Telephone Equipment Model No. KX-TGD320ALB...Telephone Equipment Model No. KX-TGD320ALB KX-TGD322ALB KX-TGD323ALB KX-TGDA30AZB Digital Cordless Answering System B: Black & Silver frame

ORDER NO. KM41512971CE

Telephone Equipment

Model No. KX-TGD320ALB KX-TGD322ALB KX-TGD323ALB KX-TGDA30AZB

Digital Cordless Answering System B: Black & Silver frame Version(for Australia)

(Handset)KX-TGDA30 KX-TGD320

(Base Unit)

(Charger Unit)

Model No Base Unit Handset Charger Unit Expendable KX-TGD320 1 (TGD320) 1 (TGDA30) Up to 6 KX-TGD322 1 (TGD320) 2 (TGDA30) 1 Up to 6 KX-TGD323 1 (TGD320) 3 (TGDA30) 2 Up to 6 KX-TGDA30 1 (TGDA30) 1

Configuration for each model

*KX-TGDA30 is also an optional accessory, which contains a handset and a charger.

© Panasonic System Networks Co., Ltd. 2016 Unauthorized copying and distribution is a violation of law.

KX-TGD320ALB/KX-TGD322ALB/KX-TGD323ALB/KZ-TGDA30AZB

WARNINGThis service information is designed for experienced repair technicians only and is not designed for use by the general public. It does not contain warnings or cautions to advise non-technical individuals of potential dangers in attempting to service a product. Products powered by electricity should be serviced or repaired only by experienced professional technicians. Any attempt to service or repair the product or products dealt with in this service information by anyone else could result in serious injury or death.

IMPORTANT SAFETY NOTICEThere are special components used in this equipment which are important for safety. These parts are marked by in the Schematic Diagrams, Circuit Board Diagrams, Exploded Views and Replacement Parts List. It is essential that these critical parts should be replaced with manufacturer’s specified parts to prevent shock, fire or other hazards.Do not modify the original design without permission of manufacturer.

IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERINGIf lead free solder was used in the manufacture of this product, the printed circuit boards will be marked PbF.Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.When this mark does appear, please read and follow the special instructions described in this manual on the use of PbF and how it might be permissible to use Pb solder during service and repair work.

L When you note the serial number, write down all 11 digits. The serial number may be found on the bottom of the unit. L The illustrations in this Service Manual may vary slightly from the actual product.

2

KX-TGD320ALB/KX-TGD322ALB/KX-TGD323ALB/KX-TGDA30AZB

TABLE OF CONTENTSPAGE PAGE

1 Safety Precautions----------------------------------------------- 51.1. For Service Technicians --------------------------------- 5

2 Warning -------------------------------------------------------------- 52.1. Battery Caution--------------------------------------------- 52.2. About Lead Free Solder (Pbf: Pb free)--------------- 5

2.2.1. Suggested PbF Solder ------------------------------ 62.3. Discarding of P.C. Board--------------------------------- 6

3 Specifications ----------------------------------------------------- 74 Technical Descriptions ----------------------------------------- 8

4.1. Block Diagram (Base Unit_Main)---------------------- 84.2. Block Diagram (Base Unit_RF Part) ------------------ 94.3. Circuit Operation (Base Unit) --------------------------10

4.3.1. BBIC (Base Band IC: IC501) ---------------------104.3.2. Flash Memory (IC601)------------------------------104.3.3. EEPROM (IC611) ------------------------------------104.3.4. Power Supply Circuit/Reset Circuit--------------114.3.5. Telephone Line Interface---------------------------134.3.6. Transmitter/Receiver--------------------------------14

4.4. Block Diagram (Handset)-------------------------------154.5. Circuit Operation (Handset)----------------------------16

4.5.1. Outline --------------------------------------------------164.5.2. Power Supply Circuit/Reset Circuit--------------164.5.3. Charge Circuit ----------------------------------------164.5.4. Battery Low/Power Down Detector--------------164.5.5. Speakerphone ----------------------------------------16

4.6. Behavior of Electric Power Failure ------------------174.7. Signal Route -----------------------------------------------18

5 Location of Controls and Components ------------------206 Installation Instructions ---------------------------------------207 Operating Instructions-----------------------------------------20

7.1. For Service Hint-------------------------------------------208 Test Mode ----------------------------------------------------------21

8.1. Engineering Mode----------------------------------------218.1.1. Base Unit ----------------------------------------------218.1.2. Handset ------------------------------------------------23

8.2. VES area layout in Flash (Handset) -----------------258.2.1. Scope ---------------------------------------------------258.2.2. Introduction--------------------------------------------258.2.3. VES area contents-----------------------------------25

8.3. How to Clear User Setting------------------------------268.3.1. Resetting both base unit and handset----------268.3.2. Resetting only h andset ----------------------------26

9 Troubleshooting Guide ----------------------------------------279.1. Troubleshooting Flowchart -----------------------------27

9.1.1. Check Power------------------------------------------289.1.2. Check Record ----------------------------------------299.1.3. Check Playback -------------------------------------299.1.4. Check Battery Charge ------------------------------309.1.5. Check Link---------------------------------------------319.1.6. Check the RF part -----------------------------------339.1.7. Registering a Handset to the Base Unit--------379.1.8. Deregistering a Handset ---------------------------379.1.9. Check Handset Transmission --------------------38

9.1.10. Check Handset Reception-------------------------389.1.11. Check Caller ID --------------------------------------389.1.12. Check Bell Reception-------------------------------399.1.13. Check TAM Operation ------------------------------399.2. Troubleshooting by Symptom (Base Unit) ---------40

9.2.1. Check Point (Base Unit) --------------------------- 409.3. Troubleshooting by Symptom (Handset)----------- 42

9.3.1. Check Point (Handset)----------------------------- 4210 Disassembly and Assembly Instructions--------------- 45

10.1. Disassembly Instructions------------------------------- 4510.1.1. Base Unit ---------------------------------------------- 4510.1.2. Handset------------------------------------------------ 4710.1.3. Charger Unit ------------------------------------------ 48

10.2. How to Replace the Handset LCD------------------- 4911 Measurements and Adjustments -------------------------- 50

11.1. Equipment Required ------------------------------------ 5011.2. The Setting Method of JIG----------------------------- 50

11.2.1. Connections (Base Unit) -------------------------- 5111.2.2. How to install Batch file into P.C. ---------------- 5211.2.3. Commands-------------------------------------------- 52

11.3. Adjustment Standard (Base Unit) -------------------- 5311.3.1. Bottom View ------------------------------------------ 53

11.4. The Setting Method of JIG (Handset)--------------- 5411.4.1. Connections ------------------------------------------ 5411.4.2. How to install Batch file into P.C. ---------------- 5511.4.3. Commands-------------------------------------------- 55

11.5. Adjustment Standard (Handset) ---------------------- 5611.5.1. Component View ------------------------------------ 56

11.6. Things to Do after Replacing IC or X'tal ------------ 5711.6.1. How to download the data ------------------------ 57

11.7. RF Specification ------------------------------------------ 6211.7.1. Base Unit ---------------------------------------------- 6211.7.2. Handset------------------------------------------------ 62

11.8. How to Check the Handset Speaker orReceiver ---------------------------------------------------- 62

12 Miscellaneous---------------------------------------------------- 6312.1. How to Replace the Flat Package IC --------------- 63

12.1.1. Preparation-------------------------------------------- 6312.1.2. How to Remove the IC----------------------------- 6312.1.3. How to Install the IC -------------------------------- 6412.1.4. How to Remove a Solder Bridge ---------------- 64

12.2. How to Replace the Shield Case--------------------- 6512.2.1. Preparation-------------------------------------------- 6512.2.2. Caution------------------------------------------------- 6512.2.3. How to Remove the Shield Case---------------- 6512.2.4. How to Install the Shield Case ------------------- 66

12.3. Terminal Guide of the ICs, Transistors andDiodes ------------------------------------------------------ 67

12.3.1. Base Unit ---------------------------------------------- 6712.3.2. Handset------------------------------------------------ 67

13 Schematic Diagram -------------------------------------------- 6813.1. For Schematic Diagram -------------------------------- 68

13.1.1. Base Unit (Base Unit (Main))--------------------- 6813.1.2. Handset (Handset (Main)) ------------------------ 68

13.2. Base Unit (Main) ----------------------------------------- 7013.3. Handset (Main) ------------------------------------------- 72

13.3.1. Main P. C. Board------------------------------------- 7213.3.2. Module P. C. Board --------------------------------- 74

14 Printed Circuit Board ------------------------------------------ 7714.1. Base Unit (Main) ----------------------------------------- 77

14.1.1. Component View ------------------------------------ 7714.1.2. Bottom View ------------------------------------------ 78

14.2. Base Unit (Operation)----------------------------------- 79

3


14.2.1. Component View ------------------------------------ 7914.3. Handset (Main) ------------------------------------------- 81

14.3.1. Component View ------------------------------------ 8114.3.2. Bottom View ------------------------------------------ 82

14.4. Handset (Module) ---------------------------------------- 8314.4.1. Component View ------------------------------------ 8314.4.2. Bottom View ------------------------------------------ 83

15 Exploded View and Replacement Parts List ----------- 8415.1. Cabinet and Electrical Parts (Base Unit) ----------- 8415.2. Cabinet and Electrical Parts (Handset) ------------- 8515.3. Cabinet and Electrical Parts (Charger Unit) ------- 8615.4. Accessories------------------------------------------------ 8715.5. Replacement Parts List --------------------------------- 88

15.5.1. Base Unit ---------------------------------------------- 8815.5.2. Handset ------------------------------------------------ 8915.5.3. Charger Unit ------------------------------------------ 9115.5.4. Accessories ------------------------------------------- 9115.5.5. Screws ------------------------------------------------- 9115.5.6. Fixtures and Tools----------------------------------- 91

4


1 Safety Precautions

1.1. For Service Technicians• Repair service shall be provided in accordance with repair technology information such as service manual so as to

prevent fires, injury or electric shock, which can be caused by improper repair work.1. When repair services are provided, neither the products nor their parts or members shall be remodeled. 2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.3. FASTON terminals shall be plugged straight in and unplugged straight out.

• ICs and LSIs are vulnerable to static electricity.When repairing, the following precautions will help prevent recurring malfunctions.1. Cover plastic parts boxes with aluminum foil.2. Ground the soldering irons.3. Use a conductive mat on worktable.4. Do not grasp IC or LSI pins with bare fingers.

2 Warning

2.1. Battery CautionRisk of explosion if battery is replaced by an incorrect type. Dispose of used batteries according to the instructions.

2.2. About Lead Free Solder (Pbf: Pb free)Note:

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder thatcontains lead.We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),Silver (Ag), and Copper (Cu).This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repairwork we suggest using the same type of solder.

Caution• PbF solder has a melting point that is 50 F ~ 70 F (30 C ~ 40 C) higher than Pb solder. Please use a soldering iron with

temperature control and adjust it to 700 F ± 20 F (370 C ± 10 C). • Exercise care while using higher temperature soldering irons.:

Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 F (600 C).• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

opposite side (See the figure below).

ComponentComponent pin

Solder

Remove all of theexcess solder

(Slice View)

5


2.2.1. Suggested PbF SolderThere are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufacturer’sspecific instructions for the melting points of their products and any precautions for using their product with other materials. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.

2.3. Discarding of P.C. BoardWhen discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.

0.3 mm X 100 g 0.6 mm X 100 g 1.0 mm X 100 g

6


3 Specifications

Note:• Design and specifications are subject to change without notice.

Note for Service:• Operation range: Up to 300 m outdoors, Up to 60 m indoors, depending on the condition.

L Standard:

DECT (Digital Enhanced Cordless Telecommunications),GAP (Generic Access Profile)

L Frequency range:

1.88 GHz to 1.90 GHz

L RF transmission power:

Approx. 10mW (average power per channel)

L Power source:

220 - 240 V AC, 50/60 Hz

L Power consumption:

Base unit:Standby: Approx. 0.57 W Maximum: Approx. 2.70 WCharger:Standby: Approx. 0.16 W Maximum: Approx. 1.80 W

L Operating conditions:

0°C - 40°C, 20 % - 80 % relative air humidity (dry)

L Dimensions (W x D x H):

Base unit: Approx. 109 mm x 108 mm x 85 mm Handset: Approx. 34 mm x 48 mm x 165 mmCharger unit: Approx. 69 mm x 69 mm x 36 mm

L Mass (Weight):

Base unit: Approx. 180 gHandset: Approx. 110 g Charger: Approx. 40 g

7


4 Technical Descriptions

4.1. Block Diagram (Base Unit_Main)

KX-T

GD

320

BLO

CK D

IAG

RAM

(BA

SE U

NIT

)

Ope

ratio

nal P

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oard

D10

1

CH

AR

GE

_CO

NT

AC

T

+ -

SP

X50

113

.824

MH

z

AN

T1

TE

L JA

CK

L1T

L1R

DC

P

DC

M

DC

JA

CK

RLY

SID

E T

ON

EC

IRC

UIT

Q16

1

Q14

1

BE

LL

DE

TE

CT

HO

OK

BE

LL

Q11

1

LIN

LOU

T

RF

_PA

RT

HS

MIP

HS

MIN

IC50

1B

BIC

INU

SE

DE

TE

CT

2

RE

CE

IVE

AM

P

DC

IN 1

DC

IN 2

IC30

2

VC

CP

AV

BA

T_A

PU

VB

AT

VC

C_F

EV

CC

_IF

VC

C_V

CO

3.0V

DO

UB

OU

T

SCL, SDAWP

VD

D

ANS_LED

IC60

1

FLA

SH

ME

MO

RY

IC61

1

EE

PR

OM

ME

MO

RY

KE

YS

R15

1,R

152

Q17

1

VB

AT

DL,CS

MSG_LED

KEY 13

KEY C, D, E

SPOUTNSPOUTP

3.0

VR

EG

ULA

TOR

CLK,DO

STM/CKM

R37

1R

372

VCCA

VC

C

XIN

XOUT

LIN

ED

ET

EC

T

DC

IN 3

Q65

1, Q

652

Opt

iona

l

PO

WE

R S

UP

PLY

C

IRC

UIT

FR

OM

HS

Q35

1, Q

352

*1

RX

p

RX

n

TX

p

TX

n

RE

SE

TR

ST

N

8


4.2. Block Diagram (Base Unit_RF Part)

RXp

RXn

ANT1

TXp

TXn

9


4.3. Circuit Operation (Base Unit)General Description:

(BBIC, Flash Memory, EERROM) is a digital speech/signal processing system that implements all the functions of speechcompression, record and playback, and memory management required in a digital telephone answering machine.The BBIC system is fully controlled by a host processor. The host processor provides activation and control of all that functionsas follows.

4.3.1. BBIC (Base Band IC: IC501)• Voice Message Recording/Play back

The BBIC system uses a proprietary speech compression technique to record and store voice message in Flash Memory.An error correction algorithm is used to enable playback of these messages from the Flash Memory.

• DTMF GeneratorWhen the DTMF data from the handset is received, the DTMF signal is output.

• Synthesized Voice (Pre-recorded message)The BBIC implements synthesized Voice, utilizing the built in speech detector and a Flash Memory, which stored the vocabulary.

• Caller ID demodulationThe BBIC implements monitor and demodulate the FSK/DTMF signals that provide CID information from the Central Office.

• Digital SwitchingThe voice signal from telephone line is transmitted to the handset or the voice signal from the handset is transmitted to theTelephone line, etc. They are determined by the signal path route operation of voice signal.

• Block Interface CircuitRF part, LED, Key scan, Speaker, Telephone line.

4.3.2. Flash Memory (IC601)Following information data is stored.

• Voice signalex: Pre-recorded Greeting message, Incoming message

4.3.3. EEPROM (IC611)Following information data is stored.

• Settingsex: message numbers, ID code, Flash Time, Tone/Pulse

RF part

ADPCM

AnalogFrontEnd

& Multi-plexer

TELLineInterface

DigitalSpeechProcessor

Caller IDModem

Digital TAM System

Flash Memory IC601

Host CPU

BBIC (IC501)

TDD & TDMA with FHSSProcessor ADPCM

Keys/ LEDsEEPROM IC611

10


4.3.4. Power Supply Circuit/Reset CircuitThe power supply voltage from AC adaptor is converted to VBAT (3.0V) in IC302. And +3.0V for peripherals and analog part isinsulated from VBAT by Doubler of BBIC.Circuit Operation:

5.5V

VBAT

RSTN(Reset)

pin 54

VBATpin 10

pin 57

pin 9

pin 15IC501IC302 IC601

BBIC

DOUBLER OUTFor peripherals

VDDC (1.2V)

AC Adaptor 3.0VREGULATOR

FLASH

IC611

EEPROM

+3.0V

STM/CKM

ReceiveAmp.

RF Part

ANS LEDMSG LED

Startmonitor(IC501 57pin)

VDDC (1.2 V)

VBAT

Reset (RSTN) (IC501_54 pin)

BBIC chip initialize

(CKM/STM)

Q171

11


4.3.4.1. Charge CircuitThe voltage from the AC adaptor is supplied to the charge circuits.

R372

R371

F301 DCP

+5.5V

CHARGE-

CHARGE+DCMD

362

C35

1

12


4.3.5. Telephone Line InterfaceTelephone Line Interface Circuit:Function

• Bell signal detection• ON/OFF hook and pulse dial circuit• Side tone circuit

Bell signal detection and OFF HOOK circuit:In the idle mode, Q141 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the Tip (T)and Ring (R) leads (When the telephone rings), the AC ring voltage is transferred as follows:T R111 C110 Q111 BBIC pin 5 [BELL]When the CPU (BBIC) detects a ring signal, Q141 turns on, thus providing an off-hook condition (active DC current flow throughthe circuit). Following signal flow is the DC current flow.T D101 Q141 Q161 R163 D101 P101 R

ON HOOK Circuit:Q141 is open, Q141 is connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an on-hook condition.

