TFT Display Module - Focus LCDsThis model is composed of a transmissive type TFT-LCD Panel, driver circuit, capacitive touch panel and backlight unit. The resolution of the 1.44”

TFT | CHARACTER | UWVD | FSC | SEGMENT | CUSTOM | REPLACEMENT

TFT Display ModulePart Number

E144RB-FW400-R

Ph. 480-503-4295 | [email protected]

1 www.FocusLCDs.com

Overview:• 1.44-inch TFT (32.36x38.0 mm)

• 128(RGB)x128 pixels

• 8/16-bit MCU Interface

• 3/4-line Serial Interface

• Bottom View

• Transmissive/Normally White

• Resistive Touch Panel

• 400 nits

• Controller: ST7735S

• RoHS Compliant

mailto:[email protected]

2 www.FocusLCDs.com

Description This is a color active matrix TFT (Thin Film Transistor) LCD (Liquid Crystal Display) that uses amorphous silicon TFT as a switching device. This model is composed of a transmissive type TFT-LCD Panel, driver circuit, resistive touch panel and backlight unit. The resolution of the 1.44” TFT-LCD contains 128x128 pixels and can display up to 65K colors.

Features Low Input Voltage: 3.3V (TYP) Display Colors of TFT LCD: 65K colors TFT Interfaces: 8/16-bit MCU

3/4-line Serial

General Information Items Specification Unit Note Main Panel

TFT Display area (AA) 25.4976 (H) x 26.496 (V) (1.44 inch) mm - Driver element TFT active matrix - - Display colors 65K colors - Number of pixels 128(RGB)x128 dots - TFT Pixel arrangement RGB vertical stripe - - Pixel pitch 0.1992 (H) x 0.207 (V) mm - Viewing angle 6:00 o'clock - TFT Driver IC ST7735S - - Display mode Transmissive/ Normally White - - Operating temperature -20～+70 ℃ - Storage temperature -30～+80 ℃ -

Mechanical Information Item Min Typ. Max Unit Note

Module size

Height (H) 32.36 mm - Vertical (V) 38.0 mm - Depth (D) 4.2 mm -

Weight TBD g -

http://www.focuslcds.com/

3 www.FocusLCDs.com

1. Block Diagram

128(RGB)*128 Panel


2. Outline Dimensions

Revision content description

Page 1/11:1

mm

Scale

Unit

Approve

Checked

Drawn

Date

3-

Interface type DB Pin in useSPI4W IM2 IM0

DBI Tyb_ 8-bit interface DB7-DB0

DBI Tyb_ 16-bit interface DB15-DB0

3-Wire 9 BIT data serial

interfaceSDA SCL CS

4-Wire 8 BIT data serial

interfaceSDA SCL CS RS

NOTE:

1.If not use PIN,fix to the GND ,IOVCC or NC.

viewing angle

单层区

Logic Diagram

XL

XR

Trace Diagram

Bending

Pad Height MAX:0.40±0.1

E144RB-FW400-R

4 www.FocusLCDs.com

5

3. Input Terminal Pin AssignmentRecommended TFT Connector: FH12-35S-0.5SH(55) | Recommended RTP Connector: FH33-4S-1SH(10)

TFTNO. Symbol Description I/O 1 YU Touch panel top film terminal A/D 2 XL Touch panel left glass terminal A/D 3 YD Touch panel bottom film terminal A/D 4 XR Touch panel right glass terminal A/D 5 GND Ground P 6 VCC Supply voltage (3.3V) P 7 IOVCC Supply voltage (1.65-3.3V) P 8 IM0 MCU Parallel Interface Type selection

I

9 IM2

10 SPI4W

11-25 DB15-DB1 DB[15:1] are used as MCU parallel interface data bus. In serial interface, D[15:1] are not used and should be fixed at VsDDI or DGND level I/O

