Embed Size (px)
Citation preview
© 2021
From Technologies
to Markets
Status of the Memory Industry
Market and Technology
Report 2021
Sample
22
• Memory players and supply chain 186
o Memory players – financial analysis 200
o Supply chain mapping 216
o Merger and acquisitions and new companies 229
• Memory modules and storage drives 236
o Memory modules 240
o Storage drives 251
o Persistent memory 262
• China’s memory landscape 272
Status and prospects, investments, competitive landscape
• NAND – market forecast 299
Revenues, market shares, ASP, shipments & demand, CapEx and more
• DRAM – market forecast 308
Revenues, market shares, ASP, shipments & demand, CapEx and more
• Emerging NVM technology, forecast and players 317
Technology description, challenges, roadmap, forecast, main trends, and more
• Embedded memory business – overview 342
• Impact of Covid-19 pandemic on the memory market 356
• General conclusions 361
• Noteworthy news 365
• How to use your data? 374
• Yole Corporate presentation 375
• Glossary and definitions 2
• Table of contents 10
• Report objectives 11
• Scope of the report 12
• Methodology & definitions 13
• About the authors 14
• Companies cited in this report 17
• Comparison with the 2020 report 18
• Who should be interested in this report 19
• Yole Group related reports 20
• Three-page summary 22
• Executive summary 26
• Memory market – drivers and dynamics 69
o Datacenters 81
o Mobile devices 92
o Automotive 98
o PC and consumer electronics 108
• Stand-alone memory market and technology 118
o NAND market and technology 126
o DRAM market and technology 150
o NOR flash and other stand-alone memory 171
Status of the Memory Industry 2021 | Sample | www.yole.fr | ©2021
TABLE OF CONTENTS
33
4DS, Adata, Adesto, Advantest, Alliance Memory, AP Memory, Apacer, Apple, Applied Materials, ASE Tech. Hold.,
ASML, Avalanche, Buffalo, Canon, Centon, CXMT, Cisco, CNE, Crocus, Crossbar, Cypress, Dell, Dosilicon, Etron,
ESMT, Everspin, Facebook, Ferroelectric Memory Company, Fidelix, Freescale, Fudan Microelectronics, Fujitsu,
Fusion IO, GigaDevice, GlobalFoundries, Google, GSI Technology, H-Grace, Hikstor, Hitachi, HLMC, Honeywell, HP,
Huawei, IBM, IDT, IMEC, Infineon, Intel, ISSI, JHICC, Kingston, KLA Tencor, Kioxia, Lam Research, Lapis, Lenovo,
Longsys, Liteon, Lyontek, Macronix, Marvell, Maxio, Maxim, Materion, MediaTek, Microchip, Micron, Montage
Technology, Nantero, Nanya, Naura, Nikon, NEC, NetApp, NetList, Numonyx, NXP, ON Semiconductors,
Panasonic, Phison, Powerchip, Powertech, ProMOS Technologies, Qualcomm, Rambus, Reliance, Realtek, Renesas,
Rohm, Samsung, SanDisk, Seagate, Semtech, Silicon Motion, SK hynix, SK Materials, Smart Modular Technologies,
SMIC, Sony, SPIL, SST, Spin Memory, STMicroelectronics, STEC, Swissbit, TDK, Texas Instruments, Tezzaron, TEL,
Teledyne e2v, TowerJazz, TPSCo, Transcend, Tsinghua Unigroup, TSMC, UMC, UniIC Semiconductors, Unimos
Microelectronics, Viking, Violin Memory, Weebit, Western Digital, Winbond, XFab, XMC, YMTC, Chinese emerging
NVM players and more…
Status of the Memory Industry 2021 | Sample | www.yole.fr | ©2021
COMPANIES CITED IN THIS REPORT
44
Simone Bertolazzi, Ph.D.
Simone Bertolazzi, PhD is a Senior Technology & Market analyst at Yole Développement (Yole) working with the Semiconductor & Software division. He is member of
the Yole’s memory team and he contributes on a day-to-day basis to the analysis of memory technologies, their related materials and fabrication processes.
Simone obtained a PhD in physics in 2015 from École Polytechnique Fédérale de Lausanne (Switzerland), where he developed novel flash memory cells based on
heterostructures of two-dimensional materials and high-κ dielectrics.
