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STAVE ASSEMBLY- STATUS. Drawings for half stave assembly jig are concluded The jig is assembled Test on Module gluing Module handling Module alignment are starting Drawings of tools for module gluing test are concluded for glue for adhesive tape Tools have been fabricated. - PowerPoint PPT Presentation
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STAVE ASSEMBLY- STATUS
•Drawings for half stave assembly jig are concluded
•The jig is assembled
•Test on1.Module gluing2.Module handling3.Module alignment
are starting
•Drawings of tools for module gluing test are concluded 1. for glue 2. for adhesive tape
•Tools have been fabricated.
•Drawings for stave assembly jig are ongoing
S.COLI- 12/03/2014 1
• STAVE: assembly of 2 half-staves• HALF-STAVE:
• outer layers: 7 modules
• MODULE: 7x2 chips for all layers• FPC (Flex Printed Circuit): Al or Cu
on polymide (X/X0: ~ 0.8->1 %)• POWER BUS: Al on polymide
2S.COLI- 12/03/2014
BASE and RAILS
MODULE BOX
ALIGNMENT STATION
REMOVABLE BASE
HALF STAVE ASSEMBLY JIG
• The base and rails: to put the module in position
• The alignment station: to handling and aline the modules
• The module box: to store, carry and prealign the modules
• The removable base: to accomodate the cold plate, to interconnect the modules and to position the BUS cable
PROCEDURE FOR THE HALF STAVE ASSEMBLY (1)• The cold plate is put in position by two pins
and taken by vacuum on the removable base
Pin for cold plate positioning
Cold plate in taken position by vacuum
S.COLI- 12/03/2014 3
• The glue (or adhesive tape is spread)
• With an alignment station the modules are taken from the box and positioned on the cold plate under a measuring machine.
Second module in the box ready to be aligned
First module positioning
Six module aligned
Last module positioning
module
S.COLI- 12/03/2014 4
PROCEDURE FOR THE HALF STAVE ASSEMBLY (2)• The base holding the aligned modules
glued onto the cold plate can be removed for Module interconnection and BUS positioning
HALF STAVE ASSEMBLY JIG
The jig is completed and assembled under the Mytutoyo measuring machine. It will be used for:- Module handling test- Module alignment test- Half stave assembly
BASE and RAILS
MODULE BOX
ALIGNMENT STATION
REMOVABLE BASE
S.COLI- 12/03/2014 5
FIRST HALF STAVE PROTOTYPE-FIRST DECISIONS
OPEN POINTS on JAN 2014:1. Module with carbon plate or not (?)2. Adhesive tape or glue (?) between cold
plate and modules. 3. Module marker on chips visible through
FPC or placed on FPC (?)4. Module box definition5. Mytutoyo or Poli measuring machine (?).
[The base is removable to cover the 1,5m stroke in case we use the Mytutoyo measuring machine].
S.COLI- 12/03/2014 6
For the FIRST HALF STAVE PROTOTYPE:1. Modules without carbon plate2. Glue will be used, but test with adhesive tape
will be done.3. Module marker are on FPC for first dummy
modules, but then the marker will be on chips visible through FPC.
4. The Module box has been defined and prototypes are on going
5. Mytutoyo measuring machine will be used.
TEST ON MODULEGLUING TEST
Tools for module gluing test with glue and adhesive tape.Masks to use both solutions are in fabrication
First test with mask used by BARI group
S.COLI- 12/03/2014 7
TEST ON MODULEHANDLING MODULE SYSTEMS [CAGLIARI]
Suction cups
springs
S.COLI- 12/03/2014 8
TEST ON MODULEMODULE HANDLING and MODULE ALIGNMENT [with Cagliari]
FPC LAYOUT
REFERENCE POINTS
«dummy-dummy Modules!»
S.COLI- 12/03/2014 9
STAVE ASSEMBLY JIG
Check the compatibility with masks for the reference points.
S.COLI- 12/03/2014 10
NEXT STEPS
• Test on module gluing
• Test on adhesive tapes
• Test on module handling
• Half stave assembly
• Verify the compatibility between stave assembly jig and the mask for the positioning of the stave reference points on end wheels.
• Foresee the possibility to test the module just after gluing (the detectors are hidden by the cold plate and the FPC).
• Conclude drawings for stave assembly jig.
S.COLI- 12/03/2014 11
12
Simple circuits for soldering tests
• Different pad dimensions: • 1,2 x 0,6 mm • 1 x 0,3 mm
• Different pad pitch• 0,4 mm • 0,3 mm
S. Beolè
connection bridge
Cu lines onkapton
13
Pads for interconnection between FPCs
• home made kapton bridges: pads size can be chosen according to chip pad layout
kapton flex
FPC FPC
TIN
kapton flex
by Michele Sacchetti
• arrays of SMD resistors (0 W) 0603 –> W 1-1.6mm L= 2-3.2 mm P=0.5-0.8mm
S. Beolè