Susceptibility Evaluation of CAN Transceiver Circuits with ... · meter RF power sensor DC supply Bias tee AC DC DUT PCB P FRD P NET P REF Accordingly to IEC 62132-4, RF power is

Susceptibility Evaluation of CAN Transceiver Circuits with

In-Place Waveform Capturing under RF DPI

Kohki Taniguchi, Makoto Nagata, Akihiro Tsukioka, Daisuke Fujimoto, Noriyuki Miura, Takao Egami*, Rieko Akimoto*, Kenji Niinomi*, Terumitsu Komatsu*,

Yoshinori Fukuba*, Atsushi Tomishima*Graduate School of Science, Technology and Innovation, Kobe University, Japan

*Toshiba Corporation, [email protected]

http://www.edu.kobe-u.ac.jp/stin-secafy/

EMC Compo (St. Petersburg) 2017.7.5

M. Nagata, Kobe University 2017.7.5 -2-

Electronic sub assembly (ESA) stands for electronic/electric components fitted to a vehicle, and needs to be certified for international automotive EMC standards.Semiconductor IC chip vendors are to be ready to requests by ESA component/module suppliers (tier 1).

EMC awareness in IC chip vendors

Electronic module supplier

Car manufacturer

IC chipvendor

Certification for ECE-R10

Certification forCSPR25, ISO11452,

and others

Ready toIEC61967, IEC62132,

and others

RequestsRequests


IC chip EMC test standards (SC47A WG9)Physical origin Measurement method EstablishedGeneral

IEC61967

Part1: General 2002

ConductedEmission

Part4: 1 ohm/150 ohm 2002Part5: WBFC 2003Part6: Magnetic probe 2002

RadiatedEmission

Part2: TEM cell 2005Part3: Surface scan 2014Part8: IC strip line 2011

General

IEC62132

Part1: General 2006

ConductedImmunity

Part3: BCI 2007Part4: DPI 2006Part5: WBFC 2005

RadiatedImmunity

Part2: TEM cell 2010Part8: IC strip line 2012

Source JEITA

EMS

EMI


Outline

1. Background2. RF DPI test on CAN transceiver3. RF DPI test extended with on-chip monitoring (OCM) 4. CAN in-place waveforms – Si examples 5. Conclusions


SG AMP Directionalcoupler

RF powermeter

RF powersensor

DCsupply

Bias teeAC

DC

DUT

PCB

PFRD PNET

PREF

Accordingly to IEC 62132-4, RF power is directly injected into a pin of an IC chip, for measuring the immunity of IC-chip operations against incoming RF noise/disturbance.

EMS evaluation of IC chip with RF DPI(EMS: electromagnetic susceptibility, RF DPI: RF direct power injection)


IEC TS 62228 – EMC evaluation of CAN transceiversThree identical test chips with CAN Tx/Rx circuits are tied to CAN_BUS.

EMS evaluation setup defined for CAN

Chip side

CAN_BUS

VCC

OCM area

DUT area

Chip 1

Chip 2

Chip 3

Tx

Rx

Rx

CAN_BUS


RF DPI on CAN; Threshold Power

Tx-Rx delay (Tdelay) varies as function of (FRF, PFWD) under RF DPI.

Tx

DPI N.A.Rx

Tdelay< 200 ns

Tolerance of delay variation: 200 ns in HS CAN (10% of Tx bit-time for the bit rate of 500 kbps)26

28

30

32

34

36

38

1 10 100 1000

P FWD

(dBm

)

FRF (MHz)

PMAX =36 dBm

Delay exceeded tolerance

Expected mask (conceptual)

CAN IC chip is EMC compliant


26

28

30

32

34

36

38

1 10 100 1000

P FWD

(dBm

)

FRF (MHz)

PMAX =36 dBm

Delay exceeded tolerance

RF DPI on CAN; Threshold Power

TxRx

DPI: FRF =5 MHz, PNET =34.2dBm

Unexpected glitches under RF DPI, although in the tolerance of delay var.