Walt Coon
Walt Coon is VP of NAND & Memory Research is a member of the Semiconductor, Memory & Computing division, at Yole Développement (Yole).
Based in the US, Walt is leading the day-to-day production of both market updates and Market Monitors, and is deeply involved in the business development of these
activities.
Prior to Yole, Walt spent 16 years at Micron Technology. Walt Coon earned a Master of Business Administration from Boise State University (Idaho, United-States) and
a Bachelor of Science in Computer Science from the University of Utah (United-States).
Status of the Memory Industry 2021 | Sample | www.yole.fr | ©2021
Biographies & contacts
ABOUT THE AUTHORS
Mike Howard is a member of the memory team at Yole Développement (Yole) as VP of DRAM & Memory Research. Mike is based in the US.
Mike’s mission at Yole is to deliver a comprehensive understanding of the entire memory and semiconductor landscape via market updates and Market Monitors. Mike is
also deeply involved in the business development of these activities.
Prior to Yole, Mike worked at IHS and Micron Techonology.
Mike earned a Master of Business Administration at The Ohio State University (United-States), a Bachelor of Science in Chemical Engineering and a Bachelor of Arts in
Finance at the University of Washington (Washington, United-States).
Mike Howard
55Status of the Memory Industry 2021 | Sample | www.yole.fr | ©2021
METHODOLOGIES & DEFINITIONS
Market
Volume (in Munits)
ASP (in $)
Revenue (in $M)
Yole’s market forecast model is based on the matching of several sources:
Information
Aggregation
Preexisting
information
66Status of the Memory Industry 2021 | Sample | www.yole.fr | ©2021
SCOPE OF THE REPORT
Key End-Markets and End-Systems
Datacenters - Severs and Enterprise
Mobile – Smartphones
Client – PC, client SSD
Automotive – Vehicles (incl.ADAS systems)
Stand-Alone Memory Markets andTechnologies
DRAM NAND
NOR (NV)SRAM
New Memories
(3D XPoint, MRAM, etc.)
EEPROM
Your needs are
out of scope of this
report?
Contact us for a custom study:
DRAM NAND
NOR
EPROM, ROM, etc. (NV)SRAM / FRAM
Emerging NVM
(incl. 3D XPoint)
Storage and Memory Modules NEW
77Status of the Memory Industry 2021 | Sample | www.yole.fr | ©2021
REPORT OBJECTIVES
(1) Provide a comprehensive overview of the stand-alone memory market:
• NAND and DRAM market trends, including revenue andbit demand-shipment forecasts
• Market size and dynamics for other stand-alone memories:
▪ Stand-alone NOR Flash
▪ Emerging NVM (PCM, MRAM, RRAM)
▪ RAM: (NV)SRAM, FRAM, etc.
▪ EEPROM, EPROM, mask PROM/ROM
• China’s memory-market landscape
(2) Present technology trends
• Future developments by technology
• Memory packaging technology trends
• Challenges and opportunities for emerging NVM
• Scaling and functional roadmaps
• Storage and memory modules: technology and market trends
(3) Describe the supply chain and the memory ecosystem
• Mapping of the supply chain from materials and equipment
suppliers to module makers (SSD, DIMM)
• Financial analysis of key memory players involved in the
NAND, DRAM and NOR businesses
• Analysis of the Chinese memory players
Leveraging on a sound expertise in memory technologies and related markets, Yole decided to publish this report “Status of the
Memory Industry” to provide the broadest overview of the overall memory industry.
The main objectives of the report are as follows:
8
COMPARISON WITH THE 2020 REPORT
What we saw, what we missed
What we saw:
o Market:
• NAND and DRAM market revenues for 2020 were estimated to be $59B and $66B, respectively. The actual results were $56B
for NAND (~5% overestimate) and $67B for DRAM (~1.5% underestimate).
o Technologies
• Technology development is advancing at fast pace:176L 3D NAND and 1𝛼 DRAM were announced in Q4-2020/Q1-2021.
o Players:
• At FMS 2019, Yole presented a NAND consolidation scenario based on the acquisition of Intel’s NAND business by SK hynix
and the rumored acquisition of Kioxia by the top American NAND suppliers (WD/Micron).