Pulse Dial Circuit:Pin 6 of BBIC turns Q141 ON/OFF to make the pulse dialing.

Side Tone Circuit:Basically this circuit prevents the TX signal from feeding back to RX signal. As for this unit, TX signal feed back from Q161 iscanceled by the canceller circuit of BBIC.

PULS

E_M

UTE

BELL

HO

OK

NL_CID

R121 390kR122 390k

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100k

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R11

7

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100k

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6

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*Q141

Q111

D13

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C16

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*C16

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C17

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Q171

*C14

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DC Monitor

Caller ID

Bell detection

Pin

28

of IC

501

Pin

25

of IC

501

Pin

24

of IC

501

Pin

16

of IC

501

Pin

18

of IC

501

Pin

19

of IC

501

Pin

17

of IC

501

Pin 6 of IC501

Pin 5 of IC501

HOOK

BELL

13


4.3.6. Transmitter/Receiver• Audio Circuits and DTMF tone signal circuits.

Base Unit and Handset mainly consist of RF Module and DECT BBIC. Base Unit and Handset transmit/receive voice signal and data signal through the antenna on carrier frequency.

Signal Path:*Refer to Signal Route(P.18).

4.3.6.1. Transmitter BlockThe voice signal input from the TEL LINE interface goes to DECT BBIC (IC501) as shown in Block Diagram (BaseUnit_Main)(P.8)The voice signal passes through the analog part of IC501 where it is amplified and converted to a digital audio stream signal.The burst switch controller processes this stream performing encryption and scrambling, adding the various other fields toproduce the GAP (Generic Access Profile) standard DECT frame, assigning to a time slot and channel etc.In IC501, the carrier frequency is changing, and frequency modulated RF signal is generated.In IC501,RF signal is amplified,and radiated from antenna. Handset detects the voice signal or data signal in the circuit same as the following explanation of

Receiver Block.

4.3.6.2. Receiver BlockThe signal of 1900 MHz band which is input from antenna is input to IC501 as shown in Block Diagram (Base Unit_Main)(P.8).In IC501, the signal of 1900 MHz band is downconverted to 864 kHz signal and demodulated, as GAP (Generic Access Profile)standard DECT frames. It passes through the decoding section burst switch controller where it separates out the frameinformation and performs de-encryption and de-scrambling as required. It then goes to the DSP section where it is turned back

into analog audio. This is amplified by the analog front end, and goes to the TEL LINE Interface.

14


4.4. Block Diagram (Handset)

QSP

IFL

ASH

MEM

OR

YIC

4

Res

et

Res

etP

in 7

1

SPEA

KER

REC

EIVE

R

MIC

CH

ARG

EC

IRC

UIT

Q2,

Q3,

Q4,

Q9,

R8

CH

ARG

EC

ON

TAC

TS

CH

ARG

E(+)

CH

ARG

E_C

TRL

CH

ARG

E_D

ET

BATT

ERY

TER

MIN

ALR

45

VBAT

BATT

-

1.8

VQ

11.8

V

LCD

CD

RES

ETC

S

SID

SC

L

CPU

Anal

ogFr

ont

End

D/A

A/D

35 37 21 22 17 18 34 33 32 24

4445

73 63 64 7776

ADPC

MC

odec

Filte

r

DSP

Spee

chD

ecod

ing

Spee

chEn

codi

ng

BMC

Burs

tD

ecod

ing

ANT1

Burs

tEn

codi

ng

RF

PLL

MO

D/D

EMO

D

1 2 87 86

RXn

ANT1

RXp

TXp

TXn

7 8

XTAL X110

.368

MH

zBA

TTER

Y

46

ON

SW

ITC

H

KEYP

AD

Cha

rge

Pum

p

RO

WS

CO

LUM

NS

CP3

VCP

4V

57, 5

8, 5

9, 6

0

11, 1

2, 1

3, 1

4, 2

5, 5

5

47, 4

8, 5

1, 5

3 Q

SP

I-IO

0-3

BBIC

IC1

65

LCD

-BA

CK

LIG

HT

KE

Y L

ED

61

LDO

_CTR

L

1.8

V

CP3

V

QSP

IC

ontro

l52

QS

PI-

SC

K49

QS

PI-

CS

LC

D_L

ED

0

CP

4V

CP3

V

1.8

V

GN

D PO

WE

R F

AIL

UR

E M

OD

EP

OW

ER

SU

PP

LY S

WQ

10, Q

11, Q

12, R

10T

GD

A30

xx O

nly

KX-T

GD

A30

BLO

CK D

IAG

RAM

(HA

ND

SET)

15


4.5. Circuit Operation (Handset)

4.5.1. OutlineHandset consists of the following ICs as shown in Block Diagram (Handset) (P.15).

• DECT BBIC (Base Band IC): IC1- All data signals (forming/analyzing ACK or CMD signal)- All interfaces (ex: Key, Detector Circuit, Charge, DC/DC Converter, EEPROM, LCD, RF Power Amp.)- PLL Oscillator- Detector- Compress/Expander- Reception- Integrated 1.9 GHz PA for DECT

• QSPI FLASH MEMORY: IC4- Main Program D/L Area- Following information data is stored

- Settingsex: ID code, user setting

4.5.2. Power Supply Circuit/Reset CircuitCircuit Operation:

When power on the Handset, the voltage is as follows;BATTERY(2.2 V ~ 2.6 V: BATT+) Q1 (1.8 V), IC1-44pin (CP3V)The Reset signal generates IC1 (71 pin) and 1.8 V.

4.5.3. Charge CircuitCircuit Operation:

When charging the handset on the Base Unit, the charge current is as follows;

DC+(5.5 V) R371 R372 D362 CHARGE+(Base) CHARGE+(Handset) Q3 BATTERY+... Battery...

BATTERY- R45 GND CHARGE-(Handset) CHARGE-(Base) GND DC-(GND)In this way, the BBIC on Handset detects the fact that the battery is charged.The charge current is controlled by switching Q9 of Handset.

Refer to Fig.101 in Power Supply Circuit/Reset Circuit (P.16).

4.5.4. Battery Low/Power Down DetectorCircuit Operation:

“Battery Low” and “Power Down” are detected by BBIC which check the voltage from battery.The detected voltage is as follows;

• Battery Low

Battery voltage: V(Batt) 2.25 V ± 50 mV

The BBIC detects this level and " " starts flashing.• Power Down

Battery voltage: V(Batt) 2.0 V ± 50 mV

The BBIC detects this level and power down.

4.5.5. SpeakerphoneThe hands-free loudspeaker at SP+ and SP- is used to generate the ring alarm.

1.8V

Battery +

Reset (IC1_71 pin)

Q2R8

16


4.6. Behavior of Electric Power Failure When AC power is lost and lose radio waves, Module PCB turns Q11 on and, battery voltage appear to CHG terminal. When CHG+ (supply voltage from handset) is higher than Vbat, Q351 is on. And, this unit continues working in power failurecondition. It’s possible to use the units during the power failure, supplying power to VBAT of base unit from battery of handset through Q10,CHG terminal and Q351.

R354Q352

R355

Q351CHG+ Vbat

R45

Q11

R11

Q10

R12

R13

3

Battery

CHG-

HANDSET BASE

17


4.7. Signal Route

Note:: inside of Handset

---ANT. - <BASE_UNIT_RF_RX_ROUTE> - IC501(46/47 - 28) - L101 - C184 - Q161 - Q141 - D101 - P101 - T/R(TEL LINE)

T/R(TEL LINE) - P101 - D101 - Q141 - Q161 - R164 - R177 - C173 - Q171 - C178 - IC501(16 - 44/45) - <BASE_UNIT_RF_TX_ROUTE> - ANT. ---

---ANT. - <BASE_UNIT_RF_RX_ROUTE> - IC501(46/47 - 28) - L101 - C184 - Q161 - Q141 - D101 - P101 -T/R(TEL LINE)

T/R(TEL LINE) - P101 - D101 - Q141 - Q161 - R164 - R177- C173 - Q171 - C178- IC501(16-44/45) - <BASE_UNIT_RF_TX_ROUTE> - ANT. ---

---ANT. - <BASE_UNIT_RF_RX_ROUTE> - IC501(46/47- 73/74) - IC601

IC601 - IC501(73/74 - 28) - L101 - C184 - Q161 - Q141 - D101 - P101 - T/R(TEL LINE)

T/R(TEL LINE) - P101 - D101 - Q141 - Q161 - R164 - R177- C193 - Q171 - C178- IC501(16 - 73/74) - IC601

IC601 - IC501(73/74 - 29/31) - SPEAKER

IC501(28) - L101 - C184 - Q161 - Q141 - D101 - P101 - T/R(TEL LINE)

T/R(TEL LINE) - P101 - C121/C122 - R121/R122 - IC501(24/25)

T/R(TEL LINE) - P101 - R111/R112 - C110/C112 - Q111 - IC501(5)

HANDSET TX

HANDSET RX

HANDSET SP-Phone TX

HANDSET SP-Phone RX

SIGNAL ROUTE IN ROUTE OUT

GREETINGRECORDING

GREETING PLAYTO TEL LINE

ICM RECORDING

ICM PLAY TOSPEAKER

DTMF SIGNAL TO TEL LINE

CALLER ID

BELL DETECTION

MIC (+) - C13 - IC1 (17) IC1(86) MIC (–) - C11 - IC1 (18) IC1(87)

C859 - ANT to BASE

from BASE UNIT ANT 1 IC1 (1)IC1 (2)

IC1 (21) - RECEIVER (+)IC1 (22) - RECEIVER (–)


C859 - ANT to BASE

from BASE UNIT ANT –– IC1 (1) ––– IC1 (35) - SP (–) – IC1 (2) – – IC1 (37) - SP (+)


C859 - ANT to BASE

RA4 - RA4 -

RA4 - RA4 -

RA4 - RA4 -

18


RF part signal route

SIGNAL ROUTE IN ROUTE OUT

HANDSET RF[ TX_ROUTE ]

HANDSET RF[ RX_ROUTE ]

BASE UNIT RF[ TX_ROUTE ]

BASE UNIT RF[ RX_ROUTE ]

IC1(86/87) - C859 - ANT

ANT - IC(1/2)

IC501(44/45) - C819 - C872 - ANT

ANT - C872 - C895 - IC501(46/47)

Note:: inside of Handset

19


5 Location of Controls and ComponentsRefer to the Operating Instructions.

Note:You can download and refer to the Operating Instructions (Instruction book) on TSN Server.

6 Installation InstructionsRefer to the Operating Instructions.


7 Operating InstructionsRefer to the Operating Instructions.


7.1. For Service Hint

(right soft key) 132

Items Contents

Battery You could use other rechargeable batteries sold in a market, but the unit is not guaranteed to work properly.

The battery strength may not be indicated correctly if the battery is disconnected and connected again, even after it is fully charged. In that case, by recharging the battery as mentioned in the Operating Instructions, you will get a correct indication of the battery strength.

PIN Code

Recall Earth Recall feature is not supported in this model.

LChange the PIN using the following method.12 7

3 Enter the new 4-digit base unit PIN. i{OK}

#

4 { ^^} : “ Yes” i{OK}i {c}}

20


8 Test Mode

8.1. Engineering Mode

8.1.1. Base Unit

Important: Make sure the address on LCD is correct when entering new data. Otherwise, you may ruin the unit.

This pictured model is KX-TGD320.

H/S key operation H/S LCD

Soft keys

(Volume) key/(Phonebook)/

(Caller list) key/(Redial) key/

Navigator key/

Dial keypad

(Talk){ }

{ }(Power)

ECO: Eco mode shortcut keyECO{ }RECALL

2). Select "Initial Setup" using or then press {OK} .

{^} {V}

4). Enter "7", "2", "6", "2", "7", "6", "6", "4". Note: 7262 7664 = PANA SONI (see letters printed on dial keys)

6). Enter " ", " ", " ", " " (Address). (*1)

7). Enter " ", " " (New Data). (*1)

5). Select "Write EEP" using or then press or {>}.

{^} {V}

3). Select "Line Setup" using or then press {OK} or {>}.

{^} {V}

_ _ _ _ _ _

Set Addr.:

Default DataSet Addr.:

OK

New DataSet Addr.:

OK{OK}

OK

Service Mode

Read EEP Write EEP{OK}

1). Press { }

9). Press to return to standby mode. After that, turn the base unit power off and then power on.

8). Press , a long confirmation beep will be heard.

{ }

{ }

{ }(Power) { }

BACK

BACK

CLEAR

CLEAR

OFF

OFF

21


Frequently Used Items (Base Unit)ex.)

Note:(*1) When you enter the address or New Data, please refer to the table below.

(*2)

Items Address Default Data New Data RemarksC-ID (FSK) sensitivity 09 16/09 17 28/00 1C/00

(3 dB up)14/00

(6 dB up)When hex changes from “00/28” to “00/1C” or“00/14”, gain increases by 3 dB or 6 dB.

Frequency 00 07 / 00 08 00/01 - - Use these items in a READ-ONLY mode toconfirm the contents. Careless rewriting maycause serious damage to the computer system.

ID 00 02 ~ 00 06 Given value - -

Bell length 03 98 32 (5sec) (*2)

1E (3 sec) 14 (2 sec) This is time until bell stops ringing.(Unit: 100 msec)

Desired Number (hex) Input Keys Desired Number (hex) Input Keys0 0 A [Flash] + 01 1 B [Flash] + 1. . C [Flash] + 2. . D [Flash] + 3. . E [Flash] + 49 9 F [Flash] + 5

Bell length 32 (hex) = 50 (dec) 50 100 msec = 5000 msec (5 sec)

22


8.1.2. Handset

Important: Make sure the address on LCD is correct when entering new data. Otherwise, you may ruin the unit.

H/S key operation H/S LCD

8). Press to return to standby mode. After that, turn the base unit power off and then power on.

2). Select "Initial Setup" using or then press {OK} .

{^} {V}

3). Enter "7", "2", "6", "2", "7", "6", "6", "4". Note: 7262 7664 = PANA SONI (see letters printed on dial keys)

5). Enter " ", " ", " ", " " (Address). (*1)

6). Enter " ", " " (New Data). (*1)

4). Select "Write EEP" using or then press or {>}.

{^} {V}

_ _ _ _ _ _

Set Addr.:

Default DataSet Addr.:

OK

New DataSet Addr.:

OK7). Press , a long confirmation beep will be heard.

{OK}

OK

Service Mode

Read EEP Write EEP{OK}

1). Press { }

BACK

BACK

CLEAR

CLEAR

Soft keys

(Volume) key/(Phonebook)/

(Caller list) key/(Redial) key/

Navigator key/

Dial keypad

(Talk){ }

{ }(Power) { }

ECO: Eco mode shortcut keyECO{ }RECALL { }

{ }(Power) { }

OFF

OFF

23


Frequently Used Items (Handset)ex.)

Note:(*1) When you enter the address or New Data, please refer to the table below.

(*2) When adding “01” (hex) to default value, sending level increases by 0.25 dB.ex.)

(*3) When reducing “01” (hex) from default value, receiving level increases by 0.25 dB.ex.)

(*4) Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to thehandset.

Items Address Default Data New Data Possible AdjustedValue MAX (hex)

Possible AdjustedValue MIN (hex)

Remarks

Sending Level 07 76 Adjusted value Given value FF D0 (*2)Receiving Level 07 77 Adjusted value Given value FF D0 (*3)

Battery Low 00 09 70 - - -(*4)Frequency 00 07 / 00 08 70/02 - - -

ID 00 02 ~ 00 06 Given value - - -

Desired Number (hex.) Input Keys Desired Number (hex.) Input Keys0 0 A [R] + 01 1 B [R] + 1. . C [R] + 2. . D [R] + 3. . E [R] + 49 9 F [R] + 5

Item Default Data New DataE7 EB E3

Sending level -2.5 dBm -1.5 dBm -3.5 dBm

Item Default Data New DataE7 EB E3

Sending level -15.0 dBm -16.0 dBm -14.0 dBm

24


8.2. VES area layout in Flash (Handset)

8.2.1. ScopeThe purpose of this section is to describe the layout of the VES (Virtual EEPROM Storage) area in FLASH (IC4) for the Handset.The VES area contains hardware, software, and user specific parameters. Some parameters are set during production of the

handset, some are set by the user when configuring the handset, and some during normal use of the phone.

8.2.2. IntroductionThe handset uses a 128k bit VES area in FLASH (IC4) for storing volatile parameters. All parameters are set up before thehandset the factory. Some of these are vital for the operation of the hardware so a set of default parameters is programmedbefore the actual hardware fine-tuning can be initiated. This document lists all default settings with a short description.This document lists all default parameters with a short description.

8.2.3. VES area contentsMMI Setting:

MMI1 Setting:

Initial Type DescriptionF The data initialized by only F command0 The data initialized by F and 0 command1 The data initialized by F, 0 and 1 command2 The data initialized by F, 0, 1 and 2 command3 The data initialized by all command (F, 0, 1, 2, 3)

Country Setting Descriptionx Default - no specific country setting, so revert to default value.

