tda 33

TDA6107AJFTriple video output amplifier1. General descriptionThe TDA6107AJF contains three video output amplifiers which are intended to drive thethree cathodes of a color CRT. The device is contained in a plastic DIL-bent-SIL 9-pinmedium power (DBS9MPF) package, and uses high-voltage DMOS technology.To obtain maximum performance, the amplifier should be used with black-current control.

2. Features

n Typical bandwidth of 5.5 MHz for an output signal of 60 V (p-p)n High slew rate of 900 V/sn No external components requiredn Very simple applicationn Single supply voltage of 200 Vn Internal reference voltage of 2.5 Vn Fixed gain of 81n Black-Current Stabilization (BCS) circuit with voltage window from 1.8 V to 6 V and

current window from +100 A to 10 mAn Thermal protectionn Internal protection against positive flashover discharges appearing on the CRT

3. Ordering information

Rev. 02 28 April 2005 Product data sheet

Table 1: Ordering informationType number Package

Name Description VersionTDA6107AJF DBS9MPF plastic DIL-bent-SIL medium power package with fin; 9 leads SOT111-1

Philips Semiconductors TDA6107AJFTriple video output amplifier

4. Block diagram

Fig 1. Block diagram (one amplifier shown)

mce457

TDA6107AJF

VDD

6

1, 2, 3

4

9, 8, 7Voc(1),Voc(2),Voc(3)

5Iom

Rf

MIRROR 5

DIFFERENTIALSTAGE

VIPREFERENCE

CURRENTSOURCE

Ri

Vi(1),Vi(2),Vi(3)

Ra3

3

CASCODE 1

CASCODE 2

MIRROR 2

1

MIRROR 4

MIRROR 3

MIRROR 1

THERMALPROTECTION

CIRCUIT

19397 750 14728 Koninklijke Philips Electronics N.V. 2005. All rights reserved.

Product data sheet Rev. 02 28 April 2005 2 of 16


5. Pinning information

5.1 Pinning

5.2 Pin description

Fig 2. Pin configuration

TDA6107AJF

Vi(1)

Vi(2)

Vi(3)

GND

Iom

VDD

Voc(3)

Voc(2)

Voc(1)001aac587

1

2

3

4

5

6

7

8

9

Table 2: Pin descriptionSymbol Pin DescriptionVi(1) 1 inverting input 1Vi(2) 2 inverting input 2Vi(3) 3 inverting input 3GND 4 ground (fin)Iom 5 black-current measurement outputVDD 6 supply voltageVoc(3) 7 cathode output 3Voc(2) 8 cathode output 2Voc(1) 9 cathode output 19397 750 14728 Koninklijke Philips Electronics N.V. 2005. All rights reserved.



6. Internal circuitry

7. Limiting values

(1) All pins have an energy protection for positive or negative overstress situations.Fig 3. Internal pin configuration

7, 8, 9

mce458

esd

6.8 Vesd

esd

GND VDD

esd

frominputcircuit

frominputcircuit

fromcontrolcircuit

from black-currentmeasurementcircuit

fromcontrolcircuit

to black-currentmeasurement circuitto black-current

measurement circuit

to black-currentmeasurement circuit

to black-currentmeasurement circuit

esd

TDA6107AJF(1)

esd

flash

to cascodestage

1, 2, 3

4 6

5

Vbias

Table 3: Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134). Voltages measured with respect to ground; currentsas specified in Figure 9; unless otherwise specified.Symbol Parameter Conditions Min Max UnitVDD supply voltage 0 250 VVi input voltage at pins Vi(1), Vi(2) and Vi(3) 0 12 VVom measurement output voltage 0 6 V|Iom(mean)| absolute value of mean current of

measurement output (for three channels)Voc = 0 V to VDD;Vom = 1.8 V to 6 V

- 5.6 mA

Voc cathode output voltage 0 VDD VTstg storage temperature 55 +150 CTj junction temperature 20 +150 CVesd electrostatic discharge voltage Human Body Model (HBM) - 3000 V

Machine Model (MM) - 300 V9397 750 14728 Koninklijke Philips Electronics N.V. 2005. All rights reserved.



8. Thermal characteristics

[1] An external heatsink is necessary; see Application Note AN10227-01.

8.1 Thermal protectionThe internal thermal protection circuit gives a decrease of the slew rate at hightemperatures: 10 % decrease at 130 C and 30 % decrease at 145 C (typical values onthe spot of the thermal protection circuit).