What we missed:
o Market:
• The anticipated 2020 NAND recovery failed to fully materialize as impacts from COVID-19 and worsening trade tensions
between the US and China provided a strong headwind to the market. Despite these challenges, both supplier revenue and
profitability improved in 2020, indicative of just how far NAND market conditions had deteriorated in 2019, when blended
pricing fell by 49%.
o Players &Technologies:
• The decision of Micron to dismiss 3D XPoint activities and sell the Lehi fab makes the future of Optane Persistent Memory
uncertain. By the end of 2021 Intel will be the only player involved in 3D XPoint development and manufacturing; the other
memory IDMs – including Micron – will focus on products that leverage the CXL protocol, which is gaining steam as a future
interconnect for “far memory” (high-capacity DRAM and storage class memory).
Status of the Memory Industry 2021 | Sample | www.yole.fr | ©2021
99Status of the Memory Industry 2021 | Sample | www.yole.fr | ©2021
STAND-ALONE MEMORY MARKET - OVERVIEW
0%
10%
20%
30%
40%
50%
0
100
200
300
400
500
2016 2017 2018 2019 2020
Semiconductor and Memory Revenues ($B)
Worldwide Semiconductor Sales Memory Revenues (NAND+DRAM)
Memory / Semiconductor (%)
-40%
-20%
0%
20%
40%
60%
80%
2016 2017 2018 2019 2020
Semiconductor and Memory Market
Annual Growth Rates (%)
Total Semiconductor Memory (NAND + DRAM)
• The stand-alone memory market is cyclical in nature, as it is characterized by periods of shortages and oversupply that give rise
to strong price variations and revenue volatility.
• Memory is one of the primary market segments for semiconductor products. In 2020, combined NAND and DRAM revenues
corresponded to XX% of the overall semiconductor market.
1010Status of the Memory Industry 2021 | Sample | www.yole.fr | ©2021
STAND-ALONE MEMORY MARKET - OVERVIEW
• NAND and DRAM account for ≈XX% of the overall stand-alone memory market.
• Combined NAND and DRAM revenue is estimated to be ≈ $XXXB in 2020, up XX% from 2019.
2020 Memory Market - Breakdown by Technology
Total Stand-Alone Market in 2020 ≈ $XXXB
Reven
ue i
n $
B
Reven
ue G
row
th (%
)
-40%
-20%
0%
20%
40%
60%
80%
0
20
40
60
80
100
120
140
160
180
2017 2018 2019 2020 2021
DRAM NAND Forecast growth (%)
DRAM NAND
NOR
EPROM, ROM, etc.(NV)SRAM / FRAM
Emerging NVM
(incl. 3D XPoint)
Yole Développement © May 2021
Yole Développement © May 2021
1111Status of the Memory Industry 2021 | Sample | www.yole.fr | ©2021
MEMORY GROWTH FORECAST - A SYSTEM POINT OF VIEW
Evolution of the average memory content for key end-systems from 2020 to 2026
22%
16%22%
19%
57%
0%
15%
30%
45%
60%
1
10
100
1 000
10 000
Enterprise
SSD
Client SSD Smartphone Tablet Vehicle
CA
GR
20-2
6
23%
13%16%
35%
12%
0%
15%
30%
45%
60%
1
10
100
1 000
10 000
Server Smartphone Tablet Vehicle PC
GB
per
Syst
em
DRAM Content NAND Content
2%-3%
2% 0%
31%
-10%
5%
20%
35%
50%
1
10
100
1 000
10 000
Enterprise
SSD
Client SSD Smartphone Tablet Vehicle
CA
GR
20-2
6
15%
5%8%
26%
5%
-10%
5%
20%
35%
50%
1
10
100
1 000
10 000
Server Smartphone Tablet Vehicle PC
US
$ p
er
Syst
em
2020 2026 CAGR 20-26
1212
0
5
10
15
20
25
30
35
40
45
50
2020 2021 2022 2023 2024 2025 2026
Combined NAND & DRAM Wafer Demand
Other
Auto
Consumer
Mobile
Datacenter
PC
Status of the Memory Industry 2021 | Sample | www.yole.fr | ©2021
MEMORY WAFER DEMAND BY END-MARKET SEGMENTS
Datacenter and mobile will be the dominant categories, automotive is the fastest growing segment
CAGR20-26 ~ XX%Yole Développement © May 2021
CAGR20-26 ~ XX%
CAGR20-26 ~ -XX%
CAGR20-26 ~ XX%
CAGR20-26 ~ XX%
CAGR20-26 ~ -XX%
´Data from “NAND and DRAM Memory Research” Service by Yole
CAGR20-26~XX%
1313Status of the Memory Industry 2021 | Sample | www.yole.fr | ©2021
NAND MEMORY - LEADING PLAYERS BY MARKET SEGMENT
• Samsung remains the undisputed leader in the SSD and Mobile segments (largest markets) followed by the Kioxia and Western Digital.