Address InitialType

Name Description Default value CountrySetting

05 86 3 EEP_Language Selected Language for LCDGERMAN:0 ENGLISH:1 SPANISH:2 NORWEGIAN:3 FRENCH:4 ITALIAN:5 DENISH:6 DUTCH:7 SWEDISH:8 FINNISH:9

GREEK:10 TURKISH:11 HUNGARIAN:12 PORTUGUESE:13 RUSSIAN:14POLISH:15 SLOVAKIAN:16 CZECH:17 CROATIAN:18 CATALAN:19UKRINIAN:20 SPANISHMEX:21 SLOVENIAN:22 ESTNIAN:23 LITHUANIAN:24LATVIAN:25 ROMANIAN:26 BULGARIAN:27 MACEDONIAN:29ALBANIAN:30 PORTUGUESEMEX:31 ENGLISH(USA):32 HEBREW:33ARABIC:34 PERSIA:35 HANTAI:36 HANTAI(HK):37 RUSSIAN(BX):38BELARUS:39 KAZAKHSTAN:40 UZBEKISTAN:41 TAJIKISTAN:42 TURKMENISTAN:43 AZERBAIJAN:44 ARMENIA:45 MOLDOV:46CANADAENGLISH:48 USSPANISH:49 USFRENCH:50 PORTUGUESE:51 ENGLISH(AZ):52

0x01 x

Address InitialType

Name Description Default value CountrySetting

00 14 F EEP_LcdContrast LCD contrast 0x28 x

25


8.3. How to Clear User SettingUnits are reset to the Factory settings by this operation (Erase recorded Voice messages, stored Phone numbers, Caller list andetc.)

Note:• Some menus are not reset. Refer to Operating Instructions (P.20).• The reset menus differ depending on the following operations.• This operation should not be performed for a usual repair.

8.3.1. Resetting both base unit and handset

Both the base unit and the registered handset which you did the following steps to are reset. Other registered handsetswill not be reset.

Note:(*1) Refer to Registering a Handset to a Base Unit in the Operating Instructions.

8.3.2. Resetting only h andset

The only handset is reset by doing the following steps to .

Note: (*2)• The handset registration to the base unit is cancelled.• If the handset needs to be registered to the base unit, refer to Registering a Handset to a Base Unit in the Operating

Instructions.• If users do not bring the base unit with them, the registration procedure has to be done by users themselves.

1 5

1 Connect the AC adaptor to the base unit and install the charged batteries into the handset.

2 Confirm the handset is registered to the base unit ( lights). If the handset is not registered to the base unit ( lights), register it. (*1)

3 Lift the handset and press { } to put the handset in standby mode.

4 Press , , and key of the handset simultaneously until a confirmation tone is heard.

5 Disconnect the AC adaptor, then remove the battery.

1 5 9

Handset Base unit

w

1

1 Install the charged batteries into the handset.

2 Lift the handset and press { } to put the handset in standby mode.

4 Remove the battery.

3 Press , , and key of the handset simultaneously until a confirmation tone is heard. (*2)3 5 7 #

Handset

26


9 Troubleshooting Guide

9.1. Troubleshooting Flowchart

Cross Reference:Check Power (P.28)Check Playback (P.29)Check Record (P.29)Check Battery Charge (P.30)Check Link (P.31)Check the RF part (P.33)Check Handset Transmission (P.38)Check Handset Reception (P.38)Check Caller ID (P.38)Check Bell Reception (P.39)Check TAM Operation (P.39)

Power ON Base Unit

OK

FLOW CHART

Check Power

OK

Playback Pre-Message Check Playback

Record

OK

Check Record

Range Check the RF part

Handset Voice Transmission Check Handset Transmission

Handset Voice Reception

OK

OK

OK

Check Handset Reception

Caller ID Reception Check Caller IDCaller ID Error

No voice

No voice

No charge

Not playback

Not record

Not working

NG

No link

OK

Link

Battery Charge

OK

Check Battery Charge

Check Link

Bell Reception

OKNot reception

Check Bell Reception

TAM Operation

OKNot working

Check TAM Operation

27


9.1.1. Check Power

9.1.1.1. Base Unit

Cross Reference:Power Supply Circuit/Reset Circuit (P.11)

Note: BBIC is IC501.(*1) Refer to Specifications (P.7) for part number and supply voltage of AC adaptor.

(*2) Refer to Base Unit (Main) (P.77).

9.1.1.2. Handset


Note: (*1) Refer to Handset (Main) (P.81).

Is the AC Adaptor inserted into AC outlet? (*1)

Is output voltage of AC adaptor 5.5 V?

YES

Check AC Adaptor.

Check VDDC (1.2 V): Test Point [VDDC] (*2)

OK

Check Power Supply Circuit.

NO

NO

NO

NO

RSTN: Reset = "High"? (*2)

YES

Check Reset Circuit.

Check Xtal CLK = 13.824 MHz?

YES

Check X501.

Check BBIC.

Check Power Supply Circuit/Reset Circuit .

Check BBIC (IC1).

Check F1 is not open.

Check X1.

Is the voltage of BATT+ 2.3 V more? (*1)

Check the battery and around BATT+ andBATT- are not shorted.

Is the battery inserted BATT+ and BATT-?

Does BBIC (IC1: 7) oscillate at 10.368 MHz?

YES

YES

YES

YES

NO

NO

YES

Is the voltage of +1.8V about 1.8 V? (*1)

Is the voltage of CP3V about 3.0 V? (*1)

Check BBIC (IC1).

YES

Is the voltage of CP4V about 4.0V ? (*1) (When LED is On)

YES

NO

NO

NO

28


9.1.2. Check Record

9.1.2.1. Base UnitA) Not record Incoming Message

Cross Reference:Signal Route (P.18)Telephone Line Interface (P.13)

Note: Flash Memory is IC601.BBIC is IC501.

9.1.3. Check Playback

9.1.3.1. Base Unit


Note: Flash Memory is IC601.BBIC is IC1.

(*1) Refer to Base Unit (Main) (P.77).

Check Bell signal.

OK

Check Telephone Line Interface [Bell].

Does the unit catch line?

YES

Check Telephone Line Interface [OFF HOOK].

Check Line In: Pin 16 of BBIC. Check ICM Recording in Signal Route.NO

OK

Check Auto Disconnect Circuit.

OK

Check Parallel Connection Detection Circuit.

OK

Check BBIC and Flash Memory.

NO

NO

Check VDDC (1.2 V): Test Point [VDDC]

OK

Check Power Supply Circuit.

Check output of BBIC (Pin 29, 31).

OK

Check BBIC and Flash Memory.

Check Speaker and its surroundings.

NO

NO

29


9.1.4. Check Battery Charge

9.1.4.1. Base Unit

Cross Reference:Charge Circuit (P.12)

9.1.4.2. Handset

Cross Reference:Check Power (P.28)Charge Circuit (P.16)

9.1.4.3. Charger Unit

Cross Reference:Charge Circuit (P.16)

Check Charge Circuit of Base Unit.

Check Handset.

Plug in the AC Power source.Charge Handset on Base Unit.

Is the voltage of two charge contacts about5.5 V or more?

OK

NO

Check Charge Contacts at Base Unit from mechanical point of view in orderto check if a bad contact between Base unitand Handset.

YES

Is BBIC (IC1: 34) high at charge state? Check Charge Circuit.

Check Power of Handset.Is Check Power OK?

NO

NO

YES

Check Charge Circuit of Charger Unit.

Check Handset.

Plug in the AC Power source.Charge Handset on Charger Unit.

Is the voltage of two charge contacts about3 V or more?

OK

NO

Check Charge Contacts at Charger Unitfrom mechanical point of view.

YES

30


9.1.5. Check Link

9.1.5.1. Base Unit

Cross Reference:Power Supply Circuit/Reset Circuit (P.11)Check the RF part (P.33)

Note: (*1) Refer to Base Unit (Main) (P.77).(*2) Refer to Check Point (Base Unit) (B) (P.40).(*3) Refer to Check Point (Base Unit) (E) (P.40).

Check around Power Supply Circuit.

Adjust +3.0V voltage to 3.0 V. (*2)

Does Base Unit make link with normal workingHandset?

Check around X501 and RF module and adjustclock frequency. (*3)

NO

NO

NO

NO

YES

YES

Is the voltage of VBAT about 3.0 V? (*1)

Check the RF part

Does the RF clock (CKM) oscillate at 13.824 MHz inBase Unit Test Mode?

YES

Is the voltage of VDDC about 1.2 V? (*1)

Is the voltage of +3.0V about 3.0 V? (*1)

YES

YESBase Unit is OK. Check Handset.

NO

OK

31


9.1.5.2. Handset

Cross Reference:Power Supply Circuit/Reset Circuit (P.11)Check the RF part (P.33)

Note: (*1) Refer to Handset (Main) (P.81).(*2) Refer to Check Point (Handset) (H) (P.42).

Check around Power Supply Circuit/Reset Circuit .

Check BBIC (IC1)

Does Handset make link with Base Unit?(Correct working unit)

Check around X1 and adjust clock frequency. (*2)

NO

NO

NO

NO

Is the voltage of "1.8V" about 1.8 V? (*1)

YES

YES

YES

YES

Is the voltage of CP3V about 3.0 V? (*1)

Does the RF clock (CKM) oscillate: 10.368 MHzin Handset Test Mode?

Handset is OK. Check Base Unit.YES

OK

Check the RF part.

NO

NO

Adjust 1.8V voltage to 1.8 V.

Is the voltage of CP4V about 4.0V? (*1) (When LED is ON)

32


9.1.6. Check the RF part

9.1.6.1. Finding out the Defective part

After All the Checkings or Repairing1. Re-register the checked handset to the checked base unit, and Regular HS to Regular BU.

Note:(*1) HS: Handset(*2) BU: Base Unit

1. Prepare Regular HS(*1) and Regular BU(*2).2. a. Re-register regular HS (Normal mode) to base unit (to be checked). If this operation fails in some ways, the base unit is defective. b. Re-register handset (to be checked) to regular BU (Normal mode). If this operation fails in some ways, the handset is defective.

Base unit is defective Handset is defective

START

Registration of Regular HS to

base unit

Registration of handset toRegular BU

(other checkings)

Registration of handset to base unit (checked ones)

Registration of Regular HS to Regular BU

Yes

No No

Yes

33


9.1.6.2. RF Check FlowchartEach item (1 ~ 6) of RF Check Flowchart corresponds to Check Table for RF part (P.35).Please refer to the each item.

Note:(*1) Refer to Check Link (P.31).

Start

Linkconfirmation

Normal

1

Controlsignal

confirmation

X'talFrequency

confirmation

TX confirmation

RX confirmation

Rangeconfirmation

NormalTEST RANGE Check.

Check BBIC interface parts.(RF Block <->BBIC on BU/HS P.C.B)

Adjust X'tal Frequency. (*1)

Check TX Block.

Check RX Block.

GOOD

6

2

3

4

5

OK

OK

OK

OK

NG

NG NG

NG

NG

NG

OK

OK

34


9.1.6.3. Check Table for RF part

Note:(*1) Adjustment Standard (Base Unit) (P.53)(*2) Adjustment Standard (Handset) (P.56)

No. Item BU (Base Unit) Check HS (Handset) Check1 Link Confirmation Normal

HS, BU Mode [Normal Mode]

1. Register Regular HS to BU (to be checked).

2. Press [Talk] key of the Regular HS to establish link.

1. Register HS (to be checked) to Regular BU.

2. Press [Talk] key of the HS to establish link.

2 X'tal Frequency confirmation

HS, BU Mode: [Adjustment]

Check X'tal Frequency.(13.824000 MHz ±100 Hz)

Check X'tal Frequency.(10.368000 MHz ±100 Hz)

3 TX confirmation

Regular HS (BU) Mode:[Test RX Mode]

BU (HS) Mode:[Test TX_Burst Mode]

1. Place Regular HS 15 cm away from a checked BU.

2. Confirm "TXDATA" waveform of BU (*1) and “RXDATA“ waveform of Regular HS by Digital Oscilloscope.

1. Place Regular BU 15 cm away from a checked HS.

2. Confirm "TXDATA" waveform of HS (*2) and "RXDATA" waveform of Regular BU by Digital Oscilloscope.

4 RX confirmation

Regular HS (BU) Mode:[Test TX_Burst Mode]

BU (HS) Mode:[Test RX Mode]

1. Place Regular HS 15 cm away from a checked BU.

2. Confirm "RXDATA" waveform of BU (*1) and “TXDATA“ waveform of Regular HS by Digital Oscilloscope.

1. Place Regular BU 15 cm away from a checked HS.

2. Confirm "RXDATA" waveform of HS (*2) and "TXDATA" waveform of Regular BU by Digital Oscilloscope.

5 Range Confirmation Normal

HS, BU Mode: [Normal Mode]


2. Press [Talk] key of the Regular HS to establish link.

3. Compare the range of the BU (being checked) with that of the Regular BU.


2. Press [Talk] key of the HS to establish link.3. Compare the range of the HS (being

checked) with that of the Regular HS.

35


9.1.6.4. TEST RANGE CheckCircuit block which range is defective can be found by the following check.

CHART1: Setting of TX Power and RX Sensitivity in Range Confirmation TX TEST, RX TEST

Note:(*1) Refer to Commands (P.52).

Item BU (Base Unit) Check HS (Handset) CheckRange Confirmation TX TEST(TX Power check)

HS, BU settingChecked unit: Low TX power (*1)Regular unit: High TX power (*1)


2. Set TX Power of the BU and the Regular HS according to CHART1.

3. At distance of about 20m between HS and BU,Link OK = TX Power of the BU is OK.No Link = TX Power of the BU is NG.


2. Set TX Power of the HS and the Regular BU according to CHART1.

3. At distance of about 20m between HS and BU,Link OK = TX Power of the HS is OK.No Link = TX Power of the HS is NG.

Range Confirmation RX TEST(RX sensitivity check)

HS, BU settingChecked unit: High TX power (*1)Regular unit: Low TX power (*1)


2. Set TX Power of the BU and the Regular HS according to CHART1.

3. At distance of about 20m between HS and BU,Link OK= RX Sensitivity of the BU is OK.No Link = RX Sensitivity of the BU is NG.


2. Set TX Power of the Checking HS and the Reg-ular BU according to CHART1.

3. At distance of about 20m between HS and BU,Link OK= RX Sensitivity of the HS is OK.No Link = RX Sensitivity of the HS is NG

BU (to be checked) Regular_HSTX Power TX Power

BU (Base Unit) TX Power Check Low HighBU (Base Unit) RX Sensitivity Check High Low

HS (to be checked) Regular_BUTX Power TX Power

HS (Handset) TX Power Check Low HighHS (Handset) RX Sensitivity Check High Low

36


9.1.7. Registering a Handset to the Base Unit

9.1.8. Deregistering a Handset

1 Handset:{ }

3 Base unit:Press and hold { } for about 5 seconds.L If all registered handsets start ringing, press { } again to stop, then

repeat this step.4 Handset:{OK} Wait until “Base PIN” is displayed. Enter the base unit PIN (default: “0000”).

# 1 3 02LThis number is used by the handset as a reference only.

^V{ }: Select a base unit number. i {OK}

i i i {OK}

1 { }

2All handsets registered to the base unit are displayed.L

3

# 1 3 1

: Select the handset you want to cancel. ^V{ } i {OK}

: “ Yes ”^V{ } i {OK} i { }OFF

37


9.1.9. Check Handset Transmission

Cross Reference:Signal Route (P.18)

9.1.10. Check Handset Reception

Cross Reference:Signal Route (P.18)

Note:When checking the RF part, Refer to Check the RF part (P.33).

9.1.11. Check Caller ID

Cross Reference:Telephone Line Interface (P.13)

Note:• Make sure the format of the Caller ID service of the Telephone company that the customer subscribes to.• It is also recommended to confirm that the customer is really a subscriber of the service.

Check MIC of handset.

Check handset Tx in Signal Route.

Check speaker of handset.

Check handset Rx in Signal Route.

YES

Did bell ring?(Message indicator blinks)

Check Calling Line Identification (Caller ID)/ Call Waiting Caller ID.

Check bell signal detection in Telephone Line Interface.

BASE UNIT

NO

38


9.1.12. Check Bell Reception

9.1.12.1. Base Unit

9.1.12.2. Handset

Cross Reference:Telephone Line Interface (P.13)Check Link (P.31)

How to Check the Handset Speaker or Receiver (P.62)

9.1.13. Check TAM Operation

When bell signal is coming, is there bell sound signal at BBIC (IC501 5pin : BELL)?

YES

Check around C101, C102, C110, C112, C113, R113, R114, R111, R112, P101, D113, Q111

NO

Check IC501 of Base Unit. Check around IC501 (VDD_PA), C507, C475, C477, C479NO

Does the bell sound from SPEAKER?

Check around SP+, SP- .

When bell signal coming, is there bell sound signal at BBIC (IC1: 35, 37)?

NO

NO

YES

When bell signal coming, is there bell sound signalat SP+, SP- ?

YES

Check BBIC (IC1), C78, C79, R77, R76.NO

Check cable of SPEAKER and resistance valueof SPEAKER.

Check IC601 and BBIC (IC501) of Base Unit.

Is there a TAM icon on the Handset display? Turn on the Answering System.

Check Power Supply Circuit.NO

NO

YES

Is the voltage of VBAT of Base Unit about 3.0 Vand +3.0V about 3.0 V?

YES

39


9.2. Troubleshooting by Symptom (Base Unit)If your unit has below symptoms, follow the instructions in remedy column. Remedies depend on whether you have DECT tester(*1) or not.