Table 4: Thermal characteristicsSymbol Parameter Conditions Typ UnitRth(j-a) thermal resistance from junction to ambient in free air 56 K/WRth(j-fin) thermal resistance from junction to fin [1] 11 K/W

(1) Infinite heatsink.(2) No heatsink.

Fig 4. Power derating curves

Ptot(W)

8

6

2

0

4

40 0 40 80 160120Tamb (C)

mbh989

(1)

(2)

Fig 5. Equivalent thermal resistance network

mgk279

5 K/W

outputs

fin

thermal protection circuit

6 K/W9397 750 14728 Koninklijke Philips Electronics N.V. 2005. All rights reserved.



9. Characteristics

Table 5: CharacteristicsOperating range: Tj = 20 C to +150 C; VDD = 180 V to 210 V; test conditions: Tamb = 25 C; VDD = 200 V;Voc(1) = Voc(2) = Voc(3) = 12VDD; CL = 10 pF (CL consists of parasitic and cathode capacitance); Rth(h-a) = 18 K/W; measured intest circuit of Figure 9; unless otherwise specified.Symbol Parameter Conditions Min Typ Max UnitIq quiescent supply current 5.6 6 7.6 mAVref(int) internal reference voltage (input

stage)- 2.5 - V

Ri input resistance - 2.1 - kG gain of amplifier 73 81 89G gain difference 4.2 0 +4.2PSRR power supply rejection ratio f < 50 kHz [1] - 55 - dBct(DC) DC crosstalk between channels - 50 - dBMeasurement output pin Iom; Voc = Voc(min) to Voc(max)Iom(offset) offset current of measurement

output (for three channels)Ioc = 0 A;Vom = 1.8 V to 6 V

50 - +50 A

Iom/Ioc linearity of current transfer(for three channels)

Ioc = 100 A to +100 A;Vom = 1.8 V to 6 V

0.9 1.0 1.1

Ioc = 100 A to +10 mA;Vom = 1.8 V to 4 V

0.9 1.0 1.1

Output pins Voc(1), Voc(2), Voc(3)Voc(DC) DC output voltage Ii = 0 A 76 87 97 VVoc(DC)(offset) differential DC output offset

voltage between two output pinsIi = 0 A 5 0 +5 V

Voc(T) output voltage temperature drift - 10 - mV/KVoc(T)(offset) differential output offset voltage

temperature drift between twooutput pins

- 0 - mV/K

Ioc(max) maximum peak output current Voc = 50 V to VDD 50 V - 20 - mAVoc(min) minimum output voltage Vi = 4.5 V; at Ioc = 0 mA [2] - - 10 VVoc(max) maximum output voltage Vi = 0.5 V; at Ioc = 0 mA [2] VDD 15 - - VBS small signal bandwidth Voc = 60 V (p-p) - 5.5 - MHzBL large signal bandwidth Voc = 100 V (p-p) - 4.5 - MHztco(p) cathode output propagation time

50 % input to 50 % outputVoc = 100 V (p-p) squarewave

[3]- 60 - ns

tco(p) difference in cathode outputpropagation time 50 % input to50 % output (between twooutput pins)

Voc = 100 V (p-p) squarewave

[3]10 0 +10 ns

toc(r) cathode output rise time10 % output to 90 % output

Voc = 50 V to 150 V squarewave

[3] 67 91 113 ns

toc(f) cathode output fall time90 % output to 10 % output

Voc = 150 V to 50 V squarewave

[3] 67 91 113 ns9397 750 14728 Koninklijke Philips Electronics N.V. 2005. All rights reserved.



[1] The ratio of the change in supply voltage to the change in input voltage when there is no change in output voltage.[2] See Figure 6 for the typical DC-to-DC transfer of Vi to Voc.[3] f < 1 MHz; tr = tf = 40 ns [pins Vi(1), Vi(2) and Vi(3)]; see Figure 7 and Figure 8.

tst settling time input (50 %) tooutput (99 % to 101 %)


[3]- - 350 ns

SR slew rate between50 V to VDD 50 V

Vi = 2.5 V (p-p) squarewave

[3]- 900 - V/s

Ov cathode output voltageovershoot


[3]- 2 - %

Table 5: Characteristics continuedOperating range: Tj = 20 C to +150 C; VDD = 180 V to 210 V; test conditions: Tamb = 25 C; VDD = 200 V;Voc(1) = Voc(2) = Voc(3) = 12VDD; CL = 10 pF (CL consists of parasitic and cathode capacitance); Rth(h-a) = 18 K/W; measured intest circuit of Figure 9; unless otherwise specified.Symbol Parameter Conditions Min Typ Max Unit

Fig 6. Typical DC-to-DC transfer of Vi to Voc

mce455

80

120

40

160

200Voc(V)

0

Vi (V)0 43219397 750 14728 Koninklijke Philips Electronics N.V. 2005. All rights reserved.



