STATUS OF DAQ PROJECT OPERA collaboration meeting, Hamburg, 3-5 June, ’04 J.Marteau T.T. LOW VOLTAGE POWER SUPPLIES NETWORK, RACKS & CABLING PT DAQ

STATUS OF DAQ PROJECTSTATUS OF DAQ PROJECT

OPERA collaboration meeting, Hamburg, 3-5 June, ’04 J.Marteau

T.T. LOW VOLTAGE POWER SUPPLIES

NETWORK, RACKS & CABLING

PT DAQ DEVELOPMENTS

CONCLUSIONS

TT LOW VOLTAGE POWER SUPPLIES

POWER SUPPLIES COST : 2 options can be considered OPTION A : 1 output () for 4 boards (i.e. per corner)

• offers / SM : 72keuros to 110keuros (SCHROFF, M.E.S., CAEN, WIENER)• remark 1 : CAEN offered a special 24% discount which is over now• remark 2 : WIENER could align its price on the one of CAEN

OPTION B : 1 output () for 16 boards (i.e. per TT plane) ex. WIENER PL6021 F8-12 :6 modules with (+) & (-) outputs, max. 23A/output 1 module/planeremote control & monitoring for each moduleTCP/IP or CANbus interface6 crates / SM1 air ventilation for 5 crates 6500euros/crate + 1070euros/fan unit offer / SM : 39keuros delivery : 10-12 weeks, prototype available in 4 weeks meeting in Lyon 08 June with Wiener representatives

2 racks / SM

OPTION A : we made the proposal to put small switches in the TTplane corners, which is an economical but risky option (absence of monitoring, long term stability of the small commercial switches…) cost / SM : 16 keuros

OPTION B : we have contact with network specialists who advise to replace these small corner switches with more reliable 24&48 ports switches that can be monitored and to take custom bundle cables. for 1 SM : 12 switches 48 ports, 3 switches 24 ports CISCO systems : 2295euros & 1191euros (IN2P3 34% discount) cost / SM (estimate) : 21 keuros (including discount, 32 keuros otherwise)



48

T.T. DAQ P.T. DAQ RPC-XPC-VETO

Manager /Admin.

48

DB

192.168.1.

192.168.0.

192.168.2. 192.168.3. 192.168.4.

Internet

48

48

48

4848

48

48

48

48

48

1Gbits link100 Mbits link

Level 0 networkLevel 1 networkAdmin. networkPublic network

24

2424

adm. adm. adm.

TT DAQ 2

P.T. DAQ RPC DAQ

VLAN admin. VLAN 0

VLAN 3 VLAN 4

VLAN 1 VLAN 2

main power supply racks

each corner redistributesto 4 electronic boardsafter filtering

NETWORK, RACKS & CABLING :TT low voltage distribution

All the cables(power supplies & ethernet)will run along the end-capsin 1 large & 1 small cable trays

The connection « platine »is being designed with theCymantec company.1st prototype ready.We will define the cable lengths etc on Wall 1 mounted in Strasbourg

NETWORK, RACKS & CABLING :TT Ethernet distribution

CONTROL ROOM : A control room will be located behind the last magnet (2 barracks of 2m*3m on top of each other). The control room will host DAQ and remote Slow Control & monitoring.

RACKS DISTRIBUTION : RPCs require 16 racks in total. Magnets require 1 rack for power supplies on each side / SM, to be located in the middle of the magnet, with a total clearance of 1.7m. PTs require 6 racks in total. It has been agreed that these racks could be located in the middle of the platform (to be checked w.r.t. the temperature).Details about the racks occupancy have to be provided. 1 slot (1U) has to be left for the PT network switch. TT need 8 racks in total. They are located only on 1 side (wall side). In total 30 racks are needed and should be available from MACRO (to be checked). A cable tray of ~0.5m will collect the cables from the back of the racks.

GENERAL SKETCH FOR RACKS ORGANIZATION : see next slide.(assuming standard rack dimensions : ~0.6m width, ~1.8m height)


C.R.1

C.R.2

5000 4340 5000 43405575

max.2000

Spectro.2 T.T.2 Spectro.1 T.T.1

RP

C

RP

C

RP

C

RP

C

RP

C

RP

C

RP

CR

PC

mag

net

mag

net

P.T. racksP.T. racks

Cable tray

Cable tray

Wall side

Corridor side


NETWORK, RACKS & CABLING : RPC crates

Number of crates required for 1 spectrometer

FEB (RPC) 4 83 boards/layer 3.5 boards/layer X

2.5 boards/layer Y6 layers/crate 3 layers/crate22 layers RPC + 2 layers XPC 22 layers RPC + 2 layers XPC

FEB (XPC) 1 12 layers XPC 2 layers XPC

Controller 21 board/layer22 layers RPC + 2 layers XPC

HV (-) 11 ch/layer4 layers/board40 chs/crate22 layers RPC + 2 layers XPC

2HV (+) 3 chs/layer

40 chs/crate22 layers RPC + 2 layers XPC

Current Meter 87 chs/layer24 chs/crate22 layers RPC + 2 layers XPC

27 crates / spectrometer

NETWORK, RACKS & CABLING : RPC racks (odd)

Temperature & Reset Temperature & Reset Temperature & Reset Temperature & Reset

FAN FAN FAN FAN

Heat exchanger Heat exchanger Heat exchanger Heat exchanger

FAN FAN FAN

FAN FAN FAN FAN


FAN FAN FAN FAN

Power Management & Alarms

CTRL


FEB (RPC - X+Y View)

SYS 127 (-) FEB (RPC - X+Y View)




FEB (RPC - X+Y View)FEB (XPC) FEB (RPC - X+Y View)

Timing

Current Meter & HV Distr.

