The Evolution of the Power Supply Architectures

Introduction to FPA and V▪I Chip as Enabling Technology to High Performance Power Systems

About Vicor

• Founded 1981

• Public listing 1984 (NASDAQ: VICR)

• Headquarters and principal manufacturing in Andover, MA

• Acknowledged pioneer in the power system industry– Introduced first high-density DC-DC “brick” power supply

– Introduced V•I Chips and Factorized Power Architecture

• Leadership in innovation and intellectual property– >100 patents in U.S., Europe & Japan

– Approximately twice the R&D investment of competitors*

* Annual R&D expense as a percentage of revenue

Vicor is leading the next generation of power management

Three Business Units – One Mission

To deliver differentiated power management solutions for which size, efficiency, speed, flexibility, or total cost of

ownership are critical to the customer.

Brick Business Unit

Vicor’s Continuum of Power System Solutions

CustomPower Systems

(VAR)

Configurable Power Supplies

Modular Power Components

(Bricks)Brick Business Unit

Next GenerationPower Components

• Unifying characteristics:– Use of proprietary Vicor products and technologies– High power applications– Innovative solutions

Vicor – Leading evolution of Power Architecture

1st Full-size

Brick at 100 W

Full-size Brick

at 600 W

VI Chips & Factorized

Power Architecture Introduced

Half-size Brick

at 300 W

Quarter-size Brick

at 150 W

VI Chips Established in Blue-Chip Applications

VI BricksIntroduced

1st Half-size

Brick

1988 1997 1997 1998 2003 2006 2008 1984

• Device performance and form factor are key competitive variables– Vicor has consistently led the industry in technical advances

• Customers turn to Vicor for innovative solutions to their specific power needs– Our mass customization model is a significant differentiator

– We do not compete for high volume commodity business

• We are well-positioned to benefit from well-defined trends– Particularly related to power consumption and thermal management

Architecture Progress

• Centralized Power Architecture– AC – to – load

• Distributed Power Architecture– AC-to-48V, 48-to-load

• Intermediate Bus Architecture– AC-48V, 48-12V, 12V-to-load

5 V1.0 V1.0 VAC inCentralPowerSupply

CentralPowerSupply

DC bus

Isolated DC-DC converter

System boardDC bus

Isolated DC-DC converter

System board

Non-isolated POL converters (niPOLs)

Isolated intermediate bus converter

Semi-regulated DC busSystem board

Non-isolated POL converters (niPOLs)

Isolated intermediate bus converter

Semi-regulated DC busSystem board

Distributed Power

48 Vdc

niPOL

niPOL

3.3 Vdc

DT=7% DT=28%

12 Vdc

IBA48 Vdc

IBC

3.3 Vdc

niPOL

48 Vdc

Brick

3.3V

¼ Brick

The Problem

• High distribution losses• Poor dynamic response for high di/dt loads• Shrinking board area space for power devices• Rising utility costs

The Reason

• Fundamental restrictions in existing power topologies– <1MHz Switching Freq– Duty cycle– Series inductance– Bulk capacitance

• Multiple power conversion stages– Adds size, cost, and may lower overall conversion

efficiencies

The Solution: FPA with V•I Chips

• Factorized Power Architecture– Separation of power conversion stages: Regulation & Voltage

Transformation• Reduces distribution losses in a system• Reduces duplicated functions in the DC-DC conversion path• Reduces power dissipation at the Point of Load while increasing total system

efficiency

• Flexible building blocks: V•I Chips• Small, powerful components for DC-DC conversion• Provide key advantages to the power designer

– Industry leading power density (size & weight)– High Efficiency– Design flexibility– Speed (fast response)

66

¼ Brick

FPA – Breaking the Duty Cycle Barrier

0.8 Vdc

FPA 48 Vdc

26V

100%

48 Vdc

niPOL

niPOL

0.8 Vdc

2%

IBA48 Vdc

0.8 Vdc

3.0 Vdc

26%

IBC

niPOL

IBA48 Vdc

0.8 Vdc

40%

2.0 Vdc

IBC

niPOL 7%

12 Vdc

IBA48 Vdc

IBC

0.8 Vdc

niPOL

Architecture Progress

• Centralized Power Architecture– AC – to – load

• Distributed Power Architecture– AC-to-48V, 48-to-load

• Intermediate Bus Architecture– AC-48V, 48-12V, 12V-to-load

• Factorized Power Architecture– AC-to-48V, 48V-direct-to-load

or, for high power systems– AC-to-380V, 380-48V, 48V-direct-to-load

5 V1.0 V1.0 VAC inCentralPowerSupply

CentralPowerSupply

DC bus

Isolated DC-DC converter

System boardDC bus

Isolated DC-DC converter

System board

Non-isolated POL converters (niPOLs)