Note:(*1) A general repair is possible even if you don’t have the DECT tester because it is for confirming the levels, such as Acousticlevel in detail.(*2) Refer to Check Point (Base Unit) (P.40)

9.2.1. Check Point (Base Unit)Please follow the items below when BBIC or EEPROM or FLASH is replaced.

Note:After the measuring, suck up the solder of TP.*: The Setting Method of JIG (P.50) is required beforehand.The connections of simulator equipment are as shown in Adjustment Standard (Base Unit) (P.53).

SymptomRemedy (*2)

You don’t have DECT Tester.You have DECT Tester.

(Model Number: CMD60)You cannot dial. Check item (A) - (G). Check item (A) - (G)You cannot hear the caller’s voice. Check item (A) - (E), (M). Check item (A) - (E), (M)You cannot use the handset a little away from base unit even if thehandset is within range of the base unit.

-Check item (H) - (L).

The acoustic transmit level is high or low. Check item (M). Check item (M).The acoustic reception level is high or low. Check item (M). Check item (M).Base unit and handset do not link to each other. Check item (A) - (E). Check item (A) - (E), (H) - (L).The unit cannot charge. Check item (N). Check item (N).TAM does not work. (for KX-TGD320 only) Check item (O). Check item (O).

Items Check Point

Procedure Check or Replace Parts

(A) 3.0 V Supply Confirmation

VBAT 1. Confirm that the voltage between test point VBAT and GND is 3.0 V ± 0.2 V. IC302, C341, R321, R322

(B) 3.0 V Supply Confirmation

+3.0V 1. Confirm that the voltage between test point +3.0V and GND is 3.0 V ± 0.02 V.2. Adjust the 3.0 V voltage of +3.0V executing command “VDA“.

IC501, C503

(C)* BBIC Confirmation - 1. BBIC Confirmation (Execute the command “getchk”).2. Confirm the returned checksum value.

Connection of checksum value and program number is shown below.

IC501, X501

(D)* EEPROM Confirmation - 1. EEP-ROM Confirmation (Execute the command "sendchar EPV").2. Confirm the returned Value. (Value for reference is written at "EEPROM C/

SUM” in Software_Version_Table.xls).

IC501, IC611, C611, RA611

(E)* BBIC Clock Adjustment CKM 1. Input Command “ sendchar sfr”, then you can confirm the current value.2. Check X’tal Frequency. (13.824 MHz ± 100 Hz).3. If the frequency is not 13.824 MHz ± 100Hz, adjust the frequency of CKM

executing the command “sendchar sfr xx xx (where xx is the value)” so thatthe reading of the frequency counter is 13.824000 MHz ± 5 Hz.

IC501, X501, C508, C509

(F)* Hookswitch Check with DC Characteristics

- 1. Connect Telephone Socket to Tel-simulator which is connected with 600 .2. Set line voltage to 48 V and line current to 40mA at off-hook condition of

normal telephone.3. Execute the command “hookoff”4. Confirm that the line current is 40 mA ± 5 mA.5. Execute the command “hookon”.6. Confirm that the line current is less than + 0.8 mA.

P101, D101, Q141, Q161, Q142, D141, R141~R145, R159~R169

(G) DTMF Generator Check - 1. Connect Telephone Socket to DTMF tester. (Load=600 )2. Link Handset and push dial key.3. Confirm DTMF character.4. Confirm that the high Group is -8.0 dBm ± 2.0 dB.5. Confirm that the low Group is -10.0 dBm ± 2.0 dB.

IC501, L101, C184, D141

checksum value80A9

program numberDER1ENex.)

40


(H)* Transmitted Power Confirmation

ANT1 Short ANT1 pattern to GND.1. Configure the DECT tester (CMD60) as follows;

<Setting>• Test mode: FP• Traffic Carrier: 5• Traffic Slot: 4• Mode: Loopback• PMID: 00000• RF LEVEL = -70 dBm.

2. Execute the command ”sendchar TST”.3. Execute the command “sendchar dmv 2 2”.4. Check that “Signalling Status” has been set to “Locked”, then press “ACCEPT

RFPI”.5. Initiate connection from Dect tester (“set up connect”)6. Execute the command “ANT1”.7. Confirm that the NTP value at ANT is 18.5 dBm ~ 25.0 dBm.

IC501, C810C811, C819 C820, C863C871, C872C873, C874 C895, L803

(I)* Modulation Check ANT1 Follow steps 1 to 6 of (H).7.Confirm that the B-Field Modulation is -350 ± 50/+350 ± 50 kHz/div using datatype Fig31.

Refer to (H)

(J)* Frequency Offset Check ANT1 Follow steps 1 to 6 of (H).7.Confirm that the frequency offset is < ±20 kHz.

Refer to (H)

(K)* Sensitivity Receiver Confirmation

ANT1 Follow steps 1 to 6 of (H).7.Set DECT tester power to -88 dBm.8.Confirm that the BER is < 1000 ppm.

Refer to (H)

(L)* Power RAMP Confirmation

ANT1 Follow steps 1 to 6 of (H).7.Confirm that Power RAMP is matching.

Refer to (H)

(M) Audio Check - 1. Link with Handset which is connected to Line Simulator.2. Set line voltage to 48 V and line current to 50 mA.3. Input -45 dBm (600 )/1 kHz to MIC of Handset. Measure the Level at Line I/F

and distortion level.4. Confirm that the level is -3 dBm ± 5 dB and that the distortion level is < 5 % at

TEL Line (600 Load).5. Input -20 dBm (600 )/1 kHz to Line I/F. Measure the Level at Receiver of

Handset and distortion level (Receive volume set to second position fromminimum).

6. Confirm that the level is -29 dBm ± 4 dB and that the distortion level is < 5 %at Receiver (34 Load).

IC501, SA101, P101, D101, Q141, Q142, Q161, Q171, R141, R142, R144, R145, D141, L101, C184, R164, R177, C173, R171, R172, R175, R176,

R178 (N) Charging Check - 1. Connect Charge Contact 12 /2 W resistor between charge+ and charge-.

2. Measure and confirm voltage across the resistor is 3.9 V ± 0.4 V.R371, R372, D362, C351

(O) TAM Operation Confirmation

- 1. TAM Confirmation (Execute the command "sendchar VPI").2. Confirm the returned Value (Value is "DER7EA 00”).

IC501, IC601, C601

Items Check Point


41


9.3. Troubleshooting by Symptom (Handset)If your unit has below symptoms, follow the instructions in remedy column. Remedies depend on whether you have DECT tester(*1) or not.

Note:(*1) A general repair is possible even if you don’t have the DECT tester because it is for confirming the levels, such as Acousticlevel in detail.(*2) Refer to Check Point (Handset) (P.42)

9.3.1. Check Point (Handset)Please follow the items below when BBIC or FLASH is replaced.

Note:After the measuring, suck up the solder of TP.*: The Setting Method of JIG (Handset) (P.54) is required beforehand.The connections of adjustment equipment are as shown in Adjustment Standard (Handset) (P.56).

Symptom Remedy (*2)You don’t have DECT Tester. You have DECT Tester.

(Model Number: CMD60)Battery strength is not indicated correctly by Battery icon. Check item (A) - (D), (E) - (G). Check item (A) - (D), (E) - (G).You cannot hear the caller’s voice. Check item (A) - (C), (H), (N). Check item (A) - (C), (H - (L)) - (N). You cannot use handset little away from base unit even if thehandset is within range of the base unit.

- Check item (I) - (M).

the Audio level is high or low. Check item (N). Check item (N).The SP-Phone level is high or low. Check item (O). Check item (O).

Items Check Point


(A)* 1.8 V Supply Adjustment 1.8V 1. Confirm that the voltage between test point 1.8V and GND is 1.8 V ± 0.02 V.2. Execute the command “VDD”, then check the current value.3. Adjust the 1.8V voltage of 1.8V executing command “VDD XX“(XX is the

value).

IC1, Q1, C44, R45, C22,

C41, C45, F1

(B)* BBIC Confirmation - 1. BBIC Confirmation (Execute the command “getchk”).2. Confirm the returned checksum value.

Connection of checksum value and program number is shown below.

IC1, X1, R61

(C)* VES Confirmation - 1. VES Confirmation (Execute the command "sendchar EPV").2. Confirm the returned Value. (Value for reference is written in

Software_Version_Table.xls).

IC1, IC4, C41

(D) Charge Control Check & Charge Current Monitor

Check

- 1. Apply 5.0 V between CHG(+) and CHG(-) with DC power supply and setcurrent limit to 150 mA.Confirm the indication of “charging” on LCD.

2. Confirm that the current limit LED of DC power supply is ON/OFF.Confirm it after waiting over 1 minute at least.

(If charge control cannot be confirmed by this procedure, please use battery tohandset power supply and try again.)

IC1, Q4 Q9, Q2, Q3, R2, R7, R8, R6,

R9, C19, R45

(E)* Charge Detection (OFF) Check

- 1. Stop supplying 5.0 V to CHG (+) and CHG (-).2. Confirm the indication of “charging” has been cleared.

IC1, Q4 Q9, Q2, Q3, R2, R7, R8, R6,

R9, C19, R45

checksum value program numberex.) 9235 DER2EP

42


(F)* Battery Monitor Check - 1. Apply 2.25 V between BATT+ and BATT-.2. Execute the command

sendchar PADsendchar LED 0sendchar CRX 0 1sendchar AD1It assumes that the return value is XX.a) XX: 70: No need to adjustb) XX: 66 ~ 6F: Need to adjustXX: 71 ~ 7A: Need to adjustWrite AD value of 2.25 V to VES.ex) read data: XX = 6A, write data: YY = 6Aread data: XX = 73, write data: YY = 73VES = 0009(Low Voltage) write “YY”Execute the command “wreeprom 00 09 01 YY”.VES = 000A(No Voltage) write “YY -C"Execute the command “wreeprom 00 0A 01 ZZ”.Note:

ZZ = YY - Cc) XX: 00 ~ 65: RejectXX: 7B ~ FF: Reject

IC1, R45

(G) Battery Low Confirmation

- 1. Apply 2.40 V between BATT+ and BATT-.2. Confirm that there is no flashing of Battery Icon.3. Apply 2.25 V ± 0.08 V between BATT+ and BATT-.4. Confirm that there is flashing of Battery Icon.

IC1, R45

(H)* BBIC Clock Adjustment CKM 1. Apply 2.6 V between BATT+ and BATT- with DC power.2. Input Command “sendchar sfr”, then you can confirm the current value.3. Check X’tal Frequency. (10.368 MHz ± 100 Hz).4. If the frequency is not 10.368 MHz ± 100 Hz, adjust the frequency of CKM

executing the command “sendchar sfr xx xx (where xx is the value)” so that thereading of the frequency counter is 10.368000 MHz ± 5 Hz.

Note:Clear the registered information for Base Unit before measurement, because theFrequency will not possibly get stable due to the registered information.Pressing the button of "3" "5" "7" "#"clears the registration.Register to it on Base Unit after measurement.

IC1, X1, C47

(I)* Transmitted Power Confirmation

- Short Antenna pattern to GND.1. Configure the DECT tester (CMD60) as follows;

<Setting>• Test mode: PP• RFPI: 0102030405• Traffic Carrier: 5• Traffic Slot: 4• Mode: Loopback• RF LEVEL = -70 dBm• PACKET: PP32Z

2. Execute the command “sendchar TST 01 02 03 04 05".3. Initiate connection from DECT tester.4. Confirm that the NTP value at ANT is 19 dBm ~ 25 dBm.

IC1, C859, C860, C863,

C862

(J)* Modulation Check and Adjustment

- Follow steps 1 to 3 of (I).4.Confirm that the B-Field Modulation is -350 ± 50/+350 ± 50 kHz/div using datatype Fig 31.

Refer to (I)

(K)* Frequency Offset Confirmation

- Follow steps 1 to 3 of (I).4.Confirm that the frequency Offset is < ± 20 kHz.

Refer to (I)

(L)* Sensitivity Receiver Confirmation

- Follow steps 1 to 3 of (I).4.Set DECT tester power to -88 dBm.5.Confirm that the BER is < 1000 ppm.

Refer to (I)

(M)* Power RAMP Confirmation

- Follow steps 1 to 3 of (I).4.Confirm that Power RAMP is matching.

Refer to (I)

(N) Audio Check and Confirmation

- 1. Link to BASE which is connected to Line Simulator.2. Set line voltage to 48 V and line current to 50 mA.3. Input -45 dBm (600 )/1 kHz to MIC of Handset. Measure the Level at Line I/F

and distortion level.4. Confirm that the level is -2.5 dBm ± 5 dB and that the distortion level is < 5 %

at TEL Line (600 Load).5. Input -20 dBm (600 )/1 kHz to Line I/F. Measure the Level at Receiver of

Handset and distortion level (Receive volume set to second position fromminimum).

6. Confirm that the level is -15 dBm ± 4 dB and that the distortion level is < 5 % atReceiver (34 Load).

IC1, C12, C11, C13, MIC, R23, RA7, C70, C71,

RA4, C68, C69

Items Check Point


43


(O) SP phone Audio Check and Confirmation

- 1. Link to Base which is connected to Line Simulator.2. Set line voltage to 48 V and line current to 50 mA.3. Set the handset off-hook using SP-Phone key.4. Input -30 dBm (600 )/1 KHz to Line I/F and measure Receiving level at SP+

and SP-.5. Confirm that the level is -10.0 dBm ± 3 dB and that the distortion level is < 5 %.

(vol = Max at SP (8 Load))

IC1, C78, C79, R76, R77, C98, C99

(P) Charge Pump 3.0 V Supply Confirmation

CP3V 1. Confirm that the voltage between testpoint CP3.0V and GND is 3.0 V ± 0.3 V. C30, C53, C29

(Q) Charge Pump CP4V Supply Confirmation

CP4V 1. Confirm that the voltage between testpoint CP4V and GND is 4.0 V ± 0.3 V.(Power is supplied when LED in on)

C52, C55, C30, C29

Items Check Point


44


10 Disassembly and Assembly Instructions

10.1. Disassembly Instructions

10.1.1. Base Unit

Remove the 4 screws to removethe cabinet cover.

Remove the solders.

4 Screws

Solders

45


Remove screw to removethe jack holder and the charge case.

Flip the Main P. C. Board and unsolder to remove the Main P. C. Board

Remove 3 screws.Remove the Operational P. C. Board

Screw

Main P. C. Board

Jack Holder

Solder

Operational P. C. Board

Screw

46


10.1.2. Handset

Cabinet body

Cabinet cover

Cabinet cover

Screw

Solders

Main P.C. board

Remove the 2 screws.

Insert a plastic card. (Ex. Used SIM card etc.) between the cabinet body and the cabinet cover, then pull it along the gap to open the cabinet.

Likewise, open the otherside of the cabinet.

Remove the cabinet cover by pushing it upward.

Remove the solders.

Remove the solders to removethe battery terminals.

Remove the screw to remove the Main P. C. board.

2 screws

Solders

Battery terminals

47


10.1.3. Charger Unit

Remove the solders to removethe 2 charge terminals.

Remove the cabinet cover.

Cabinet Cover

Solders

Charge Terminals

48


10.2. How to Replace the Handset LCDNote:

The illustrations are simplified in this page.They may differ from the actual product.

Peel off the FFC (Flexible Flat Cable) from the LCD, in the direction of the arrow. Take care to ensure that the foil on the P.C. board is not damaged.

Fit the heatseal of a new LCD.

Rubber of Soldering Iron(Part No. PQZZ430PRB)

Tip of Soldering Iron(Part No. PQZZ430PIR)

Heatweld with the tip of the soldering iron about 5 to 8 seconds (in case of 60W soldering iron).

New LCD

0.2 mm

0.2 mm

P. C. board

If interval tolerance between center linesis less than 0.2 mm, it is o.k.

Horizontal IntervalTolerance

Vertical IntervalTolerance

OK

NG

NG

NG

(Horizontal interval tolerance is more than 0.2 mm.)

(Vertical interval tolerance is more than 0.2 mm.)

(Inclined)

49


11 Measurements and AdjustmentsThis chapter explains the measuring equipment, the JIG connection, and the PC setting method necessary for the measurement in Troubleshooting Guide (P.27)

11.1. Equipment Required• Digital multi-meter (DMM): it must be able to measure voltage and current.• Oscilloscope.• Frequency counter: It must be precise enough to measure intervals of 1 Hz (precision; ±4 ppm)

Hewlett Packard, 53131A is recommended.• DECT tester: Rohde & Schwarz, CMD 60 is recommended.

This equipment may be useful in order to precisely adjust like a mass production.

11.2. The Setting Method of JIG

<Preparation>• Serial JIG cable: PQZZ1CD300E*• PC which runs in DOS mode• Batch file CD-ROM for setting: Refer to parts list of Fixtures and Tools (P.91).

50


Note:*: If you have the JIG Cable for TCD500 series (PQZZ1CD505E), change the following values of resistance. Then you can useit as a JIG Cable for both TCD300 and TCD500 series. (It is an upper compatible JIG Cable.)

11.2.1. Connections (Base Unit) Connect the AC adaptor.

Connect the JIG Cable GND (black).

Connect the JIG Cable RX (red) and TX (yellow).

Note:*: COM port names may vary depending on what your PC calls it.

Resistor Old value (k) New value (k)R2 22 3.3R3 22 3.3R4 22 4.7R7 4.7 10

1

2

3

Base unit P. C. board

To Serial Port(COM port 1*)

PC

URXGND

UTX

UTX (yellow)

3

2

3

GND (black)

URX (red)

JIG Cable

AC adaptor

1

DC JACK

51


11.2.2. How to install Batch file into P.C.

Note:“*****” varies depending on the country or models.