26 DB0 (SPI-SDA) DB0 is the serial input/output signal in serial interface mode I/O

27 RD Read enable in 8080 MCU parallel interface If not used, fix to VDDI or DGND I

28 RS (SPI-SCL)

Display data/command selection pin in MCU interface D/CX=’1’: Display data or parameter D/CX=’0’: Command data In serial interface, this is used as SCL If not used fix to VDDI or DGND

I

29 RESET Reset signal of device. Must be applied to properly initialize the chip. Signal is active low I

30 CS Chip select pin. Low enable. I

31 WR (SPI-RS) Write enable in MCU parallel interface. In 4-line SPI, this pin is used as D/CX (data/command selection) If not used pin to VDDI or DGND

I

32 LEDK1 Cathode pin of backlight P 33 LEDK2 Cathode pin of backlight P 34 LEDA1 Anode pin of backlight P 35 LEDA2 Anode pin of backlight P

I: Input, O: Output, P: Power

6

4. LCD Optical Characteristics4.1 Optical Specifications

Item Symbol Condition Min Typ. Max Unit Note

Contrast Ratio CR

θ=0

Normal viewing

angle

-- 300 -- % (2)

Color Filter

Chromaticity

White WX 0.285 0.305 0.325

(5)(6)

WY 0.314 0.334 0.354

Red RX 0.588 0.608 0.628

RY 0.296 0.316 0.336

Green GX 0.285 0.305 0.325

GY 0.536 0.556 0.576

Blue BX 0.115 0.315 0.155

BY 0.117 0.137 0.157

Viewing angle

Hor. ΘL

CR≥10

-- 60 --

degree (1)(6) ΘR -- 60 --

Ver. ΘT -- 30 --

ΘB -- 60 --

Option View Direction 6:00 (1)

7

Optical Specification Reference Notes:

(1) Definition of Viewing Angle: The viewing angle is the angle at which the contrast ratio is greater than 10. Theviewing angles are determined for the horizontal or 3,9 o'clock direction and the vertical or 6,12 o'clock directionwith respect to the optical axis which is normal to the LCD surface.

www.FocusLCDs.com

8

(2) Definition of Contrast Ratio (Cr): measured at the center point of panel. The contrast ratio (Cr) measured on amodule, is the ratio between the luminance (Lw) in a full white area (R=G=B=1) and the luminance (Ld) in a dark area(R=G=B=0).

Cr =Lw

Ld

(3) Definition of transmittance (T%): The transmittance of the panel including the polarizers is measured with electricaldriving.

The transmittance is defined as:

Tr =It

Io 𝑥 100%

Io = the brightness of the light source. It = the brightness after panel transmission

(4) Definition of Response Time (Tr, Tf): The rise time ‘Tr’ is defined as the time for luminance to change from 90% to

10% as a result of a change of the electrical condition. The fall time ‘Tf’ is defined as the time for luminance to change

from 10% to 90% as a result of a change of the electrical condition.

www.FocusLCDs.com

9

(5) Definition of Color Gamut: Measuring machine CFT-01. NTSC’s Primaries: R(x,y,Y),G(x,y,Y), B(x,y,Y). FPM520 ofWestar Display Technologies, INC., which utilized SR-3 for Chromaticity and BM-5A for other optical characteristics.

(6) Definition of Optical Measurement Setup:

www.FocusLCDs.com

www.FocusLCDs.com

10

(6) Optical Measurement Setup Continued:The LCD module should be stabilized at a given temperature for 20 minutes to avoid abrupt temperature change duringmeasuring. In order to stabilize the luminance, the measurement should be executed after lighting backlight for 20minutes.

www.FocusLCDs.com

www.FocusLCDs.com

11

5. TFT Electrical Characteristics5.1 Absolute Maximum Rating (Ta=25 ˚C, VSS=0V)

Characteristics Symbol Min Max Unit

Digital Supply Voltage VCc -0.3 4.8 V

Digital Interface Supply Voltage IOVCC -0.3 4.6 V

Operating Temperature TOP -20 +70 ℃

Storage Temperature TST -30 +80 ℃

NOTE: If the absolute maximum rating of the above parameters is exceeded, even momentarily, the quality of the product may be degraded. Absolute maximum ratings specify the values which the product may be physically damaged if exceeded. Be sure to use the product within the range of the absolute maximum ratings.