• Samsung does not focus on the Removable & Consumer segment, which is dominated by Kioxia and Western Digital with a combinedmarket share over XX%.
Total 2020 NAND market
~$XXB0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
SSD Mobile Removable &
Consumer
Other
NAND Revenue Market Share 2020 by Application
Samsung Kioxia Western Digital Micron SK hynix Intel YMTC Other
SSD Mobile Removable &
Consumer
Other
1414Status of the Memory Industry 2021 | Sample | www.yole.fr | ©2021
3D NAND PRODUCTION ROADMAP FOR LEADING PLAYERS
Samsung
Kioxia
WDC
Micron
SK hynix
Intel
YMTC
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
INT-96L
XXX
XXX
XXX
XXX
2020 2021 2022 2023 2024 2025 20262020 2021 2022 2023 2024 2025 2026
* Roadmap threshold: 10,000 WPM shippable production
Before 2020
Yole Développement © May 2021
1515Status of the Memory Industry 2021 | Sample | www.yole.fr | ©2021
DRAM MEMORY - LEADING PLAYERS BY MARKET SEGMENT
• Samsung is leading the two largest market segments – Datacenter and Mobile – as well as Graphics and Consumer segments.
• SK hynix and Samsung are the top players for PC DRAM, whereas Micron leads the Automotive DRAM market.
Total 2020 DRAM market
~$XXB0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
PC Datacenter Mobile Graphics Consumer Auto Other
DRAM Revenue Market Share 2020 by Application
Samsung SK hynix Micron Nanya Winbond Powerchip CXMT Other
PC Datacenter Mobile Graphics Consumer Auto
1616
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
MU-1βnm
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
2020 2021 2022 2023 2024 2025 2026
Status of the Memory Industry 2021 | Sample | www.yole.fr | ©2021
DRAM PRODUCTION ROADMAP FOR LEADING PLAYERS
Samsung
SK hynix
Micron
Nanya
CXMT
2020 2021 2022 2023 2024 2025 2026
* Roadmap threshold: 10,000 WPM shippable production
Before 2020
Yole Développement © May 2021
1717Deposition Dry etchingLithography
2020
~$B
2025
~$17.5B
CAGR20-25: +14%
Status of the Memory Industry 2021 | Sample | www.yole.fr | ©2021
NAND AND DRAM MANUFACTURING COMPLEXITY IS GROWING
Scaling NAND and DRAM is a capital-intensive business!
0,0
0,2
0,4
0,6
0,8
1,0
1,2
1,4
1,6
2020 2021 2022 2023
Industry Capex per % of bit growth (in $B)
NAND DRAM
Example: 3D NAND WFE Market Evolution
18
MEMORY MODULE SHIPMENTS (2020-2022)
Shipments by connection standard (interface): DDR3, DDR4 and DDR5
In 2021, DDR4 is the leading
interface utilized in PC and server modules. DDR5
will take off in the server reaching
40% of the server volume shipments
in 2022.