SYS 127 (-)

Power Management & Alarms Power Management & Alarms





1740

mm

= 3

9 U

NETWORK, RACKS & CABLING : RPC racks (even)


FAN FAN FAN FAN


FAN FAN FAN

FAN FAN FAN FAN


SLOW CONTROL

SLOW CONTROL SWITCH 48

FAN FAN FAN

CTRL


FEB (XPC)


FEB (RPC -Y View)

FEB (RPC -Y View)

SYS 127 (-)

CTRL



FEB (RPC -Y View)

FEB (RPC -Y View)





Switch required close to controllercrates

NETWORK, RACKS & CABLING : TT racks


SWITCH 24

SWITCH 48

SWITCH 48

SWITCH 48

SWITCH 48

SWITCH 48

SWITCH 48

SWITCH 48

SWITCH 48

SWITCH 48

SWITCH 48

FAN FAN FAN FAN


L.V. POWER SUPPLIES

L.V. POWER SUPPLIES

L.V. POWER SUPPLIES

VME CLOCK


TT DAQ 1 P.C.

TT DAQ 2 P.C.

RPC DAQ P.C.

PT DAQ P.C.

Power Management & AlarmsPower Management & Alarms

L.V. POWER SUPPLIES

L.V. POWER SUPPLIES

L.V. POWER SUPPLIES

PT DAQ DEVELOPMENTS

TDC 1

Common STOP

Selectchip

Mezzanine :•readout sequence•zero suppress•trigger timestamps

ClockRJ45

RJ45

RJ45

16 bits BUS : signal

6 bits BUS :control

TDC 2

TDC 12

TDC 11

VME board

DESIGN OF TDC BOARD, including the Ethernet Mezzanine with MSC company (meeting in April).Collaboration of M.Braueur.

TRIGGER STRATEGY (see also talk by M.Braueur)

Trigger input (common TDC stop) : OR of 2 nearby (X)RPC planes

Trigger rate : around 14 kHz Data flow : 16 bits / channel 16 * 96 * 14 k = 22 Mbits / s / TDC board (max. 100 Mbits / s) possible reduction with zero suppress : typically 3 Mbits / s assuming 3 noisy channels per board still leads to 125 Mbits / s on the PT DAQ PC

Being close to the limit, we need the trigger strategy (including XPC & VETO) to be studied in more details (e.g. OR of N1 planes & OR of N2 planes) in terms of rates, efficiencies, hardware setting…

PT DAQ DEVELOPMENTS

SLOW CONTROL & MONITORING : Hardware setup :

HV modules (CAEN SY2527, ethernet CAEN protocol) crates (CAN bus) T sensors (CAN bus) Gas system (dedicated PC) 2-3 PCs to be connected with the DAQ Manager

Software : we agreed to use CORBA for communication with DAQ Manager : some libraries already exist for these applications also used by BMM (Brick Manipulator Manager) M.Braueur start to work on it & to compile the libraries

Since most the items (hardware & software) are common to PT & RPC, we shouldoptimize the work & avoid double developments :

combine the purchase of e.g. racks & crates (also for easier maintenance) adopt the same software environment

PT DAQ DEVELOPMENTS

BUDGET : Update of the DAQ budget performed and submitted to IN2P3 (meeting 09 June) New procedure for the public markets (January ’04) entering into application now

MEZZANINE BOARDS PRODUCTION : A serious bug has been discovered (and confirmed by AXIS) recently, concerning the RESET input on some MCM chips. This bug is not fixed by AXIS (not even in the upgraded version of the chip) This requires a new version for the mezzanine (prototype+serie) which prevents us to have the complete TT electronics ready for the 1st 12 walls installation.

CAMEROP BOARDS PRODUCTION : Final version now under tests 2 Pre-series available (4+36 boards) to be used for tests & calibration Next serie (this summer) to be installed on the 1st 12 TT walls (mezzanines will be plugged later on the CAMEROP boards : less painful solution to avoid delays).

CONCLUSIONS (I)

REQUEST : work could be easier if we could use F/E boards & LED pulsers(when it is possible to pick-up samples from the production batches)

RPC MEZZANINES (strongly required) : dedicated software version (VHDL & CORBA) needs to be developed a copy of the VME motherboard (+ F/E emulator) has been asked in order to speed up developments and tests

PT TDC BOARDS : not on the critical path for the moment.

SOFTWARE : CORBA software is improving constantly (1st versions debugged w.r.t. memoryleaks) The TTsensor / TTdaq processes defined with omniORB.4.0.3 libraries Automatic board tests program using the CORBA software Start the tests with large number of boards connected (equivalent to 1 TT wall).

CONCLUSIONS (II)

Documents

STATUS OF DAQ PROJECT OPERA collaboration meeting, Hamburg, 3-5 June, ’04 J.Marteau T.T. LOW VOLTAGE POWER SUPPLIES NETWORK, RACKS & CABLING PT DAQ