Fig 7. Output voltage [pins Voc(1), Voc(2) and Voc(3)] rising edge as a function of the AC input signal

150140

100

6050

151

149

tst

Ov (in %)

t

t

2.34

2.96

1.73

toc(r)

tco(p)

Voc(V)

Vi(V)

mce4779397 750 14728 Koninklijke Philips Electronics N.V. 2005. All rights reserved.



10. Application information

10.1 Cathode outputThe cathode output is protected against peak currents (caused by positive voltage peaksduring high-resistance flash) of 3 A maximum with a charge content of 100 C. Externalprotection against higher currents is described in Application note AN10227-01.

The cathode is also protected against peak currents (caused by positive voltage peaksduring low-resistance flash) of 6 A maximum with a charge content of 100 nC. Externalprotection against higher currents is described in Application note AN10227-01.

The DC voltage of pin VDD must be within the operating range of 180 V to 210 V duringthe peak currents.

10.2 Flashover protectionThe TDA6107AJF incorporates protection diodes against CRT flashover discharges that

Fig 8. Output voltage [pins Voc(1), Voc(2) and Voc(3)] falling edge as a function of the ACinput signal

51

49

Ov (in %)

t

t

mce476

150140

100

6050

2.34

2.96

1.73

Voc(V)

Vi(V)

tst

toc(f)

tco(p)9397 750 14728 Koninklijke Philips Electronics N.V. 2005. All rights reserved.


clamp the cathodes output voltage up to a maximum of VDD + Vd.


To limit the diode current an external 1.5 k carbon high-voltage resistor in series with thecathode output and a 2 kV spark gap are needed (for this resistor value, the CRT has tobe connected to the main PCB).VDD must be decoupled to GND:

1. With a capacitor > 20 nF with good HF behavior (e.g. foil); this capacitor must beplaced as close as possible to pins VDD and GND and must be within 5 mm.

2. With a capacitor > 3.3 F on the picture tube base print, depending on the CRT size.

10.3 Switch-off behaviorThe switch-off behavior of the TDA6107AJF is controllable. This is because the outputpins of the TDA6107AJF are still under control of the input pins for low power supplyvoltages (approximately 30 V and higher).

10.4 BandwidthThe addition of the flash resistor produces a decreased bandwidth and increases the riseand fall times.

10.5 DissipationA distinction must first be made between static dissipation (independent of frequency) anddynamic dissipation (proportional to frequency).The static dissipation of the TDA6107AJF is due to voltage supply currents and loadcurrents in the feedback network and CRT.

The static dissipation Pstat equals: Pstat = VDD IDD + 3 Voc Ioc

Where:

VDD = supply voltageIDD = supply currentVoc = DC value of cathode output voltageIoc = DC value of cathode output current

The dynamic dissipation Pdyn equals: Pdyn = 3 VDD (CL + Cint) fi Voc(p-p) Where:

CL = load capacitanceCint = internal load capacitance (4 pF)fi = input frequencyVoc(p-p) = cathode output voltage (peak-to-peak value) = non-blanking duty cycle

The TDA6107AJF must be mounted on the picture tube base print to minimize the loadcapacitance.9397 750 14728 Koninklijke Philips Electronics N.V. 2005. All rights reserved.



11. Test information

11.1 Quality informationThe General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable.

Current sources J1, J2 and J3 must be adjusted so that the DC output voltage of pins Voc(1), Voc(2) and Voc(3) is set to 100 V.Fig 9. Test circuit

mce459

2 M W

C1

191

J1

22 m F

22 nF

C2

4

probe 1

R1

100 k WR2

6.8 pFC10

20 nFC7

10 m FC8

3.2 pFC9

136 pFC11

VIPREFERENCE

Vi(1) Vof

Iom

Voc(1)

VDD

Ri

Rf

Ra

2 M W

C3

2

6

82

J2

22 m F

22 nF

C4

probe 2

R3

100 k WR4

6.8 pFC13

3.2 pFC12

136 pFC14

Vi(2) Vof

Iom

Voc(2)Ri

Rf

Ra

2 M W

C5

GND

TDA6107AJF

37

5

3

J3

22 m F

22 nF

C6

probe 3

R5

100 k WR6

4 V

6.8 pFC16

3.2 pFC15

136 pFC17

Vi(3) Vof

Iom

Vom

Voc(3)Ri

Rf

Ra9397 750 14728 Koninklijke Philips Electronics N.V. 2005. All rights reserved.



