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The Electronics Packaging &

Flexible Electronics Centers

at Binghamton University

Research Webinar

November 20, 2014

8-9:30 a.m. PST (US)

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Agenda

About S3IP

IEEC Vision & Mission

IEEC model

History

Annual symposium

Staff

Resources/facilities

Key research thrusts

Education

Economic impact

Partners

Membership

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http://www.binghamton.edu/s3ip/

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Vision

The IEEC will conduct transformational research in the area

of electronic systems integration and packaging that will

have a broad impact on society and our partners and will

contribute to their technological and economic successes.

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Mission

• To conduct world class electronics packaging research that provides significant technological advantage to our customers

• To provide physical and intellectual infrastructure and expertise that will help our customers be successful in their businesses

• To enable each of our partners to network and grow their customer and partner base

• To enable economic growth in the electronics industry throughout the region and the nation

• To provide high-quality and real-world relevant educational experiences to our students in the interdisciplinary field of electronics packaging

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IEEC model

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History Highlights

1991 founded as NSF I/UCRC at Binghamton University

Lockheed Martin, UIC, BAE Systems, and IBM

1994 Sigrity began as an IEEC project

Mid ‘90s Tear-down Reports

1996 “Graduated” from I/UCRC to a self-sustaining center

Funding from New York State

Increased member companies

2000 First IEEC laboratory

2014 Center of Excellence building

$30M, 114,000 square feet

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History

Expertise has grown with the industry

• THT to SMT, Including PIP

• Peripherally Leaded to Area Array

• Pb-Free Studies

• Nano materials for EP

• 2.5D / 3D Integration

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Annual symposium

Topics include:

• 3D Packaging

• Thermal Challenges

• Sensors/MEMS

• Embedded Electronics

• Printed Electronics / Additive Mfg.

• HiTemp Electronics

• Mobile Electronics

• Flexible Electronics

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Staff

Our seven-member staff boasts 120+ years of electronics packaging industry experience. More than a dozen Binghamton University faculty researchers are affiliated with the center.

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Resources/Facilities

MPM Stencil PrinterUniversal AdVantis PlacementHeller 1700W Reflow

Assembly

These next few slides show just a partial

list of our resources/facilities, please see

our website for the complete list

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Thermal Shock and Cycling

HAST

T/H

Drop Shock

Shaker w/ Temp

Dage 4000 and 4000+

Resources/FacilitiesStress/Reliability

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Analytical and DiagnosticResources/Facilities

Sample Preparation

CSAM

X-Ray

CMM

Profilometer

ADL

Overview:• Analytical and Diagnostics Laboratory (ADL) in the

NY state Center of Excellence in Small Scale Systems Integration and Packaging (S3IP)

• 8000 sq-ft, state-of-the-art research facility

• Complete, advanced analytical lab accessible to industry and academic customers

• $21M NY state grant

• Opened in Fall 2007

Resources• ADL Staff:

• PhD scientists, engineers, graduate research assistants, and technicians

• Materials Science & Engineering, Physics, Chemistry, and Mechanical Engineering background

• Extensive experience in microelectronics industry

• State-of-the-art Instrumentation

• BU Faculty

ADL Services

ADL provides

• Materials Analysis and Characterization Services

• Root cause physical failure analysis for industrial products

• Expert insight and solution to industrial manufacturing and development problems

• Access to analytical and characterization instruments

• Collaboration for product and process development with industries

• Long term research collaboration with industries

• Knowledge transfer and training

ADL Capabilities

• Wide range of high-tech, analytical equipment under one roof

• Over 76 distinct instruments available through one user interface, over 58 in one facility.

• Electron Microscopy

• Non-destructive Testing

• Thermal Analysis

• Chemical Compositional Analysis

• Surface and Interface Analysis

• Crystallography and Particle Analysis

• Optical Microscopy

• Bio-materials analysis

• Electrical and Mechanical Testing

• Extensive Sample Prep Tools

• Device Fabrication and Processing

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Services

Consultation: We are happy to answer electronics questions, with formality ranging from a phone call to a full report.

Analytical work: The IEEC laboratories are as close as a phone call. We strive for rapid response on all requests for analysis, with same-day turn around when possible.

Environmental stressing: Chamber time is easily scheduled. In addition to stressing, we can provide in situ continuity testing.

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Services

Modeling: Microelectronic systems have peculiar thermal distributions and are prone to mechanical and thermomechanical stress failures. Finite Element Modeling can determine the thermal patterns in a given structure as well as the high stress points.

Reliability assessments and failure analysis: We can identify failure mechanisms, isolating and analyzing failures.

Materials evaluation: Our laboratories can measure material properties such as hardness, modulus, Tg, CTE, heat capacity and thermal conductivity.

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Key research thrusts

Source: M.P. Groover (Fund. of Modern Mfg.: Materials, Processes, and Systems)

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2014-2015 pooled projects

• Materials for Hi-temp Electronics

• Assessment of Potential Impact of Additive Manufacturing on Microelectronics Fabrication

• Glass Interposers – Cu Filling for High Aspect Through Holes

• Design Guidelines for 3D IC Packaging

• Reliability of Nano-Cu Alternatives to Hi-Temp Solders

• Dual-Wavelength Optical Interferometry for Characterization of EP Materials

• Characterization of the Microstructure and Reliability of Si/micro Cu pillar/solder/glass Assemblies

• Enhancement of Cu/EMC Interface Adhesion by Controlling Surface Finish of Cu

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Future research thrusts

• 3D Packaging

• Printed Electronics / Additive Manufacturing

• Flexible Electronics

• Healthcare/Medical Electronics

• Power Electronics

• Advanced Materials Development (e.g., nano materials)

• Sensors

• Photonics

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Education

375+ graduates (PhD, MS, BS) with IEEC support

A small sample of where they work:

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Economic impact

Based on letters of economic impact from partner companies

IEEC 2012-20135 YEAR

(2008-2013)SINCE 1996

Total Economic

Impact$61.9M $412.4M >$1.0B

Total New & Retained Jobs

59 549 1848

$ Economic Impact per $1 NYS Funding

$67.2 $88.0 $69.1

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Partners

ASTEELFLASH Kionix Kintner Equipment Leonardi Manufacturing

RPA Electronics

EZRED GE Ventures GE Inspection Technologies

EMS Technologies

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Member benefits

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How to become a member

Visit us online at:www.binghamton.edu/ieec

Contact us:

Daryl Santos, directorsantos@binghamton.edu

Bill Infantolino, associate directorbinfanto@binghamton.edu

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Thank you!