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STULZ Micro DCwith Chip-to-AtmosphereTM Liquid to Chip Cooling
STULZ Micro DCData center professionals and communication service
providers (CSPs) face an increasingly difficult world. The
continued deluge of connected devices finds the modern
IT professional facing the reality of internet traffic surging
by as much as 50 percent each year, not to mention the
need of networks to handle more bandwidth intensive
operations with minimal latency.
The STULZ Micro DC provides a cost-effective solution
for rapidly deploying IT capacity exactly where it is
• Quick configuration & delivery
• Drop-in solution (ease of install and expansion)
• Scalable from low to high density using precision air and
liquid-to-chip cooling options
• Modular design with removable Integrated Cooling Solution (ICS)
to fit through standard doorway
• Configured, tested, and shipped from Frederick, MD USA
• Worldwide sales and service network
• Suitable for non-data center environments
Features & Benefits
Why Choose STULZFor over 50 years, STULZ has engineered and
manufactured mission critical environmental control
equipment for data centers, computer rooms, and
mission critical IT spaces on a global scale. The success
of our company is driven by listening to our customers
and delivering innovative solutions.
needed. This modular, and highly efficient solution can
easily scale to accommodate the needs of today and the
rapid growth of tomorrow, even in space constrained
environments.
Each micro data center can be configured for low/
mid density IT loads and scale up to higher density
workloads with a combination of integrated precision air
cooling and Direct Contact Liquid Cooling (DCLC) .
• IT Rack Alone
• IT Rack with Side ICS
• Rack with 2x Side ICS
Three Rack Sizes
Retail
Edge to DC on Demand
Server Room Optimization
FinanceMicro
Data CenterSolutions
High Density
Industry 4.0
Oil, Gas & Mining
Traditional DC or Austere Facility
The STULZ Micro DC is a cost effective way to provide scalable IT resources in proximity to demand, retrofit
existing critical infrastructure, or simply add additional compute and storage at the edge of your network.
• Additional Configurations and Multi-Rack Solutions Upon Request
• 48U Standard
Each modular system can be configured with all of the necessary critical power, distribution, rack security, and
cooling integrated to your requirements. All configurations of the STULZ Micro DC feature a standard 19“
rack which can be easily outfitted with standard accessories including UPS, PDU, cable management, LED
lighting, environmental monitoring software and more.
Modular and Scalable SolutionCommon Accessories / Features
• Fire Suppression
• Spring Open Door
• Security
• Alarms
• UPS
Configurable Options
Power DistributioneConnect PDU‘s with Environmental Probe & Temperature Humidity Sensor
Monitoring & SecurityRemote Infrastructure Management
Cable ManagementUniversal Cable Runway withHorizontal Cable Management
Rack ConstructionHeavy Duty Steel Construction with Powder Coat Finish
• E-Access
• Lighting
• STULZ state-of-the-art E2 Microprocessor with a range of BMS interface options
• Available with optional black or white paint
What is Chip-to-Atmosphere Liquid-to-Chip Cooling?STULZ and CoolIT have partnered to combine Precision Air Cooling and Direct Contact Liquid CoolingTM
(DCLC) technology. This unique combination creates Chip-to-AtmosphereTM Cooling. DCLC uses the
exceptional thermal conductivity of liquid to provide concentrated cooling to the hottest components inside
a server, enabling very high density configurations. CoolIT’s centralized pumping liquid cooling solutions can
be tailored to any server layout and have already been adopted by many server manufacturers as a reliable
technology.
Liquid-to-Chip CoolingThe time has come for your Data Center
• Higher kW per rack by massively parrallel computing in one compute center or data center
• Not just for high performance data centers
- Leading chip manufacturers are designing processors that must be liquid cooled
- By running the processor cooler at lower temperatures there is a greater level of
reliability
- Artificial intelligence, VR and massive data aquisition applications are driving high
performance parallel computing
• Patented coldplate technology supports CPU, GPU, ARM and ancillary interposers, heat
pipes, or heat spreaders
• Reliable stainless steel manifolds employing dry break, quick connect technology in horizontal
or vertical chassis
• Servers from HP, Lenovo, Dell, Huawei, NEC, Intel,
SuperMicro and others are supported
• Servers from almost any rack can be adapted
• Retrofit or new builds
Rack w/ICS & DCLCTotal Space Available: 48U
Space Used for Cooling: 10URemaining Space: 38U
Modular Configuration ExamplesUtilizing Precision & Liquid Cooling
Side Mounted: Integrated Cooling Solutions (ICS)• Side Mount provides up to 27 kW of cooling = 48U Available• Minimal energy consumption• Provides precise temperature control• Available in chilled water, air, water and glycol cooled
systems• EC Fans can be controlled independently of each other
for optimum adaptation to different return air and supply air temperatures (ICS Side Mount)
• STULZ’ state-of-the-art E2 Microprocessor with a range of BMS interface options
Rack w/ICSTotal Space Available: 48U
Space Used for Cooling: 6URemaining Space: 42U
Rack w/Side ICSTotal Space Available: 48U
Space Used for Cooling: 0URemaining Space: 48U
Scalable and Modular - Small Servers to High Density
Precision
Precision
PrecisionLiquid
Precision
Rack w/Side ICS + DCLCTotal Space Available: 48U
Space Used for Cooling: 4URemaining Space: 44U
Rack w/Multi-Side 2xICS + DCLCTotal Space Available: 48USpace Used for Cooling:4U
Remaining Space: 44U
Scalable and Modular - Small Servers to High Density
LiquidPrecision
LiquidPrecision
Direct Liquid to Chip Cooling (DCLC)• 80 kW of chip level cooling per rack (@ 30C facility water)
• Internal mount utilizes 4U = 44U Remaining
• Manages 120+ servers
• Quick and easy service
• Uses only 652W
• Servers remain hot-swappable for service
• High temperature return water can be used for heat re-use
Liquid
Internally Mounted: Integrated Cooling System (ICS)• Internal Mount with 3 kW (6U) per unit for additional cooling = 42 U Remaining• Minimal energy consumption• Provides precise temperature control• Available in chilled water, air, water and glycol cooled systems• STULZ’ state-of-the-art E2 Microprocessor with a range of BMS interface options
Precision
* Multiple N + 1 Solutions for each Cabinet will Increase Capacity
STULZ AIR TECHNOLOGY SYSTEMS (STULZ USA) , INC. 1572 Tilco Drive | Frederick, MD 21704 Tel. 301.620.2033 | Fax 301.662.5487
QC-MDC0110 - © STULZ USA – All rights reserved
UltrasonicHumidification
Perimeter
Row
Drop-inReplacement
EC FanRetrofit
Ceiling
PackagedRooftop AHU
IndirectEvaporativeAir Handler
CustomAir Handler
Modular
Retrofit&
Replacement
IndoorCooling
OutdoorCooling
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DirectExpansion
(DX)
ChilledWater(CW)
Air-SideEconomizer
Water-SideEconomizer
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Controls&
Monitoring
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MultipleColor
Options
CustomAir Handler • • • • •
E2 ControllerRetrofit • • • •
Solutions Portfolio
DesiccantDehumidification • • • •
HumidityControl
MicroData Center • • • • •Liquid Chip
Cooling • • • • •