Status of the Memory Industry 2021 | Sample | www.yole.fr | ©2021
0
100
200
300
400
2020 2021 2022
Volu
me (
Mu)
PC Module Shipments (in Mu)
DDR3 DDR4 DDR5
0%
20%
40%
60%
80%
100%
2020 2021 2022
PC Module Shipments
Breakdown by interface
DDR3 DDR4 DDR5
0
50
100
150
200
2020 2021 2022
Volu
me (
Mu)
Server Module Shipments (in Mu)
DDR3 DDR4 DDR5
0%
25%
50%
75%
100%
2020 2021 2022
Server Module Shipments
Breakdown by interface
DDR3 DDR4 DDR5
Pers
on
al C
om
pu
ters
Servers
% o
f sh
ipm
ents
% o
f sh
ipm
ents
19
STORAGE DRIVE SHIPMENTS (2020-2022)
SSD Shipments by interface and form factor
PCIe with the NVMe protocol
continues its penetration in both
client and enterprise
segments. The most common form
factor for client and enterprise will be mSATA/M.2 and
2.5’’/U.2, respectively.
Status of the Memory Industry 2021 | Sample | www.yole.fr | ©2021
Clien
t S
SD
s
(PC
, gam
ing
and o
ther)
En
terp
rise
SS
Ds
(sto
rage
-an
d s
erv
er-
atta
ched)
0%
25%
50%
75%
100%
2020 2021 2022
% o
f sh
ipm
ents
Client SSD Shipments Breakdown by form factor
2.5" mSATA/M.2 BGA
0%
25%
50%
75%
100%
2020 2021 2022%
of sh
ipm
ents
Client SSD Shipments Breakdown by interface
SATA (AHCI) PCIe (NVMe)
0%
25%
50%
75%
100%
2020 2021 2022
% o
f sh
ipm
ents
Enterprise SSD ShipmentsBreakdown by form factor
2.5"/U.2 mSATA/M.2 EDSFF AIC/other
0%
25%
50%
75%
100%
2020 2021 2022
% o
f sh
ipm
ents
Enterprise SSD Shipments Breakdown by interface
SATA (AHCI) PCIe (NVMe) SAS
2020Status of the Memory Industry 2021 | Sample | www.yole.fr | ©2021
NOR FLASH AND OTHER STAND-ALONE MEMORIES
2121
Micron is the only player focusing on all
four major stand-alone technologies.
However, in March 2021 they announced the intention to cease
all 3D XPoint activities.
Status of the Memory Industry 2021 | Sample | www.yole.fr | ©2021
STAND-ALONE MEMORY BUSINESS - MAIN PLAYERS
NAND DRAM NOR 3D XPoint
Alliance: Kioxia-WD Micron acquired Inotera memory from Nanya in 2016
WD acquiredSanDisk in 2016
Intel-Micron JV - IMFT
(from 2006 to 2019)
Cypress and Spansion
merged in 2014
In 2018, SK
hynix and
Cypress formed
a JV for NAND
flash business
In 2019, Cypress was acquired by
Infineon, and has started a JV with
SK hynix, SkyHigh Memory, which
focuses on SLC NAND
In October 2020, the long-
rumored acquisition of Intel’s
NAND business by SK hynix
has finally materialized, but
3D XPoint is not included in
this transaction.
Due to supply-chain
disruptions induced by
the trade war in
2020, GigaDevice
shifted its NOR orders
from SMIC to HLMC.
2222
FINANCIAL ANALYSIS
Status of the Memory Industry 2021 | Sample | www.yole.fr | ©2021
2323Status of the Memory Industry 2021 | Sample | www.yole.fr | ©2021
END-GAME CONSOLIDATION: INTEL + SK HYNIX, WD + KIOXIA + MICRON
What does it mean to the market?
• This is the consolidation scenario that results in a landscape most like DRAM. In this scenario all NAND players would have access to DRAMtechnology (exceptYMTC), and all would have ample market share to compete long term.
• Micron would gain scale via Kioxia and enterprise know-how via Western Digital; while SK hynix would gain share and an immediate presence inthe enterprise space via Intel.The market would be in a much better position to withstand the likely emergence ofYMTC from China.
Closing in progress
Disclaimer: consolidation scenarios are provided for informational purposes only and should not be construed as endorsements or predictions by Yole.