11.2.3. CommandsSee the table below for frequently used commands.

Command name Function Examplerdeeprom Read the data of EEPROM Type “rdeeprom 00 00 FF”, and the data from address

“00 00” to “FF” is read out.readid Read ID (RFPI) Type “readid”, and the registered ID is read out.writeid Write ID (RFPI) Type “writeid 00 18 E0 0E 98”, and the ID “0018 E0 0E

98” is written.hookoff Off-hook mode on Base Type “hookoff”.hookon On-hook mode on Base Type “hookon”.getchk Read checksum Type “getchk”.wreeprom Write the data of EEPROM Type “wreeprom 01 23 45”. “01 23” is address and “45”

is data to be written.epc Write memory size Type “epc”. idwrite Write ID Type “idwrite”. Then enter ID code.

1. Insert the Batch file CD-ROM into CD-ROM drive and copy PNZZTG**** folder to your PC (example: D drive).

2. Open an MS-DOS mode window.

3. At the DOS prompt, type "D:" (for example) to select the drive, then press the Enter key.

4. Type "CD PNZZTG****", then press the Enter key.

5. Type "SET_COM=X", then press the Enter key (X: COM port number used for the serial connection on your PC).

6. Type "READID", then press the Enter key. If any error messages appear, change the port number or check the cable connection. If any value appear, go to next step.

7. Type "DOSKEY", then press the Enter key.

<Example>

C: Documents and Settings>D: D: >CD PNZZTG****D: PNZZTG**** >SET_COM=X D: PNZZTG****>READID00 52 4F A8 A8D: PNZZTG****>DOSKEYD: PNZZTG****>

<Example: error happens>

C: Documents and Settings>D: D: >CD PNZZTG****D: PNZZTG**** >SET_COM=X D: PNZZTG****>READID

CreateFile errorERROR 10: Can't open serial portD: PNZZTG ****>

<Example for Windows>

On your computer, click [Start], select Programs (All Programs for Windows XP/Windows Server 2003), then click MS-DOS Prompt. (for Windows 95/Windows 98)OrAccessories-MS-DOS Prompt. (for Windows Me)OrCommand Prompt. (for Windows NT 4.0)OrAccessories-Command Prompt. (for Windows 2000/Windows XP/Windows Server 2003)

52


11.3. Adjustment Standard (Base Unit)When connecting the simulator equipment for checking, please refer to below.

11.3.1. Bottom View

Note:(*1) is referred to No.2 of Check Table for RF part (P.35)(*2) is referred to Power Supply Circuit/Reset Circuit (P.11)

RTC

K

RSTN

VCC

A

DC

M

DC

P

C601

+3.0V

C611

CH

G+

CH

G-

F301

ANT1

UR

X1

UTX1

ANt1_Short

TCK

Q111

TDI

TDO

C475

C476

C477

C478

SW1

STM/C

KM/P15

Q140

IC601

Q142

IC611

Q351

Q352 Q353

R103

R104

R111

R112

R113

R114

R121

R122

R12

3

R124

D472

D473

R510

R511

VBAT

R321R322

C103

C104

R142

R144

R145

R148

R149

C110

C112

C113

R151R

152

R924

R925

VDD

C

TMS

R158

L1R

L1T

C120

R351

C121

R352

C122

R354

R355

R164

R165

C513

C321

C515

C902R

A611

R371

C141

R372

R373

C143

C152

C351

C167

D113

GN

D1

VREF

L401

L402

IC302

ANT1_S-G

ND

D362

C479

Q144

R153

R154

R801

TEL

YLW

BRW

DC

GRY

PUR

ORG

PNLB

2423

Z*KX

-TG

D3x

xPb

F

ANT1 Short

FrequencyCounter

CKM

GND(E)

DECT TesterCTS60

(H)(I)(J)(K)(L)

DC

DC-

DC+

Jig

RX

TX

(B)(C)(D)(E)(F)(H)(O)

PC

GN

D

TEL

Dig

ital

Vol

t Met

er

12 2W

CHG-

CHG+(N)

+3.0V (B)

VBAT (A)

53


11.4. The Setting Method of JIG (Handset)This section explains the PC setting to use command required in Check Point (Handset)(P.42).

<Preparation>• Serial JIG cable: PQZZ1CD300E*• PC which runs in DOS mode• Batch file CD-ROM for setting: Refer to parts list of Fixtures and Tools (P.91).

Note:*: If you have the JIG Cable for TCD500 series (PQZZ1CD505E), change the following values of resistance. Then you can useit as a JIG Cable for both TCD300 and TCD500 series. (It is an upper compatible JIG Cable.)

11.4.1. Connections Connect the DC Power or Battery to BATT+ and BATT-.

Connect the JIG cable GND (black) to GND.

Connect the JIG cable UTX (yellow) to UTX and URX (red) to URX.

Note:*: COM port names may vary depending on what your PC calls it.

Resistor Old value (k) New value (k)R2 22 3.3R3 22 3.3R4 22 4.7R7 4.7 10

1

2

3

2 GND (black)

3

To Serial Port(com port 1*)

JIG Cable

PC

URX

(yellow)3 UTX

(red)

GND

UTXURX

DC Poweror Battery

1 BATT-

BATT+

54


11.4.2. How to install Batch file into P.C.

Note:• “*****” varies depending on the country or models.

11.4.3. CommandsSee the table below for frequently used commands.

Command name Function Examplerdeeprom Read the data of EEPROM Type “rdeeprom 00 00 FF”, and the data from address

“00 00” to “FF” is read out.readid Read ID (RFPI) Type “readid”, and the registered ID is read out.writeid Write ID (RFPI) Type “writeid 00 18 E0 0E 98”, and the ID “0018 E0 0E

98” is written.getchk Read checksum Type “getchk”.wreeprom Write the data of EEPROM Type “wreeprom 01 23 45”. “01 23” is address and “45”

is data to be written.

1. Insert the Batch file CD-ROM into CD-ROM drive and copy PNZZTG***** folder to your PC (example: D drive).

2. Open an MS-DOS mode window.

3. At the DOS prompt, type "D:" (for example) to select the drive, then press the Enter key.

4. Type "CD PNZZTG*****", then press the Enter key.

5. Type "SET RTX_COM=X", then press the Enter key (X: COM port number used for the serial connection on your PC).

6. Type "READID", then press the Enter key. If any error messages appear, change the port number or check the cable connection. If any value appear, go to next step.

7. Type "DOSKEY", then press the Enter key.

<Example>

C: Documents and Settings>D: D: >CD PNZZTG*****D: PNZZTG***** >SET RTX_COM=X D: PNZZTG*****>READID00 52 4F A8 A8D: PNZZTG*****>DOSKEYD: PNZZTG*****>

<Example: Error happens>

C: Documents and Settings>D: D: >CD PNZZTG*****D: PNZZTG***** >SET RTX_COM=X D: PNZZTG*****>READID

CreateFile errorERROR 10: Can't open serial portD: PNZZTG*****>

<Example for Windows>

On your computer, click [Start], select Programs (All Programs for Windows XP/Windows Server 2003), then click MS-DOS Prompt. (for Windows 95/Windows 98)OrAccessories-MS-DOS Prompt. (for Windows Me)OrCommand Prompt. (for Windows NT 4.0)OrAccessories-Command Prompt. (for Windows 2000/Windows XP/Windows Server 2003)

55


11.5. Adjustment Standard (Handset)When connecting the simulator equipment for checking, please refer to below.

11.5.1. Component View

Note:(A) - (R) is referred to Check Point (Handset) (P.42)

BA

TT+

BA

TT-C

38

AN

T-Short-G

ND

CH

G+ C

HG

-

Q 1 0

Q11

Q 1 2

C68

C69

C70

C71

RA

2

C72

RA

3

C73

C78

C79

C81

C91C

92

C93

C1

C 5

C6

UR

XS

UTX

S

UR

X

F1

RE

CE

IVE

R

AN

T1_TP

UTX

BA

TT+_

AN

T-Short

BA

TT-_

VB

AT

C113

CP

3V

R 1 0

R11

R12R

13

R15

CP

4V

R20

Q 2

Q3

Q4

Q6

Q 9

R2

R6

R7

R8

R9

R45

R48

R62

R63

SP

EA

KE

R

PO

WE

R

R76

R77

CK

M

1.8V

C15

GN

D

C19

ICIC1

R80

P N L B 2 4 3 2 Z *K X - T G D A 3 0 x x

P b F

R E F - 2

A

GND

VBAT

DC

VO

LT ME

TER

DC

PO

WE

R S

UP

PLY

2.6V

Frequency Counter

* Send com

mand "S

FR", then

the frequency output on this TP.

When m

easure RF, short "A

NT-S

hort" and "AN

T-Short-G

ND

" with copper w

ire which length 5m

m.

After m

easure do not forget to remove the w

ire.

40

Oscilloscope

AF V

OLT M

ETE

R

415 H

15 H

100100

Oscilloscope

AF V

OLT M

ETE

R

Spectrum

Analyzer

MIC

LoadMIC+

+

+

MIC- 47

47

OS

C1.1 kH

z

DC

VO

LT ME

TER

(N)

(Q)

(A)

(P)

(O)

Jig

PC

GND

TXRX

(B), (C), (F), (H)

(N)

(F), (G)

(H)

(I), (J), (K), (M)

DC VOLT METER

DC POWER SUPPLY (D), (E)

5.0V

-+

56


11.6. Things to Do after Replacing IC or X'talIf repairing or replacing EEPROM and X'tal, it is necessary to download the required data such as Programming data or adjustmentdata, etc. in memory.The set doesn't operate if it is not executed.

11.6.1. How to download the data

11.6.1.1. Base UnitFirst, operate the PC setting according to The Setting Method of JIG(P.50).Then download the appropriate data according to the following procedures.

Note:(*1) WW: country code, XXX_YYY: revision number“XXX_YYY” vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The SettingMethod of JIG (P.50).

Items How to download/Required adjustmentEEPROM (IC611) Adjusted parameter data is stored in memory.

(country version batch file, default batch file,etc.)

1) Change the address “0001” of EEPROM to “AA” to downloadthe data.2) Default batch file: Execute the command “default.bat”.3) Country version batch file: Execute the command “TGD32x_EUEX_WW_RevXXX_YYY.bat” (*1)4) Clock adjustment

X'tal (X501) System clock Clock adjustment data is in EEPROM, adjust the data againafter replacing it.1) Apply 5.5V between DCP ad DCM with DC power.2) Input Command "sendchar sfr", then you can confirm thecurrent value.3) Check X'tal Frequency.(13.824 MHz ± 100 Hz).4) If the frequency is not 13.824 MHz ± 100 Hz, adjust thefrequency of CLK executing the command "sendchar sfr xx xx(where xx is the value)" so that the reading of the frequencycounter is 13.824000 MHz ± 5 Hz.

57


11.6.1.2. HandsetFirst, operate the PC setting according to The Setting Method of JIG (P.50).Then download the appropriate data according to the following procedures.

Note:(*2) WW: country code, XXX_YYY: revision number“XXX_YYY” vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The SettingMethod of JIG (P.50).

Items How to download/Required adjustmentFLASH(IC4) Adjusted parameter data is

stored in memory. (country version batch file, default batch file,ect)

1) Please be sure to execute the following steps if you have replaced the FLASH IC(IC4).

1. Update BBIC. Refer How to update the BBIC.2. Detach the JIG cable, then disconnect the battery.3. Insert battery.4. Connect the JIG cable again, and execute the command "getchk", then con-

firm the checksum value is correct.• If the downloading failes, start again from step 1.

5. Check DECT ID written on Plastic bag of FLASH (IC4).6. Execute the command "idw xx xx xx xx xx". xx xx xx xx xx: use DECT ID in

Step 5.7. Execute the command "epw 00 01 01 AA".8. Default bath file: Execute the command "default.bat"9. Common batch file: Execute the command

"TGDA30_EX_DEF_RevXXX_YYY.bat" (*2). 10. Country version batch file: Execute the command

"TGDA30_EX_WW_RevXXX_YYY.bat” (*2). 11. Confirm DECT ID written in the label pated plastic bag of FLASH rom.12. Write ID(PFPI): Write DECT ID.

• Execute the command "IDWRITE". Refer to 11.2.3 Commands (P.52)2) Clock adjustment.3) Battery low confirmation as below.

Battery Low Confirmation - 1) Apply 2.40 V between BATT+ and BATT-.2) Confirm that there is no flashing of Battery lcon.3) Apply 2.25 V ± 0.08 V between BATT+ and BATT-.4) Confirm that there is flashing of Battery lcon. If need to adjust Battery low detection, please proceed as below.5) Apply 2.25V between BATT+ and BATT- Execute the command sendchar PAD sendchar LED 0 sendchar CRX 0 1 sendchar AD1 It assumes that the return value is XX*. a) 6c XX 71: No need to adjust b) XX: 6A ~ 6B: Need to adjust Execute the command wreeprom 00 09 01 XX wreeprom 00 0A 01 ZZ ZZ = XX-1D (hex) Note: * : If XX is “00” to “69” or “75” to “FF” it may not be able to adjust properly. Please check power circuit.

Clock Adjustment (X1) CLK 1) Apply 2.6 V between BATT+ and BATT- with DC power.2) Input Command “sendchar sfr“, then you can confirm the current value.3) Check X’tal Frequency. (10.368 MHz ± 100 Hz).4) If the frequency is not 10.368 MHz ± 100 Hz, adjust the frequency of CLK execute in the command “sendchar sfr xx xx (where xx is the value)“ so that the reading of the frequency counter is 10.368000 MHz ± 5 Hz.

58


11.6.1.2.1. How to update the BBIC.• Execute COM communicator.exe

1. Initialize COM port.(Only once at first.)Select “Setting” “Serial port” “Initial settings” “OK”.

2.Select serial port COM number.Select “Setting” “Serial port” “Setting” “OK”.Fill up the “COM Options” “OK”.

Note:Once download is successful for a PC, this step is unnecessary next time to the PC.

Setting

Serial Port Setting

OK Cancel

(1) (2)

(3)

Setting

Serial Port Initial Setting

OK Cancel

59


• Execute COM communicator.exe again <<Write program>>1. Select “Addon” “ProgramLoader”.

2. Select "Setting" "Config".Fill up the “ConfigSettings”.

Note:(2) Select Baud Rate as 57600. If write error happens, select slower Baud Rate (example: 19200).

3. Select download file.

(1)

(2)

(3)

(1)

(2)

60


4. Start download.(1). Connect Unit and 3wire jig.(2). Confirm "Turn on power to target and press download." display.(3). Power off the unit, then power on.(4). Press "Download" button again.

5. Finish download.Completed dialog means "Download finished successfully!." It takes more than 20 minutes to download

( It depends on baud rate). If error message is displayed, proceed from step 3 again.

6. Continuous download.

Write next unit's software with proceeding from step 3 to Step 5.

(2)

(4)

61


11.7. RF Specification

11.7.1. Base Unit

*: Refer to Check Point (Base Unit) (P.40)

11.7.2. Handset

**: Refer to Check Point (Handset) (P.42)

11.8. How to Check the Handset Speaker or Receiver1. Prepare the digital voltmeter, and set the selector knob to ohm meter.2. Put the probes at the speaker terminals as shown below.

Item Value Refer to -. *TX Power 18.5 dBm ~ 25 dBm Check Point (Base Unit) (H)Modulation -350 ± 50/+350 ± 50 kHz/div Check Point (Base Unit) (I)Frequency Offset <±20 kHz Check Point (Base Unit) (J)RX Sensitivity < 1000 ppm Check Point (Base Unit) (K)Power RAMP Power RAMP is matching Check Point (Base Unit) (L)

Item Value Refer to -. **TX Power 19 dBm ~ 25 dBm Check Point (Handset) (I)Modulation -350 ± 50/+350 ± 50 kHz/div Check Point (Handset) (J)Frequency Offset <±20 kHz Check Point (Handset) (K)RX Sensitivity < 1000 ppm Check Point (Handset) (L)Power RAMP Power RAMP is matching Check Point (Handset) (M)

Handset speaker (receiver)

Digital Voltmeter

Is the value between(+) terminal and (–) terminal about 40 Ω?

RECEIVER:

Is the value between(+) terminal and (–) terminal about 8 Ω?

NG

NO

OK

YES

Replace the speaker (receiver).

SPEAKER:

62


12 Miscellaneous

12.1. How to Replace the Flat Package ICEven if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), asoldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.

12.1.1. Preparation• PbF (: Pb free) Solder• Soldering Iron

Tip Temperature of 700 F ± 20 F (370 C ± 10 C)Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone withless experience could overheat and damage the PCB foil.

• FluxRecommended Flux: Specific Gravity 0.82.Type RMA (lower residue, non-cleaning type)

Note: See About Lead Free Solder (Pbf: Pb free) (P.5)

12.1.2. How to Remove the IC1. Put plenty of solder on the IC pins so that the pins can be completely covered.

Note:If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.

2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.

3. While the solder melts, remove it together with the IC pins.

When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder is

left at the joint on the board, the new IC will not be attached properly.

63


12.1.3. How to Install the IC1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.

*Check the accuracy of the IC setting with the corresponding soldering foil.

2. Apply flux to all pins of the FLAT PACKAGE IC.

3. Solder the pins, sliding the soldering iron in the direction of the arrow.

12.1.4. How to Remove a Solder Bridge1. Lightly resolder the bridged portion.2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.

64


12.2. How to Replace the Shield Case

12.2.1. Preparation• PbF (: Pb free) Solder• Soldering Iron

Tip Temperature of 700 F ± 20 F (370 C ± 10 C)Note:We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less experience could overheat and damage the PCB foil.

