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This Presentation Contains - · PDF fileThis Presentation Contains ... Raman, FTIR, XRD, XRR, WDXRF Analytical Chemistry ... Silicon Manufacturers Solar ( Si, CIGS,CdTe)

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2 2 January 2008

This Presentation Contains

•Background /History of Cerium Laboratories

•Overview of Capability and Services

•Overview of Selected Techniques

3 3

Introduction to Cerium Laboratories LLC

• Located in the heart of Silicon Hills – Austin, Texas

• Created in 1986 as an in house process characterization laboratory for Advanced Micro Devices Inc.

• Supported world wide efforts for AMD, including technology development and insertions into manufacturing sites in Japan, Europe, and the US.

• Providing commercial services since 2004

• Division was spun-off to form Cerium Laboratories, LLC

• Specializing in device characterization and process analysis service for Semiconductor Industry

4 4 January 2008

FAB25

Introduction to Cerium Laboratories LLC

5 5 January 2008

FAB 25 Module

Introduction to Cerium Laboratories LLC

6 6 January 2008

PCAL Manager- Donald Tiffin

Introduction to Cerium Laboratories LLC

7 7 January 2008

AES Auger Electron Spectroscopy

AFM Atomic Force Microscopy

BSE Back-Scattered Electron microscopy

DMS Defect Management System

EDS Electron Dispersive Spectroscopy ESCA Electron Spectroscopy for Chemical Analysis

FIB Focused ion beam

FTIR Fourier Transformed Infrared Spec

GC-MS Gas Chromatography – Mass Spec

IC Ion Chromatography

ICP-MS Inductively Coupled Plasma- Mass Spec

μ-RS Micro-Raman Spectroscopy

SEM Scanning Electron Microscopy

SIMS Secondary-Ion Mass Spectroscopy

SRP Spreading Resistance Probe TEM Transmission Electron Microscopy

TOF-SIMS Time-Of-Flight Secondary-Ion Mass Spectroscopy

TXRF Total reflection X-ray Fluorescence

VPD Vapor Phase Decomposition

WD-XRF Wavelength Dispersive X-ray Fluorescence

XPS X-ray Photoelectron Spectroscopy

XRD X-ray Diffraction

XRR X-ray Reflectivity

Introduction to Cerium Laboratories LLC: Technologies

8 8

Introduction to Cerium Laboratories LLC

• Cerium has over 150 customers, including those designing

or manufacturing: EPROM, ASIC, DRAM, SRAM, FLASH,

Microprocessors, Embedded Logic, DSP, MEMS, LED,

and RF devices using CMOS and Bi-Polar semiconductor

technologies.

• Cerium provides services across the electronics industry

value chain;

Material Suppliers

Wafer Manufacturers

Equipment Manufacturers

Chip Manufacturers

Final Test Firms

Design houses

9 9

• Areas of expertise include

Electron Microscopy - nano-scale characterization SEM, TEM, FIB, AFM, and optical microscopy

Elemental analysis with EDS and EELS

Spectroscopy - high resolution elemental analysis of films SIMS, Auger, XPS, Raman, FTIR, XRD, XRR, WDXRF

Analytical Chemistry – chemical and contamination analysis VPD-ICPMS, HR-ICPMS,GCMS, IC, ICPOES, TOC, Assay

Enviromental testing (air, water and surface contamination)

• Cerium employs over 25 scientists and engineers with an average of over 15 years of professional experience in the semiconductor industry.

Cerium Labs Infrastructure

10 10

Diversified Expertise

• Reliability issues due to cosmic ray neutron

• Chemical analysis of Solar Poly Si impurities

• VPD analysis for Si wafer

• Reverse Engineering

11 11

Data and Sample Security

NDA - Cerium regards every clients data as proprietary and confidential.

Standard practice includes entering into bi-lateral non-disclosure agreements with our customers

Acquired data is not repackaged and offered as commercial reports

Secured Environment:

Two layers of security controlled access to the facilities

128-bit encrypted database and IT data transfer infrastructure

LabCollector™ Database:

Custom tailored application designed by Cerium Labs

Audit trail

Chain of custody

Facilitates analyst/client dialogue

128-bit encrypted web based data access appliance

12 12

Data and Sample Security

Cerium Laboratories has worked with clients from the fortune

500 list, National Laboratories and Universities to

innovative start up companies.

The wide range of characterization capability allows for the

necessary insight and understanding of material properties

and their effect in products and applications.

The synergistic combination of Cerium’s advanced electron

imaging, surface science and analytical chemistry labs

enables the development of solutions to material R&D.

13 13

Industry and Technology served

Semiconductor Alternative Energy

Silicon Manufacturers Solar ( Si, CIGS,CdTe)

Equipment Manufacturers Hydrogen Fuel Cell

Chip Manufacturers Solid Oxide Fuel Cell

Design and Test Houses Lithium-Ion Technologies

Reverse Engineering Organic

Reliability Issues from cosmic rays

neutrons

Chemical analysis of solar grade Si

•We provide services to a wide range of sectors within the semiconductor and alternative energy industries.

14 14

REVERSE ENGINEERING

15 15

Reverse Engineering and Litigation Support

Cerium experts have experience in IP/Patent case support:

From Reverse Engineering needed to prepare licensing campaign,

evidence evaluation during discovery process, through depositions and expert

testimony while in litigation.

Cerium experts have experience in high-technology manufacturing, R&D, and analysis.

Support of semi, pharmaceutical, nanotechnology, and various fuel cell lines including

Solar, Hydrogen and SOFC.

