HeterogeneousTechnology

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HTA General Assembly

November 12 – 13, 2013

The Heterogeneous Technology Alliance HTA Project Idea: Wafer Level Dry Release Technology

EU call: ICT 2 H2020

Project Idea short description : Develop a wafer level dry releasing process for MEMS heterogeneous integration application

Short Description: Develop a wafer level 100% dry releasing process for wafer level MEMS heterogeneous integration applications suitable for transfer of large structures that cannot sustained chemical exposure or mechanical stress.

Structure to be transferred could be directly fabricated on glass (e.g LIGA) or, Si processing and use glass as temporary carrier. The bonding/sacrifical layer interface should withstand:

-Sustaining most of the standard processing such as lithography wet etching, dry etching electroplating, thermal treatment up to possibly >400°C

-Fully dry and necessitating no mechanical force for the releasing (important for MEMS delicate parts)

-Possibly allow selective debonding for wafer level device distribution

IP situation and commercial viability:

Potential Applications / Applications:

- MEMS, packaging, 3D integration of microelectronic devices

Potential Consortium/Competences needed:

HTA partners with their own or their partners specifics applications , EVG/Suess , company providing tool for wafer level laser processing, IBM Zurich

Contact:

Michel Despont (CSEM)

The Heterogeneous Technology Alliance HTA

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