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THERMAL INTERFACE MATERIAL USING CARBON NANOTUBES
Vahab Hassani National Renewable Energy Laboratory [email protected] Tel: 303-275-4427
FY05 Budget: $0K FY06 Budget: $250K
FreedomCAR APEEM Quarterly Program Review Nov. 1-3, 2005
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Where Does This Project Fit?
• Integrated cooling loop • Inlet coolant at 105 oC for hybrid, 85 oC for FCV • Heat fluxes at the order of up to 250 W/cm2
• Eventually, we would like to do air cooling by FY10 to FY15
Power
Electronics
Electrical
Machines
Thermal
Systems
Wide Band-Gap Mat’ls
High-Temp. Capacitors
Wide Band-Gap Mat’ls
High-Temp.Capacitors
Magnets
Reduce Thermal Resistance
Air Cooling105C and 85C WEG
Increase Heat-Transfer Coefficient
• D
Project Description
evelopment of highly conductive thermal interface materials for
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maintaining an acceptable operating temperature for power electronics l Silicon chip
Solder
Direct Bond Copper Cu,
Thermal Paste
Base plate, heat sink
Pin finsTB
TH
TCQ heat
AlN, Cu
, Base plate Temp.
, IGBT Temp.
, coolant Temp.
Goals
The goals of this project are:
• Increase the thermal conductivity of the existing thermal interface material by a factor of 6
• Grow carbon nano-tubes on Si or copper substrate
• Produce prototype material for testing
• Develop a nano-thermo foil TIM
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Technical Approach
• Develop ultra-thin copper-CNT sheets as thermal interface material by synthesizing carbon nanotubes on copper(one side/both sides) using chemical vapor deposition
• Optimize the growth process for the nanothermofoil
• Measure thermal conductance of the nanothermofoil
• Compare the thermal conductance of the nanothermofoil with commercially available products
• Measure the contact resistance at the joint
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Timeline for FY06
Oct Nov Dec Jan Feb Mar Apr May Jun Jul Aug Sep
Develop ultra-thin cop er-CNT psheets
Optimize the growth process
Measure thermal conductance
Analysis
Measure thermal Mile-
Resistance stone
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Barriers and Challenges
• Proper growth of carbon nano-tube/distribution
• Optimize the growth process for the nanothermofoil
• Overcoming the impact of contact resistance
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• University of Colorado, Boulder
• National Institute of Standards and Technology (NIST)
Interactions and Collaborations
