forming a contact hole in an insu- lating layer exposing a substrate; forming an adhesion layer on the sidewalls; electrolessly depositing a first barrier layer; activating; selectively electrolessly plating a first metal; forming a second insu- lating layer; pat terning a second insula t ing layer to form a via hole; forming a second barrier lay- er; activating; selectively electro- less plating a second metal filling the via hole.

METAL DEPOSIT PROCESS U.S, Patent 6,180,524. Jan. 30, 2001 G.W. Ferrell, Hal f Moon Bay, Calif.

A method for controllable deposit of a metal on a surface of an ob- ject, rinsing an exposed surface of a selected workpiece in a solution in an oxygen-free solution includ- ing liquid ammonia and draining the solution; us ing electroless deposition to provide a seed thick- ness of a selected metal no more than 0.1 t~m; contacting the work- piece exposed surface in an elec- troplating solution including the selected metal and liquid amino- nia; causing the selected metal in the electroplating solution to de- posit on the workpiece exposed surface; providing an electrically conducting plate within the elec- troplating solution; providing a selected voltage difference be- tween the workpiece exposed sur- face and the electrically conduct- ing plate; and when a second selected thickness has been de- posited removing the remaining electroplating solution and rins- ing the workpiece exposed surface in liquid ammonia.

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S P R A Y S Y S T E M U.S. Patent 6,182,908. Feb. 6, 2001 R.J. Hamilton, assignor to Spraying Systems Co., Wheaton, Ill.

A solenoid-operated, heated liq- uid spray device.

ABRASIVE ARTICLE U.S. Patent 6,183,346. Feb. 6, 2001 J.J. Gagliardi, assignor to 3M Innovative Properties Co., St. Paul, Minn.

An abrasive article comprising an embossed isolation layer defining contoured first and second sur- faces with a plurality of peaks on the first surface producing a plu- rality of pockets on the second surface; grinding aid-containing p ro t rus ions pos i t ioned in the pockets, wherein the grinding aid is selected from the group consist- ing of halogenated thermoplas- tics, sulfonated thermoplastics, waxes, halogenated waxes, sulfo- nated waxes, and mixtures there- of; and a coating of abrasive par- ticles adhered to the contoured first surface of the isolation layer.

ELECTROLESS NICKEL BATH U.S. Patent 6,183,546. Feb. 6, 2001 C.E. McComas, assignor to McComas Industries International, Richmond Hill, Can.

A coating bath for providing a hard, wear- and corrosion-resis-

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tant , ductile coating on a sub- strate having a pH of 10 to 14 and comprising 0.175 to 2.10 moles per gallon of coating bath of nickel ions; 0.0508 to 0.11872 grams per gallon of a mixture containing thall ium nitrate and thall ium sul- fate as a stabilizer wherein the percentage of thall ium nitrate in the mixture is less than 50% of the combined weight of the thal- lium nitrate and thall ium sulfate; an effective amount of metal ion complexing agent in an amount sufficient to inhibit precipitation of the metal ions from the coating bath; and an effective amount of a borohydride reducing agent.

SURFACE TREATMENT PROCESS U.S. Patent 6,183,570. Feb. 6, 2001 J. Kawaguchi and H. Iizuka, assignors to Nihon Parkerizing Co. Ltd., Tokyo

A surface t rea tment process for a stainless steel surface comprising a first step in which etching pits are produced accompanied with a formation of a film coat by con- tacting with a first aqueous solu-

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November 2001 93

tion of oxalic acid ion and hy- drofluoric acid ion; and a second step in which the film coat is re- moved by contacting with a sec- ond aqueous solution of a mixture of nitric acid and hydrofluoric acid.

COMPOSITE PLATING APPARATUS U.S. Patent 6,183,610. Feb. 6, 2001 Y. Kataoka et al., assignors to Nihon Parkerizing Co. Ltd., Tokyo

An apparatus for composite plat- ing the inner surface of a cylindri- cal body,

SPUI"I'ERING CATHODE U.S. Patent 6,183,612. Feb. 6, 2001 R. Adam et al., assignors to Leybold Systems GmbH, Hanau, Germany

A sputtering cathode with a flat plate-shaped target formed from at least one part comprising a tub- shaped yoke having a center ridge and a tub rim with end faces and being spaced apart from and be- hind a target.

SPUTIrEH TARGET/BACKING PLATE ASSEMBLY U.S. Patent 6,183,613. Feb. 6, 2001

P.S. Gilman et al., assignors to Praxair S.T. Technology Inc., Danbury, Conn.

A sputter target assembly com- prising a target member; a back- ing member; and a block member.

ROTATING SPUTTER MAGNETRON ASSEMBLY U.S. Patent 6,183,614. Feb. 6, 2001 J. Fu, assignor to Applied Materials Inc., Santa Clara, Calif.

A magnetron assembly position- able at a backside of a sputtering target and rotatable about a cen- ter position of the target.

ELECTROCOAT BATH STABILIZATION U.S. Patent 6,183,616. Feb. 6, 2001 H. Sakamoto et al., assignors to Nippon Paint Co. Ltd., Osaka, Japan

A method of stabilization of elec- trolyte bath in electrocoating for obtaining electrodeposition coat by immersing a substrate in the electrolyte bath filled with a cat- ionic electrocoating composition containing a basic resin and an

amine compound and carrying out electrocoating.

TIN PLATING PROCESS U.S. Patent 6,183,617. Feb. 6, 2001 D. Guhl and F. Honselmann, assignors to Th Goldschmidt AG, Essen, Germany

A self-regulating, acidic electro- lyte for tin plating aluminum al- loys.

SULFONIC ACID ELECTROPLATING BATHS U.S. Patent 6,183,619. Feb. 6, 2001 H.D. Gillman et al., assignors to Technic Inc., Cranston, R.I., and Special Chemical Systems Inc., Royersford, Pa.

A method of improving the plat- ing performance of sulfonic acid based electroplating baths com- prising replacing at least a por- tion of the alkyl sulfonic acid elec- trolyte with a salt of an alkanol sulfonic acid or of a mixture of an alkyl sulfonic acid and an alkanol sulfonic acid, wherein the replace- ment salt is selected from the group consisting of alkali metal, alkaline earth metal, and ammo- nium or substituted ammonium salts.

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ADDITIVE FOR ELECTROREFINING AND ELECTROWINNING U.S. Patent 6,183,622. Feb. 6, 2001 R. Janik, assignor to Enthone-OMI Inc., Warren, Mich.

A method for improving the duc- tility of copper produced by the electrowinning or electrorefining of copper from a copper electrolyte bath comprising adding an addi- tion agent consisting essentially of a bath-soluble adduct of a ter- t iary alkyl amine.

ABRASIVE SHEET U.S. Patent 6,183,677. Feb. 6, 2001 A. Usui and Y. Yoshida, assignors to Kovax Corp., Tokyo

A method of manufactur ing an abrasive sheet comprising form-

94 Metal Finishing