Isolated intermediate bus converter

Semi-regulated DC busSystem board

Non-isolated POL converters (niPOLs)

Isolated intermediate bus converter

Semi-regulated DC busSystem board

Isolated POL converters (VTMs)

DC bus

Non-isolated pre-regulators (PRMs)

System board

Isolated POL converters (VTMs)

DC bus

Non-isolated pre-regulators (PRMs)

System boardDC bus

Non-isolated pre-regulators (PRMs)

System board

Higher Efficiency, Sm

aller Size, Lower System

Cost

PRM Pre-Regulation Module• Pre-Regulation Module (PRM)

– Non-Isolated– Regulated 26V – 55V output– Wide range input– ZVS Buck-Boost topology– ZVS, >1MHz switching frequency– Ideal for powering niPOLs / VRMs

• Performance– 320W in 1.1 in2 package (>68W / cm3)– 1105W/ in3

– >97% efficient at 300W out• Inputs

– 24V (18 – 36)– 30V (18 – 60)– 48V (38 – 55 or 36 – 75)

• Output– Regulated 26V – 55V to VTM

VTM Voltage Transformation Module• Voltage Transformation Module (VTM)

– Isolated– Voltage transformer / current multiplier– Sine Amplitude Converter Topology– ZVS, ZCS, >1Mhz switching frequency

• Performance– Up to 100A in 1.1 in2 package (>60W / cm3)

• Inputs– Regulated 26V – 55V from PRM

• Output– 0.8V – 55V, up to 100A (13 models)

V•I Chip Components: BCM• Bus Converter Module (BCM)

– Isolated– Unregulated– Voltage transformer / current multiplier– Sine Amplitude Converter Topology

• ZVS, ZCS, >1Mhz switching frequency– Ideal for powering POLs / VRMs

• Performance– 300W in 7.1cm2 (1.1in2) package– Power Density = >60W/cm3 (>1,000W/in3)– Efficiency = >95%

• 48V Versions (Telecom / Server)– Input : 48V (38-55V)– Output : 1.5 - 55V

• High Voltage Versions (350V distr., 380V post-PFC)– Input : 350V or 380V– Output : 10 – 13V 48V

U.S. and Foreign Patents and Patents Pending

Factorization

• Separate Regulation and Isolation Functions• Flexibility to locate PRM remotely-saves board

space• Factorized bus at ~48V saves I2R losses• VTM located directly at POL

Regulation

3 Regulation Options:

1. Local sense – 5%2. Adaptive Loop – 1%3. Remote sense – 0.2%

Bulk Capacitance Elimination

• Energy stored in a capacitor = ½ CV2

• VTMs have very fast transient response• Equivalent capacitance at VTM input, but 1/k2

smaller• Saves valuable POL board space• Better reliability (fewer bulk capacitors)• Saves cost of populating capacitors

The “48V to Processor” Challenge• Traditional synch buck PWMs are limited due to FET duty cycle

– 12V : 1.2V may be OK… but 12V : 0.8V or 48V : 1.2V...?

• FPA separates regulation & voltage transformation functions: PRM + VTM– High efficiency 48 : 1.2V transformation at the processor

• Allows power savings upstream– Physical separation of PRM and VTM

• Allows the PRM to be placed remotely, with 94% reduction in distribution losses (W/ohm)• Only the VTM is required to be at the processor, minimize high current traces / losses.• Enables minimal form factor solutions directly at / under the processor

– VTM: High bandwidth bi-directional transformation with low Q• Capacitance: Bulk

– Move from processor to MV factorized bus and reduce to ~ 1/1000 capacitance (1/K2)• Capacitance: Bypass (ceramics)

– Greatly reduced (only needed to support dynamic response within a time scale of 1 uS). – Excellent transient response

Processor Power Solutions: Baseline System

48 V:12 V IBC and 4 Phase VR powering 1.2 V, 100 A microprocessor.95% efficient and 85% 80.75% efficient from 48 V to 1.2 V load