Micron + Kioxia +
WD
Samsung
SK hynix + Intel
YMTC Other
Potential M&A
Samsung
KioxiaWD
Micron
SK hynix
Intel
2020 NAND Market Share Pro Forma 2020 NAND Market Share
2424Status of the Memory Industry 2021 | Sample | www.yole.fr | ©2021
SUPPLY CHAIN ANALYSIS – PLAYERS’ MAPPING
2525Status of the Memory Industry 2021 | Sample | www.yole.fr | ©2021
CHINA MEMORY MARKET, PLAYERS AND ACTIVITIES
2626Status of the Memory Industry 2021 | Sample | www.yole.fr | ©2021
2020-2026 MARKET FORECAST
27
Contact our
Sales Team
for more
information
27
Contact our
Sales Team
for more
information
Equipment and Materials for 3D-NAND Manufacturing 2020
Emerging Non-Volatile Memory 2021
DRAM & NAND QuarterlyMarket Monitor
Neuromorphic Computing and Sensing 2021
Status of the Memory Industry | Sample | www.yole.fr | ©2021
YOLE GROUP OF COMPANIES RELATED REPORTS
Yole Développement
28
Contact our
Sales Team
for more
information
28
Contact our
Sales Team
for more
information
Intel Optane 128GB DIMM
Micron LPDDR5 12GB Mobile Memory
Samsung LPDDR5 12GB Mobile Memory
YTMC 3D NAND Flash Memory
Status of the Memory Industry | Sample | www.yole.fr | ©2021
YOLE GROUP OF COMPANIES RELATED REPORTS
System Plus Consulting
29
Yole Group of Companies, including Yole Développement,
System Plus Consulting and PISEO, are pleased to provide
you a glimpse of our accumulated knowledge.
We invite you to share our data with your own network,
within your presentations, press releases, dedicated
articles and more, but you first need approval from Yole
Public Relations department.
If you are interested, feel free to contact us right now!
We will also be more than happy to give you updated data
and appropriate formats.
Your contact: Sandrine Leroy, Dir. Public Relations
Email: [email protected]
HOW TO USE OUR DATA?
About Yole Développement | www.yole.fr | ©2021
© 2021
From Technologies to Markets
Yole Développement
Who are we?
31©2019 | www.yole.fr | About Yole Développement
FIELDS OF EXPERTISE COVERING THE SEMICONDUCTOR INDUSTRY
Semiconductor, Memory &
Computing
o Semiconductor Packaging and Substrates
o Semiconductor Manufacturing
o Memory
o Computing and Software
Power & Wireless
o RF Devices & Technologies
o Compound Semiconductors & Emerging
Materials
o Power Electronics
o Batteries & Energy Management
Photonics & Sensingo Photonics
o Lighting
o Imaging
o Sensing & Actuating
o Display
About Yole Développement | www.yole.fr | ©2021
32
A COMPLETE SET OF PRODUCTS & SERVICES TO ANSWER YOUR NEEDS
WEEKLY
TRACKS
Insight
› Teardowns of phones, smart
home, wearables and automotive
modules and systems
› Bill-of-Materials
› Block diagrams
Format
› Web access
› PDF and Excel files
› High-resolution photos
Topics
› Consumer: Smartphones, smart
home, wearables
› Automotive: Infotainment, ADAS,
Telematics
175+ teardowns per year125+ reports per year
YEARLY
REPORTS
Insight
› Yearly reports
› Market, technology and strategy
analysis
› Supply chain changes analysis
› Reverse costing and reverse
engineering
Format
› PDF files with analyses
› Excel files with graphics and data
Topics
› Photonics, Imaging & Sensing
› Lighting & Displays
› Power Electronics & Battery
› Compound Semiconductors
› Semiconductor Manufacturing and
Packaging
› Computing & Memory
115+ reports per year
SERVICES
QUARTERLY
MONITORS
Insight› Quarterly updated market data and
technology trends in units, value
and wafer
› Direct access to the analyst
Format› Excel files with data
› PDF files with analyses graphs and
key facts
› Web access (to be available soon)
Topics› Advanced Packaging
› Application Processor
› DRAM
› NAND
› Compound Semiconductor
› CMOS Image Sensors
› Smartphones
7 different monitors
quarterly updated
CUSTOM
SERVICE
Insight
› Specific and dedicated projects
› Strategic, financial, technical, supply
chain, market and other
semiconductor-related fields
› Reverse costing and reverse