• Hot Air Desoldering ToolTemperature: 608 F ± 68 F (320 C ± 20 C)

12.2.2. Caution• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.

12.2.3. How to Remove the Shield CaseNote:

If you don’t have special tools (ex. Hot air disordering tool), conduct the following operations.

1. Cut the case along perforation.

2. Remove the cut part.

3. Cut the four corners along perforation.

4. Remove the reminds by melting solder.

65


12.2.4. How to Install the Shield CaseNote:

• If you don’t have special tools (ex. Hot air disordering tool), conduct the following operations.• Shield case’s No. : PNMC1091Z

1. Put the shield case.

2. Solder the surroundings.

66


12.3. Terminal Guide of the ICs, Transistors and Diodes

12.3.1. Base Unit

12.3.2. Handset

B3AAB0000347

Cathode

Anode

1

88 67

23 4422

66

45

(Reverse View)

DA2J10100L

C

B

E

2SC6054JSL, B1ABDM000001B1ABCE000009, DRC9113Z0L

B1ADNB000003

14

85

PNWIBD320ALHPNWIAGD320GH

C2HBCY000157

CathodeAnode

B0ECKM000008 B0EDER000009

CE

B

B1ACGP000008

32

1

4

C0DBEYY00102

B0BC02000015

Anode

Cathode

Cathode

Anode

BC

C

E

DSC7003S0L

Anode

Cathode

B3AFB0000370

C

B

E

14

85

PNWIADA30EXR

B1ADGE000012, UNR9216J0LDSA900100L, B1ABGE000011 2SC6054JSL, B1ADNB000003 B3ACB0000190

(Reverse View)

Anode

Cathode

C1CB00003837

1

(Reverse View)

1

6788

23 4422

66

45

89 pin(GND)

67


13 Schematic Diagram

13.1. For Schematic Diagram

13.1.1. Base Unit (Base Unit (Main))Notes:

1. DC voltage measurements are taken with voltmeter from the negative voltage line.

2. The schematic diagrams may be modified at any time with the development of new technology.

13.1.2. Handset (Handset (Main))Notes:

1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.2. The schematic diagrams may be modified at any time with the development of new technology.

Important Safety Notice:Components identified by mark have special characteristics important forsafety. When replacing any of these components, use only the manufacture'sspecified parts.

68


Memo

69


1)

2)

3)

4)

6)

8)

9)

10)11)12)13)

14)

15)

5)

7)

13.2. Base Unit (Main)

NC: No Components

* Start Monitor* When "SFR" command is executed, 13.824MHz frequency will be output.

1.2V

Beep Tone/Ringer Tone

(

(

(

(

(

(

(

((((

(

(

(

(

SH

OR

T

SH

OR

T

SH

OR

T

SH

OR

T

SHORT

SHORT

EE

P_S

CL

EE

P_S

DA

EE

P_W

P

JTA

G_T

DO

JTA

G_T

CK

JTA

G_T

MS

SP

I_D

IS

PI_

DO

SP

I_C

LK

SP

I_C

S

JTA

G_R

TC

K

JTA

G_T

DI

JTAG_RTCK

SP

I_D

IS

PI_

DO

SP

I_C

LK

MSG_LED

SP

I_C

SJTAG_TDOJTAG_TDIJTAG_TCKJTAG_TMS

KEYS_E

ANS_LED

UR

X

UT

X

KEYIN3KEYIN2

KEYS_D

KE

YIN

3K

EY

IN2

KE

YIN

1

MS

G_L

ED

AN

S_L

ED

KEYIN1KEYS_C

C51

90.

1u

C516 0.1u

C52

00.

1u

C120

1000p

C50

810

p

VBAT

VDDC

C517 0.1u

C518 0.1u

C47

8N

C

*C47

710

pF

RSTN

RXn

TXpTXn

RXp

GND

STM/CKM/P15

+3.0V

RT

CK

C50

912

p

X501

13.824M

+3.0V

+5.5V

C33

1

NC

C18

1

NC

KEYIN2

LED_VDD

KEYIN1

KEYS_DKEYIN3

C65

6N

C

KEYS_C

MSG_LED

KEYS_E

*C601 0.1u

+3.0V

*C16

6

0.1

*R51

1

NC

C17

80.

1u

Q171

VBAT

D47

2N

C

D47

3N

C

L502

100n

C51

5

1u

*Q652

C51

110

u

R17

6

1k

C51

01u

C65

7N

C

URXUTXGND

R17

1

220

R172 680k

R17

5

3.9k

C173

0.027u

C175

560p

R331

68kF

R33

2

33k

F

GND

SH

OR

T2

TXn

GND

ANt1_Short

VBAT

SH

OR

T5

C819

10p

L803

2.7n

GND

ANT1_S-GND

RXp

C872

1.3p

C82

0

1.5p

TXp

GND

C81

1

10p

RXn

SH

OR

T6

GND

C8952p

GND

GND

C8732p C

863

1.5p

SH

OR

T3

ANT1

12

C87

4

15p

SHORT1

GND

GND

GND

GND

SHORT4

R50

210

k

R50

310

k

R50

410

k

R50

610

k VDDC

C17

61u

TDI

TMS

TCK

TDO

ANS_LED

*Q651

URX1UTX1

L401 NC

L402 NC

C47

6N

C

*C47

510

pF

SP

PS

PN

C65

2N

CC

653

NC

C65

4N

C

C65

1N

C

C65

5N

C

*R651 1.2k

*R652 1.2k

R92

5N

C

RA

502

100

18

27

36

45

C50

72.

2u

C51

32.

2u

+3.0V

R92

4N

C

*SW1NC

12

GND1

*C47

910

pF

IC501

25H

SM

IP

26M

PW

R

27H

SS

PO

UTP

28LO

UT

29S

PO

UTN

30V

CC

PA

31S

PO

UTP

32P

WM

1

33P

WM

0

47 RXn

48 GND_RF

49 TRSW_p

50 ANT_n

51 ATST_n

52 ATST_p

53 TEST

54 RSTN

55 NC

76V

DD

IO1

77G

PIO

[9]

78G

PIO

[10]

79G

PIO

[11]

80G

PIO

[12]

81G

PIO

[13]

82G

PIO

[14]

83G

PIO

[15]

84G

PIO

[16]

23M

IP

24H

SM

IN

34D

CIN

S

35X

OU

T

36X

IN

45 TXp

46 RXp

56 VCC_VCO

57 GPIO[27]

58 VDDUSB74

GP

IO[7

]75

GP

IO[8

]

85G

PIO

[17]

86V

DD

IO2

87G

PIO

[18]

37V

BA

T_A

PU

59 DM_USB/GPI28

88G

PIO

[19]

GN

D

38V

DD

_AP

U

39V

CC

_IF

40V

DD

_IF

41V

CC

_FE

42A

NT

43TR

SW

_n

44TX

n

60 DP_USB/GPI29

61 VDDC1

62 JTAG_TDO

63 JTAG_TDI

64 JTAG_TCK

65 JTAG_TMS

66 JTAG_RTCK

67G

PIO

[0]/S

CL_

IIC68

GP

IO[1

]/SD

A_I

IC69

GP

IO[2

]70

GP

IO[3

]71

GP

IO[4

]72

GP

IO[5

]73

GP

IO[6

]

*IC601 6M_FLASH1 *CS

2 SO/SIO1

6SCLK

7NC/SIO3

3 *WP/SIO2

8VCC

4 GND 5SI/SIO0

C81

0

1.1p

C8711.1p

GND

R80

1N

C

TO RF BLOCK

1

9

MODELH=Dj

ANT-Pattern

open-stubSLW=2.9mmL=3.8mm

W 0.2mmL 3.8mm1st layer

SLW=0.3mmL=6.95mm

MSLWm=0.4mmLm=10mm

W 0.15mmL 6.2mm1st layer

MSLW=0.25L=2mm

MSLW=0.25L=2mm

Tx-balunSLW=0.3L=40mm

open-stubSLW=2.2mmL=5.0mm Pre-matching

SLW=0.3mmL=6.5mm

SLW=0.2mmL=20mm

SLW=0.3mmL=12.45mm


RF Block

70


NC: No ComponentsKX-TGD320AL SCHEMATIC DIAGRAM (Base Unit (Main))

DC Monitor

Caller ID

Bell Detection

!

3.0V

(1)

(2)

(3)

(4)

(6)

(8)

(9)

(10)(11)(12)(13)

(14)

(15)

(5)

(7)

HOOKBELL

PU

LSE

_MU

TE

BELL

EE

P_S

CL

EE

P_W

P

EE

P_S

DA

KEYS_C

HO

OK

PULSE_MUTE

NL_CID

KEYS_DKEYS_E

URXUTX

+5.5V

HAK_CL1

C5010.1u

R121 390kR122 390k

+3.0V

+3.0V

DCP

DCM

CHARGE-

CHARGE+

VCCA

VCCA

C35

1

1.0u

C504 1uC521 1u

R501

10

+3.0V

VDDC

L501

100n

+3.0V

L2R

L1R

L1T

L2T

*R12

3

NC

*R12

4

10

*Q140

R141

100k

R14

2

2.7k

*R14

4

C14

3

C14

2

0.01

u

Q161

C15

20.

01u

*C16

4

R11

7

100k

R1155.6M

R1165.6MR

118

100k

D36

2 CHG+

C11

5

100n

C11

6

100n

*Q141

Q111

D13

3D

132

D11

3

C16

110

u

*C14

1

R114

68k

*R14

8

10k

*R149

680

*R16

2

R16

5

27k

C11

3

0.01

u

*R15

9461R*

k1771R

R11

3

22k

R111

1M

R112

47k

*C16

7R

158

4.7k

+3.0V

RA6113.3k

12345 6 7 8

C611 0.1u

RA

151

1k

1 234

C502

10u

C50

3

10u

C505

10u

C101 680p

C102 680p

C121 680pC122 680p

D101

1

4 3

2

C506 1u

C32

11u

+5.5V

IC3023IN2 OUT1

1ADJ

4 OUT2

VBAT

C34

20.

1u

VBAT

R37

1

1

R37

2

1

C10

3N

C

*C10

4

NC

*R10

3

R16

3

39(0

.5W

)

GAP

1

2

+5.5V

C110 0.1u

C112 0.1u

*R10

4

R16

7

NC

VREF

ZA11 2

6

79

11

3 4

810

521

*Q352

*Q351

*R35

1

33k

453R*

+5.5V

*Q353*R

352

*R35

5

*D901

*R37

3

C90

2 NC

*D14

2

SA

102

NC

21*S

A10

1 21

P101

R32

2

100

F

R15

1

100k

R15

2

130k

D14

3N

C

L101

27n

RA501 NC

1 42 3

*C34

3

241Q

481C

u1

*D14

1

R13

1N

CR

133

NC

C13

2N

C

R510 NC

F301

3A

*R154

NC

*R15

3

NC

*Q144

NC

3GPIO[22]4GPIO[23]5GPIO[24]6GPIO[25]7GPIO[26]8VDDC29COREOUT10VBAT11DOUBCAPN1

1GPIO[20]2GPIO[21]

12DOUBCAPN13DOUBCAPP14DOUBCAPP115DOUBOUT

89

16DCIN0/LIN017DCIN118DCIN219DCIN3/LIN120VREF21VCCA22MIN

*IC611128K EEPROM

1 A0

2 A1

6SCL

7WP

3 A2

8VCC

4 GND 5SDA

*R16

9

509R* NC

*C34

1

1000

u

*R32

1

200

*R14

5

*C17

1

REFERENCE

7XX : FOR DK/BT

3XX : POWER, CHARGE

5XX : BBIC6XX : FLASH, EEPROM, KEY, LCD

4XX : MIC, SP

1XX : TEL LINE

8XX : RF

Supply from HS

IC501

2.2k

NC

NC

NC

6.8k

10k

680

680

1000

*R160

NC

N

C

. NC

47k

NC

NC

1k

0.00

22

0.03

3u

180

2.2k

71


13.3. Handset (Main)

13.3.1. Main P. C. Board

NC: No ComponentsKX-TGDA30AZ SCHEMATIC DIAGRAM (Handset_Main)

POWER

BELL_LED2CHG_CTRLCHG_DETPOWER

CHG_CTRLCHG_DET

BATTERY_ONCHG+

KIN_3KIN_2

LCD_RESETLCD_SCLLCD_SID

LCD_LED

BE

LL_L

ED

1B

AT

TE

RY

_ON

ST

B_B

ST

B_E

ST

B_A

KE

Y_L

ED

MIC

-

CH

G+

SO

Cp

SO

Cn

SOCp

SOCn

MIC+

MIC

+M

IC-

STB_DSTB_C

LCD_CD

LCD_CS

KIN_5KIN_4KIN_1

KIN_5

KIN_4

KIN_3

KIN_2

STB_ESTB_DSTB_CSTB_B

BELL_LED1

BELL_LED2

KEY_LED

SP+

SP

-

SP

+S

P-

LCD_RESET

LCD_CD

LCD_SID

LCD_CS

LCD_SCL

RC

V+

RC

V-

LCD_LED

RC

V+

RC

V-

STB_A

KIN_1

GND

CARBON_CL1

C73D10p

C72D10p

GND

GND

C15J39p

VBAT

GND

GND

GND

GND

C6K0.1u

MIC AP1

R7820

R930k

Q3

R230k

C19K1000p

R610k

C78K2200p

GND

C79K2200p

GND

R771

R761

GND

HAK_CL1

GND GNDGND

C81NC

GND

CP4V

C38NC

*R131k

*R12220k

*R11680

*Q11

GND

GND

*Q10@NC

Q6

GND

R15

1.5k

CP4V

LCD

12G

ND

LCD

8V

DD

LCD

10V

SS

LCD

7S

I

LCD

2O

TP_P

WR

/XV

0

C92K1u

LCD

9V

DD

A

C93K1u

GND

LCD

1G

ND

C9116V K1u

LCD

11V

0

LCD

6S

CL

LCD

5A

0

LCD

4R

ES

LCD

3C

S1

C5K0.1u

SOFT_C

RIGHT

1

SHARP

456

2

7

SP

PU3

8

AST

DOWN

LEFT

TALK

SOFT_A

0

9

ECO/R

C1

220u6.3V

GND

*R101.0

SPEAKER+

-

CHG+

Q9

1.8V

BATT+

BATT-

UTXURXGND

VBAT

*Q12

Q2

Q4

GNDANT-Short-GND

ANT-Short

ANT1_TP

GND

R48390

R8 4.3(3216)

LED20

R450.1

C70J68p

C71J68p

CHG+

CHG-

R62 NC

R63 NCUTXSURXS

C113D10p

INT

OFF

VBAT

POWER

BATT+_

BATT-_

GND

CP4V

CP3V

*LED11 NCB

*LED12 NCB C69D10p

GND GND

C68D10p

CKM

1.8V

SH

OR

T1

SHORT2

RA4NC

*LE

D8

NC

*LE

D7

*LE

D6

*LE

D4

*LE

D3

*LE

D2

*LE

D5

*LE

D1

*R20 30

k

F1 2.5A

R80

NC

C94NC

1.8V

CP4V

CP3V

CP3V

MODULE

18SP+19GND_520URX

48G

ND

_18

49G

ND

_4

50B

ELL

_LE

D2

51G

ND

_19

66 KIN_5

67 KIN_4

68 KIN_1

69

GND_24

3B

ATT

ER

Y_O

N

2B

ELL

_LE

D1

1G

ND

_1

4S

TB_B

5S

TB_E

6S

TB_A

7K

EY

_LE

D8

MIC

h9

MIC

-10

GN

D_2

11G

ND

_312

RE

C+

13R

EC

-14

CH

G+

15B

AT-

/SO

Cp

16S

OC

n

21UTX22LCD_LED23CP4V24GND_625GND_7261.8V27GND_828LCD_SID29LCD_SCL30LCD_RESET31GND_9

44G

ND

_16

45G

ND

_17

46B

AT+

/VB

AT2

47LE

D1

40C

HG

_CTR

L

41G

ND

_13

42G

ND

_14

43G

ND

_15

36A

NT

37G

ND

_12

38P

OW

ER

39C

HG

_DE

T

62 GND_23

63 LCD_CD

64 LCD_CS

65 P0_7

58 BAT+/VBAT1

59 CP3V

60 GND_21

61 GND_22

57 GNDA

70

GND_25

71

GND_26

55 GND_20

56 MIC+

17S

P-

32KIN_233KIN_334GND_10

35G

ND

_11

54 STB_C

52 P2_3

53 STB_D

RECEIVER

For TGD

+

-

For TGK

1+

2-

C101NC

C102NC

C103NC

GND

GND

GND

RA21k

RA3560

Test Pattern for Carbon

To Charge Terminal

To Battery

Test Pattern for Pattern

(TGKA30 = BLUE]

BELL LED

(EX = White)

(TGD3xEX = AMBER)KEY B/L LED

1.8/1.47 inch Monochrome LCD [Heat Seal]

LCD B/L LED

(TGDA30 = NC]

ANT pattern

(TGK31EX = WHITE)

[for Korea]ANT tuningpattern

SP Phone RX

Handset RX

SP Phone TXHandset TX

Charge Current

When on Charge

1s

!

