Drift digitally!

Page 37: TI Analog Overview

37

BiCom3 Highest Speeds and Precision

In volume productionApplications: wireless infrastructure and measurement equipmentFor Highest Speeds and Precision

Ideally Suited for High-Speed Op Amps and Data Converters

Spee

d -B

andw

idth

(GH

z)

THD @ 30 MHz (dB)

THS4302

CLC440MAX4104AD9631

AD8055AD9021

- - -0

0.5

1

1.5

2

2.5

3

0 50 100 150Linearity

Spee

d -P

NP

(f TG

Hz)

ADI XFCB2

NSC VIP10

TIBiCom3

ADI XFCB1

0

5

10

15

20

0 5000 10000 15000 20000 25000

BiCom3 is Industry’s 1st Complementary SiGe Bipolar Process

MAX CB-4

Technology Features:• 200mm Wafers• 0.35 um Features• 5V Operation• SOI Substrates• Trench Isolation• 115 A Gate Ox

• TLM (1.0 um Pitch)• NiCrAl Thin Film Resistor• Metal-Silicide Capacitor• Cu Power Metal Option• Laser Trimming• 13K Gates/mm2

Page 38: TI Analog Overview

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• 125 Msps with Low Power (750 mW)• 70 dB SNR at 100 MHz IF• 82 dB SFDR at 100 MHz IF• 750 MHz Input Bandwidth• 10K Gates of Logic

C05 – Mixed-Signal Integration– Data Converters & Amplifiers –

ADS5500125 Msps, 14-Bit ADC

Source BackgateDrainIsolation

Nwell

Poly

NSD NSD

P Substrate

PSDNSD

NwellPwell

Deep Nwell

NSD

• Deep Nwell Isolation• R: 140 Ω/sq Poly• C: 0.46 fF/µm2 (MIM)• Vertical PNP• Status: Released

• 1.8V and 3.3V CMOS• TLM Pitch: 0.50 µm• 1.8V Lmin: 0.18 µm• 3.3V Lmin: 0.42 µm• 70K Gates/mm2

For High Speed and IntegrationTechnology Features:

Isolated NMOS Transistor

Page 39: TI Analog Overview

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LBC7 – LDMOS Technology

Technology Features:• 0.25 um Features• 30 – 40V LDMOS• 75/200 A Gate Ox

NSDNSD

NWELL

P Substrate

Poly

Gate Oxide

Field OxideDrain

GateSource Backgate

NSDDWELL

NBL

Channel

LDMOS Rsp vs BVdss

1

10

100

1000

10 100BVdss (V)

Rsp

(mΩ

-mm

2 )

ST BCD5ST BCD6TI LBC-5TI LBC-5 nadjTI LBC-7

LBC-7

LBC-5LBC5 nadj

20

BCD5 BCD6

30 40 50 60 70 80 90

Industry Leading Rsp PerformanceKey Benefits• Extremely Low On Resistance (Rsp)• Ideal for Below 30V Standard Supply

and Portable Power• High Current Carrying Capabilities• Creation of World Class Power and

Analog Devices• High Integration Capability• Extremely Low Leakage

• TLM• Thick Cu Metal• 23K Gates/mm2

High Integration and Low Voltage Power

Page 40: TI Analog Overview

40

Quad FlatpackNo Leads

(QFN)Heat Sink ThinQuad Flatpack

(HTQFP)

Small Outline Transistor(SOT223)

Small Outline

No Leads(SON)

Thin Quad Flatpack(TQFP)

Transistor Outline

(TO236)

PowerPadSmall Outline

Package(HSOP)

Mini SmallOutline

Package(MSOP)

ShrinkSmall Outline

Package(SSOP)

Small OutlineTransistor Package (SOT23)

Surface Mount Header (DDPak)

Transistor Outline

(TO220)

MicroStar BGA ™Chip Scale Tape BGA

(u*BGA)

Laminate Chip Scale BGA(nFBGA)

Thin ShrinkSmall Outline

Package(TSSOP)

PowerSmall Outline

Package(PSOP3)

Small Outline

Integrated Circuit(SOIC)

Heat Slug Small Outline

Integrated Circuit

Laminate Ball Grid

Array(BGA)

Plastic Dual-In-Line Package(PDIP)

HPA offers a wide range of packages including:

HPA Packages

MicroStar JR ™Chip Scale Pkg

(u*JR BGA)

MicroStar Ultra Thin™Land Grid Array

Chip Scale Package(u*UT LGA)

Wafer Scale Package(WSP)

Scale: 2.5x 24-bit

Page 41: TI Analog Overview

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TI is Committed to the Environment Participates in industry standards organizations and works with legislative groups to set achievable and meaningful environmental goals

Began removing Lead (Pb) from products more than a decade ago– Over 70% of TI’s lead-frame components do

not contain lead and are compatible with proposed RoHS thresholds

– All TI Logic products are available Pb-Free

Is actively qualifying Pb-Free and Green solutions that go beyond current industry thresholds in anticipation of future environmental requirements

TI recognizes that customers require early availability of Pb-Free products and has already converted a large percentage of TI’s entire product line to Pb-Free solutions. By 1Q 2005, >90% of TI products and >80% of HPA products will be available Lead (Pb)-Free and Green.

Page 42: TI Analog Overview

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TI Leadfree Information

For questions, vendor surveys or conversion status information, use our Pb-Free and Green resources:

• TI Web site www.ti.com/leadfreeEasy-to-use search engine to determine Pb-Free status and schedule for all TI products

• Your TI sales representative

[email protected] resource for questionnaires, vendor surveys or for requesting conversion status and material content on long lists of part numbers

Page 43: TI Analog Overview

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Launching Leadership ProductsTHS4509 – High-Speed Amplifier

Battery Gas GaugeIntroduced Sept. 13, 2004

Calculates remaining battery capacity with 99% accuracy

Always Know True Battery Life

Prolongs Battery Use

Introduced March 7, 2005

Digitally Controlled Power Management

For UPS, Computing, Server & Telecom Power Systems

Enhances Performance and Lifetime of Power Supplies

Reduces Time-to-Market & System Cost

ADS1271 – Industrial Data Converter

Introduced November 9, 2004

New class of industrial data converter with both precision and speed

Enables new level of precision measurements in industrial, medical and automotive applications

Widest bandwidth 24-bit industrial ADC

Introduced January 24, 2005

Lowest noise, lowest distortion fully-differential amplifier

Drives high-speed ADCs to their best performance

For demanding applications like test & measurement, medical imaging, wireless infrastructure & industrial

Digital Power

Page 44: TI Analog Overview

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Q & A