Cerium provides Reverse Engineering services for device analysis:

System teardown and documentation

De-cap and die removal

Imaging of process layers

Extraction of physical layout of circuitry

Identification and functionality of components

Process layer characterization

Chemical composition studies

Manufacturing approach inference

Forensic reverse engineering

16 16 January 2008

• Overview of highlighted techniques

17 17

Die Extraction and De-Processing

• Mechanical, Chemical, and/or Plasma assisted removal of package, solder, thermal paste, die passivation, metal interconnects, and dielectric layers on the device.

18 18

Electron Microscope Imaging of layers

SEM Image

Identify Area of Interest

for analysis

19 19

TEM micrographs of transistors

20 20

Atomic Resolution TEM measurements Process Films

21 21

Layout or Function Determination

Given a competitive product

Identify the floor plan

Identify devices and their interconnections

Have a patent covering this circuit

Schematics

22 22

Full Die or Partial Die imaging

Full die mosaic consists of !2 arrays. Each

array contains 900 individual images at high

resolution.

23 23 January 2008 January 2008

Automated Feature Extraction

M2 Features

M3 Features

Composite 3D Structure

http://204.2.20.210/mca-demo.htm

24 24

Creation of 3D models of complex interconnect structure

Combination of Optical and SEM review data into 3D models

http://204.2.20.210/M2M3/video/

25 25

Field Emission Scanning Electron Microscope

The Scanning Electron Microscope (SEM) is a microscope that uses electrons

rather than light to form an image. There are many advantages to using the SEM

instead of a light microscope. The SEM also produces images of high resolution

(8 Angstroms), which means that closely spaced features can be examined at a

high magnification. The combination of higher magnification, larger depth of

focus, greater resolution, and ease of sample observation makes the SEM a

widely used instruments in a large variety of industries.

26 26

Energy Dispersive X-Ray Spectroscopy

Used in conjunction with SEM, Energy Dispersive X-Ray Spectroscopy (EDS

or EDX) detects the elements present in a selected area of the SEM image

providing qualitative and quantitative information of material composition or

identification of contamination.

27 27

EDS elemental composition determination

Image of sample

Elemental Maps

Identified Elements

Spectral Data

28 28

Quad-SIMS

Small Area Analysis

• Small spot size at low & high

beam energies

• Checker-board data

collection for post analysis

Stability

• Uptime greater than 95%

• RSD (relative standard

deviation) of dose less than

1%

29 29

AFM

(Atomic Force Microscopy)

Typical Applications:

• Measure RMS surface

roughness of blanket films.

• Measure step heights on

patterned wafers.

AFM measures topography with a vertical precision of < 2 Å and a lateral

resolution about 50 Å.

30 30

Vapor Phase Decomposition

Sample Analysis

The sample is analyzed using a Finnigan

Element 2 High Resolution Inductively

Coupled Plasma Mass Spectrometer (HR-

ICP-MS).

The Element 2 has three separate resolution

settings, 300, 4000, and 10000, enabling the

separation of molecular ion interferences

and direct isotope interferences from the

analytes of interest.

31 31

GC-MS Identification of

Thermally Desorbed Surface Organics

SNK18 Clean Y

4.00 6.00 8.00 10.00 12.00 14.00 16.00 18.00 20.00 22.00 24.00Time0

100

%

0

100

%

WWD246 Scan EI+ TIC

4.65e614.59

13.96

11.48

4.092.55

5.984.53 13.05

22.11

17.52 18.16

23.78

WWD248 Scan EI+ TIC

4.65e6

2.56 5.98 11.49 13.04 22.11

11.48 3-heptanone13.96 azo-bis(isobutyronitrile)14.59 2-ethyl-1-hexanol22.11 di-tert-butyl-para-benzoquinone

Thermal desorption chamber designed for 300mm wafers, showing internal construction and three temperature controllers.

Chromatograms showing organic compounds desorbed from a processed wafer (red trace) and control wafer (green trace).

32 32

Neutron Activation Analysis

Cerium Labs is only one a few labs world wide that have the capability to perform ultra sensitive contamination measurements using Neutron Activation Analysis (NAA). Samples are irradiated with neutron flux from a research reactor to convert impurities into their radioactive isotopes. These isotopes decay with emission of characteristic gamma rays that are detected and analyzed using a gamma ray spectrometer.

Applications are many, but include environmental testing from coal, petroleum, and power plants. Trace contamination of pharmaceutical products.

33 33

Gas Diffusion Layer

•Analyze Gas Diffusion Layer for graphitic nature of layer

and measure SP2 character of graphite. Example: Monitor

SP2 content by measuring chemical binding information.

•Measure organic and inorganic contaminates

Platinum Catalyst Layer

•The electrode layer can be analyzed with advanced

surface science techniques.

•Image Pt aggregation and distribution with high resolution

TEM.

•Chemical composition & state information. Example:

metallic Pt and oxidized Pt can be identified.

Membrane Layer

•Identify membrane composition and moisture content of

the film through chemical and surface science techniques

•Understand membrane microstructure and changes due to

fuel cell operation with advanced imaging techniques.

Example: Loss of F from fluorinated membrane

Waste water

•Analyze contaminants in the waste water such as fluorine

and sulfur species. Trace metals such as Fe, Cr, Pt etc. can

be analyzed using high resolution chemistry techniques.

4H+

O2 H2

4e-

4e-

ANODE CATHODE

FUEL AIR

2H2O

CHARACTERIZATION PEM CELL