48V-to-load Solution: PRM+VTM

PRM (97%) and VTM (91%) 88.3% efficiency from 48V to 1.2V load

FPA: Fast Transient Response

Move “bulk” capacitance upstream to higher voltageRequires only 1/1000 of original capacitance

FPA: Flexible•VTM placed directly at load minimizes track loss

•PRM moved to backplane frees valuable space on motherboard

HV BCM Full V•I Chip solution from PFC load

• B384F120T30 K=1/32 300W 384VIN 12VOUT Released• VIB0002 K=1/8 330W 384VIN 48VOUT Q4’07

0.8-55V375V 48V VFAC V

PFC(e.g. FE375)

HV BCM PRM VTM

Power & Size Comparison (8x 1.2V, 100A μP array)

Baseline system

FPA systemWith V•I Chips

The FPA Advantage: Efficiency, Size and $ Running Costs

• Applying FPA in higher power systems highlights the size, efficiency and value of the V•I Chips

• Efficiency 7.7%• Power Loss 31%• Size 45%• Save $30 / €24 per year,

per processor, in energy costs• $380,000 per year, per datacenter

V•I Chips for Solid State Lighting / Display (LED)

Lighting

Back Light

Displays

LED Progress – more Lumens per Watt

Cree, APEC 2007

LED Progress – Industry “Tipping Point”

Cree, APEC 2007

Constant Current Source• LEDs require constant current• PRM provides constant current with high control accuracy (IOUT + / - 2%)

– “Loss-less” differential current-sense and controlling amplifier into PRM’s voltage control pin

– Independent of VTM choice– Same PRM for any color / size LED

• 300W demonstration systemDual Op-Amp:ISENSE & control

To VTM

LED Power

• Multiple options to drive LEDs• PRM in constant current mode• PRM-to-VTM driving a series

array• BCM-to-LED driver in a parallel

array• High efficiency• Wide adjustment/intensity

range

Power Light• PRM+VTM

– Power = 300W– Power Density = 30 W/cm3

– Efficiency = 92%– PDISS / Light = <1W / 1,000 Lumens

• Power dissipated in powertrain per 1,000 Lumens emitted• Assumes 75 Lumens per 1W LED (Cree, APEC 2007)

22,500 Lumens

48V 24V325W 300W

92%

The Flexibility of FPA

More Application Examples

Battery Backup Systems

• High voltage and 48V BCM connected in ORing fashion• If primary supply BCM fails,48V backup provides charge• P12125 provides the ORing function

Regenerative Burn-In

• Burn-in normally can waste excessive energy• BCM can operate in reverse (output-to-input)• BCM ~96% efficient, and recycles burn-in output load• BCM’s input pins produce 48V of input for burn-in

AC-DC Server Solution

• Complete AC-DC server solution includes Picor products in conjunction with full suite of V•I Chips

• Very efficient• Flexible layout options with FPA

High current driveVarious output voltage levels availableUltra fast transient responseIncludes EMI filtering and ORing functions

Boost Systems

• Boost 12V to 48V with reverse VTM• PRM regulates the VF • Final stage VTM provides current multiplication

and isolation functions

Evolution of System Level Power Architectures (the summary)

12V5V3.3V,5A

Centralized Power Architecture (CPA)

ACAC-DC

AC-DC5V

3.3V

2.5V

DC-DCDC-DC

DC-DC

Distributed Power Architecture (DPA)

48VAC

Regulation, Isolation& Transformation

AC-DC5V

2.5V

DC-DC

DC-DC

niPOLniPOL

niPOL

3.3V

1.8VniPOL

Intermediate Bus Architecture (IBA)

48V

12V

12VAC

Isolation,Transformation

Regulation,Transformation

Vicor Product Focus

High VoltagesLow Currents

Large SizeLow Efficiency

CustomInflexible

Tim

e &

Tec

hnol

ogy

Adv

ance

s

FPA: The Future of System Level Power Architecture

Vicor Product Focus

AC-DC

0.8V,200A

PRMPRM

VTMVTM

1.8V

5V3.3V

BCM niPOLniPOL

Factorized Power Architecture (FPA)

48V12V

VF

VF

AC

Isolation,Transformation

Regulation,Transformation

Isolation,Transformation

Regulation

• Low Voltages• High Currents• Smallest Size• Higher Efficiency• Standard Blocks• Flexible

Thank you!

mpanizza@vicorpower.com