12. Package outline

UNIT A A3 b1 D1 2b2b c D(1) E(1) Z(1)

e L P P1 q1 q2q

REFERENCESOUTLINEVERSION

EUROPEANPROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 18.517.88.78.0

A4

15.515.1

1.401.14

0.670.50

1.401.14

0.480.38

21.821.4

21.420.7

6.486.20

3.43.2

2.54

e

2.54 1 65555.95.7

4.44.2

3.93.4

15.114.9

Q

1.751.55

DIMENSIONS (mm are the original dimensions)

Note1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

2.752.50

SOT111-1 95-03-1103-03-12

0 5 10 mm

scale

0.25

w

D

E

A

A

c

A2

3

A4

q 1q 2

L

e2

Q

w M

b

b1b2

D1

P

q

1

Z e

1 9

P

sea

ting

plan

e

pin 1 index

q

q

o

o

DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads SOT111-1

Amax. max.

2

3.79397 750 14728 Koninklijke Philips Electronics N.V. 2005. All rights reserved.


Fig 10. Package outline SOT 111-1 (DBS9MPF)


13. Handling informationInputs and outputs are protected against electrostatic discharge in normal handling.However, to be completely safe, it is desirable to take normal precautions appropriate tohandling integrated circuits.

14. Soldering

14.1 Introduction to soldering through-hole mount packagesThis text gives a brief insight to wave, dip and manual soldering. A more in-depth accountof soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages(document order number 9398 652 90011).Wave soldering is the preferred method for mounting of through-hole mount IC packageson a printed-circuit board.

14.2 Soldering by dipping or by solder waveDriven by legislation and environmental forces the worldwide use of lead-free solderpastes is increasing. Typical dwell time of the leads in the wave ranges from3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPbor Pb-free respectively.

The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plasticbody must not exceed the specified maximum storage temperature (Tstg(max)). If theprinted-circuit board has been pre-heated, forced cooling may be necessary immediatelyafter soldering to keep the temperature within the permissible limit.

14.3 Manual solderingApply the soldering iron (24 V or less) to the lead(s) of the package, either below theseating plane or not more than 2 mm above it. If the temperature of the soldering iron bit isless than 300 C it may remain in contact for up to 10 seconds. If the bit temperature isbetween 300 C and 400 C, contact may be up to 5 seconds.

14.4 Package related soldering information

[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit

Table 6: Suitability of through-hole mount IC packages for dipping and wave solderingmethods

Package Soldering methodDipping Wave

CPGA, HCPGA suitableDBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable [1]

PMFP [2] not suitable9397 750 14728 Koninklijke Philips Electronics N.V. 2005. All rights reserved.


board.[2] For PMFP packages hot bar soldering or manual soldering is suitable.


15. Revision history

Table 7: Revision historyDocument ID Release date Data sheet status Change notice Doc. number SupersedesTDA6107AJF_2 20050428 Product data sheet - 9397 750 14728 TDA6107AJF_1Modifications: The format of this data sheet has been redesigned to comply with the new presentation and

information standard of Philips Semiconductors. Changed data sheet status to product data sheet

TDA6107AJF_1 20030919 Preliminary specification - 9397 750 11632 -9397 750 14728 Koninklijke Philips Electronics N.V. 2005. All rights reserved.



16. Data sheet status

[1] Please consult the most recently issued data sheet before initiating or completing a design.[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at

URL http://www.semiconductors.philips.com.[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

17. DefinitionsShort-form specification The data in a short-form specification isextracted from a full data sheet with the same type number and title. Fordetailed information see the relevant data sheet or data handbook.

Limiting values definition Limiting values given are in accordance withthe Absolute Maximum Rating System (IEC 60134). Stress above one ormore of the limiting values may cause permanent damage to the device.These are stress ratings only and operation of the device at these or at anyother conditions above those given in the Characteristics sections of thespecification is not implied. Exposure to limiting values for extended periodsmay affect device reliability.