Why glitches???- PSRR- CMRR- Multiply rooted by ESD, BGR, VR, and many others


Outline

1. Background2. RF DPI test on CAN transceiver3. RF DPI test extended with on-chip monitoring (OCM) 4. CAN in-place waveforms – Si examples 5. Conclusions


RF DPI system extended with OCM function

Analog signalsDigital signals

FPGAboard

OCM I/F board

DPI system

OCM system

USB

PC

System clock (Ref_clk)

DUTboard

Backplane (GPIB)

SG PA PNET

FRF

Power meter

In-place waveform capturing for in-depth understanding of CAN circuit-level response to voltage-mode disturbance induced by RF DPI

(OCM: on-chip waveform monitoring)


CAN under Extended RF DPI (with OCM)CANH

CANLRF

Rx

TxNode1

CAN

OCM

Node2

CAN

OCM

Node3

CAN

OCM

Rx

CAN Transceiver

Tx

Rx

CANH

CANL

VDC

OCM


CAN signal/power line

cf. VRF DPI >> 10 VVSIG CAN < 5 V

OCM with high voltage tolerance

LV SF(CMOS)

HV SF(DMOS)

HV SW LV LC

N:1Divider

DPU

MUX

VIN DOUT

VREF

TSTRB

SF: Source followerLC: Latch comparatorSW: SwitchMUX: MultiplexerDPU: Data processing unit

Vbias

Vsfi

Vsfo

Low voltage (LV, CMOS) and high voltage (HV, DMOS) input channelsHV for large-signal sinusoids induced by RF DPI, while LV for internal signalsOffset/gain variations of HV channels are calibrated by LV reference channel


Automotive EMC test vehicle

HV OCM

HV OCM OCMOCM CAL

OCMCalibration Noise

source

CAN Transceiver Analog cores

Auto-motivecores

130 nm BiCDprocess technology

CAN Tx/Rx OCM frontend/

backend

DUT PCB I/F PCB FPGA board


In-place waveforms: CAN Rx (High)

Dominant (Logic L) Recessive (Logic H)1.5

2.0

2.5

3.0

3.5

0.0 1.0 2.0 3.0 4.0

V OCM_

H(V

)

Time (s)

DPI off PNET =4.1 dBmPNET =15.8 dBmPNET =21.3 dBmPNET =26.5 dBm

Time resolution: 10 ns


In-place waveforms: CAN Rx (Low)


2.0

2.5

3.0

3.5

0.0 1.0 2.0 3.0 4.0

V OCM_

L(V

)

Time (s)


Time resolution: 10 ns


In-place waveforms: CAN Rx (Differential)

Dominant (Logic L) Recessive (Logic H)-0.1

0.0

0.1

0.2

0.3

0.0 1.0 2.0 3.0 4.0

V OCM_

DIFF

(V)

Time (s)


CAN as multiple-master logical AND system – dominant (logic L) driver wins.


In-place waveforms: CAN Rx (High)


2.0

3.0

4.0

0.0 1.0 2.0 3.0 4.0

V OCM_

H(V

)

Time (s)

PNET =36.2 dBm

DPI off PNET =21.5 dBmPNET =26.6 dBmPNET =28.1 dBm

PNET =38.2 dBm


In-place waveforms: CAN Rx (Low)

1.0

2.0

3.0

4.0

0.0 1.0 2.0 3.0 4.0

V OCM_

L(V

)

Time (s)

Dominant (Logic L) Recessive (Logic H)

PNET =36.2 dBm


PNET =38.2 dBm


In-place waveforms CAN Rx (Differential)Dominant (Logic L) Recessive (Logic H)

-0.0

0.1

0.3

0.5

0.0 1.0 2.0 3.0 4.0

V OCM_

DIFF

(V)

Time (s)

0.6

0.4

0.2

0.0

PNET =36.2 dBm


PNET =38.2 dBm


CAN Rx (High resolution at 1 ns, differential)

0.1

0.3

0.3 0.4 0.6 0.7 0.8

V OCM_

DIFF

(V)

Time (s)

0.4

0.2

0.0

-0.1

0.5

DPI off PNET =34.2 dBm

RecessiveDominantRx

2.3 2.4 2.6 2.7 2.8Time (s)2.5

DPI off PNET =34.2 dBm

0.1

0.3

V OCM_

DIFF

(V)

0.4

0.2

0.0

-0.1

DominantRecessive

Rx glitch due to RF DPI


ConclusionsRF DPI test for CAN transceiver is extended with on-chip waveform monitoring (OCM).In-place waveforms of CAN circuits exhibit two key susceptibility mechanisms:(1) Large signal common to differential mode transition(2) Glitches due to additional crossings to the threshold level Criteria to IC designs toward EMC compliance: – desensitizing techniques for voltage-mode RF disturbances

IC-level EMC simulation techniques in high demand:“Sensitivity analysis for multi states and even in their transition”“Chip-package-system board interaction”

Documents

Susceptibility Evaluation of CAN Transceiver Circuits with ... · meter RF power sensor DC supply Bias tee AC DC DUT PCB P FRD P NET P REF Accordingly to IEC 62132-4, RF power is