5.2 DC Electrical Characteristics

Characteristics Symbol Min Typ. Max Unit Note

Digital Supply Voltage VCC 2.5 2.8/3.3 4.8 V

Digital Interface Supply Voltage IOVCC 1.65 1.8 3.3 V

Normal Mode Current Consumption IDD -- 1.2 -- mA

Level Input Voltage VIH 0.7IOVCC -- IOVCC V

VIL GND -- 0.3IOVCC V

Level Output Voltage VOH 0.8IOVCC -- IOVCC V

VOL GND -- 0.2IOVCC V

12 www.FocusLCDs.com

Note 1: LED lifetime (Hr) can be defined as the time in which it continues to operate under the condition: Ta=25±3 ℃, typical IL value indicated in the above table until the brightness becomes less than 50%.

Note 2: The “LED lifetime” is defined as the module brightness decrease to 50% original brightness at Ta=25℃ and IL = 40mA. The LED lifetime could be decreased if operating IL is larger than 40mA. The constant current driving method is suggested.

Note 3: Luminance Uniformity of these 9 points is defined as below:

Luminance = (Total Luminance of 9 points) 9

Uniformity =minimum luminance in 9 points(1-9) maximum luminance in 9 points(1-9)

5.3 LED Backlight Characteristics The backlight system is edge lighting type with 2 chips LED.

Item Symbol Min Typ. Max Unit Note

Forward Current IF 30 40 -- mA

Forward Voltage VF -- 3.2 -- V

LCM Luminance LV 380 -- -- cd/m2 Note 3

LED lifetime Hr 50000 -- -- hour Note1 & 2

Uniformity AVg 80 -- -- ﹪ Note 3



6.1 8080 System MCU Parallel Interface Characteristics: 8/16-bit Bus

Figure 6.1: Parallel Interface Timing Characteristics (8080-Series MCU Interface)

6. AC Electrical Characteristic



Signal Symbol Parameter Min Max Unit Description

D/CX TAST Address setup time 0 ns

- TAHT Address hold time (Write/Read) 10 ns

CSX

TCHW Chip select “H” pulse width 0 ns

-

TCS Chip select setup time (Write) 15 ns TRCS Chip select setup time (Read ID) 45 ns

TRCSFM Chip select setup time (Read FM) 355 ns TCSF Chip select wait time (Write/Read) 10 ns

TCSH Chip select hold time 10 ns

WRX

TWC Write cycle 66 ns TWRH Control pulse “H” duration 15 ns

TWRL Control pulse “L” duration 15 ns

RDX (ID)

TRC Read cycle (ID) 160 ns When read ID

data TRDH Control pulse “H” duration (ID) 90 ns TRDL Control pulse “L” duration 45 ns

RDX (FM)

TRCFM Read cycle (FM) 450 ns When read from frame

memory TRDHFM Control pulse “H” duration (FM) 90 ns TRDLFM Control pulse “L” duration (FM) 355 ns

D[17:0], TDST Data setup time 10 ns

For max CL=30pF For min CL=8pF

TDHT Data hold time 10 ns

TRAT Read access time (ID) 40 ns TRATFM Read access time (FM) 340 ns

TODH Output disable time 20 80 ns

Note: The rising time and falling time (Tr, Tf) of input signal and fall time are specified at 15 ns or less. Logic high and low levels are specified as 30% and 70% of VDDI for Input signals.