72


Memo

73


(1)

(2)

(3)

(4)

(6)

(8)

(9)

(5)

(7)

13.3.2. Module P. C. Board

BELL_LED2

LCD_RESET

LCD_CS

ST

B_B

ST

B_C

LCD

_SC

L

KIN

_4K

IN_3

KIN

_2K

IN_1

LCD

_CD

KE

Y_L

ED

LCD

_SID

BELL_LED1

EEP_WP

KIN

_5

CHG_CTRLCHG_DET

BE

LL_L

ED

2

SOCp

EE

P_W

P

LCD_LED0

KE

Y_L

ED

LCD

_RE

SE

T

LCD

_CD

LCD

_SID

LCD

_SC

L

LCD

_CS

LCD

_LE

D0

SOCn

ST

B_A

KIN_2

ST

B_B

KIN_4

KIN_1

ST

B_E

ST

B_D

ST

B_C

KIN_3

KIN_5

BE

LL_L

ED

1

R611k

C69

NC

GND

+1.8V

RF_TXnRF_TXp

RF_RXnRF_RXp

C44

K0.1u

R22

F56k

GND

C43

D10

p

VBAT

GND

VBAT2

+1.8V

C45K0.1u

GND

C866K0.1u

C47

1u

JTAG

IC1

3R

FP1

4R

FP0

5R

EF_

RE

S6

AV

S_X

TAL

7X

TAL2

8X

TAL1

9A

VD

_XTA

L10

RF_

SU

PP

LY1

11P

3_4/

PA

RA

DE

T55

P2_

7/B

XTA

L

76 P2_2/PCM_CLK/CLK10077 WLED_CUR_078 WLED_CUR_179 P2_1/ECZ2/PWM1/LED480 P2_0/ECZ1/PWM0/LED381 LDORF_CTRL82 VDD383 RFP0n84 RF_SUPPLY2

1R

F_R

Xn

2R

F_R

Xp

12P

3_5/

RIN

GO

UT/

RIN

GIN

G

56P

1_5/

INT5

/RD

I/VD

DE

57P

1_4/

INT4

/TD

OD

58P

1_3/

INT3

/SIO

74 P2_4/SCL1/PCM_DO/DP375 P2_3/SDA1/PCM_DI/DP2

85 RF_SUPPLY_PA86 RF_TXn87 RF_TXp

59P

1_2/

INT2

/SK

88 RFP2

89GND

60P

1_1/

INT1

/LE

61P

2_6/

WTF

_IN

62P

0_7/

SP

I_D

I/PW

M1

63P

0_6/

SP

I_D

O64

P0_

5/S

PI_

CLK

65P

0_4/

SP

I_E

N66

P0_

3/S

CL2

/UR

X2

67 P0_2/SDA2/UTX268 P0_1/URX/PWM0

69 P0_0/UTX70 VDD271 *RSTn72 JTAG73 P2_5/PCM_FSC/SF

RA5NC

STM

RST

NC

1 A0

2 A1

6SCL

7WP

3 A2

8VCC

4 VSS 5SDA

C4610pF

KIN_1

URX

VBAT

STB_B

CHG_DET

SOCp

KIN_3

REC-

STB_A

UTX

CP4V

LCD_SID

MIC-

STB_C

MIC+

ANT

SP+

GND

LCD_SCL

CHG+

LCD_RESET

SP-

BELL_LED2

KIN_2

KIN_4

CP3V

Battery_ON

LCD_CS

LCD_LED0

KIN_5

STB_D

CHG_CTRL

LCD_CD

KEY_LED

STB_E

REC+

BE

LL_L

ED

2

LCD

_CS

KE

Y_L

ED

LCD

_CD

LCD

_LE

D0

LCD

_RE

SE

T

LCD

_SC

L

LCD

_SID

SOCp

VBAT

SOCn

SOCn

CHG_CTRLCHG_DET

UTXURX

P2_3

LED1

KIN_5

KIN_4

KIN_1

KIN_3

KIN_2

ST

B_E

ST

B_C

ST

B_D

ST

B_A

ST

B_B

POWER

LED1

P2_3

MICh

+1.8V

BE

LL_L

ED

1

BELL_LED1

P0_7

CP3V

TP1

1GND_12BELL_LED13BATTERY_ON4STB_B5STB_E6STB_A7KEY_LED8MICh9MIC-10GND_211GND_312REC+13REC-14CHG+15BAT-/SOCp16SOCn17SP-18SP+19GND_520URX21UTX22LCD_LED23CP4V24GND_625GND_7261.8V27GND_828LCD_SID29LCD_SCL30LCD_RESET31GND_932KIN_233KIN_334GND_1035GND_1136ANT37GND_1238POWER39CHG_DET40CHG_CTRL41GND_1342GND_1443GND_1544GND_1645GND_1746BAT+/VBAT247LED148GND_1849GND_450BELL_LED251GND_1952P2_353STB_D54STB_C55GND_2056MIC+57GNDA58BAT+/VBAT159CP3V60GND_2161GND_2262GND_2363LCD_CD64LCD_CS65P0_766KIN_567KIN_468KIN_169GND_2470GND_2571GND_26

P0_7

VBAT2

GNDA

*X1 10.368MHz

TO RF BLOCK

IC3

3.0V

*Start Monitor*When “SFR” command is executed, 10.368MHz frequency will be output.

74


NC: No ComponentsKX-TGDA30AZ SCHEMATIC DIAGRAM (Handset_Module)

SHORT

SHORT

SH

OR

T

SH

OR

T

SHORT

SHORT

ST

B_D

CHG_DETCHG_CTRL

STB_A

ST

B_E

SOCnSOCp

GND

+1.8V

C57

K0.

1u

C30K1u

R231k

C99D10p

C98D10p

GND GND

Q1C22K1u

C190K0.1u

C33K0.1u R21

10k

CHG+

CP3V

GND

GND

C53K2.2u

C55D10p

CP4V

GND

C41K0.1u

GND

C191K1u

C59K1u

C52 K1u

C29

K1u

R1 10k

C12K2.2u

GND

25P3_3/ADC0

26P1_0/INT0/ADC1

27SOCp

28SOCn

29DC_SENSE

30DC_I

31DC_CTRL

32VBAT

33CHARGE_CTRL

47Q

SP

I_IO

2

48Q

SP

I_IO

1

49Q

SP

I_C

S

50V

DD

IO_Q

SP

I

51Q

SP

I_IO

3

52Q

SP

I_S

CK

53Q

SP

I_IO

0

54V

DD

113

P3_

6/R

ING

n14

P3_

7/R

ING

p

23VDD/AVD

24LDO_CTRL

34P1_7/CHARGE

35P3_1/DP1/PAOUTp

36VDDPA

45C

P_V

OU

T2

46P

1_6/

PO

N

15P

3_2/

CID

INp

37P3_0/DP0/PAOUTn

16V

RE

Fp17

CID

INn/

MIC

p18

CID

OU

T/M

ICn

19M

ICh

20V

RE

Fm21

LSR

p22

LSR

n

38CP_VBAT1

39CP_C1x

40CP_C2x

41CP_C1y

42CP_VBAT2

43CP_C2y

44CP_VOUT1

VBAT

VBAT

RA7 820

12 3

4

RF_TXn

RF_TXp

RF_RXp

C859

10p

VBAT2

GND

RF_RXn

OJ1

OJ2

OJ3

OJ7

CP4V

*ZA1

!!

1 2

6

79

11

3 4

810

521

C86

21.

5p

IC4VJ1 8M

1 *CS

2 DO/IO1

6CLK

7*HOLD/IO3

3 *WP/IO2

8VCC

4 GND 5DI/IO0

C3168p

C3268p

C8631.8p

GND

CHG+

SP+

SP-

REC-

REC+

MIC+MIC-

Bat

tery

_ON

MICh

ANT

CP3V

CP4V

POWER

+1.8V

GNDA GND

SHORT2

SHORT1

GNDA

GNDA

R26NC

R25NC

C16NC

C15NC

R24NC

GNDA

+1.8V

C86510p

GND

VBAT2

C8601.2p

RA42.7k

C13

0.1u

FC

110.

1uF

C14NC

C5610p

MICn

(MAX500mA)1

RECEIVER+

RECEIVER-

MIC_POWER

MICp



TX-balunSLW=0.3mmL=39.0mm

RF BLOCK


SLW=0.3mmL=6.5mm

*open-stubSLx2W1=0.2mmL1=3.3mmW2=0.7mmL2=5.0mm

RX-balunMSLW=0.170mmL=3.6mmS=0.125mm

SLW=0.2mmL=20.0mm

LPF

SLW=0.3mmL=6.95mm

MSLW=0.25mmL=5mm

MSLW=0.25mmL=5mm

MSLW=0.25mmL=2mm

MSLW=0.25mmL=2mm

50 ohm lineL=2mm

50 ohm lineTotal L=4mm

MICh

for Headset

IC1

(1)

(2)

(3)

(4)

(6)

(8)

(9)

(5)

(7)

SP Phone Rx

Handset Rx

Handset TxSP PhoneTx

RX_RF

TX_RF

75


Memo

76


14 Printed Circuit Board

14.1. Base Unit (Main)


KX-TGD320 MAIN BOARD (Base Unit (Component View))

MSG_LEDKEYS_CE_ SYEK D_ SYEK

RA5

01

RA502

SA10

1SA

102

R651

R65

2

C81

0

C81

1C

819

C82

0

ZA1

RA1

51

C651C652C653

C65

4

L101

C65

5C656

C65

7

UR

X

L501

L502

C86

3

UTX

C871

C87

2

C873

LED_VDD

C87

4

KEYIN1 KEYIN2 KEYIN3

C895

Q161

Q171

R11

5

R11

6

R11

7

R11

8

R501

R50

2

R50

3

R50

4

R506

R13

1

R905

R331

C101

R332

C102

GAP

R14

1

C11

5

C11

6

C50

1C

502

C503

C50

4

R15

9

C505

C506

C50

7

C508 C509

R16

0

R162

R16

3

C510

C511

X501

R16

7

R169

C51

6

C517

C518

HAK

_CL1

C519

C132

R17

1

+5.5

VR

172

C520

R17

5

C52

1

R17

6

R17

7

C331

C14

2

C34

1

C342

C34

3C

161

D10

1

C16

4

C16

6

C171

C17

3C

175

C17

6

R133

C17

8

C18

1C184

D901

D13

2

D13

3

ANS_LED

IC50

1

L803

D14

1D

142

D14

3

GN

D

Q651

Q652

P101EQ141

E

E

E

E

DC

PUR

GRY

TEL

YLW

BRW

SP

ORG

BLU

CH

ARG

E+C

HAR

GE-

PNLB

2423

Z*KX

-TG

D3x

x

SP

PbF

A

77


14.1.2. Bottom View

KX-TGD320 MAIN BOARD (Base Unit (Bottom View))

RTC

K

RSTN

VCC

A

DC

M

DC

P

C601

+3.0V

C611

CH

G+

CH

G-

F301

ANT1

UR

X1

UTX1

ANt1_Short

TCK

Q111

TDI

TDO

C475

C476

C477

C478

SW1

STM/C

KM/P15

Q140

IC601

Q142

IC611

Q351

Q352 Q353

R103

R104

R111

R112

R113

R114

R121

R122

R12

3

R124

D472

D473

R510

R511

VBAT

R321R322

C103

C104

R142

R144

R145

R148

R149

C110

C112

C113

R151

R152

R924

R925

VDD

C

TMS

R158

L1R

L1T

C120

R351

C121

R352

C122

R354

R355

R164

R165

C513

C321

C515

C902R

A611

R371

C141

R372

R373

C143

C152

C351

C167

D113

GN

D1

VREF

L401

L402

IC302

ANT1_S-G

ND

D362

C479

Q144

R153

R154

R801

STM/CKM/P1STM/CKM/P15

RSTNRSTN

TEL

YLW

BRW

DC

GRY

PUR

ORG

PNLB

2423

Z*KX

-TG

D3x

xPb

F

A

+3.0V+3.0VU

RX

UR

X

UTX

UTX

GN

DG

ND

for JIGfor JIG

VDDCVDDC

78


14.2. Base Unit (Operation)


KX-TGD320 OPERATION BOARD (Base Unit (Component View))

T G D 3 2 x HP N L B 2 4 2 9 Z A - R C9

1

R E F - 1

LOCATOR

REPEAT

LED901 LED902

DOWN

ERASE

SKIP

UP

ANSWER ANSWER1 MSG MSG1

P b F

79


Memo

80


14.3. Handset (Main)


KX-TGDA30 MAIN BOARD (Handset (Component View))

BA

TT+

BA

TT-C

38

AN

T-Short-G

ND

CH

G+ C

HG

-

Q 1 0

Q11

Q 1 2

C68

C69

C70

C71

RA

2

C72

RA

3

C73

C78

C79

C81

C91C

92

C93

C1

C 5

C6

UR

XS

UTX

S

UR

X

F1

RE

CE

IVE

R

AN

T1_TP

U T X

BA

TT+_

AN

T-Short

BA

TT-_

VB

AT

C113

CP

3V

R 1 0

R11

R12R

13

R15

CP

4V

R20

Q 2

Q3

Q4

Q6

Q 9

R2

R6

R7

R8

R9

R45

R48

R62

R63

SP

EA

KE

R

PO

WE

R

R76

R77

CK

M

1.8V

C15

G N D

C19

IC1

R80

P N L B 2 4 3 2 Z *K X - T G D A 3 0 x x

P b F

R E F - 2

CHG (-)

BATTERYGND

UTX for JIG

URX

BATT-BATT+

CHG (+)

CP3V

CP4V

1.8V

CKM (10.368MHz)

A

81


14.3.2. Bottom View

KX-TGDA30 MAIN BOARD (Handset (Bottom View))

0

1 2 3

4A

ST

5 6

7 8 9

LCD

LED

1

LED

2

LED

3

LED

4

LED

5

LED

6

LED

20

DO

WN

RIG

HT

SP

OFF

SH

AR

P

UP

INT

MIC

SO

FT_A

SO

FT_C

EC

O/R

TALK

A

P N L B 2 4 3 2 Z *K X - T G D A 3 0 x x

P b F

R E F - 2

82


14.4. Handset (Module)


KX-TGDA30 MODULE BOARD (Handset (Component View))

14.4.2. Bottom View

KX-TGDA30 MODULE BOARD (Handset (Bottom View))

C22

C29

C30C31

C32C33

C41

C43

C44

C45

C46

C47

C52

C53C55

C56

C57

C59

C69

RA5

RA7

C98C99

STM

C859C860

C862

C863

C865C866

JTAG

IC1

IC3 CP4V

R21

R22R23

R24 R25

Q1

R26

R1

RSTR61

C190C191

X1

C11

C12

C13

C14

C15

C16

IC4

RA4

PbF

RE

F-2

P N L B 2 4 3 1 Z *T G D A / T G K A 3 x R 0

A

P N L B 2 4 3 1 Z *T G D A / T G K A 3 x R 0

A

PbF

83


15 Exploded View and Replacement Parts List

15.1. Cabinet and Electrical Parts (Base Unit)

Note:(*1)(*2) This SPACERs are cut from the excess parts of CUSHION/LCD (No.105).

Ref.No. Figure

A2.6 x 8mm

1

2

3 4

5

6

A

PCB1

7

8

9

10

11

13

12

14

15

PCB2

A

A

A

A

CUSHION/LCD (No. 105)

(*1)

(*2)

(*1)

(*2)

84


15.2. Cabinet and Electrical Parts (Handset)

Note:(*1) This cable is fixed by welding. Refer to How to Replace the Handset LCD (P.49).(*2) The rechargeable Ni-MH Panasonic Battery is available through sales route of Panasonic.(*3) Attach the SPACER (No. 114) to the exact location described above.(*4)(*5) This SPACERs are cut from the excess parts of CUSHION/LCD (No.105).

CUSHION RUBBER*STICK IT WITHIN THE FRAMEWORK ON P.C.B.

Ref.No.

2× 8 mmB

Figure

Spacer (No.114)

Battery cover

Put it in the center.

Stick it along upperrib.

CUSHION/LCD (No. 105)

(*4) (*5)

(*4)(*5)

E104

101

102

E102

E101 (*1)

E103

B

E107

E106E105E108

104

110

105

107

115

113

114 (*3)

(*2)

B

112

109

108

111106

PCB100

85


15.3. Cabinet and Electrical Parts (Charger Unit)200

200-1

200-3

200-2

200-4

200-5

86


15.4. AccessoriesA2A1 A3

87


15.5. Replacement Parts List1. RTL (Retention Time Limited)

Note:The “RTL” marking indicates that its Retention Time is Limited.When production is discontinued, this item will continue to be available only for a specific period of time.This period of time depends on the type of item, and the local laws governing parts and product retention. At the end of this period, the item will no longer be available.

2. Important safety noticeComponents identified by the mark indicates special characteristics important for safety. When replacing any of these components, only use specified manufacture's parts.

3. The S mark means the part is one of some identical parts. For that reason, it may be different from the installed part.

4. ISO code (Example: ABS-94HB) of the remarks column shows quality of the material and a flame resisting grade about plastics.

5. RESISTORS & CAPACITORSUnless otherwise specified;All resistors are in ohms () k=1000, M=1000kAll capacitors are in MICRO FARADS (F) p=F*Type & Wattage of Resistor

15.5.1. Base Unit

15.5.1.1. Cabinet and Electrical Parts

15.5.1.2. Main P.C.Board PartsNote:

(*1) When replacing IC611 or X501, make the adjustmentusing Batch file CD-ROM for setting. Refer to parts list of Fixtures and Tools (P.91). Refer to How to download the data (P.57) of Things to Do after Replacing IC or X'tal (P.57)(*2) When removing ZA1 use special tools (ex. Hot air disordering tool).(*3) Backside of this IC has a ground plate. Refer to How to Replace the Flat Package IC (P.63).(*4) Supplied IC is Flat Package Type.

Safety Ref. No.