Application information Applications that are described herein for anyof these products are for illustrative purposes only. Philips Semiconductorsmake no representation or warranty that such applications will be suitable forthe specified use without further testing or modification.

18. DisclaimersLife support These products are not designed for use in life supportappliances, devices, or systems where malfunction of these products canreasonably be expected to result in personal injury. Philips Semiconductorscustomers using or selling these products for use in such applications do soat their own risk and agree to fully indemnify Philips Semiconductors for anydamages resulting from such application.Right to make changes Philips Semiconductors reserves the right tomake changes in the products - including circuits, standard cells, and/orsoftware - described or contained herein in order to improve design and/orperformance. When the product is in full production (status Production),relevant changes will be communicated via a Customer Product/ProcessChange Notification (CPCN). Philips Semiconductors assumes noresponsibility or liability for the use of any of these products, conveys nolicense or title under any patent, copyright, or mask work right to theseproducts, and makes no representations or warranties that these products arefree from patent, copyright, or mask work right infringement, unless otherwisespecified.

19. Contact informationFor additional information, please visit: http://www.semiconductors.philips.comFor sales office addresses, send an email to: [email protected]

Level Data sheet status [1] Product status [2] [3] Definition

I Objective data Development This data sheet contains data from the objective specification for product development. PhilipsSemiconductors reserves the right to change the specification in any manner without notice.

II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be publishedat a later date. Philips Semiconductors reserves the right to change the specification without notice, inorder to improve the design and supply the best possible product.

III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves theright to make changes at any time in order to improve the design, manufacturing and supply. Relevantchanges will be communicated via a Customer Product/Process Change Notification (CPCN).9397 750 14728 Koninklijke Philips Electronics N.V. 2005. All rights reserved.



20. Contents Koninklijke Philips Electronics N.V. 2005All rights are reserved. Reproduction in whole or in part is prohibited without the priorwritten consent of the copyright owner. The information presented in this document does

1 General description . . . . . . . . . . . . . . . . . . . . . . 12 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Ordering information . . . . . . . . . . . . . . . . . . . . . 14 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Pinning information . . . . . . . . . . . . . . . . . . . . . . 35.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 36 Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 47 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 48 Thermal characteristics. . . . . . . . . . . . . . . . . . . 58.1 Thermal protection . . . . . . . . . . . . . . . . . . . . . . 59 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 610 Application information. . . . . . . . . . . . . . . . . . . 910.1 Cathode output . . . . . . . . . . . . . . . . . . . . . . . . . 910.2 Flashover protection . . . . . . . . . . . . . . . . . . . . . 910.3 Switch-off behavior . . . . . . . . . . . . . . . . . . . . . 1010.4 Bandwidth . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1010.5 Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . 1011 Test information . . . . . . . . . . . . . . . . . . . . . . . . 1111.1 Quality information . . . . . . . . . . . . . . . . . . . . . 1112 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 1213 Handling information. . . . . . . . . . . . . . . . . . . . 1314 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1314.1 Introduction to soldering through-hole mount

packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1314.2 Soldering by dipping or by solder wave . . . . . 1314.3 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 1314.4 Package related soldering information . . . . . . 1315 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 1416 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 1517 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1518 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1519 Contact information . . . . . . . . . . . . . . . . . . . . 15not form part of any quotation or contract, is believed to be accurate and reliable and maybe changed without notice. No liability will be accepted by the publisher for anyconsequence of its use. Publication thereof does not convey nor imply any license underpatent- or other industrial or intellectual property rights.

Date of release: 28 April 2005Document number: 9397 750 14728

Published in The Netherlands

This datasheet has been download from:

www.datasheetcatalog.com

Datasheets for electronics components.

1. General description2. Features3. Ordering information4. Block diagram5. Pinning information5.1 Pinning5.2 Pin description

6. Internal circuitry7. Limiting values8. Thermal characteristics8.1 Thermal protection

9. Characteristics10. Application information10.1 Cathode output10.2 Flashover protection10.3 Switch-off behavior10.4 Bandwidth10.5 Dissipation

11. Test information11.1 Quality information

12. Package outline13. Handling information14. Soldering14.1 Introduction to soldering through-hole mount packages14.2 Soldering by dipping or by solder wave14.3 Manual soldering14.4 Package related soldering information

15. Revision history16. Data sheet status17. Definitions18. Disclaimers19. Contact information20. Contents

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tda 33