Table 6.3: 8080 Series MCU Parallel Timing Characteristics



6.2 Display Serial Interface Characteristics (3-line serial)

VDDI = 1.64 to 3.3V, VDD = 2.4 to 3.3V, AGND=DGND=0V, Ta=-30 to 70 𝐶𝑜


CSX

TCSS Chip select setup time (write) 15 ns

- TCSH Chip select hold time (write) 15 ns TCSS Chip select setup time (read) 60 ns

TSCC Chip select hold time (read) 65 ns


SCL

TSCYCW Serial clock cycle (write) 66 ns

TSHW SCL “H” pulse width (write) 15 ns TSLW SCL “L” width (write) 15 ns

TSCYCR Serial clock cycle (read) 150 ns TSHR SCL “H” pulse width (read) 60 ns

TSLR SCL “L” pulse width (read) 60 ns

SDA (DIN) TSDS Data setup time 10

ns TSDH Data hold time 10

DOUT

TACC Access time 10 50

ns

For max CL=30pF For min CL=8pF

TOH Output disable time 15 50

Note: The rising time and falling time (Tr, Tf) of input signal are specified at 15 ns or less. Logic high and low levels are specified as 30% and 70% of VDDI for Input signals

Figure 6.2: Serial Interface 3-SPI Timing Diagram

Table 6.2: 3-line Serial Interface Timing Characteristics



6.3 Serial Interface Characteristics (4-line serial)


CSX

TCSS Chip select setup time (write) 15 ns TCSH Chip select hold time (write) 15 ns

TCSS Chip select setup time (read) 60 ns TSCC Chip select hold time (read) 65 ns


SCL

TSCYCW Serial clock cycle (write) 66 ns write command &

data ram TSHW SCL “H” pulse width (write) 15 ns

TSLW SCL “L” width (write) 15 ns TSCYCR Serial clock cycle (read) 150 ns

read command & data ram

TSHR SCL “H” pulse width (read) 60 ns

TSLR SCL “L” pulse width (read) 60 ns

D/CX TDCS D/CX setup time 10 ns

TDCH D/CX hold time 10 ns

SDA (DIN) TSDS Data setup time 10 ns TSDH Data hold time 10 ns

DOUT TACC Access time 10 50 ns For max CL=30pF TOH Output disable time 15 50 ns For min CL=8pF

Note: The rising time and falling time (Tr, Tf) of input signal are specified at 15 ns or less. Logic high and low levels are specified as 30% and 70% of VDDI for Input signals.

Figure 6.3: Serial Interface 4-SPI Timing Diagram

Table 6.3: 4-line Serial Interface Timing Characteristics



6.4 Reset Timing

Related Pins Symbol Parameter Min Max Unit

RESX

TRW Reset pulse duration 10 - us

TRT Reset cancel - 5 (Note 1,5) ms

120 (Note 1, 6, 7) ms

Notes:

1. The reset cancel includes also required time for loading ID bytes, VCOM setting and other settings from NVM (orsimilar device) to registers. This loading is done every time when there is HW reset cancel time (tRT) within 5msafter a rising edge of RESX.

2. Spike due to an electrostatic discharge on RESX line does not because irregular system reset accordingto the table below:

RESX Pulse Action Shorter than 5us Reset Rejected

Longer than 9us Reset

Between 5us and 9 us Reset starts

3. During the resetting period, the display will be blanked (the display is entering blanking sequence, whichmaximum time is 120ms, when reset starts in Sleep Out mode. The display remains the blank state in Sleep inmode) and then return to Default condition for Hardware Reset.

4. Spike Rejection also applies during a valid reset pulse as shown below:

5. When Reset applied during Sleep In Mode.

6. When Reset applied during Sleep Out Mode.

7. It is necessary to wait 5ms after releasing RESX before sending commands. Also Sleep Out command cannot be

sent for 120ms.

