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Tesglo Semiconductor Adhesive Tapes - Product Catalogue

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7/22/2019 Tesglo Semiconductor Adhesive Tapes - Product Catalogue

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7/22/2019 Tesglo Semiconductor Adhesive Tapes - Product Catalogue

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7/22/2019 Tesglo Semiconductor Adhesive Tapes - Product Catalogue

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Model Name AP90-CB AUD1 AUD2 AU105-HA

StructureBase Film PVC PVC PVC Ployolefn

Adhesive Acryl Acryl Acryl Acryl

 Thickness

(µm)

 TotalBase Film

90±580

90±580

90±580

105±5100

Adhesive 10 10 10 5

Protection Film 38±2 38±2 38±2 38±2

Physical

Property

 Tensile Strength

(N/m2)25~35 25~40 25~40 20~30

Elogation(%) 200~400 400~600 400~600 500~700

Adhesion

(g/25mm)

Beore UV

irradiation200 300 500 500

Ater UV

irradiation~15 15~25 5~15

Application

Non-UV type

Expandable

UV type

Expandable

UV type

Expandable

UV type

Expandable

* REMARK : Film thickness & adhesion variation depends on the customer’s request & quantity..

 Test Conditions :

- Test Method : JIS Z 0237 / KS A 1107

- Note) The Product could be modifed by customer’s request.

- Sample : 25mm × 350mm, 4ea

- Substrate : Sus Plate (#280 polished)

- Laminating Pressure : 1cycle with 2kg Rubber Roller

- Remove Speed : 300mm/min- Peeling Angle : 180C

7/22/2019 Tesglo Semiconductor Adhesive Tapes - Product Catalogue

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Model Name AU120-SC AU170-HC AUG1 AUG2

StructureBase Film Ployolefn Ployolefn PET PET

Adhesive Acryl Acryl Acryl Acryl

 Thickness

(µm)

 TotalBase Film

120±5120

170±5150

130±5100

155±5125

Adhesive 20 20 30 30

Protection Film 38±2 38±2 38±2 38±2

Physical

Property

 Tensile Strength

(N/m2)20~30 20~30 200~300 200~300

Elogation(%) 30~50 500~700 100~150 100~150

Adhesion

(g/25mm)

Beore UV

irradiation1,300 1,700 1,500 1,300

Ater UV

irradiation10~40 10~40 10~40 5~15

ApplicationNon-UV type

Non- Expandable

UV type

Expandable

UV type

Non- Expandable

UV type

Non- Expandable

* REMARK : Film thickness & adhesion variation depends on the customer’s request & quantity.

Test Conditions :

- Test Method : JIS Z 0237 / KS A 1107

- Note) The Product could be modifed by customer’s request.

- Sample : 25mm × 350mm, 4ea

- Substrate : Sus Plate (#280 polished)

- Laminating Pressure : 1cycle with 2kg Rubber Roller

- Remove Speed : 300mm/min

- Peeling Angle : 180C

7/22/2019 Tesglo Semiconductor Adhesive Tapes - Product Catalogue

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Model Name AP130-SC AP210-SC AU130-SC

StructureBase Film Ployolefn Ployolefn Ployolefn

Adhesive Acryl Acryl Acryl

 Thickness

(µm)

 TotalBase Film

130±5110

210±5180

130±5110

Adhesive 20 30 20

Protection Film 38±2 38±2 38±2

Physical

Property

 Tensile Strength

(N/m2)20~30 20~30 20~30

Elogation(%) 500~700 500~700 500~700

Adhesion

(g/25mm)

Beore UV

irradiation130 125 330

Ater UV

irradiation10~40

ApplicationNon-UV type

Non-Expandable

Non-UV type

Non-Expandable

UV type

Non-Expandable

* REMARK : Film thickness & adhesion variation depends on the customer’s request & quantity.

Test Conditions :

- Test Method : JIS Z 0237 / KS A 1107

- Sample : 25mm × 350mm, 4ea

- Substrate : Sus Plate (#280 polished)

- Laminating Pressure : 1cycle with 2kg Rubber Roller

- Remove Speed : 300mm/min

- Peeling Angle : 180C

7/22/2019 Tesglo Semiconductor Adhesive Tapes - Product Catalogue

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Item Decover 25 BR350A Test Method

Colour White Transparent Yellow

 Total Thickness 0.055 mm 0.085 mm Thickness Dial

Gauge (1/1000mm)

Adhesion Strength 850 g/25mm 17.5 N/25mm180o peel

KS A-1107

 Tensile Strength 12 kg/25mm 126 N/cm KS A-1107

Elongation 120 % 127% KS A-1107