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Strategy for the Future Delivering high-added values from an equipment supplier
September 7, 2016
Tony Kawai
President & CEO
Tokyo Electron Limited
T. Kawai / September 7, 2016 2
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Because of the server capacity
Why was Pokemon-GO release
delayed in its home ground Japan ?
Pixabay.com
T. Kawai / September 7, 2016 3
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User’s frustration is…
Battery runs out soon
Because of AR and GPS which consume high-power
5%
Pixabay.com
T. Kawai / September 7, 2016 4
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ja.wikipedia.org
It requires sensor systems and AI enabling advanced
semiconductor
Autonomous driving will transform society
T. Kawai / September 7, 2016 5
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New wave of IoT technologies
New disruptive technologies require higher performance,
lower power and higher reliability devices
VR
FinTech
AR Cloud
Autonomous
Driving
AI Advanced
Robotics
T. Kawai / September 7, 2016 6
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Semiconductor technology roadmap
2015 2016 2017 2018 2019 2020
Logic
DRAM
3D NAND
Emerging Memory
Advanced Package
Source: TEL marketing, as of April 2016
As technology becomes complex,
the role of equipment supplier is getting more critical
Logic 3D NAND DRAM
STT-MRAM XPoint
Emerging Memory
1Xnm 1Ynm 1Znm 20nm
48 layer 64 layer 96 layer
14nm 10nm 7nm
Fan Out-WLP / 2.5D, 3D
ReRAM, XPoint
STT-MRAM
T. Kawai / September 7, 2016 7
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TEL™ leading-edge technologies
Quest for leading-edge solutions with wide range of products
Plasma
etching
Thermal
processing CVD ALD PVD Cleaning
Coater/
developers
CLEAN TRACK™
LITHIUS Pro™ Z CELLESTA™-i EXIM™
NT333™ Triase+™
Stratus™ CLEAN TRACK™
LITHIUS Pro™ AP Apollo Precio™
Coater/
developers PVD
Electro-
plating Prober Bonder
Synapse™ S
Tactras™ TELINDY
PLUS™
T. Kawai / September 7, 2016 8
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Integrated technology is becoming more essential
SAMP (self-aligned multiple patterning)
SAC (self-aligned contact)
SAMP requires ALD,
which can control
deposition thickness at
the nm scale
ALD and ALE are
indispensable to SAC,
which is now dominant in
MOL contact
44nm hp 22nm hp 11nm hp 5.5nm hp
We propose optimized solutions which solve customer’s
critical problems by integrating our various technologies
T. Kawai / September 7, 2016 9
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TEL- IMEC partnership since 1998
This collaboration began with lithography area,
Now expanded to other key technology programs
8 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2004 2015 2016
Adv. Interconnect
Logic
Memory ReRAM STT -MRAM
248 nm, Immersion and EUV
3DI
DSA
1998
Intg. Patterning
T. Kawai / September 7, 2016 10
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TEL - Tohoku University partnership for STT-MRAM
Device
maker
System
maker
Metrology
tool maker
Materials
maker
*CIES: Center for innovative integrated electronic systems
in Tohoku University since 2012.
60% cell size reduction (vs. conventional off-via MTJ cell )
Over 95% average yield
2Mb STT-MRAM fabricated with 90nmCMOS/60nm MTJ
adapting on-via MTJ cell structure
Achieved with TEL’s PVD & RIE
Significant results achieved by open innovation
By courtesy of Professor Endoh, Director of CIES
H. Koike et al. @ IMW2016
STT-MRAM
T. Kawai / September 7, 2016 11
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New wave of IoT technologies
Existing technologies just as important as innovative
technologies
VR
FinTech
AR Cloud
Autonomous
Driving
AI Advanced
Robotics
T. Kawai / September 7, 2016 12
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Semiconductor manufacturing process node for IoT
Manufacturing process node going multi-generational
Existing manufacturing lines just as important
0
2,000
4,000
6,000
8,000
10,000
12,000
2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020
7nm
10nm
14nm
20nm
28nm
45nm
65nm
90nm
0.13micron
0.18micron
0.25micron
0.35micron
0.5micron
Source : IHS, Semiconductor Silicon Forecast Tracker Q2, 2016
Wafer Consumption by Node
Forecast
<10nm
14nm 20nm
90nm
28nm
>90nm
65nm
(Mil. sq. inch)
Leading-edge
Mature Technology
T. Kawai / September 7, 2016 13
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Our strategic directions in IoT era
Respond to customer needs in all generations
Provide leading-edge equipment
Improve performance of
legacy equipment
T. Kawai / September 7, 2016 14
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Providing solutions for equipment in the field - capacity
TEL’s world-wide installed base: 60,000 units
(Taiwan 12,000 units)
Fully support customers’ diversified needs driven by IoT
Upgrades to leading-edge
technology
TEL-certified used
equipment
T. Kawai / September 7, 2016 15
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Providing solutions for equipment in the field - productivity
Increase equipment productivity and lower
manufacturing costs
27% reduction in MTTR
35% reduction in process variability
20% reduction of consumables
10% improvement in throughput
Customer
fab site
TEL real-time Database server
DB
Internet
Actual values based on specific situations. Results may vary.
Intelligent Remote Service
TELeMetrics™
T. Kawai / September 7, 2016 16
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Providing further values - smart manufacturing
Smart manufacturing realized by intelligent equipment
Intelligent equipment
• Sensing & AI technology
• Optimal process control
• Self-diagnosis
• Predictive fault detection
T. Kawai / September 7, 2016 17
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Taiwan, the largest spender and the largest wafer capacity
holder
Taiwan plays a critical role in the semiconductor industry
both in terms of “production” and “technology development”
Wafer capacity at Dec-2015
Korea 21%
Japan 17%
US 14%
China 10%
Europe 6%
Other 10%
Taiwan
22%
Source：IC Insights, Monthly installed
capacity in 200mm equivalents
Wafer-fab equipment
spending in 2015
Korea 22%
Japan 15%
U.S. 15%
China 12%
Europe 6%
Other 4%
Taiwan
26%
Source: VLSI Research
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As new and innovative applications emerge, semiconductors are
required to evolve further
Customers’ needs get diversified. We continue to provide leading-
edge technologies that support customer’s further scaling, while
providing solutions to customers’ needs by upgrading their existing
manufacturing technologies
TEL is fully committed to support semiconductor industry in Taiwan
which is a critical base both in terms of “production” and
“technology development”
Summary
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