Part No. Part Name & Description Remarks

1 PNGP1363Z1 PANEL PC-V-22 PNKM1605Z1 CABINET BODY ABS-HB3 PNBC1591Y1 PUSH BUTTON (ANSWER) ABS-HB4 PNBC1592Y1 PUSH BUTTON (PLAY) ABS-HB5 PNJK1249Y KEYBOARD SWITCH 6 PNKE2033Z1 CASE, CHARGE PS-HB7 PNJT1214Z TERMINAL, CHARGE 8 PNHR2082Z GUIDE, SPEAKER ABS-HB9 L0AA04A00028 SPEAKER 10 PNHG1277Z RUBBER PARTS 11 PNHR2086Z GUIDE, JACK PS-HB12 K2ECYZ000002 JACK, DC

Type

ERC:SolidERDS:CarbonERJ:Chip

ERX:Metal FilmERG:Metal OxideER0:Metal Film

PQ4R:ChipERS:Fusible ResistorERF:Cement Resistor

Type

ECFD:Semi-ConductorECQS:StyrolECUV,PQCUV, ECUE:ChipECQMS:Mica

ECCD,ECKD,ECBT,F1K,ECUV:CeramicECQE,ECQV,ECQG:PolyesterECEA,ECST,EEE:ElectlyticECQP:Polypropylene

Wattage

*Type & Voltage Of Capacitor

10,16:1/8W 14,25:1/4W 12:1/2W 1:1W 2:2W 3:3W

VoltageECQ Type ECQG

ECQV Type

05:50V 1:100V 2:200V

ECSZ Type

0J :6.3V1A :10V1C :16V1E,25:25V

1V :35V50,1H:50V1J :16V2A :100V

0F:3.15V1A:10V1V:35V0J:6.3V

Others

1H:50V2A:100V2E:250V2H:500V

13 PQJJ1T039M JACK, MODULAR 14 PNKF1369Z1 CABINET COVER PS-HB15 PNHA1013Z RUBBER PARTS, FOOT

CUSHION

Safety Ref. No.

Part No. Part Name & Descripti on

Remarks

PCB1 PNWPAD320ALH MAIN P.C.BOARD ASS'Y (RTL) (ICs)

IC302 C0DBEYY00102 IC IC501 C2HBCY000157 IC (*3)(*4) IC601 PNWIBD320ALH IC (FLASH) IC611 PNWIAGD320GH IC (EEPROM)(*1)

(TRANSISTORS)Q111 2SC6054JSL TRANSISTOR(SI) SQ140 B1ABCE000009 TRANSISTOR(SI) Q141 B1ACGP000008 TRANSISTOR(SI) Q142 B1ABDM000001 TRANSISTOR(SI) SQ161 DSC7003S0L TRANSISTOR(SI) Q171 2SC6054JSL TRANSISTOR(SI) SQ351 B1ADNB000003 TRANSISTOR(SI) Q352 2SC6054JSL TRANSISTOR(SI) SQ353 2SC6054JSL TRANSISTOR(SI) SQ651 DRC9113Z0L TRANSISTOR(SI) Q652 DRC9113Z0L TRANSISTOR(SI)

(DIODES)D101 B0EDER000009 DIODE(SI) SD113 DA2J10100L DIODE(SI) D132 DA2J10100L DIODE(SI) D133 DA2J10100L DIODE(SI) D141 B0BC02000015 DIODE(SI) D362 B0ECKM000008 DIODE(SI) D901 B0ECKM000008 DIODE(SI)

(COILS)L101 G1C27NJ00010 COIL L501 G1CR10J00010 COIL L502 G1CR10J00010 COIL L803 G1C2N7Z00009 COIL

(RESISTOR ARRAYS)RA151 EXB24V102JX RESISTOR ARRAY RA502 EXB28V101JX RESISTOR ARRAY RA611 EXB28V332JX RESISTOR ARRAY

(VARISTOR)SA101 J0LE00000047 VARISTOR

(RESISTORS)R111 PQ4R10XJ105 1M SR112 PQ4R10XJ473 47k SR113 ERJ3GEYJ223 22k SR114 ERJ2GEJ683 68k SR115 ERJ3GEYJ565 5.6M SR116 ERJ3GEYJ565 5.6M SR117 ERJ3GEYJ104 100k SR118 ERJ3GEYJ104 100k SR121 ERJ3GEYJ394 390k SR122 ERJ3GEYJ394 390k SR124 PQ4R18XJ100 10 SR141 ERJ3GEYJ104 100k S

Safety Ref. No.


88


15.5.1.3. Operational P.C. Board

15.5.2. Handset


R142 PQ4R18XJ272 2.7k SR145 ERJ2GEJ222 2.2k SR148 ERJ2GEJ103 10k SR149 D0GA681JA021 680 SR151 D0GA104JA021 100k SR152 ERJ2GEJ134X 130k SR158 ERJ2GEJ472X 4.7k SR159 ERJ3GEYJ102 1k SR160 ERJ3GEYJ181 180 SR162 ERJ3GEYJ473 47k SR163 D0GG390JA007 39 R164 ERJ3GEYJ222 2.2k SR165 ERJ3GEYJ273 27k SR171 ERJ2GEJ221 220 S

R172 ERJ2GEJ684 680k SR175 D0GA392JA015 3.9k SR176 ERJ2GEJ102 1k SR177 ERJ2GEJ102 1k SR321 ERJ2RKF2000 200 SR322 ERJ2RKF1000 100 SR331 ERJ2RKF6802 68k SR332 ERJ2RKF3302 33k SR351 ERJ2GEJ333 33k SR352 ERJ2GEJ682 6.8k SR354 ERJ2GEJ103 10k SR355 D0GA681JA021 680 SR371 ERJ8GEYJ1R0 1 SR372 ERJ8GEYJ1R0 1 SR373 D0GA681JA021 680 SR501 ERJ3GEYJ100 10 SR502 ERJ2GEJ103 10k SR503 ERJ2GEJ103 10k SR504 ERJ2GEJ103 10k SR506 ERJ2GEJ103 10k SR651 ERJ2GEJ122 1.2k SR652 ERJ2GEJ122 1.2k S

(CAPACITORS)C101 F1K2H681A008 680 SC102 F1K2H681A008 680 SC110 F1J2A104A025 CERAMIC CAPACITOR C112 F1J2A104A025 CERAMIC CAPACITOR C113 PQCUV1H103KB 0.01 C115 ECUV1C104KBV 0.1 C116 ECUV1C104KBV 0.1 C120 ECUE1H102KBQ 0.001 C121 F1K2H681A008 680 SC122 F1K2H681A008 680 SC142 ECUV1H103KBV 0.01 C152 ECUE1C103KBQ 0.01 C161 F1K1E1060001 10 C166 ECUV1H104KBV 0.1 C167 ECUE1H222KBQ 0.0022 C171 ECUE1A333KBQ 0.033 C173 ECUE1A273KBQ 0.027 C175 ECUE1H561KBQ 560p C176 ECUE0J105KBQ 1 C178 ECUV1C104KBV 0.1 C184 ECUV1C105KBV 1 C321 ECUV1C105KBV 1 C341 F2G0J1020022 1000 C342 ECUE1A104KBQ 0.1 C343 F2G0J1020022 1000 C351 ECUV1C105KBV 1 C475 ECUE1H100DCQ 10p C477 ECUE1H100DCQ 10p C479 ECUE1H100DCQ 10p C501 ECUE1A104KBQ 0.1 C502 ECJ1VB0G106M 10 SC503 ECJ1VB0G106M 10 SC504 ECUE0J105KBQ 1 C505 ECJ1VB0G106M 10 SC506 ECUE0J105KBQ 1 C507 ECUV0J225KBV 2.2

Safety Ref. No.


Remarks

C508 ECUE1H100DCQ 10p C509 ECUE1H120JCQ 12p C510 ECUE0J105KBQ 1 C511 ECJ1VB0G106M 10 SC513 ECUV0J225KBV 2.2 C515 ECUE0J105KBQ 1 C516 ECUE1A104KBQ 0.1 C517 ECUE1A104KBQ 0.1 C518 ECUE1A104KBQ 0.1 C519 ECUE1A104KBQ 0.1 C520 ECUE1A104KBQ 0.1 C521 ECUE0J105KBQ 1 C601 ECUE1A104KBQ 0.1 C611 ECUE1A104KBQ 0.1 C810 F1G1H1R1A765 1.1 C811 ECUE1H100DCQ 10p C819 ECUE1H100DCQ 10p C820 F1G1H1R5A765 1.5 C863 F1G1H1R5A765 1.5 C871 F1G1H1R1A765 1.1 C872 F1G1H1R3A765 1.3 C873 F1G1H2R0A765 2 C874 ECUE1H150JCQ 15p C895 F1G1H2R0A765 2

(OTHERS)F301 ERBRD3R00X FUSE

P101 D4DAY220A022 THERMISTOR X501 H0J138500011 CRYSTAL OSCILLATOR (*1) ZA1 PNMC1091Z MAGNETIC, SHIELD CASE

(*2)

Safety Ref. No.


PCB2 PNWPBTGD320H OPERATIONAL P.C.BOARD ASS'Y (RTL) (DIODES)

LED901 B3AAB0000347 DIODE(SI) LED902 B3AAB0000347 DIODE(SI)

Safety Ref. No.


101 PNGP1364Z1 PANEL, LCD PMMA-HB102 PNYE7745Z TAPE, DOUBLE SIDED 104 PNKM1608X5 CABINET BODY ABS-HB105 PNYE7746Z SPACER, LCD 106 PNBC1594Y1 PUSH BUTTON, NAVIGATOR ABS-HB107 PNJK1250Y KEYBOARD SWITCH 108 L0AA02A00119 SPEAKER 109 PNMH1308Z GUIDE, SPEAKER 110 L0AD01A00024 RECEIVER 111 PNHS1640Z SPACER, SPEAKER NET 112 PNJC1018Z BATTERY TERMINAL 113 PNKF1372Z1 CABINET COVER ABS-HB114 PNHS1691Z SPACER, BATTERY COVER 115 PNKK1114Z1 LID, BATTERY ABS-HB

Safety Ref. No.


Remarks

89


15.5.2.2. Main P.C.Board PartsNote:

(*1) Reconfirm the model No. written on the handset’s nameplate when replacing PCB100. Because the model No. ofthe optional handset may differ from the included handset.(*2) When replacing IC4 or X1, make the adjustmentusing Batch file CD-ROM for setting. Refer to parts list of Fixtures and Tools (P.91). Refer to How to download the data (P.57) of Things to Do after Replacing IC or X'tal (P.57)(*4) When replacing the handset LCD, See How to Replace the Handset LCD (P.49).(*5) Backside of this IC has a ground plate. Refer to How to Replace the Flat Package IC (P.63).(*6) Supplied IC is Flat Package Type.

15.5.2.2.1. Main P.C. Board 15.5.2.2.2. Module P.C.Board

Safety Ref. No.


PCB100 PNWPADA30EXR MAIN P.C.BOARD ASS'Y (RTL)(*1)(TRANSISTORS)

Q2 DSA900100L TRANSISTOR(SI) Q3 B1ABGE000011 TRANSISTOR(SI) Q4 DSA900100L TRANSISTOR(SI) Q6 2SC6054JSL TRANSISTOR(SI) SQ9 UNR9216J0L TRANSISTOR(SI) SQ10 B1ADNB000003 TRANSISTOR(SI) Q11 2SC6054JSL TRANSISTOR(SI) SQ12 DSA900100L TRANSISTOR(SI)

(DIODES)LED1 B3ACB0000190 DIODE(SI) LED2 B3ACB0000190 DIODE(SI) LED3 B3ACB0000190 DIODE(SI) LED4 B3ACB0000190 DIODE(SI) LED5 B3ACB0000190 DIODE(SI) LED6 B3ACB0000190 DIODE(SI) LED20 B3AFB0000370 DIODE(SI)

(RESISTOR ARRAYS)RA2 D1H810240004 RESISTOR ARRAY SRA3 EXB24V561JX RESISTOR ARRAY S

(RESISTORS)R2 ERJ2GEJ303 30k SR6 ERJ2GEJ103 10k SR7 ERJ2GEJ821 820 SR8 ERJ8GEYJ4R3V 4.3 SR9 ERJ2GEJ303 30k SR10 ERJ3GEYJ1R0 1 SR11 D0GA681JA021 680 SR12 ERJ2GEJ224 220k SR13 ERJ2GEJ102 1k SR15 D0GA152JA021 1.5k SR20 ERJ2GEJ303 30k SR45 D0GBR10JA113 0.1 R48 ERJ2GEJ391 390 SR76 ERJ2GEJ1R0 1 SR77 ERJ2GEJ1R0 1 S

(CAPACITORS)C1 EEE0JA221WP 220 C5 ECUV1C104KBV 0.1 C6 ECUV1C104KBV 0.1 C15 ECUE1H390JCQ 39p C19 ECUE1H102KBQ 0.001 C68 ECUE1H100DCQ 10p C69 ECUE1H100DCQ 10p C70 ECUE1H680JCQ 68p C71 ECUE1H680JCQ 68p C72 ECUE1H100DCQ 10p C73 ECUE1H100DCQ 10p C78 ECUE1H222KBQ 0.0022

C79 ECUE1H222KBQ 0.0022 C91 ECUV1C105KBV 1 C92 ECUE0J105KBQ 1 C93 ECUE0J105KBQ 1 C113 ECUE1H100DCQ 10p

(OTHERS)F1 ERBRD2R50X FUSE

MIC L0CBAY000053 BUILTIN-MICROPHONE E101 L5DYBYY00001 LIQUID CRYSTAL

DISPLAY(*4)E102 PNHR2088Z GLASS/TRANSPARENT PLATE PMMA-HBE103 PNHR2087Z GUIDE, LCD ABS-HBE104 PQHG10729Z RUBBER PARTS E105 PNJT1114Z TERMINAL-TERMINAL PLATE E106 PNJT1113Z TERMINAL-TERMINAL PLATE E107 PNVE1011Z BATTERY TERMINAL E108 PNJE1220Z SPECIAL SWITCH

Safety Ref. No.


(IC) IC1 C1CB00003837 IC(*5)(*6) IC4 PNWIADA30EXR IC (FLASH)(*2)

(TRANSISTOR)Q1 B1ADGE000012 TRANSISTOR(SI)

(RESISTOR ARRAYS)RA4 EXB24V272J RESISTOR ARRAY RA7 EXB24V821JX RESISTOR ARRAY

(RESISTORS)R1 ERJ2GEJ103 10k SR21 ERJ2GEJ103 10k SR22 D0GA563ZA006 56k R23 ERJ2GEJ102 1k SR61 ERJ2GEJ102 1k S

(CAPACITORS)C11 F1L1A104A054 CERAMIC CAPACITOR C12 ECUV0J225KBV 2.2 C13 F1L1A104A054 CERAMIC CAPACITOR C22 ECUE0J105KBQ 1 C29 ECUE0J105KBQ 1 C30 ECUV1A105KBV 1 C31 ECUE1H680JCQ 68p C32 ECUE1H680JCQ 68p C33 ECUE1A104KBQ 0.1 C41 ECUE1A104KBQ 0.1 C43 ECUE1H100DCQ 10p C44 ECUE1A104KBQ 0.1 C45 ECUE1A104KBQ 0.1 C46 ECUE1H100DCQ 10p C47 ECUE0J105KBQ 1 C52 ECUE0J105KBQ 1 C53 ECUV1A225KBV 2.2 C55 ECUE1H100DCQ 10p C56 ECUE1H100DCQ 10p C57 ECUE1A104KBQ 0.1 C59 ECUE0J105KBQ 1 C98 ECUE1H100DCQ 10p C99 ECUE1H100DCQ 10p C190 ECUE1A104KBQ 0.1 C191 ECUE0J105KBQ 1 C859 ECUE1H100DCQ 10p C860 F1G1H1R2A765 1.2 C862 F1G1H1R5A765 1.5 C863 F1G1H1R8A765 1.8 C865 ECUE1H100DCQ 10p C866 ECUE1A104KBQ 0.1

(OTHERS)X1 H0J103500039 CRYSTAL OSCILLATOR ZA1 PNMC1091Z MAGNETIC SHIELD (*2)

Safety Ref. No.


90


15.5.3. Charger Unit


15.5.4. Accessories

15.5.5. Screws

15.5.6. Fixtures and ToolsNote:

(*1) See Equipment Required (P.50), and The Setting Method of JIG The Setting Method of JIG (Handset)(P.54).(*2) When replacing the Handset LCD, See How to Replace the Handset LCD (P.49).

YANKX-TGD320ALBKX-TGD322ALBKX-TGD323ALBKX-TGDA30AZB

Safety Ref. No.


200 PNLC1064ZB CHARGER UNIT ASS'Y without NAME PLATE (RTL)

200-1 PNKM1609Z1 CABINET BODY PS-HB200-2 PNJT1182Z CHARGE TERMINAL200-3 PNJJ021001Z JACK, MODULAR200-4 PNKF1280Y1 CABINET COVER PS-HB200-5 PQHA10023Z RUBBER PARTS, FOOT

CUSHION

Safety Ref. No.


A1 PNLV226AL0Y AC ADAPTOR (for Base Unit)

A2 PQJA10168Z CORD, TELEPHONEA3 PNLV233ALKZ AC ADAPTOR (for Charger

Unit)

Safety Ref. No.


A XTB26+8GFJ TAPPING SCREWB XTB2+8GFJ TAPPING SCREW

Safety Ref. No.


PQZZ1CD300E JIG CABLE (*1) PNZZTGD320AL BATCH FILE CD-ROM(*1) PQZZ430PIR TIP OF SOLDERING IRON

(*2)

PQZZ430PRB RUBBER OF SOLDERING IRON (*2)

91