Figure 6.4: Reset Timing



7. TP Feature

7.1 Conditions of Use and Storage

Item Condition Note

Temperature range upon operation

Humidity: 20%-90% non-dew, condensation -20℃~70℃

In a simple substance

Temperature range upon storage

Humidity: 20%-90% non-dew, condensation -30℃~80℃

In a simple substance

7.2 Electrical Property

Item Value Note

Maximum voltage DC 5V

Resistance between terminal

X direction (film side): 200-600 Ω

Connect X + ~X and Y+ ~Y, apply 25V DC Between X and Y for perform measurements

Y direction (glass side): 300-900 Ω

Insulation resistance DC 25V, 20MΩ or above

Chattering 10ms or below

Rating Voltage is 5V DC



7.3 Mechanical Property

Item Value Note Input method Used of an exclusive pen or finger

Load upon operation

Exclusive pen 60-100g or below

Operation and measurement with a pen must be carried out under the following tip conditions: Stylus pen material: POM (ployacetal) Tip: Diameter 3.0mm, SR 0.8 mm

Finger 60-100g or

below

Operation and measurement with a pen must be carried out under the following tip conditions: Stylus pen material: Silicon rubber (Hardness: 30°Hs) Tip: Diameter 12.0mm, SR 12.5 mm

Surface hardness Pencil hardness: 3H or aboveIt complies with the way of test method JIS K5400

7.4 Optical Property

Item Performance Note

Total light transmittance 80% or above JIS K7105

Haze 5% or below JIS K7136

Film specification Polished type with hard coated surface



8. Cautions and Handling Precautions8.1 Handling and Operating the Module

1. When the module is assembled, it should be attached to the system firmly. Do not warp or twist the moduleduring assembly work.

2. Protect the module from physical shock or any force. In addition to damage, this may cause improperoperation or damage to the module and back-light unit.

3. Note that polarizer is very fragile and could be easily damaged. Do not press or scratch the surface.4. Do not allow drops of water or chemicals to remain on the display surface. If you have the droplets for a long

time, staining and discoloration may occur.5. If the surface of the polarizer is dirty, clean it using some absorbent cotton or soft cloth.6. The desirable cleaners are water, IPA (Isopropyl Alcohol) or Hexane. Do not use ketene type materials (ex.

Acetone), Ethyl alcohol, Toluene, Ethyl acid or Methyl chloride. It might permanent damage to the polarizerdue to chemical reaction.

7. If the liquid crystal material leaks from the panel, it should be kept away from the eyes or mouth. In case ofcontact with hands, legs, or clothes, it must be washed away thoroughly with soap.

8. Protect the module from static; it may cause damage to the CMOS ICs.9. Use fingerstalls with soft gloves in order to keep display clean during the incoming inspection and assembly

process.10. Do not disassemble the module.11. Protection film for polarizer on the module shall be slowly peeled off just before use so that the electrostatic

charge can be minimized.12. Pins of I/F connector shall not be touched directly with bare hands.13. Do not connect, disconnect the module in the “Power ON” condition.14. Power supply should always be turned on/off by the item Power On Sequence & Power Off Sequence.

8.2 Storage and Transportation

1. Do not leave the panel in high temperature, and high humidity for a long time. It is highly recommended tostore the module with temperature from 0 to 35 ℃ and relative humidity of less than 70%

2. Do not store the TFT-LCD module in direct sunlight.3. The module shall be stored in a dark place. When storing the modules for a long time, be sure to adopt

effective measures for protecting the modules from strong ultraviolet radiation, sunlight, or fluorescent light.4. It is recommended that the modules should be stored under a condition where no condensation is allowed.

Formation of dewdrops may cause an abnormal operation or a failure of the module. In particular, the greatestpossible care should be taken to prevent any module from being operated where condensation has occurredinside.

5. This panel has its circuitry FPC on the bottom side and should be handled carefully in order not to be stressed.


Documents

TFT Display Module - Focus LCDsThis model is composed of a transmissive type TFT-LCD Panel, driver circuit, capacitive touch panel and backlight unit. The resolution of the 1.44”