engineering
Format
› PDF files with analyses
› Excel files with graphics and data
Topics
› Photonics, Imaging & Sensing
› Lighting & Displays
› Power Electronics & Battery
› Compound Semiconductors
› Semiconductor Manufacturing and
Packaging
› Computing & Memory
190 custom projects
per year
About Yole Développement | www.yole.fr | ©2021
33
PART OF YOLE GROUP OF COMPANIES
About Yole Développement | www.yole.fr | ©2021
M&A
and evaluation of companies
Direct acces to the analysts
Market, technology, and
strategy consulting
Teardown and reverse
engineering
Cost simulation tools
Structure, process and cost
analysis
34About Yole Développement | www.yole.fr | ©2021
A WORLDWIDE PRESENCE
100+ collaborators in 8 different countries
Headquarters
› Lyon – Yole Développement
› Nantes – System Plus Consulting
Singapore
TokyoShenzhen
Hsinchu
Lyon
Frankfurt
Nantes Boise
CorneliusRaleighPhoenix
AustinSeoul
35
A WIDE RANGE OF INFORMATION SOURCES
Our unique position allows us to obtain detailed and accurate information to meet your needs
About Yole Développement | www.yole.fr | ©2021
5,000 players
interviews
per year
120+ annual
conferences
6,800+ companies’
news relayed
70+ analysts
worldwide
800+ systems and
modules
teardowns
available –
175+ in 2020
20+ years in the
semiconductor
industry
36
A UNIQUE AND PROVEN METHODOLOGY
› Market segmentation
› Per application
› Per technical needs
› Per technology
adoption and behavior
of the supply chain
MARKET › Top to bottom
› Industry organizations
› Aggregate of market forecasts at
system and device levels up to the
wafer and equipment
› Bottom-up
› Ecosystem analysis
› Aggregate of all players’ revenue at
device, module and system levels
› In unit, dollar and wafer
BOTTOM-UP
& TOP-TO-BOTTOM
› Technology analysis
› Competitive landscape
› Technology comparison
› Reverse costing
› Reverse engineering
› Technology life cycle
› Development cycles
› Adoption by the supply chain
› HV manufacturing and evolutions
TECHNOLOGYThanks to its marketing approach, its
understanding of the industrial and
technical environment and information
collection, Yole Développement can assist
companies at every stage of their growth.
About Yole Développement | www.yole.fr | ©2021
37
OUR NETWORK IS THE ENTIRE SUPPLY CHAIN ACROSS 6 MARKETS
Integrators,
end-users and
software developers
Device
manufacturers
Suppliers: material,
equipment, OSAT, foundries…
Financial investors, R&D centers
Mobile
& Consumer
Automotive
& Mobility
Telecom &
Infrastructure Medical IndustrialDefense
& Aerospace
6
key markets
About Yole Développement | www.yole.fr | ©2021
38About Yole Développement | www.yole.fr | ©2020
CONTACTS
Western US & Canada
Steve Laferriere - [email protected]
+ 1 310 600 8267
Eastern US & Canada
Chris Youman - [email protected]
+1 919 607 9839
Europe and RoW
Lizzie Levenez - [email protected]
+49 15 123 544 182
Benelux, UK & Spain
Marine Wybranietz - [email protected]
+49 69 96 21 76 78
India and RoA
Takashi Onozawa - [email protected]
+81 80 4371 4887
Greater China
Mavis Wang - [email protected]
+886 979 336 809 +86 136 6156 6824
Korea
Peter Ok - [email protected]
+82 10 4089 0233
Japan
Miho Ohtake - [email protected]
+81 34 4059 204
Japan and Singapore
Itsuyo Oshiba - [email protected]
+81 80 3577 3042
Japan
Toru Hosaka – [email protected]
+81 90 1775 3866
FINANCIAL SERVICES
› Jean-Christophe Eloy - [email protected]
+33 4 72 83 01 80
› Ivan Donaldson - [email protected]
+1 208 850 3914
CUSTOM PROJECT SERVICES
› Jérome Azémar, Yole Développement -
[email protected] - +33 6 27 68 69 33
› Julie Coulon, System Plus Consulting -
[email protected] - +33 2 72 17 89 85
GENERAL
› Sandrine Leroy, Public Relations
[email protected] - +33 4 72 83 01 89
› General inquiries: [email protected] - +33 4 72 83 01 80
Follow us on
REPORTS, MONITORS & TRACKS
About Yole Développement | www.yole.fr | ©2021
